JP6217109B2 - Hermetic seal - Google Patents

Description

  The present invention relates to an airtight sealed body.

  A package for a hybrid IC (Integrated Circuit) uses a simple box-type cap, covers the component mounting except for the lead connection ride pattern portion on the ceramic wiring substrate with the cap, and the joint between the substrate and the cap is made of resin. The structure is hermetically sealed. However, the above-described package has a structure in which the degree of freedom of the area where the sealing resin can spread is very large. Therefore, the package after curing is affected by variations in the amount and viscosity of the sealing resin or the ambient temperature. There is a drawback that the shape of the stopping resin tends to be non-uniform.

  Various techniques related to such a background are known (see, for example, Patent Document 1).

  For example, Patent Document 1 describes a hybrid IC package having a wiring board, a box cap, and an airtight seal. More specifically, the wiring board can mount a mounting component and has an external lead. In addition, the external lead is disposed and attached to the peripheral part of the wiring board, and a rising part reaching the required height from the board mounting part through the space between the inner and outer walls of the hermetic sealing part is provided, and the tip part is hermetically sealed. It is provided so as to extend in the lateral direction of the wiring board beyond the part. Further, the box-type cap covers a mounting component mounted on the wiring board and isolates it from the outside air. The hermetic sealing portion is a bottomed resin filling space having an inner / outer double wall structure formed around the side wall of the box-type cap. The resin filling space includes a peripheral portion of the wiring board and an external portion. The lead board mounting portion is received, and the joint portion between the box-type cap and the wiring board is embedded in the resin. In this way, depending on the hybrid IC package, the range in which the sealing resin spreads is limited, and the resin sealing of the hollow package can be performed in a more stable state.

  In addition, a configuration in which an electronic component such as an IC element mounted and mounted in a hybrid IC is hermetically sealed with a metal cap is reduced or avoided, or mounted and mounted, for example, due to environmental changes such as humidity. The IC element is protected against mechanical action from the outside world, and always takes a required function.

  Various techniques relating to such a background are known (see, for example, Patent Document 2).

  For example, in Patent Document 2, a plurality of electronic components including IC elements are mounted and mounted on a predetermined surface of a ceramic wiring board, and the electronic components are hermetically sealed to the ceramic wiring board surface by a metal cap. A hermetically sealed hybrid IC is described. More specifically, this hermetically sealed hybrid IC is provided with deformation strength by making the top surface of the metal cap uneven. In this way, according to the hermetic sealing type hybrid IC, the strength against bending of the relatively weak top surface of the metal cap that hermetically seals the mounted and mounted electronic components is improved. Therefore, for example, deformation of the metal cap due to mechanical impact or the like is effectively prevented.

  As a method for connecting a semiconductor chip to a printed wiring board, a method using a semiconductor mounting substrate such as a pin grid array, a leadless chip carrier, a leaded chip carrier or the like is known.

  Various techniques related to such a background are known (see, for example, Patent Document 3).

  For example, Patent Document 3 discloses a semiconductor in which a recess is formed in a printed circuit board, a semiconductor chip is mounted in the recess, and then a first resin frame is attached to a position surrounding the bonding pad around the recess to inject a sealing resin. A mounting device is described. More specifically, in this semiconductor mounting apparatus, a second resin frame larger than the first resin frame is attached to the outside of the first resin frame, and the space between the first resin frame and the second resin frame is determined. A metal cap is mounted on the surface, and a water repellent resin is injected into the gap, or a water repellent resin is injected between the first resin frame and the second resin frame, and the metal cap is mounted in the water repellent resin. . Thus, depending on the semiconductor mounting device, the water repellent resin blocks the invasion of moisture from the resin surface and the interface between the resin and the substrate, so that impurity ions reach the semiconductor chip surface due to moisture. Therefore, the chip surface is not corroded and there is connection reliability.

  In addition, the chip of the semiconductor element is sealed in order to increase the mechanical strength so that the characteristics are not deteriorated after the electrodes are attached.

  Various techniques related to such a background are known (see, for example, Patent Document 4).

