JP6218498B2 - Insulation equipment and equipment - Google Patents
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Description
本発明は、絶縁装置及び機器に関するものである。 The present invention relates to an insulating device and a device.
外部回路から内部回路へ信号を伝送する電気・電子機器では、外界からの雑音を機器に侵入させないために、外部回路と内部回路とがトランス、アイソレータ、フォトカプラ等を用いて分離される。トランス、アイソレータにおいては電磁誘導、フォトカプラにおいては半導体の光導電効果が利用される。 In an electric / electronic device that transmits a signal from an external circuit to an internal circuit, the external circuit and the internal circuit are separated using a transformer, an isolator, a photocoupler, or the like in order to prevent noise from the outside from entering the device. Transformers and isolators use electromagnetic induction, and photocouplers use semiconductor photoconductive effects.
近年の電気・電子回路の安価かつ小型回路の実現のためには、上記のような高価かつ大型の絶縁専用受動部品を可能な限り使用しないことが望まれる。 In order to realize an inexpensive and small circuit of an electric / electronic circuit in recent years, it is desired that the above-described expensive and large-sized passive component for insulation is not used as much as possible.
従来、コイルパタンが形成された絶縁基板を有する複合積層板を用いた平面型電磁誘導電器がある（例えば、特許文献１参照）。 Conventionally, there is a planar electromagnetic induction device using a composite laminate having an insulating substrate on which a coil pattern is formed (see, for example, Patent Document 1).
特許文献１に記載の平面型電磁誘導電器は、前述したような電気・電子機器として使用することができない。 The planar electromagnetic induction device described in Patent Document 1 cannot be used as an electric / electronic device as described above.
本発明は、例えば、トランス、アイソレータ、フォトカプラ等の絶縁専用受動部品を用いずに、プリント基板上において外部回路から内部回路へ非接触で信号を伝送することを目的とする。 An object of the present invention is to transmit a signal in a non-contact manner from an external circuit to an internal circuit on a printed circuit board without using, for example, passive components such as a transformer, an isolator, and a photocoupler.
本発明の一の態様に係る絶縁装置は、
外部から入力される信号を、前記信号の波形を矩形波に整形する装置へ出力する際に、前記信号の入力側と出力側とを絶縁する絶縁装置であって、
前記信号を入力する１次側回路と、
前記信号を出力する２次側回路と、
前記１次側回路と前記２次側回路とが互いに絶縁されるように実装されるとともに、前記１次側回路に接続された１次側信号線パタンと、前記２次側回路に接続された２次側信号線パタンとが互いに一定の間隔を空けて並走するように形成され、前記信号を誘導により前記１次側信号線パタンから前記２次側信号線パタンへ伝送するプリント基板とを備える。
An insulating device according to one aspect of the present invention includes:
An insulating device that insulates an input side and an output side of the signal when an externally input signal is output to a device that shapes the waveform of the signal into a rectangular wave,
A primary side circuit for inputting the signal;
A secondary circuit for outputting the signal;
The primary side circuit and the secondary side circuit are mounted so as to be insulated from each other, and are connected to the primary side signal line pattern connected to the primary side circuit and the secondary side circuit. A printed circuit board that is formed so that the secondary signal line patterns run parallel to each other at a predetermined interval and that transmits the signal from the primary signal line pattern to the secondary signal line pattern by induction. Prepare.
本発明の一の態様によれば、絶縁装置のプリント基板に、信号の入力側に接続された１次側信号線パタンと、信号の出力側に接続された２次側信号線パタンとが互いに一定の間隔を空けて並走するように形成され、この１次側信号線パタン及び２次側信号線パタンにより非接触で信号を伝送することが可能となる。 According to one aspect of the present invention, the primary side signal line pattern connected to the signal input side and the secondary side signal line pattern connected to the signal output side are mutually connected to the printed circuit board of the insulating device. It is formed so as to run in parallel with a constant interval, and signals can be transmitted in a non-contact manner by the primary side signal line pattern and the secondary side signal line pattern.
