JP6213123B2 - Curable composition containing silica particles, cured product thereof, and semiconductor encapsulant using the same - Google Patents

Description

  The present invention relates to a curable composition containing silica particles, a cured product thereof, and a semiconductor sealing material using the same. Specifically, a sealing material or adhesive that requires heat resistance, for example, a sealing material for power semiconductors, a sealing material for optical members that requires transparency, a curable composition for use in lenses and optical thin films In particular, the present invention relates to a sealing material such as a light emitting diode (hereinafter abbreviated as LED) or a semiconductor laser.

  Conventionally, epoxy resins and silicone resins have been used for transparent sealing materials such as LEDs. These sealing materials are required to have heat resistance to withstand the heat generation of the LED during operation and gas barrier properties necessary for long-term reliability. In the present specification, the silicone resin refers to a polymer compound having a main skeleton formed by a siloxane bond.

  However, conventional epoxy resins have insufficient heat resistance as a semiconductor encapsulant for use in encapsulating high-intensity light-emitting elements such as high-intensity LEDs or semiconductor lasers, and due to deterioration of the encapsulant at high temperatures. The amount of extracted light may decrease due to current leakage or yellowing of the sealing material.

  Silicone resin is less likely to turn yellow than epoxy resin. For example, Patent Document 1 discloses an addition curable silicone resin composition containing a specific methylphenylsiloxane-based silicon compound as an addition curable silicone resin composition having excellent antisulfurization properties and high light emission efficiency in optical applications. , An optical element sealing material made of the composition, and a semiconductor device in which the optical element is sealed with a cured product of the optical element sealing material. Patent Document 2 discloses a curable composition for encapsulating an optical material that uses a phenyl-modified polyorganosiloxane having a high refractive index as a base polymer and does not generate cracks or peel off from a substrate even when heated. ing. However, normally, the silicone resin is easy to permeate gas, the permeation of corrosive gas from the atmosphere, the LED plating electrode and the reflector of the LED are easily discolored, the sealing material is easily peeled off from the LED package due to the permeation of water vapor, etc. There was a problem.

By adding an inorganic filler such as silica to the sealing material, it is possible to improve gas barrier properties or mechanical strength. For example, Patent Document 3 discloses a light-emitting device in which an LED is encapsulated with a resin, and the encapsulating resin (A) has two or more alkenyl groups in one molecule, and a perfluoropolyethylene in the main chain. Linear polyfluoro compound having an ether structure: 100 parts by mass, (B) Fluorinated organohydrogensiloxane having two or more hydrogen atoms directly bonded to silicon atoms in one molecule: 1 mol of alkenyl group of component (A) The amount of SiH group is 0.5 to 3.0 moles, (C) platinum group metal catalyst: 0.1 to 500 ppm in terms of platinum group metal atom, (D) specific surface area measured by BET method is 50 Silica powder of ˜400 m ² / g: A light emitting device characterized by being a cured product obtained by curing a curable composition containing 0.01 to 10 parts by mass is disclosed. However, there is a problem that transparency and fluidity are impaired by the addition of the inorganic filler to the sealing material.

  There is a need for a semiconductor sealing material that has gas barrier properties, transparency, and fluidity, and has heat resistance that does not deteriorate even when used for a long time at high temperatures.

JP 2012-52035 A JP 2005-307015 A JP 2009-277887 A JP 2007-15991 A

Hasegawa et al. Chem. Lett. , Pp. 1319 (1988) Journal of Organic Chemistry, vol. 692, pp1892-977 (2007), S.A. Varapurath V. Sudarsanan et al., J. Org. Chem. , Pp1892 (2007) M.M. A. Estuelas, et al., Organometallics, pp 3891 (2004). Polymer Bulletin, vol. 37, pp 705-710, 1996, K.K. Shintani

  The present invention has excellent heat resistance and gas barrier properties, can be potted (resin-filled) at room temperature (20 ° C), and does not deteriorate even when used at a high temperature of 150 ° C or higher for a long time. An object of the present invention is to obtain a curable composition containing silica particles, a cured product thereof, and a transparent semiconductor sealing material using the same, which are used for a stopper.

  The present invention includes the following inventions.

[Invention 1]
General formula (1)

(In the formula, each X independently represents the general formula X1 or X2

The number of X1 is an integer of 1 to 8, the number of X2 is an integer of 0 to 7, and the sum of the numbers of X1 and X2 is 8.
In the formula, R ^{1 to} R ⁴ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and in these hydrocarbon groups A part of hydrogen atoms may be substituted with fluorine atoms, and each R ⁵ is independently an alkyl group having 1 to 18 carbon atoms, an alkenyl group, an alkynyl group or an aryl group having 6 to 18 carbon atoms, Some of the hydrogen atoms in these hydrocarbon groups may be substituted with fluorine atoms, some of the carbon atoms may be substituted with oxygen atoms or nitrogen atoms,
R ⁶ is each independently a hydrogen atom, a vinyl group or an allyl group, m and n are each an integer of 1 to 4, and 3 ≦ m + n. )
A siloxane compound (A) represented by
At least one metal compound (D) selected from the group consisting of silica particles (C) and platinum compounds, palladium compounds and rhodium compounds;
A curable composition comprising:

[Invention 2]
R ⁵ is a methyl group, tertiary butyl group, phenyl group, biphenyl group, naphthyl group, formula (2)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (3)

(In the formula, u is an integer of 1 to 3.)
Is at least one group selected from the group consisting of groups represented by:
The curable composition of the invention 1.

[Invention 3]
Furthermore, the curable composition of Invention 1 or Invention 2, comprising a siloxane compound (B) having at least one hydrogen atom or alkenyl group bonded to a silicon atom.

[Invention 4]
The siloxane compound (B) has the general formula (4)

(Wherein R ⁷ represents an ether bond, a phenylene group, or a general formula (5)

Wherein R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and these hydrocarbon groups A part of the hydrogen atoms may be substituted with fluorine atoms, and r is an integer of 1 to 100.)
A part of hydrogen atoms in these groups may be substituted with fluorine atoms, and R ⁸ and R ⁹ are each independently a hydrogen atom, a carbon number of 1 to 8 is an alkyl group, an alkenyl group or an alkynyl group, and an aryl group having 6 to 8 carbon atoms, and R ¹⁰ is a hydrogen atom or a vinyl group. )
A compound (B1) represented by:
General formula (6)

(Wherein R ¹³ is each independently a hydrogen atom or vinyl group, R ¹⁴ is each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 8 carbon atoms, A part of the hydrogen atoms in the hydrocarbon group may be substituted with fluorine, and s is an integer of 3 to 7.)
A siloxane compound (B2)
And general formula (7)
(R ¹⁵ R ¹⁶ R ¹⁷ SiO _1/2 ) _a (SiO _4/2 ) _b (7)
(In the formula, R ^{15 to} R ¹⁷ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a vinyl group, and a part of the hydrogen atoms in these groups are substituted with fluorine atoms. In addition, at least two of R ^{15 to} R ¹⁷ are hydrogen atoms or vinyl groups, a and b are positive numbers indicating the molar ratio of each siloxane unit, a + b = 1, and a is 0.1 -0.9, b is 0.1-0.9)
A siloxane compound represented by formula (B3)
Is at least one siloxane compound selected from the group consisting of:
The curable composition of invention 3.

[Invention 5]
The curable composition of inventions 1-4, wherein the silica particles (C) are obtained by distilling off the solvent from colloidal silica.

[Invention 6]
The solvent contained in colloidal silica, Hildebrand solubility parameters, ^{12 MPa 1/2} or more and ^{25 MPa 1/2} or less, the curable composition of the invention 5.

[Invention 7]
Silica particles (C)
General formula (8)
Si (OH) _c (R ¹⁸ ) _d (8)
(In the formula, each R ¹⁸ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (9)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (10)

(In the formula, u is an integer of 1 to 3.)
A silicon compound (C1) represented by at least one group selected from the group consisting of groups represented by: C is an integer of 1 to 3, d is an integer of 1 to 3, and c + d = 4. ),
Formula (11)

(Wherein R ^{19 to} R ²⁴ each independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (12)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (13)

(In the formula, u is an integer of 1 to 3.)
At least one group selected from the group consisting of groups represented by: )
A silicon compound (C2) represented by
General formula (14)
Si (Cl) _e (R ²⁵ ) _f (14)
(In the formula, each R ²⁵ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (14-1)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (15)

(In the formula, u is an integer of 1 to 3.)
Wherein e is an integer of 1 to 3, f is an integer of 1 to 3, and e + f = 4. )
A silicon compound (C3) represented by
And general formula (16)
Si (OR ²⁶ ) _g (R ²⁷ ) _h (16)
(In the formula, each R ²⁶ independently represents a methyl group or an ethyl group, and each R ²⁷ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, or a trifluoroethyl group. Group, trifluoropropyl group,
Formula (17)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (18)

(In the formula, u is an integer of 1 to 3.)
And at least one group selected from the group consisting of groups represented by the formula: g is an integer of 1 to 3, h is an integer of 1 to 3, and c + d = 4. )
A silicon compound (C4) represented by
Silica particles obtained by distilling off the solvent from a mixture of at least one silicon compound selected from the group consisting of and colloidal silica,
Curable composition of invention 1-6.

[Invention 8]
Hardened | cured material which the curable composition of invention 1-7 hardened | cured.

[Invention 9]
The semiconductor sealing material containing the curable composition of the invention 1-7.

  The curable composition of the present invention is liquid and fluid at 60 ° C. or lower, and can be potted at room temperature (20 ° C.), for example, and transparent when heated to 50 ° C. or higher and 300 ° C. or lower. A cured product was obtained. The cured product has excellent gas barrier properties and has heat resistance that maintains high transparency without being colored even when exposed to a high temperature of 150 ° C. for a long time, and can be used as a semiconductor sealing material. .

  The present invention includes at least one siloxane compound (A) selected from the group consisting of specific siloxane compounds as essential components, silica particles (C) having an average particle diameter of 1 nm or more and 400 nm or less, platinum compounds, palladium A curable composition containing silica particles, a cured product thereof, and a semiconductor sealing material using the same, comprising at least one metal compound (D) selected from the group consisting of a compound and a rhodium compound.

In the present invention, silica is a substance containing a siloxane bond composed of silicon dioxide (SiO ₂ ), colloidal silica is a colloid of silicon dioxide or a hydrate thereof, and has a solvent for dispersion. It is. Colloidal silica (silica sol) includes an organosilica sol using an organic solvent such as alcohol or ketone as a solvent, and is preferably an organosilica sol. Silica particles are obtained by distilling off the solvent from colloidal silica.

