JP6207466B2 - Transparent resin film, transfer film, conductive film laminate, capacitive input device, and image display device - Google Patents

Description

  The present invention relates to a transparent resin film, a transfer film, a conductive film laminate, a capacitive input device, and an image display device. More specifically, a transparent resin film used to fill at least a step between the electrode pattern and the front plate of the capacitive input device capable of detecting the contact position of the finger as a change in capacitance, and the transparent resin The present invention relates to a transfer film including a film, a conductive film laminate, a capacitive input device, and an image display device including the capacitive input device as a constituent element.

  In recent years, electronic devices such as mobile phones, car navigation systems, personal computers, ticket vending machines, and bank terminals have been equipped with tablet-type input devices on the surface of liquid crystal devices and instructions displayed in the image display area of liquid crystal display devices. There is a type in which information corresponding to an instruction image can be input by touching a part where the instruction image is displayed with a finger or a touch pen while referring to the image.

Such input devices (touch panels) include a resistance film type and a capacitance type.
Capacitance type input devices are more resistant to changes in operating temperature range and changes over time than resistance film type input devices that have a two-layer structure of film and glass. Has advantages. In addition, the capacitive input device has an advantage that a light-transmitting conductive film is simply formed on a single substrate. A capacitive touch panel of a cover glass integrated type (OGS: One Glass Solution) touch panel has a front plate integrated with a capacitive input device, and thus can be reduced in thickness and weight.

  In such a capacitive touch panel, the appearance of the device has been improved by covering the sense circuit with a decorative layer. There is no restriction | limiting in particular as a decoration layer, It is known that the decoration layer of various color tone (Black, white, pastel color, metallic etc.) can be provided. In addition, when a decorative layer with a low optical density is used for design reasons, a black mask layer (shielding layer) may be laminated on the decorative layer for the purpose of securely covering the sense circuit. .

  However, when a functional layer such as a decorative layer or a mask layer (shielding layer) is provided on a part of one surface of the front panel of the capacitive touch panel, A film thickness difference from the non-formed part may occur, and problems such as disconnection of the sensor of the obtained touch panel may occur (see Patent Document 1). On the other hand, in patent document 1, in order to make the level | step difference resulting from a decoration layer small with respect to an OGS touch panel, the method of producing a dent in the glass base material of the lower part of a decoration layer is described.

  On the other hand, Patent Document 2 describes a touch panel member in which a transparent electrode layer is formed directly or indirectly on a transparent substrate, and a photosensitive siloxane resin layer is formed on the transparent electrode layer. A mode in which a conductive siloxane resin layer is used as an interlayer insulating film and / or a surface protective layer having a thickness of about 1.5 μm and a transparent electrode layer is embedded in the interlayer insulating film and / or the surface protective layer and planarized is described. ing. As a specific configuration, in FIG. 1 of Patent Document 2, a transparent resin layer is laminated as an interlayer insulating film or a surface protective layer, and a transparent electrode is provided on both surfaces of the interlayer insulating film or one surface of the surface protective layer. A configuration is disclosed. Further, it is described that the photosensitive siloxane resin layer can form an interlayer insulating film and / or a surface protective layer excellent in surface hardness and heat resistance. Patent Document 2 does not describe any use of such a photosensitive siloxane resin layer to fill a step caused by a functional layer (such as a decorative layer) other than the transparent electrode layer.

  In Patent Document 3, an image display member and a light-transmitting cover member having a light-shielding layer formed on a peripheral portion are light-transmitted through a light-transmitting cured resin layer formed from a liquid photocurable resin composition. In a manufacturing method of an image display device laminated so that a light shielding layer forming surface of a transmissive cover member is arranged on the image display member side, a liquid photocurable resin composition is formed on the light transmissive cover member. A step of applying a thickness greater than the thickness of the light-shielding layer on the side surface or the surface of the image display member so that a step formed between the light-shielding layer and the light-shielding layer-forming surface of the light-transmitting cover member is canceled; A step of forming a temporarily cured resin layer by irradiating the photocurable resin composition with ultraviolet rays to temporarily cure; a light-transmitting cover on the image display member so that the light shielding layer and the temporarily cured resin layer are inside Process of pasting materials; image table By irradiating the temporarily cured resin layer sandwiched between the member and the light-transmitting cover member with ultraviolet rays and performing main curing, the image display member and the light-transmitting cover member are bonded to the light-transmitting cured resin layer. And a manufacturing method having a step of obtaining an image display device by laminating through. In particular, in Patent Document 3, a liquid photocurable resin composition used for canceling a step formed between the light shielding layer and the light shielding layer forming side surface of the light transmissive cover member is a polyurethane (meth) acrylate or There is a description that it is preferable to contain an acrylic resin such as polyisoprene-based (meth) acrylate.

  On the other hand, in the field of protection panels for flat panel displays, for example, Patent Document 4 describes a display protection plate made of a transparent protection plate and a transparent resin that fills the difference between the printing portion and the printing portion as a method of filling the step. . In Patent Document 3, an acrylic resin is used as a transparent resin for filling the steps.

JP 2012-073726 A JP 2011-150550 A Japanese Patent Laid-Open No. 2014-081642 JP 2010-176111 A

Smartphones and tablet PCs equipped with a capacitive touch panel on a liquid crystal or organic EL display have been developed and announced using a tempered glass typified by Corning's gorilla glass on the front plate (the surface directly touched by a finger) Has been. The method described in Patent Document 1 for processing a concave mold on the glass substrate below the decorative layer is difficult to use when such a tempered glass substrate is used, and other simpler methods are required. It was done.
Tempered glass is used for the glass substrate for the touch panel, and it is difficult to break even when impact force is applied, but in the unlikely event that the glass substrate breaks, it can also maintain the function as a capacitive input device It was left as a technical issue. In particular, when the glass substrate is broken, it is difficult for the electrode pattern to be disconnected. In other words, when the capacitance type input device includes a device for storing data, it is required that the data can be taken out.

As a result of investigations by the present inventors, an acrylic resin or a photosensitive siloxane resin is used for such a tempered glass substrate (hereinafter also referred to as “front plate”), transfer using a transfer film, liquid resist coating, screen printing, etc. It was found that a decorative layer having a tapered gentle slope at the end can be formed by forming a decorative layer. Moreover, in order to improve the concealing power of the transparent electrode pattern provided on the decorative layer, it was found that it is necessary to provide a thickness of 5 μm or more depending on the color of the decorative layer. Here, a functional layer such as a decorative layer on a part of the front plate, that is, a step having a gentle slope at the end and having a thickness of 5 μm or more (in other words, the front plate A transparent electrode pattern such as ITO is provided even if it has unevenness on one side of the front plate due to the functional layer such as a decorative layer being arranged on a part of one side Even so, it was expected that the disconnection of the transparent electrode pattern due to the step would not occur. However, when the present inventors examined, contrary to the above-mentioned expectation, a functional layer such as a decorative layer having a taper-shaped gentle slope at the end and a thickness of 5 μm or more is formed on a part of the front plate. Even if the end of the functional layer such as the decorative layer has a tapered gentle slope, the other on the step (the side of the front plate where the decorative layer is formed) It was found that the problem of disconnection of the transparent electrode pattern provided on the level difference occurred when the members were laminated.
Moreover, the method of embedding and transparentizing the transparent electrode layer described in Patent Document 2 in an interlayer insulating film and / or a surface protective layer of about 1.5 μm can be applied to a decorative layer having a thickness exceeding 5 μm. No assumption was made, and no disclosure or suggestion was made about filling a step having a thickness exceeding 5 μm.

  Here, using the acrylic resin described in Patent Document 3 and the transparent resin described in Patent Document 4 in the field of flat panel display protection plates, the present inventors made a step caused by the decorative layer of the OGS touch panel. As a result of examining the filling, the OGS touch panel is heated in the process for preparing the transparent electrode pattern. However, the transparent resin using the acrylic binder described in Patent Documents 3 and 4 has the above process. It has been found that improvement in transparency is required when the steps of the OGS touch panel are filled, because the heat yellows due to heating. That is, it has been found that there is a problem in that the transparency of the transparent resin film used to fill the step caused by the decorative layer of the OGS touch panel is lowered. Further, it has been found that further improvement is required for the disconnection of the electrode pattern when the front plate of the capacitive input device is cracked.

  The problem to be solved by the present invention includes a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. Capacitance-type input device having at least a step between the electrode pattern and the front plate can be filled, transparency is high, and disconnection of the electrode pattern during the manufacture of the capacitance-type input device can be suppressed. It is providing the transparent resin film which can suppress the disconnection of the electrode pattern when the front board of a type | mold input device is cracked.

  The present inventors reduced transparency by using a transparent resin film having a specific range of thickness including a silicone resin and a catalyst to fill a step caused by a functional layer such as a decorative layer of an OGS touch panel. Can provide a flat surface with reduced steps in the decorative layer, smooth the steps and reduce the risk of breakage of electrode patterns such as ITO, and even when the front panel of the touch panel is broken As a result, the inventors have found that the disconnection can be effectively prevented and have reached the present invention.

The present invention, which is a specific means for solving the above problems, is as follows.
[1] A transparent resin film containing at least a silicone resin and a catalyst and having a thickness of 5 to 300 μm,
An electrostatic capacitance type in which the transparent resin film has a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate A transparent resin film used to fill at least a step between the electrode pattern and the front plate of the input device.
[2] In the transparent resin film according to [1], the content of the catalyst is preferably 0.5 to 5.0% by mass with respect to the content of the silicone resin.
[3] The transparent resin film according to [1] or [2] preferably includes at least an acrylic-modified silicone resin or a polyester-modified silicone resin as a silicone resin, or a silicone resin containing these as a copolymerization component.
[4] The transparent resin film according to any one of [1] to [3] preferably has a transparent resin film thickness of 10 to 300 μm.
[5] The transparent resin film according to any one of [1] to [4] is preferably manufactured by a coating method.
[6] a temporary support;
A transfer film comprising the transparent resin film according to any one of [1] to [5].
[7] A transparent front plate;
A functional layer disposed on a part of one surface of the front plate;
Having an electrode pattern disposed on the same side as the functional layer of the front plate,
The electrically conductive film laminated body which has a transparent resin film as described in any one of [1]-[5] so that the level | step difference between an electrode pattern and a front plate may be filled at least.
[8] In the conductive film laminate according to [7], the transparent resin film fills at least a step between the electrode pattern and the front plate with the transparent resin film included in the transfer film according to [6]. It is preferably formed by transferring.
[9] In the conductive film laminate according to [7] or [8], the thickness of the functional layer is preferably 5 μm or more.
[10] In the conductive film laminate according to any one of [7] to [9], a transparent protective layer is provided on a surface of the transparent resin film, the functional layer, and the electrode pattern opposite to the front plate. It is preferable to include.
[11] In the conductive film laminate according to any one of [7] to [10], the transparent resin film is heated to 180 to 300 ° C. in an environment of 0.08 to 1.2 atm. Is preferred.
[12] In the conductive film laminate according to any one of [7] to [11], the electrode pattern preferably includes the following (1) to (3);
(1) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction through connection portions;
(2) A plurality of second electrode patterns comprising a plurality of pad portions that are electrically insulated from the first transparent electrode pattern and extend in a direction crossing the first direction;
(3) An insulating layer that electrically insulates the first transparent electrode pattern from the second electrode pattern.
[13] The conductive film laminate according to [12] is further (4) electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern, It is preferable to have a conductive element different from the second electrode pattern.
[14] In the conductive film laminate according to [12] or [13], (2) the second electrode pattern is preferably a transparent electrode pattern.
[15] In the conductive film laminate according to any one of [7] to [14], the end portion of the functional layer preferably has a tapered shape.
[16] In the conductive film laminate according to any one of [7] to [15], the end portion of the transparent resin film is on at least a part of the surface of the functional layer opposite to the front plate. Preferably it is arranged.
[17] In the conductive film laminate according to any one of [7] to [16], the functional layer is preferably a decorative layer.
[18] In the conductive film laminate according to [17], it is preferable that the step between the front plate and the decorative layer is filled with a transparent resin film.
[19] A capacitance-type input device including the conductive film laminate according to any one of [7] to [18].
[20] An image display device comprising the capacitive input device according to [19] as a constituent element.

  According to the present invention, a capacitance having a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. The gap between at least the electrode pattern and the front plate of the mold input device can be filled, the transparency is high, and the disconnection of the electrode pattern at the time of manufacturing the capacitive input device can be suppressed. A transparent resin film that can suppress disconnection of the electrode pattern when the front plate is broken can be provided.

1 is a schematic cross-sectional view showing a configuration of an example of a capacitive input device of the present invention. It is explanatory drawing which shows an example of the front plate in this invention. It is explanatory drawing which shows an example of the 1st transparent electrode pattern in this invention, and a 2nd transparent electrode pattern. It is a top view which shows an example of the tempered glass in which the opening part was formed. It is a top view which shows an example of the front board in which the decoration layer was formed. It is a top view which shows an example of the front plate in which the 1st transparent electrode pattern was formed. It is a top view which shows an example of the front plate in which the 1st and 2nd transparent electrode pattern was formed. It is a top view which shows an example of the front plate in which the electroconductive element different from a black decorating layer and the 1st and 2nd transparent electrode pattern was formed. It is explanatory drawing which shows a metal nanowire cross section. It is the schematic which shows the shape after die-cutting of the transfer film used in order to form a decorating layer. It is explanatory drawing which shows the method of die-cutting the transfer film used in order to form a decorating layer. It is explanatory drawing which shows the die-cutting method of the transfer film used in order to form a decoration layer in the X1-X2 cross section of a front plate. It is explanatory drawing which shows the die cutting method of the transfer film used in order to form a decorating layer in the Y1-Y2 cross section of a front plate. It is a cross-sectional schematic diagram which shows the structure of another example of the electrostatic capacitance type input device of this invention. It is a cross-sectional schematic diagram which shows the structure of another example of the electrostatic capacitance type input device of this invention. It is a cross-sectional schematic diagram which shows the structure of another example of the electrostatic capacitance type input device of this invention. It is the schematic diagram of the cross-sectional shape created based on the cross-sectional shape observed by SEM of the structure as another example of the capacitive input device of the present invention. It is a top view of the structure of another example of the capacitive input device of the present invention. FIG. 19 is a schematic cross-sectional view of the configuration of the capacitive input device of FIG. 18.

Hereinafter, the transparent resin film, transfer film, conductive film laminate, capacitance-type input device and image display device of the present invention will be described.
The description of the constituent elements described below may be made based on typical embodiments of the present invention, but the present invention is not limited to such embodiments. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.

[Transparent resin film]
The transparent resin film of the present invention is a transparent resin film containing at least a silicone resin and a catalyst and having a thickness of 5 to 300 μm. The transparent resin film is formed of a transparent front plate and one surface of the front plate. In order to fill at least a step between the electrode pattern and the front plate of the capacitive input device having a functional layer arranged in part and an electrode pattern arranged on the same side as the functional layer of the front plate Used.
With such a configuration, the transparent resin film of the present invention has a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode disposed on the same surface side as the functional layer of the front plate. The gap between at least the electrode pattern and the front plate of the capacitive input device having a pattern can be filled, the transparency is high, and the disconnection of the electrode pattern at the time of manufacturing the capacitive input device can be suppressed, It is possible to suppress disconnection of the electrode pattern when the front plate of the capacitive input device is broken.
By filling at least the step between the electrode pattern and the front plate with the transparent resin film, the step can be smoothed, and disconnection of the electrode pattern at the time of manufacturing the capacitive input device can be suppressed.
When the transparent resin film contains a catalyst, not only the disconnection at the time of manufacturing the capacitive input device (especially when forming the transparent electrode), but also when the front plate of the capacitive input device is cracked (particularly the substrate is dropped The disconnection of the transparent electrode pattern can also be prevented. Without being bound by any theory, if a transparent electrode pattern is placed on the transparent resin film (not directly on the front plate), which has a certain degree of hardness by adding a catalyst, the front plate This is considered to be a mechanism by which the influence on the transparent electrode pattern can be reduced when the is damaged.
Further, in comparison with the transparent resin film containing acrylic resin used for step filling in Japanese Patent Application Laid-Open No. 2014-081642, in the present invention, the transparent resin film contains a silicone resin and contains a catalyst. Transparency and the effect of preventing disconnection when the front plate of the capacitive input device is broken (particularly when the substrate is dropped).

In the transparent resin film, the conductive film laminate, the capacitive input device, and the image display device described in Japanese Patent Application No. 2014-010993, the electrode pattern is located on the surface of the transparent resin film on the front plate (support) side. The transparent resin film may be on the side opposite to the front plate (support) of the transparent resin film, and some transparent electrodes are on the front plate (support) side of the transparent resin film, A configuration in which the remaining part is on the surface opposite to the support of the transparent resin film was also included.
On the other hand, in this invention, the transparent electrode pattern is arrange | positioned on the transparent resin film, and the layer structure is limited.

In addition, in order to prevent glass fragments from being scattered even if the glass substrate is broken, a resin film having a scattering prevention function may be laminated, as disclosed in JP 2012-073726 A and JP 2011-150550 A. In Japanese Patent Laid-Open No. 2014-081642 and the like, it has been left as a technical problem.
By adopting the configuration of the present invention, the transparent resin film having appropriate hardness and toughness is protected by the presence of the transparent resin film at least between the electrode pattern and the front plate, and the transparent electrode layer that is easily cut is protected. It is preferable that the mechanism can prevent glass fragments from being scattered even when the glass substrate is broken.

The transparent resin film of the present invention may be in a state where the fluidity is maintained, may be in a state where the fluidity is lost, or may be in a cured or fixed state.
The transparent resin film of the present invention has a transparent front plate, a decorative layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on one surface side of the front plate. In the case where the capacitance type input device is formed from a transparent resist solution for filling at least a step between the electrode pattern and the front plate, the transparent resist solution in a state of maintaining fluidity is used as the transparent resin of the present invention. A film obtained by drying the transparent resist solution to lose fluidity can also be referred to as the transparent resin film of the present invention.
Moreover, when using the transparent resin film of this invention for the transfer film of this invention mentioned later, the coating liquid for transparent resin film formation of this invention is apply | coated on a temporary support etc. which are mentioned later, it dries, and a dry film and In this case, the transparent resin film in the transfer film of the present invention can also be referred to as the transparent resin film of the present invention.
Further, using the transparent resin film of the present invention, a transparent front plate, a decorative layer arranged on a part of one surface of the front plate, and an electrode arranged on one surface side of the front plate A transparent resin film cured by irradiation of actinic radiation after filling at least a step between the electrode pattern and the front plate of the capacitive input device having a pattern can also be referred to as the transparent resin film of the present invention. .

Here, a capacitance-type input device having a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. There is no particular limitation on the level difference between at least the electrode pattern and the front plate.
At least the step between the electrode pattern and the front plate is “step between the front plate and the functional layer”. When the third layer is provided on the step formed by the front plate and the functional layer, the front plate and the functional layer For example, a step remaining when the step due to the surface is not filled with the third layer can be given.
In the present invention, a capacitive input having a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. The functional layer of the device is preferably a decorative layer, and in this case, at least the step between the electrode pattern and the front plate is more preferably “the step between the front plate and the decorative layer”.

