JP6218498B2 - Insulation equipment and equipment - Google Patents

Description

  The present invention relates to an insulating device and a device.

  In an electric / electronic device that transmits a signal from an external circuit to an internal circuit, the external circuit and the internal circuit are separated using a transformer, an isolator, a photocoupler, or the like in order to prevent noise from the outside from entering the device. Transformers and isolators use electromagnetic induction, and photocouplers use semiconductor photoconductive effects.

  In order to realize an inexpensive and small circuit of an electric / electronic circuit in recent years, it is desired that the above-described expensive and large-sized passive component for insulation is not used as much as possible.

  Conventionally, there is a planar electromagnetic induction device using a composite laminate having an insulating substrate on which a coil pattern is formed (see, for example, Patent Document 1).

JP 2009-259922 A

  The planar electromagnetic induction device described in Patent Document 1 cannot be used as an electric / electronic device as described above.

  An object of the present invention is to transmit a signal in a non-contact manner from an external circuit to an internal circuit on a printed circuit board without using, for example, passive components such as a transformer, an isolator, and a photocoupler.

An insulating device according to one aspect of the present invention includes:
An insulating device that insulates an input side and an output side of the signal when an externally input signal is output to a device that shapes the waveform of the signal into a rectangular wave,
A primary side circuit for inputting the signal;
A secondary circuit for outputting the signal;
The primary side circuit and the secondary side circuit are mounted so as to be insulated from each other, and are connected to the primary side signal line pattern connected to the primary side circuit and the secondary side circuit. A printed circuit board that is formed so that the secondary signal line patterns run parallel to each other at a predetermined interval and that transmits the signal from the primary signal line pattern to the secondary signal line pattern by induction. Prepare.

  According to one aspect of the present invention, the primary side signal line pattern connected to the signal input side and the secondary side signal line pattern connected to the signal output side are mutually connected to the printed circuit board of the insulating device. It is formed so as to run in parallel with a constant interval, and signals can be transmitted in a non-contact manner by the primary side signal line pattern and the secondary side signal line pattern.

FIG. 3 illustrates a configuration of an electric / electronic device according to Embodiment 1. 6 is a graph showing the relationship of transmission voltage with respect to the pattern length and pattern interval of the primary side signal line pattern and the secondary side signal line pattern of the insulation circuit according to the first embodiment. FIG. 3 is a diagram illustrating an example of waveforms of a primary side signal and a secondary side signal of the insulating circuit according to Embodiment 1; FIG. 5 shows an operation of the waveform shaping circuit of the electric / electronic device according to the first embodiment. FIG. 5 shows a structure of an insulating circuit according to a second embodiment. FIG. 5 shows a configuration of an insulating circuit according to a third embodiment. FIG. 6 shows a configuration of an insulating circuit according to a fourth embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of each embodiment, the directions such as “up”, “down”, “left”, “right”, “front”, “back”, “front”, “back” are However, it is not intended to limit the arrangement or orientation of devices, instruments, parts, or the like.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration of an electric / electronic device 100 according to the present embodiment.

  In FIG. 1, the electric / electronic device 100 includes an insulation circuit 110 and a waveform shaping circuit 120.

  The insulation circuit 110 insulates the input side and the output side of a signal when outputting an externally input signal (input signal 101) to a device (waveform shaping circuit 120) that shapes the waveform of the signal into a rectangular wave. This is an example of an insulating device.

  The waveform shaping circuit 120 is an example of a signal generating device that shapes a waveform of a signal output from the insulating device (insulating circuit 110) into a rectangular wave to generate a rectangular wave signal (output signal 102).

  The insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, termination resistors 113 and 114, a primary side ground 115, and a secondary side ground 116. Is provided.

  Although not shown, the primary side circuit 131, the secondary side circuit 132, and the termination resistors 113 and 114 are mounted on one printed circuit board. The primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the printed circuit board.

  The primary side circuit 131 and the secondary side circuit 132 are insulated from each other. That is, the primary side circuit 131 and the secondary side circuit 132 are electrically separated.