In the present invention, the alkyl group is a group represented by —C _n H _{2n + 1} , the alkylene group is a group represented by —C _n H _2n —, and the alkenyl group is a group having —CH═CH _2. The alkynyl group is a group having —C≡CH, the allyl group is —CH ₂ —CH═CH _2, and the aryl group is a group derived from an aromatic hydrocarbon, and the group contains an aromatic hydrocarbon.

  The curable composition of the present invention has fluidity, and the cured product has excellent gas barrier properties, transparency and heat resistance necessary for a semiconductor encapsulant.

In the curable composition of the present invention, the siloxane compound (A) exhibits transparency and fluidity, and exhibits high heat resistance when cured. Further, the siloxane compound (A) can uniformly disperse the silica particles (C) without agglomeration of the silica particles (C), and has high fluidity even if the content of the silica particles (C) is high. And has transparency. Further, as silica particles (C), it is preferable to use silica particles which are removed by evaporating the solvent from colloidal silica which is a colloid of silicon dioxide or a hydrate thereof, that is, distilled off. At that time a Hildebrand solubility parameter of the solvent contained in colloidal silica ^{12 MPa 1/2} or more, by a ^{25 MPa 1/2} or less, it exhibits excellent fluidity and transparency. Further, the Hildebrand solubility parameter of the solvent contained in colloidal silica ^{12 MPa 1/2} or more, by a ^{25 MPa 1/2} or less, the cured product exhibits excellent gas barrier properties.

  In the curable composition of the present invention, the addition of silica particles (C) has the effect of increasing the gas barrier property of a cured product obtained by curing the curable composition. As described above, the solvent is used together with the siloxane compound (A). It is possible to disperse uniformly. By increasing the content of silica particles (C) in the curable composition, the cured product exhibits excellent gas barrier properties.

When the curable composition (A) of the present invention is heated, a bonding reaction such as Si—H group and Si—CH═CH ₂ group occurs, and curing proceeds. At this time, in order to proceed the reaction and obtain a cured product, at least one metal compound (D) selected from the group consisting of a platinum compound, a palladium compound and a rhodium compound is used as the composition. The curable composition of the present invention is cured by the action of the metal compound (D) as a curing catalyst, is transparent, and has heat resistance and transparency that does not deteriorate even when continuously used in an environment of 150 ° C. A cured product having excellent gas barrier properties can be obtained.

  Furthermore, in the curable composition of the present invention, the siloxane compound (B) has an action of accelerating curing when the composition of the present invention is heated and cured to obtain a cured product, and is preferably added. A curable composition containing the silica particles of the present invention, a cured product thereof, and a semiconductor encapsulant using the same are used as a semiconductor encapsulant requiring high heat resistance, for example, for LED high-luminance light emitting devices. Useful for fastening materials.

  Hereinafter, the curable composition of the present invention will be described.

1. Curable composition The curable composition of the present invention comprises a siloxane compound (A) represented by the general formula (1), silica particles (C) having an average particle diameter of 1 nm or more and 400 nm or less, and a platinum compound, At least one metal compound (D) selected from the group consisting of a palladium compound and a rhodium compound is an essential component.

  Furthermore, the group which consists of a siloxane compound (B3) represented by the siloxane compound (B1) represented by General formula (4), the siloxane compound (B2) represented by General formula (6), and General formula (7). It is preferable that at least one siloxane compound selected from is included.

  Hereinafter, the curable composition of the present invention will be described by being divided into components.

2. Siloxane compound (A)
The siloxane compound (A)
General formula (1):

(In the formula, each X independently represents the general formula X1 or X2

The number of X1 is an integer of 1 to 8, the number of X2 is an integer of 0 to 7, and the sum of the numbers of X1 and X2 is 8.
In the formula, R ^{1 to} R ⁴ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and in these hydrocarbon groups A part of hydrogen atoms may be substituted with fluorine atoms, and each R ⁵ is independently an alkyl group having 1 to 18 carbon atoms, an alkenyl group, an alkynyl group or an aryl group having 6 to 18 carbon atoms, Some of the hydrogen atoms in these hydrocarbon groups may be substituted with fluorine atoms, some of the carbon atoms may be substituted with oxygen atoms or nitrogen atoms,
R ⁶ is each independently a hydrogen atom, vinyl group or allyl group, m and n are each an integer of 1 to 4, and 3 ≦ m + n. )
It is represented by

A siloxane compound (A) in which m in R ⁶ is 2 or 4 is easy to synthesize, and m is preferably 2 or 4.

In order to provide the cured product obtained by heat-curing the curable composition of the present invention with heat resistance that does not deteriorate at a high temperature of 150 ° C. or higher, R ⁵ in the siloxane compound (A) is a methyl group or tertiary butyl. Group, phenyl group, biphenyl group, naphthyl group, formula (2)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (3):

(In the formula, u is an integer of 1 to 3.)
It is preferably at least one group selected from the group consisting of groups represented by:

When the curable composition of the present invention is cured, R ⁵ is represented by a phenyl group, a group represented by the formula (2) or a formula (3) in order to obtain high heat resistance and gas barrier properties for the cured product. And more preferably a group represented by the formula (2) or a group represented by the formula (3). By using the curable composition using the siloxane compound (A), the cured product obtained by curing the curable composition can have transparency, excellent heat resistance, and gas barrier properties.

2-1. Synthesis of Siloxane Compound (A) A method for synthesizing the siloxane compound (A) will be described.

  The synthesis of the siloxane compound (A) is obtained by synthesizing a precursor which is a cage siloxane compound, followed by silylation, then chlorination, and finally addition of an organic group. That is, the synthesis of the precursor is performed, followed by the silylation of the precursor, the chlorination of the silylated precursor, and then the addition of an organic group.

2-1-1. Synthesis of Precursor First, synthesis of a precursor for obtaining the siloxane compound (A) represented by the general formula (1) will be described.

  Specifically, as shown in the following reaction scheme, a tetraalkoxysilane such as tetraethoxysilane (hereinafter sometimes referred to as TEOS) is added to an aqueous solution of quaternary ammonium hydroxide and stirred at room temperature. Thus, a precursor which is an ammonium salt is obtained.

By this reaction, a precursor having a cage skeleton composed of 8 silicon atoms and 12 oxygen atoms is obtained by bonding with a siloxane bond (—Si—O—) (described in Non-Patent Document 1).

(R ^X and R ^Y are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group, an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and one of the hydrogen atoms in these hydrocarbon groups. Part may be substituted with a fluorine atom.)
Specific examples of the quaternary ammonium hydroxide include tetramethylammonium, tetraethylammonium, tetrapropylammonium, tetrabutylammonium and choline. Among these, choline is preferably used because it is obtained as a solid and is excellent in solubility in alcohol as a reaction solvent in the silylation of the next reaction for obtaining the siloxane compound (A).

2-1-2. Production of Siloxane Compound (A) A production method of the siloxane compound (A) represented by the general formula (1) (m = 1, 2 ≦ n ≦ 4) will be described step by step.

<Silylation of precursor>
The aforementioned silylation of the precursor is performed by a reaction between the precursor and a silylating agent. Silylating agents include dialkylsilane halides such as chlorodimethylsilane, disiloxanes such as hexamethyldisiloxane. The reaction between the precursor and chlorodimethylsilane is described in Non-Patent Document 1, and the reaction with disiloxane is disclosed in Patent Document 4.

<Chlorination of silylation precursor>
Chlorination of the silylated precursor can be carried out by reacting the silylated precursor with trichloroisocyanuric acid, reacting with hexachlorocyclohexane in the presence of a rhodium catalyst, or reacting with chlorine gas. For example, although the chlorination method described in Non-Patent Document 2 can be used without limitation, it is preferable to react with trichloroisocyanuric acid or chlorine gas because it has few by-products and is practical in terms of economy. The reaction of the silylated precursor with trichloroisocyanuric acid is described in Non-Patent Document 3, and the reaction with hexachlorocyclohexane using a rhodium catalyst is described in Non-Patent Document 4.

<Addition of organic groups>
Next, as shown below, the chlorinated precursor and the siloxylithium compound are reacted to obtain the siloxane composition (A) (m = 1, 2 ≦ n ≦ 4) represented by the general formula (1). be able to.

  Then, the manufacturing method of the siloxane compound (A) (2 <= m <= 4, 2 <= n <= 4) represented by General formula (1) is demonstrated in order.

<Silylation of precursor>
The aforementioned silylation of the precursor is performed by a reaction between the precursor and a silylating agent. Examples of the silylating agent include halogenated dialkylsilanes such as chlorodimethylsilane and disiloxane such as 1,1,3,3-tetramethyldisiloxane. The reaction between the precursor and chlorodimethylsilane is described in Non-Patent Document 1. The reaction with disiloxane is disclosed in US Pat.

<Chlorination of silylation precursor>
Chlorination of the silylated precursor can be carried out by reacting the silylated precursor with trichloroisocyanuric acid, reacting with hexachlorocyclohexane in the presence of a rhodium catalyst, or reacting with chlorine gas. For example, although the chlorination method described in Non-Patent Document 2 can be used without limitation, it is preferable to react with trichloroisocyanuric acid or chlorine gas because it has few by-products and is practical in terms of economy. The reaction of the silylated precursor with trichloroisocyanuric acid is described in Non-Patent Document 3, and the reaction with hexachlorocyclohexane using a rhodium catalyst is described in Non-Patent Document 4.

<Addition of organic groups>
Next, as shown below, by reacting with a chlorinated precursor and a siloxylithium compound, the siloxane composition (A) represented by the general formula (1) (2 ≦ m ≦ 4, 2 ≦ n ≦ 4) Can be obtained.

2-1-3. Production of Siloxane Compound (A-1) A synthesis method of the following siloxane compound (A-1) contained in the siloxane compound (A) represented by the general formula (1) will be described step by step.

  As described above, m in the siloxane compound (A) represented by the general formula (1) is an integer of 1 to 4, and m = 2 or 4 for ease of synthesis. Incidentally, a siloxane compound (A-1) is a case where m is 2.

The starting material for the siloxane compound is the aforementioned precursor in which R ^X and R ^Y are methyl groups.

<Silylation of precursor>
The aforementioned silylation of the precursor is performed by a reaction between the precursor and a silylating agent. Examples of silylating agents include halogenated dialkylsilanes such as chlorodimethylsilane, disiloxanes such as hexamethyldisiloxane, and the reaction of the precursor with chlorodimethylsilane is described in Non-Patent Document 1, where The reaction is disclosed in Patent Document 4.