(composition)
-Silicone resin-
Known silicone resins can be used for the transparent resin film of the present invention.
Silicone resin is a straight resin that utilizes the inherent properties of silicone by dehydrating and condensing a modified silicone resin with various properties and a silane compound having an alkoxy group or silanol group. It can be classified as a silicone resin. In the transparent resin film and transfer film of the present invention, the silicone resin is preferably a modified silicone resin or a straight silicone resin, and particularly preferably a modified silicone resin.

  Examples of modified silicone resins include acrylic-modified silicone resins (such as KR-9706 manufactured by Shin-Etsu Chemical Co., Ltd.), polyesters obtained by polymerizing or copolymerizing monomers obtained by reacting acrylic monomers such as acrylic acid with silane compounds, and other acrylic monomers. Modified silicone resin (such as KR-5230, manufactured by Shin-Etsu Chemical Co., Ltd.), an epoxy resin-modified silicone resin obtained by reacting an epoxy-containing silane compound with an amino group residue of the resin, and alkyd An alkyd resin-modified silicone resin obtained by modifying a resin with a reactive silane compound, a rubber-based silicone resin that directly forms a covalent bond with a resin using an oxime initiator, and the like can be used. Among them, acrylic modified polyester resin or polyester modified silicone resin, or including a silicone resin containing these as a copolymer component is more transparent when the front plate of the capacitive input device is broken (particularly when dropped). It is preferable from the viewpoint that the disconnection of the electrode pattern can be more effectively prevented.

As the straight silicone resin, one containing at least a siloxane structure represented by the following general formula (1) in the molecule can be used.

In general formula (1), R ¹ is independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, a linear or branched structure having 1 to 20 carbon atoms. Or a cyclic alkyl group, a linear, branched or cyclic substituted alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms, an aryl having 6 to 20 carbon atoms A group or an aralkyl group having 7 to 20 carbon atoms, and a plurality of R ¹ may be the same or different. That is, the straight silicone resin having a siloxane structure represented by the general formula (1) may be a condensate having the same siloxane structure or a co-condensate having a different combination.

Examples of the halogen atom represented by R ¹ include a fluorine atom and a chlorine atom.
Examples of the linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms represented by R ¹ include a methoxy group, an ethoxy group, an n-propoxy group, an i-propoxy group, an n-butoxy group and an i-butoxy group. Group, sec-butoxy group, t-butoxy group, n-pentyloxy group, n-hexyloxy group, cyclopentyloxy group, cyclohexyloxy group and the like.
Examples of the linear, branched or cyclic alkyl group having 1 to 20 carbon atoms represented by R ¹ include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, and an i-butyl group. Group, sec-butyl group, t-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group and the like. Among the linear, branched or cyclic alkyl groups having 1 to 20 carbon atoms represented by R ¹ , an alkyl group having 1 to 3 carbon atoms is preferable, and a methyl group is more preferable.
Examples of the linear, branched, or cyclic substituted alkyl group having 1 to 20 carbon atoms represented by R ¹ include an arylalkyl group, a fluoroalkyl group, a chloroalkyl group, a hydroxyalkyl group, and a (meth) acryloxyalkyl group. Groups and mercaptoalkyl groups. Specific examples thereof include, for example, phenylmethyl (benzyl) group, diphenylmethyl group, 1-phenylethyl group, 2-phenylethyl group, 1-phenyl-n-propyl group, 2-phenyl-2-propyl (cumyl ) Group, 3-phenyl-n-propyl group, 1-phenylbutyl group, 2-phenylbutyl group, 3-phenylbutyl group, 4-phenylbutyl group, 1-phenylpentyl group, 2-phenylpentyl group, 3- Phenylpentyl group, 4-phenylpentyl group, 5-phenylpentyl group, 1-phenylhexyl group, 2-phenylhexyl group, 3-phenylhexyl group, 4-phenylhexyl group, 5-phenylhexyl group, 6-phenylhexyl Group, 1-phenylcyclohexyl group, 2-phenylcyclohexyl group, 3-phenylcyclohexyl group 1-phenylheptyl group, 2-phenylheptyl group, 3-phenylheptyl group, 4-phenylheptyl group, 5-phenylheptyl group, 6-phenylheptyl group, 1-phenyloctyl group, 2-phenyloctyl group, 3- Phenyloctyl group, 4-phenyloctyl group, 5-phenyloctyl group, 6-phenyloctyl group, 1-naphthylethyl group, 2-naphthylethyl group, 1-naphthyl-n-propyl group, 2-naphthyl-2-propyl group Group, 3-naphthyl-n-propyl group, 1-naphthylbutyl group, 2-naphthylbutyl group, 3-naphthylbutyl group, 4-naphthylbutyl group, 1-naphthylpentyl group, 2-naphthylpentyl group, 3-naphthyl Pentyl group, 4-naphthylpentyl group, 5-naphthylpentyl group, 1-naphthylhexyl group, 2-naphthyl Hexyl group, 3-naphthylhexyl group, 4-naphthylhexyl group, 5-naphthylhexyl group, 6-naphthylhexyl group, 1-naphthylcyclohexyl group, 2-naphthylcyclohexyl group, 3-naphthylcyclohexyl group, 1-naphthylheptyl group 2-naphthylheptyl group, 3-naphthylheptyl group, 4-naphthylheptyl group, 5-naphthylheptyl group, 6-naphthylheptyl group, 1-naphthyloctyl group, 2-naphthyloctyl group, 3-naphthyloctyl group, 4 -Arylalkyl groups such as naphthyloctyl group, 5-naphthyloctyl group, 6-naphthyloctyl group; fluoromethyl group, trifluoromethyl group, 2-fluoroethyl group, (trifluoromethyl) methyl group, pentafluoroethyl group , 3-fluoro-n-propyl group, 2- ( (Trifluoromethyl) ethyl group, (pentafluoroethyl) methyl group, heptafluoro-n-propyl group, 4-fluoro-n-butyl group, 3- (trifluoromethyl) -n-propyl group, 2- (pentafluoro Ethyl) ethyl group, (heptafluoro-n-propyl) methyl group, nonafluoro-n-butyl group, 5-fluoro-n-pentyl group, 4- (trifluoromethyl) -n-butyl group, 3- (pentafluoro) Ethyl) -n-propyl group, 2- (heptafluoro-n-propyl) ethyl group, (nonafluoro-n-butyl) methyl group, perfluoro-n-pentyl group, 6-fluoro-n-hexyl group, 5- (Trifluoromethyl) -n-pentyl group, 4- (pentafluoroethyl) -n-butyl group, 3- (heptafluoro-n-propyl) -n Propyl group, 2- (nonafluoro-n-butyl) ethyl group, (perfluoro-n-pentyl) methyl group, perfluoro-n-hexyl group, 7- (trifluoromethyl) -n-heptyl group, 6- ( Pentafluoroethyl) -n-hexyl group, 5- (heptafluoro-n-propyl) -n-pentyl group, 4- (nonafluoro-n-butyl) -n-butyl group, 3- (perfluoro-n-pentyl) ) -N-propyl group, 2- (perfluoro-n-hexyl) ethyl group, (perfluoro-n-heptyl) methyl group, perfluoro-n-octyl group, 9- (trifluoromethyl) -n-nonyl Group, 8- (pentafluoroethyl) -n-octyl group, 7- (heptafluoro-n-propyl) -n-heptyl group, 6- (nonafluoro-n-butyl) -n-he Sil group, 5- (perfluoro-n-pentyl) -n-pentyl group, 4- (perfluoro-n-hexyl) -n-butyl group, 3- (perfluoro-n-heptyl) -n-propyl group , Fluoroalkyl groups such as 2- (perfluoro-n-octyl) ethyl group, (perfluoro-n-nonyl) methyl group, perfluoro-n-decyl group, 4-fluorocyclopentyl group, 4-fluorocyclohexyl group; Chloromethyl group, 2-chloroethyl group, 3-chloro-n-propyl group, 4-chloro-n-butyl group, 3-chlorocyclopentyl group, 4-chlorocyclohexyl group, hydroxymethyl group, 2-hydroxyethyl group, 3-hydroxycyclopentyl group, 4-hydroxycyclohexyl group, 3- (meth) acryloxypropyl group, 3-mercapto A propyl group etc. can be mentioned.
Examples of the linear, branched or cyclic alkenyl group having 2 to 20 carbon atoms represented by R ¹ include a vinyl group, a 1-methylvinyl group, a 1-propenyl group, and an allyl group (2-propenyl group). 2-methyl-2-propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 3-cyclopentenyl group, 3-cyclohexenyl group, and the like. Among the linear, branched or cyclic substituted alkyl groups having 1 to 20 carbon atoms represented by R ¹ , arylalkyl groups are preferable, and cumyl groups are more preferable.
Examples of the aryl group having 6 to 20 carbon atoms represented by R ¹ include a phenyl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, a 2,3-xylyl group, and a 2,4-xylyl group. 2,5-xylyl group, 2,6-xylyl group, 3,4-xylyl group, 3,5-xylyl group, 1-naphthyl group, and the like. Among the aryl groups having 6 to 20 carbon atoms represented by R ¹ , other than an unsubstituted phenyl group, that is, an o-tolyl group, an m-tolyl group, a p-tolyl group, , 3-xylyl group, 2,4-xylyl group, 2,5-xylyl group, 2,6-xylyl group, 3,4-xylyl group, 3,5-xylyl group, 1-naphthyl group are preferable, o- A tolyl group, m-tolyl group, and p-tolyl group are more preferable.
Examples of the aralkyl group having 7 to 20 carbon atoms represented by R ¹ include a benzyl group and a phenethyl group.

In the general formula (1), R ¹ is independently a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic group having 1 to 6 carbon atoms. Is preferably a substituted alkyl group or an aryl group having 6 to 9 carbon atoms, and more preferably represents a hydrogen atom, a methyl group, a phenyl group or a tolyl group.
The siloxane structure represented by the general formula (1) preferably contains a methyl group as R ¹ from the viewpoint of particularly enhancing the L value of the decorative layer.

The straight silicone resin includes two or more general formulas (1) in which R ¹ are different from each other
It is also preferable that it is a copolymer of the siloxane structure represented by these. In this case, the siloxane structure represented by the general formula (1) in which R ¹ is an alkyl group and the siloxane structure represented by the general formula (1) in which R ¹ is a hydrogen atom, a substituted alkyl group, or an aryl group. And a copolymer thereof. The copolymerization ratio is not particularly limited, but the siloxane structure represented by the general formula (1) in which R ¹ is an alkyl group is 50 to 50% of the siloxane structure represented by the general formula (1). It is preferably 100 mol%, more preferably 60 to 100 mol%, and particularly preferably 70 to 100 mol%.

一般式（２）中、Ｒ²は上記一般式（１）のＲ¹と同様のものが使用できる同義であり、好ましい範囲もＲ¹と同様である。 As a straight silicone resin used in the present invention, a siloxane structure comprising a co-condensation with a siloxane structure represented by the following general formula (2) in addition to the siloxane structure represented by the general formula (1) in the molecule. The thing containing this can also be used preferably.

In general formula (2), R ² has the same meaning as that used for R ^{1 in} general formula (1), and the preferred range is also the same as R ¹ .

Specific examples of straight silicone resins include alkyl straight silicones prepared from the condensation of silane compounds having an alkyl group having 1 to 20 carbon atoms and an alkoxy group (methyl straight silicones, etc.), alkyl aryls such as methylphenyl, etc. Straight silicone, aryl straight silicone such as phenyl, and hydrogen straight silicone such as methyl hydrogen can be used.
More preferred are methyl-based straight silicone resins, methyl-tolyl-based straight silicone resins, methyl-phenyl-based straight silicone resins, acrylic resin-modified silicone resins, methyl-hydrogen-based straight silicone resins, and hydrogen-hydrogen-based straight silicone resins. From the viewpoint of preventing the decrease in lightness without generating benzene, methyl straight silicone resin, methyl tolyl straight silicone resin, methyl hydrogen straight silicone resin, and hydrogen tol straight silicone resin are particularly preferable.
These silicone resins may be used alone or in combination of two or more, and the film properties can be controlled by mixing them at an arbitrary ratio.

  The weight average molecular weight of the silicone resin is preferably 1,000 to 5,000,000, more preferably 2,000 to 3,000,000, and 2,500 to 3,000,000. Is particularly preferred. When the molecular weight is 1,000 or more, the film forming property is good.

The weight average molecular weight in this specification can be measured, for example, by gel permeation chromatography (GPC). Specifically, it can be measured under the following conditions.
Column: GPC column TSKgelSuper HZM-H (manufactured by Tosoh Corporation)
・ Solvent: Tetrahydrofuran ・ Standard: Monodisperse polystyrene

As a silane compound used to prepare a modified silicone resin and a straight silicone resin,
Tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, tetraisobutoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriacetoxysilane, methyltributoxysilane, Ethyltrimethoxysilane, ethyltriethoxysilane, isobutyltrimethoxysilane, propyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxyethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriacetoxysilane , Cumyltrimethoxysilane, tolyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, γ-methacryloxypropi Trimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxy Silane, N-β (aminoethyl) -γ-aminopropyltriethoxysilane, β-cyanoethyltriethoxysilane, methyltriphenoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, α-glycid Xylethyltrimethoxysilane, α-glycidoxyethyltriethoxysilane, β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, α-glycidoxypropyltrimethoxysilane, α-glycidoxypro Pyrtriethoxysilane, β-glycidoxypropyltrimethoxysilane, β-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxy Propyltripropoxysilane, γ-glycidoxypropyltributoxysilane, γ-glycidoxypropyltrimethoxyethoxysilane, γ-glycidoxypropyltriphenoxysilane, α-glycidoxybutyltrimethoxysilane, α-glycid Xylbutyltriethoxysilane, β-glycidoxybutyltrimethoxysilane, β-glycidoxybutyltriethoxysilane, γ-glycidoxybutyltrimethoxysilane, γ-glycidoxybutyltriethoxysilane, δ-glycid Xibutyltrimethoxy , Δ-glycidoxybutyltriethoxysilane, (3,4-epoxycyclohexyl) methyltrimethoxysilane, (3,4-epoxycyclohexyl) methyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltri Methoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltripropoxysilane, β- (3,4-epoxycyclohexyl) ethyltributoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriphenoxysilane, γ- (3,4-epoxycyclohexyl) propyltrimethoxysilane, γ- (3,4 Epoxycyclohexyl) propyltri Trialkoxy such as toxisilane, δ- (3,4-epoxycyclohexyl) butyltriethoxysilane, triacyloxy or triphenoxysilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, dimethyldiacetoxysilane, γ-methacryloxypropyl Methyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-mercaptopropylmethyldimethyldimethoxysilane, γ-mercaptopropyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, vinylmethyl Dimethoxysilane, vinylmethyldiethoxysilane, glycidoxymethyldimethoxysilane, glycidoxymethyldiethoxysilane, α-glycidoxyethylme Rudimethoxysilane, α-glycidoxyethyldiethoxysilane, β-glycidoxyethylmethyldimethoxysilane, β-glycidoxyethylmethyldiethoxysilane, α-glycidoxypropylmethyldimethoxysilane, α-glycidoxy Propylmethyldiethoxysilane, β-glycidoxypropylmethyldimethoxysilane, β-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ- Glycidoxypropylmethyldipropoxysilane, γ-glycidoxypropylmethyldibutoxysilane, γ-glycidoxypropylmethyldimethoxyethoxysilane, γ-glycidoxypropylmethyldiphenoxysilane, γ-glycidoxypropylethyl Methoxysilane, γ-glycidoxypropylethyldiethoxysilane, γ-glycidoxypropylethyldipropoxysilane, γ-glycidoxypropylvinyldimethoxysilane, γ-glycidoxypropylvinyldiethoxysilane, γ-glycid Alkoxysilanes or diacyloxysilanes such as xylpropylphenyldimethoxysilane, γ-glycidoxypropylphenyldiethoxysilane, dimethoxymethylsilane, trimethoxysilane, dimethylethoxysilane, diacetoxymethylsilane, diethoxymethylsilane, diethylmethyl Silane, triethylsilane, butyldimethylsilane, dimethylphenylsilane, methylphenylvinylsilane, diphenylmethylsilane, tripropylsilane, tripentyloxysilane, Nylsilane, trihexylsilane, diethylsilane, allyldimethylsilane, methylphenylsilane, diphenylsilane, phenylsilane, octylsilane, 1,4-bis (dimethylsilyl) benzene, and 1,1,3,3-tetramethyldisiloxane , Dimethyltolylsilane, methyltolylvinylsilane, ditolylmethylsilane, tolylylsilane, dimethylbenzylsilane, methylbenzylvinylsilane, dibenzylmethylsilane, tribenzylsilane, diphenylsilane, 2-chloroethylsilane, bis [(p-dimethyl Silyl) phenyl] ether, 1,4-dimethyldisilylethane, 1,3,5-tris (dimethylsilyl) benzene, 1,3,5-trimethyl-1,3,5-trisilane, poly (methylsilylene) phenylene ,as well as Poly (methylsilylene) methylene, tetrachlorosilane, trichlorosilane, triethoxysilane, tri-n-propoxysilane, tri-i-propoxysilane, tri-n-butoxysilane, tri-sec-butoxysilane, fluorotrichlorosilane, fluoro Trimethoxysilane, fluorotriethoxysilane, fluorotri-n-propoxysilane, fluorotri-i-propoxysilane, fluorotri-n-butoxysilane, fluorotri-sec-butoxysilane, methyltrichlorosilane, methyltri-n-propoxy Silane, methyltri-i-propoxysilane, methyltri-n-butoxysilane, methyltri-sec-butoxysilane, 2- (trifluoromethyl) ethyltrichlorosilane, 2- (trifluoromethyl) Tiltrimethoxysilane, 2- (trifluoromethyl) ethyltriethoxysilane, 2- (trifluoromethyl) ethyltri-n-propoxysilane, 2- (trifluoromethyl) ethyltri-i-propoxysilane, 2- (trifluoro Methyl) ethyltri-n-butoxysilane, 2- (trifluoromethyl) ethyltri-sec-butoxysilane, 2- (perfluoro-n-hexyl) ethyltrichlorosilane, 2- (perfluoro-n-hexyl) ethyltrimethoxy Silane, 2- (perfluoro-n-hexyl) ethyltriethoxysilane, 2- (perfluoro-n-hexyl) ethyltri-n-propoxysilane, 2- (perfluoro-n-hexyl) ethyltri-i-propoxysilane , 2- (perfluoro-n-hexyl) Tiltly-n-butoxysilane, 2- (perfluoro-n-hexyl) ethyltri-sec-butoxysilane, 2- (perfluoro-n-octyl) ethyltrichlorosilane, 2- (perfluoro-n-octyl) ethyltri Methoxysilane, 2- (perfluoro-n-octyl) ethyltriethoxysilane, 2- (perfluoro-n-octyl) ethyltri-n-propoxysilane, 2- (perfluoro-n-octyl) ethyltri-i-propoxy Silane, 2- (perfluoro-n-octyl) ethyltri-n-butoxysilane, 2- (perfluoro-n-octyl) ethyltri-sec-butoxysilane, hydroxymethyltrichlorosilane, hydroxymethyltrimethoxysilane, hydroxyethyltri Methoxysilane, hydroxy Methyltri-n-propoxysilane, hydroxymethyltri-i-propoxysilane, hydroxymethyltri-n-butoxysilane, hydroxymethyltri-sec-butoxysilane, 3- (meth) acryloxypropyltrichlorosilane, 3- (meth) Acryloxypropyltrimethoxysilane, 3- (meth) acryloxypropyltriethoxysilane, 3- (meth) acryloxypropyltri-n-propoxysilane, 3- (meth) acryloxypropyltri-i-propoxysilane, 3 -(Meth) acryloxypropyltri-n-butoxysilane, 3- (meth) acryloxypropyltri-sec-butoxysilane, 3-mercaptopropyltrichlorosilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylto Ethoxysilane, 3-mercaptopropyltri-n-propoxysilane, 3-mercaptopropyltri-i-propoxysilane, 3-mercaptopropyltri-n-butoxysilane, 3-mercaptopropyltri-sec-butoxysilane, vinyltrichlorosilane Vinyltri-n-propoxysilane, vinyltri-i-propoxysilane, vinyltri-n-butoxysilane, vinyltri-sec-butoxysilane, allyltrichlorosilane, allyltrimethoxysilane, allyltriethoxysilane, allyltri-n-propoxysilane, Allyltri-i-propoxysilane, allyltri-n-butoxysilane, allyltri-sec-butoxysilane, phenyltrichlorosilane, phenyltri-n-propoxysilane, phenyltri- -Propoxysilane, phenyltri-n-butoxysilane, phenyltri-sec-butoxysilane, methyldichlorosilane, methyldiethoxysilane, methyldi-n-propoxysilane, methyldi-i-propoxysilane, methyldi-n-butoxysilane, Methyldi-sec-butoxysilane, dimethyldichlorosilane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldi-n-propoxysilane, dimethyldi-i-propoxysilane, dimethyldi-n-butoxysilane, dimethyldi-sec-butoxysilane, (methyl ) [2- (perfluoro-n-octyl) ethyl] dichlorosilane, (methyl) [2- (perfluoro-n-octyl) ethyl] dimethoxysilane, (methyl) [2- (perfluoro-n-octyl) Ethyl] dimethoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-n-propoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-i-propoxy Silane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-n-butoxysilane, (methyl) [2- (perfluoro-n-octyl) ethyl] di-sec-butoxysilane, (methyl ) (Γ-glycidoxypropyl) dichlorosilane, (methyl) (γ-glycidoxypropyl) dimethoxysilane, (methyl) (γ-glycidoxypropyl) diethoxysilane, (methyl) (γ-glycidoxy Propyl) di-n-propoxysilane, (methyl) (γ-glycidoxypropyl) di-i-propoxysilane, (methyl) (γ-glycidoxy Propyl) di -n- butoxysilane, (methyl) (.gamma.-glycidoxypropyl) di -sec- butoxysilane, (methyl) (3-mercaptopropyl) dichlorosilane, (methyl) (3-mercaptopropyl)
Dimethoxysilane, (methyl) (3-mercaptopropyl) diethoxysilane, (methyl) (3-mercaptopropyl) di-n-propoxysilane, (methyl) (3-mercaptopropyl) di-i-propoxysilane, (methyl ) (3-mercaptopropyl) di-n-butoxysilane, (methyl) (3-mercaptopropyl) di-sec-butoxysilane, (methyl) (vinyl) dichlorosilane, (methyl) (vinyl) dimethoxysilane, (methyl ) (Vinyl) diethoxysilane, (methyl) (vinyl) di-n-propoxysilane, (methyl) (vinyl) di-i-propoxysilane, (methyl) (vinyl) di-n-butoxysilane, (methyl) (Vinyl) di-sec-butoxysilane, divinyldichlorosilane, divinyldimethoxysilane, Vinyldiethoxysilane, divinyldi-n-propoxysilane, divinyldi-i-propoxysilane, divinyldi-n-butoxysilane, divinyldi-sec-butoxysilane, diphenyldichlorosilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldi-n -Propoxysilane, diphenyldi-i-propoxysilane, diphenyldi-n-butoxysilane, diphenyldi-sec-butoxysilane, chlorodimethylsilane, methoxydimethylsilane, ethoxydimethylsilane, chlorotrimethylsilane, bromotrimethylsilane, iodo Trimethylsilane, methoxytrimethylsilane, ethoxytrimethylsilane, n-propoxytrimethylsilane, i-propoxytrimethylsilane, n-butoxytrime Silane, sec-butoxytrimethylsilane, t-butoxytrimethylsilane, (chloro) (vinyl) dimethylsilane, (methoxy) (vinyl) dimethylsilane, (ethoxy) (vinyl) dimethylsilane, (chloro) (methyl) diphenylsilane, (Methoxy) (methyl) diphenylsilane, (ethoxy) (methyl) diphenylsilane and the like can be exemplified. However, the present invention is not limited to these specific examples.