以下、本発明の実施の形態について、図を用いて説明する。なお、各実施の形態の説明において、「上」、「下」、「左」、「右」、「前」、「後」、「表」、「裏」といった方向は、説明の便宜上、そのように記しているだけであって、装置、器具、部品等の配置や向き等を限定するものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of each embodiment, the directions such as “up”, “down”, “left”, “right”, “front”, “back”, “front”, “back” are However, it is not intended to limit the arrangement or orientation of devices, instruments, parts, or the like.
実施の形態１．
図１は、本実施の形態に係る電気・電子機器１００の構成を示す図である。
Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration of an electric / electronic device 100 according to the present embodiment.
図１において、電気・電子機器１００は、絶縁回路１１０と波形整形回路１２０とを備える。 In FIG. 1, the electric / electronic device 100 includes an insulation circuit 110 and a waveform shaping circuit 120.
絶縁回路１１０は、外部から入力される信号（入力信号１０１）を、信号の波形を矩形波に整形する装置（波形整形回路１２０）へ出力する際に、信号の入力側と出力側とを絶縁する絶縁装置の例である。 The insulation circuit 110 insulates the input side and the output side of a signal when outputting an externally input signal (input signal 101) to a device (waveform shaping circuit 120) that shapes the waveform of the signal into a rectangular wave. This is an example of an insulating device.
波形整形回路１２０は、絶縁装置（絶縁回路１１０）から出力される信号の波形を矩形波に整形して矩形波信号（出力信号１０２）を生成する信号生成装置の例である。 The waveform shaping circuit 120 is an example of a signal generating device that shapes a waveform of a signal output from the insulating device (insulating circuit 110) into a rectangular wave to generate a rectangular wave signal (output signal 102).
絶縁回路１１０は、１次側回路１３１、２次側回路１３２、１次側信号線パタン１１１、２次側信号線パタン１１２、終端抵抗１１３，１１４、１次側グランド１１５、２次側グランド１１６を備える。 The insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, termination resistors 113 and 114, a primary side ground 115, and a secondary side ground 116. Is provided.
図示していないが、１次側回路１３１、２次側回路１３２、終端抵抗１１３，１１４は、１つのプリント基板に実装される。１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６は、そのプリント基板に形成される。 Although not shown, the primary side circuit 131, the secondary side circuit 132, and the termination resistors 113 and 114 are mounted on one printed circuit board. The primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the printed circuit board.
１次側回路１３１及び２次側回路１３２は、互いに絶縁される。即ち、１次側回路１３１及び２次側回路１３２は、電気的に分離される。 The primary side circuit 131 and the secondary side circuit 132 are insulated from each other. That is, the primary side circuit 131 and the secondary side circuit 132 are electrically separated.
１次側信号線パタン１１１及び２次側信号線パタン１１２は、互いに一定の間隔を空けて並走する。 The primary-side signal line pattern 111 and the secondary-side signal line pattern 112 run in parallel with a certain distance from each other.
１次側グランド１１５及び２次側グランド１１６は、互いに絶縁される。即ち、１次側グランド１１５及び２次側グランド１１６は、電気的に分離される。１次側グランド１１５は、１次側信号線パタン１１１の出力側に終端抵抗１１３を介して接続される。２次側グランド１１６は、２次側信号線パタン１１２の入力側に終端抵抗１１４を介して接続される。 The primary side ground 115 and the secondary side ground 116 are insulated from each other. That is, the primary side ground 115 and the secondary side ground 116 are electrically separated. The primary side ground 115 is connected to the output side of the primary side signal line pattern 111 via a termination resistor 113. The secondary side ground 116 is connected to the input side of the secondary side signal line pattern 112 via a termination resistor 114.
