JP6209958B2

JP6209958B2 - Biosensor

Info

Publication number: JP6209958B2
Application number: JP2013250581A
Authority: JP
Inventors: 滝澤　稔; 稔滝澤; 芳如林; 佐々木　康; 康佐々木
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2013-12-03
Filing date: 2013-12-03
Publication date: 2017-10-11
Anticipated expiration: 2033-12-03
Also published as: JP2015107170A

Description

本発明の実施形態は、生体センサに関する。 Embodiments described herein relate generally to a biosensor.

近年の健康志向の増加に伴い、心電系を直接人体に付け常時測定したいとの要望がある。そのため常時使用するためには生活環境に合わせる必要があり、そのひとつに隙間を封止することが求められる。 With the recent increase in health consciousness, there is a demand for continuous measurement with the electrocardiogram attached directly to the human body. Therefore, in order to use it constantly, it is necessary to match the living environment, and one of them is required to seal the gap.

特開平４−１３２５３６号公報JP-A-4-132536

本実施形態が解決しようとする課題は、隙間を封止することが可能な生体センサを提供することである。 The problem to be solved by the present embodiment is to provide a biosensor capable of sealing a gap.

実施形態の生体センサでは、開口部を有する筐体と、前記筐体内に配置される回路基板と、前記回路基板と接続する第１電極部と、前記第１電極部と一体的に構成されて前記開口部から一端が前記筐体外部に突出する第２電極部と、を有する電極であって、前記第１電極部は前記開口部と前記回路基板との間の前記筐体内において前記第２電極部の径に対して非連続的に拡大する径を有する電極と、前記第１電極部の外周面と前記第１電極部に対面する前記筐体の内面との間、前記第２電極部の外周面と前記第２電極部に対面する前記筐体の内面との間及び前記第２電極部から前記第１電極部への拡径部における前記第１電極部と前記筐体の内面との間に介在されるシーリング材と、を備えることを特徴とする。 The biosensor embodiments, the housing having an opening, wherein a circuit board disposed within the housing, a first electrode portion to be connected to the circuit board, is constructed the integrally with the first electrode portion An electrode having one end protruding from the opening to the outside of the housing , wherein the first electrode portion is the second electrode in the housing between the opening and the circuit board. Between the electrode having a diameter that discontinuously expands with respect to the diameter of the electrode portion, the outer peripheral surface of the first electrode portion, and the inner surface of the housing facing the first electrode portion, the second electrode portion The first electrode portion and the inner surface of the housing in the enlarged diameter portion from the second electrode portion to the first electrode portion and between the outer peripheral surface of the housing and the inner surface of the housing facing the second electrode portion And a sealing material interposed therebetween.

本発明の第１の実施形態に係る筐体構造を示す断面図。Sectional drawing which shows the housing | casing structure which concerns on the 1st Embodiment of this invention. 本発明の第２の実施形態に係る筐体構造を示す断面図。Sectional drawing which shows the housing | casing structure which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態の変形例に係る筐体構造を示す断面図。Sectional drawing which shows the housing | casing structure which concerns on the modification of the 2nd Embodiment of this invention. 本発明の第３の実施形態に係る筐体構造を示す平面図。The top view which shows the housing structure which concerns on the 3rd Embodiment of this invention. 本発明の第４の実施形態に係る筐体構造を示す断面図。Sectional drawing which shows the housing structure which concerns on the 4th Embodiment of this invention. 本発明の第５の実施形態に係る電極形状を示す断面図。Sectional drawing which shows the electrode shape which concerns on the 5th Embodiment of this invention.

以下、発明を実施するための実施形態について説明する。 Hereinafter, embodiments for carrying out the invention will be described.

（第１の実施形態）
第１の実施形態を図１に基づき説明する。 (First embodiment)
A first embodiment will be described with reference to FIG.

生体センサは、筐体１、電極２、シーリング材３、回路基板８を備えて構成される。 The biosensor includes a housing 1, an electrode 2, a sealing material 3, and a circuit board 8.

筐体１は第１筐体１a、第２筐体１bとから構成される。第１筐体１aと第２筐体１bは回路基板８を収納するために設けられている。 The housing 1 includes a first housing 1a and a second housing 1b. The first housing 1 a and the second housing 1 b are provided for housing the circuit board 8.