Specifically, as shown in the following reaction scheme, an alcohol solution of a precursor, tetramethyldivinylsilane and tetramethylsilane is reacted in the presence of an organic base to silylate the precursor, A silylated silylated precursor is obtained. In this reaction, it is preferable to use methanol, ethanol or 2-propanol as the alcohol, and triethylamine or pyridine as the organic base. In this reaction, the ratio of X1 and X2 in the silylated precursor can be adjusted by the ratio of tetramethyldivinylsilane and tetramethylsilane used in the reaction.

<Chlorination of silylation precursor>
Chlorination of the silylated precursor can be carried out by reacting the silylated precursor with trichloroisocyanuric acid, reacting with hexachlorocyclohexane in the presence of a rhodium catalyst, or reacting with chlorine gas. For example, although the chlorination method described in Non-Patent Document 2 can be used without limitation, it is preferable to react with trichloroisocyanuric acid or chlorine gas because it has few by-products and is practical in terms of economy. The reaction of the silylated precursor with trichloroisocyanuric acid is described in Non-Patent Document 3, and the reaction with hexachlorocyclohexane using a rhodium catalyst is described in Non-Patent Document 4.

Specifically, as shown in the following scheme, a chlorinated precursor can be obtained by reacting a silylated precursor with trichloroisocyanuric acid in an organic solvent. As the organic solvent, it is preferable to use a chlorinated solvent such as dichloromethane, chloroform or dichloroethane, or tetrahydrofuran.

<Addition of organic groups>
A method for adding an organic group to the chlorinated precursor will be described.

  For example, a silanolate compound containing a phenyl group can be obtained by reacting a halogenated benzene with an organometallic reagent to exchange a metal atom and a halogen atom and then reacting with the chlorinated precursor.

As shown in the following reaction scheme, n-butyllithium as an organometallic reagent was reacted with bromobenzene to obtain phenyllithium, and further reacted with hexamethylcyclotrisiloxane to contain a siloxylithium containing a phenyl group. A compound is obtained.

In the case of using an alkylsilanol such as trimethylsilanol or tert-butyldimethylsilanol, a siloxylithium compound can be prepared by a one-step reaction by acting silanol and an organometallic reagent such as n-butyllithium. That is, as shown in the following reaction formula, a siloxylithium compound can be obtained by reacting trimethylsilanol with n-butyllithium.

Next, as shown below, the siloxane compound is an example of the siloxane composition (A) represented by the general formula (1) by reacting with a chlorinated precursor and a siloxylithium compound containing a phenyl group. (A-1) can be obtained.

2-1-3. Synthesis of Siloxane Compound (A) The synthesis of a siloxane compound other than the siloxane compound (A-1) will be described.

<Synthesis of precursor>
Disiloxane compound used in <Synthesis of precursor> in the siloxane compound (A-1), that is, a mixture of 1,3-divinyltetramethyldisiloxane and 1,1,3,3-tetramethyldisiloxane In addition, you may use 1 type chosen from the disiloxane compound group shown below, or 2 or more types in mixture.

  For example, 1,1,3,3-tetraisopropyldisiloxane, 1,1,3,3-tetraphenyldisiloxane, 1,1,3,3-tetravinyldisiloxane, 1,3-bis ((acryloxy Methyl) phenethyl) -tetramethyldisiloxane, 1,3-bis (2-aminoethylaminomethyl) tetramethyldisiloxane, 1,3-bis (3-aminopropyl) tetramethyldisiloxane, bis ((bicycloheptenyl) ) Ethyl) tetramethyldisiloxane, 1,3-bis (3-carboxypropyl) tetramethyldisiloxane, bis (3-chloroisobutyl) tetramethyldisiloxane, 1,3-bis (chloromethyl) tetramethyldisiloxane, 1,3-bis (cyanopropyl) tetramethyldisiloxane, bis (2- (3,4-epoxy Chlohexyl) ethyl) tetramethyldisiloxane, 1,3-bis (glycidoxypropyl) tetramethyldisiloxane, 1,3-bis (hydroxybutyl) tetramethyldisiloxane, 1,3-bis (hydroxypropyl) tetramethyl Disiloxane, 1,3-bis (methacrylamidopropyl) tetramethyldisiloxane, 1,3-bis (3-methacryloxy-2-hydroxypropoxypropyl) tetramethyldisiloxane, 1,3-bis (3-methacryloxy) Propyl) tetramethyldisiloxane, bis (methoxytriethyleneoxypropyl) tetramethyldisiloxane, bis (nonafluorohexyl) tetramethyldisiloxane, bis (tridecafluoro-1,1,2,2-tetrahydrooctyl) tetramethyl Disiloxa 1,3-bis (triethoxysilylethyl) tetramethyldisiloxane, 1,3-bis (trifluoropropyl) tetramethyldisiloxane, 1,3-diallyltetramethyldisiloxane, 1,3-dichloro-1,3 -Diphenyl-1,3-dimethyldisiloxane, 1,3-dichlorotetramethyldisiloxane, 1,3-dichlorotetraphenyldisiloxane, 1,3-diethyltetramethyldisiloxane, 1,3-diethynyltetramethyldi Siloxane, 1,3-dimethyltetramethoxydisiloxane, 1,3-diphenyltetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-dichlorodisiloxane, 1,3-divinyl-1, 3-diphenyl-1,3-dimethyldisiloxane, 1,3-divinyltetraethoxydi Siloxane, 1,3-divinyltetraphenyldisiloxane, hexaethyldisiloxane, hexamethyldisiloxane, hexaphenyldisiloxane, hexavinyldisiloxane, 1,1,3,3-tetracyclopentyldichlorodisiloxane, 1,1, 3,3-tetraethoxy-1,3-dimethyldichlorosilane, 1,3-tetramethyl-1,3-diethoxydisiloxane, 1,1,3,3-tetraphenyldimethyldisiloxane, 1,1,3,3 -Tetravinyl dimethyldisiloxane, 1-allyl-1,1,3,3-tetramethyldisiloxane, 3-aminopropylpentamethyldisiloxane or chloromethylpentamethyldisiloxane can be exemplified. 1,3-divinyltetramethyldisiloxane, 1,1,3,3-tetramethyldisiloxane or hexamethyldisiloxane is preferred.

<Silylation of precursor>
In addition to vinyldimethylchlorosilane and dimethylchlorosilane, which are chlorosilane compounds specifically mentioned as silylating agents in <silylation of precursor> in the synthesis of siloxane compound (A-1), silylating agents include trimethyl. Examples include chlorosilane, methylchlorosilane, cyclohexenyldimethylchlorosilane, allyldimethylchlorosilane, vinyldiphenylchlorosilane, vinylmethylphenylchlorosilane, methylphenylchlorosilane, diphenylchlorosilane, glycidyldimethylchlorosilane, or methacryloxydimethylchlorosilane run. Vinyldimethylchlorosilane, dimethylchlorosilane or trimethylchlorosilane is preferred.

<Addition of organic substances>
Further, as shown in the following reaction formula, in the procedure shown in <Addition of an organic group> in the synthesis of the siloxane compound (A-1), each bromo compound is derived as a raw material into a siloxylithium compound, By reacting each siloxylithium compound with a chlorinated precursor, R ⁵ in X1 of the general formula (1) is represented by the following formulas (a), (b), (c), (d), (e ) And (f), a siloxane compound (A) is obtained. For the siloxane compound (A) containing an alkyl group such as (h) or (i), an alkylsilanol and an organometallic reagent such as n-butyllithium are allowed to act to induce siloxylithium compounds, and then the same as described above. , Synthesized by the action of a chlorinated precursor.

Specifically, in the siloxane compound (A), X1 is represented by the following formulas (i) to (viii):

Can be obtained.

  Next, the process for synthesizing the aforementioned siloxylithium compound will be described in detail.

As shown in the following reaction formula, by the general formula (1) a siloxane compound represented by the bromo of R ⁵ for introducing the R ⁵ in X1 in (A) (Br-R ⁵⁾ and starting material, A lithiated form of R ⁵ (Li-R ⁵ ) is obtained. Thereafter, a siloxylithium compound is obtained by reacting a lithiated form of R ⁵ having a mole number x (Li-R ⁵ ) with a cyclic siloxane having a mole number y.

As shown in Table 1, the number m of siloxane units of the siloxylithium compound can be controlled to 1 or 3 by controlling the molar ratio (x: y) and the number of siloxane units w of the cyclic siloxane. This is described in Non-Patent Document 5.

As described above, R ⁵ of the bromo form (Br—R ⁵ ) of R ⁵ is a phenyl group, a biphenyl group, a naphthyl group, a trifluoromethylphenyl group, a ditrifluoromethylphenyl group, a monofluorophenyl group, or a difluorophenyl group. A group can be exemplified. Examples of R ¹ and R ² are each independently a hydrogen atom, methyl group, isopropyl group, phenyl group, 2-phenylpropyl group, or 3,3,3-trifluoropropyl.

As described above, it is also possible to synthesize a siloxylithium compound from the reaction of alkylsilanol and n-butyllithium represented by the following formula. Specific examples of the functional group Q include a methyl group and a tert-butyl group. Specific examples of R ¹ and R ² are each independently a hydrogen atom, a methyl group, an isopropyl group, a phenyl group, a 2-phenylpropyl group, or a 3,3,3-trifluoropropyl group.

3. Silica particles (C)
Next, the silica particles (C), which is an essential component in the composition of the present invention, will be described.

  The curable composition of the present invention contains silica particles (C) having an average particle diameter of 1 nm or more and 400 nm or less as an ingredient, and has an effect of improving the gas barrier property of the cured product when cured.

  The average particle diameter of the silica particles (C) is preferably 1 nm or more and 400 nm or less. When the average particle size is larger than 400 nm, the scattering intensity of the cured product increases and the transparency is lost. When the average particle size is less than 1 nm, the silica particles (C) aggregate. Easy to lose fluidity and transparency. More preferably, it is 2 nm or more and 100 nm or less. In addition, in this specification, an average particle diameter refers to the value measured by the dynamic light scattering method using Zeta-potental and particle size analyzer (made by Otsuka Electronics Co., Ltd.).

  The content of the silica particles (C) is expressed by mass ratio, and is preferably siloxane compound (A): silica particles (C) = 100: 5 to 100: 100, and the silica particles (C) are less than 5%. The cured product has poor gas barrier properties, and if it exceeds 100%, the fluidity is poor and potting is difficult. More preferably, it is 10% or more and 90% or less.