１次側回路１３１にはデジタル信号を伝送するための矩形波信号（以降、交流（ＡＣ）信号）が入力される。１次側回路１３１より１次側信号線パタン１１１に信号が入力されると、１次側信号線パタン１１１に生じる電流は、そのパタン幅以下で並走する２次側信号線パタン１１２に誘導電流を発生させ、２次側の終端抵抗１１４に電圧を発生させる。この電圧により波形整形回路１２０は矩形波信号を生成する。 A rectangular wave signal (hereinafter referred to as an alternating current (AC) signal) for transmitting a digital signal is input to the primary side circuit 131. When a signal is input from the primary side circuit 131 to the primary side signal line pattern 111, a current generated in the primary side signal line pattern 111 is induced in the secondary side signal line pattern 112 that runs in parallel within the pattern width. A current is generated, and a voltage is generated at the terminating resistor 114 on the secondary side. With this voltage, the waveform shaping circuit 120 generates a rectangular wave signal.
上記のように、本実施の形態において、絶縁回路１１０は、信号（入力信号１０１）として交流信号を１次側回路１３１に入力する。絶縁回路１１０は、１次側回路１３１に入力した信号を電磁誘導により１次側信号線パタン１１１から２次側信号線パタン１１２へ伝送する。絶縁回路１１０は、２次側信号線パタン１１２へ伝送した信号を２次側回路１３２から波形整形回路１２０に対して出力する。波形整形回路１２０は、２次側回路１３２から出力された信号の波形を矩形波に整形して矩形波信号（出力信号１０２）を生成する。 As described above, in the present embodiment, the insulation circuit 110 inputs an AC signal to the primary circuit 131 as a signal (input signal 101). The insulating circuit 110 transmits the signal input to the primary side circuit 131 from the primary side signal line pattern 111 to the secondary side signal line pattern 112 by electromagnetic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).
本実施の形態によれば、トランス、アイソレータ、フォトカプラ等の絶縁専用受動部品を用いずに、プリント基板上において１次側回路１３１から２次側回路１３２へ非接触で信号を伝送することができる。そのため、機器のコスト低減、小型化等が可能となる。 According to the present embodiment, it is possible to transmit a signal in a non-contact manner from the primary side circuit 131 to the secondary side circuit 132 on the printed circuit board without using a dedicated passive component such as a transformer, an isolator, or a photocoupler. it can. Therefore, it is possible to reduce the cost and size of the device.
図２は、１次側信号線パタン１１１及び２次側信号線パタン１１２のパタン長とパタン間隔とに対する伝送電圧の関係を示すグラフである。 FIG. 2 is a graph showing the relationship of the transmission voltage with respect to the pattern length and pattern interval of the primary side signal line pattern 111 and the secondary side signal line pattern 112.
図２において、パタン長ａ，ｂ，ｃは、いずれも１次側信号線パタン１１１及び２次側信号線パタン１１２が並走する距離の例である。ここでは、ａ＜ｂ＜ｃとする。パタン間隔Ｄは、１次側信号線パタン１１１及び２次側信号線パタン１１２の間の距離である。伝送電圧Ｖは、電磁誘導により１次側信号線パタン１１１から２次側信号線パタン１１２へ印加される電圧である。 In FIG. 2, the pattern lengths a, b, and c are examples of distances in which the primary side signal line pattern 111 and the secondary side signal line pattern 112 travel in parallel. Here, a <b <c. The pattern interval D is a distance between the primary signal line pattern 111 and the secondary signal line pattern 112. The transmission voltage V is a voltage applied from the primary signal line pattern 111 to the secondary signal line pattern 112 by electromagnetic induction.
図２では、パタン長ａ，ｂ，ｃのそれぞれについて、パタン間隔Ｄに対する伝送電圧Ｖの関係を示している。この図から分かるように、並走パタン長を長くし、パタン間隔を狭めることで伝送電圧を高めることが可能であり、この関係に基づいて１次側信号線パタン１１１と２次側信号線パタン１１２との構成を適宜決定すればよい。 FIG. 2 shows the relationship of the transmission voltage V with respect to the pattern interval D for each of the pattern lengths a, b, and c. As can be seen from this figure, it is possible to increase the transmission voltage by increasing the parallel pattern length and narrowing the pattern interval. Based on this relationship, the primary side signal line pattern 111 and the secondary side signal line pattern What is necessary is just to determine the structure with 112 suitably.
