JP6221132B2 - Printed wiring board - Google Patents

Description

  The present invention relates to a printed wiring board.

  Conventionally, for example, a printed wiring board used in a vehicle control circuit is newly designed according to a change in vehicle specifications. For example, Patent Literature 1 describes an electrical junction box that can easily change a printed wiring board according to vehicle specifications.

  The electrical junction box described in Patent Document 1 arranges a part of a terminal provided with a pressure contact slot along the periphery of the opening of the case of the electrical junction box, and the terminal along the periphery of the printed wiring board. The connection pins and conductors can be connected at the same pitch, and the terminals in the case and the connection pins of the printed wiring board can be connected together. When changing the printed wiring board according to changes in vehicle specifications, only the printed wiring board can be easily It can be changed.

JP 2006-60970 A

  However, the electrical junction box described in Patent Document 1 has to redesign the entire printed wiring board in response to changes in vehicle specifications, which increases design cost and reduces manufacturing lead time. Even if there is a part with a common specification, the part cannot be partially used and is wasted. Therefore, there is a problem that the cost of parts is increased and the environment is adversely affected.

  The present invention has been made in view of the above, and an object of the present invention is to provide a printed wiring board capable of reducing design and component costs, shortening manufacturing lead time, and reducing environmental load.

In order to solve the above-described problems and achieve the object, the printed wiring board according to claim 1 of the present invention is a portion where the conductive wiring is changed according to a plurality of wiring specifications of the conductive wiring. A modified wiring forming portion, and a common wiring forming portion that includes a modified wiring fitting portion into which the modified wiring forming portion is fitted and that is a portion where the conductive wiring common to a plurality of wiring specifications is formed. When the changed wiring forming portion is fitted to the changed wiring fitting portion, the conductive wiring exposed on the changed wiring side fitting surface that becomes the fitting surface of the changed wiring forming portion, and A wiring path of the conductive wiring is formed by electrically connecting the conductive wiring exposed to the common wiring side fitting surface which becomes a fitting surface of the changed wiring fitting portion through a conductive material, The changed wiring forming portion and the common wiring forming portion are the changed wiring. A fitting concave portion is formed on one surface of the fitting surface or the common wiring side fitting surface, and a fitting convex portion to be fitted to the fitting concave portion is formed on the other surface, When the modified wiring forming portion is fitted to the modified wiring fitting portion, the fitting concave portion and the fitting convex portion are fitted, the protruding end surface of the fitting convex portion, and the fitting concave portion The conductive wiring exposed only on the bottom surface is the exposed conductive wiring .

  The printed wiring board according to claim 2 of the present invention is characterized in that, in the above invention, the conductive material is solder.

  Further, in the printed wiring board according to claim 3 of the present invention, in the above invention, the changed wiring forming portion and the common wiring forming portion are common to the changed wiring forming portion and the mounted component mounted on the surface. It is mounted so as to connect the wiring forming part.

  In the printed wiring board according to claim 1 of the present invention, the changed wiring forming portion changed according to the change of the wiring specification is fitted to the changed wiring fitting portion of the common wiring forming portion, and the changed wiring side The printed wiring board having a changed wiring specification by electrically connecting the conductive wiring exposed on the fitting surface and the conductive wiring exposed on the common wiring side fitting surface with the conductive material. Therefore, it is not necessary to newly redesign the entire board, and the common wiring forming part can be used as a common part, so that design and parts costs can be reduced, manufacturing lead time can be shortened, In addition, the environmental load can be reduced.

  Since the printed wiring board which concerns on Claim 2 of this invention uses the solder as the said electrically-conductive material, it can obtain the joint strength of the said change wiring formation part and the said common wiring formation part.

  In the printed wiring board according to claim 3 of the present invention, since the joint strength between the changed wiring forming portion and the common wiring forming portion is reinforced by the mounted component, the changed wiring forming portion and the common wiring forming portion The bonding strength can be further increased.