The silica particles (C) are within the range of the average particle diameter, and may be uniformly dispersed together with the siloxane compound (A) in the solvent when applied, and the colloidal silica that is a colloid of SiO ₂ or its hydrate is used as a solvent. Examples thereof include silica particles such as fumed silica and fused silica. These silica particles may be used alone or in combination of two or more. In the curable composition of the present invention, in order to uniformly disperse the siloxane compound (A) in a solvent or as a mixture without a solvent and to easily obtain a composition having a low viscosity and a high silica content, a solvent is used from colloidal silica. It is preferable to employ silica particles from which is distilled off.

  In order to obtain a state where silica particles (C) of 1 nm or more and 400 nm or less are uniformly dispersed in the siloxane compound (A), colloidal silica is added to the siloxane compound (A) so that the mixed solution becomes uniform. It is preferable to sufficiently stir and remove the solvent under reduced pressure.

The solvent contained in colloidal silica, Hildebrand solubility parameters, ^{12 MPa 1/2} or more, preferably not more ^{25 MPa 1/2} or less, ^{12 MPa 1/2} smaller, or ^{25 MPa 1/2} larger than, the siloxane compound ( When colloidal silica is added to A), the interaction between the silica particles (C) is stronger than the strength of the intermolecular interaction between the siloxane compound (A) and the silica particles (C), and the silica particles (C) are aggregated. Thus, fluidity and transparency are lost. Specifically, cyclopentane, cyclohexane, cycloheptane, dimethylacetamide, diethyl ether, tetrahydrofuran, 1,4-dioxane, acetone, ethyl acetate, acetonitrile, 1-propanol, 2-propanol, methyl ethyl ketone, toluene, benzene, xylene, Examples include cyclohexane, chloroform, chlorobenzene, dichloromethane, hexane, heptane, octane, 1-butanol or 2-butanol.

2-Propanol, methyl ethyl ketone or toluene is preferred.

More preferably, ^{16 MPa 1/2} or more and ^{20 MPa 1/2} or less. These solvents may be used alone or in combination of two or more. However, when two or more kinds of solvents are used, _assuming that the solubility parameter of each solvent is δ _n and the volume fraction is φ _n , the solubility parameter δ _M of the mixed solvent is
δ _M = (Σφ _n × δ _n ) / (Σ _φ )
Any solvent may be used as long as the calculation result falls within the range of 12 to 25.

Further, the colloidal silica described above may be an organosilica sol dispersed in an organic solvent such as alcohol or ketone in a colloidal silica (synonymous with silica sol) which is a colloid of SiO ₂ or its hydrate, and is commercially available. In the product, the product name, IPA-ST (particle diameter 10 to 20 nm), IPA-ST-L (40 to 50 nm), IPA-ST-ZL (particle diameter 70 to 100 nm) are obtained from the organosilica sol manufactured by Nissan Chemical Industries, Ltd. ), IPA-ST-UP (40-100 nm), EAC-ST, MEK-ST (particle diameter 10-15 nm), MEK-ST-40, MEK-ST-L, MEK-ST-ZL, MEK-ST- Examples thereof include UP and TOL-ST (particle diameter of 10 to 15 nm). These may be used alone or in combination of two or more. The particle size of colloidal silica depends on the specifications of Nissan Chemical Industries.

Silica particles (C)
General formula (8)
Si (OH) _c (R ¹⁸ ) _d (8)
(In the formula, each R ¹⁸ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (9)

(In the formula, t is an integer of 1 to 3.)
A group represented by
Formula (10)

(In the formula, u is an integer of 1 to 3.)
A silicon compound (C1) represented by at least one group selected from the group consisting of groups represented by: C is an integer of 1 to 3, d is an integer of 1 to 3, and c + d = 4. ),
Formula (11)

(Wherein R ^{19 to} R ²⁴ are each independently a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group, a formula (12)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (13)

(In the formula, u is an integer of 1 to 3.)
At least one group selected from the group consisting of groups represented by: )
A silicon compound (C2) represented by
General formula (14)
Si (Cl) _e (R ²⁵ ) _f (14)
(In the formula, each R ²⁵ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (14-1)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (15)

(In the formula, u is an integer of 1 to 3.)
Wherein e is an integer of 1 to 3, f is an integer of 1 to 3, and e + f = 4. )
A silicon compound (C3) represented by
And general formula (16)
Si (OR ²⁶ ) _g (R ²⁷ ) _h (16)
(In the formula, each R ²⁶ independently represents a methyl group or an ethyl group, and each R ²⁷ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, or a trifluoroethyl group. Group, trifluoropropyl group,
Formula (17)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (18)

(In the formula, u is an integer of 1 to 3.)
And at least one group selected from the group consisting of groups represented by the formula: g is an integer of 1 to 3, h is an integer of 1 to 3, and c + d = 4. )
A silicon compound (C4) represented by
Silica particles obtained by mixing at least one silicon-containing compound selected from the group consisting of and colloidal silica, stirring the mixture at 25 ° C. to 120 ° C. for 10 minutes to 60 hours, and then distilling off the solvent. (C) It is more preferable to employ silica particles (C) in which these silicon compounds are bonded to the surface so that they can be uniformly dispersed in a solvent together with the siloxane compound (A).

  The silicon-containing compound (C1) represented by the general formula (8) is a compound containing one or more Si—OH groups, and includes dimethylphenylsilanol, trimethylsilanol, dimethylsilanol, dimethylvinylsilanol, methylphenylsilanol, triphenyl Examples thereof include fluoromethyldimethylsilanol, trifluoromethylmethylsilanol, p-trifluoromethylphenyldimethylsilanol, m-trifluoromethylphenyldimethylsilanol, p-fluorophenyldimethylsilanol or m-fluorophenyldimethylsilanol. These compounds may be used alone or in combination of two or more. Among these, dimethylphenylsilanol, trimethylsilanol, dimethylvinylsilanol, dimethylsilanol, p-trifluoromethylphenyldimethylsilanol, and m-trifluoromethylphenyldimethylsilanol are preferable.

  The silicon-containing compound (C2) represented by the general formula (11) is a disiloxane compound, and includes hexamethyldisiloxane, 1,3-dibutyltetramethyldisiloxane, 1,3-diphenyltetramethyldisiloxane, 1, Examples include 3-divinyltetramethyldisiloxane, tetramethyldisiloxane, or hexaethyldisiloxane. These compounds may be used alone or in combination of two or more. Among these, it is preferable to use hexamethyldisiloxane or tetramethyldisiloxane.

  The silicon-containing compound (C3) represented by the general formula (14) is a chlorosilane compound, and is dimethylphenylchlorosilane, trimethylchlorosilane, dimethylchlorosilane, dimethylvinylchlorosilane, methyltrichlorosilane, phenyltrichlorosilane, vinyltrichlorosilane, trichlorosilane. , Dimethyldichlorosilane, diphenyldichlorosilane, divinyldichlorosilane, methylphenyldichlorosilane, methylvinyldichlorosilane, phenylvinyldichlorosilane, methylphenylchlorosilane, methyldichlorosilane, phenyldichlorosilane, vinyldichlorosilane, trifluoromethyldimethylchlorosilane, Trifluoromethylmethyldichlorosilane, trifluoromethylmethylchlorosilane, trifluoromethyl Trichlorosilane, p-trifluoromethylphenyldimethylchlorosilane, m-trifluoromethylphenyldimethylchlorosilane, p-trifluoromethylphenylmethyldichlorosilane, m-trifluoromethylphenylmethyldichlorosilane, p-trifluoromethylphenyltrichlorosilane, m-trifluoromethylphenyltrichlorosilane, p-fluorophenyldimethylchlorosilane, m-fluorophenyldimethylchlorosilane, p-fluorophenylmethyldichlorosilane, p-fluorophenyltrichlorosilane, m-fluorophenylmethyldichlorosilane or m-fluorophenyl An example is trichlorosilane. These compounds may be used alone or in combination of two or more. Among them, it is preferable to use dimethylphenylchlorosilane, trimethylchlorosilane, dimethylchlorosilane, dimethylvinylchlorosilane, m-trifluoromethylphenyldimethylchlorosilane, and p-trifluoromethylphenyldimethylchlorosilane.

  The silicon-containing compound (C4) represented by the general formula (16) is an alkoxysilane compound, and includes dimethylphenylmethoxysilane, trimethylmethoxysilane, dimethylmethoxysilane, dimethylvinylmethoxysilane, methyltrimethoxysilane, and phenyltrimethoxysilane. , Vinyltrimethoxysilane, trimethoxysilane, dimethyldimethoxysilane, diphenyldimethoxysilane, divinyldimethoxysilane, methylphenyldimethoxysilane, methylvinyldimethoxysilane, phenylvinyldimethoxysilane, methylphenylmethoxysilane, methyldimethoxysilane, phenyldimethoxysilane, Vinyldimethoxysilane, trifluoromethyldimethylmethoxysilane, trifluoromethylmethyldimethoxysilane, trifluoro Methylmethylmethoxysilane, trifluoromethyltrimethoxysilane, p-trifluoromethylphenyldimethylmethoxysilane, m-trifluoromethylphenyldimethylmethoxysilane, p-trifluoromethylphenylmethyldimethoxysilane, m-trifluoromethylphenylmethyldimethoxy Silane, p-trifluoromethylphenyltrimethoxysilane, m-trifluoromethylphenyltrimethoxysilane, p-fluorophenyldimethylmethoxysilane, m-fluorophenyldimethylmethoxysilane, p-fluorophenylmethyldimethoxysilane, p-fluorophenyl Trimethoxysilane, m-fluorophenylmethyldimethoxysilane, m-fluorophenyltrimethoxysilane, dimethylphenylethoxysilane , Trimethylethoxysilane, dimethylethoxysilane, dimethylvinylethoxysilane, methyltriethoxysilane, phenyltriethoxysilane, vinyltriethoxysilane, triethoxysilane, dimethyldiethoxysilane, diphenyldiethoxysilane, divinyldiethoxysilane, methyl Phenyldiethoxysilane, methylvinyldiethoxysilane, phenylvinyldiethoxysilane, methylphenylethoxysilane, methyldiethoxysilane, phenyldiethoxysilane, vinyldiethoxysilane, trifluoromethyldimethylethoxysilane, trifluoromethylmethyldiethoxy Silane, trifluoromethylmethylethoxysilane, trifluoromethyltriethoxysilane, p-trifluoromethylphenyldimethyl eth Xisilane, m-trifluoromethylphenyldimethylethoxysilane, p-trifluoromethylphenylmethyldiethoxysilane, m-trifluoromethylphenylmethyldiethoxysilane, p-trifluoromethylphenyltriethoxysilane, m-trifluoromethylphenyl Triethoxysilane, p-fluorophenyldimethylethoxysilane, m-fluorophenyldimethylchlorosilane, p-fluorophenylmethyldichlorosilane, p-fluorophenyltriethoxysilane, m-fluorophenylmethyldiethoxysilane or m-fluorophenyltriethoxy Silane can be exemplified. These compounds may be used alone or in combination of two or more. Among them, it is preferable to use trimethylmethoxysilane, dimethylmethoxysilane, dimethylvinylmethoxysilane, dimethylphenylmethoxysilane, p-trifluoromethylphenyldimethylmethoxysilane or m-trifluoromethylphenyldimethylmethoxysilane.