電極２は生体センサから読み取った電気信号を回路基板８に伝搬するもので、第１電極部２a、第２電極部２bから構成される。 The electrode 2 propagates an electrical signal read from the biosensor to the circuit board 8, and is composed of a first electrode portion 2a and a second electrode portion 2b.

この第１電極部２aは貫通口の径より大きく、筐体１に収納された回路基板８に接続している。第２電極部２bは第１電極部２aと一体的に連続し、貫通口を貫通し外部に突出する。第２電極部２bが生体表面に例えばシールを介して接着し、生体からの電気信号を読み取る。読み取った電気信号は第２電極部２bから第１電極部２aを通り、回路基板８に伝搬される。第１電極部２aと、第１電極部２aに対面する筐体１との間、及び第２電極部２bと第２電極部２bと対面する貫通口内周面との間にそれぞれシーリング材が介在されている。 The first electrode portion 2a is larger than the diameter of the through hole and is connected to the circuit board 8 accommodated in the housing 1. The second electrode portion 2b is integrally continuous with the first electrode portion 2a, passes through the through-hole, and protrudes to the outside. The second electrode part 2b adheres to the surface of the living body through a seal, for example, and reads an electrical signal from the living body. The read electrical signal is transmitted from the second electrode portion 2b to the circuit board 8 through the first electrode portion 2a. Sealing materials are interposed between the first electrode portion 2a and the housing 1 facing the first electrode portion 2a, and between the second electrode portion 2b and the through hole inner peripheral surface facing the second electrode portion 2b. Has been.

ここでシーリング材は、隙間を埋める機能を有する。また隙間を埋めた際に筐体と電極とが接着し安定させる用途を有していてもよい。 Here, the sealing material has a function of filling the gap. Further, when the gap is filled, the housing and the electrode may be bonded and stabilized.

製造段階において第１電極部２aと第２電極部２bが貫通口に接着すると、第１電極部２aと第１電極部２aに対面する筐体１との間に介在するシーリング材３が、第１電極部２aと第１電極部２aに対面する筐体１内面に一様に広がる。同様に第２電極部２bと第２電極部２bに対面する貫通口内周面との間に介在するシーリング材３が、第２電極部２bと第２電極部２bに対面する貫通口内周面との間に一様に広がる。 When the first electrode portion 2a and the second electrode portion 2b are bonded to the through-hole in the manufacturing stage, the sealing material 3 interposed between the first electrode portion 2a and the housing 1 facing the first electrode portion 2a is It spreads uniformly on the inner surface of the housing 1 facing the first electrode portion 2a and the first electrode portion 2a. Similarly, the sealing material 3 interposed between the second electrode portion 2b and the through hole inner peripheral surface facing the second electrode portion 2b is formed between the second electrode portion 2b and the through hole inner peripheral surface facing the second electrode portion 2b. It spreads uniformly between.

その後、第１電極部２aと第１電極部２aに対面する筐体１内面と第２電極部２bと第２電極部２bに対面する貫通口内周面との間に一様に広がったシーリング材が乾くことで隙間を封止する効果が得られる。 Thereafter, a sealing material spread uniformly between the first electrode portion 2a and the inner surface of the housing 1 facing the first electrode portion 2a and the inner surface of the through-hole facing the second electrode portion 2b and the second electrode portion 2b. The effect of sealing the gap is obtained by drying.

第１電極部２aを設けることにより、仮に第２電極部２bと貫通口内周面との間を侵入してきた例えば汗などの液体は、侵入経路を曲げられてしまい直接回路基板８には行けない。さらに第１電極部２aと筐体１内面との接続面積を増やすことでシーリング材３が介在する距離も長くなるため隙間を封止する効果が得られる。 By providing the first electrode portion 2a, the liquid such as sweat that has entered between the second electrode portion 2b and the inner peripheral surface of the through-hole is bent in the intrusion path and cannot go directly to the circuit board 8. . Further, by increasing the connection area between the first electrode portion 2a and the inner surface of the housing 1, the distance in which the sealing material 3 is interposed is increased, so that the effect of sealing the gap is obtained.