図３は、絶縁回路１１０の１次側信号１５１及び２次側信号１５２の波形の例を示す図である。 FIG. 3 is a diagram illustrating examples of waveforms of the primary side signal 151 and the secondary side signal 152 of the isolation circuit 110.
図３において、１次側信号１５１の立ち上がりのタイミングで生じる２次側信号１５２の正側ピーク電圧１５３は、正側閾値１５５を上回る。その後、１次側信号１５１の立ち下がりのタイミングで生じる２次側信号１５２の負側ピーク電圧１５４は、負側閾値１５６を下回る。これが繰り返される。 In FIG. 3, the positive peak voltage 153 of the secondary signal 152 generated at the rising timing of the primary signal 151 exceeds the positive threshold 155. Thereafter, the negative peak voltage 154 of the secondary signal 152 generated at the falling timing of the primary signal 151 falls below the negative threshold 156. This is repeated.
図４は、波形整形回路１２０の動作を示す図である。 FIG. 4 is a diagram illustrating the operation of the waveform shaping circuit 120.
図４において、波形整形回路１２０は、２次側信号１５２の電圧が正側閾値１５５を上回ると、これを立ち上がりとして検知し、出力信号１０２の論理を正とすることを判断し、以降、これを維持する。波形整形回路１２０は、２次側信号１５２の電圧が負側閾値１５６を下回ると、これを立ち下がりとして検知し、出力信号１０２の論理をゼロとすることを判断し、以降、これを維持する。 In FIG. 4, when the voltage of the secondary side signal 152 exceeds the positive side threshold value 155, the waveform shaping circuit 120 detects this as a rising edge and determines that the logic of the output signal 102 is positive. To maintain. When the voltage of the secondary signal 152 falls below the negative threshold 156, the waveform shaping circuit 120 detects this as a falling edge, determines that the logic of the output signal 102 is zero, and maintains this thereafter. .
波形整形回路１２０は、例えばオペアンプ等を用いた回路によって実装することが可能である。あるいは、波形整形回路１２０は、マイクロコンピュータ等のＡＤＣ（アナログ／デジタルコンバータ）とＤＳＰ（デジタル信号処理部）とを用いて実装することも可能である。 The waveform shaping circuit 120 can be mounted by a circuit using an operational amplifier, for example. Alternatively, the waveform shaping circuit 120 can be implemented using an ADC (analog / digital converter) such as a microcomputer and a DSP (digital signal processing unit).
本実施の形態において、１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６は、前述した１つのプリント基板の同一層に形成される。これにより、層数の少ないプリント基板上で、トランス、アイソレータ、フォトカプラ等の絶縁専用受動部品を用いずに絶縁回路１１０を形成することができ、機器のコスト低減、小型化等が可能となる。 In the present embodiment, the primary-side signal line pattern 111, the secondary-side signal line pattern 112, the primary-side ground 115, and the secondary-side ground 116 are formed on the same layer of the above-described one printed board. As a result, the insulating circuit 110 can be formed on a printed circuit board having a small number of layers without using passive components such as transformers, isolators, and photocouplers, thereby reducing the cost and downsizing of the device. .
なお、１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６は、前述した１つのプリント基板の複数層に分けて形成されてもよい（各層に別々に形成されてもよい）。その場合、層数の多いプリント基板上で、小面積でトランス、アイソレータ、フォトカプラ等の絶縁専用受動部品を用いずに絶縁回路１１０を形成することができ、機器のコスト低減、小型化等が可能となる。 The primary-side signal line pattern 111, the secondary-side signal line pattern 112, the primary-side ground 115, and the secondary-side ground 116 may be formed by being divided into a plurality of layers of the aforementioned one printed circuit board (each layer). May be formed separately). In that case, the insulating circuit 110 can be formed on a printed circuit board having a large number of layers without using passive components for insulation such as transformers, isolators, and photocouplers in a small area, thereby reducing the cost and downsizing of the device. It becomes possible.
また、１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６のうち、一部がプリント基板の同一層に形成され、その他がプリント基板の別々の層に形成されてもよい。 Further, a part of the primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the same layer of the printed circuit board, and the others are separately formed on the printed circuit board. It may be formed in a layer.