4). Metal compound (D)
The metal compound (D) that is essential in the composition of the present invention will be described.

  The metal compound (D) acts as a curing catalyst in the composition of the present invention in order to obtain a cured product having hardness and heat resistance.

  The metal compound (D) is only required to have a catalytic action for promoting the curing reaction, and is selected from the group consisting of a platinum compound, a palladium compound, and a rhodium compound. Specifically, a platinum compound such as a platinum-carbonylvinylmethyl complex, a platinum-divinyltetramethyldisiloxane complex, a platinum-cyclovinylmethylsiloxane complex, or a platinum-octylaldehyde complex, a palladium compound containing palladium, or rhodium Examples of rhodium compounds are: These may be used alone or in combination of two or more. In the composition of the present invention, it is preferable to employ a platinum compound because the hardness and the cured product are less deteriorated and easily obtained after curing.

  In these metal compounds (D), a platinum compound has an effect as a curing catalyst. Since a hard cured product is obtained and the composition is easy to handle during potting processing, the platinum compound (D) content is 1. It is preferably 0% or less, more preferably 0.00001% or more and 1.0% or less. If it is less than 0.00001%, it will not be cured, and if it is more than 1.0%, the liquid stability of the curable composition will be poor, it will be difficult to control the curing reaction, and it will become a coloring component in the cured product. Transparency may be impaired. More preferably, it is 0.0001% or more and 0.05% or less.

5. Siloxane compound (B)
The siloxane compound (B) used in the composition of the present invention will be described.

  The siloxane compound (B) has an effect of promoting curing when the composition of the present invention is cured by heating to obtain a cured product.

  In the curable composition of the present invention, at least selected from the group consisting of a siloxane compound (A), silica particles (C) having an average particle diameter of 1 nm or more and 400 nm or less, a platinum compound, a palladium compound, and a rhodium compound. In addition to one metal compound (D), a siloxane compound (B) having at least two hydrogen atoms or alkenyl groups bonded to a silicon atom may be used.

  The content of the siloxane compound (B) is preferably 1% or more and 50% or less with respect to the siloxane compound (A) in the curable composition of the present invention, and the content is preferably 1%. If it is less, curing will not be promoted even if heated, and if it is more than 50%, the content of the siloxane compound (A) will be small and the cured product will deteriorate even if exposed to a high temperature of 150 ° C. or higher for a long time. It is difficult to obtain heat resistance. More preferably, it is 2% or more and 40% or less.

  The siloxane compound (B) is preferably the aforementioned siloxane compound (B1), siloxane compound (B2), and siloxane compound (B3), and each may be used alone or in combination. .

5-1. Siloxane compound (B1)
The siloxane compound (B1)
General formula (4)

(Wherein R ⁷ represents an ether bond, a phenylene group,
Or general formula (5)

Wherein R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and these hydrocarbon groups A part of the hydrogen atoms may be substituted with fluorine atoms, and r is an integer of 1 to 100.)
A part of hydrogen atoms in these groups may be substituted with fluorine atoms, and R ⁸ and R ⁹ are each independently a hydrogen atom, a carbon number of 1 to 8 is an alkyl group, an alkenyl group or an alkynyl group, and an aryl group having 6 to 8 carbon atoms, and R ¹⁰ is a hydrogen atom or a vinyl group. )
It is represented by

The siloxane compound (B1) is preferably a compound containing two or more of either —Si—H groups or —Si—CH═CH ₂ groups in the same structure, 3-tetramethyldisiloxane, 1,1,3,3-divinyltetramethyldisiloxane, 1,4-bis (dimethylsilyl) benzene, 1,2-bis (dimethylsilyl) benzene, bis ((p-dimethylsilyl ) Phenyl) ether, 1,4-bis (vinyldimethylsilyl) benzene, 1,1,3,3,5,5-hexamethyltrisiloxane, tris (dimethylsiloxy) phenylsilane, 1,1,3,3- Examples thereof include tetraisopropyldisiloxane, tetrakis (dimethylsilyloxy) silane, and 1,5-dimethyl-2,5-disilahexane. Preferably, 1,1,3,3-tetramethyldisiloxane, 1,1,3,3-divinyltetramethyldisiloxane, 1,4-bis (dimethylsilyl) benzene, 1,2-bis (dimethylsilyl) Benzene.

  Commercially available products include vinyl-terminated polydimethylsiloxane (eg, Gelest, product name, DMS-V series), diphenylsiloxane-modified polydimethylsiloxane (eg, Gelest, product name, PDV series), trifluoropropyl-modified. Polydimethylsiloxane (for example, manufactured by Gelest, product name, product name, FMV, EDV series), vinyl-modified polydimethylsiloxane (manufactured by Gelest, product name, VDT, VDS, VDV, VGM, VGP, VGF, VMS series), Si-H-terminated polydimethylsiloxane (Gelest, product name, DMS-H series), Si-H-modified polydimethylsiloxane (Gelest, product name, HMS, HES series), or phenyl-modified polydimethylsiloxane (Ge est Co., Ltd., product name, HDP, HPM series) can be exemplified. These compounds may be used alone or in combination of two or more.

5-2. Siloxane compound (B2)
The siloxane compound (B2) is
General formula (6)

(In the formula ^{(6), R 13} are each independently a hydrogen atom or a vinyl ^{group, R 14} each independently represent a hydrogen atom, an alkyl group or an aryl group having a carbon number of 6-8 having from 1 to 8 carbon atoms And a part of hydrogen atoms of these hydrocarbon groups may be substituted with fluorine, and s is an integer of 3 to 7.

The siloxane compound (B2) is preferably a compound containing two or more —Si—H groups or —Si—CH═CH ₂ groups in the same structure. Trimethylcyclotrisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, cyclotrisiloxane, cyclotetrasiloxane, cyclopentasiloxane, 1,3 , 5-trivinyl 1,3,5-trimethylcyclotrisiloxane, 1,3,5,7-tetravinyl 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentavinyl 1,3,5,7,9-pentamethylcyclopentasiloxane, 1,3,5-triphenylcyclotrisiloxane, 1,3,5,7-tetra Examples thereof include phenylcyclotetrasiloxane, 1,3,5,7,9-pentaphenylcyclopentasiloxane, methylhydrocyclosiloxane ((MeHSiO) _3-5 ), and phenylhydrocyclosiloxane ((PhHSiO) _3-5 ). These compounds may be used alone or in combination of two or more. Preferably, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, 1,3,5,7-tetravinyl 1,3,5,7 , 9-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentavinylpentamethylcyclopentasiloxane, methylhydrocyclosiloxane ((MeHSiO) _3-5 ), or phenylhydrocyclosiloxane ((PhHSiO) _{3 -5} ).

5-3. Siloxane compound (B3)
The siloxane compound (B3)
General formula (7)
(R ¹⁵ R ¹⁶ R ¹⁷ SiO _1/2 ) _a (SiO _4/2 ) _b (7)
(In the formula, R ^{15 to} R ¹⁷ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a vinyl group, and a part of the hydrogen atoms in these groups are substituted with fluorine atoms. A and b are positive numbers indicating the molar ratio of each siloxane unit, and a + b = 1, a is 0.1 to 0.9, and b is 0.1 to 0.9).

In the siloxane compound (B3), R ^{15 to} R ¹⁷ are —H or —CH═CH ₂ groups, in other words, any one of hydrogen atoms and vinyl groups is bonded to the same silicon atom. It is preferable that it is a compound, and in a commercial item, the product made from Gelest, a product name, hydride Q resin, HQM series, CAS, 689888-57-8 can be illustrated. These compounds may be used alone or in combination of two or more.

6). Curing Method of Curable Composition When the curable composition of the present invention is heated, a bonding reaction such as Si—H group and Si—CH═CH ₂ group occurs, and curing proceeds. In order to advance the reaction, the metal compound which is a compound of platinum, palladium or rhodium described above is used as a composition, and the composition is cured by the action of a curing catalyst of these metal compounds, so that the temperature of 150 ° C. A cured product that does not deteriorate even when used in an environment can be obtained.

  Curing proceeds even at room temperature for a long time, but the curing temperature is preferably 100 ° C. or higher and 300 ° C. or lower, more preferably 100 ° C. or higher and 200 ° C. or lower. If the curing temperature is lower than 100 ° C., it is difficult to obtain hardness in the cured product. Curing progresses as the temperature is increased, but if the curing temperature is higher than 300 ° C., cracks may occur, which is not practical. The curing time is preferably 0.5 hours or more and 10 hours or less, more preferably 1 hour or more and 4 hours or less. If the curing time is shorter than 0.5 hours, the effect may not completely proceed, and if it is longer than 10 hours, it is not practical.

  Regarding the fluidity of the composition of the present invention, the composition of the present invention has a viscosity of 50 Pa · S or less measured at 25 ° C. with a rotary viscometer. Fluidity is obtained in the range of room temperature (20 ° C.) to 60 ° C., and it is easy to handle in potting and the like.

  Hereinafter, the present invention will be specifically described, but the present invention is not limited to these examples. The physical properties of the siloxane compounds, compositions, and cured products obtained in the examples and comparative examples were evaluated by the following methods.

Specifically, the precursor a of the siloxane compound (A) described above is synthesized, silylated precursors (a-1) to (a-4) derived from the precursor (a) are synthesized, and then silyl The siloxane compounds (A-1) to (A-18) belonging to the siloxane compound (A) derived from the chemical precursors (a-1) to (a-4) were synthesized.

  Next, silica particles (C) were added to these siloxane compounds (A) and stirred. When colloidal silica was used for the silica particles (C), the colloidal silica was added to the siloxane component (A), stirred, and then concentrated under reduced pressure, and the contained solvent was distilled off. Subsequently, the metal compound (D) was added, the composition was prepared, and fluidity | liquidity was evaluated. Furthermore, the said composition was heated and the hardened | cured material was produced and the heat resistance, transparency, and gas barrier property were evaluated for the physical property. Subsequently, the siloxane compound (B1), the siloxane compound (B2), or the siloxane compound (B3) was added to the composition to prepare a composition, and the fluidity was evaluated. Furthermore, the said composition was heated and the hardened | cured material was produced and the heat resistance, transparency, and gas barrier property were evaluated for the physical property. The physical properties were evaluated by the following methods.