Since the printed wiring board according to claim 1 of the present invention, the modified extended portion may be fitted to the changing wire fitting portion, the said fitting projection and the fitting recess is fitted, The modified wiring forming portion can be fitted so as to be positioned in a predetermined direction with respect to the modified wiring fitting portion, and the fitting convex portion and the fitting concave portion are fitted. As a result, movement of the changed wiring forming portion within the changed wiring fitting portion is restricted, so that the changed wiring forming portion and the common wiring forming portion are securely fixed, and the changed wiring forming portion and the common A connection portion of the conductive material with the wiring forming portion is hardly damaged by vibration or the like, and as a result, connection reliability can be improved.

Printed wiring board according to claim 1 of the present invention, the modified lines in the vicinity of the exposed said conductive wire to said common wiring side fitting surface and the exposed said conductive wire to said change line-side fitting surface Since the formation portion and the common wiring formation portion are securely fixed, the connection portion of the changed wiring formation portion and the common wiring formation portion by the conductive material is less affected by vibration and the like, and the connection reliability The sex can be further improved.

FIG. 1 is a perspective view of an electrical junction box in which a printed wiring board according to Embodiment 1 of the present invention is incorporated. 2A is a perspective view of the common wiring forming portion shown in FIG. 1, and FIG. 2B is a perspective view of the changed wiring forming portion shown in FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. FIG. 4 is a cross-sectional view taken along line AA in a state where the changed wiring forming portion is fitted in FIG. FIG. 5 is an enlarged view around the changed wiring forming portion shown in FIG. FIG. 6 shows an example of a method for manufacturing a printed wiring board according to the first embodiment of the present invention. FIG. 7 shows an example of a method for manufacturing a printed wiring board according to Embodiment 1 of the present invention. FIG. 8A is a perspective view before the changed wiring forming portion of the printed wiring board of the modified example of the printed wiring board according to the first embodiment of the present invention is fitted to the changed wiring fitting portion. b) is a perspective view of a state in which a modified wiring forming portion of a modified printed wiring board is fitted to a modified wiring fitting portion. 9A is a perspective view of the common wiring forming portion of the printed wiring board according to the second embodiment of the present invention, and FIG. 9B is a modified wiring of the printed wiring board according to the second embodiment of the present invention. It is the figure which looked at the formation part periphery from the mounting surface side. FIG. 10 is a diagram for explaining that the changed wiring forming portion can be fitted to the common wiring forming portion by changing the direction.

  Hereinafter, preferred embodiments of a printed wiring board 1 according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an electrical junction box 100 in which a printed wiring board 1 according to a first embodiment of the present invention is incorporated.
In FIG. 1, the printed wiring board 1 in the housing case 120 can be seen through by showing the housing case 120 of the electrical junction box 100 with a broken line.
2A is a perspective view of the common wiring forming portion 30 shown in FIG. 1, and FIG. 2B is a perspective view of the changed wiring forming portion 20 shown in FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. FIG. 4 is a cross-sectional view taken along line AA in a state in which the changed wiring forming unit 20 is fitted in FIG. FIG. 5 is an enlarged view around the changed wiring forming unit 20 shown in FIG.
The printed wiring board 1 according to the first embodiment of the present invention is incorporated in an electrical junction box 100 mounted on a vehicle.
The electrical junction box 100 distributes power supplied from a power source such as a battery or an alternator to each electrical component. The circuit configuration body 110 and a storage case 120 for protecting and storing the circuit configuration body 110 therein. And.

  The housing case 120 is made of an insulating material such as synthetic resin, and includes a connector connection port 111b of a power input connector 111 (to be described later) of the circuit component 110, a fuse attachment / detachment port 112a of a fuse block 112 (to be described later), and a power output connector 113 (to be described later). The circuit connector 110 is accommodated so that the connector connection port 113b is exposed to the outside of the case.

  The circuit structure 110 includes a printed wiring board 1, a power input connector 111 to which a power connector (not shown) serving as a power supply source from a power source is connected, and a fuse block in which a plurality of fuses (not shown) are detachably mounted. 112 and a power output connector 113 to which a power distribution connector (not shown) formed by connecting electric wires for distributing and transmitting power to various electrical components is connected.

  The printed wiring board 1 is formed by a wiring path according to wiring specifications with conductive wiring 10 made of a conductive material such as copper on the front and back mounting surfaces 1a and 1a or on the inner layer with an insulating resin 11 disposed between the layers. The mounting surfaces 1a, 1a are four-layer plates having a rectangular outer shape formed by applying a solder resist 12 as an insulating protective film.