Commercially available silicone resins such as modified silicone resins and straight silicone resins can be used. In the product name, for example,
KC-89, KC-89S, X-21-3153, X-21-5841, X-21-5842, X-21-5842, X-21-5844, X-21-5845, X-21-5845, X-21-5847, X-21-5848, X-22-160AS, X-22-170B, X-22-170BX, X-22-170D, X-22-170DX, X-22-176B, X- 22-176D, X-22-176DX, X-22-176F, X-40-2308, X-40-2651, X-40-2655A, X-40-2671, X-40-2672, X-40- 9220, X-40-9225, X-40-9226, X-40-9227, X-40-9246, X-40-9247, X-40-9250, X-40-9323, X-40- 460M, X-41-1053, X-41-1056, X-41-1805, X-41-1810, KF6001, KF6002, KF6003, KR-212, KR-213, KR-217, KR-220, KR- 240, KR-242A, KR-271, KR-282, KR-300, KR-311, KR-400, KR-251, KR-253, KR-255, KR-401N, KR-500, KR-510, KR-5206, KR-5230, KR-5235, KR-9218, KR-9706, KR-165 (above, Shin-Etsu Chemical Co., Ltd.);
SH804, SH805, SH806A, SH840, SR2400, SR2402, SR2405, SR2406, SR2410, SR2411, SR2416, SR2420 (above, Toray Dow Corning);
YR3187, YR3370, TSR127B (Momentive Performance Materials Japan GK)
FZ3711, FZ3722 (above, Nippon Unicar Company);
DMS-S12, DMS-S15, DMS-S21, DMS-S27, DMS-S31, DMS-S32, DMS-S33, DMS-S35, DMS-S38, DMS-S42, DMS-S45, DMS-S51, DMS- 227, PSD-0332, PDS-1615, PDS-9931, XMS-5025 (above, Chisso);
Methyl silicate MS51, Methyl silicate MS56 (Mitsubishi Chemical Corporation);
Ethyl silicate 28, ethyl silicate 40, ethyl silicate 48 (above, Colcoat);
Examples include partial condensates such as glass resin GR100, GR650, GR908, GR950 (above, Showa Denko). However, the present invention is not limited to these specific examples.

  Here, the transparent resin film of the present invention may not be formed by photocuring a resin composition containing a photocurable resin and a photopolymerization initiator, and the resin composition used for forming the transparent resin film is , It may or may not contain a photocurable resin or photopolymerization initiator. Among these, when the transparent resin film contains an antioxidant described later, the function of the antioxidant is not hindered by the radicals generated when exposed to the photopolymerization initiator. From the viewpoint of sufficiently increasing the whiteness after baking. Therefore, the silicone resin is preferably thermosetting.

-Catalyst-
The transparent resin film of the present invention contains a catalyst. Since the transparent resin film contains a catalyst, the transparent resin film containing the silicone resin is cured to improve toughness, and the disconnection of the electrode pattern when the front plate of the capacitive input device is cracked can be suppressed. Can be. The catalyst is used to increase the molecular weight of the silicone resin by dehydration / dealcohol condensation reaction, and a known catalyst can be used.
As a preferable catalyst, tin (Sn), zinc (Zn), iron (Fe), titanium (Ti), zirconium (Zr), bismuth (Bi), hafnium (Hf), yttrium (Y), aluminum (as a metal component) Examples include, but are not limited to, organic metal compound catalysts such as organic complexes or organic acid salts of at least one metal selected from the group consisting of Al), boron (B), and gallium (Ga).
Among these, Sn, Ti, Zn, Zr, Hf, and Ga are preferable in terms of high reaction activity, Zn or Ti is more preferable from the viewpoint of preventing cracking during baking, and the front plate of the capacitive input device is cracked. Zn is particularly preferable from the viewpoint of enabling the disconnection of the electrode pattern to be suppressed and improving the pot life.
Examples of the organometallic compound catalyst containing zinc (Zn) include zinc triacetylacetonate, zinc stearate, bis (acetylacetonato) zinc (II) (monohydrate) and the like.
Examples of organometallic compound catalysts containing tin (Sn), titanium (Ti), zirconium (Zr), hafnium (Hf), and gallium (Ga) include, for example, the catalysts described in JP 2012-238636 A. It can be preferably used.
A commercially available catalyst can also be used as the catalyst. Examples thereof include zinc-based condensation catalyst D-15 (manufactured by Shin-Etsu Chemical Co., Ltd.).
One type of the catalyst may be used alone, or two or more types may be used in any combination and ratio. Moreover, you may use together with a reaction accelerator and reaction inhibitor.
In the transparent resin film of the present invention, the content of the catalyst is preferably 0.01 to 10% by mass with respect to the content of the silicone resin from the viewpoint of preventing cracking during baking and improving pot life, More preferably, it is 0.03-5.0 mass%. From the viewpoint of suppressing the disconnection of the electrode pattern when the front plate of the capacitive input device is cracked, the transparent resin film of the present invention has a content of the catalyst equal to the content of the silicone resin. On the other hand, it is particularly preferably 0.5 to 5.0% by mass, and more preferably 1 to 4% by mass.

-Antioxidant-
In the present invention, the transparent resin film preferably contains an antioxidant from the viewpoint of increasing the transparency of the transparent resin film after baking. Here, when forming a transparent electrode pattern such as ITO on the capacitance type input device, it is necessary to bake at a high temperature. By adding an antioxidant, the transparency of the transparent resin film after baking is increased. Can be increased.
Known antioxidants can be used as the antioxidant. For example, hindered phenol antioxidants, semi-hindered phenol antioxidants, phosphoric acid antioxidants, and hybrid antioxidants having phosphoric acid and hindered phenol in the molecule can be used.
Preferably a phosphoric acid antioxidant; a combination of a phosphoric acid antioxidant and a hindered phenol antioxidant or a semi-hindered phenol antioxidant; or a hybrid antioxidant having phosphoric acid and hindered phenol in the molecule is there.
A commercially available antioxidant can also be used as the antioxidant. For example, examples of the phosphoric acid antioxidant include IRGAFOS168 and IRGAFOS38 (both manufactured by BASF Japan). IRGAMOD295 (manufactured by BASF Japan) can be mentioned as a phosphoric acid / hindered phenol-based antioxidant, and Sumiser GP (Sumitomo Chemical Co., Ltd.) as a hybrid type antioxidant having phosphoric acid and hindered phenol in the molecule. Manufactured).
The antioxidant is more preferably a phosphoric acid antioxidant from the viewpoint of improving transparency after baking of the transparent resin film, and IRGAFOS 168 is particularly preferable.
Although there is no restriction | limiting in particular as the addition amount of the said antioxidant with respect to the total solid of the said transparent resin film, It is preferable that it is 0.001-10 mass%, and it is more preferable that it is 0.01-1 mass%. Preferably, it is 0.05-1 mass% especially preferable.

-Additives-
Furthermore, you may use another additive for the said transparent resin film. Examples of the additive include surfactants described in paragraph 0017 of Japanese Patent No. 4502784, paragraphs 0060-0071 of JP-A-2009-237362, and thermal polymerization prevention described in paragraph 0018 of Japanese Patent No. 4502784. And other additives described in paragraphs 0058 to 0071 of JP-A No. 2000-310706. The concentration of the surfactant contained in the transparent resin film is preferably 0.01% by mass to 10% by mass.

(Thickness)
The transparent resin film of the present invention has a thickness of 5 to 300 μm, preferably 10 to 300 μm. In particular, when the functional layer described later is a decorative layer, and the decorative layer is a white decorative layer, Since it is preferable to increase the thickness of the white decorative layer, the thickness of the transparent resin film is more preferably 20 μm or more.

(Characteristic)
The characteristics of the transparent resin film of the present invention are not particularly limited.
The transparent resin film of the present invention preferably has a relative dielectric constant of 3.5 or less, more preferably 3.0 or less, and particularly preferably 2.5 or less. It is more preferable that the relative dielectric constant after post-baking to be described later at 240 ° C. for 60 minutes in air under atmospheric pressure (1 atm) is in the above range.

(Transparent resin film production method)
The method for producing the transparent resin film is not particularly limited, but the transparent resin film of the present invention is preferably produced by a coating method. When the transparent resin film of the present invention is produced by a coating method, it can be formed by applying a preparation solution containing the above-mentioned silicone resin, catalyst and other additives, and the preparation solution used at the time of application is a solvent. Can be prepared.
As a solvent for producing the transparent resin film by coating, the solvents described in paragraphs [0043] to [0044] of JP2011-95716A can be used.
There is no particular limitation on the method for preparing the transparent resin film of the present invention in a desired size or pattern, but it is possible to employ a method by a photolithography method or a pre-cut method, which is mentioned as a patterning method for the decorative layer described later, A pre-cut method is preferred, and a die-cut method is more preferred.

[Transfer film]
The transfer film of the present invention includes a temporary support and the transparent resin film of the present invention.
Further, it may or may not have other layers such as a thermoplastic resin layer or a release layer between the temporary support and the transparent resin film.

<Temporary support>
As the temporary support, a material that is flexible and does not cause significant deformation, shrinkage, or elongation under pressure or under pressure and heating can be used. Examples of such a temporary support include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film, and among them, a biaxially stretched polyethylene terephthalate film is particularly preferable.

There is no restriction | limiting in particular in the thickness of a temporary support body, The range of 5-200 micrometers is common, and the range of 10-150 micrometers is especially preferable at points, such as handleability and versatility.
Further, the temporary support may be transparent or may contain dyed silicon, alumina sol, chromium salt, zirconium salt or the like.
Further, the temporary support can be provided with conductivity by a method described in JP-A-2005-221726.

<Transparent resin film>
The transfer film of the present invention includes the transparent resin film of the present invention. The transparent resin film used for the transfer film of the present invention has a desired size in order to fill at least a step between the electrode pattern and the front plate of the conductive laminate and the capacitive input device of the present invention described later. It is preferable. However, as described in the description of the conductive laminate and the capacitive input device of the present invention described later, the transfer film of the present invention is used to fill at least a step between the electrode pattern and the front plate by a precut process or the like. Desired size. Therefore, the transparent resin film used for the transfer film of the present invention has a size necessary to fill at least a step between the electrode pattern and the front plate of the conductive laminate and the capacitive input device of the present invention described later. It is not always necessary to match.
On the other hand, in order to fill at least a step between the electrode pattern and the front plate of the conductive laminate or the capacitive input device of the present invention described later, the transparent resin film of the present invention is applied at the stage of use for the transfer film. It is preferable to adjust the thickness to the same level as the height of the functional layer such as the decorative layer.

(Viscosity of transparent resin film)
The viscosity of the transparent resin film measured at 100 ° C. is preferably in the region of 1 to 50000 Pa · sec.

  Here, the viscosity of each layer can be measured as follows. The solvent is removed from the coating solution for the thermoplastic resin layer or transparent resin film by drying at atmospheric pressure and under reduced pressure to obtain a measurement sample. For example, Vibron (DD-III type: manufactured by Toyo Baldwin Co., Ltd.) is used as a measuring instrument. Then, measurement is performed under the conditions of a measurement start temperature of 50 ° C., a measurement end temperature of 150 ° C., a temperature increase rate of 5 ° C./min, and a frequency of 1 Hz / deg, and a measurement value of 100 ° C. can be used.

<Thermoplastic resin layer>
In the transfer film of the present invention, a thermoplastic resin layer may be provided between the temporary support and the transparent resin film. The thermoplastic resin layer is preferably alkali-soluble. The thermoplastic resin layer plays a role as a cushioning material so as to be able to absorb unevenness of the base surface (including unevenness due to already formed images, etc.), and according to the unevenness of the target surface. It is preferable to have a property that can be deformed.

  The thermoplastic resin layer preferably includes an organic polymer substance described in JP-A-5-72724 as a component. The Vicat method [specifically, a polymer by American Material Testing Method ASTM D1235] An embodiment containing at least one selected from organic polymer substances having a softening point of about 80 ° C. or less according to the softening point measurement method] is particularly preferable.

  Specifically, polyolefins such as polyethylene and polypropylene, ethylene copolymers with ethylene and vinyl acetate or saponified products thereof, copolymers of ethylene and acrylic acid esters or saponified products thereof, polyvinyl chloride and vinyl chloride, Vinyl chloride copolymer with vinyl acetate or saponified product thereof, polyvinylidene chloride, vinylidene chloride copolymer, polystyrene, styrene copolymer with styrene and (meth) acrylic acid ester or saponified product thereof, polyvinyl toluene, Vinyl toluene copolymer of vinyl toluene and (meth) acrylic acid ester or saponified product thereof, poly (meth) acrylic acid ester, (meth) acrylic acid ester copolymer weight of butyl (meth) acrylate and vinyl acetate, etc. Coalescence, vinyl acetate copolymer nylon, copolymer nylon, - alkoxymethyl nylon, N- dimethylamino nylon or the like of the polyamide resin, polyester, and organic polymers such as.

  Moreover, it is preferable to add a foaming agent or the like for controlling peelability to the thermoplastic resin layer, and those described in paragraphs 0020 to 0028 of JP-A-2007-225939 can be used as appropriate.

  It is also preferable to add a surfactant to the thermoplastic resin layer. For example, those described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of JP-A-2009-237362 can be used as appropriate.

  The layer thickness of the thermoplastic resin layer is preferably 3 to 30 μm. When the thickness of the thermoplastic resin layer is 3 μm or more, the followability at the time of lamination is sufficient, and the unevenness of the base surface is easily absorbed. In addition, when the layer thickness is 30 μm or less, it is difficult to apply a load to drying (solvent removal) when forming the thermoplastic resin layer on the temporary support, and development of the thermoplastic resin layer does not take too much time. , Process aptitude is good. The layer thickness of the thermoplastic resin layer is more preferably 4 to 25 μm, and particularly preferably 5 to 20 μm.

  The thermoplastic resin layer can be formed by applying a preparation liquid containing a thermoplastic organic polymer, and the preparation liquid used for the application can be prepared using a solvent. The solvent is not particularly limited as long as it can dissolve the polymer component constituting the thermoplastic resin layer, and examples thereof include methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol.

  The thermoplastic resin layer preferably has a viscosity measured at 100 ° C. in the range of 1000 to 50000 Pa · sec.

<Other layers>
In the transfer film of the present invention, an intermediate layer or a release layer is provided between the transparent resin film and the thermoplastic resin layer, or a protective film (sometimes referred to as a cover film) is provided on the surface of the transparent resin film. Furthermore, it can provide and comprise suitably.

  The transfer film of the present invention may be provided with an intermediate layer for the purpose of preventing mixing of components during the application of a plurality of layers and during storage after application. As the intermediate layer, an oxygen barrier film having an oxygen barrier function, which is described as “separation layer” in JP-A-5-72724, is preferable, which increases the sensitivity during exposure and reduces the time load of the exposure machine. And productivity is improved.

  As the intermediate layer and the protective film, those described in paragraphs 0083 to 0087 and 0093 of JP-A-2006-259138 can be appropriately used.

