JP5222641B2

JP5222641B2 - Circuit structure

Info

Publication number: JP5222641B2
Application number: JP2008179393A
Authority: JP
Inventors: 広利前田; 穂福山; 茂樹山根; 雄大水野; 登陳
Original assignee: Sumitomo Wiring Systems Ltd; AutoNetworks Technologies Ltd; Sumitomo Electric Industries Ltd
Current assignee: Sumitomo Wiring Systems Ltd; AutoNetworks Technologies Ltd; Sumitomo Electric Industries Ltd
Priority date: 2008-07-09
Filing date: 2008-07-09
Publication date: 2013-06-26
Anticipated expiration: 2028-07-09
Also published as: JP2010022117A

Description

本発明は、回路基板とバスバーとを重ね合わせてなる回路構成体に関する。 The present invention relates to a circuit structure formed by superposing a circuit board and a bus bar.

従来より、電子部品が実装される回路基板と、回路基板上の電子部品と電気的に接続されるバスバーと、が貼り合わされてなる回路構成体が知られている。この回路基板とバスバーとの貼り合わせに際しては、接着剤等が用いられている。
特許第４００２４２７号公報 2. Description of the Related Art Conventionally, a circuit configuration body is known in which a circuit board on which electronic components are mounted and a bus bar that is electrically connected to the electronic components on the circuit board are bonded together. An adhesive or the like is used for bonding the circuit board and the bus bar.
Japanese Patent No. 4002427

ところで、接着剤等の部材を用いて回路基板とバスバーを貼り合わせる場合には、接着剤等の部材が必要なだけでなく、回路基板とバスバーとを押し付けるためのプレス機等の機材が必要となる。また、生産ラインでは、接着剤等の塗布工程や、プレス機によるプレス工程、接着剤を乾燥して固化させる工程が必要となり、これら複数の工程のための時間がかかっていた。また、接着剤を使用したことで、環境温度が変化した際の品質保証も難しくなっていた。 By the way, when a circuit board and a bus bar are bonded together using a member such as an adhesive, not only a member such as an adhesive is required, but also equipment such as a press machine for pressing the circuit board and the bus bar is required. Become. In addition, in the production line, an application process of an adhesive, a press process using a press machine, and a process of drying and solidifying the adhesive are required, and it takes time for the plurality of processes. In addition, the use of an adhesive makes it difficult to guarantee quality when the environmental temperature changes.

そのため、接着のために必要な部材や機材を減らしてコストを削減したいという要請や、生産ラインの工程数を減らして生産時間を短縮し、コストを削減したいという要請、ならびに信頼性の高い製品構造にしたいという要請があった。 Therefore, there is a request to reduce costs by reducing the number of parts and equipment necessary for bonding, a request to reduce production time by reducing the number of production line processes, and a highly reliable product structure. There was a request to make it.

本発明は上記のような事情に基づいて完成されたものであって、生産コストを抑えて、接着剤を使用することなく回路基板とバスバーとを固着させることが可能な回路構成体を提供することを目的とする。 The present invention has been completed based on the above-described circumstances, and provides a circuit structure capable of fixing a circuit board and a bus bar without using an adhesive while suppressing production cost. For the purpose.

本発明の回路構成体は、導電路を有すると共に、当該導電路に接続された電子部品が実装された回路部と、この回路部の前記電子部品実装面とは反対側の面の金属製のバスバーで構成される電力回路部と、前記回路部の少なくとも前記電力回路部側の面に形成された樹脂充填孔部と、前記回路部と前記電力回路部とを重ねた状態で一部が前記樹脂充填孔部内を貫通すると共に、他の一部が前記電力回路部であるバスバーを貫通し又は前記電力回路部であるバスバーの側部を通って前記電力回路部であるバスバーの前記回路部とは反対側の面に係止する形態の係止部を有して固化した樹脂連結部とを備えてなり、前記樹脂充填孔部は前記回路部を貫通する基板貫通孔として形成されると共に、前記電力回路部であるバスバーには前記基板貫通孔と整合する位置に貫通孔が形成され、前記樹脂連結部は前記基板貫通孔及び前記電力回路部であるバスバーの貫通孔の双方を貫通して設けられているところに特徴を有する（手段１）。
手段１の構成によれば、樹脂成型機によって成形された樹脂連結部が、回路基板とバスバーとの双方を貫通して両者を固着するため、基板/バスバー間の剥がれや変形を、より一層確実に防止できる。 The circuit structure of the present invention has a conductive path, a circuit part on which an electronic component connected to the conductive path is mounted, and a metal part on the surface opposite to the electronic component mounting surface of the circuit part. A part of the power circuit portion constituted by a bus bar, the resin filling hole portion formed on at least the power circuit portion side surface of the circuit portion, and the circuit portion and the power circuit portion are overlapped. The circuit portion of the bus bar that is the power circuit portion passes through the inside of the resin filling hole portion and the other part passes through the bus bar that is the power circuit portion or passes through the side portion of the bus bar that is the power circuit portion. the Ri Na and a resin connecting portion which solidified with a locking portion forms of engagement on the opposite side, together with the resin charging hole portion is formed as a substrate through hole passing through the circuit part In the bus bar which is the power circuit section, the substrate through hole Through hole at a position aligned are formed, the resin connecting portion has a characterized in that are provided through both the through hole of the a substrate through hole, and the power circuit section busbar (unit 1).
According to the configuration of means 1, since the resin connecting portion formed by the resin molding machine penetrates both the circuit board and the bus bar and fixes them together, the peeling and deformation between the board and the bus bar are further ensured. Can be prevented.

手段１の構成において、前記回路部は、複数枚の単位基板を重ねあわせた積層基板からなり、前記樹脂充填孔部は、前記単位基板のうち最表面（部品実装面側）の単位基板において径大となる部分を有するように形成されているところに特徴を有する（手段２）。
手段２の構成によれば、回路基板とバスバーとが離れる方向に力が加わったとしても、単位基板の径大となる部分に樹脂が充填されていれば、この樹脂が引っかかってバスバーと回路基板とが固着した状態を保つことができる。 In the configuration of means 1 , the circuit portion is formed of a laminated substrate in which a plurality of unit substrates are overlapped, and the resin-filled hole portion has a diameter on a unit substrate on the outermost surface (component mounting surface side) of the unit substrates. It is characterized in that it is formed to have a large portion (means 2 ).
According to the configuration of the means 2 , even if a force is applied in a direction in which the circuit board and the bus bar are separated from each other, if the resin is filled in a portion having a large diameter of the unit board, the resin is caught and the bus bar and the circuit board are caught. And can be kept in a fixed state.

手段１または手段２に記載の構成において、前記樹脂連結部は、前記回路基板の前記電子部品の実装面側において前記基板貫通孔よりも大きい径大部を有するところに特徴を有する（手段３）。
手段３の構成によれば、回路基板とバスバーとが離れる方向に力が加わったとしても、径大部が回路基板の表面に引っかかることにより、バスバーと回路基板とが固着した状態を保つことができる。 In the configuration according to the means 1 or 2, the resin connecting portion is characterized in that it has a large diameter portion larger than the substrate through hole on the mounting surface side of the electronic component of the circuit board (means 3 ). .
According to the configuration of the means 3 , even if a force is applied in a direction in which the circuit board and the bus bar are separated from each other, the large diameter portion is caught on the surface of the circuit board so that the bus bar and the circuit board can be kept in a fixed state. it can.