Further, the printed wiring board 1 according to the first embodiment has a relay 13 mounted as a mounting component mounted on the mounting surface 1a. As shown in FIG. 5, the relay 13 is mounted so as to connect the changed wiring forming unit 20 and the common wiring forming unit 30.
More specifically, the relay 13 is changed via the relay 13 by mounting a plurality of terminals 13a of the relay 13 on a later-described changed wiring forming unit 20 and a common wiring forming unit 30 of the printed wiring board 1. The wiring forming part 20 and the common wiring forming part 30 are connected with a stronger bonding force in addition to the bonding force by the solder 40.

  The printed wiring board 1 includes a plurality of changed wiring forming portions 20 that are portions where conductive wiring 10a (hereinafter referred to as “change-side conductive wiring”) that is changed according to a plurality of wiring specifications of the conductive wiring 10 is formed. And a common wiring forming portion 30 which is a portion where conductive wiring 10b (hereinafter referred to as “common-side conductive wiring”) common to the wiring specifications is formed.

  The changed wiring forming unit 20 is a part in which changed parts of the wiring specifications of the conductive wiring 10 are formed in an aggregated manner. The changed wiring forming portion 20 has a cylindrical shape, and the peripheral side surface is a changed wiring fitting surface 20a.

The common wiring forming unit 30 forms a common side conductive wiring 10b that is commonly used for the plurality of wiring specifications of the conductive wiring 10 with respect to the changed wiring forming unit 20 that is changed according to the plurality of wiring specifications of the conductive wiring 10. It is a part to be done.
The common wiring forming portion 30 includes a changed wiring fitting portion 31 to which the changed wiring forming portion 20 is fitted.

  Corresponding to the cylindrical shape of the modified wiring forming unit 20, the modified wiring fitting unit 31 is a portion that is hollowed out in a circular cross section so as to penetrate the front and back of the common wiring forming unit 30. The inner surface of the changed wiring fitting portion 31 is a common wiring side fitting surface 31a.

As the conductive material 40, solder is used, and the change-side conductive wiring 10a exposed to the change-wiring-side fitting surface 20a and the common-side conductive wiring 10b exposed to the common-wiring-side fitting surface 31a by reflow processing or the like. In addition to being electrically connected, the modified wiring forming unit 20 and the common wiring forming unit 30 are fixed.
In the first embodiment, the conductive material 40 is exemplified by using solder. However, the present invention is not limited to this, and any other material may be used as long as the metal used for the conductive wiring 10 is electrically connected. It doesn't matter.

The printed wiring board 1 has the modified wiring exposed to the modified wiring side fitting surface 20a which becomes the fitting surface of the modified wiring forming section 20 when the modified wiring forming section 20 is fitted to the modified wiring fitting section 31. The conductive wiring 10a is electrically connected to the common-side conductive wiring 10b exposed on the common-wiring-side fitting surface 31a serving as the fitting surface of the changed-wiring fitting portion 31 through the conductive material 40, so that the conductive A wiring path of the wiring 10 is formed.
Since such a printed wiring board 1 is integrally formed by fitting the changed wiring forming portion 20 and the common wiring forming portion 30, even if the wiring specifications are changed, the same 1 It can be incorporated into the electrical junction box 100 as a single substrate. That is, even if the wiring specifications are changed, the assembly work to the electrical junction box 100 does not become complicated.

The power input connector 111 is provided with an input terminal (not shown) connected to a terminal of a power connector (not shown) in the input connector housing. The input connector housing 111a is made of an insulating resin such as a synthetic resin, and a power connector (not shown) is inserted through the connector connection port 111b.
The fuse block 112 is formed by integrally molding a plurality of fuse connection bus bars 114 on a block main body portion made of an insulating resin such as a synthetic resin.

Specifically, the fuse connection bus bar 114 is a conductive path forming member, and a plate-like metal member is formed into a predetermined shape by die pressing or the like. The fuse connection bus bar 114 is formed by bending a linearly extending belt-like metal member into an L shape, and forming a board connection side end 114a and a fuse connection side end (not shown) at each end.
The board connection side end portion 114 a is an end portion on the side connected to the printed wiring board 1, and is a portion inserted through a through hole as the conductive wiring 10 formed on the mounting surface 1 a of the printed wiring board 1.
A fuse connection side end (not shown) is an end connected to an output side electrode of a fuse (not shown).