（第２の実施形態）
第２の実施形態について図２を用いて説明する。図２(a)は、電極２が筐体１の貫通口を貫通する前の状態示す。図２(b)は、電極２が筐体１の貫通口を貫通した後の状態を示す。第２の実施形態が第１の実施形態と異なる点は、貫通口が形成された筐体１側面に凹部４が形成されている。凹部内には第１電極部２aが、回路基板８に対面する第１電極部２aの面と筐体１内面とを画一にしつつ収納されている。第１実施形態の筐体１の厚さが同じ場合、この形状にすることで侵入経路がさらに長くなり、また接合面が増えるためシーリング材３が介在する距離も長くなる。そのため隙間を封止する効果が得られる。また第１電極部２aが筐体１内面と画一に収納されることで、第１電極部２aの厚さ分全体の厚さを薄くすることができる。筐体１に凹部４を設けた構成要素以外は第１の実施形態と同じであるので、同一部分には同一符号を付して詳細な説明は省略する。 (Second Embodiment)
A second embodiment will be described with reference to FIG. FIG. 2A shows a state before the electrode 2 penetrates the through hole of the housing 1. FIG. 2 (b) shows a state after the electrode 2 has penetrated the through hole of the housing 1. The second embodiment is different from the first embodiment in that a recess 4 is formed on the side surface of the housing 1 in which a through-hole is formed. The first electrode portion 2a is accommodated in the recess while the surface of the first electrode portion 2a facing the circuit board 8 and the inner surface of the housing 1 are made uniform. When the thickness of the housing 1 of the first embodiment is the same, this shape further increases the intrusion path, and also increases the distance at which the sealing material 3 is interposed because the joining surface increases. Therefore, the effect of sealing the gap is obtained. In addition, since the first electrode portion 2a is housed in a uniform manner with the inner surface of the housing 1, the entire thickness of the first electrode portion 2a can be reduced. Since the components other than the constituent elements provided with the recess 4 in the housing 1 are the same as those in the first embodiment, the same portions are denoted by the same reference numerals and detailed description thereof is omitted.

（第２の実施形態の変形例）
第２の実施形態の変形例について図３を用いて説明する。図３(a)は、電極２が筐体１の貫通口を貫通する前の状態示す。図３(b)は、電極２が筐体１の貫通口を貫通した後の状態を示す。 (Modification of the second embodiment)
A modification of the second embodiment will be described with reference to FIG. FIG. 3A shows a state before the electrode 2 penetrates the through hole of the housing 1. FIG. 3B shows a state after the electrode 2 has penetrated the through hole of the housing 1.

第２実施形態での電極２は、第２電極部２bが、第１電極部２aとの接合部において直角に接合されている。第２実施形態と異なる点は、第１電極部２aから第２電極部２bに向かうに従って接合部に傾斜を設けている点である。 In the electrode 2 in the second embodiment, the second electrode part 2b is joined at a right angle at the joint part with the first electrode part 2a. The difference from the second embodiment is that the joint is inclined as it goes from the first electrode portion 2a to the second electrode portion 2b.

第１電極部２aから第２電極部２bに向かうに従い傾斜する箇所にシーリング材３を介在させる。第１電極部２aと第２電極部２bが貫通口に向けて押し込まれると、シーリング材３は、第１電極部２aと第１電極部２aに対面する筐体１内面との間に、第２電極部２bと第２電極部2bに対面する貫通口内周面との間にそれぞれ広がりやすくなる。このことから隙間を封止する効果が得られる。 The sealing material 3 is interposed at a location that inclines from the first electrode portion 2a toward the second electrode portion 2b. When the first electrode portion 2a and the second electrode portion 2b are pushed toward the through hole, the sealing material 3 is placed between the first electrode portion 2a and the inner surface of the housing 1 facing the first electrode portion 2a. It becomes easy to spread between the two electrode portions 2b and the inner peripheral surface of the through hole facing the second electrode portion 2b. From this, the effect of sealing the gap is obtained.

この第２電極部２bが、第２電極部２bと第１電極２aとの接合部において、第１電極部２aから第２電極部２bに向かうに従って傾斜している構成要素以外は第２の実施形態と同じであるので、同一部分には同一符号を付して詳細な説明は省略する。 The second electrode portion 2b is the second embodiment except for the components that are inclined toward the second electrode portion 2b from the first electrode portion 2a at the junction between the second electrode portion 2b and the first electrode 2a. Since it is the same as the form, the same parts are denoted by the same reference numerals, and detailed description thereof is omitted.