実施の形態２．
本実施の形態について、主に実施の形態１との差異を説明する。
Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.
図５は、本実施の形態に係る絶縁回路１１０の構成を示す図である。 FIG. 5 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.
図５において、絶縁回路１１０は、１次側回路１３１、２次側回路１３２、１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６を備える。 In FIG. 5, the insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, a primary side ground 115, and a secondary side ground 116. .
図示していないが、１次側回路１３１、２次側回路１３２は、１つのプリント基板に実装される。１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６は、そのプリント基板に形成される。１次側グランド１１５及び２次側グランド１１６は、例えばベタパタンとして形成される。 Although not shown, the primary side circuit 131 and the secondary side circuit 132 are mounted on one printed circuit board. The primary side signal line pattern 111, the secondary side signal line pattern 112, the primary side ground 115, and the secondary side ground 116 are formed on the printed circuit board. The primary side ground 115 and the secondary side ground 116 are formed as, for example, a solid pattern.
１次側回路１３１及び２次側回路１３２は、互いに絶縁される。即ち、１次側回路１３１及び２次側回路１３２は、電気的に分離される。 The primary side circuit 131 and the secondary side circuit 132 are insulated from each other. That is, the primary side circuit 131 and the secondary side circuit 132 are electrically separated.
１次側信号線パタン１１１及び２次側信号線パタン１１２は、互いに一定の間隔を空けて並走する。 The primary-side signal line pattern 111 and the secondary-side signal line pattern 112 run in parallel with a certain distance from each other.
１次側グランド１１５及び２次側グランド１１６は、互いに絶縁される。即ち、１次側グランド１１５及び２次側グランド１１６は、電気的に分離される。１次側グランド１１５は、１次側信号線パタン１１１に電気的に接続される。２次側グランド１１６は、２次側信号線パタン１１２に電気的に接続される。 The primary side ground 115 and the secondary side ground 116 are insulated from each other. That is, the primary side ground 115 and the secondary side ground 116 are electrically separated. The primary side ground 115 is electrically connected to the primary side signal line pattern 111. The secondary side ground 116 is electrically connected to the secondary side signal line pattern 112.
本実施の形態では、１次側信号線パタン１１１、２次側信号線パタン１１２、２次側グランド１１６、１次側グランド１１５が、この順番に配置される。１次側信号線パタン１１１と２次側信号線パタン１１２との間の距離Ｄ１は、２次側信号線パタン１１２と２次側グランド１１６との間の距離Ｄ２よりも短い。また、２次側グランド１１６と１次側グランド１１５との間の距離Ｄ３も、２次側信号線パタン１１２と２次側グランド１１６との間の距離Ｄ２よりも短い。即ち、Ｄ１＜Ｄ２、Ｄ３＜Ｄ２である。 In the present embodiment, the primary side signal line pattern 111, the secondary side signal line pattern 112, the secondary side ground 116, and the primary side ground 115 are arranged in this order. The distance D1 between the primary side signal line pattern 111 and the secondary side signal line pattern 112 is shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. The distance D3 between the secondary side ground 116 and the primary side ground 115 is also shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. That is, D1 <D2 and D3 <D2.