  For example, in Patent Document 4, at least one semiconductor chip is mounted on a substrate, the semiconductor chip is connected to a conductor pattern formed on the substrate, and the semiconductor chip is covered with a protective layer provided on the substrate. A hollow sealed package in which a hollow portion is formed between a protective layer and a semiconductor chip is described. More specifically, this hollow sealed package uses an insulating film and a resin as a protective layer. In this way, depending on the hollow sealed package, the production cost is not required, and a small and highly sealed seal is possible.

  Moreover, in a semiconductor device used in a relatively low frequency band of 1 GHz or less, it is easy to bond a semiconductor chip on a substrate with a conductive adhesive or the like and pot an epoxy resin around the semiconductor chip including a bonding wire. A sealing structure is used.

  Various techniques related to such a background are known (see, for example, Patent Document 5).

  For example, Patent Document 5 describes a method of manufacturing a semiconductor device having an inexpensive sealing structure with a small transmission loss in the millimeter wave band. More specifically, in this method of manufacturing a semiconductor device, a semiconductor chip is mounted on a substrate provided with a conductor pattern, and a cap is placed on the substrate after electrically connecting the semiconductor chip and the conductor pattern. A space is formed around the semiconductor chip, and a resin is potted from above the cap to seal the contact portion between the substrate and the cap. In this way, depending on the method for manufacturing the semiconductor device, it is possible to provide a semiconductor device having an inexpensive sealing structure with a small transmission loss in the millimeter wave band.

  In general, a semiconductor device is often used as a package in which a bare chip is sealed.

  Various techniques relating to such a background are known (see, for example, Patent Document 6).

  For example, Patent Document 6 describes a semiconductor device having a structure in which an IC chip is embedded in a multilayer substrate and the IC chip is sealed using a cap. More specifically, in this semiconductor device, a positioning hole or groove is provided in the uppermost layer of the multilayer substrate, and a protrusion is provided in the cap at a position corresponding to the positioning hole or groove, and the protrusion is positioned. The IC chip is sealed by being fitted into a hole or groove. Thus, depending on the semiconductor device, it is not necessary to provide a positioning layer on the multilayer substrate, and cost reduction can be realized.

  Also, the use of photon devices such as vertical cavity surface emitting lasers or photodetectors has become very popular in the communications and electronics industries.

  Various techniques relating to such a background are known (see, for example, Patent Document 7).

  For example, Patent Document 7 describes a method of hermetically sealing a photon device such as a vertical cavity surface emitting laser or a photodetector on a substrate material. More specifically, in the method of hermetically sealing the photon device on the substrate material, the photon device is attached to the upper surface of the substrate material. And the method of sealingly sealing this photon apparatus on a board | substrate material seals a photon apparatus on a board | substrate material upper surface by sealing sealing. Thus, depending on the method of hermetically sealing the photon device on the substrate material, an appropriate number of submounts of the hermetically sealed photon device can be mass-produced on the wafer.

  In addition, as a highly accurate oscillator, a crystal or a ceramic oscillator is generally used.

  Various techniques related to such a background are known (see, for example, Patent Document 8).

  For example, Patent Document 8 is provided with a component having a box-shaped cap on the element and a hollow portion between the element and the inner surface of the plate-shaped ceiling portion facing the element in the cap. A mold package in which components are sealed with a mold resin is described. More specifically, the mold package has a convex plate shape in which the ceiling portion is convex in a direction away from the element. In this way, depending on the mold package, the distance between the inner surface of the ceiling portion and the element inside the cap can be increased, so that the ceiling portion of the cap and the element inside the cap come into contact with each other due to the stress caused by the mold resin. Can be prevented.

  In addition, a semiconductor package includes an IC chip mounted on a flat ceramic substrate, a sealing member that covers a portion to be sealed is attached using a joining member, and the inside is hermetically sealed hollow. is there.

  Various techniques related to such a background are known (see, for example, Patent Document 9).

  For example, Patent Document 9 describes a semiconductor package used for a radar device or the like. More specifically, this semiconductor package includes an IC chip. The semiconductor package also includes a sealing barrier that is bonded to the substrate and surrounds the periphery of the IC chip. The semiconductor package also includes a sealing lid that is attached to the barrier and closes an opening formed by the substrate and the barrier. In this semiconductor package, a step for aligning the sealing barrier is provided at a portion where the sealing barrier is attached on the substrate. Thus, depending on the semiconductor package, it is possible to prevent the relative position between the ceramic substrate and the sealing member from being shifted in the bonding step.

