JP6203855B2 - 金属ウィスカーの発生を低減するための方法及び装置 - Google Patents

金属ウィスカーの発生を低減するための方法及び装置 Download PDF

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Publication number
JP6203855B2
JP6203855B2 JP2015537703A JP2015537703A JP6203855B2 JP 6203855 B2 JP6203855 B2 JP 6203855B2 JP 2015537703 A JP2015537703 A JP 2015537703A JP 2015537703 A JP2015537703 A JP 2015537703A JP 6203855 B2 JP6203855 B2 JP 6203855B2
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Japan
Prior art keywords
electromagnetic energy
controlling
energy source
whisker
emitter
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JP2015537703A
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English (en)
Japanese (ja)
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JP2015534279A5 (https=
JP2015534279A (ja
Inventor
ジェイ・ クレメン、ジュニア、マーク
ジェイ・ クレメン、ジュニア、マーク
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Boeing Co
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Boeing Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2015537703A 2012-10-19 2013-08-30 金属ウィスカーの発生を低減するための方法及び装置 Active JP6203855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/656,293 US9532463B2 (en) 2012-10-19 2012-10-19 Methods and apparatus for reducing the occurrence of metal whiskers
US13/656,293 2012-10-19
PCT/US2013/057489 WO2014062301A1 (en) 2012-10-19 2013-08-30 Methods and apparatus for reducing the occurrence of metal whiskers

Publications (3)

Publication Number Publication Date
JP2015534279A JP2015534279A (ja) 2015-11-26
JP2015534279A5 JP2015534279A5 (https=) 2016-03-31
JP6203855B2 true JP6203855B2 (ja) 2017-09-27

Family

ID=49263427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015537703A Active JP6203855B2 (ja) 2012-10-19 2013-08-30 金属ウィスカーの発生を低減するための方法及び装置

Country Status (4)

Country Link
US (1) US9532463B2 (https=)
EP (1) EP2910094B1 (https=)
JP (1) JP6203855B2 (https=)
WO (1) WO2014062301A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014116537B4 (de) * 2014-11-12 2024-05-29 Infineon Technologies Ag Funktionales Hautpflaster sowie System zum Überwachen eines Körpergesundheitsparameters
KR102277371B1 (ko) * 2019-03-26 2021-07-14 (주)앨트론 위스커 성장 방지를 위한 전자빔 조사 방법
CN110512244B (zh) * 2019-09-19 2021-03-09 昆山一鼎工业科技有限公司 电镀雾锡产品的表面处理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0307096D0 (en) * 2003-03-27 2003-04-30 Univ Cambridge Tech Terahertz radiation sources and methods
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法
JP2006216474A (ja) * 2005-02-07 2006-08-17 Sony Chem Corp 配線体、電子機器、配線体の製造方法、および電子機器の製造方法
JP4654741B2 (ja) 2005-04-08 2011-03-23 澁谷工業株式会社 ウィスカ防止方法
US20100220750A1 (en) * 2005-07-19 2010-09-02 James Hayden Brownell Terahertz Laser Components And Associated Methods
JP2007090354A (ja) * 2005-09-26 2007-04-12 Fuji Xerox Co Ltd 電気回路装置
JP2007297668A (ja) * 2006-04-28 2007-11-15 Om Sangyo Kk メッキ製品の製造方法
US20070275262A1 (en) 2006-05-23 2007-11-29 Dechao Lin Reducing formation of tin whiskers on a tin plating layer
US7848835B2 (en) * 2006-06-02 2010-12-07 Cymer, Inc. High power laser flat panel workpiece treatment system controller
US8617913B2 (en) * 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
JP4986141B2 (ja) 2007-05-08 2012-07-25 国立大学法人秋田大学 錫メッキの針状ウィスカの発生を抑制する方法
US8071931B2 (en) * 2007-11-13 2011-12-06 Battelle Energy Alliance, Llc Structures, systems and methods for harvesting energy from electromagnetic radiation
JP5388324B2 (ja) * 2008-02-22 2014-01-15 日本圧着端子製造株式会社 めっき層の熱処理方法
JP2010256254A (ja) * 2009-04-27 2010-11-11 Panasonic Corp 電磁波検出装置、それを備えた加熱装置および冷凍装置
JP2011198683A (ja) * 2010-03-23 2011-10-06 Mitsubishi Materials Corp コネクタ用接続端子及びその製造方法

Also Published As

Publication number Publication date
WO2014062301A1 (en) 2014-04-24
US9532463B2 (en) 2016-12-27
JP2015534279A (ja) 2015-11-26
US20140110402A1 (en) 2014-04-24
EP2910094A1 (en) 2015-08-26
EP2910094B1 (en) 2018-08-01

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