１次側回路１３１には低サイクルのデジタル信号又は直流（ＤＣ）信号（以降、直流信号）が入力される。１次側回路１３１より１次側信号線パタン１１１に信号が入力されると、１次側信号線パタン１１１と１次側グランド１１５との間に生じる電圧は、この間に電界を発生させ、２次側信号線パタン１１２及び２次側グランド１１６に電圧を発生させる。このとき、２次側信号線パタン１１２及び２次側グランド１１６に発生する電圧は、１次側信号線パタン１１１と１次側グランド１１５との相対位置によって決まる。したがって、１次側信号線パタン１１１と２次側信号線パタン１１２の電位を等しくするため、これらを近接させ、１次側グランド１１５と２次側グランド１１６の電位を等しくするため、これらを近接させる。 A low cycle digital signal or a direct current (DC) signal (hereinafter referred to as a direct current signal) is input to the primary circuit 131. When a signal is input from the primary side circuit 131 to the primary side signal line pattern 111, the voltage generated between the primary side signal line pattern 111 and the primary side ground 115 generates an electric field between them, and 2 A voltage is generated in the secondary signal line pattern 112 and the secondary ground 116. At this time, the voltages generated in the secondary signal line pattern 112 and the secondary ground 116 are determined by the relative positions of the primary signal line pattern 111 and the primary ground 115. Therefore, in order to make the potentials of the primary side signal line pattern 111 and the secondary side signal line pattern 112 equal, they are close to each other, and in order to make the potentials of the primary side ground 115 and the secondary side ground 116 equal, they are close to each other. Let
上記のように、本実施の形態において、絶縁回路１１０は、信号（入力信号１０１）として直流信号を１次側回路１３１に入力する。絶縁回路１１０は、１次側回路１３１に入力した信号を静電誘導により１次側信号線パタン１１１から２次側信号線パタン１１２へ伝送する。絶縁回路１１０は、２次側信号線パタン１１２へ伝送した信号を２次側回路１３２から波形整形回路１２０に対して出力する。波形整形回路１２０は、２次側回路１３２から出力された信号の波形を矩形波に整形して矩形波信号（出力信号１０２）を生成する。 As described above, in the present embodiment, the insulation circuit 110 inputs a DC signal to the primary circuit 131 as a signal (input signal 101). The insulating circuit 110 transmits the signal input to the primary side circuit 131 from the primary side signal line pattern 111 to the secondary side signal line pattern 112 by electrostatic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).
本実施の形態によれば、実施の形態１と同様に、トランス、アイソレータ、フォトカプラ等の絶縁専用受動部品を用いずに、１次側回路１３１から２次側回路１３２へ非接触で信号を伝送することができる。そのため、機器のコスト低減、小型化等が可能となる。 According to the present embodiment, in the same manner as in the first embodiment, a signal is transmitted from the primary side circuit 131 to the secondary side circuit 132 in a non-contact manner without using dedicated passive components such as transformers, isolators, and photocouplers. Can be transmitted. Therefore, it is possible to reduce the cost and size of the device.
実施の形態３．
本実施の形態は、実施の形態１及び２の機能を１つの回路で実現できるようにしたものである。
Embodiment 3 FIG.
In the present embodiment, the functions of the first and second embodiments can be realized by a single circuit.
図６は、本実施の形態に係る絶縁回路１１０の構成を示す図である。 FIG. 6 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.
図６において、絶縁回路１１０は、１次側回路１３１、２次側回路１３２、１次側信号線パタン１１１、２次側信号線パタン１１２、終端抵抗１１３，１１４、１次側グランド１１５、２次側グランド１１６を備える。 In FIG. 6, an insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, termination resistors 113 and 114, a primary side ground 115, 2 A secondary ground 116 is provided.
実施の形態１と同様に、１次側グランド１１５は、１次側信号線パタン１１１の出力側に終端抵抗１１３を介して接続される。２次側グランド１１６は、２次側信号線パタン１１２の入力側に終端抵抗１１４を介して接続される。 As in the first embodiment, the primary side ground 115 is connected to the output side of the primary side signal line pattern 111 via the termination resistor 113. The secondary side ground 116 is connected to the input side of the secondary side signal line pattern 112 via a termination resistor 114.
また、実施の形態２と同様に、１次側信号線パタン１１１、２次側信号線パタン１１２、２次側グランド１１６、１次側グランド１１５が、この順番に配置される。１次側信号線パタン１１１と２次側信号線パタン１１２との間の距離Ｄ１は、２次側信号線パタン１１２と２次側グランド１１６との間の距離Ｄ２よりも短い。また、２次側グランド１１６と１次側グランド１１５との間の距離Ｄ３も、２次側信号線パタン１１２と２次側グランド１１６との間の距離Ｄ２よりも短い。即ち、Ｄ１＜Ｄ２、Ｄ３＜Ｄ２である。 Similarly to the second embodiment, the primary side signal line pattern 111, the secondary side signal line pattern 112, the secondary side ground 116, and the primary side ground 115 are arranged in this order. The distance D1 between the primary side signal line pattern 111 and the secondary side signal line pattern 112 is shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. The distance D3 between the secondary side ground 116 and the primary side ground 115 is also shorter than the distance D2 between the secondary side signal line pattern 112 and the secondary side ground 116. That is, D1 <D2 and D3 <D2.