手段１ないし手段３のいずれかに記載の構成において、前記電力回路部であるバスバーの前記回路基板とは反対側の面に位置して前記回路基板と略同形の底板部と、その底板部と一体であって前記回路基板の外周端面を包囲する包囲枠部と、前記包囲枠部と一体であって前記回路基板の外周縁部を覆う押さえ枠部とが、前記樹脂連結部との同時成形によって成形されているところに特徴を有する（手段４）。
手段４の構成によれば、基板の端部について、底板部と押さえ枠部とにより、基板とバスバーとが挟み合わされた状態で保持することができるため、より確実にバスバーを回路基板に固着させることができる。 In the configuration according to any one of the means 1 to 3 , the bottom plate portion that is located on the surface opposite to the circuit board of the bus bar that is the power circuit portion and has substantially the same shape as the circuit board, and the bottom plate portion, An enclosure frame portion that is integral and surrounds the outer peripheral end surface of the circuit board, and a pressing frame portion that is integral with the enclosure frame portion and covers the outer peripheral edge portion of the circuit board are simultaneously formed with the resin coupling portion. (Means 4 ).
According to the configuration of the means 4 , since the end portion of the substrate can be held in a state where the substrate and the bus bar are sandwiched by the bottom plate portion and the holding frame portion, the bus bar is more securely fixed to the circuit substrate. be able to.

手段１ないし手段４いずれかに記載の構成において、前記回路部は、回路基板であり、前記回路基板に形成された貫通孔を通って前記回路部の前記導電路又は前記電子部品と前記バスバーとを電気的に接続する中継回路部を備え、前記樹脂充填孔部は、前記回路部の少なくとも前記電力回路部側の面に前記中継回路部の近傍に形成されているところに特徴を有する（手段５）。 In the configuration according to any one of the means 1 to 4 , the circuit unit is a circuit board, and the conductive path or the electronic component of the circuit unit and the bus bar pass through a through hole formed in the circuit board. The resin filling hole is characterized in that it is formed in the vicinity of the relay circuit part on at least the power circuit part side surface of the circuit part (means) 5 ).

回路基板を貫通してバスバーと回路基板の導電路等とを中継回路部によって貫通接続する構成の場合、その中継回路部とバスバーや導電路との接続が断たれると、回路構成体の回路動作に支障を来す。このため、中継回路部周りの接続信頼性を高く保つことが重要である。しかるに、回路基板にバスバーを接着剤層を介して積層する従来構造では、どの箇所で接着剤層の剥離が発生するかは不確定であり、信頼性を高く維持することは容易ではなかった。
これに対して、手段５の構成では、バスバーを回路基板に固着させる機能を発揮する樹脂充填孔部が中継回路部の近傍に形成される。したがって、中継回路部の近傍の位置に樹脂連結部が設けられることになり、中継回路部の位置における回路基板とバスバーとの固着強度が高くなり、回路構成体の信頼性を高くすることができる。 In the case of a configuration in which the bus bar and the conductive path of the circuit board are connected through the circuit board through the relay circuit unit, if the connection between the relay circuit unit and the bus bar or the conductive path is broken, the circuit of the circuit structure It interferes with operation. For this reason, it is important to keep the connection reliability around the relay circuit portion high. However, in the conventional structure in which the bus bar is laminated on the circuit board via the adhesive layer, it is uncertain where the adhesive layer is peeled off, and it is not easy to maintain high reliability.
On the other hand, in the configuration of the means 5 , the resin filling hole portion that exhibits the function of fixing the bus bar to the circuit board is formed in the vicinity of the relay circuit portion. Therefore, the resin connecting portion is provided in the vicinity of the relay circuit portion, the fixing strength between the circuit board and the bus bar at the position of the relay circuit portion is increased, and the reliability of the circuit structure can be increased. .

本発明の回路構成体は、導電路を有すると共に、当該導電路に接続された電子部品が実装された回路部と、この回路部の前記電子部品実装面とは反対側の面の金属製のバスバーで構成される電力回路部と、前記回路部の少なくとも前記電力回路部側の面に形成された樹脂充填孔部と、前記回路部と前記電力回路部とを重ねた状態で一部が前記樹脂充填孔部内を貫通すると共に、他の一部が前記電力回路部であるバスバーを貫通し又は前記電力回路部であるバスバーの側部を通って前記電力回路部であるバスバーの前記回路部とは反対側の面に係止する形態の係止部を有して固化した樹脂連結部とを備えてなり、前記回路部は、複数枚の単位基板を重ねあわせた積層基板からなり、前記樹脂充填孔部は、前記単位基板のうち部品実装面側の単位基板において径大となる部分を有するように形成されているところに特徴を有する（手段６）。
また、本発明の回路構成体は、導電路を有すると共に、当該導電路に接続された電子部品が実装された回路部と、この回路部の前記電子部品実装面とは反対側の面の金属製のバスバーで構成される電力回路部と、前記回路部の少なくとも前記電力回路部側の面に形成された樹脂充填孔部と、前記回路部と前記電力回路部とを重ねた状態で一部が前記樹脂充填孔部内を貫通すると共に、他の一部が前記電力回路部であるバスバーを貫通し又は前記電力回路部であるバスバーの側部を通って前記電力回路部であるバスバーの前記回路部とは反対側の面に係止する形態の係止部を有して固化した樹脂連結部とを備えてなり、前記樹脂連結部は、前記回路部の前記電子部品の実装面側において前記樹脂充填孔部よりも大きい径大部を有するところに特徴を有する（手段７）。
また、本発明の回路構成体は、導電路を有すると共に、当該導電路に接続された電子部品が実装された回路部と、この回路部の前記電子部品実装面とは反対側の面の金属製のバスバーで構成される電力回路部と、前記回路部の少なくとも前記電力回路部側の面に形成された樹脂充填孔部と、前記回路部と前記電力回路部とを重ねた状態で一部が前記樹脂充填孔部内を貫通すると共に、他の一部が前記電力回路部であるバスバーを貫通し又は前記電力回路部であるバスバーの側部を通って前記電力回路部であるバスバーの前記回路部とは反対側の面に係止する形態の係止部を有して固化した樹脂連結部とを備えてなり、前記電力回路部であるバスバーの前記回路部とは反対側の面に位置して前記回路部と略同形の底板部と、その底板部と一体であって前記回路部の外周端面を包囲する包囲枠部と、前記包囲枠部と一体であって前記回路部の外周縁部を覆う押さえ枠部とが、前記樹脂連結部との同時成形によって成形されているところに特徴を有する（手段８）。
また、本発明の回路構成体は、導電路を有すると共に、当該導電路に接続された電子部品が実装された回路部と、この回路部の前記電子部品実装面とは反対側の面の金属製のバスバーで構成される電力回路部と、前記回路部の少なくとも前記電力回路部側の面に形成された樹脂充填孔部と、前記回路部と前記電力回路部とを重ねた状態で一部が前記樹脂充填孔部内を貫通すると共に、他の一部が前記電力回路部であるバスバーを貫通し又は前記電力回路部であるバスバーの側部を通って前記電力回路部であるバスバーの前記回路部とは反対側の面に係止する形態の係止部を有して固化した樹脂連結部とを備えてなり、前記回路部は、回路基板であり、前記回路基板に形成された貫通孔を通って前記回路部の前記導電路又は前記電子部品と前記バスバーとを電気的に接続する中継回路部を備え、前記樹脂充填孔部は、前記回路部の少なくとも前記電力回路部側の面に前記中継回路部の近傍に形成されているところに特徴を有する（手段９）。
手段１ないし手段９のいずれかに記載の構成において、前記回路部は、フレキシブルプリント基板（Flexible Printed Circuit）、プリント基板等の導体を印刷してパターン化した基板で構成されるところに特徴を有する（手段１０）。 The circuit structure of the present invention has a conductive path, a circuit part on which an electronic component connected to the conductive path is mounted, and a metal part on the surface opposite to the electronic component mounting surface of the circuit part. A part of the power circuit portion constituted by a bus bar, the resin filling hole portion formed on at least the power circuit portion side surface of the circuit portion, and the circuit portion and the power circuit portion are overlapped. The circuit portion of the bus bar that is the power circuit portion passes through the inside of the resin filling hole portion and the other part passes through the bus bar that is the power circuit portion or passes through the side portion of the bus bar that is the power circuit portion. And a solidified resin connecting portion having a locking portion that is locked to the opposite surface, and the circuit portion is a laminated substrate in which a plurality of unit substrates are stacked, and the resin The filling hole is a unit on the component mounting surface side of the unit board. Characterized in place is formed to have a portion to be a large diameter in the plate (unit 6).
The circuit structure of the present invention has a conductive path, a circuit part on which an electronic component connected to the conductive path is mounted, and a metal on a surface opposite to the electronic component mounting surface of the circuit part. A part of the power circuit part composed of bus bars made of resin, a resin-filled hole part formed on at least the power circuit part side of the circuit part, and the circuit part and the power circuit part overlapped Passes through the inside of the resin-filled hole, and the other part of the circuit of the bus bar that is the power circuit unit passes through the bus bar that is the power circuit unit or through the side of the bus bar that is the power circuit unit. And a solidified resin connecting portion having a locking portion that is locked to a surface opposite to the portion, and the resin connecting portion is provided on the mounting surface side of the electronic component of the circuit portion. Specially located in a larger diameter part than the resin-filled hole part. The has (means 7).
The circuit structure of the present invention has a conductive path, a circuit part on which an electronic component connected to the conductive path is mounted, and a metal on a surface opposite to the electronic component mounting surface of the circuit part. A part of the power circuit part composed of bus bars made of resin, a resin-filled hole part formed on at least the power circuit part side of the circuit part, and the circuit part and the power circuit part overlapped Passes through the inside of the resin-filled hole, and the other part of the circuit of the bus bar that is the power circuit unit passes through the bus bar that is the power circuit unit or through the side of the bus bar that is the power circuit unit. And a solidified resin connecting portion having a locking portion that is locked to a surface opposite to the portion, and is positioned on the surface opposite to the circuit portion of the bus bar that is the power circuit portion. And a bottom plate portion having substantially the same shape as the circuit portion, and the bottom plate portion Thus, an enclosure frame portion that surrounds the outer peripheral end surface of the circuit portion and a holding frame portion that is integral with the enclosure frame portion and covers the outer peripheral edge portion of the circuit portion are formed by simultaneous molding with the resin connection portion. (Means 8).
The circuit structure of the present invention has a conductive path, a circuit part on which an electronic component connected to the conductive path is mounted, and a metal on a surface opposite to the electronic component mounting surface of the circuit part. A part of the power circuit part composed of bus bars made of resin, a resin-filled hole part formed on at least the power circuit part side of the circuit part, and the circuit part and the power circuit part overlapped Passes through the inside of the resin-filled hole, and the other part of the circuit of the bus bar that is the power circuit unit passes through the bus bar that is the power circuit unit or through the side of the bus bar that is the power circuit unit. And a solidified resin connecting portion having a locking portion that is locked to a surface opposite to the portion, and the circuit portion is a circuit board, and the through hole formed in the circuit board The conductive path of the circuit part or the electronic component and the It has a relay circuit part that electrically connects to a sbar, and the resin filling hole is characterized in that it is formed in the vicinity of the relay circuit part at least on the surface of the circuit part on the power circuit part side (Means 9).
The configuration according to any one of the means 1 to 9 , wherein the circuit unit is characterized in that it is formed of a flexible printed circuit (PCB), a printed circuit board or the like on which a conductor is printed and patterned. (Means 10 ).