  The primary-side signal line pattern 111 and the secondary-side signal line pattern 112 run in parallel with a certain distance from each other.

  The primary side ground 115 and the secondary side ground 116 are insulated from each other. That is, the primary side ground 115 and the secondary side ground 116 are electrically separated. The primary side ground 115 is connected to the output side of the primary side signal line pattern 111 via a termination resistor 113. The secondary side ground 116 is connected to the input side of the secondary side signal line pattern 112 via a termination resistor 114.

  A rectangular wave signal (hereinafter referred to as an alternating current (AC) signal) for transmitting a digital signal is input to the primary side circuit 131. When a signal is input from the primary side circuit 131 to the primary side signal line pattern 111, a current generated in the primary side signal line pattern 111 is induced in the secondary side signal line pattern 112 that runs in parallel within the pattern width. A current is generated, and a voltage is generated at the terminating resistor 114 on the secondary side. With this voltage, the waveform shaping circuit 120 generates a rectangular wave signal.

  As described above, in the present embodiment, the insulation circuit 110 inputs an AC signal to the primary circuit 131 as a signal (input signal 101). The insulating circuit 110 transmits the signal input to the primary side circuit 131 from the primary side signal line pattern 111 to the secondary side signal line pattern 112 by electromagnetic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).

  According to the present embodiment, it is possible to transmit a signal in a non-contact manner from the primary side circuit 131 to the secondary side circuit 132 on the printed circuit board without using a dedicated passive component such as a transformer, an isolator, or a photocoupler. it can. Therefore, it is possible to reduce the cost and size of the device.

  FIG. 2 is a graph showing the relationship of the transmission voltage with respect to the pattern length and pattern interval of the primary side signal line pattern 111 and the secondary side signal line pattern 112.

  In FIG. 2, the pattern lengths a, b, and c are examples of distances in which the primary side signal line pattern 111 and the secondary side signal line pattern 112 travel in parallel. Here, a <b <c. The pattern interval D is a distance between the primary signal line pattern 111 and the secondary signal line pattern 112. The transmission voltage V is a voltage applied from the primary signal line pattern 111 to the secondary signal line pattern 112 by electromagnetic induction.

  FIG. 2 shows the relationship of the transmission voltage V with respect to the pattern interval D for each of the pattern lengths a, b, and c. As can be seen from this figure, it is possible to increase the transmission voltage by increasing the parallel pattern length and narrowing the pattern interval. Based on this relationship, the primary side signal line pattern 111 and the secondary side signal line pattern What is necessary is just to determine the structure with 112 suitably.

  FIG. 3 is a diagram illustrating examples of waveforms of the primary side signal 151 and the secondary side signal 152 of the isolation circuit 110.

  In FIG. 3, the positive peak voltage 153 of the secondary signal 152 generated at the rising timing of the primary signal 151 exceeds the positive threshold 155. Thereafter, the negative peak voltage 154 of the secondary signal 152 generated at the falling timing of the primary signal 151 falls below the negative threshold 156. This is repeated.

  FIG. 4 is a diagram illustrating the operation of the waveform shaping circuit 120.

  In FIG. 4, when the voltage of the secondary side signal 152 exceeds the positive side threshold value 155, the waveform shaping circuit 120 detects this as a rising edge and determines that the logic of the output signal 102 is positive. To maintain. When the voltage of the secondary signal 152 falls below the negative threshold 156, the waveform shaping circuit 120 detects this as a falling edge, determines that the logic of the output signal 102 is zero, and maintains this thereafter. .

  The waveform shaping circuit 120 can be mounted by a circuit using an operational amplifier, for example. Alternatively, the waveform shaping circuit 120 can be implemented using an ADC (analog / digital converter) such as a microcomputer and a DSP (digital signal processing unit).

  In the present embodiment, the primary-side signal line pattern 111, the secondary-side signal line pattern 112, the primary-side ground 115, and the secondary-side ground 116 are formed on the same layer of the above-described one printed board. As a result, the insulating circuit 110 can be formed on a printed circuit board having a small number of layers without using passive components such as transformers, isolators, and photocouplers, thereby reducing the cost and downsizing of the device. .