  The power output connector 113 is formed by integrally forming a plurality of output side connection bus bars 115 on a connector main body 113a made of an insulating resin such as a synthetic resin.

Specifically, the output side connection bus bar 115 is formed by bending a rod-shaped metal member into an L shape and forming a board connection side end portion 115a and an output terminal portion (not shown) at each end portion.
The board connection side end portion 115a is an end portion on the side connected to the printed wiring board 1, and is a portion inserted through a through hole as the conductive wiring 10 formed on the mounting surface 1a of the printed wiring board 1.
An output terminal portion (not shown) is a portion to which a terminal of a power distribution connector (not shown) is connected.

  The connector main body 113a is disposed at the board end of the printed wiring board 1, and a power distribution connector (not shown) is inserted through the connector connection port 113b.

  In such a circuit configuration body 110, the power supplied from the power input connector 111 is supplied from an input terminal (not shown), a fuse (not shown), the fuse connection bus bar 114, the printed wiring board 1, and the output side connection bus bar 115. Are sequentially transmitted, and are distributed to various electrical components from a power distribution connector (not shown) connected to the power output connector 113.

Here, an example of the manufacturing method of the printed wiring 1 is shown using FIG. 6 and FIG.
6 and 7 show an example of a method for manufacturing the printed wiring board 1 according to the first embodiment of the present invention.

First, the changed wiring forming unit 20 and the common wiring forming unit 30 are manufactured (see FIG. 6A). For the changed wiring forming unit 20 and the common wiring forming unit 30, a general method for manufacturing a printed wiring board having four layers is applied.
In addition, as a formation method of the change wiring fitting part 31 of the common wiring formation part 30, after the lamination process of 4 layers is completed, the part of the change wiring fitting part 31 is made into a cross-sectional circle shape by a router processing machine, for example. There are a method of performing a punching process, or a method of performing a punching process in advance in a cross-sectional circle shape on an insulating resin sheet and a double-sided plate as a laminate material in a stage before the stacking process.
Since the common wiring forming unit 30 manufactured here is used in common for the printed wiring board 1 having a plurality of wiring specifications, the work load related to the wiring design of the printed wiring board 1 is reduced.

  Thereafter, the solder 40 is applied to the change-side conductive wiring 10a exposed on the change-wiring-side fitting surface 20a (see FIG. 6B). The solder 40 may be applied to the common side conductive wiring 10b exposed on the common wiring side fitting surface 31a in place of the changed side conductive wiring 10a exposed on the changed wiring side fitting surface 20a. .

  Thereafter, the changed wiring forming portion 20 is fitted into the changed wiring fitting portion 31 of the common wiring forming portion 30 (see FIG. 6C). The fitting process of the changed wiring forming unit 20 can be suppressed in accordance with the mounting process of the mounted components such as the relay 13, thereby suppressing an increase in manufacturing lead time.

Then, the printed wiring board 1 is completed by performing the solder reflow process which heat-processes to the printed wiring board 1 (refer Fig.7 (a) and FIG.7 (b)). Through this process, the change-side conductive wiring 10a exposed on the change-wiring-side fitting surface 20a and the common-side conductive wiring 10b exposed on the common-wiring-side fitting surface 31a are electrically connected via the solder 40. Thus, a wiring path of the conductive wiring 10 as one printed wiring board 1 is formed.
Note that if the solder reflow process is performed in accordance with the solder reflow process of the mounted components such as the relay 13, this process can be performed without increasing the manufacturing lead time.

  In addition, in the manufacturing method of the printed wiring board 1 of Example 1, the change side conductive wiring 10a exposed to the change wiring side fitting surface 20a and the common side conductive wiring 10b exposed to the common wiring side fitting surface 31a. As the soldering process, the solder reflow process is exemplified. However, after the changed wiring forming part 20 is fitted in the changed wiring fitting part 31 of the common wiring forming part 30, the printed wiring board 1 is placed in the solder tank. You may make it perform the process to immerse.