樹脂成型機によって回路基板の樹脂充填孔部に充填された樹脂連結部は、回路基板に埋め込まれたようになって、ここに強固に接着される。一方、樹脂連結部にはバスバーに係止される係止部が一体に形成されるため、バスバーは樹脂連結部を介して回路基板に強固に固着された状態となる。 The resin connecting portion filled in the resin filling hole portion of the circuit board by the resin molding machine is embedded in the circuit board and is firmly bonded thereto. On the other hand, since the locking portion locked to the bus bar is formed integrally with the resin connecting portion, the bus bar is firmly fixed to the circuit board via the resin connecting portion.

したがって、接着剤等の塗布工程や、プレス機によるプレス工程、接着剤を乾燥して固化させる工程を行わなくても、回路基板とバスバーを固着することが可能になり必要な機材や生産時間を減らし、コストを削減することが可能になる。 Therefore, it is possible to fix the circuit board and the bus bar without performing the application process of adhesives, the pressing process with a press, the process of drying and solidifying the adhesive, and the necessary equipment and production time are reduced. It becomes possible to reduce the cost.

＜実施形態１＞
以下、本発明の実施形態１を図１〜図１１によって説明する。
本実施形態における図１の回路構成体１０は、バッテリー等の電源（図示せず）と、ヘッドランプ、ワイパー等の車載電装品（図示せず）との間に接続されて、各種車載電装品への電力の供給及び供給電力の制御等を行うものである。なお、図１の斜め左下を前方とし、斜め右上を後方として説明する。 <Embodiment 1>
Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS.
1 in the present embodiment is connected between a power source (not shown) such as a battery and in-vehicle electrical components (not shown) such as a headlamp and a wiper, and various in-vehicle electrical components. Power supply and control of the power supply. In the following description, it is assumed that the diagonally lower left in FIG. 1 is the front and the diagonally upper right is the rear.

回路構成体１０は、図２に示すように、電子部品１１が実装される回路基板２０（本発明の「回路部」に相当）と、回路基板２０に重ねあわされる金属製のバスバー３０と、回路基板２０とバスバー３０とを固着させる樹脂連結部５０（図７参照）と、を備えて構成されている。 As shown in FIG. 2, the circuit structure 10 includes a circuit board 20 on which the electronic component 11 is mounted (corresponding to the “circuit portion” of the present invention), a metal bus bar 30 overlaid on the circuit board 20, A resin connecting portion 50 (see FIG. 7) for fixing the circuit board 20 and the bus bar 30 is provided.

回路基板２０は、長方形状をなし、制御回路に応じて多数の導電路Ｄ（概略のみ図示）が一方の面に形成されており、後方には、幅方向の対称な位置に矩形状の複数の部品逃げ孔２１，２１が形成されている。 The circuit board 20 has a rectangular shape, and a large number of conductive paths D (only schematically shown) are formed on one surface according to the control circuit. The component escape holes 21 and 21 are formed.

また、回路基板２０には、複数（図１では３個）の中継用貫通孔２２Ａ,２２Ｂ,２２Ｃ（中継用貫通孔２２Ａ,２２Ｂ,２２Ｃを総称して中継用貫通孔２２ということがある）が形成されている。この実施形態では、これらの中継用貫通孔２２は、概ね電子部品１１の端子Ｔ１と回路基板２０の導電路Ｄとの接続部分の近傍に形成されており、この中継用貫通孔２２Ａ,２２Ｂ,２２Ｃの内部には、それぞれ中継回路部４０Ａ,４０Ｂ,４０Ｃ（中継回路部４０Ａ,４０Ｂ,４０Ｃを総称して中継回路部４０ということがある）が形成されている。 The circuit board 20 has a plurality (three in FIG. 1) of relay through holes 22A, 22B, 22C (the relay through holes 22A, 22B, 22C may be collectively referred to as relay through holes 22). Is formed. In this embodiment, these relay through holes 22 are formed in the vicinity of the connection portion between the terminal T1 of the electronic component 11 and the conductive path D of the circuit board 20, and the relay through holes 22A, 22B, 22C includes relay circuit portions 40A, 40B, and 40C (respectively, the relay circuit portions 40A, 40B, and 40C may be collectively referred to as the relay circuit portion 40).