  In recent years, due to demands for high performance, high quality, small size, and low price for electronic devices, it has become essential to improve and improve the container that covers the element as well as the element itself.

  Various techniques related to such a background are known (see, for example, Patent Document 10).

  For example, Patent Document 10 describes a method for manufacturing an electronic device having a structure in which an electronic component is hollow-sealed. More specifically, in this method of manufacturing an electronic device, a substrate having a conductive pattern provided on the substrate is prepared. In this method for manufacturing an electronic device, an adhesive layer is formed on a conductive pattern provided on a substrate. In this method of manufacturing an electronic device, an electronic component is mounted on a substrate and the electronic component is electrically connected to a conductive pattern. In this method of manufacturing an electronic component, a resin cap made of two or more resin layers and a conductive pattern are bonded via an adhesive layer, and the electronic component is sealed in a hollow state. In this way, depending on the method of manufacturing the electronic component, the sealing performance of the electronic component can be maintained, the yield of the product can be improved, and an increase in cost can be suppressed.

  In addition, as a communication device such as a mobile phone or a device for information communication such as wireless broadband or satellite communication, for example, a high-frequency device using a gallium nitride semiconductor is used.

    Various techniques related to such a background are known (see, for example, Patent Document 11).

  For example, in Patent Document 11, a first mold having a recess formed on one surface, a second mold that can be opposed to one surface of the first mold, a third mold, and a first mold are disclosed. The surface of the second mold that can face one surface of the first mold is provided with a protrusion and a groove located on the outer periphery of the protrusion. The fourth mold can be interposed between the first mold and the third mold, and uses a hollow resin package forming apparatus for an electronic device that has a cylindrical shape having a hole. A method for forming a hollow resin package for electronic devices is described. More specifically, in this method for forming a hollow resin package for an electronic device, a substrate on which a chip is mounted is disposed on a surface of a third mold that can face one surface of the first mold. To do. The method for forming a hollow package for an electronic device includes: a cavity for forming a cover portion of a cap by joining a first die and a second die to form a gap and a groove between the recess and the protrusion. The cover part of the cap is formed by filling the resin material into the cavity and solidifying it. The method for forming the hollow resin package for an electronic device includes the first mold and the fourth mold in a state where the molded cover portion is attached and held inside the concave portion of the first mold. The third mold is laminated in order, and the cover portion held by the first mold is arranged on the substrate arranged in the third mold through the hole of the fourth mold. In doing so, the chip is covered by the cover with a space from the chip. Then, in the method for forming the hollow package for an electronic device, the resin material is filled between the cover portion and the wall surface of the hole portion of the fourth mold and solidified in a state where the cover portion is disposed on the substrate. In forming the joint portion located on the outer periphery of the cover portion, the cap is completed by integrating the joint portion with the cover portion, and the cap and the substrate are joined by the joint portion. Thus, depending on the method for forming the hollow package for electronic devices, the number of steps required for forming the hollow resin package can be reduced, so that the cost can be reduced and the yield can be increased.

Japanese Examined Patent Publication No. 7-93389 JP-A-4-259244 JP-A-5-198610 Japanese Utility Model Publication No. 7-14651 JP-A-7-326685 JP 9-22594 A JP-T-2002-534813 JP 2007-258343 A JP 2008-60289 A JP 2009-283553 A JP 2011-1000082 A

  In the hollow sealing structure described in Patent Document 11, the shape of the cap is not specified, but the bottom surface is square or rectangular, the side surface has a trapezoidal shape with a width narrowing toward the top surface, and the top surface Generally has a square or rectangular structure with an area smaller than the area of the bottom surface. When covering and sealing a cap having this structure, the side surface of the cap is pushed by the flow of the covering sealing material, the cap moves from a predetermined position, and the hollow portion may be displaced from the predetermined position.

  Depending on the technique described in Patent Document 4, since a dome-shaped insulating film is provided, such a problem can be avoided, but it is difficult to adsorb and transport the upper surface of the insulating film.

  The objective of this invention is providing the airtight sealing body which solves the subject mentioned above.