  The primary-side signal line pattern 111, the secondary-side signal line pattern 112, the primary-side ground 115, and the secondary-side ground 116 may be formed by being divided into a plurality of layers of the aforementioned one printed circuit board (each layer). May be formed separately). In that case, the insulating circuit 110 can be formed on a printed circuit board having a large number of layers without using passive components for insulation such as transformers, isolators, and photocouplers in a small area, thereby reducing the cost and downsizing of the device. It becomes possible.

  Further, a part of the primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the same layer of the printed circuit board, and the others are separately formed on the printed circuit board. It may be formed in a layer.

Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 5 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.

  In FIG. 5, the insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, a primary side ground 115, and a secondary side ground 116. .

  Although not shown, the primary side circuit 131 and the secondary side circuit 132 are mounted on one printed circuit board. The primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the printed circuit board. The primary side ground 115 and the secondary side ground 116 are formed as, for example, a solid pattern.

  The primary side circuit 131 and the secondary side circuit 132 are insulated from each other. That is, the primary side circuit 131 and the secondary side circuit 132 are electrically separated.

  The primary-side signal line pattern 111 and the secondary-side signal line pattern 112 run in parallel with a certain distance from each other.

  The primary side ground 115 and the secondary side ground 116 are insulated from each other. That is, the primary side ground 115 and the secondary side ground 116 are electrically separated. The primary side ground 115 is electrically connected to the primary side signal line pattern 111. The secondary side ground 116 is electrically connected to the secondary side signal line pattern 112.

  In the present embodiment, the primary side signal line pattern 111, the secondary side signal line pattern 112, the secondary side ground 116, and the primary side ground 115 are arranged in this order. The distance D1 between the primary side signal line pattern 111 and the secondary side signal line pattern 112 is shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. The distance D3 between the secondary side ground 116 and the primary side ground 115 is also shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. That is, D1 <D2 and D3 <D2.

  A low cycle digital signal or a direct current (DC) signal (hereinafter referred to as a direct current signal) is input to the primary circuit 131. When a signal is input from the primary side circuit 131 to the primary side signal line pattern 111, the voltage generated between the primary side signal line pattern 111 and the primary side ground 115 generates an electric field between them, and 2 A voltage is generated in the secondary signal line pattern 112 and the secondary ground 116. At this time, the voltages generated in the secondary signal line pattern 112 and the secondary ground 116 are determined by the relative positions of the primary signal line pattern 111 and the primary ground 115. Therefore, in order to make the potentials of the primary side signal line pattern 111 and the secondary side signal line pattern 112 equal, they are close to each other, and in order to make the potentials of the primary side ground 115 and the secondary side ground 116 equal, they are close to each other. Let

  As described above, in the present embodiment, the insulation circuit 110 inputs a DC signal to the primary circuit 131 as a signal (input signal 101). The insulating circuit 110 transmits the signal input to the primary side circuit 131 from the primary side signal line pattern 111 to the secondary side signal line pattern 112 by electrostatic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).

  According to the present embodiment, in the same manner as in the first embodiment, a signal is transmitted from the primary side circuit 131 to the secondary side circuit 132 in a non-contact manner without using dedicated passive components such as transformers, isolators, and photocouplers. Can be transmitted. Therefore, it is possible to reduce the cost and size of the device.

Embodiment 3 FIG.
In the present embodiment, the functions of the first and second embodiments can be realized by a single circuit.

  FIG. 6 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.

  In FIG. 6, an insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, termination resistors 113 and 114, a primary side ground 115, 2 A secondary ground 116 is provided.

  As in the first embodiment, the primary side ground 115 is connected to the output side of the primary side signal line pattern 111 via the termination resistor 113. The secondary side ground 116 is connected to the input side of the secondary side signal line pattern 112 via a termination resistor 114.

  Similarly to the second embodiment, the primary side signal line pattern 111, the secondary side signal line pattern 112, the secondary side ground 116, and the primary side ground 115 are arranged in this order. The distance D1 between the primary side signal line pattern 111 and the secondary side signal line pattern 112 is shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. The distance D3 between the secondary side ground 116 and the primary side ground 115 is also shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. That is, D1 <D2 and D3 <D2.