中継回路部４０（４０Ａ,４０Ｂ,４０Ｃ）は、クランク状をなすジャンパチップにより構成され、その一端側が回路基板２０上の導電路Ｄにはんだ付けされ、他端側が中継用貫通孔２２を通ってバスバー３０にはんだ付けされている。 The relay circuit unit 40 (40A, 40B, 40C) is configured by a jumper chip having a crank shape, one end of which is soldered to the conductive path D on the circuit board 20, and the other end passes through the through hole 22 for relay. Soldered to the bus bar 30.

また、回路基板２０には、図２に示すように、複数（本実施形態では６個）の基板貫通孔２５Ａ〜２５Ｆ（本発明の「樹脂充填孔部」に相当）が回路基板２０を貫通して形成されている。 Further, as shown in FIG. 2, a plurality (six in this embodiment) of substrate through holes 25 A to 25 F (corresponding to “resin-filled hole portions” of the present invention) penetrate the circuit board 20. Is formed.

６個の基板貫通孔２５Ａ〜２５Ｆのうち、やや大きい４個の基板貫通孔２５Ａ,２５Ｂ,２５Ｃ,２５Ｄは、回路基板２０の四隅の位置にそれぞれ形成されている。これにより、左前方の基板貫通孔２５Ｄ（及び径大部５２Ｄ）が中継用貫通孔２２Ｂ，２２Ｃ（及び中継回路部４０Ｂ，４０Ｃ）の近傍の位置となっている。
なお、本実施形態の回路構成体は、極めて小型のものを用いることができ、その場合、回路基板２０の表面面積も小さくなるため、少なくとも本実施形態の基板貫通孔２５Ｄ（及び径大部５２Ｄ）と中継用貫通孔２２Ｂ，２２Ｃ（及び中継回路部４０Ｂ，４０Ｃ）との位置関係は「近傍」に含まれる。やや大きい回路構成体を用いる場合には、基板貫通孔２５（基板貫通孔２５Ａ〜２５Ｆを総称していう）と中継用貫通孔２２の位置関係を図２よりも、より近い位置とした方が、後述する樹脂連結部５０により中継回路部４０の接続状態をより強固に維持することができ、好適である。
また、中継回路部４０の接続状態を維持するための、中継回路部４０と基板貫通孔２５（及び径大部５２）の好ましい近さは、回路基板２０、バスバー３０、樹脂連結部５０の材質等により線膨張係数が異なり、温度変化に対する中継回路部４０に生じる応力が異なるため、その応力が電気的接続状態を保つのに支障がない範囲となる近さ（距離）を設定する。 Of the six substrate through holes 25A to 25F, four slightly larger substrate through holes 25A, 25B, 25C, and 25D are formed at the four corner positions of the circuit board 20, respectively. Thereby, the board | substrate through-hole 25D (and large diameter part 52D) of the left front becomes the position of the vicinity of the through-holes 22B and 22C for relay (and the relay circuit parts 40B and 40C).
In addition, since the circuit structure of this embodiment can use a very small thing and the surface area of the circuit board 20 also becomes small in that case, at least board | substrate through-hole 25D (and large diameter part 52D of this embodiment). ) And the through holes 22B and 22C for relay (and the relay circuit portions 40B and 40C) are included in the “neighborhood”. When using a slightly larger circuit structure, the positional relationship between the substrate through-hole 25 (collectively referred to as substrate through-holes 25A to 25F) and the relay through-hole 22 is closer to that in FIG. The connection state of the relay circuit unit 40 can be more firmly maintained by the resin coupling unit 50 described later, which is preferable.
In order to maintain the connection state of the relay circuit unit 40, the preferable proximity of the relay circuit unit 40 and the substrate through hole 25 (and the large diameter portion 52) is the material of the circuit board 20, the bus bar 30, and the resin connection unit 50. Since the linear expansion coefficient differs depending on the temperature and the stress generated in the relay circuit unit 40 with respect to a temperature change is different, the proximity (distance) in which the stress does not hinder the electrical connection state is set.

他の２個の基板貫通孔２５Ｅ,２５Ｆは、四隅の位置の基板貫通孔２５Ａ〜２５Ｄよりも径が小さいものであり、２つの部品逃げ孔２１，２１の間の位置に形成されている。
なお、回路基板２０は、切り離し溝部２９により両側端の支持部２８から切り離し可能になっている。 The other two substrate through holes 25E and 25F are smaller in diameter than the substrate through holes 25A to 25D at the four corners, and are formed at positions between the two component escape holes 21 and 21.
The circuit board 20 can be separated from the support portions 28 at both ends by a separation groove 29.

バスバー３０は、複数の金属板材３０Ａ〜３０Ｆを備えると共に、これらの周囲を取り囲む支持枠３３を有する。支持枠３３は、樹脂成形の際に金属板材３０Ａ〜３０Ｆを支持し、その後に切り離されて、金属板材３０Ａ〜３０Ｆが相互に分離される（図５，６参照）。 The bus bar 30 includes a plurality of metal plate members 30 A to 30 F and a support frame 33 that surrounds these. The support frame 33 supports the metal plate members 30A to 30F during resin molding, and is then cut off to separate the metal plate members 30A to 30F from each other (see FIGS. 5 and 6).

金属板材３０Ａ〜３０Ｆには、基板貫通孔２５Ａ〜２５Ｆに対応（整合）した位置に、バスバー貫通孔３５Ａ〜３５Ｆが形成されている。バスバー貫通孔３５Ａ〜３５Ｆは、対応する基板貫通孔２５Ａ〜２５Ｆと同じ大きさとなっている。
また、金属板材３０Ａ〜３０Ｆは、外部との接続のための雄型の端子部３１を形成する。 On the metal plate members 30A to 30F, bus bar through holes 35A to 35F are formed at positions corresponding to (aligned with) the substrate through holes 25A to 25F. The bus bar through holes 35A to 35F have the same size as the corresponding substrate through holes 25A to 25F.
Moreover, the metal plate members 30A to 30F form a male terminal portion 31 for connection to the outside.

これら回路基板２０とバスバー３０とが重ね合わされた状態で、図１に示すように、ＦＥＴ等の電子部品１１が部品逃げ孔２１，２１内で、バスバー３０上に載置される。このとき、電子部品１１の向きは、その端子Ｔ１,Ｔ２が後述するバスバー３０の端子部３１の差込方向に沿う方向に向けられる。
そして、電子部品１１の端子の一部の端子Ｔ１が回路基板２０の導電路Ｄ上にはんだ付けされ、他の一部の端子Ｔ２が部品逃げ孔２１から上面が露出したバスバー３０Ｂ,３０Ｄにはんだ付けされる（図２参照）。また、電子部品１１は、グランドに接続されるとともに、電子部品１１を固定する固定用端子Ｔ３を有し、この固定用端子Ｔ３が電子部品１１の下のバスバー３０Ｃにはんだ付けされる。これら端子Ｔ１〜Ｔ３は、電子部品１１内部のスイッチング回路で電気的接続状態をオンオフできる。
なお、電子部品１１の端子Ｔ１,Ｔ２と回路基板２０の導電路Ｄ（及びバスバー３０）との接続部分は、後述する２個の基板貫通孔２５Ｅ,２５Ｆ（及び径大部５２Ｅ,５２Ｆ）の近傍の位置となっている。 In a state where the circuit board 20 and the bus bar 30 are overlapped, as shown in FIG. 1, the electronic component 11 such as an FET is placed on the bus bar 30 in the component escape holes 21 and 21. At this time, the direction of the electronic component 11 is directed in the direction along the insertion direction of the terminal portion 31 of the bus bar 30 to be described later.
Then, a part of the terminals T1 of the electronic component 11 is soldered onto the conductive path D of the circuit board 20, and the other part of the terminals T2 is soldered to the bus bars 30B and 30D whose upper surfaces are exposed from the component escape holes 21. (See FIG. 2). The electronic component 11 is connected to the ground and has a fixing terminal T3 for fixing the electronic component 11. The fixing terminal T3 is soldered to the bus bar 30C below the electronic component 11. These terminals T 1 to T 3 can be turned on and off in an electrically connected state by a switching circuit inside the electronic component 11.
The connecting portion between the terminals T1 and T2 of the electronic component 11 and the conductive path D (and the bus bar 30) of the circuit board 20 is formed by two board through holes 25E and 25F (and large diameter parts 52E and 52F) described later. It is a nearby position.