<NMR (nuclear magnetic resonance) measurement>
Using a nuclear magnetic resonance apparatus (manufactured by JEOL Ltd.) having a resonance frequency of 400 MHz, 1H-NMR, 19F-NMR, and 29Si-NMR were measured.

<Viscosity measurement>
Viscosity of siloxane compound (A) at 25 ° C. using a rotational viscometer (Brookfield Engineering Laboratories, Inc., product name, DV-II + PRO) and a temperature control unit (Brookfield Engineering Laboratories, Inc., product name, THERMOSEL) Was measured.

<Transparency>
Using a UV-visible spectrophotometer (model number UV-3150, manufactured by Shimadzu Corporation), the transmittance of a cured product having a thickness of 2 mm at a wavelength of 400 nm was measured.

<Gas barrier properties (water barrier properties)>
According to JIS Z 0208, the moisture permeability of a cured product having a thickness of 2 mm was measured under the conditions of a temperature of 40 ° C. and a relative humidity of 90%.
<Fluidity>
At 25 ° C., the composition was poured into a mold to investigate whether the composition could be potted.

<Heat resistance>
After holding a cured product with a thickness of 2 mm for 200 hours in a furnace set to 150 ° C. (model number FS-30P manufactured by Tokyo Glass Equipment Co., Ltd.), an ultraviolet-visible spectrophotometer (model number UV-3150 manufactured by Shimadzu Corporation) is used. Then, the transmittance at a wavelength of 400 nm was measured.

[Synthesis of Siloxane Compound (A)]
First, the synthesis of the siloxane compound (A) used in the composition of the present invention will be described. Specifically, the synthesis of the precursor (a) of the siloxane compound (A) described above, the synthesis of silylated precursors (a-1) to (a-4) derived from the precursor (a), and then silylated The synthesis of the siloxane compounds (A-1) to (A-18) derived from the precursors (a-1) to (a-4) will be described step by step.

1 Synthesis of Precursor (a) In a 1 L three-necked flask equipped with a thermometer and a reflux condenser, 200 g (960 mmol) of tetraethoxysilane and 233 g (960 mmol) of a 50% by mass aqueous choline hydroxide solution were collected, and room temperature (20 ) For 12 hours. After the completion of stirring, 100 g of 2-propanol was added and the mixture was further stirred for 30 minutes. After cooling to 3 ° C., the precipitated crude product was separated by filtration and washed with 2 propanol, and then dried to form white powder, octa (2-hydroxyethyl) as a precursor (a) represented by the following formula: 151 g of trimethylammonium) silsesquioxane 36 hydrate was obtained in a yield of 62%.

The structural formula of octa (2-hydroxyethyltrimethylammonium) silsesquioxane is shown below.

<NMR measurement result>
¹ H NMR (solvent: deuterated methanol, reference material: tetramethylsilane); δ 3.23 (s, 9H), 3.48-3.51 (m, 2H), 4.02-4.05 (m, 2H) ) 2 Synthesis of Silylated Precursor Next, the precursor (a) described above was silylated using a silylating agent to obtain a silylated precursor. Different types of silylation precursors (a-1) to (a-4) were synthesized by changing the silylating agent.

2.1 Precursor (a) → Silylated precursor (a-1)
The precursor (a) described above was silylated to obtain a silylated precursor (a-1).

That is, 350 g of toluene, 30 g of methanol, 26.5 g (198 mmol) of tetramethyldisiloxane as a silylating agent, and 23.9 g (198 mmol) of tetramethyldivinyldisiloxane were placed in a 1 L three-necked flask equipped with a thermometer and a reflux condenser. Cooled to 3 ° C. Next, 69% by mass and 54.1 g of nitric acid were added dropwise over 30 minutes while stirring. After stirring for 30 minutes, a methanol solution in which 100 g (49.3 mmol) of the aforementioned octa (2-hydroxyethyltrimethylammonium) silsesquioxane 36 hydrate was dissolved in 100 g of methanol was heated to room temperature while stirring. The mixture was stirred at room temperature for 12 hours to carry out a silylation reaction. After completion of stirring, the aqueous layer was removed, and the organic layer was washed 3 times with 100 g of clean water. The organic layer was dried over 10 g of magnesium sulfate, and magnesium sulfate was filtered off and concentrated under reduced pressure. The obtained crude product was washed with methanol, dried, and as a white powder, silylated precursor (B-1) represented by the following formula: tetra (hydrodimethylsiloxy) tetra (vinyldimethylsiloxy) silsesqui Oxane, 46.0 g (45.0 mmol) was obtained. The yield was 91%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.18-0.24 (m, 12H), 4.70-4.72 (m, 1H), 5.75-5.81 (M, 1H), 5.93-5.96 (m, 1H), 5.97-6.15 (m, 1H),
²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.9, −1.7, −108.7, −109.0
2.2 Precursor (a) → Silylated precursor (a-2)
The aforementioned precursor (a) was silylated to obtain a silylated precursor (a-2).

That is, the same procedure as the reaction for obtaining the above-mentioned silylated precursor (b-1) using 19.9 g (149 mmol) of tetramethyldisiloxane and 30.6 g (248 mmol) of tetramethyldivinyldisiloxane as the silylating agent. The precursor a is silylated, and a silylated precursor (b-2) represented by the following formula: tri (hydrodimethylsiloxy) hepta (vinyldimethylsiloxy) silsesquioxane, 49.4 g ( 43.0 mmol) was obtained. The yield was 87%. The ratio of X1 and X2 is X1: X2 = 3: 5 as an average value of the respective numbers.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.18-0.24 (m, 36H), 4.70-4.72 (m, 3H), 5.75-5.81 (M, 5H), 5.93-5.96 (m, 5H), 5.97-6.15 (m, 5H), ²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ0 .9, -1.7, -108.7, -109.0
2.3 Precursor (a) → Siloxane compound precursor (a-3)
The precursor (a) described above was silylated to obtain a silylated precursor (a-3).

That is, the same procedure as the reaction for obtaining the silylated precursor (b-1) using 39.8 g (297 mmol) of tetraphenyldisiloxane and 15.3 g (99 mmol) of tetramethyldivinyldisiloxane as the silylating agent. To obtain siloxane compound precursor B-3 represented by the following formula: hepta (hydrodiphenylsiloxy) tri (vinyldimethylsiloxy) silsesquioxane, 36.3 g (21.0 mmol). The yield was 43%. The ratio of X1 and X2 is X1: X2 = 5: 3 in terms of the average value of each number.

2.4 Precursor (a) → Siloxane compound precursor (a-4)
The precursor (a) described above was silylated to obtain a silylated precursor (a-4).

  That is, using 53.0 g (396 mmol) of tetramethyldisiloxane as a silylating agent, the same procedure as in the reaction for obtaining the silylated precursor (a-1) was performed, and the precursor (a) was converted to silyl As a result, a siloxane compound precursor (a-4) represented by the following formula: octa (hydrodimethylsiloxy) silsesquioxane, 43.8 g (43.0 mmol) was obtained. The yield was 87%. The ratio of X1 and X2 is X1: X2 = 8: 0 in terms of the average value of the respective numbers.

The structural formula of the siloxane compound precursor (a-4) is shown below.

3 Synthesis of Siloxane Compound (A) Next, siloxane compounds (A-1) to (A-18) were synthesized using the silylated precursors (a-1) to (a-4). Examples of synthesis of each siloxane compound are shown below.

3.1 Silylated precursor (a-1) → Siloxane compound (A-1)
A 300 mL three-necked flask equipped with a thermometer and a reflux condenser was charged with 50.0 g of tetrahydrofuran and 11.2 g (10.0 mmol) of the silylated precursor (a-1), and the temperature was kept at −78 ° C. while stirring. Cooled down. Subsequently, after the internal temperature reached −78 ° C., 3.41 g (15.0 mmol) of trichloroisocyanuric acid was added. After completion of the addition, the mixture was stirred at −78 ° C. for 30 minutes, and then heated to room temperature while stirring. The precipitated insoluble material was filtered off to obtain a tetrahydrofuran solution.

  Subsequently, 4-bromobenzene, 6.3 g (40.0 mmol), and diethyl ether 50 g were placed in a 1 L three-necked flask equipped with a thermometer and a reflux condenser, and the mixture was cooled to −78 ° C. while stirring. After the internal temperature reached −78 ° C., 28 ml (45 mmol) of a 1.6 mol / L butyl lithium hexane solution was added dropwise over 30 minutes. After stirring for 30 minutes after the completion of dropping, 29.6 g (133 mmol) of hexamethylcyclotrisiloxane was added. The temperature was raised to room temperature while stirring, and the mixture was stirred at room temperature for 12 hours.

Subsequently, it cooled to 3 degreeC and, after the internal temperature reached 3 degreeC, the said tetrahydrofuran solution was dripped in 10 minutes. While stirring after completion of the dropwise addition, the temperature was raised to room temperature and stirred at room temperature for 2 hours. After the stirring was completed, diisopropyl ether, 50 g, pure water and 50 g were added, and the mixture was stirred for 30 minutes and then separated into two layers. The aqueous layer was then removed and the organic layer was washed 3 times with 50 g of distilled water. The organic layer was dried over 10 g of magnesium sulfate, and after magnesium sulfate was filtered off, the filtrate was concentrated under reduced pressure at 150 ° C./0.1 mmHg to give a siloxane compound (A-1) represented by the following formula as a colorless and transparent viscous material. ) 11.5 g was obtained with a yield of 82%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. When the viscosity of the siloxane compound (A-1) was measured, the viscosity was 900 mPa · s.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ-0.04-0.47 (m, 72H) 5.66-6.24 (m, 12H), 7.21-7. 45 (m, 12H), 7.47-7.69 (m, 8H)
3.2 Silylated precursor (a-2) → Siloxane compound (A-2)
Silylation precursor (a-2) 11.5 g (10.0 mmol) was used, except that 4-bromobenzocyclobutene 5.49 g (30.0 mmol) was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the siloxane compound (A-1) was performed to obtain 12.2 g of a siloxane compound (A-2) represented by the following formula as a colorless transparent oil in a yield of 80%. The ratio of X1 and X2 is X1: X2 = 3: 5 as an average value of the respective numbers. The viscosity was 800 mPa · s.