<Production method of transfer film>
The transfer film of the present invention can be produced according to the method for producing a photosensitive transfer material described in paragraphs 0094 to 0098 of JP-A-2006-259138.
When the transfer film in the present invention is specifically formed, it can be suitably produced by applying a transparent resin film coating solution on a temporary support and drying it. A protective film or the like may be further laminated on the surface of the transparent resin film.
When the transfer film of the present invention having an intermediate layer is specifically formed, a solution (the coating solution for the thermoplastic resin layer) in which the additive is dissolved together with the thermoplastic organic polymer is applied on the temporary support. After drying and providing a thermoplastic resin layer, a preparation liquid (intermediate layer coating liquid) prepared by adding a resin or an additive to a solvent that does not dissolve the thermoplastic resin layer is applied onto the thermoplastic resin layer. Then, the intermediate layer is laminated by drying, and a transparent resin film coating solution prepared by using a solvent that does not dissolve the intermediate layer is further applied onto the intermediate layer, and dried, and if necessary, the transparent resin film It can be suitably produced by further laminating a protective film or the like on the surface.

[Conductive film laminate, capacitance type input device]
The conductive film laminate of the present invention has a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. In addition, the transparent resin film of the present invention or the transparent resin film of the transfer film of the present invention is provided so as to fill at least a step between the electrode pattern and the front plate.
The capacitance-type input device of the present invention includes the conductive film laminate of the present invention.
Note that, in the conductive film laminate of the present invention and the capacitive input device of the present invention, the transparent resin film of the present invention may maintain a uniform thickness, and a part of the thickness is not satisfactory. It may be a uniform shape (in other words, a transparent resin layer).

In the conductive film laminate of the present invention, the transparent resin film is formed by transferring the transparent resin film contained in the transfer film of the present invention so as to fill at least a step between the electrode pattern and the front plate. Is preferred.
Here, a capacitance-type input device having a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. There is no particular limitation on the level difference between at least the electrode pattern and the front plate.
At least examples and preferred ranges of the step between the electrode pattern and the front plate are as described in the explanation of the transparent resin film of the present invention.
The conductive film laminate of the present invention is not particularly limited as the aforementioned functional layer, and examples thereof include a decorative layer, a laminate of a decorative layer and a mask layer (shielding layer), and the like. Among them, the functional layer described above is preferably a decorative layer or a laminate of a decorative layer and a mask layer (shielding layer), and more preferably a decorative layer.
When the functional layer is a decorative layer, it is more preferable that at least the step between the electrode pattern and the front plate is “a step between the front plate and the decorative layer”.

In the conductive film laminate of the present invention, the electrode pattern preferably includes the following (1) to (3) from the viewpoint of using the conductive film laminate of the present invention as a capacitive input device.
(1) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via connection portions (2) electrically insulated from the first transparent electrode pattern, A plurality of second electrode patterns comprising a plurality of pad portions formed extending in a direction crossing the first direction (3) electrically connecting the first transparent electrode pattern and the second electrode pattern However, “the electrode pattern is disposed on the decorative layer” means that (1) or (2) of the above (1) to (3) is part of the decorative layer. What is necessary is just to be arrange | positioned on top, and all of (1)-(3) does not need to be arrange | positioned on a decoration layer. Moreover, the electrode pattern may be arrange | positioned adjacent to the said decoration layer, and may be arrange | positioned through another layer.
Furthermore, in the capacitive input device of the present invention, the electrode pattern may further include the following (4).
(4) A conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern, and is different from the first transparent electrode pattern and the second electrode pattern. In the conductive film laminate and the capacitive input device of the present invention, the second electrode pattern may be a transparent electrode pattern. In this specification, the second transparent electrode pattern may be described instead of the second electrode pattern, but the preferred embodiment of the second electrode pattern is the same as the preferred embodiment of the second transparent electrode pattern. is there.
Furthermore, the conductive film laminate and the capacitance-type input device of the present invention are provided on the surface of the decorative layer formed on one surface side of the front plate on the side opposite to the surface facing the front plate. Further, a mask layer may be provided.
Hereinafter, the preferable aspect of the electrically conductive film laminated body and electrostatic capacitance type input device of this invention is demonstrated.

<Structure of conductive film laminate and capacitive input device>
The structures of the conductive film laminate and the capacitance type input device of the present invention will be described. In the following description, the case where the functional layer described above is a decorative layer and the step between the electrode pattern and the front plate is a step between the front plate and the decorative layer will be described. However, the present invention is not limited to such an embodiment. FIG. 14 is a cross-sectional view showing a preferred configuration among the capacitance-type input device of the present invention. In FIG. 14, the capacitance type input device is arranged on the transparent front plate 1, the decorative layer 2 arranged on a part of one surface of the front plate, and one surface side of the front plate. It has an electrode pattern (second transparent electrode pattern 4 and conductive element 6), and the step between the front plate 1 and the decorative layer 2 is filled with the transparent resin film 9 of the present invention. Further, the capacitive input device shown in FIG. 14 includes a first transparent electrode pattern 3, an insulating layer 5, and a transparent protective layer 7.
As in the capacitive input device shown in FIG. 14, the front plate 1, the decorative layer 2, the first transparent electrode pattern 3, the second transparent electrode pattern 4, the insulating layer 5, and the conductivity An element 6, a transparent protective layer 7 ′, and the transparent resin film 9 of the present invention are formed, and an electrode pattern (second transparent electrode pattern 4 and conductive element 6) is adjacent to the decorative layer 2. Are preferably arranged. That is, a transparent protective layer is included on the transparent resin film, the decorative layer, and the electrode pattern (the overcoat layer is present above the electrode pattern such as ITO). In the case of using a transparent protective layer that is not present, it is preferable from the viewpoint that the transparent protective layer does not undergo thermal discoloration during ITO sputtering.
On the other hand, in FIG. 1, the electrode pattern (second transparent electrode pattern 4 and conductive element 6) is disposed on the decorative layer 2 via the transparent protective layer 7. As shown in FIG. 1, the conductive film laminate and the capacitive input device of the present invention are further provided between the decorative layer 2 and the electrode pattern, and between the transparent resin film 9 and the electrode pattern. The aspect containing the transparent protective layer 7 may be sufficient. However, in the conductive film laminate of the present invention, the stacking order shown in FIG. 14 is preferable to the stacking order shown in FIG.
The edge part of the decoration layer 2 may be a taper shape, a reverse taper shape, or may not form the taper shape. In FIG. 1, the decoration layer 2 has a tapered end. On the other hand, as shown in FIG. 14, the decoration layer 2 does not need to form a taper shape. As for the electrically conductive film laminated body of this invention, it is preferable that the edge part of the said decoration layer is a taper shape.
14 and 1, the inner diameter (one side) L of the decorative layer 2 is equal to the width of the transparent resin film 9 of the present invention. On the other hand, when the step between the front plate 1 and the decorative layer 2 is filled with the transparent resin film 9 of the present invention, the inner diameter (one side) L of the decorative layer 2 is as long as it is not contrary to the spirit of the present invention. As shown in FIG. 15, it may be wider than the width of the transparent resin film 9 of the present invention, and conversely, as shown in FIG. 16, it may be narrower than the width of the transparent resin film 9 of the present invention. The transparent resin film 9 existing on the decorative layer 2 is thinner than the transparent resin film 9 in direct contact with the front plate 1 due to the pressure applied during transfer due to the thickness of the decorative layer 2. Tend to be. Here, in the conductive film laminate of the present invention, the end of the transparent resin film is disposed on at least a part of the surface of the functional layer opposite to the front plate (the end of the transparent resin film is added). Preferably, the decorative layer 2 has an inner diameter (one side) L narrower than the width of the transparent resin film 9 of the present invention as shown in FIG. In other words, the width of the transparent resin film 9 of the present invention is preferably wider than the inner diameter (one side) L of the decorative layer 2. The width of the transparent resin film 9 of the present invention is preferably equal to or larger than the inner diameter (one side) L of the decorative layer 2 and is 20 mm or less wide (10 mm or less wide at one end), and is equal to or wider than 10 mm (one side) Is manufactured when the transparent resin film is formed by transferring the transparent resin film contained in the transfer film so as to fill at least the step between the electrode pattern and the front plate. It is particularly preferable from the viewpoint of ease and suppression of new bubble mixing near the edge of the transparent resin film present on the decorative layer 2.

  The front plate 1 is composed of a light-transmitting substrate such as a glass substrate, and tempered glass represented by Corning gorilla glass can be used. In this specification, of the surfaces of the front plate 1 constituting the capacitive input device of the present invention, the surface on which input is performed by bringing a finger or the like into contact is referred to as a contact surface, and the contact surface of the front plate 1 Is the non-contact surface. Hereinafter, the front plate may be referred to as a “base material”.

In addition, a mask layer may be provided on one surface of the front plate 1 with a decorative layer 2 interposed therebetween. The mask layer is a frame-like pattern around the display area formed on one surface side of the front panel of the touch panel, and is formed so as not to show the lead wiring or the like.
The decoration layer 2 may be formed for the purpose of decoration between one surface of the touch panel front plate and the mask layer.
In the capacitive input device of the present invention, as shown in FIG. 2, a decorative layer 2 and a mask layer (a mask layer (covering a region other than the input surface in FIG. 2) of the front plate 1 are covered. (Not shown) is preferably provided. Further, the front plate 1 can be provided with an opening 8 in a part of the front plate as shown in FIG. A pressing mechanical switch can be installed in the opening 8. Since the tempered glass used as a base material has high strength and is difficult to process, it is general to form the opening 8 by forming the opening 8 before the tempering treatment and then performing the tempering treatment. . However, when trying to form the decorative layer 2 using the liquid resist for decorating layer formation or the screen printing ink on the substrate after the strengthening treatment having the opening 8, the resist component mole from the opening, There is a problem that the resist component protrudes from the glass edge in the decorative layer provided between the mask layer and the front plate, which needs to form a light-shielding pattern until the boundary of the front plate, and the back side of the substrate is contaminated. However, when the decorative layer 2 is formed on the base material having the opening 8 by using a transfer film, such a problem can be solved.

On one surface of the front plate 1, a plurality of first transparent electrode patterns 3 in which a plurality of pad portions are formed extending in the first direction via connection portions, and a first transparent electrode pattern 3. And a plurality of second transparent electrode patterns 4 comprising a plurality of pad portions formed extending in a direction crossing the first direction, the first transparent electrode pattern 3 and the second An insulating layer 5 for electrically insulating the transparent electrode pattern 4 is formed. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and another conductive element 6 to be described later are, for example, translucent materials such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide). The conductive metal oxide film can be used. Examples of such metal films include ITO films; metal films such as Al, Zn, Cu, Fe, Ni, Cr, and Mo; metal oxide films such as SiO ₂ . At this time, the film thickness of each element can be 10 to 200 nm. Further, since the amorphous ITO film is made into a polycrystalline ITO film by firing, the electrical resistance can be reduced. The first transparent electrode pattern 3, the second transparent electrode pattern 4, and the conductive element 6 described later use a transfer film having a conductive curable resin layer using a conductive fiber described later. Can also be manufactured. In addition, when forming a 1st transparent electrode pattern etc. with ITO etc., the paragraphs 0014-0016 of patent 4506785 grade | etc., Can be referred.

  Further, at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4 is the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the front plate 1 of the decorative layer 2. It can be installed across both areas of the opposite surface and the opposite surface. In FIG. 14, the second transparent electrode pattern 4 is opposite to the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the surface facing the front plate 1 of the decorative layer 2. The figure in which the second transparent electrode pattern 4 is installed across both regions of the side surface is shown. Thus, when laminating an electrode pattern (for example, laminating the below-mentioned transfer film) over the decoration layer 2 which needs fixed thickness, and the transparent resin film 9 of this invention arrange | positioned on the front plate back surface However, by using the transparent resin film 9 of the present invention, it is possible to laminate without the generation of bubbles at the boundary of the decorative layer and the disconnection of the electrode pattern without using expensive equipment such as a vacuum laminator. become.

  The first transparent electrode pattern 3 and the second transparent electrode pattern 4 will be described with reference to FIG. FIG. 3 is an explanatory diagram showing an example of the first transparent electrode pattern and the second transparent electrode pattern in the present invention. As shown in FIG. 3, the first transparent electrode pattern 3 is formed such that the pad portion 3a extends in the first direction via the connection portion 3b. The second transparent electrode pattern 4 is electrically insulated by the first transparent electrode pattern 3 and the insulating layer 5 and extends in a direction intersecting the first direction (second direction in FIG. 3). It is constituted by a plurality of pad portions that are formed. Here, when the first transparent electrode pattern 3 is formed, the pad portion 3a and the connection portion 3b may be manufactured as one body, or only the connection portion 3b is manufactured, and the pad portion 3a and the second portion 3b are formed. The transparent electrode pattern 4 may be integrally formed (patterned). When the pad portion 3a and the second transparent electrode pattern 4 are produced (patterned) as a single body (patterning), as shown in FIG. 3, a part of the connection portion 3b and a part of the pad portion 3a are coupled, and an insulating layer Each layer is formed so that the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are electrically insulated by 5.

  In FIG. 14, the electroconductive element 6 is installed in the surface side on the opposite side to the surface facing the front board 1 of the decorating layer 2. In FIG. The conductive element 6 is electrically connected to at least one of the first transparent electrode pattern 3 and the second transparent electrode pattern 4, and is different from the first transparent electrode pattern 3 and the second transparent electrode pattern 4. Another conductive element. FIG. 14 shows a diagram in which another conductive element 6 is connected to the second transparent electrode pattern 4.

Moreover, in FIG. 1, the transparent protective layer 7 is further installed between the said decoration layer 2 and the said electrode pattern, and between the said transparent resin film 9 and the said electrode pattern. Thus, the transparent protective layer 7 may be configured to cover only a part of each component. A transparent protective layer 7 is formed across both the regions of the transparent resin film 9 of the present invention disposed on one surface of the front plate 1 and the surface of the decorative layer 2 opposite to the surface facing the front plate 1. Even in the case of installation, by using the transparent resin film 9 of the present invention, it is possible to perform lamination without generating bubbles at the boundary of the decorative layer with a simple process without using expensive equipment such as a vacuum laminator.
On the other hand, as shown in FIG. 14, it is more preferable that the transparent protective layer 7A is provided so as to cover all the components. In FIG. 1, a transparent protective layer 7A may be provided as shown in FIG. 14 so as to cover all of the constituent elements. The transparent protective layer 7 or 7A is sometimes called an overcoat layer.
The insulating layer 5 and the transparent protective layer 7 may be made of the same material or different materials. As a material constituting the insulating layer 5 and the transparent protective layers 7 and 7A, those having high surface hardness and high heat resistance are preferable, and known photosensitive siloxane resin materials, acrylic resin materials, and the like are used.

  Examples of the embodiment formed in the manufacturing process of the capacitive input device of the present invention include the embodiments shown in FIGS. FIG. 4 is a top view illustrating an example of the tempered glass 11 in which the opening 8 is formed. FIG. 5 is a top view showing an example of the front plate on which the decorative layer 2 is formed. FIG. 6 is a top view showing an example of the front plate on which the first transparent electrode pattern 3 is formed. FIG. 7 is a top view showing an example of a front plate on which the first transparent electrode pattern 3 and the second transparent electrode pattern 4 are formed. FIG. 8 is a top view showing an example of a front plate on which conductive elements 6 different from the first and second transparent electrode patterns are formed. These show examples embodying the above description, and the scope of the present invention is not limitedly interpreted by these drawings.

  Hereinafter, with respect to the conductive film laminate and the capacitance-type input device of the present invention, details of each layer and preferred embodiments of a method for manufacturing each layer will be described.

<Decoration layer>
It is preferable that the electrically conductive film laminated body and electrostatic capacitance type input device of this invention have a functional layer arrange | positioned at the one surface side of the said front board, and a functional layer is a decoration layer.

In the conductive film laminate and the capacitive input device body of the present invention, the thickness of the decorative layer is preferably 5 μm or more, more preferably 10 μm or more, and in particular, the decorative layer is a white decorative layer. When it is, since it is preferable to make the thickness of a white decoration layer thick, it is more preferable that it is 30 micrometers or more.
In the conductive film laminate of the present invention, the thickness of the transparent resin film is preferably 0.2 to 2.0 times, and preferably 0.3 to 1.5 times the thickness of the decorative layer. More preferably, it is 0.99 to 1.01 times.

(material)
-Colorant-
The decorative layer includes a colorant.

  Examples of the black colorant include carbon black, titanium carbon, iron oxide, titanium oxide, and graphite. Among these, carbon black is preferable. In addition to the black colorant, a mixture of pigments such as red, blue, and green can be used.

As the white colorant, white pigments described in JP2009-191118A paragraph 0019 and JP2000-175718A paragraph 0109 can be used. Moreover, the white pigment as described in paragraph 0015 and 0114 of Unexamined-Japanese-Patent No. 2005-7765 can also be used.
Specifically, in the present invention, white inorganic pigments such as titanium oxide (rutile type), titanium oxide (anatase type), zinc oxide, lithopone, light calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, barium sulfate, etc. Titanium oxide (rutile type), titanium oxide (anatase type) and zinc oxide are more preferable, titanium oxide (rutile type) and titanium oxide (anatase type) are more preferable, and rutile type titanium oxide is particularly preferable.

  Specific examples of titanium dioxide include JR, JRNC, JR-301, 403, 405, 600A, 605, 600E, 603, 701, 800, 805, 806, JA-1, C, 3, 4, 5, MT- 01, 02, 03, 04, 05, 100AQ, 100SA, 100SAK, 100SAS, 100TV, 100Z, 100ZR, 150W, 500B, 500H, 500SA, 500SAK, 500SAS, 500T, SMT-100SAM, 100SAS, 500SAM, 500SAS Manufactured), CR-50, 50-2, 57, 58, 58-2, 60, 60-2, 63, 67, 80, 85, 90, 90-2, 93, 95, 97, 953, Super 70, PC -3, PF-690, 691, 711, 736, 737, 739, 740, 7 2, R-550, 580, 630, 670, 680, 780, 780-2, 820, 830, 850, 855, 930, 980, S-305, UT771, TTO-51 (A), 51 (C), 55 (A), 55 (B), 55 (C), 55 (D), S-1, S-2, S-3, S-4, V-3, V-4, MPT-136, FTL- 100, 110, 200, 300 (Ishihara Sangyo Co., Ltd.), KA-10, 15, 20, 30, KR-310, 380, KV-200, STT-30EHJ, 65C-S, 455, 485SA15, 495M, 495MC ( Titanium Industry Co., Ltd.), TA-100, 200, 300, 400, 500, TR-600, 700, 750, 840, 900 (Fuji Titanium Industry Co., Ltd.) and the like. It may be.

In the present invention, the surface of the white inorganic pigment (particularly titanium oxide) can be used in combination with silica treatment, alumina treatment, titania treatment, zirconia treatment, organic matter treatment and the like.
Thereby, the catalytic activity of the white inorganic pigment (particularly titanium oxide) can be suppressed, and heat resistance, fluorescence, and the like can be improved.
From the viewpoint of the whiteness of the decorative layer after heating, in the present invention, the white pigment is preferably a rutile type titanium oxide surface-treated with an inorganic substance, and at least one of alumina treatment and zirconia treatment was surface-treated. A rutile type titanium oxide is more preferable, and a rutile type titanium oxide surface-treated by an alumina / zirconia combined treatment is particularly preferable.