樹脂連結部５０は、図１１に示すように、基板貫通孔２５及びバスバー貫通孔３５の内部に樹脂が充填されて形成された充填部５３を有する。これにより、基板貫通孔２５とバスバー貫通孔３５とを貫通する充填部５３は、回路基板２０及びバスバー３０に埋め込まれたようになって、ここに強固に接着されるようになっている。 As shown in FIG. 11, the resin connecting portion 50 includes a filling portion 53 formed by filling the inside of the substrate through hole 25 and the bus bar through hole 35 with resin. Thereby, the filling portion 53 penetrating the board through hole 25 and the bus bar through hole 35 is embedded in the circuit board 20 and the bus bar 30 and is firmly bonded thereto.

また、樹脂連結部５０は、回路基板２０の上面に円形の径大部５２がはみ出して形成されている。
円形の径大部５２は、その径が基板貫通孔２５の径よりも大きくされている。これにより、回路基板２０とバスバー３０とが離れる方向に力が加わっても、径大部５２が回路基板２０の上面に引っかかり、回路基板２０とバスバー３０とがより強固に固着した状態を保てるようになっている。 The resin connecting portion 50 is formed by protruding a circular large diameter portion 52 on the upper surface of the circuit board 20.
The circular large diameter portion 52 has a diameter larger than that of the substrate through hole 25. As a result, even when a force is applied in a direction in which the circuit board 20 and the bus bar 30 are separated from each other, the large diameter portion 52 is caught on the upper surface of the circuit board 20 so that the circuit board 20 and the bus bar 30 are more firmly fixed. It has become.

また、樹脂連結部５０は、バスバー３０の下方側（回路基板２０とは反対側）からバスバー３０を覆うように形成された係止部５１を有する。
係止部５１は、図１，図７に示すように、バスバー３０の下面側では、バスバー３０の下方から端子部３１を除いたバスバー３０及び回路基板２０の全体を覆うように、回路基板２０よりもわずかに大きく形成されている。この係止部５１により、バスバー３０を下側から支え、バスバー３０が回路基板２０から離れないように係止する。 Further, the resin connecting portion 50 includes a locking portion 51 formed so as to cover the bus bar 30 from the lower side of the bus bar 30 (the side opposite to the circuit board 20).
As shown in FIGS. 1 and 7, the locking portion 51 is provided on the lower surface side of the bus bar 30 so as to cover the entire bus bar 30 and the circuit board 20 except for the terminal portion 31 from below the bus bar 30. It is formed slightly larger than. The locking portion 51 supports the bus bar 30 from below and locks the bus bar 30 so as not to be separated from the circuit board 20.

なお、この係止部５１は、バスバー３０の全体を覆ってもよいが、本実施形態では、複数（５個）の空洞の部分が形成されている（図５参照）。これは、係止部５１は、バスバー３０を構成する複数の金属部材を位置決めし固定する機能も有するため、少なくとも、複数の金属部材の金属部材間を跨ぐように形成する必要がある反面、バスバー３０の係止に必要な部分のみに係止部５１を形成することで、全体を覆う場合と比較して軽量化を図っている。したがって、かかる形態でもバスバー３０は回路基板２０に固着されるようになっている。 In addition, although this latching | locking part 51 may cover the whole bus-bar 30, in this embodiment, the part of multiple (5 pieces) cavity is formed (refer FIG. 5). This is because the locking portion 51 also has a function of positioning and fixing a plurality of metal members constituting the bus bar 30, so it is necessary to form at least between the metal members of the plurality of metal members, on the other hand, the bus bar By forming the locking part 51 only in the part necessary for locking 30, the weight is reduced as compared with the case of covering the whole. Therefore, the bus bar 30 is fixed to the circuit board 20 even in such a form.

樹脂連結部５０は、本実施形態では以下に説明する樹脂成形機（図示しない）により金型６０に樹脂を注入する射出成形により行われるが、これに限られず他の成形法でもよい。例えば、熱硬化性の樹脂においては、トランスファー成形や圧縮成形等を用いてもよく、また、インサート成形等の成形法を組み合わせたものでもよい。注入する樹脂としては、本実施形態では、ポリフェニレンサルファイド（ＰＰＳ）樹脂を用いる。なお、他の熱硬化性樹脂や他の熱可塑性樹脂等を注入してもよい。 In the present embodiment, the resin connecting portion 50 is performed by injection molding in which a resin is injected into the mold 60 by a resin molding machine (not shown) described below. However, the present invention is not limited to this, and other molding methods may be used. For example, in a thermosetting resin, transfer molding, compression molding, or the like may be used, or a combination of molding methods such as insert molding may be used. In this embodiment, polyphenylene sulfide (PPS) resin is used as the resin to be injected. In addition, you may inject | pour another thermosetting resin, another thermoplastic resin, etc.

次に回路構成体１０の製造方法について説明する。
図３のように回路基板２０及びバスバー３０を重ねて支持部２８及び支持枠３３を固定した状態で金型６０にセットする（図８）。なお、金型６０のうち、上型には、径大部５２を形成する位置に、円形の凹部６１が形成されている。 Next, a method for manufacturing the circuit structure 10 will be described.
As shown in FIG. 3, the circuit board 20 and the bus bar 30 are overlapped and the support portion 28 and the support frame 33 are fixed and set in the mold 60 (FIG. 8). Of the mold 60, a circular recess 61 is formed in the upper mold at a position where the large-diameter portion 52 is formed.

次に、図９に示すように、樹脂成型機により、ＰＰＳ樹脂を、樹脂連結部５０の径大部５２が形成される部分に入り込むまで注入する。そして、ＰＰＳ樹脂が硬化した後、金型６０から取り出す（図４,図１０）。 Next, as shown in FIG. 9, the PPS resin is injected by a resin molding machine until it enters a portion where the large diameter portion 52 of the resin connecting portion 50 is formed. And after PPS resin hardens | cures, it takes out from the metal mold | die 60 (FIG. 4, FIG. 10).

次に、回路基板２０の支持部２８及びバスバー３０の支持枠３３を切り離す（図６，図７）。そして、回路基板２０の部品逃げ孔２１，２１の位置に合わせて、電子部品１１をバスバー３０の上に載置し、各端子Ｔ１〜Ｔ３ごとに所定の導電路Ｄ及びバスバー３０にはんだ付けすることで（図１１）、回路構成体１０が製造される。
このように本実施形態では、樹脂成型機によって回路基板２０の基板貫通孔２５（樹脂充填孔部）に充填された充填部５３（樹脂連結部５０）は、回路基板２０に埋め込まれたようになって、ここに強固に接着される。一方、樹脂連結部５０にはバスバー３０に係止される係止部５１が一体に形成されるから、結局、バスバー３０は樹脂連結部５０を介して回路基板２０に強固に固着された状態となる。 Next, the support portion 28 of the circuit board 20 and the support frame 33 of the bus bar 30 are separated (FIGS. 6 and 7). And according to the position of the component escape holes 21 and 21 of the circuit board 20, the electronic component 11 is mounted on the bus bar 30, and is soldered to the predetermined conductive path D and the bus bar 30 for each of the terminals T1 to T3. Thus (FIG. 11), the circuit structure 10 is manufactured.
As described above, in this embodiment, the filling portion 53 (resin connecting portion 50) filled in the substrate through hole 25 (resin filling hole portion) of the circuit board 20 by the resin molding machine is embedded in the circuit board 20. It is firmly bonded here. On the other hand, the resin connecting portion 50 is integrally formed with a locking portion 51 that is locked to the bus bar 30, so that the bus bar 30 is firmly fixed to the circuit board 20 via the resin connecting portion 50. Become.