  In the printed wiring board 1 according to the first embodiment of the present invention, the changed wiring forming portion 20 changed according to the change of the wiring specification is fitted to the changed wiring fitting portion 31 of the common wiring forming portion 30, and the changed wiring side The change is made by electrically connecting the change-side conductive wiring 10a exposed on the fitting surface 20a and the common-side conductive wiring 10b exposed on the common wiring-side fitting surface 31a with solder 40 as a conductive material. Since the printed wiring board 1 having the specified wiring specifications is configured, it is not necessary to newly redesign the entire board, and the common wiring forming portion 30 can be used as a common component, thereby reducing design and component costs. , Manufacturing lead time can be shortened, and environmental load can be reduced.

  Moreover, since the printed wiring board 1 which concerns on Example 1 of this invention uses the solder 40 as a electrically conductive material, the joint strength of the change wiring formation part 20 and the common wiring formation part 30 can be obtained.

  In addition, the printed wiring board 1 according to the first embodiment of the present invention has the bonding strength between the modified wiring forming unit 20 and the common wiring forming unit 30 reinforced by the relay 13 as a mounted component. The bonding strength with the common wiring forming unit 30 can be further increased.

(Modification)
Next, a modified example of the printed wiring board 2 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 8A is a perspective view before the changed wiring forming portion 50 of the printed wiring board 2 of the modified example of the printed wiring board 1 according to the first embodiment of the present invention is fitted to the changed wiring fitting portion 61. (B) is a perspective view of a state where the modified wiring forming portion 50 of the modified printed wiring board 2 is fitted to the modified wiring fitting portion 61.
The printed wiring board 2 according to this modification is the printed wiring board 2 according to the first embodiment in that the modified wiring forming unit 50 has a cubic shape and is fitted to the common wiring forming unit 60 at the end position of the common wiring forming unit 60. Different from the wiring board 1.
Other configurations are the same as those of the first embodiment, and the same components as those of the first embodiment are denoted by the same reference numerals.

  Similar to the printed wiring board 1 according to the first embodiment, the printed wiring board 2 according to this modified example replaces the changed wiring forming unit 50 changed according to the change in the wiring specification with the changed wiring fitting unit 61 of the common wiring forming unit 60. The change-side conductive wiring 10a exposed to the change-wiring-side fitting surface 50a and the common-side conductive wiring 10b exposed to the common-wiring-side fitting surface 61a are electrically connected by solder 40 as a conductive material. Since the printed wiring board 2 having a changed wiring specification is configured by connecting to the circuit board, it is not necessary to redesign the entire board, and the common wiring forming unit 60 can be used as a common component. Therefore, it is possible to reduce the design and component costs, shorten the manufacturing lead time, and reduce the environmental load.

Next, the printed wiring board 3 according to the second embodiment of the present invention will be described with reference to FIGS. 9 and 10. 9A is a perspective view of the common wiring forming portion 80 of the printed wiring board 3 according to the second embodiment of the present invention, and FIG. 9B is a printed wiring board 3 according to the second embodiment of the present invention. It is the figure which looked at the change wiring formation part 70 periphery of this from the mounting surface side. FIG. 10 is a diagram for explaining that the changed wiring forming unit 70 can be fitted to the common wiring forming unit 80 by changing the direction.
In the printed wiring board 3 of the second embodiment, a fitting recess 82 is formed on the common wiring side fitting surface 31a of the common wiring forming portion 80, and the fitting is performed on the changed wiring side fitting surface 70a of the changed wiring forming portion 70. It differs from the printed wiring board 1 of an Example by the point by which the fitting convex part 71 fitted to the joint recessed part 82 is formed.
Other configurations are the same as those of the first embodiment, and the same components as those of the first embodiment are denoted by the same reference numerals.

  The modified wiring forming portion 70 is provided with fitting convex portions 71 at intervals of 90 degrees along the circumferential direction of the modified wiring side fitting surface 20a. That is, the modified wiring forming portion 70 is provided with the fitting convex portions 71 at four locations along the circumferential direction.

  The fitting recesses 82 are provided at four locations corresponding to the fitting projections 71 provided at four locations.