  In order to use as a decoration layer of the said other color, you may mix and use the pigment or dye as described in the paragraph 0183-0185 of patent 4546276, etc. Specifically, pigments and dyes described in paragraphs 0038 to 0054 of JP-A-2005-17716, pigments described in paragraphs 0068 to 0072 of JP-A-2004-361447, paragraphs of JP-A-2005-17521 The colorants described in 0080 to 0088 can be suitably used.

The content of the inorganic pigment with respect to the total solid content of the decorative layer is 20 to 75% by mass to form a decorative layer having good brightness and whiteness and simultaneously satisfying other required characteristics. It is preferable from the viewpoint. Moreover, when using the transfer film of this invention for the manufacturing method of the electrostatic capacitance type input device of this invention mentioned later, also from a viewpoint of fully shortening development time, the said inorganic pigment with respect to the total solid of the said decoration layer is sufficient. The content is preferably 20 to 75% by mass.
As for the content rate of the said inorganic pigment with respect to the total solid of the said decoration layer, it is more preferable that it is 25-60 mass%, and it is still more preferable that it is 30-50 mass%.
The total solid content as used in this specification means the total mass of the non-volatile component except a solvent etc. from the said decoration layer.

  The inorganic pigment (which is the same for other colorants) is desirably used as a dispersion. This dispersion can be prepared by adding and dispersing a composition obtained by previously mixing the inorganic pigment and the pigment dispersant in an organic solvent (or vehicle) described later. The above-mentioned vehicle refers to a portion of a medium in which a pigment is dispersed when the paint is in a liquid state, and is a liquid component that binds to the pigment to form a coating film (binder) and dissolves and dilutes it. Component (organic solvent).

  The disperser used for dispersing the inorganic pigment is not particularly limited. For example, a kneader described in Kazuzo Asakura, “Encyclopedia of Pigments”, First Edition, Asakura Shoten, 2000, p. 438. , Known dispersing machines such as a roll mill, atrider, super mill, dissolver, homomixer, and sand mill. Further, fine grinding may be performed using frictional force by mechanical grinding described in page 310 of this document.

The colorant that can be used in the present invention is preferably a colorant having an average primary particle size of 0.16 μm to 0.3 μm, more preferably 0.18 μm to 0.27 μm, from the viewpoint of dispersion stability and hiding power. The colorant is preferred. Furthermore, a coloring agent of 0.19 μm to 0.25 μm is particularly preferable. When the average particle size of the primary particles is smaller than 0.16 μm, the hiding power is suddenly lowered, and the base of the decorative layer may be easily seen or the viscosity may be increased. On the other hand, when it exceeds 0.3 μm, the whiteness is lowered particularly when a white inorganic pigment is used, and at the same time, the hiding power is suddenly lowered, and the surface condition when applied may be deteriorated.
The “average particle size of primary particles” as used herein refers to the diameter when the electron micrograph image of the particles is a circle of the same area, and the “number average particle size” refers to the above-mentioned particle size for a large number of particles. The diameter is determined, and among these, an average value of 100 particle diameters arbitrarily selected is referred to.
On the other hand, when measuring by the average particle diameter in a dispersion liquid and a coating liquid, laser scattering HORIBA H (made by Horiba Advanced Techno Co., Ltd.) can be used.

-Binder resin-
It is preferable that a decoration layer contains binder resin. As said binder resin, the silicone resin similar to the said transparent resin film is mentioned preferably.
Moreover, it is preferable that a catalyst is included from a viewpoint of hardening the said decoration layer containing the said silicone resin and improving a brittleness. As said catalyst, the thing similar to the said transparent resin film is mentioned preferably.

(Method for forming the decorative layer)
Although there is no restriction | limiting in particular in the formation method of the said decoration layer, It is preferable to form using the transfer film which has a temporary support body and a resin layer in this order, and this temporary support body and a photocurable resin layer are made into this. It is more preferable to form using a photosensitive transfer film having in order, and it is particularly preferable to use a photosensitive transfer film having a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order. . For example, when the white decorative layer 2 is formed, the white light curing is performed on the surface of the front plate 1 by using a photosensitive transfer film described later having a white light curing resin layer as the photocurable resin layer. The conductive resin layer is preferably formed by transferring.
When forming a decoration layer using the said transfer film, a coloring agent can be used for a resin layer. As the colorant, the above-mentioned colorants (organic pigments, inorganic pigments, dyes, etc.) can be suitably used.

  In the capacitance-type input device having the opening 8 configured as shown in FIG. 2, when the decorative layer 2 and the mask layer (not shown) shown in FIG. 1 are formed using the transfer film of the present invention, the opening is formed. Even the front plate (substrate) having a portion has no resist component leakage from the opening. In particular, when using the transfer film of the present invention, in the decorative layer that needs to form a light-shielding pattern just above the boundary line of the front plate, there is no protrusion of the resist component from the glass edge, so the back side of the front plate is A touch panel having advantages of thinning and light weight can be manufactured through a simple process without contamination.

A method for forming the decorative layer using a transfer film will be described.
In general, when a transfer film is used, it can be formed by an ordinary photolithography method if the decorative layer contains a photocurable resin.
The transfer film may or may not contain the photocurable resin, and the case where the decorative layer contains the photocurable resin and the case where the decorative layer does not contain the photocurable resin. In any case, the decorative layer can be formed by using a transfer film by a transfer method by half-cut or a transfer method by die-cut, which will be described later.

  About the case where permanent materials, such as a decoration layer, are formed using a transfer film, the patterning method using a transfer film is demonstrated to the example of the method of forming a decoration layer.

(1-A) Patterning by photolithography The patterning method will be described for the case where the decorative layer is formed using a photolithography method.

In the patterning method in the case of forming the decorative layer using a photolithography method, it is a transfer film having at least a temporary support and a photocurable resin layer, and the photocurable resin layer is a photocurable resin and a colorant. A transfer film having
The transfer film having the photocurable resin layer may include a protective film and an intermediate layer in addition to the photocurable resin layer, the temporary support, and the thermoplastic resin layer.
The preferred configuration and order of lamination of each layer is the same except that a resin layer containing a colorant (preferably a photocurable resin layer containing a colorant) is used instead of the transparent resin film of the invention in the transfer film of the invention. .
The photocurable resin layer of the transfer film having the photocurable resin layer preferably has the following configuration.

There is no restriction | limiting in particular as long as it is not contrary to the meaning of this invention as said monomer used for the said photocurable resin layer, A well-known polymeric compound can be used.
As the polymerizable compound, the polymerizable compounds described in paragraphs 0023 to 0024 of Japanese Patent No. 4098550 can be used.

The binder used in the photocurable resin layer is not particularly limited as long as it is not contrary to the gist of the present invention, and a known polymerizable compound can be used.
When the transfer film having the photocurable resin layer is a negative material, the photocurable resin composition preferably contains an alkali-soluble resin, a polymerizable compound, and a polymerization initiator. Furthermore, although a coloring agent, an additive, etc. are used, it is not restricted to this.
As the alkali-soluble resin, polymers described in paragraph 0025 of JP 2011-95716 A and paragraphs 0033 to 0052 of JP 2010-237589 A can be used. On the other hand, when the decorative layer is formed by precutting, it is also preferable to use a silicone resin as the binder resin in the resin layer having the colorant as described above.
When the transfer film having the photocurable resin layer is a positive type material, for example, a material described in JP-A-2005-221726 is used for the photocurable resin layer, but is not limited thereto.

  As said photoinitiator used for the said photocurable resin layer, the polymeric compound as described in Paragraphs 0031-0042 of Unexamined-Japanese-Patent No. 2011-95716 can be used.

  Furthermore, an additive may be used for the photocurable resin layer. Examples of the additive include surfactants described in paragraph 0017 of Japanese Patent No. 4502784, paragraphs 0060-0071 of JP-A-2009-237362, and thermal polymerization prevention described in paragraph 0018 of Japanese Patent No. 4502784. And other additives described in paragraphs 0058 to 0071 of JP-A No. 2000-310706.

-Solvent-
Moreover, as a solvent at the time of manufacturing the transfer film which has a photocurable resin layer by application | coating, the solvent as described in Paragraph 0043-0044 of Unexamined-Japanese-Patent No. 2011-95716 can be used.

  As described above, the case where the transfer film having the photocurable resin layer is a negative material has been mainly described. However, the transfer film may be a positive material.

It is preferable that the viscosity of the photocurable resin layer measured at 100 ° C. is in the region of 2000 to 50000 Pa · sec, and further satisfies the following formula.
Viscosity of thermoplastic resin layer <viscosity of photocurable resin layer

  When the transfer film has a photocurable resin layer, the method for forming the decorative layer includes a protective film removing step for removing the protective film from the transfer film, and a method for removing the protective film from the transfer film. A transfer step of transferring the photocurable resin layer onto the substrate, an exposure step of exposing the photocurable resin layer transferred onto the substrate, and developing the exposed photocurable resin layer to form a pattern And a development step for obtaining an image. In this case, it is preferable to further include a step of post-exposing the transferred photocurable resin layer after the transfer step.

After the transfer film is laminated on the front plate (base material), it is exposed to the required pattern, and in the case of negative type material, the unexposed part and in the case of positive type material, the exposed part is developed and removed. A pattern can be obtained. At this time, the development may be carried out by removing the thermoplastic resin layer and the photocurable resin layer with separate liquids, or with the same liquid. You may combine well-known image development facilities, such as a brush and a high pressure jet, as needed. After the development, post-exposure and post-bake may be performed as necessary.
Hereinafter, when forming the said decoration layer using a photolithographic system, the detail of a preferable transfer process, an exposure process, a image development process, and another process is demonstrated.

-Transfer process-
The said transfer process is a process of transferring the said photocurable resin layer of the transfer film from which the said protective film was removed on a base material.
At this time, a method of removing the temporary support after laminating the photocurable resin layer of the transfer film on the substrate is preferable.
Transfer (bonding) of the photocurable resin layer to the surface of the substrate is performed by stacking the photocurable resin layer on the surface of the substrate, pressurizing and heating. For laminating, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator that can further increase productivity can be used.

-Exposure process, development process, and other processes-
As examples of the exposure step, the development step, and other steps, the method described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be preferably used in the present invention.

The said exposure process is a process of exposing the said photocurable resin layer transcribe | transferred on the base material.
Specifically, there is a method in which a predetermined mask is disposed above the photocurable resin layer formed on the substrate, and then exposed from above the mask through the mask, the thermoplastic resin layer, and the intermediate layer. Can be mentioned.
Here, the light source for the exposure can be appropriately selected and used as long as it can irradiate light in a wavelength region capable of curing the photocurable resin layer (for example, 365 nm, 405 nm, etc.). Specifically, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, etc. are mentioned. As an exposure amount, it is about 5-200 mJ / cm < ² > normally, Preferably it is about 10-100 mJ / cm < ² >.

The developing step is a step of developing the exposed photocurable resin layer.
The development can be performed using a developer. The developer is not particularly limited, and a known developer such as a developer described in JP-A-5-72724 can be used. The developer is preferably a developer in which the photocurable resin layer has a dissolution type development behavior. For example, a developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 to 5 mol / L is preferable. A small amount of an organic solvent miscible with water may be added. Examples of organic solvents miscible with water include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, and benzyl alcohol. , Acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam, N-methylpyrrolidone and the like. The concentration of the organic solvent is preferably 0.1% by mass to 30% by mass. Further, a known surfactant can be further added to the developer. The concentration of the surfactant is preferably 0.01% by mass to 10% by mass.

  The development method may be any of paddle development, shower development, shower & spin development, dip development, and the like. Here, the shower development will be described. An uncured portion can be removed by spraying a developer onto the photocurable resin layer after exposure. In the case where a thermoplastic resin layer or an intermediate layer is provided, an alkaline liquid having a low solubility of the transparent curable resin layer containing a photocurable resin is sprayed by a shower or the like before development, and the thermoplastic resin layer, It is preferable to remove the intermediate layer and the like. Further, after the development, it is preferable to remove the development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like. The liquid temperature of the developer is preferably 20 ° C. to 40 ° C., and the pH of the developer is preferably 8 to 13.

(1-B) Patterning by the pre-cut method When the decorative layer is formed by an ordinary photolithographic method, it is necessary to form an image portion on the decorative layer before transfer.

A step of making a cut in a depth that does not penetrate the temporary support and through the decorative layer in a part of the transfer film, or a step of making a cut through the temporary support from the decorative layer It is also called a step of pre-cutting an image portion to be transferred in the decorative layer.
As a kind of the pre-cut, a step (half-cut step) in which a depth of not penetrating through the decorative layer and penetrating through the temporary support is partially penetrated into the transfer film and the temporary support from the decorative layer. There is a process (die cutting process) for making a cut through the body.

The method of forming the decorative layer is a half-cut step, that is, a step of making a cut in a depth that penetrates the decorative layer and does not penetrate the temporary support in a part of the transfer film, and the cut Forming the decorative layer using the transfer film after removing the decorative layer in at least a part of the region surrounded by the region and the decorative layer in the partial region It is preferable to include the process to do.
In addition, the method for forming the decorative layer includes a die cutting step, that is, a step of making a cut through the temporary support from the decorative layer into a part of the transfer film, and the decoration of the partial region. It is also preferable to include the process of forming the said decoration layer using the said transfer film after removing a layer.

The step of removing the decorative layer in at least a part of the region surrounded by the cuts is also referred to as a step of removing the decorative layer of the non-image portion that is not transferred.
Further, when the transfer film includes a protective film, an intermediate layer, or a thermoplastic resin layer, the step of removing the decorative layer in at least a part of the region surrounded by the cuts is a protective film for a non-image part. And a step of removing the decorative layer and the protective film of the image portion.

The step of forming the decorative layer using the transfer film after removing the decorative layer in the partial area is also referred to as a transfer step of transferring the decorative layer of the image portion onto the substrate.
Furthermore, when the transfer film includes a protective film, an intermediate layer or a thermoplastic resin layer, the step of forming the decorative layer using the transfer film after removing the decorative layer in the partial area, It is preferable that it is a transfer process which transfers the decoration layer of the said image part of the said transfer film from which the said protective film was removed on a base material.
In this case, the step of forming the decorative layer using the transfer film after removing the decorative layer in the partial area further includes the step of peeling the temporary support transferred onto the substrate. It is preferable to include.
In this case, the step of forming the decorative layer using the transfer film after removing the decorative layer in the partial area further includes a step of removing the thermoplastic resin layer and the intermediate layer. preferable.

  The method for forming the decorative layer includes a step of pre-cutting the image portion to be transferred among the decorative layer of the transfer film, a step of removing the protective film and the decorative layer of the non-image portion, and the protective film of the image portion, A transfer step of transferring the decorative layer of the image portion of the transfer film from which the protective film has been removed onto a substrate, a step of peeling off the temporary support transferred onto the substrate, a thermoplastic resin layer, A method having a step of removing the intermediate layer is more preferable.

  Moreover, in order to improve the adhesiveness of the decoration layer by the lamination in a subsequent transfer process, one surface of the base material (front plate) can be subjected to surface treatment in advance. As the surface treatment, it is preferable to carry out a surface treatment (silane coupling treatment) using a silane compound (silane coupling agent). As the silane coupling agent, those having a functional group that interacts with the photosensitive resin are preferable. For example, a silane coupling solution (N-β (aminoethyl) γ-aminopropyltrimethoxysilane 0.3 mass% aqueous solution, trade name: KBM603, manufactured by Shin-Etsu Chemical Co., Ltd.) is sprayed for 20 seconds by a shower, and pure water shower washing is performed. To do. Thereafter, the reaction is carried out by heating. A heating tank may be used, and the reaction can be promoted by preheating the substrate of the laminator.

In the transfer method by half-cutting, first, after pre-cutting with a razor or the like at the boundary between the image portion and the non-image portion of the decorative layer, the protective film, the decorative layer and the intermediate layer of the non-image portion are removed with a tape, and further the image portion Similarly, the protective film is removed, and the decorative layer pattern is transferred to the substrate.
On the other hand, in the transfer method by die cutting, first, as shown in FIGS. 11 to 13, after pre-cutting so as to penetrate all layers with a razor or the like at the boundary between the image part 32 and the non-image part 31 of the decorative layer, The protective film of the image part 32 which remained after removing the said decoration layer (non-image part 31) of this area | region is removed with a tape, and a decoration layer pattern is transcribe | transferred to a board | substrate.
Subsequently, the decorative layer pattern can be formed by removing the thermoplastic resin layer and the intermediate layer by development.
You may combine well-known image development facilities, such as a brush and a high pressure jet, as needed. After development, post-exposure and post-bake may be performed as necessary, and post-bake is preferably performed.
Hereinafter, when forming the said decoration layer using a precut system, the detail of a preferable precut process, a transfer process, an exposure process, a development process, and another process is demonstrated.

-Pre-cut process-
(I) Half-cut process First, in the pre-cut process, the half-cut process in the method of forming the decorative layer, that is, part of the transfer film penetrates the decorative layer and penetrates the temporary support. The process of making a notch depth cut will be described below.
There is no restriction | limiting in particular as the method of making the said incision, Incision can be made by arbitrary methods, such as a blade and a laser, and it is preferable to make an incision with a blade. Further, the structure of the blade is not particularly limited.
When the transfer film is composed of, for example, a temporary support, a thermoplastic resin layer, an intermediate layer, a decorative layer, and a protective film, in that order, for example, using a blade or a laser, from above the protective film, By cutting through the protective film, the decorative layer, and the intermediate layer and reaching a part of the thermoplastic resin layer, it is possible to separate the image portion to be transferred and the non-image portion not to be transferred.

  In order to selectively transfer the image portion of the decorative layer precut by the half cut to the substrate, it is necessary to devise a method for not transferring the non-image portion. One method is a method of removing the decorative layer in the non-image area before transfer, and after removing the protective film, the decorative layer and the intermediate layer in the non-image area are simultaneously peeled off. The other is a method of peeling off the protective film on the non-image area, subsequently peeling off the decorative layer and the intermediate layer at the same time, and further peeling off the protective film on the image area. From the viewpoint of protecting the image portion of the decorative layer until just before transfer, the latter is preferred.

(Ii) Die-cutting step Next, in the pre-cutting step, the die-cutting step in the method for forming the decorative layer, that is, the step of making a cut through the temporary support from the decorative layer into a part of the transfer film. Will be described below.
There is no restriction | limiting in particular as the method of making the said incision like a half cut, It can cut with arbitrary methods, such as a blade and a laser, It is preferable to make incision with a blade. Further, the structure of the blade is not particularly limited.
When the transfer film is composed of, for example, a temporary support, a thermoplastic resin layer, an intermediate layer, a decorative layer, and a protective film, in that order, for example, using a blade or a laser, from above the protective film, By making a cut through the protective film, the decorative layer, the intermediate layer, the thermoplastic resin layer, and the temporary support, it is possible to separate between the image portion to be transferred and the non-image portion not to be transferred.

-Transfer process-
The said transfer process is a process of transferring the said decoration layer of the said transfer film after a precut process on a base material.
At this time, a method of removing the temporary support after laminating the decorative layer of the transfer film on the substrate is preferable.
Transfer (bonding) of the decorative layer to the substrate surface is performed by stacking the decorative layer on the substrate surface, pressurizing and heating. For laminating, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator that can further increase productivity can be used.