したがって、接着剤等の塗布工程や、プレス機によるプレスし、接着剤を乾燥して固化させる工程を行わなくても、回路基板２０とバスバー３０を固着することが可能になり必要な機材や生産時間を減らし、コストを削減することが可能になる。 Therefore, it is possible to fix the circuit board 20 and the bus bar 30 without the need to perform an adhesive application process or a press machine to dry and solidify the adhesive. Time can be reduced and costs can be reduced.

また、本実施形態のように、回路基板２０を貫通してバスバーと回路基板２０の導電路等とを中継回路部４０によって貫通接続する構成の場合、その中継回路部４０とバスバー３０や導電路Ｄとの接続が断たれると、回路構成体１０の回路動作に支障を来す。このため、中継回路部４０周りの接続信頼性を高く保つことが重要である。しかるに、回路基板２０にバスバー３０を接着剤層を介して積層する従来構造では、どの箇所で接着剤層の剥離が発生するかは不確定であり、信頼性を高く維持することは容易ではなかった。 Further, as in the present embodiment, in a configuration in which the bus bar and the conductive path of the circuit board 20 are connected through the circuit board 20 through the relay circuit unit 40, the relay circuit unit 40, the bus bar 30, and the conductive path are connected. When the connection with D is broken, the circuit operation of the circuit structure 10 is hindered. For this reason, it is important to keep the connection reliability around the relay circuit unit 40 high. However, in the conventional structure in which the bus bar 30 is laminated on the circuit board 20 via the adhesive layer, it is uncertain where the adhesive layer is peeled off, and it is not easy to maintain high reliability. It was.

これに対して、本実施形態では、バスバー３０を回路基板２０に固着させる機能を発揮する基板貫通孔２５（樹脂充填孔部）は中継回路部４０の近傍に形成することとしているから、中継回路部４０の近傍の位置において回路基板２０とバスバーとの固着強度が最も高くなり、回路構成体１０の信頼性を高くすることができる。 On the other hand, in the present embodiment, the board through hole 25 (resin filling hole part) that exhibits the function of fixing the bus bar 30 to the circuit board 20 is formed in the vicinity of the relay circuit part 40. The fixing strength between the circuit board 20 and the bus bar is highest at a position in the vicinity of the portion 40, and the reliability of the circuit structure 10 can be increased.

ところで、端子部３１を雌端子に差し込む際には、内部に回路基板２０が固定されたケース（図示しない）を掴み、端子部３１の方向に押し込むことになる。このとき、回路基板２０には、ケースからの力を受けて押し込む方向の力が加わる一方、バスバー３０には、端子部３１からの力を受けて押し戻す方向の力が加わるため、回路基板２０とバスバー３０との間にせん断力が生じるおそれがある。ここで、回路基板２０とバスバー３０とが接着剤により接着されている場合には、接着面のうち、どの部分にせん断力が生じるかわからず、このため、せん断力による回路基板２０とバスバー３０と間の剥がれもどこに生じるかわからない。しかし、後述する樹脂連結部５０により回路基板２０とバスバー３０とを固着させることで、少なくとも樹脂連結部５０の近傍の位置においてはせん断力による剥がれを生じさせないようにすることができるため、樹脂連結部５０の近傍に配された中継回路部４０の電気的接続状態を維持することができる。 By the way, when the terminal portion 31 is inserted into the female terminal, a case (not shown) in which the circuit board 20 is fixed is grasped and pushed in the direction of the terminal portion 31. At this time, the circuit board 20 is applied with a force in the direction of pushing in by receiving a force from the case, while the bus bar 30 is applied with a force in a direction of pushing back by receiving the force from the terminal portion 31. There is a possibility that a shearing force is generated between the bus bar 30 and the bus bar 30. Here, when the circuit board 20 and the bus bar 30 are bonded by an adhesive, it is not known which part of the bonded surface generates a shearing force. For this reason, the circuit board 20 and the bus bar 30 due to the shearing force are not known. I don't know where the peeling occurs. However, since the circuit board 20 and the bus bar 30 are fixed to each other by a resin connecting portion 50 described later, at least a position near the resin connecting portion 50 can be prevented from causing peeling due to shearing force. The electrical connection state of the relay circuit unit 40 arranged in the vicinity of the unit 50 can be maintained.

＜実施形態２＞
次に、本発明の実施形態２を図１２ないし図１６を参照して説明する。
実施形態２の回路構成体１００は、実施形態１の構成に加えて、図１２に示すように、樹脂連結部１５０が、回路基板２０の端部でバスバー３０の下側から回路基板２０の上面に亘って形成（架設）されることで、回路基板２０上面の縁部が樹脂で覆われた形状となっている。 <Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS.
In addition to the configuration of the first embodiment, the circuit configuration body 100 of the second embodiment includes a resin connecting portion 150 at the end of the circuit board 20 from the lower side of the bus bar 30 on the upper surface of the circuit board 20 as shown in FIG. As a result, the edge of the upper surface of the circuit board 20 is covered with a resin.

具体的には、樹脂連結部１５０は、バスバー３０の下側（回路基板２０とは反対側）の面に位置して回路基板２０と略同形の底板部７０と、その底板部７０と一体であって回路基板２０の外周端面を包囲する包囲枠部７１と、包囲枠部７１と一体であって回路基板２０の上面にて回路基板２０の外周縁部を覆う押さえ枠部７２と、を備えて構成される。 Specifically, the resin connecting portion 150 is located on the lower surface (opposite side of the circuit board 20) of the bus bar 30, and has a bottom plate portion 70 that is substantially the same shape as the circuit board 20, and is integrated with the bottom plate portion 70. An encircling frame portion 71 that surrounds the outer peripheral end surface of the circuit board 20, and a holding frame portion 72 that is integral with the enclosing frame portion 71 and covers the outer peripheral edge of the circuit board 20 on the upper surface of the circuit board 20. Configured.

これら底板部７０と包囲枠部７１と押さえ枠部７２とは、後述する樹脂連結部１５０との同時成形によって製造されており、押さえ枠部７２と底板部７０とが回路基板２０及びバスバー３０を挟み合わせた状態となっている。 The bottom plate portion 70, the surrounding frame portion 71, and the holding frame portion 72 are manufactured by simultaneous molding with a resin connecting portion 150 described later, and the holding frame portion 72 and the bottom plate portion 70 connect the circuit board 20 and the bus bar 30. It is in a state of being sandwiched.

次に回路構成体１０の製造方法について説明する。
回路基板２０及びバスバー３０を重ねて支持部２８及び支持枠３３を固定した状態で金型１６０にセットする（図１３）。なお、金型１６０には、包囲枠部７１と押さえ枠部７２を形成する凹部１６１が形成されている。 Next, a method for manufacturing the circuit structure 10 will be described.
The circuit board 20 and the bus bar 30 are overlapped, and the support portion 28 and the support frame 33 are fixed and set in the mold 160 (FIG. 13). The mold 160 has a recess 161 that forms the surrounding frame portion 71 and the holding frame portion 72.

次に、図１４に示すように、ＰＰＳ樹脂を、樹脂連結部１５０の径大部５２が形成される部分に入り込むまで注入する。そして、ＰＰＳ樹脂が硬化した後、金型６０から取り出す（図１５）。 Next, as shown in FIG. 14, the PPS resin is injected until it enters the portion where the large diameter portion 52 of the resin connecting portion 150 is formed. And after PPS resin hardens | cures, it takes out from the metal mold | die 60 (FIG. 15).