（第３の実施形態）
第３の実施形態について図４を用いて説明する。図４(a)は、第１電極２aが筐体１の環状溝５に嵌合する前の状態示す。図４(b)は、第１電極２aが筐体１の環状溝５に嵌合している状態を示す。図４(c)筐体１の環状溝５の平面図を示す。 (Third embodiment)
A third embodiment will be described with reference to FIG. FIG. 4A shows a state before the first electrode 2 a is fitted into the annular groove 5 of the housing 1. FIG. 4B shows a state where the first electrode 2 a is fitted in the annular groove 5 of the housing 1. FIG. 4C shows a plan view of the annular groove 5 of the housing 1.

第４の実施形態が第２の実施形態と異なる点は、第１電極部２aの内面と第１電極部２aの内面に対面する筐体１の内面いずれか一方に環状溝５が形成され、他方に環状溝５に嵌合する凸部が形成されていることである。 The fourth embodiment is different from the second embodiment in that an annular groove 5 is formed on either the inner surface of the first electrode portion 2a or the inner surface of the housing 1 facing the inner surface of the first electrode portion 2a. On the other hand, a convex portion that fits into the annular groove 5 is formed.

環状溝５と、他方に形成された凸部が嵌合することにより侵入経路が長くなり、シーリング材３の介在距離も長くなる。そのため隙間を封止するができる。さらに環状溝５と他方に形成された環状溝５に嵌合する凸部が嵌合することで、隙間を封止する効果だけでなく、筐体１に収納されている回路基板８の安定性も確保することができる。 By fitting the annular groove 5 and the convex portion formed on the other side, the intrusion path becomes longer and the intervening distance of the sealing material 3 becomes longer. Therefore, the gap can be sealed. Furthermore, the convex part fitted to the annular groove 5 and the annular groove 5 formed on the other side is fitted, so that not only the effect of sealing the gap but also the stability of the circuit board 8 accommodated in the housing 1 is achieved. Can also be secured.

第１電極部２aの内面と第１電極２aの内面に対面する筐体１の内面いずれか一方に環状溝５が形成され、他方に環状溝５に嵌合する凸部が形成されていることの構成要素以外は第２の実施形態と同じであるので、同一部分には同一符号を付して詳細な説明は省略する。 An annular groove 5 is formed on one of the inner surface of the first electrode portion 2a and the inner surface of the housing 1 facing the inner surface of the first electrode 2a, and a convex portion that fits the annular groove 5 is formed on the other. Since the other components are the same as those of the second embodiment, the same parts are denoted by the same reference numerals and detailed description thereof is omitted.

（第４の実施形態）
第４の実施形態につい図５を用いて説明する。図５(a)は、電極２が筐体１の貫通口を貫通する前の状態示す。図５(b)は、電極２が筐体１の貫通口を貫通した後の状態を示す。第５の実施形態が第１又は第２の実施形態と異なる点は、第２電極部２bの外周面あるいは第２電極部２bの外周面に対面する貫通口の内周面の少なくとも一方に凹凸面６が形成されていることである。少なくとも一方に凹凸面６が形成されることにより液体の侵入経路が長くなる。さらに第２電極部２bの外周面と第２電極部２bの外周面に対する貫通口の内周面との間のシーリング材３の面積が増えるため隙間を液密に封止する効果が得られる。 (Fourth embodiment)
A fourth embodiment will be described with reference to FIG. FIG. 5A shows a state before the electrode 2 penetrates the through hole of the housing 1. FIG. 5B shows a state after the electrode 2 has penetrated the through hole of the housing 1. The fifth embodiment differs from the first or second embodiment in that at least one of the outer peripheral surface of the second electrode portion 2b or the inner peripheral surface of the through hole facing the outer peripheral surface of the second electrode portion 2b is uneven. That is, the surface 6 is formed. By forming the irregular surface 6 on at least one side, the liquid intrusion path becomes longer. Furthermore, since the area of the sealing material 3 between the outer peripheral surface of the second electrode portion 2b and the inner peripheral surface of the through hole with respect to the outer peripheral surface of the second electrode portion 2b is increased, an effect of sealing the gap in a liquid-tight manner can be obtained.