-Exposure process, development process-
When a decoration layer contains a photocurable resin, you may perform an exposure process after a precut process, and the preferable aspect of the exposure process after a precut process is the same as the preferable aspect of the exposure process in a photography system. When the decorative layer does not contain a photocurable resin, the exposure process may not be performed after the precut process.

The preferred embodiment of the development step after patterning after the precut step is the same as the preferred embodiment of the development step in the photographic system, and the development used in the step of developing the exposed photocurable resin layer in the photographic method. The liquid can also be used in the development step after patterning after the precut step. Further, a known surfactant can be further added to the alkali developer. The concentration of the surfactant is preferably 0.01% by mass to 10% by mass.
The method of removing the thermoplastic resin layer and the intermediate layer may be any of paddle, shower, shower & spin, dip, and the like used for developing the exposed photocurable resin layer. As an example of the step of removing the thermoplastic resin layer and the intermediate layer, the method described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be suitably used in the present invention.

(2) Post-bake The decorative layer forming method preferably includes a post-bake step after the transfer step, and more preferably includes a step of post-bake after the step of removing the thermoplastic resin layer and the intermediate layer. preferable.
The decorative layer is formed by heating the decorative layer after the transfer step at 180 to 300 ° C. in an environment of 0.08 to 1.2 atm. It is preferable from the viewpoint.
The post-baking is more preferably performed in an environment of 0.5 atm or more. On the other hand, it is more preferable to carry out in an environment of 1.1 atm or less, and it is particularly preferred to carry out in an environment of 1.0 atm or less. Furthermore, it is more preferable to carry out in an environment of about 1 atm (atmospheric pressure) from the viewpoint of reducing the manufacturing cost without using a special decompression device. Here, conventionally, when the decorative layer is formed by curing by heating, it is performed in a reduced pressure environment of a very low pressure, and the whiteness after baking is maintained by lowering the oxygen concentration. By using a transfer film formed using a coating liquid for a decoration layer containing a silicone resin, the whiteness of the decoration layer can be increased even after baking in the above pressure range.
The post-baking temperature is more preferably 200 to 280 ° C, and particularly preferably 220 to 260 ° C.
The post-baking time is more preferably 20 to 150 minutes, and particularly preferably 30 to 100 minutes.
The post-baking may be performed in an air environment or a nitrogen substitution environment, but it is particularly preferable to perform the post-bake from the viewpoint of reducing the manufacturing cost without using a special decompression device.

(3) Other process The formation method of a decoration layer may have other processes, such as a post-exposure process.
When the said decoration layer has a photocurable resin layer, when forming the said decoration layer, it is preferable that a post-exposure process is included. The post-exposure step may be performed only from the surface direction of the decorative layer on the side in contact with the base material, or from only the surface direction on the side not in contact with the transparent base material, or from both sides. Also good.

  As examples of other steps, the method described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be suitably used in the present invention.

<Transparent resin film>
The conductive film laminate and the capacitive input device of the present invention are formed by filling at least a step between the electrode pattern and the front plate with the transparent resin film of the present invention.

The method for filling at least the step between the electrode pattern and the front plate with the transparent resin film of the present invention is not particularly limited, but the transfer film of the present invention is transferred by half-cutting described in the method for forming the decorative layer. It is preferable that the transparent resin film of the present invention is prepared to have a size equivalent to the inner diameter of the decorative layer by using a method or a transfer method by die cutting, and the transparent resin film of the present invention is transferred to the front plate.
A preferred embodiment of the method for transferring the transparent resin film of the present invention to the front plate is the same as the preferred embodiment of the method for forming the decorative layer using the transfer film.
On the other hand, the liquid resist solution for the transparent resin film of the present invention is applied or printed at least on the step portion between the electrode pattern and the front plate, and cured by a known method, thereby at least the electrode pattern and the front plate. The step between them may be filled with the transparent resin film of the present invention.

  In the conductive film laminate and the capacitive input device according to the present invention, the transparent resin film is heated to 180 to 300 ° C. in an environment of 0.08 to 1.2 atm. It is preferable from the viewpoint of compatibility. The preferable aspect of a heating is the same as the preferable aspect of the post-baking in the formation method of the said decoration layer.

<(1) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction via connection portions>
In the method of manufacturing the capacitance-type input device, at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, the temporary support and the photocurable resin layer are arranged in this order. It is preferable that the transparent conductive material is formed by etching using the etching pattern formed by the transfer film having, and the transfer film having a temporary support, a thermoplastic resin layer, and a curable resin layer in this order. More preferably, the transparent conductive material is etched by using the formed etching pattern.
Furthermore, at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element includes a temporary support and a photocurable resin layer, and a transfer film having a photocurable resin layer It is more preferable to use an etching pattern formed by a transfer film having a photocurable resin layer having a temporary support, a thermoplastic resin layer, and a photocurable resin layer in this order. It is particularly preferable to use it.
On the other hand, the method for manufacturing a capacitance-type input device includes at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, a temporary support, a conductive curable resin layer, Are preferably formed using a transfer film having a temporary support, a thermoplastic resin layer, and a conductive curable resin layer in this order.
Forming at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element using a transfer film having a temporary support and a conductive curable resin layer in this order. Specifically, a transfer film having at least one of the first transparent electrode pattern, the second transparent electrode pattern, and the conductive element, and a temporary support and a conductive curable resin layer in this order. The conductive curable resin layer is transferred and formed.
That is, the first transparent electrode pattern 3 is preferably formed using an etching process or a transfer film having a conductive curable resin layer.

(Etching process)
When the first transparent electrode pattern 3 is formed by etching, first, a transparent electrode layer such as ITO is sputtered on one surface of the front plate 1 on which the decorative layer 2 or the transparent protective layer 7 is formed. Form. Next, etching is performed by exposure and development using a transfer film similar to the transfer film used for forming the decorative layer 2 except that the photocurable resin layer for etching is provided as the photocurable resin layer on the transparent electrode layer. Form a pattern. Thereafter, the transparent electrode layer is etched to pattern the transparent electrode, and the etching pattern is removed, whereby the first transparent electrode pattern 3 and the like can be formed.
Even when the transfer film having the photocurable resin layer is used as an etching resist (etching pattern), a resist pattern can be obtained in the same manner as in the above method. For the etching, etching and resist stripping can be applied by a known method described in paragraphs 0048 to 0054 of JP 2010-152155 A.

  For example, as an etching method, a commonly performed wet etching method in which the substrate is immersed in an etching solution can be used. As an etchant used for wet etching, an acid type or alkaline type etchant may be appropriately selected in accordance with an object to be etched. Examples of acidic etching solutions include aqueous solutions of acidic components such as hydrochloric acid, sulfuric acid, hydrofluoric acid, and phosphoric acid, and mixed aqueous solutions of acidic components and salts of ferric chloride, ammonium fluoride, potassium permanganate, and the like. Is done. As the acidic component, a combination of a plurality of acidic components may be used. In addition, alkaline type etching solutions include sodium hydroxide, potassium hydroxide, ammonia, organic amines, aqueous solutions of alkali components such as organic amine salts such as tetramethylammonium hydroxide, alkaline components and potassium permanganate. A mixed aqueous solution of a salt such as A combination of a plurality of alkali components may be used as the alkali component.

The temperature of the etching solution is not particularly limited, but is preferably 45 ° C. or lower. The resin pattern used as an etching mask (etching pattern) in the present invention is particularly excellent with respect to acidic and alkaline etching solutions in such a temperature range by being formed using the decorative layer described above. Demonstrate resistance. Therefore, the resin pattern is prevented from peeling off during the etching process, and the portion where the resin pattern does not exist is selectively etched.
After the etching, a cleaning process and a drying process may be performed as necessary to prevent line contamination. For the cleaning process, for example, the base material is cleaned with pure water for 10 to 300 seconds at room temperature, and for the drying process, the air blow pressure (about 0.1 to 5 kg / cm ² ) is appropriately adjusted using an air blow. Just do it.

  Next, the peeling method of the resin pattern is not particularly limited, and examples thereof include a method of immersing the substrate in a peeling solution being stirred at 30 to 80 ° C., preferably 50 to 80 ° C. for 5 to 30 minutes. The resin pattern used as an etching mask in the present invention exhibits excellent chemical resistance at 45 ° C. or lower as described above, but exhibits a property of swelling by an alkaline stripping solution when the chemical temperature is 50 ° C. or higher. . Due to such properties, when the peeling step is performed using a peeling solution of 50 to 80 ° C., there is an advantage that the process time is shortened and the peeling residue of the resin pattern is reduced. That is, by providing a difference in the chemical temperature between the etching process and the peeling process, the resin pattern used as an etching mask in the present invention exhibits good chemical resistance in the etching process, while in the peeling process. Good peelability will be exhibited, and both conflicting properties of chemical resistance and peelability can be satisfied.

  Examples of the stripping solution include inorganic alkali components such as sodium hydroxide and potassium hydroxide, organic alkali components such as tertiary amine and quaternary ammonium salt, water, dimethyl sulfoxide, N-methylpyrrolidone, or these. A stripping solution dissolved in a mixed solution of You may peel by the spray method, the shower method, the paddle method etc. using said peeling liquid.

(Method using transfer film having conductive curable resin layer)
In addition, the transfer film having a temporary support and a curable resin layer can be used as a lift-off material to form the first transparent electrode pattern, the second transparent electrode pattern, and other conductive members. Examples of the transfer film include a transfer film having the photocurable resin layer. Also in this case, the transfer film having the temporary support and the curable resin layer preferably has the thermoplastic resin layer between the temporary support and the curable resin layer. In this case, after patterning using a transfer film having a photocurable resin layer, after forming a transparent conductive layer on the entire surface of the substrate, the transfer film having a decorative layer or a photocurable resin layer together with the deposited transparent conductive layer A desired transparent conductive layer pattern can be obtained by dissolving and removing the photocurable resin layer in (lift-off method).

  When the first transparent electrode pattern 3 is formed using a transfer film having a conductive curable resin layer, it can be formed by transferring the conductive curable resin layer to the surface of the front plate 1. it can.

When the first transparent electrode pattern 3 is formed using a transfer film having the conductive curable resin layer, the front plate (substrate) having an opening has no resist component leakage from the opening, and the back side of the front plate. In a simple process, the touch panel can be manufactured with a merit of thinning and weight reduction.
Furthermore, in forming the first transparent electrode pattern 3, a transfer film having a specific layer structure having a thermoplastic resin layer between the conductive curable resin layer and the temporary support is used to laminate the transfer film. Bubble generation is prevented, and the first transparent electrode pattern 3 having excellent conductivity and low resistance can be formed.

  Moreover, when the said transfer film has a conductive curable resin layer, a conductive fiber etc. contain in the said conductive curable resin layer.

-Conductive curable resin layer (conductive fiber)-
When the transfer film on which the conductive curable resin layer is laminated is used for forming a transparent electrode pattern or another conductive element, the following conductive fibers can be used for the conductive curable resin layer.

There is no restriction | limiting in particular as a structure of an electroconductive fiber, Although it can select suitably according to the objective, Either a solid structure or a hollow structure is preferable.
Here, the fiber having a solid structure may be referred to as “wire”, and the fiber having a hollow structure may be referred to as “tube”. In addition, a conductive fiber having an average minor axis length of 1 nm to 1,000 nm and an average major axis length of 1 μm to 100 μm may be referred to as “nanowire”.
In addition, conductive fibers having an average minor axis length of 1 nm to 1,000 nm, an average major axis length of 0.1 μm to 1,000 μm, and having a hollow structure may be referred to as “nanotubes”.
The material of the conductive fiber is not particularly limited as long as it has conductivity, and can be appropriately selected according to the purpose. However, at least one of metal and carbon is preferable. The conductive fiber is particularly preferably at least one of metal nanowires, metal nanotubes, and carbon nanotubes.

-Metal nanowires-
--Metal--
The material of the metal nanowire is not particularly limited. For example, at least one metal selected from the group consisting of the fourth period, the fifth period, and the sixth period of the long periodic table (IUPAC 1991) is preferable. More preferably, at least one metal selected from Group 2 to Group 14 is selected from Group 2, Group 8, Group 9, Group 10, Group 11, Group 12, Group 13, and Group 14. At least one metal selected from the group is more preferable, and it is particularly preferable to include it as a main component.

Examples of the metal include copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel, titanium, bismuth, antimony, and lead. And alloys thereof. Among these, in view of excellent conductivity, those mainly containing silver or those containing an alloy of silver and a metal other than silver are preferable.
Containing mainly silver means that the metal nanowire contains 50% by mass or more, preferably 90% by mass or more.
Examples of the metal used in the alloy with silver include platinum, osmium, palladium and iridium. These may be used alone or in combination of two or more.

--- Shape--
The shape of the metal nanowire is not particularly limited and may be appropriately selected depending on the purpose. In applications where high transparency is required, a cylindrical shape and a cross-sectional shape with rounded polygonal corners are preferred.
The cross-sectional shape of the metal nanowire can be examined by applying a metal nanowire aqueous dispersion on a substrate and observing the cross-section with a transmission electron microscope (TEM).
The corner of the cross section of the metal nanowire means a peripheral portion of a point that extends each side of the cross section and intersects with a perpendicular drawn from an adjacent side. Further, “each side of the cross section” is a straight line connecting these adjacent corners. In this case, the ratio of the “outer peripheral length of the cross section” to the total length of the “each side of the cross section” was defined as the sharpness. For example, in the metal nanowire cross section as shown in FIG. 9, the sharpness can be represented by the ratio of the outer peripheral length of the cross section indicated by the solid line and the outer peripheral length of the pentagon indicated by the dotted line. A cross-sectional shape having a sharpness of 75% or less is defined as a cross-sectional shape having rounded corners. The sharpness is preferably 60% or less, and more preferably 50% or less. If the sharpness exceeds 75%, the electrons may be localized at this corner and plasmon absorption may increase, or the transparency may be deteriorated due to the yellowness remaining. Moreover, the linearity of the edge part of a pattern may fall and a shakiness may arise. The lower limit of the sharpness is preferably 30%, more preferably 40%.

--- Average minor axis length and average major axis length--
The average minor axis length of the metal nanowire (sometimes referred to as “average minor axis diameter” or “average diameter”) is preferably 150 nm or less, more preferably 1 nm to 40 nm, still more preferably 10 nm to 40 nm, 15 nm to 35 nm is particularly preferable.
When the average minor axis length is less than 1 nm, the oxidation resistance may be deteriorated and the durability may be deteriorated. When the average minor axis length is more than 150 nm, scattering due to metal nanowires occurs and sufficient transparency is obtained. There are times when you can't.
The average minor axis length of the metal nanowires was observed using 300 transmission metal microscopes (TEM; manufactured by JEOL Ltd., JEM-2000FX). The average minor axis length of was determined. In addition, the short axis length in case the short axis of the said metal nanowire is not circular made the longest short axis length.

The average major axis length (sometimes referred to as “average length”) of the metal nanowire is preferably 1 μm to 40 μm, more preferably 3 μm to 35 μm, and even more preferably 5 μm to 30 μm.
If the average major axis length is less than 1 μm, it may be difficult to form a dense network and sufficient conductivity may not be obtained. If it exceeds 40 μm, the metal nanowires are too long and manufactured. Sometimes entangled and agglomerates may occur during the manufacturing process.
The average major axis length of the metal nanowires is such that, for example, a transmission electron microscope (TEM; manufactured by JEOL Ltd., JEM-2000FX) is used to observe 300 metal nanowires. The average major axis length of the wire was determined. In addition, when the said metal nanowire was bent, the circle | round | yen which makes it an arc was considered and the value calculated from the radius and curvature was made into the major axis length.

  The thickness of the conductive curable resin layer is preferably from 0.1 to 20 μm, more preferably from 0.5 to 18 μm, from the viewpoint of process suitability such as the stability of the coating solution and the drying time during coating and the development time during patterning. Preferably, 1-15 micrometers is especially preferable. The content of the conductive fiber relative to the total solid content of the conductive curable resin layer is preferably 0.01 to 50% by mass, and 0.05 to 30% by mass from the viewpoints of conductivity and stability of the coating solution. Is more preferable, and 0.1 to 20% by mass is particularly preferable.

<(2) A plurality of second electrode patterns composed of a plurality of pad portions that are electrically insulated from the first transparent electrode pattern and extend in a direction crossing the first direction>
The second electrode pattern is preferably a transparent electrode pattern. The second transparent electrode pattern 4 can be formed using the transfer film having the etching treatment or the conductive curable resin layer. A preferred embodiment at that time is the same as the method for forming the first transparent electrode pattern 3.

<(3) Insulating layer that electrically insulates first transparent electrode pattern and second transparent electrode pattern>
When the insulating layer 5 is formed, a first transparent electrode pattern is formed by using a transfer film having the photocurable resin layer having an insulating photocurable resin layer as the photocurable resin layer. Further, it can be formed by transferring an insulating photocurable resin layer to the surface of the front plate 1.
In addition, when forming an insulating layer using a transfer film, the layer thickness of the insulating layer is preferably 0.1 to 5 μm, more preferably 0.3 to 3 μm, from the viewpoint of maintaining insulation. 2 μm is particularly preferable.

<(4) Conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second transparent electrode pattern and is different from the first transparent electrode pattern and the second transparent electrode pattern>
Said another electroconductive element 6 can be formed using the said etching process or the transfer film which has the said electroconductive curable resin layer.

<(5) Transparent protective layer>
When the transparent protective layer 7 is formed, the front plate on which each element is formed using a transfer film having the photocurable resin layer having a transparent photocurable resin layer as the photocurable resin layer. It can be formed by transferring a transparent photocurable resin layer to the surface of 1.
When forming a transparent protective layer using a transfer film, the thickness of the transparent protective layer is preferably 0.5 to 10 μm, more preferably 0.8 to 5 μm, from the viewpoint of exhibiting sufficient surface protection ability. -3 μm is particularly preferred.

[Image display device]
The image display device including the capacitive input device of the present invention as a constituent element is “latest touch panel technology” (published July 6, 2009, Techno Times), supervised by Yuji Mitani, “Touch Panel Technology and Development. The configurations disclosed in CM Publishing (2004, 12), FPD International 2009 Forum T-11 Lecture Textbook, Cypress Semiconductor Corporation Application Note AN2292, etc. can be applied.

Hereinafter, the present invention will be described more specifically with reference to examples.
The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below. Unless otherwise specified, “%” and “parts” are based on mass.
Examples 1 and 10 are reference examples.

[Example 1]
<Preparation of transfer film L1 for forming a white decorative layer (frame shape) for touch panel>
On a polyethylene terephthalate film (temporary support) having a thickness of 75 μm, a thermoplastic resin layer coating liquid: Formulation H1 was applied using a slit nozzle and dried to form a thermoplastic resin layer. Next, the intermediate layer coating solution: Formulation P1 was applied and dried to form an intermediate layer. Furthermore, the decoration layer coating solution: Formula L1 was applied and dried to form a decoration layer. In this way, a thermoplastic resin layer having a dry film thickness of 15.1 μm, an intermediate layer having a dry film thickness of 1.6 μm, and a white decorative layer having a dry film thickness of 35 μm were provided on the temporary support. . Finally, the protective film (thickness 12 μm polypropylene film) on the decorative layer was pressure-bonded. In this way, a transfer film for forming a white decorative layer was produced in which the temporary support, the thermoplastic resin layer, the intermediate layer (oxygen barrier film), the decorative layer, and the protective film were integrated.