In such a printed wiring board 3, when the changed wiring forming portion 70 is fitted to the changed wiring fitting portion 81, the fitting convex portions 71 and the fitting concave portions 82 are fitted. For this reason, the modified wiring forming unit 70 is fitted to the modified wiring fitting unit 81 while being oriented in a predetermined direction.
In addition, when each fitting convex portion 71 and each fitting concave portion 82 are fitted, the movement of the changed wiring forming portion 70 in the circumferential direction within the changed wiring fitting portion 81 is restricted, and the changed wiring is formed. The portion 70 is securely fixed to the common wiring forming portion 80.

In the printed wiring board 3, the changed-side conductive wiring 10 a is exposed to the protruding end surface 71 a of the fitting convex portion 71 and the bottom surface 82 a of the fitting concave portion 82, and the changed wiring forming portion 70 is fitted to the changed wiring fitting portion 81. As a result, the changed wiring forming portion 70 and the common wiring forming portion 80 are electrically connected via the solder 40.
The change-side conductive wiring 10a is not only exposed to the protruding end surface 71a of the fitting convex portion 71 and the bottom surface 82a of the fitting concave portion 82, but also a wider area of the fitting convex portion 71 including the protruding end surface 71a, and You may make it expose in the wider area | region of the fitting recessed part 82 containing the bottom face 82a.

  Furthermore, the modified wiring forming unit 70 of the second embodiment is adapted to two types of wiring specifications. More specifically, as shown in FIG. 10, when the changed wiring forming portion 70 is rotated 90 degrees in the circumferential direction with respect to the changed wiring fitting portion 81, the changed wiring forming portion 70 is in both the states before and after the rotation. And the common wiring forming portion 80 are electrically connected, and two types of wiring paths of the conductive wiring 10 are formed.

  Although only the conductive wiring 10 on the mounting surface side is shown in FIG. 10, the inner-layer conductive wiring 10 is also applied to two types of wiring specifications.

  Similar to the printed wiring board 1 according to the first embodiment, the printed wiring board 3 according to the second embodiment of the present invention uses the changed wiring forming unit 70 that has been changed according to the change in the wiring specifications as the changed wiring of the common wiring forming unit 80. The change side conductive wiring 10a that is fitted to the fitting portion 81 and is exposed to the change wiring side fitting surface 70a and the common side conductive wiring 10b that is exposed to the common wiring side fitting surface 81a are soldered as conductive materials. Since the printed wiring board 3 having the changed wiring specification is configured by being electrically connected by 40, there is no need to newly redesign the entire board, and the common wiring forming portion 80 is used as a common component. Therefore, design and component costs can be reduced, manufacturing lead time can be shortened, and the environmental load can be reduced.

  In the printed wiring board 3 according to the second embodiment of the present invention, when the changed wiring forming portion 70 is fitted to the changed wiring fitting portion 70a, the fitting convex portion 71 and the fitting concave portion 82 are fitted. Therefore, the modified wiring forming part 70 can be fitted so as to be positioned in a predetermined direction with respect to the modified wiring fitting part 70a, and the fitting convex part 71 and the fitting concave part 82 are fitted. As a result, the movement of the changed wiring forming portion 70 in the changed wiring fitting portion 81 is restricted, so that the changed wiring forming portion 70 and the common wiring forming portion 80 are securely fixed, and the changed wiring forming portion The connection portion between the solder 70 and the common wiring forming portion 80 by the solder 40 is not easily damaged by vibration or the like, and as a result, the connection reliability can be improved.

  Furthermore, the printed wiring board 3 according to the second embodiment of the present invention includes the change-side conductive wiring 10a exposed on the change-wiring-side fitting surface 70a and the common-side conductive wiring 10b exposed on the common-wiring-side fitting surface 70a. Since the fixed wiring forming portion 70 and the common wiring forming portion 80 are securely fixed in the vicinity of each other, the connection portion by the solder 40 between the changed wiring forming portion 70 and the common wiring forming portion 80 is affected by vibration or the like. It becomes harder to receive, and connection reliability can be further improved.

  Further, in the printed wiring board 3 according to the second embodiment of the present invention, since the changed wiring forming unit 70 is adapted to a plurality of types of wiring specifications, the component cost can be further reduced.

  In the printed wiring board 3 according to the second embodiment of the present invention, one modified wiring forming unit 70 is applied to two types of wiring specifications. However, the present invention is not limited to this, and one modified wiring forming unit is used. 70 may be applied to only one type of wiring specification.