Siloxane compound (A-2)
<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.07-0.35 (m, 72H), 5.75-6.08 (m, 12H), 7.03 (brs, 8H ), 7.50 (brs, 8H)
¹⁹ F NMR (solvent: deuterated chloroform, reference material: trichlorofluoromethane); δ-112.2
3.3 Silylated precursor (a-1) → Siloxane compound (A-3)
The silylation precursor (a-1), 11.2 g (10.0 mmol) was used, and 9.00 g (40.0 mmol) of 4-bromobenzotrifluoride was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the siloxane compound (A-1) is performed, and 8.55 g of a siloxane compound (A-3) represented by the following formula is obtained as a colorless and transparent viscous material at a yield of 43%. Obtained. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 1100 mPa · s.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ-0.06-0.37 (m, 72H), 5.72-6.14 (m, 12H), 7.57-7 .66 (m, 16H)
²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.93-1.70, −17.1, -109.3, -110.1
¹⁹ F NMR (solvent: deuterated chloroform, reference material: trichlorofluoromethane); δ-63.3
3.4 Silylated precursor (a-1) → Siloxane compound (A-4)
The silylation precursor (a-1), 11.2 g (10.0 mmol) was used, and 3-bromobenzotrifluoride 9.00 g (40.0 mmol) was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the siloxane compound (A-1) is performed, and 7.06 g of a siloxane compound (A-4) represented by the following formula is obtained as a colorless and transparent viscous material at a yield of 35%. Obtained. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 1100 mPa · s.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.07-0.40 (m, 72H), 5.73-6.12 (m, 12H), 7.46 (m, 4H) ), 7.60 (m, 4H), 7.76 (m, 8H)
²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ0.7, -1.6, -17.2, -109.3, -110.2
¹⁹ F NMR (solvent: deuterated chloroform, reference material: trichlorofluoromethane); δ-63.1
3.5 Silylated precursor (a-1) → Siloxane compound (A-5)
The silylation precursor (a-1), 11.2 g (10.0 mmol) was used, and 11.72 g (40.0 mmol) of 3,5-bis (trifluoromethyl) bromobenzene was used instead of 4-bromobenzene. In the same manner as in the reaction for obtaining the siloxane compound (A-1), 16.1 g of a siloxane compound (A-5) represented by the following formula was obtained as a colorless and transparent viscous material. The yield was 83%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 1000 mPa · s.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ-0.06-0.05 (m, 72H), 5.58-6.21 (m, 12H), 7.77-8 .02 (m, 12H)
²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ8.4, -1.6, -16.4, -109.2, -110.0
¹⁹ F NMR (solvent: deuterated chloroform, reference material: trichlorofluoromethane); -63.3
3.6 Silylated precursor (a-1) → Siloxane compound (A-6)
The silylation precursor (a-1), 11.2 g (10.0 mmol) was used, and 3-trifluoromethylbromobenzene 9.00 g (40.0 mmol) was used instead of 4-bromobenzene, and hexamethylcyclohexane was used. Except that trisiloxane was changed to 9.8 g (44 mmol), the same procedure as the reaction for obtaining the siloxane compound (A-1) was performed, and the colorless transparent viscous material was represented by the following formula. 18.7 g of siloxane compound (A-6) was obtained with a yield of 75%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 3100 mPa · s.

3.7 Silylated precursor (a-3) → Siloxane compound (A-7)
The amount of trichloroisocyanuric acid was changed to 2.79 g (18.3 mmol) using 17.3 g (10.0 mmol) of the silylated precursor (a-3), and 4-bromobiphenyl was used instead of 4-bromobenzene. Except for using 13.99 g (60.0 mmol), the same procedure as in the reaction for obtaining the siloxane compound (A-1) was performed, and a siloxane represented by the following formula was obtained as a colorless and transparent viscous material. 25.2 g of compound (A-7) was obtained with a yield of 70%. It was. The ratio of X1 and X2 is X1: X2 = 5: 3 in terms of the average value of each number. The viscosity was 3800 mPa · s.

3.8 Silylated precursor (a-1) → Siloxane compound (A-8)
For the synthesis of the siloxane compound (A-8), a commercially available trimethylsilanol and an organometallic reagent such as n-butyllithium were allowed to act to prepare a siloxylithium compound and a chlorinated precursor to act.

  A 300 mL three-necked flask equipped with a thermometer and a reflux condenser was charged with 50.0 g of tetrahydrofuran and 11.2 g (10.0 mmol) of the silylated precursor (a-1) and stirred at -78 ° C while stirring. Cooled down. Subsequently, after the internal temperature reached −78 ° C., 3.41 g (15.0 mmol) of trichloroisocyanuric acid was added. After completion of the addition, the mixture was stirred at −78 ° C. for 30 minutes, and then heated to room temperature while stirring. The precipitated insoluble material was filtered off to obtain a tetrahydrofuran solution.

  Next, 3.6 g (40.0 mmol) of trimethylsilanol and 50 g of diethyl ether were placed in a 1 L three-necked flask equipped with a thermometer and a reflux condenser, and cooled to −78 ° C. with stirring. After the internal temperature reached −78 ° C., 25 ml (40 mmol) of a 1.6 mol / L butyl lithium hexane solution was added dropwise over 30 minutes.

The tetrahydrofuran solution was then added dropwise over 10 minutes. While stirring after completion of the dropwise addition, the temperature was raised to room temperature and stirred at room temperature for 2 hours. After the stirring was completed, diisopropyl ether, 50 g, pure water and 50 g were added, and the mixture was stirred for 30 minutes and then separated into two layers. The aqueous layer was then removed and the organic layer was washed 3 times with 50 g of distilled water. The organic layer was dried over 10 g of magnesium sulfate, and the magnesium sulfate was filtered off and concentrated under reduced pressure at 150 ° C./0.1 mmHg to give a siloxane compound represented by the following formula (A-8) as a colorless and transparent viscous material. 6.90 g was obtained with a yield of 47%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. When the viscosity measurement of the siloxane compound (A-8) was performed, the viscosity was 900 mPa · s.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.09 (brs, 60H), 0.20 (brs, 24H), 5.76-6.16 (m, 12H) ²⁹ Si NMR (Solvent: deuterated chloroform, reference material: tetramethylsilane); δ 15.5, 7.7, −11.2, −101.9, −103.0
3.9 Silylated precursor (a-1) → Siloxane compound (A-9)
The procedure is the same as that for obtaining the siloxane compound (A-8) except that 5.29 g (40.0 mmol) of t-butyldimethylsilanol is used instead of trimethylsilanol. 7.66 g of a siloxane compound (A-9) represented by the formula: was obtained with a yield of 44%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 900 mPa · s due to the viscosity measurement.

<NMR measurement result>
¹ H NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 0.04-0.21 (m, 72H), 0.86 (s, 36H), 5.75-6.16 (m, 12H) ) ²⁹ Si NMR (solvent: deuterated chloroform, reference material: tetramethylsilane); δ 11.0, 0.3, -19.2, -109.2, -110.3
3.10 Silylated precursor (a-4) → Siloxane compound (A-10)
The aforementioned siloxane compound (A-1) except that the siloxane compound precursor (a-4), 11.2 g (10.0 mmol) was used, and the amount of trichloroisocyanuric acid was changed to 2.79 g (18.3 mmol). The same procedure as in the reaction for obtaining the above was performed, and 11.3 g of a siloxane compound (A-10) represented by the following formula was obtained as a colorless and transparent viscous material in a yield of 82%. The ratio of X1 and X2 is X1: X2 = 5: 3 in terms of the average value of each number. The viscosity was 800 mPa · s.

3.11 Siloxane Compound Precursor (a-4) → Siloxane Compound (A-11)
The above siloxane was used except that siloxane compound precursor (b-4), 11.2 g (10.0 mmol) was used, and 5.22 g (40.0 mmol) of 4-fluorobromobenzene was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the compound (A-1) is performed, and 13.5 g of a siloxane compound (A-11) represented by the following formula is obtained as a colorless and transparent viscous material in a yield of 80%. It was. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 800 mPa · s.

3.12 Silylated precursor (b-4) → Siloxane compound (A-12)
The silylation precursor (b-4) was used except that 11.2 g (10.0 mmol) was used, and 9.00 g (40.0 mmol) of 4-bromobenzotrifluoride was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the siloxane compound (A-1) was performed, and as a colorless and transparent viscous material, 16.1 g of a siloxane compound (A-12) represented by the following formula was obtained in a yield of 85%. Obtained. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 800 mPa · s.

3.13 Silylated precursor (a-4) → Siloxane compound (A-13)
The silylation precursor (a-4) was used except that 11.2 g (10.0 mmol) was used and 9.00 g (40.0 mmol) of 4-bromobenzotrifluoride was used instead of 4-bromobenzene. The same procedure as the reaction for obtaining the siloxane compound (A-1) is performed, and 15.9 g of a siloxane compound (A-13) represented by the following formula is obtained as a colorless and transparent viscous material with a yield of 84%. Obtained. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 800 mPa · s.

3.14 Silylated precursor (a-4) → siloxane compound (A-14)
The silylated precursor (a-4), 10.2 g (10.0 mmol) was used, and 12.9 g (44.0 mmol) of 3,5-bis (trifluoromethyl) bromobenzene was used instead of 4-bromobenzene. The same procedure as in the reaction for obtaining the siloxane compound (A-1) described above was performed, and 13.2 g of a siloxane compound (A-14) represented by the following formula was obtained as a colorless and transparent viscous product. Obtained at 72%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 900 mPa · s due to the viscosity measurement.

3.15 Silylated precursor (a-4) → siloxane compound (A-15)
Using the siloxane compound precursor (b-4), 10.2 g (10.0 mmol), the amount of trichloroisocyanuric acid used was changed to 2.50 g (11.0 mmol), and the amount of hexamethylcyclotrisiloxane used was 9. The reaction was the same as in the reaction to obtain the siloxane compound (A-1) except that 7.42 g (33.0 mmol) of 3-trifluoromethylbromobenzene was used instead of 4-bromobenzene. The procedure was followed to obtain 14.9 g of a siloxane compound (A-15) represented by the following formula as a colorless and transparent viscous material with a yield of 74%. The ratio of X1 and X2 is X1: X2 = 3: 5 as an average value of the respective numbers. The viscosity was 2300 mPa · s.

