JP6182969B2 - High frequency module and manufacturing method thereof - Google Patents

Description

The present invention relates to a high-frequency module including a wiring board on which a switch IC and a filter component are mounted on one main surface thereof, and a manufacturing method thereof.

  Conventionally, as shown in FIG. 9, a high frequency module is known in which an antenna switch IC and a filter component electrically connected to the IC are mounted on one main surface of a wiring board (see Patent Document 1). ). The high-frequency module 100 is a front-end module connected to an external antenna, and includes a ceramic multilayer wiring board 101, an antenna switch IC 102, and two surface acoustic wave duplexers that are filter components 103 each formed with a filter circuit. And a mounting component 104 for matching. In this case, a via conductor 105 as an interlayer connection conductor, a wiring electrode 106 connected to a predetermined via conductor 105, and the like are formed inside the ceramic multilayer wiring board 101, and an antenna switch IC 102 is formed on one main surface thereof. Then, the filter component 103 and the matching mounting component 104 respectively connected to the IC 102 are mounted. A plurality of external electrodes 107 for connecting to an external mother board or the like are formed on the other main surface of the ceramic multilayer wiring board 101. The antenna disposed on the external mother board and the filter component 103 are connected via the antenna switch IC 102 so that signals in different frequency bands can be transmitted and received.

Japanese Patent Laying-Open No. 2007-129594 (see paragraphs 0023 and 0024, FIG. 4 etc.)

  By the way, the filter component 103 such as a duplexer is a filter component 103 alone before mounting on the ceramic multilayer wiring board 101, and whether high frequency characteristics such as isolation characteristics, insertion loss and attenuation characteristics are within a desired range. It is common to inspect and sort. However, the high frequency characteristics of the filter component 103 alone and the characteristics after mounting are often different due to the parasitic capacitance / parasitic inductance component of the ceramic multilayer wiring board 101 and the matching relationship. In view of the characteristic change after mounting on the ceramic multilayer wiring board 101, it is necessary to strictly set the inspection standard (non-defective product standard). For this reason, there is a problem in that the non-defective product rate of the filter component 103 is lowered, and the loss of the component is increased accordingly.

  Thus, it is conceivable to inspect the high-frequency characteristics of the filter component 103 after mounting the filter component 103 on the ceramic multilayer wiring board 101. This inspection is performed on one end side of the filter component 103 connected to the antenna, It is necessary to connect the other end side where I / O is input / output to the measuring device. However, in the high-frequency module 100 described above, one end side of the filter component 103 and the external electrode 107 connected to the external antenna are connected via the antenna switch IC 102 and are directly connected to one end side of the filter component 103. There is no external electrode 107. Therefore, for example, when the characteristic inspection of the filter component 103 is performed from the other main surface side of the ceramic multilayer wiring substrate 101 using a predetermined electrode of each external electrode 107, the ceramic multilayer wiring substrate 101 and the filter component 103 are combined. After mounting the antenna switch IC 102, it was necessary to drive the IC 102. In such a case, if the defect of the filter component 103 is found from the inspection result, not only the filter component 103 but also the antenna switch IC 102 and the ceramic multilayer wiring board 101 are wasted, and as a result, the manufacturing cost of the high-frequency module 100 increases. Problem arises.

  The present invention has been made in view of the above-described problems, and can perform a characteristic inspection of a filter component from at least one of both main surfaces of the wiring board in a state where only the filter component is mounted on the wiring board. An object is to provide a high-frequency module that can be used.

In order to achieve the above-described object, the high-frequency module of the present invention includes a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to one of the plurality of switching terminals, and a filter component on one main surface. In a high-frequency module including a wiring board to be mounted, a plurality of one-side electrodes provided on one main surface of the wiring board on which the switch IC and the filter component are mounted, and provided on the other main surface of the wiring board. A plurality of other electrodes for external connection, and the plurality of one-side electrodes are provided on the wiring board and a switching electrode to which any one of the plurality of switching terminals of the switch IC is connected. A first switch-side mounting electrode connected to the switching electrode by a wiring electrode and connected to one end of a first filter circuit provided in the filter component; And a first mounting electrodes to which the other end side of the filter circuit is connected, the plurality of the other-side electrode includes a first connection electrode connected by the wiring electrodes on the first mounting electrode, the switching electrodes are formed on one main surface of the wiring substrate, it is characterized in that the first measuring electrode are connected by the wiring electrode and the first mounting electrode is formed.