(Coating solution for thermoplastic resin layer: Formulation H1)
Methanol: 11.1 parts by mass Propylene glycol monomethyl ether acetate: 6.36 parts by mass Methyl ethyl ketone: 52.4 parts by mass Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition ratio) (Molar ratio) =
55 / 11.7 / 4.5 / 28.8, weight average molecular weight = 100,000,
Tg (glass transition temperature) ≈70 ° C.): 5.83 parts by mass Styrene / acrylic acid copolymer (copolymerization composition ratio (molar ratio) = 63/37,
Weight average molecular weight = 10,000, Tg≈100 ° C.): 13.6 parts by mass / monomer 1 (trade name: BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.)
: 9.1 parts by mass / surfactant (fluorine polymer, trade name: Megafak F780F,
Manufactured by Dainippon Ink and Chemicals Incorporated): 0.54 parts by mass The above fluorine-containing _{polymer, C 6 F 13 CH 2 CH} 2 OCOCH = CH 2 40 parts of _{H (OCH (CH 3) CH} 2) 7 OCOCH = a copolymer of CH ₂ 55 parts of _{H (OCHCH 2) 7 OCOCH =} CH 2 5 parts, weight average molecular weight 30,000, methyl ethyl ketone 30 wt% solution.
The viscosity at 120 ° C. after removing the solvent of the coating solution for thermoplastic resin layer: Formulation H1 was 1500 Pa · sec.

(Coating liquid for intermediate layer: prescription P1)
Polyvinyl alcohol: 32.2 parts by mass (trade name: PVA205, manufactured by Kuraray Co., Ltd., saponification degree = 88%, polymerization degree 550)
・ Polyvinylpyrrolidone: 14.9 parts by mass (trade name: K-30, manufactured by ISP Japan Co., Ltd.)
-Distilled water: 524 parts by mass-Methanol: 429 parts by mass

(Coating liquid for decorative layer: Formula L1)
・ Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 56 parts by mass ・ Silicone resin KR-300 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Straight silicone xylene solution (solid content 50% by mass): 584 parts by mass. Silicone resin catalyst D-15 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Xylene solution (solid content: 25% by mass): 12 parts by mass, white pigment dispersion 1 (the following composition): 346 parts by mass, antioxidant (Irgafos168, manufactured by BASF Corp.): 0.6 parts by mass, interface Activator (Brand name: MegaFuck F-780F, manufactured by DIC Corporation)
: 2.2 parts by mass

-Composition of white pigment dispersion 1-
・ Titanium oxide (CR97 manufactured by Ishihara Sangyo; alumina / zirconia-treated rutile type,
Primary particle diameter 0.25 μm): 70.0 mass%
-Random copolymer (weight average molecular weight 37,000) of benzyl methacrylate / methacrylic acid = 72/28 molar ratio: 3.5% by mass
・ Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 26.5% by mass

Using a CO ₂ laser cutter (L-CPNC550, manufactured by Crime Products Co., Ltd.), all of the white decorative layer-forming transfer film (protective film, decorative film) is used to transfer the white decorative layer-forming transfer film before size punching. Layer, intermediate layer, thermoplastic resin layer and temporary support) were penetrated from the protective film side and punched out. As shown in FIG. 3, the white decorative layer-forming transfer film after punching is formed with an outer peripheral portion 42, a frame interior 41 having a straight portion, and a wiring extraction portion 43 having a straight portion.
By this punching, a white decorative layer-forming transfer film after punching having the shape of FIG. 10 was formed.

<Preparation of front plate with decorative layer (frame shape)>
Using glass (300 mm × 400 mm × 0.7 mm) tempered glass with an opening (15 mmΦ) as a transparent front plate (glass substrate) and spraying a glass detergent solution adjusted to 25 ° C. for 20 seconds with a shower Washed with a rotating brush having nylon bristles, washed with pure water shower, then silane coupling liquid (N-β (aminoethyl) γ-aminopropyltrimethoxysilane 0.3 mass% aqueous solution, trade name: KBM603, Shin-Etsu Chemical Co., Ltd.) (Made by Co., Ltd.) was sprayed for 20 seconds with a shower and washed with pure water. This glass substrate was preheated at 90 ° C. for 2 minutes with a substrate preheating apparatus.

As shown in FIGS. 11 and 12, the white decorative layer forming transfer film (white decorative layer forming transfer film after punching) punched with the blade 33 is used to protect the non-image portion 31 with a tape. Only 25 was peeled off, and similarly, the two layers of the decorative layer 24 and the intermediate layer 23 of the non-image part 31 were peeled off simultaneously using a tape. Further, only the protective film 25 in the region corresponding to the image portion 32 was peeled off.
The surface of the decorative layer 24 of the image portion 32 exposed after the protective film 25 is peeled off and the surface of the tempered glass that has been preheated at 90 ° C. and that has been subjected to the silane coupling treatment are overlapped to form a laminator (Co., Ltd.). ) Using Hitachi Industries (Lamic II type)), lamination was performed at a rubber roller temperature of 120 ° C., a linear pressure of 100 N / cm, and a conveying speed of 2.5 m / min. Subsequently, the polyethylene terephthalate temporary support 21 was peeled off at the interface with the thermoplastic resin layer 22 to remove the temporary support 21.
As a result, the decorative layer 24, the intermediate layer 23, and the thermoplastic resin layer 22 are transferred from the white decorative layer forming transfer film to the image portion 32 of the glass substrate, and are transferred to the non-image portion 31 of the glass substrate. Only the thermoplastic resin layer 22 was transferred from the white decorative layer forming transfer film.

Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 30 ° C. For 60 seconds, shower development was performed at a flat nozzle pressure of 0.1 MPa to remove the thermoplastic resin layer 22 and the intermediate layer 23 of the image portion 32 of the glass substrate and the thermoplastic resin layer 22 of the non-image portion 31. Subsequently, air was blown onto the upper surface of the glass base material to drain the liquid, and then pure water was sprayed for 10 seconds by a shower, pure water shower washing was performed, and air was blown to reduce a liquid pool on the glass base material.
Then, a white decoration layer 24 is formed by performing post-baking treatment at 240 ° C. for 60 minutes in air under atmospheric pressure (1 atm), and a white decoration layer having a thickness of 35 μm is formed on the upper surface of the glass substrate. Got the front plate. The obtained white decorative layer has a frame shape (also referred to as a frame shape), the length of one side inside the frame (frame) is 70 mm, and the length of the outer side parallel to the inner side is It was 90 mm. The outline of the white decorative layer is shown in FIG.

<Preparation of transfer film for embedding steps>
On a 50 μm thick polyethylene terephthalate film (temporary support, trade name Unipeel TP-6, manufactured by Unitika Co., Ltd.), using a slit-shaped nozzle, a coating solution for transparent resin film: Formulation C1 is applied and dried. Thus, a transparent resin film was formed.

(Coating liquid for transparent resin film: prescription C1)
-Methyl ethyl ketone (manufactured by Tonen Chemical Co., Ltd.): 20 parts by mass-Silicone resin KR-300 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Xylene solution of straight silicone (solid content 50% by mass): 26.8 parts by mass. Silicone resin KR-311 (manufactured by Shin-Etsu Chemical Co., Ltd.);
Straight silicone xylene solution (solid content 60% by mass): 201 parts by mass Zinc-based crosslinking catalyst (D-15, manufactured by Shin-Etsu Chemical Co., Ltd. (solid content concentration 25%))
: 1.07 parts by mass · Antioxidant (Irgafos 168, manufactured by BASF Corp.): 0.25 parts by mass · Surfactant (trade name: Megafac F-780F, manufactured by DIC Corp.): 1 part by mass

In this way, a transparent resin film having a dry film thickness of 35 μm was provided on the temporary support. The obtained transparent resin film was used as the transparent resin film of Example 1. The obtained transparent resin film has a shape that is 5 mm larger on each side than the length of the inner side of the frame (frame) of the white decorative layer. Details of the thickness of the transparent resin film of Example 1 and the formulation C1 of the coating liquid for transparent resin film are shown in Table 1 described later. However, when the edge part of a decoration layer has a taper shape, let the part which becomes equal to the maximum height of a decoration layer be a reference | standard which measures the length of the inner side of a white decoration layer (frame shape) (FIG. L indicated by 15).
Finally, a protective film (12 μm thick polypropylene film) was pressure-bonded on the transparent resin film of Example 1. In this way, the transfer film of Example 1 for embedding a step, in which the temporary support, the transparent resin film of Example 1 and the protective film were integrated, was produced.

<Inset of transparent resin film>
Using the CO ₂ laser cutter (L-CPNC550, manufactured by Crime Products Co., Ltd.), the transfer film for step embedding (protective film, transparent) A resin film and a temporary support) were penetrated from the protective film side and punched out by a die cutting method. The transfer film for embedding the step after punching is 5 mm larger on each side than the length of the inner side of the white decorative layer (frame shape). It is punched out so as to fit in the area where the decorative layer is not formed.

The front plate on which the decorative layer was formed was preheated at 90 ° C. for 2 minutes with a base material preheating device.
Only the protective film was peeled off from the transfer film of Example 1 for embedding a step after punching using a tape.
Example 1 for embedding a step so that the surface of the transparent resin film in the image area exposed after the protective film is peeled off and the surface of the tempered glass pretreated with silane coupling treated at 90 ° C. The transfer film is disposed in the frame of the white decorative layer without any gap, and the step between the front plate and the white decorative layer is filled with the transparent resin film, and each end of the transparent resin film is formed of the white decorative layer. A rubber roller using a laminator (manufactured by Hitachi Industries, Ltd. (Lamic II type)) so that it can be fitted 5 mm above each end (inner end) of the white decorative layer. Lamination was performed at a temperature of 120 ° C., a linear pressure of 100 N / cm, and a conveyance speed of 2.5 m / min. Since the edge part of a decoration layer has a taper shape, the reference | standard of the edge part of a decoration layer was made into the part equal to the maximum height of a decoration layer.
Subsequently, the polyethylene terephthalate temporary support was peeled off at the interface with the transparent resin film to remove the temporary support.

  Thereafter, a post-bake treatment was performed at 240 ° C. for 60 minutes in air under atmospheric pressure (1 atm), and the transparent resin film of Example 1 was placed without any gap in the frame of the white decorative layer, and the front plate and the white plate were added. The step with the decorative layer is filled with a transparent resin film, and each end of the transparent resin film is on the part of the surface opposite to the front panel of the white decorative layer, A front plate was obtained which was fitted so as to run 5 mm from each end.

<Evaluation of transparent resin film>
(Relative permittivity)
The relative dielectric constant of the transparent resin film was measured by CV-Map 92A (made by Four Dimensions, Inc.). The evaluation is based on a transparent resin film sample included in the front plate in which a transparent resin film is fitted in the frame of the white decorative layer after post-baking at 240 ° C. for 60 minutes in air under atmospheric pressure (1 atm). evaluated.
The evaluation results are shown in Table 2 below.

(Evaluation of transparency (after post-baking))
The front plate with the transparent resin film fitted in the frame of the white decorative layer produced as described above was observed by 10 persons, and the transparency of the transparent resin film was evaluated according to the following evaluation criteria. The practical level is B or higher.
<Evaluation criteria>
A: Number of people recognized as yellowish 0-1 people B: Number of people recognized as yellowish 2-5 people C: Number of people recognized as yellowish 6-10 People Evaluation results Is shown in Table 2 below.

<Formation of first transparent electrode pattern>
(Formation of transparent electrode layer)
A front plate on which a transparent resin film in which a step between the decorative layer and the decorative layer is embedded is formed is introduced into a vacuum chamber, and an ITO target having a SnO ₂ content of 10 mass% (indium: tin = 95: 5 ( A 40 nm thick ITO thin film is formed by DC magnetron sputtering (conditions: substrate temperature 250 ° C., argon pressure 0.13 Pa, oxygen pressure 0.01 Pa), and a transparent electrode layer is formed. A front plate was obtained. The surface resistance of the ITO thin film was 80Ω / □.

(Preparation of etching transfer film E1)
In the production of the white decorative layer forming transfer film L1, the white decorative layer was used except that the decorative layer coating solution: Formula L1 was used instead of the etching photocurable resin layer coating solution: Formula E1. The transfer film for etching in which the temporary support, the thermoplastic resin layer, the intermediate layer (oxygen barrier film), the photocurable resin layer for etching and the protective film are integrated in the same manner as the formation of the transfer film L1 E1 was obtained (the film thickness of the photocurable resin layer for etching was 2.0 μm).

-Coating liquid for photocurable resin layer for etching: Formula E1-
Methyl methacrylate / styrene / methacrylic acid copolymer (copolymer composition (mass%): 31/40/29, mass average molecular weight 60000,
Acid value 163 mg KOH / g): 16 parts by mass Monomer 1 (Brand name: BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.)
: 5.6 parts by mass-tetramethylene oxide monomethacrylate 0.5 mol adduct of hexamethylene diisocyanate: 7 parts by mass-cyclohexane dimethanol monoacrylate as a compound having one polymerizable group in the molecule: 2.8 parts by mass・ 2-Chloro-N-butylacridone: 0.42 parts by mass Biimidazole: 2.17 parts by mass ・ Leukocrystal violet: 0.26 parts by mass ・ Phenothiazine: 0.013 parts by mass ・ Surfactant (trade name: MegaFuck F-780F, manufactured by Dainippon Ink Co., Ltd.)
: 0.03 parts by mass · Methyl ethyl ketone: 40 parts by mass · 1-methoxy-2-propanol: 20 parts by mass

(Formation of first transparent electrode pattern)
In the same manner as the cleaning of the tempered glass in the formation of the decorative layer, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, and the front plate on which the transparent electrode layer is formed are cleaned, and then the protective film is applied. The removed transfer film E1 for etching was laminated (base material temperature: 130 ° C., rubber roller temperature 120 ° C., linear pressure 100 N / cm, conveyance speed 2.2 m / min). After peeling off the temporary support, the distance between the exposure mask (quartz exposure mask having a transparent electrode pattern) surface and the photocurable resin layer for etching is set to 200 μm, and the exposure amount is 50 mJ / cm ² (i-line). ) For pattern exposure.
Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 25 ° C. Developed for 100 seconds, washed with surfactant-containing cleaning solution (trade name: T-SD3 (manufactured by FUJIFILM Corporation) 10 times with pure water) at 33 ° C. for 20 seconds, The front plate was rubbed with a rotating brush, and the residue was removed by spraying pure water from an ultra-high pressure cleaning nozzle. Further, a post-baking treatment at 130 ° C. for 30 minutes is performed to obtain a front plate on which a decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a transparent electrode layer, and a photocurable resin layer pattern for etching are formed. It was.

  A decorative layer, a transparent resin film in which a step of the decorative layer is embedded, a transparent electrode layer and a front plate on which a photocurable resin layer pattern for etching is formed are made of an ITO etchant (hydrochloric acid, potassium chloride aqueous solution, liquid temperature 30 ° C.). Is immersed in an etching bath containing 100 to 100 seconds (etching treatment), and the transparent electrode layer in the exposed region not covered with the photocurable resin layer for etching is dissolved and removed. A front plate with a transparent electrode layer pattern with a transparent resin film embedded with steps and a photocurable resin layer pattern for etching was obtained.

  Next, a front plate with a transparent electrode layer pattern with a photocurable resin layer pattern for etching was applied to a resist stripping solution (N-methyl-2-pyrrolidone, monoethanolamine, surfactant (trade name: Surfynol 465). , Manufactured by Air Products, Inc., liquid temperature 45 ° C.), immersed in a resist stripping tank, treated for 200 seconds (peeling treatment), removed the photo-curable resin layer for etching, and a step between the decorative layer and the decorative layer The transparent resin film embedded in the first surface of the front plate and the first surface of the decorative layer disposed on both sides of the surface opposite to the surface facing the front plate as shown in FIG. A front plate with a transparent electrode pattern was obtained.

<Formation of insulating layer>
(Preparation of transfer film W1 for forming an insulating layer)
In the production of the decorative layer forming transfer film L1, the decorative layer forming transfer film L1 was prepared in place of the decorative layer forming coating liquid: the prescription L1, except that the insulating layer forming coating liquid: the prescription W1 was used. Similarly, a transfer film W1 for forming an insulating layer was obtained in which a temporary support, a thermoplastic resin layer, an intermediate layer (oxygen barrier film), a photocurable resin layer for an insulating layer, and a protective film were integrated ( The film thickness of the photocurable resin layer for the insulating layer is 1.4 μm).

-Coating liquid for insulating layer formation: Formula W1-
Binder 3 (cyclohexyl methacrylate (a) / methyl methacrylate (b) / methacrylic acid copolymer (c) glycidyl methacrylate adduct (d) (composition (% by mass): a / b / c / d = 46/1) / 10/43, mass average molecular weight: 36000, acid value 66 mgKOH / g) 1-methoxy-2-propanol, methyl ethyl ketone solution (solid content: 45%)): 12.5 parts by mass DPHA (dipentaerythritol hexaacrylate) Manufactured by Nippon Kayaku Co., Ltd.)
Propylene glycol monomethyl ether acetate solution (76% by mass)
: 1.4 parts by mass / urethane monomer (trade name: NK Oligo UA-32P, manufactured by Shin-Nakamura Chemical Co., Ltd .: non-volatile content 75%, propylene glycol monomethyl ether acetate:
25%): 0.68 parts by mass. Tripentaerythritol octaacrylate (trade name: V # 802,
Osaka Organic Chemical Industry Co., Ltd.): 1.8 parts by mass. Diethylthioxanthone: 0.17 parts by mass. 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1-
[4- (4-morpholinyl) phenyl] -1-butanone (Brand name: Irgacure 379, manufactured by BASF): 0.17 parts by mass Dispersant (Brand name: Solsperse 20000, manufactured by Avicia): 0.19 parts by mass, interface Activator (Brand name: Megafuck F-780F, manufactured by Dainippon Ink)
: 0.05 parts by mass-Methyl ethyl ketone: 23.3 parts by mass-MMPGAc (manufactured by Daicel Chemical Co., Ltd.): 59.8 parts by mass The viscosity at 100 ° C. after removing the solvent of the coating liquid W1 for forming the insulating layer is 4000 Pa.・ It was sec.

In the same manner as the cleaning of the tempered glass substrate in the formation of the decorative layer, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, and the front plate with the first transparent electrode pattern are cleaned, and then the silane The insulating film-forming transfer film W1 from which the protective film was removed was laminated (base material temperature: 100 ° C., rubber roller temperature 120 ° C., linear pressure 100 N / cm, conveyance speed 2.3 m / min). After removing the temporary support, the distance between the exposure mask (quartz exposure mask having the insulating layer pattern) surface and the insulating layer was set to 100 μm, and pattern exposure was performed at an exposure amount of 30 mJ / cm ² (i-line). .

  Next, using a triethanolamine developer (containing 30% by mass of triethanolamine, trade name: T-PD2 (manufactured by Fuji Film Co., Ltd.) diluted 10 times with pure water) at 33 ° C. Using a sodium carbonate / sodium hydrogen carbonate developer (trade name: T-CD1 (manufactured by Fuji Film Co., Ltd.) diluted 5 times with pure water) at 25 ° C. for 60 seconds. Developed for 50 seconds. Next, using a surfactant-containing cleaning solution (trade name: T-SD3 (manufactured by Fuji Film Co., Ltd.) diluted 10-fold with pure water), it was washed at 33 ° C. for 20 seconds, and the surface was cleaned with a rotating brush. The residue was removed by rubbing the face plate and spraying pure water from an ultra-high pressure cleaning nozzle. Furthermore, the post-baking process for 230 degreeC and 60 minutes was performed, and the front board which formed the transparent resin film which embedded the level | step difference of the decorating layer and the decorating layer, the 1st transparent electrode pattern, and the insulating layer pattern was obtained.