3.16 Silylated precursor (a-4) → siloxane compound (A-16)
Using the silylated precursor (a-4), 10.2 g (10.0 mmol), the amount of trichloroisocyanuric acid used was changed to 1.67 g (7.3 mmol), and the amount of hexamethylcyclotrisiloxane used was 4. The procedure was the same as the reaction for obtaining the siloxane compound (A-1) except that 4-bromobiphenyl was used instead of 4-bromobenzene and 5.13 g (22.0 mmol) was used instead of 4-bromobenzene. The operation was performed to obtain 22.1 g of a siloxane compound (A-16) represented by the following formula as a colorless and transparent viscous material with a yield of 70%. The ratio of X1 and X2 is X1: X2 = 3: 5 as an average value of the respective numbers. The viscosity was 3900 mPa · s.

3.17 Silylated precursor (a-4) → siloxane compound (A-17)
Except for using silylated precursor (a-4), 10.2 g (10.0 mmol), the same procedure as in the synthesis example with the reaction for obtaining the siloxane compound (A-8) described above was performed, As a colorless and transparent viscous material, 11.0 g of a siloxane compound (A-17) represented by the following formula was obtained in a yield of 80%. The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 1200 mPa · s due to the viscosity measurement.

3.18 Silylated precursor (a-4) → siloxane compound (A-18)
The siloxane compound described above except that 10.2 g (10.0 mmol) of the silylated precursor (a-4) was used and 5.29 g (40.0 mmol) of t-butyldimethylsilanol was used instead of trimethylsilanol. The same procedure as the reaction for obtaining (A-1) was performed, and 12.6 g of a siloxane compound (A-18) represented by the following formula was obtained as a colorless and transparent viscous material in a yield of 82%. . The ratio of X1 and X2 is X1: X2 = 4: 4 in terms of the average value of each number. The viscosity was 1200 mPa · s due to the viscosity measurement.

[Production of composition, production of cured product, and evaluation of physical properties]
After adding silica particles (C-1) to (C-3) to the synthesized siloxane compounds (A-1) to (A-18) and stirring them until uniform, they are concentrated under reduced pressure by skipping. The solvent was distilled off.

Subsequently, the composition which added the metal compound (D-1) and (D-2) was prepared, and it heat-hardened, and obtained hardened | cured material. Moreover, the siloxane compounds (B1-1) to (B1-5) belonging to the siloxane compound (B1) and the siloxane compounds (B2-1) to (B2-4) belonging to the siloxane compound (B2) Or the composition which added the siloxane compound (B3-1) and (B3-2) which belong to a siloxane compound (B3) was prepared, and it heat-hardened, and obtained hardened | cured material.

The compounds used are shown in Table 2.

Next, the composition of the composition is shown in Tables 1 to 21 in Table 3. The blending ratio is shown in mass parts or ppm in ().

  In the obtained cured products of Examples 1 to 21, no foaming and cracks were observed, there was no gel-specific tackiness (tackiness), transparency, good appearance, and easy handling.

  With respect to the 2 mm-thick cured products of Examples 1 to 21, transparency evaluation using an ultraviolet-visible spectrometer was performed immediately after curing and after a heat resistance test at 150 ° C. for 200 hours. When the light transmittance with respect to incident light having a wavelength of 400 nm was measured, the transmittance was 85% or more immediately after curing and after the heat resistance test, and no deterioration in transparency due to continuous heating was observed. Moreover, generation | occurrence | production was not recognized by foaming and a crack.

About the hardened | cured material of 2 mm thickness of Examples 1-21, the gas barrier property test by a water barrier property test was done immediately after hardening. The moisture permeability was 15 (g / m ² · 24 h) or less, and had high gas barrier properties.

[Comparative Example 1]
As a sealant for LEDs, photodiodes, optical waveguide connections and various solar cells, a solvent-free and two-component thermosetting organic silicone resin consisting of A and B liquids (manufactured by Shin-Etsu Chemical Co., Ltd., product number APS) -1111 (A / B)) is poured into a polytetrafluoroethylene (hereinafter sometimes referred to as PTFE) mold at room temperature (20 ° C) and cured by heating in a heating furnace at 150 ° C for 1 hour. I got a thing. The cured product had a moisture permeability of 4 (g / m ² · 24 hr), but the heat resistance was transparent with a light transmittance of 85% or more immediately after curing, but after a heat resistance test at 150 ° C. for 200 hours. In this case, the sealing material is colored yellow, loses transparency, and does not have both heat resistance and gas barrier properties.

[Comparative Example 2]
As a sealing material for LEDs, photodiodes, optical waveguide connection parts, and various solar cells, a solvent-free and two-component thermosetting organic silicone resin consisting of A and B liquids (manufactured by Shin-Etsu Chemical Co., Ltd., product number KER2500) (A / B)) was poured into a PTFE mold at room temperature (20 ° C.) and heated in a heating furnace at 150 ° C. for 1 hour to obtain a cured product. The cured product had a light transmittance of 85% or more immediately after curing and after a heat resistance test at 150 ° C. for 200 hours, and no deterioration in transparency due to continuous heating was observed. m ² · 24 h), which is a sealing material in which heat resistance and gas barrier properties are not compatible.

  As described above, the cured product obtained by curing the composition of the present invention maintains transparency immediately after curing and after heating at 150 ° C. for 200 hours, and neither foaming nor cracking occurs, and the gas barrier property is also excellent. I understood. In addition, when it prepared except metal compound (D-1) and (D-2), even if it heated, the composition remained a viscous substance, it had tackiness, and hardened | cured material was not obtained.

Claims (6)

General formula (1)

(In the formula, each X independently represents the general formula X1 or X2

The number of X1 is an integer of 1 to 6 , the number of X2 is an integer of 2 to 7 , and the sum of the numbers of X1 and X2 is 8.
In the formula, each of R ^{1 to} R ⁴ is independently an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 8 carbon atoms, and a part of hydrogen atoms in these hydrocarbon groups is substituted with fluorine atoms. Each of R ⁵ is independently an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms, and a part of hydrogen atoms in these hydrocarbon groups is substituted with fluorine atoms. A part of the carbon atom may be substituted with an oxygen atom or a nitrogen atom,
R ⁶ is each independently a hydrogen atom, vinyl group or allyl group, m and n are each an integer of 1 to 4, and 3 ≦ m + n. )
A siloxane compound (A) represented by
At least one metal compound selected from the group consisting of silica particles (C) obtained by distilling off the solvent from colloidal silica and having an average particle diameter of 1 nm or more and 400 nm or less and platinum compounds, palladium compounds and rhodium compounds. (D),
A curable composition comprising: R ⁵ is a methyl group, tertiary butyl group, phenyl group, biphenyl group, naphthyl group, formula (2)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (3)

(In the formula, u is an integer of 1 to 3.)
Is at least one group selected from the group consisting of groups represented by:
The curable composition according to claim 1. The curable composition according to claim 1, further comprising a siloxane compound (B) having at least one hydrogen atom or alkenyl group bonded to a silicon atom. The siloxane compound (B) has the general formula (4)

(Wherein R ⁷ represents an ether bond, a phenylene group,
Or general formula (5)

Wherein R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and these hydrocarbon groups A part of the hydrogen atoms may be substituted with fluorine atoms, and r is an integer of 1 to 100.)
A part of hydrogen atoms in these groups may be substituted with fluorine atoms,
R ⁸ and R ⁹ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkenyl group or an alkynyl group, or an aryl group having 6 to 8 carbon atoms, and R ¹⁰ is a hydrogen atom or a vinyl group. is there. )
A compound (B1) represented by:
General formula (6)

(In the formula ^{(6), R 13} are each independently a hydrogen atom or a vinyl ^{group, R 14} each independently represent a hydrogen atom, an alkyl group or an aryl group having a carbon number of 6-8 having from 1 to 8 carbon atoms Yes, some of the hydrogen atoms in these hydrocarbon groups may be substituted with fluorine, and s is an integer of 3 to 7.)
A siloxane compound (B2)
And general formula (7)
(R ¹⁵ R ¹⁶ R ¹⁷ SiO _1/2 ) _a (SiO _4/2 ) _b (7)
(In the formula, R ^{15 to} R ¹⁷ are each independently a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or a vinyl group, and a part of the hydrogen atoms in these groups are substituted with fluorine atoms. In addition, at least two of R ^{15 to} R ¹⁷ are a hydrogen atom or a vinyl group, a and b are positive numbers indicating the molar ratio of each siloxane unit, a + b = 1, a is 0.1 to 0.9, b is 0.1 to 0.9)
A siloxane compound represented by formula (B3)
Is at least one siloxane compound selected from the group consisting of:
The curable composition according to claim 3. The solvent contained in colloidal silica, Hildebrand solubility parameters, ^{12 MPa 1/2} or more and ^{25 MPa 1/2} or less, the curable composition according to claims 1-4. Silica particles (C)
General formula (8)
Si (OH) _c (R ¹⁸ ) _d (8)
(In the formula, each R ¹⁸ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (9)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (10)

(In the formula, u is an integer of 1 to 3.)
And at least one group selected from the group consisting of groups represented by the following: c is an integer of 1 to 3, d is an integer of 1 to 3, and c + d = 4)
A silicon compound (C1) represented by
Formula (11)

(Wherein R ^{19 to} R ²⁴ each independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (12)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (13)

(In the formula, u is an integer of 1 to 3.)
At least one group selected from the group consisting of groups represented by: )
A silicon compound (C2) represented by
General formula ( 14 )
Si (Cl) _e (R ²⁵ ) _f (14)
(In the formula (14), each R ²⁵ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, a trifluoroethyl group, a trifluoropropyl group,
Formula (14-1)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (15)

(In the formula, u is an integer of 1 to 3.)
Wherein e is an integer of 1 to 3, f is an integer of 1 to 3, and e + f = 4. )
A silicon compound (C3) represented by
And general formula (16)
Si (OR ²⁶ ) _g (R ²⁷ ) _h (16)
(In the formula, each R ²⁶ independently represents a methyl group or an ethyl group, and each R ²⁷ independently represents a methyl group, an ethyl group, a phenyl group, a hydrogen atom, a vinyl group, a trifluoromethyl group, or a trifluoroethyl group. Group, trifluoropropyl group,
Formula (17)

(In the formula, t is an integer of 1 to 3.)
A group represented by
And formula (18)

(In the formula, u is an integer of 1 to 3.)
And at least one group selected from the group consisting of groups represented by the formula: g is an integer of 1 to 3, h is an integer of 1 to 3, and c + d = 4. ) Represented by a silicon compound (C4),
Silica particles obtained by distilling off the solvent from a mixture of at least one silicon compound selected from the group consisting of and colloidal silica,
The curable composition according to any one of claims 1 to 5 .