In order to solve the above problems, according to a first embodiment of the present invention, an airtight sealing body is provided on a surface of a substrate to hermetically seal a component, and at least a part of the outer surface is outside. The cap has a curved shape that curves toward the surface, and at least a part of the outer surface has a planar shape, and a covering sealing portion that covers the outer periphery of the cap, and the curved shape portion is injected from the gate It has a curved surface shape that reduces the flow resistance of the resin, and the planar portion is formed on the upper part of the outer surface of the cap .

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. Also, a sub-combination of these feature groups can also be an invention.

  As is clear from the above description, according to the present invention, the cap can be prevented from being displaced and the cap can be transported while adsorbing a flat surface provided outside the cap.

It is a figure which shows an example of the structure of the airtight sealing body which concerns on 1st Embodiment. It is a figure which shows an example of the structure of the airtight sealing body which concerns on 2nd Embodiment.

  Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the claimed invention, and all combinations of features described in the embodiments are described below. However, this is not always essential for the solution of the invention.

  FIG. 1 shows an example of the structure of the hermetic sealing body according to the first embodiment. The hermetic sealing body according to this embodiment includes a substrate 5, a component 6, a cap 2, and a covering sealing portion 1.

  More specifically, the cap 2 is provided on the surface of the substrate 5 on which the component 6 is mounted, and has a curved shape that curves outward on the outer surface and the inner surface, and each corner also has It has a curved surface shape and has a flat portion outside the cap. The covering sealing portion 1 is covered so as to cover the entire cap 2, and is in close contact with the bottom surface of the substrate 5. With this configuration, the inside of the cap 2 can be kept airtight.

  Note that the material of the cap 2 is, for example, a thermosetting resin, a thermoplastic resin, a non-ferrous metal, and an iron metal.

  FIG. 2 shows an example of the structure of the hermetic sealing body according to the second embodiment. In the second embodiment, at least a part of the outer shape of the cap 2 has a convex curved shape facing outward, a flat portion is provided on the outer side of the cap 2, and the four corners of the cap 2 are square. It is characterized by that.

  The manufacturing method of the hermetic sealing body according to the embodiment described above has a convex curved shape toward the outside both inside and outside, each corner also has a curved shape, and a flat portion is provided outside the cap. The cap 2 is molded. Then, the flat portion of the cap 2 is sucked and conveyed, mounted on the substrate 5 and hermetically sealed with the component 6, clamped on the substrate 5 with a mold, and then injected with a covering sealing material from the gate 3, The sealing part 1 is formed. The covering sealing portion 1 hits the side surface of the cap 2, but the cap 2 has a convex curved surface shape, so that the flow resistance is small, and the cap 2 is covered and sealed without moving in the resin flow direction. In addition, since the inside of the cap 2 has a curved surface shape that is convex upward, even if the pressure of the covering sealing portion 1 is applied to the cap 2, the deflection can be suppressed.

  As is apparent from the above description, according to the present invention, since the flow resistance when the coating sealing material passes through the cap 2 is reduced, the displacement of the cap 2 can be prevented.

  In addition, since the cross section has a curved surface structure that is convex upward and has a structure that is strong against compression from above, even if the pressure of the covering sealing portion 1 is applied to the cap 2, the cap 2 is bent. Can be suppressed.

  Further, the cap 2 can be transported by adsorbing a flat surface provided outside the cap 2.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Covering sealing part 2 Cap 3 Gate 4 Hollow part 5 Substrate 6 Parts

Claims (3)

A cap that is provided on the surface of the substrate to hermetically seal the component, and is formed with a planar shape portion and a curved shape portion that curves outwardly on at least a part of the outer surface;
A covering sealing portion covering the outer peripheral portion of the cap,
The curved surface shape portion has a curved surface shape that reduces the flow resistance of the resin injected from the gate ,
The airtight sealing body , wherein the planar shape portion is formed on an upper portion of an outer surface of the cap . Of the outer surface of the cap, in a portion other than the planar shape portion, hermetically sealed body according to claim 1, wherein the curved portion is formed. The material of the cap is any one of a thermosetting resin, a thermoplastic resin, a non-ferrous metal, and a ferrous metal. The hermetic sealing body according to claim 1 or 2 , wherein:

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