  As described above, in the present embodiment, the insulating circuit 110 can input both an AC signal and a DC signal to the primary circuit 131 as a signal (input signal 101). If the signal input to the primary circuit 131 is an AC signal, the insulation circuit 110 transmits this signal from the primary signal line pattern 111 to the secondary signal line pattern 112 by electromagnetic induction. If the signal input to the primary circuit 131 is a DC signal, the insulation circuit 110 transmits this signal from the primary signal line pattern 111 to the secondary signal line pattern 112 by electrostatic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).

  In the present embodiment, the same effect as in the first and second embodiments can be obtained.

Embodiment 4 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 7 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.

  In FIG. 7, the insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, and a primary side ground 115, as in the first embodiment. In addition to the secondary side ground 116, a noise countermeasure circuit 117 is provided.

  The noise countermeasure circuit 117 is an example of a noise removal circuit that removes noise of a signal (input signal 101) input to the primary side circuit 131. The noise countermeasure circuit 117 includes a noise return element such as a capacitor and a varistor, for example. Note that the noise countermeasure circuit 117 forms a filter that does not attenuate the primary side signal 151 and the secondary side signal 152.

  According to the present embodiment, unnecessary noise can be reduced.

  As mentioned above, although embodiment of this invention was described, you may implement in combination of 2 or more among these embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, this invention is not limited to these embodiment, A various change is possible as needed.

  100 Electrical / Electronic Equipment, 101 Input Signal, 102 Output Signal, 103, 110 Isolation Circuit, 111 Primary Signal Line Pattern, 112 Secondary Signal Line Pattern, 113 Termination Resistor, 115 Primary Ground, 116 Secondary Side Ground, 117 Noise countermeasure circuit, 120 Waveform shaping circuit, 131 Primary side circuit, 132 Secondary side circuit, 151 Primary side signal, 152 Secondary side signal, 153 Positive side peak voltage, 154 Negative side peak voltage, 155 Positive Side threshold, 156 negative threshold.

Claims (6)

An insulating device that insulates an input side and an output side of the signal when an externally input signal is output to a device that shapes the waveform of the signal into a rectangular wave,
A primary circuit and a secondary circuit mounted on one printed circuit board and insulated from each other;
A primary-side signal line pattern and a secondary-side signal line pattern formed on the printed circuit board and running parallel to each other at a predetermined interval ;
A primary side ground and a secondary side ground formed on the printed circuit board and insulated from each other ;
The primary side signal line pattern, the secondary side signal line pattern, the secondary side ground, and the primary side ground are arranged in order,
The primary side ground is connected to the output side of the primary side signal line pattern via a resistor,
The secondary side ground is connected to the input side of the secondary side signal line pattern via a resistor,
The signal is input to the primary side circuit, and the signal is input from the primary side signal line pattern by electrostatic induction if the signal is a DC signal and from the primary side signal line pattern by electromagnetic induction if the signal is an AC signal. An insulating device that transmits to a secondary signal line pattern and outputs the signal from the secondary circuit. The distance between the primary side signal line pattern and the secondary side signal line pattern, and the distance between the secondary side ground and the primary side ground are the secondary side signal line pattern and the secondary side. The insulating device according to claim 1 , wherein the insulating device is shorter than a distance to the side ground. The primary signal line patterns, the secondary-side signal line pattern, the primary side ground, the secondary side ground, according to claim 1 or 2, characterized in that it is formed in the same layer of the printed circuit board Insulation equipment. The primary signal line patterns, the secondary-side signal line pattern, the primary side ground, the secondary side ground, according to claim 1, characterized in that it is formed in a plurality layers of the printed circuit board or 2. Insulation device.   The insulation apparatus according to claim 1, further comprising a noise removal circuit that removes noise of the signal input to the primary side circuit. An insulating device according to any one of claims 1 to 5 ;
An apparatus comprising: a signal generation device configured to shape a waveform of the signal output from the insulating device into a rectangular wave to generate a rectangular wave signal.