次に、回路基板２０の支持部２８及びバスバー３０の支持枠３３を切り離す。そして、回路基板２０の部品逃げ孔２１，２１の位置に合わせて、ＦＥＴ等の電子部品１１をバスバー３０の上に載置し、各端子Ｔ１〜Ｔ３ごとに所定の導電路Ｄ及びバスバー３０にはんだ付けすることで（図１６）、回路構成体１０が製造される。
これにより、実施形態１の効果に加え、樹脂連結部１５０により回路基板２０の端部についても回路基板２０とバスバー３０とが挟み合わされた状態で保持されるから、より強固にバスバー３０を回路基板２０に固着させることができる。 Next, the support portion 28 of the circuit board 20 and the support frame 33 of the bus bar 30 are separated. And according to the position of the component escape holes 21 and 21 of the circuit board 20, the electronic components 11 such as FETs are placed on the bus bar 30, and the predetermined conductive path D and the bus bar 30 are connected to each terminal T1 to T3. By soldering (FIG. 16), the circuit structure 10 is manufactured.
Thereby, in addition to the effect of the first embodiment, the end portion of the circuit board 20 is also held by the resin connecting portion 150 in a state where the circuit board 20 and the bus bar 30 are sandwiched. 20 can be fixed.

＜実施形態３＞
次に、本発明の実施形態３を図１７を参照して説明する。
実施形態３は、図１７に示すように、回路基板２０は三枚（複数枚）の単位基板８０Ａ,８０Ｂ,８０Ｃを重ねあわせた積層基板８０からなり、基板貫通孔２５（樹脂充填孔部）には、三枚の単位基板のうち真中の単位基板８０Ｂの基板貫通孔２５側の内面を切り欠いた径大貫通孔８１を形成し、この径大貫通孔８１の内部が（バスバー３０から遠い側の単位基板において径大となる部分）が樹脂溜り部８２となっている。
そして、三枚の基板貫通孔内に充填された充填部１５３は、樹脂溜り部８２にも進入しているため、たとえ回路基板２０とバスバー３０とが離れる方向に力が加わっても、充填部１５３（樹脂連結部）が径大貫通孔８１（樹脂溜り部８２）に引っかかり、より強固にバスバー３０を回路基板２０に固着させることができる。 <Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIG.
In the third embodiment, as shown in FIG. 17, the circuit board 20 is composed of a laminated substrate 80 in which three (a plurality of) unit substrates 80A, 80B, and 80C are stacked, and the substrate through hole 25 (resin-filled hole portion). In the three unit substrates, a large diameter through hole 81 is formed by notching the inner surface of the middle unit substrate 80B on the substrate through hole 25 side, and the inside of the large diameter through hole 81 (distant from the bus bar 30) is formed. The portion of the unit substrate on the side that has a large diameter) is a resin reservoir 82.
And since the filling part 153 filled in the three board | substrate through-holes has also entered the resin reservoir part 82, even if force is applied in the direction in which the circuit board 20 and the bus bar 30 are separated, the filling part 153 (resin connecting portion) is caught in the large-diameter through hole 81 (resin reservoir portion 82), and the bus bar 30 can be more firmly fixed to the circuit board 20.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
（１）上記実施形態では、基板貫通孔２５と同じ位置にバスバー貫通孔３５が形成されているため、樹脂連結部５０は、基板貫通孔２５及びバスバー貫通孔３５を通る構成としたが、これに限られず、例えば、基板貫通孔２５の位置をその真下にはバスバー３０を有さない位置に形成し、樹脂連結部５０がバスバー３０の側部であってバスバー３０を有さない位置を通る構成としてもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above embodiment, since the bus bar through hole 35 is formed at the same position as the substrate through hole 25, the resin connecting portion 50 is configured to pass through the substrate through hole 25 and the bus bar through hole 35. For example, the position of the substrate through hole 25 is formed at a position directly below the bus bar 30, and the resin connecting portion 50 passes through a position on the side of the bus bar 30 without the bus bar 30. It is good also as a structure.

（２）実施形態１では、樹脂連結部５０には、円形の径大部５２を設けたが、図１８に示すように、回路構成体２００が径大部５２を有さない構成としてもよい。このようにしても、基板貫通孔２５（樹脂充填孔部）に充填された樹脂連結部は、回路基板に埋め込まれたようになって、ここに固着（接着）することが可能である。また、このように押さえ枠部７２と、この径大部５２を設けないようにすることで、回路基板上に突起物が生じないため、この突起物が回路基板上で障害にならず、部品実装が容易になる。 (2) In the first embodiment, the resin connecting portion 50 is provided with the circular large-diameter portion 52. However, as shown in FIG. . Even in this case, the resin connecting portion filled in the board through-hole 25 (resin filling hole) can be fixed (adhered) to the circuit board as if it were embedded in the circuit board. Further, by not providing the holding frame portion 72 and the large diameter portion 52 in this way, no protrusion is generated on the circuit board, so that the protrusion does not become an obstacle on the circuit board, and the component Easy to implement.

（３）上記実施形態では、回路基板２０を貫通する基板貫通孔２５（樹脂充填孔部）を設ける構成としたが、このように回路基板２０を貫通していなくてもよく、回路基板２０の少なくともバスバー３０側の面に、樹脂充填孔部が凹設されている構成でもよい。かかる構成でも、この樹脂充填孔部に充填された樹脂連結部は、回路基板に埋め込まれたようになって、ここに固着することができる。また、このように押さえ枠部７２と、この径大部５２を設けないようにすることで、回路基板上に突起物が生じないため、この突起物が回路基板上で障害にならず、部品実装が容易になる。 (3) In the above embodiment, the substrate through-hole 25 (resin filling hole portion) that penetrates the circuit board 20 is provided. However, the circuit board 20 may not be penetrated in this way. The structure by which the resin filling hole part is recessedly provided in the surface at the side of the bus-bar 30 may be sufficient. Even in such a configuration, the resin connecting portion filled in the resin filling hole portion is embedded in the circuit board and can be fixed thereto. Further, by not providing the holding frame portion 72 and the large diameter portion 52 in this way, no protrusion is generated on the circuit board, so that the protrusion does not become an obstacle on the circuit board, and the component Easy to implement.

（４）上記実施形態では、中継回路部４０には、ジャンパチップを用いたが、これに限らず、例えば、はんだを中継用貫通孔２２に埋め込んで中継回路部４０を形成してもよい。 (4) In the above embodiment, a jumper chip is used for the relay circuit unit 40. However, the present invention is not limited to this. For example, the relay circuit unit 40 may be formed by embedding solder in the relay through hole 22.

（５）回路基板（回路部）には、積層基板以外にも、フレキシブルプリント基板（Flexible Printed Circuit）、プリント基板等の導体を印刷してパターン化した基板を用いることができる。 (5) In addition to the laminated substrate, a circuit substrate (circuit unit) that is patterned by printing a conductor such as a flexible printed circuit or a printed circuit board can be used.