上記のように、本実施の形態において、絶縁回路１１０は、信号（入力信号１０１）として交流信号と直流信号との両方を１次側回路１３１に入力することができる。絶縁回路１１０は、１次側回路１３１に入力した信号が交流信号であれば、この信号を電磁誘導により１次側信号線パタン１１１から２次側信号線パタン１１２へ伝送する。絶縁回路１１０は、１次側回路１３１に入力した信号が直流信号であれば、この信号を静電誘導により１次側信号線パタン１１１から２次側信号線パタン１１２へ伝送する。絶縁回路１１０は、２次側信号線パタン１１２へ伝送した信号を２次側回路１３２から波形整形回路１２０に対して出力する。波形整形回路１２０は、２次側回路１３２から出力された信号の波形を矩形波に整形して矩形波信号（出力信号１０２）を生成する。 As described above, in the present embodiment, the insulating circuit 110 can input both an AC signal and a DC signal to the primary circuit 131 as a signal (input signal 101). If the signal input to the primary circuit 131 is an AC signal, the insulation circuit 110 transmits this signal from the primary signal line pattern 111 to the secondary signal line pattern 112 by electromagnetic induction. If the signal input to the primary circuit 131 is a DC signal, the insulation circuit 110 transmits this signal from the primary signal line pattern 111 to the secondary signal line pattern 112 by electrostatic induction. The insulating circuit 110 outputs the signal transmitted to the secondary signal line pattern 112 from the secondary circuit 132 to the waveform shaping circuit 120. The waveform shaping circuit 120 shapes the waveform of the signal output from the secondary side circuit 132 into a rectangular wave to generate a rectangular wave signal (output signal 102).
本実施の形態では、実施の形態１及び２と同様の効果が得られる。 In the present embodiment, the same effect as in the first and second embodiments can be obtained.
実施の形態４．
本実施の形態について、主に実施の形態１との差異を説明する。
Embodiment 4 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.
図７は、本実施の形態に係る絶縁回路１１０の構成を示す図である。 FIG. 7 is a diagram illustrating a configuration of the insulating circuit 110 according to the present embodiment.
図７において、絶縁回路１１０は、実施の形態１と同様に、１次側回路１３１、２次側回路１３２、１次側信号線パタン１１１、２次側信号線パタン１１２、１次側グランド１１５、２次側グランド１１６を備えるほか、ノイズ対策回路１１７を備える。 In FIG. 7, the insulating circuit 110 includes a primary side circuit 131, a secondary side circuit 132, a primary side signal line pattern 111, a secondary side signal line pattern 112, and a primary side ground 115, as in the first embodiment. In addition to the secondary side ground 116, a noise countermeasure circuit 117 is provided.
ノイズ対策回路１１７は、１次側回路１３１に入力される信号（入力信号１０１）のノイズを除去するノイズ除去回路の例である。ノイズ対策回路１１７は、例えば、コンデンサ、バリスタ等のノイズ還流素子を有する。なお、ノイズ対策回路１１７は、１次側信号１５１及び２次側信号１５２を減衰させないフィルタを形成するものとする。 The noise countermeasure circuit 117 is an example of a noise removal circuit that removes noise of a signal (input signal 101) input to the primary side circuit 131. The noise countermeasure circuit 117 includes a noise return element such as a capacitor and a varistor, for example. Note that the noise countermeasure circuit 117 forms a filter that does not attenuate the primary side signal 151 and the secondary side signal 152.
本実施の形態によれば、不要なノイズを低減することができる。 According to the present embodiment, unnecessary noise can be reduced.