第２電極部２bの外周面と第２電極部２bの外周面に対面する貫通口の内周面の少なくとも一方に凹凸面６が形成されている構成要素以外は第１の実施形態と同じであるので、同一部分には同一符号を付して詳細な説明は省略する。 Except for the component in which the uneven surface 6 is formed on at least one of the outer peripheral surface of the second electrode portion 2b and the inner peripheral surface of the through hole facing the outer peripheral surface of the second electrode portion 2b, it is the same as the first embodiment. Therefore, the same parts are denoted by the same reference numerals, and detailed description thereof is omitted.

（第５の実施形態）
第５の実施形態につい図６を用いて説明する。第６の実施形態は第１〜第４の実施形態のいずれかにおいて、回路基板８と第１電極部２aの間に金属製ばね部材７を介在させたことである。金属製ばね部材７が介在されることにより、第１電極部２aの内面が筐体１内面に向けて圧着されるため、第１電極部２aの内面と筐体１内面の接合面の隙間を減らすことができる。第１電極部２aから回路基板８に対してもばねの反発力が働くが、筐体１で抑え込むため安定性を保つことができる。 (Fifth embodiment)
A fifth embodiment will be described with reference to FIG. The sixth embodiment is that the metal spring member 7 is interposed between the circuit board 8 and the first electrode portion 2a in any one of the first to fourth embodiments. By interposing the metal spring member 7, the inner surface of the first electrode portion 2 a is pressure-bonded toward the inner surface of the housing 1, so that a clearance between the inner surface of the first electrode portion 2 a and the inner surface of the housing 1 is formed. Can be reduced. Although the repulsive force of the spring also acts on the circuit board 8 from the first electrode portion 2a, the stability can be maintained because it is suppressed by the housing 1.

実施形態は例示であり、発明の範囲は実施形態に限定されない。 The embodiment is an exemplification, and the scope of the invention is not limited to the embodiment.

本実施形態において第２電極部２bは円形を用いて説明を行ったが、第２電極部２bの形状は円形に限定されず、例えば三角形や四角形を用いることができる。またシーリング材が介在する面を限定せず、接着面からはみ出していても構わない。 In the present embodiment, the second electrode portion 2b has been described using a circle, but the shape of the second electrode portion 2b is not limited to a circle, and for example, a triangle or a rectangle can be used. Further, the surface on which the sealing material is interposed is not limited and may protrude from the adhesion surface.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

１・・・筐体
１a・・・第１筐体
１b・・・第２筐体
２・・・電極
２a・・・第１電極部
２b・・・第２電極部
３・・・シーリング材
４・・・凹部
５・・・環状溝
６・・・凹凸面
７・・・金属製ばね部材
８・・・回路基板 DESCRIPTION OF SYMBOLS 1 ... Case 1a ... 1st case 1b ... 2nd case 2 ... Electrode 2a ... 1st electrode part 2b ... 2nd electrode part 3 ... Sealing material 4 ... Recess 5 ... Round groove 6 ... Rough surface 7 ... Metal spring member 8 ... Circuit board

Claims

A housing having an opening;
A circuit board disposed in the housing;
An electrode having a first electrode connected to the circuit board, and a second electrode formed integrally with the first electrode and having one end protruding from the opening to the outside of the housing , The first electrode portion has a diameter that discontinuously expands with respect to the diameter of the second electrode portion in the housing between the opening and the circuit board ;
Between the outer peripheral surface of the first electrode portion and the inner surface of the housing facing the first electrode portion, the outer peripheral surface of the second electrode portion and the inner surface of the housing facing the second electrode portion And a sealing material interposed between the first electrode portion and the inner surface of the housing in the enlarged diameter portion from the second electrode portion to the first electrode portion ,
A biological sensor comprising:

The biosensor according to claim 1, wherein a recess is formed on the inner surface of the casing around the opening so that the first electrode portion can be accommodated.

The said 2nd electrode part has a part gradually diameter-expanded toward the said 1st electrode part in the connection part of a said 2nd electrode part and a said 1st electrode part, The Claim 2 characterized by the above-mentioned. Biosensor.

The annular groove is formed in either one of the first electrode part or the housing facing the first electrode part, and the convex part that fits into the annular groove is formed in the other. 2. The biosensor according to 2.

3. The biosensor according to claim 1, wherein unevenness is formed on at least one of a side surface of the second electrode portion and a surface of the opening facing the second electrode portion.

The biosensor according to any one of claims 1 to 5, wherein a metal spring member is interposed between the circuit board and the first electrode portion.