<Formation of second transparent electrode pattern>
(Formation of transparent electrode layer)
In the same manner as the formation of the first transparent electrode pattern, the front plate on which the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, and the insulating layer pattern is formed is formed by DC magnetron sputtering. Processed (conditions: substrate temperature 50 ° C., argon pressure 0.13 Pa, oxygen pressure 0.01 Pa), an ITO thin film with a thickness of 80 nm is formed, and a transparent resin film in which a step between the decorative layer and the decorative layer is embedded A front plate on which a first transparent electrode pattern, an insulating layer pattern, and a transparent electrode layer were formed was obtained. The surface resistance of the ITO thin film was 110Ω / □.

In the same manner as the formation of the first transparent electrode pattern, using the etching transfer film E1, a transparent resin film in which the steps of the decorative layer and the decorative layer are embedded, the first transparent electrode pattern, the insulating layer pattern, and the transparent A front plate on which an electrode layer and a photocurable resin layer pattern for etching were formed was obtained (post-baking treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, an etching process (30 ° C., 50 seconds) is performed, and then the photocurable resin layer for etching is removed (peeling process: 45 ° C., 200 seconds). By, the decorative layer, the transparent resin film embedded in the step of the decorative layer, the first transparent electrode pattern, the insulating layer pattern, one surface of the front plate and the surface of the decorative layer facing the front plate Obtained a front plate on which a second transparent electrode pattern was formed as shown in FIGS. 18 and 19 across both regions of the opposite surface.

<Formation of Conductive Element Different from First and Second Transparent Electrode Pattern>
Similarly to the formation of the first and second transparent electrode patterns, the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, and the second transparent electrode The front plate on which the pattern was formed was subjected to DC magnetron sputtering treatment to obtain a front plate on which an aluminum (Al) thin film having a thickness of 200 nm was formed.

In the same manner as the formation of the first and second transparent electrode patterns, using the etching transfer film E1, the decorative layer, a transparent resin film in which the steps of the decorative layer are embedded, the first transparent electrode pattern, A front plate on which an insulating layer pattern, a second transparent electrode pattern, an aluminum thin film, and a photocurable resin layer pattern for etching were formed was obtained (post-bake treatment; 130 ° C., 30 minutes).
Further, in the same manner as the formation of the first transparent electrode pattern, by performing an etching process (30 ° C., 50 seconds), and then removing the photocurable resin layer for etching (peeling process: 45 ° C., 200 seconds), The decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, and the conductive element different from the first and second transparent electrode patterns A front plate formed was obtained.

<Preparation of transparent protective layer>
(Method for forming transparent protective layer-A)
Using the coating solution formulation 1 for photosensitive resin layer described in Example 1 of JP2012-78528A, according to the method described in paragraphs 0103 to 0113 of the same publication, a temporary support (PET) and a thermoplastic resin A photosensitive transfer film in which a layer, an intermediate layer, and a photosensitive resin layer were integrated was produced.
Front plate having a white decorative layer (frame shape) embedded with the transparent resin film of Example 1 (decorative layer, transparent resin film embedded with a step in the decorative layer, first transparent electrode pattern, insulating layer pattern, The photosensitive resin layer of the prepared photosensitive transfer film is placed on a temporary support (PET) on the second transparent electrode pattern, a front plate on which a conductive element different from the first and second transparent electrode patterns is formed. ) And then transferred together with the thermoplastic resin layer and the intermediate layer (layer forming step).
Next, using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) having an ultrahigh pressure mercury lamp, the entire surface was exposed from the thermoplastic resin layer side at i line and 40 mJ / cm ² . Next, a triethanolamine developer (containing 30% triethanolamine, trade name: T-PD2 (manufactured by FUJIFILM Corporation) 10 times with pure water (1 part of T-PD2 and 9 parts of pure water). The mixture was diluted to 30) at 30 C for 60 seconds at a flat nozzle pressure of 0.04 MPa to remove the thermoplastic resin and the intermediate layer. Subsequently, air was blown onto the upper surface (photosensitive resin layer side) of the glass substrate to drain the liquid, and then pure water was blown for 10 seconds in a shower, washed, and air was blown to remove a liquid pool on the glass substrate. Reduced. Next, the substrate is heat-treated at 230 ° C. for 60 minutes (post-bake), the decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second Obtaining a transparent electrode pattern, a front plate on which a conductive element different from the first and second transparent electrode patterns and a transparent protective layer-A are laminated, a conductive film laminate and a capacitive input device of Example 1 It was.

<Evaluation of capacitive input device>
(Evaluation of disconnection of electrode pattern when manufacturing capacitive input device)
The presence or absence of disconnection of the electrode pattern was evaluated by evaluating the electrical continuity between 4A and 4B of the transparent electrode pattern of FIGS. 18 and 19, and was evaluated according to the following criteria. B and above are practical levels.

<Evaluation criteria>
A: Disconnection rate 5% or less B: Disconnection rate 5% or more, 50% or less C: Disconnection rate 50% or more
The evaluation results are shown in Table 2 below.

(Effect of preventing disconnection when dropped (disconnection of the electrode pattern when the front panel of the capacitive input device is broken))
The glass substrate on which the electrode was produced as described above was dropped onto the concrete from a height of 70 cm so that the surface of the transparent resin film faced upward, and the presence or absence of the transparent electrode breakage in the state where the substrate cracked was evaluated. . The presence or absence of disconnection was evaluated by the electrical continuity between 4A and 4B of the transparent electrode patterns of FIGS.

<Evaluation criteria>
A: Disconnection rate 5% or less B: Disconnection rate 5% or more, 30% or less C: Disconnection rate 30% or more, 50% or less D: Disconnection rate 50% or more
The evaluation results are shown in Table 2 below.

(Angle A, B)
The cross-sectional shape was observed by SEM, and a schematic diagram of the cross-sectional shape is shown in FIG. The angles A and B formed by the transparent resin film in FIG. 17 were measured.
The definition of the angle A is an angle formed by the tangent line drawn from the end of the transparent resin film to the transparent resin film formed on the decorative layer and the surface of the decorative layer on the transparent resin film side.
The definition of the angle B is a transparent resin from the point that the surface of the transparent resin film where the film thickness is not constant in the part that is not the upper part of the decorative layer and the effect of the decorative layer in which the transparent resin film exists below begins to rise. This is the angle formed by the tangent line drawn to the raised part due to the influence of the decorative layer existing below the film.
The evaluation results are shown in Table 2 below.

[Examples 2 to 6 and 10]
In Example 1, the transparent resin film coating solution: Transparent prepared in the same manner as the preparation of the transparent resin film coating solution: Formulation C1, except that the formulation described in Tables 1 and 2 below was used instead of the formulation C1. Transparent resin films and transfer films for embedding steps were prepared in the same manner as in Example 1 except that the resin film coating solution was used.
In place of the step-embedding transfer film used in Example 1, instead of using the prepared step-embedding transfer films of Examples 2 to 6 and 10, respectively, the same procedures as those for embedding the transparent resin film in Example 1 were used. The transparent resin film is inserted so that there is no gap in the frame of the white decorative layer and each end of the transparent resin film runs 5 mm above the white decorative layer, and the step between the decorative layer and the decorative layer The transparent resin film, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, the conductive element different from the first and second transparent electrode patterns, and the transparent protective layer-A were formed. A front plate was produced, and the conductive film laminate and the capacitive input device of Examples 2 to 6 and 10 were used.
The results of evaluating the transparent resin films and the capacitive input devices of Examples 2 to 6 and 10 in the same manner as in Example 1 are shown in Table 2 below.

[Examples 7 and 9]
The transfer film for embedding steps of Examples 7 and 9 is the same as Example 3 except that the film thickness of the transparent resin film is 100 μm (Example 7) and 5 μm (Example 9), respectively. Was made.
Instead of using the transfer film for embedding the steps of Examples 7 and 9 instead of the transfer film for embedding the steps used in Example 1, in the same manner as the embedding of the transparent resin film of Example 1, Insert the transparent resin film so that there is no gap in the frame of the white decorative layer and each end of the transparent resin film runs 5mm above the white decorative layer, and embeds the steps of the decorative layer and the decorative layer. A front plate on which a transparent resin film, a first transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, a conductive element different from the first and second transparent electrode patterns, and a transparent protective layer-A are formed. Were made to be a conductive film laminate and a capacitive input device of Examples 7 and 9.
The results of evaluating the transparent resin films and the capacitive input devices of Examples 7 and 9 in the same manner as in Example 1 are shown in Table 2 below.

[Example 8]
In Example 8, instead of inserting a transparent resin film into the frame of the white decorative layer using a transfer film, a transparent resin film was prepared by application using a liquid resist.
In Example 1, instead of the coating solution for transparent resin film: formulation C1, the same procedure as in the preparation of coating solution for transparent resin film: formulation C1 except that the formulation described in Tables 1 and 2 below was used. A coating solution for transparent resin film for 8 was prepared.
In the frame of the white decorative layer on the glass base material provided with the white decorative layer used in Example 1, a coater for glass base material (manufactured by FS Japan Co., Ltd., product) (Name: MH-1600), a transparent resist for forming a transparent resin film for Example 8 was applied. Subsequently, after part of the solvent was dried by VCD (vacuum dryer, manufactured by Tokyo Ohka Kogyo Co., Ltd.) for 30 seconds to eliminate the fluidity of the coating layer, the periphery of the substrate was measured by EBR (edge bead remover). The unnecessary coating solution was removed and prebaked at 120 ° C. for 3 minutes to obtain a transparent resin film having a thickness of 5.0 μm on the tempered glass (liquid resist method). The application of the coating solution for producing the transparent resin film was repeated 20 times to obtain a transparent resin film having a film thickness of 100 μm of Example 8 in which 20 layers having a film thickness of 5.0 μm were formed on the glass substrate. In addition, after exceeding the film thickness of the white decoration layer, it apply | coated so that each edge part of a transparent resin film might run on 5 mm at a time on a white decoration layer. The obtained decorative layer, the transparent resin film in which the step of the decorative layer is embedded, the first transparent electrode pattern, the insulating layer pattern, the second transparent electrode pattern, different from the first and second transparent electrode patterns The front plate on which the conductive element and the transparent protective layer-A were formed was used as the conductive film laminate and the capacitive input device of Example 8.
The results of evaluating the transparent resin film and the capacitive input device of Example 8 in the same manner as in Example 1 are shown in Table 2 below.

[Comparative Example 1]
In Example 1, the step of embedding the step-embedded transfer film, that is, in the same manner as in Example 1 except that the transparent resin is not present inside the frame of the white decorative layer, the white decorative layer, A front plate on which a transparent element pattern, an insulating layer pattern, a second transparent electrode pattern, a conductive element different from the first and second transparent electrode patterns and a transparent protective layer-A are formed is prepared. 1 conductive film laminate and capacitive input device.
The results of evaluating the capacitive input device of Comparative Example 1 in the same manner as in Example 1 are shown in Table 2 below.

[Comparative Example 2]
Coating liquid for transparent resin film of Example 1: In preparation of formulation C1, benzyl methacrylate / methacrylic acid which is an acrylic resin / random copolymer of 68/32 molar ratio, weight average molecular weight 50,000) (Comparative Example 2 ) In the same manner as in Example 1 (the same solid content is added), that is, in the same manner as in Example 1 except that the binder shown in Table 1 below is used. A transparent resin film embedded, a decorative layer, a transparent resin film embedded with a step in the decorative layer, a first transparent electrode pattern, an insulating layer pattern, a second transparent electrode pattern, a first and a second transparent electrode pattern Manufactured a front plate on which another conductive element and transparent protective layer-A were formed, and used as a capacitance-type input device of Comparative Example 2.
The results of evaluating the transparent resin film and the capacitive input device of Comparative Example 2 in the same manner as in Example 1 are shown in Table 2 below.

From Table 1 and Table 2, the transparent resin film of the present invention is disposed on the same front side as the transparent front plate, the functional layer disposed on a part of one surface of the front plate, and the functional layer of the front plate. Capacitance type input device having a patterned electrode pattern can fill at least a step between the electrode pattern and the front plate, has high transparency, and disconnects the electrode pattern during the production of the capacitance type input device. It was found that the disconnection of the electrode pattern when the front plate of the capacitive input device was cracked could be suppressed.
From the comparative example 1, the capacitance type input device having no transparent resin film between the electrode pattern and the front plate has a problem of disconnection of the electrode pattern during the production of the capacitance type input device. It has been found that there is a problem of disconnection of the electrode pattern when the front plate of the device is cracked.
From Comparative Example 2, the capacitance type input device having a transparent resin film containing neither a silicone resin nor a catalyst between the electrode pattern and the front plate has a low transparency after post-baking of the transparent resin film, and is in front of the capacitance type input device. It turned out that the problem of the disconnection of an electrode pattern also arises when a face plate is cracked.

From Table 1 and Table 2 above, it was also found that the electrode pattern is less likely to break as the angle A and / or the angle B shown in the schematic diagram of FIG. 17 is smaller. The angle A is preferably 15 ° or less, and more preferably 10 ° or less. The angle B is preferably 15 ° or less, and more preferably 10 ° or less.
On the other hand, from Table 1 and Table 2 above, it seemed that the performance of preventing disconnection at the time of dropping hardly correlates with the corners A and B.
Moreover, although the aspect which arrange | positions separately so that the edge part of a transparent resin film may not be ridden on a decoration layer (it does not overlap) is also considered, the edge part of a transparent resin film is partially ridden on a decoration layer ( Compared to the arrangement mode, the difference in performance is due to the transparency, the disconnection of the electrode pattern when manufacturing the capacitive input device, and the disconnection of the electrode pattern when the front plate of the capacitive input device is cracked. There wasn't. However, if the transparent resin film is formed by transferring the transparent resin film contained in the transfer film so as to fill at least the step between the electrode pattern and the front plate, the end of the transparent resin film is a decorative layer. It has been found that it is easier to manufacture an embodiment in which a part of the vehicle is placed on (superposed).

(Bubble trapping state near the white decorative layer)
In addition, the surface which formed the white decorative layer (frame shape) which embedded the transparent resin film of each Example, the surface which formed the decorative layer of the front plate, and the surface which formed the decorative layer are the other side. The surface was observed with a microscope using reflected light and transmitted light, and the bubble intake state in the vicinity of the white decorative layer was confirmed. In each of the conductive film laminates of each example, no air bubble was found in the vicinity of the white decorative layer (frame shape), or several air bubbles were taken in the vicinity of the white decorative layer (frame shape). However, it was confirmed that it could not be recognized from the surface opposite to the surface on which the decorative layer was formed.

DESCRIPTION OF SYMBOLS 1 Front plate 2 Decoration layer 3 First transparent electrode pattern 3a Pad part 3b Connection part 4 Second transparent electrode pattern 4A Second transparent electrode pattern 4B on one side of the decoration layer The other of the decoration layer Second transparent electrode pattern 5 on the side of the insulating layer 6 Conductive element 7, 7A Transparent protective layer 8 Opening 9 Transparent resin film of the present invention (for step filling)
L Inner diameter of decorative layer (one side)
11 Tempered glass A Angle formed by the tangent line drawn from the end of the transparent resin film to the transparent resin film formed on the decorative layer, and the surface of the decorative layer on the transparent resin film side B Upper part of the decorative layer Influence of the decorative layer with the transparent resin film underneath because the surface of the transparent resin film with a constant thickness in the part that is not and the point where the transparent resin film began to rise due to the influence of the decorative layer underneath The angle C formed by the tangent drawn to the raised part by the first direction D the second direction 21 Temporary support 22 Thermoplastic resin layer 23 Intermediate layer 24 Decorating layer 25 Cover film (protective film)
31 Non-image part 32 Image part 33 Blade 40 Transfer material 41 Inside frame 42 Outside frame 43 Wiring extraction part 44 Decoration layer (region not removed)
45 Area from which the decoration layer has been removed

Claims (19)

A transparent resin film containing at least a silicone resin and a catalyst and having a thickness of 5 to 300 μm;
The content of the catalyst is 0.5 to 5.0 mass% with respect to the content of the silicone resin,
The transparent resin film has a transparent front plate, a functional layer disposed on a part of one surface of the front plate, and an electrode pattern disposed on the same surface side as the functional layer of the front plate. A transparent resin film used to fill at least a step between the electrode pattern and the front plate of a capacitive input device. The transparent resin film according to claim 1, wherein the silicone resin includes at least an acrylic-modified silicone resin or a polyester-modified silicone resin, or a silicone resin containing these as a copolymerization component. The thickness of the transparent resin film is 10 to 300 [mu] m, the transparent resin film according to claim 1 or 2. The transparent resin film as described in any one of Claims 1-3 manufactured by the apply | coating system. A temporary support;
The transfer film containing the transparent resin film as described in any one of Claims 1-4 . A transparent front plate,
A functional layer disposed on a part of one surface of the front plate;
An electrode pattern disposed on the same side as the functional layer of the front plate,
The electrically conductive film laminated body which has a transparent resin film as described in any one of Claims 1-4 so that the level | step difference between the said electrode pattern and the said front plate may be filled at least. The transparent resin film, formed by formed by transferring a transparent resin film included in the transfer film of claim 5 to fill a level difference between at least the electrode pattern and the front plate, according to claim 6 The electrically conductive film laminated body of description. The electrically conductive film laminated body of Claim 6 or 7 whose thickness of the said functional layer is 5 micrometers or more. Wherein on a surface opposite to the front plate comprises a transparent protective layer, a conductive film laminate according to any one of claims 6-8 of the transparent resin layer, the functional layer and the electrode pattern. The conductive film laminate according to any one of claims 6 to 9 , wherein the transparent resin film is heated to 180 to 300 ° C in an environment of 0.08 to 1.2 atm. It said electrode pattern comprises the following (1) to (3), a conductive film laminate according to any one of claims 6-10;
(1) A plurality of first transparent electrode patterns formed by extending a plurality of pad portions in a first direction through connection portions;
(2) A plurality of second electrode patterns comprising a plurality of pad portions that are electrically insulated from the first transparent electrode pattern and extend in a direction crossing the first direction;
(3) An insulating layer that electrically insulates the first transparent electrode pattern from the second electrode pattern. And (4) a conductive element that is electrically connected to at least one of the first transparent electrode pattern and the second electrode pattern and is different from the first transparent electrode pattern and the second electrode pattern. The electrically conductive film laminated body of Claim 11 which has these. The conductive film laminate according to claim 11 or 12 , wherein the (2) second electrode pattern is a transparent electrode pattern. End of the functional layer is a tapered shape, the conductive film laminate according to any one of claims 6 to 13. End of the transparent resin film, wherein the functional layer the front plate of the disposed over at least a portion of the surface opposite the conductive film laminate according to any one of claims 6-14 . The functional layer is a decorative layer, a conductive film laminate according to any one of claims 6-15. The electrically conductive film laminated body of Claim 16 with which the level | step difference of the said front board and the said decoration layer was filled with the said transparent resin film. An electrostatic capacitance type input device comprising the conductive film laminate according to any one of claims 6 to 17 . An image display device comprising the capacitive input device according to claim 18 as a component.

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