  In the printed wiring board 3 according to the second embodiment of the present invention, the fitting wiring 71 is formed in the changed wiring forming portion 70 and the fitting recessed portion 82 is formed in the common wiring forming portion 80. However, the present invention is not limited to this, and it is only necessary that the modified wiring forming portion 70 and the common wiring forming portion 80 are fitted by the concavo-convex portion. For example, a fitting concave portion may be formed in the changed wiring forming portion 70 and a fitting convex portion may be formed in the common wiring forming portion 80.

  In addition, the printed wiring board 3 according to the second embodiment of the present invention has exemplified the case where the conductive wiring 10 is exposed to the protruding end surface 71a of the fitting convex portion 71 and the bottom surface 82a of the fitting concave portion 82. However, the conductive wiring 10 is not exposed at the fitting convex portion 71 and the fitting concave portion 82 but is exposed at other portions of the changed wiring side fitting surface 20a and the common wiring side fitting surface 31a. The fitting recess 82 may function only as a positioning portion and a fixing portion.

  In addition, the printed wiring boards 1, 2, and 3 according to the first and second embodiments of the present invention have been illustrated as being incorporated into the electrical junction box 100, but are not limited to this, and part of other circuit components. It may also be used.

  In addition, the printed wiring boards 1, 2, and 3 according to the first and second embodiments of the present invention are exemplified by four layers. However, the number of layers is not limited to this, and the other layers are not limited thereto. A number of them may be used.

  The invention made by the present inventor has been specifically described based on the above-described embodiments of the invention. However, the present invention is not limited to the above-described embodiments of the invention and does not depart from the gist thereof. Various changes can be made.

1, 2, 3 Printed wiring board 1a Mounting surface 10 Conductive wiring 10a Change-side conductive wiring 10b Common-side conductive wiring 11 Insulating resin 12 Solder resist 13 Relay (mounted component)
13a terminal 20, 50, 70 modified wiring forming portion 20a, 50a, 70a modified wiring side fitting surface 30, 60, 80 common wiring forming portion 31, 61, 81 modified wiring fitting portion 31a, 61a, 81a common wiring side fitting Interfacing 40 Solder (conductive material)
71 fitting convex part 71a protruding end face 82 fitting concave part 82a bottom face 100 electrical connection box 110 circuit structure 111 power input connector 111a input connector housing 111b connector connection port 112 fuse block 112a fuse attaching / detaching port 113 power output connector 113a connector main body 113b Connector connection port 114 Fuse connection bus bar 114a Substrate connection side end 115 Output side connection bus bar 115a Substrate connection side end 120 Storage case

Claims (3)

A changed wiring forming portion that is a portion where the conductive wiring is changed according to a plurality of wiring specifications of the conductive wiring; and
A common wiring forming portion that includes a changed wiring fitting portion into which the changed wiring forming portion is fitted, and that is a portion where the conductive wiring common to a plurality of wiring specifications is formed;
Having
When the modified wiring forming portion is fitted to the modified wiring fitting portion, the conductive wiring exposed on the modified wiring side fitting surface which is a fitting surface of the modified wiring forming portion, and the modified wiring fitting The conductive wiring exposed to the common wiring side fitting surface that becomes the fitting surface of the part is electrically connected via a conductive material, thereby forming a wiring path of the conductive wiring,
The changed wiring forming part and the common wiring forming part are:
A fitting recess is formed on one surface of the modified wiring side fitting surface or the common wiring side fitting surface, and a fitting convex portion is formed on the other surface. Being
When the changed wiring forming portion is fitted to the changed wiring fitting portion, the fitting concave portion and the fitting convex portion are fitted,
The printed wiring board , wherein the conductive wiring exposed only on the protruding end surface of the fitting convex portion and the bottom surface of the fitting concave portion is the exposed conductive wiring. The conductive material is
The printed wiring board according to claim 1, wherein the printed wiring board is solder. The changed wiring forming part and the common wiring forming part are:
The printed wiring board according to claim 1, wherein a mounting component mounted on a surface is mounted so as to connect the changed wiring forming unit and the common wiring forming unit.

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