実施形態１の回路構成体の斜視図A perspective view of a circuit composition object of Embodiment 1. 回路基板とバスバーの斜視図Perspective view of circuit board and bus bar 回路基板とバスバーとが重ねあわされた図Diagram of circuit board and bus bar overlapped 樹脂連結部形成後の上面図Top view after forming the resin connection 図４の下面図Bottom view of FIG. 支持部を切り離した図Figure with the support part cut away 図６の下面図Bottom view of FIG. 樹脂連結部形成前の図Figure before forming resin connection 樹脂連結部形成中の図Figure of resin connection part formation 樹脂連結部形成後のＡ−Ａ断面図AA cross-sectional view after resin connection part formation 電子部品１１の実装後の回路構成体Circuit structure after mounting electronic component 11 実施形態２の回路構成体の斜視図A perspective view of a circuit composition object of Embodiment 2. 樹脂連結部形前の図Figure before resin joint 樹脂連結部形成中の図Figure of resin connection part formation 樹脂連結部形成後の図Figure after forming the resin connection 電子部品実装後の回路構成体Circuit structure after mounting electronic components 実施形態３を説明する図The figure explaining Embodiment 3 他の実施形態の回路構成体の斜視図The perspective view of the circuit structure object of other embodiments

Explanation of symbols

１０,１００,２００…回路構成体
１１…電子部品
２０…回路基板
２５…基板貫通孔（樹脂充填孔部）
３０（３０Ａ〜３０Ｆ）…バスバー
３５…バスバー貫通孔
４０…中継回路部
５０,１５０…樹脂連結部
５１…係止部
５２…径大部
５３,１５３…充填部
６０…金型
７０…底板部
７１…包囲枠部
７２…押さえ枠部
８０…積層基板
８０Ａ,８０Ｂ,８０Ｃ…単位基板
８１…径大貫通孔
８２…樹脂溜り部
Ｄ…導電路
Ｔ１〜Ｔ３…端子 DESCRIPTION OF SYMBOLS 10,100,200 ... Circuit structure 11 ... Electronic component 20 ... Circuit board 25 ... Board | substrate through-hole (resin filling hole part)
30 (30A to 30F) ... Bus bar 35 ... Bus bar through hole 40 ... Relay circuit part 50,150 ... Resin connecting part 51 ... Locking part 52 ... Large diameter part 53,153 ... Filling part 60 ... Mold 70 ... Bottom plate part 71 ... Surrounding frame part 72 ... Holding frame part 80 ... Multilayer substrate 80A, 80B, 80C ... Unit substrate 81 ... Large-diameter through hole 82 ... Resin reservoir part D ... Conductive path T1 to T3 ... Terminal

Claims

A circuit unit having a conductive path and mounted with an electronic component connected to the conductive path;
A power circuit unit composed of a metal bus bar on the surface opposite to the electronic component mounting surface of the circuit unit;
A resin-filled hole portion formed on at least the power circuit portion side surface of the circuit portion;
In a state where the circuit part and the power circuit part are overlapped, a part thereof penetrates the inside of the resin filling hole part, and another part penetrates the bus bar which is the power circuit part or the bus bar which is the power circuit part. the through side the circuit portion of the bus bar which is the power circuit unit Ri name and a resin connecting portion which solidified with a locking portion forms of engagement on the opposite side,
The resin filling hole portion is formed as a substrate through hole penetrating the circuit portion, and the bus bar as the power circuit portion is formed with a through hole at a position aligned with the substrate through hole. A circuit structure , characterized in that it is provided so as to penetrate both the substrate through hole and the through hole of the bus bar as the power circuit portion .

The circuit portion is formed of a laminated substrate in which a plurality of unit substrates are overlapped, and the resin-filled hole portion is formed to have a portion having a large diameter in the unit substrate on the component mounting surface side of the unit substrate. circuit arrangement as claimed in claim 1, wherein the are.

3. The circuit structure according to claim 1 , wherein the resin connecting portion has a larger diameter portion than the substrate through hole on a mounting surface side of the electronic component of the circuit portion .

A bottom plate portion that is located on a surface opposite to the circuit portion of the bus bar that is the power circuit portion, and a bottom plate portion that is substantially the same shape as the circuit portion, and an enclosure that is integral with the bottom plate portion and surrounds the outer peripheral end surface of the circuit portion The frame portion and a holding frame portion that is integral with the surrounding frame portion and covers an outer peripheral edge portion of the circuit portion are formed by simultaneous molding with the resin connecting portion. The circuit structure according to claim 3.

The circuit unit is a circuit board, and includes a relay circuit unit that electrically connects the conductive path or the electronic component of the circuit unit and the bus bar through a through-hole formed in the circuit board, The resin filling hole portion is formed in the vicinity of the relay circuit portion on at least the power circuit portion side surface of the circuit portion . Circuit construct.

A circuit unit having a conductive path and mounted with an electronic component connected to the conductive path;
A power circuit unit composed of a metal bus bar on the surface opposite to the electronic component mounting surface of the circuit unit;
A resin-filled hole portion formed on at least the power circuit portion side surface of the circuit portion;
In a state where the circuit part and the power circuit part are overlapped, a part thereof penetrates the inside of the resin filling hole part, and another part penetrates the bus bar which is the power circuit part or the bus bar which is the power circuit part. And a solidified resin connecting portion having a locking portion in a form of locking to the surface opposite to the circuit portion of the bus bar that is the power circuit portion through the side portion,
The circuit portion is formed of a laminated substrate in which a plurality of unit substrates are overlapped, and the resin-filled hole portion is formed to have a portion having a large diameter in the unit substrate on the component mounting surface side of the unit substrate. A circuit structure characterized by that.

A circuit unit having a conductive path and mounted with an electronic component connected to the conductive path;
A power circuit unit composed of a metal bus bar on the surface opposite to the electronic component mounting surface of the circuit unit;
A resin-filled hole portion formed on at least the power circuit portion side surface of the circuit portion;
In a state where the circuit part and the power circuit part are overlapped, a part thereof penetrates the inside of the resin filling hole part, and another part penetrates the bus bar which is the power circuit part or the bus bar which is the power circuit part. And a solidified resin connecting portion having a locking portion in a form of locking to the surface opposite to the circuit portion of the bus bar that is the power circuit portion through the side portion,
The circuit structure according to claim 1, wherein the resin connecting portion has a larger diameter portion than the resin filling hole portion on a mounting surface side of the electronic component of the circuit portion .

A circuit unit having a conductive path and mounted with an electronic component connected to the conductive path;
  A power circuit unit composed of a metal bus bar on the surface opposite to the electronic component mounting surface of the circuit unit;
  A resin-filled hole portion formed on at least the power circuit portion side surface of the circuit portion;
  In a state where the circuit part and the power circuit part are overlapped, a part thereof penetrates the inside of the resin filling hole part, and another part penetrates the bus bar which is the power circuit part or the bus bar which is the power circuit part. And a solidified resin connecting portion having a locking portion in a form of locking to the surface opposite to the circuit portion of the bus bar that is the power circuit portion through the side portion,
  A bottom plate portion that is located on a surface opposite to the circuit portion of the bus bar that is the power circuit portion, and a bottom plate portion that is substantially the same shape as the circuit portion, and an enclosure that is integral with the bottom plate portion and surrounds the outer peripheral end surface of the circuit portion A circuit structure, wherein a frame portion and a holding frame portion that is integral with the surrounding frame portion and covers an outer peripheral edge portion of the circuit portion are formed by simultaneous molding with the resin connecting portion.

A circuit unit having a conductive path and mounted with an electronic component connected to the conductive path;
  A power circuit unit composed of a metal bus bar on the surface opposite to the electronic component mounting surface of the circuit unit;
  A resin-filled hole portion formed on at least the power circuit portion side surface of the circuit portion;
  In a state where the circuit part and the power circuit part are overlapped, a part thereof penetrates the inside of the resin filling hole part, and another part penetrates the bus bar which is the power circuit part or the bus bar which is the power circuit part. And a solidified resin connecting portion having a locking portion in a form of locking to the surface opposite to the circuit portion of the bus bar that is the power circuit portion through the side portion,
  The circuit unit is a circuit board,
  The circuit board includes a relay circuit part that electrically connects the conductive path or the electronic component of the circuit part and the bus bar through a through hole formed in the circuit board, the resin filling hole part of the circuit part A circuit structure characterized in that it is formed in the vicinity of the relay circuit section at least on the surface on the power circuit section side.

The circuit structure according to any one of claims 1 to 9, wherein the circuit unit includes a flexible printed circuit board or a printed circuit board.