以上、本発明の実施の形態について説明したが、これらの実施の形態のうち、２つ以上を組み合わせて実施しても構わない。あるいは、これらの実施の形態のうち、１つを部分的に実施しても構わない。あるいは、これらの実施の形態のうち、２つ以上を部分的に組み合わせて実施しても構わない。なお、本発明は、これらの実施の形態に限定されるものではなく、必要に応じて種々の変更が可能である。 As mentioned above, although embodiment of this invention was described, you may implement in combination of 2 or more among these embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, this invention is not limited to these embodiment, A various change is possible as needed.
１００ 電気・電子機器、１０１ 入力信号、１０２ 出力信号、１０３ 、１１０ 絶縁回路、１１１ １次側信号線パタン、１１２ ２次側信号線パタン、１１３ 終端抵抗、１１５ １次側グランド、１１６ ２次側グランド、１１７ ノイズ対策回路、１２０ 波形整形回路、１３１ １次側回路、１３２ ２次側回路、１５１ １次側信号、１５２ ２次側信号、１５３ 正側ピーク電圧、１５４ 負側ピーク電圧、１５５ 正側閾値、１５６ 負側閾値。 100 Electrical / Electronic Equipment, 101 Input Signal, 102 Output Signal, 103, 110 Isolation Circuit, 111 Primary Signal Line Pattern, 112 Secondary Signal Line Pattern, 113 Termination Resistor, 115 Primary Ground, 116 Secondary Side Ground, 117 Noise countermeasure circuit, 120 Waveform shaping circuit, 131 Primary side circuit, 132 Secondary side circuit, 151 Primary side signal, 152 Secondary side signal, 153 Positive side peak voltage, 154 Negative side peak voltage, 155 Positive Side threshold, 156 negative threshold.
Claims (6)
１つのプリント基板に実装され、互いに絶縁される１次側回路及び２次側回路と、
前記プリント基板に形成され、互いに一定の間隔を空けて並走する１次側信号線パタン及び２次側信号線パタンと、
前記プリント基板に形成され、互いに絶縁される１次側グランド及び２次側グランドと
を備え、
前記１次側信号線パタン、前記２次側信号線パタン、前記２次側グランド、前記１次側グランドが、順番に配置され、
前記１次側グランドが、前記１次側信号線パタンの出力側に抵抗を介して接続され、
前記２次側グランドが、前記２次側信号線パタンの入力側に抵抗を介して接続され、
前記信号を前記１次側回路に入力し、前記信号を、前記信号が直流信号であれば静電誘導により、前記信号が交流信号であれば電磁誘導により前記１次側信号線パタンから前記２次側信号線パタンへ伝送し、前記信号を前記２次側回路から出力することを特徴とする絶縁装置。 An insulating device that insulates an input side and an output side of the signal when an externally input signal is output to a device that shapes the waveform of the signal into a rectangular wave,
A primary circuit and a secondary circuit mounted on one printed circuit board and insulated from each other;
A primary-side signal line pattern and a secondary-side signal line pattern formed on the printed circuit board and running parallel to each other at a predetermined interval ;
A primary side ground and a secondary side ground formed on the printed circuit board and insulated from each other ;
The primary side signal line pattern, the secondary side signal line pattern, the secondary side ground, and the primary side ground are arranged in order,
The primary side ground is connected to the output side of the primary side signal line pattern via a resistor,
The secondary side ground is connected to the input side of the secondary side signal line pattern via a resistor,
The signal is input to the primary side circuit, and the signal is input from the primary side signal line pattern by electrostatic induction if the signal is a DC signal and from the primary side signal line pattern by electromagnetic induction if the signal is an AC signal. An insulating device that transmits to a secondary signal line pattern and outputs the signal from the secondary circuit.
前記絶縁装置から出力される前記信号の波形を矩形波に整形して矩形波信号を生成する信号生成装置と
を備えることを特徴とする機器。 An insulating device according to any one of claims 1 to 5 ;
An apparatus comprising: a signal generation device configured to shape a waveform of the signal output from the insulating device into a rectangular wave to generate a rectangular wave signal.
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