Thus, by providing the first measurement electrode connected to the other end side of the first filter circuit provided in the filter component on the one main surface side of the wiring board via the first mounting electrode, wiring is performed. In a state where only the filter component is mounted on the substrate, for example, using one of the switching electrode and the first measurement electrode that are the mounting electrodes for the switch IC connected to one end of the first filter circuit, The characteristic inspection of the filter component can be performed from the main surface side. In addition, since filter component characteristics can be inspected from one main surface side of the wiring board with only the filter parts mounted on the wiring board, not only the filter parts but also the switch ICs can be inspected. As with conventional high-frequency modules that must be mounted on the wiring board, the switch IC is not wasted when the filter component fails as a result of inspection without satisfying the desired characteristics. Thus, the manufacturing cost of the high frequency module can be reduced.

Another high-frequency module according to the present invention includes a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to one of the plurality of switching terminals, and a wiring board on which a filter component is mounted on one main surface thereof A plurality of one-side electrodes provided on one main surface of the wiring board on which the switch IC and the filter component are mounted, and an external connection provided on the other main surface of the wiring board. A plurality of other side electrodes, and the plurality of one side electrodes are switched by a switching electrode to which any one of the plurality of switching terminals of the switch IC is connected and a wiring electrode provided on the wiring board. A first switch-side mounting electrode connected to the electrode and connected to one end side of the first filter circuit provided in the filter component; and the other end of the first filter circuit And the plurality of other-side electrodes include a first connection electrode connected to the first mounting electrode by the wiring electrode, and the first connection electrode is formed. A second measurement electrode connected by the switching electrode and the wiring electrode is formed on the other main surface of the wiring board. According to this configuration, the second measurement electrode connected to the switching electrode is provided on one end side of the first filter circuit provided in the filter component on the other main surface side of the wiring substrate, whereby the filter component is provided on the wiring substrate. The other main surface of the wiring board, for example, using the first connection electrode and the second measurement electrode connected to the other end side of the first filter circuit via the first mounting electrode in a state where only the first filter circuit is mounted The characteristic inspection of the filter parts can be performed from the side.

In addition , the filter component characteristics can be inspected from the other main surface side of the wiring board in a state where only the filter parts are mounted on the wiring board. As with conventional high-frequency modules that must be mounted on the wiring board, the switch IC is not wasted when the filter component fails as a result of inspection without satisfying the desired characteristics. Thus, the manufacturing cost of the high frequency module can be reduced. In addition, a first measurement electrode connected to the first mounting electrode and the wiring electrode may be formed on one main surface of the wiring board. According to this configuration, the characteristic inspection of the filter component can be performed from either of the two main surfaces of the wiring board without mounting the switch IC.

Further , another component mounted on one main surface of the wiring board and connected to the filter component, and a third mounting electrode formed on the one main surface of the wiring board to which the other component is connected, The third mounting electrode may be used as the first measurement electrode . As described above, when there is another component connected to the filter component on the one main surface of the wiring board, the first measurement electrode is used as the third mounting electrode as the mounting electrode connected to the other component. By using it, it is not necessary to separately form mounting electrodes for other components on one main surface of the wiring board, so that the manufacturing cost of the high-frequency module can be reduced.

Further, it may be directly connected by the previous SL first mounting electrode and the first measuring electrode and said wiring electrodes while formed on the main surface of the wiring board. In this case, since the length of the wiring electrode that connects the first mounting electrode and the first measurement electrode is shortened, it is possible to prevent an increase in parasitic inductance caused by the length of the wiring electrode that connects the two. . In addition, by directly connecting the two by a wiring electrode formed on one main surface of the wiring board, there is no need to provide a via conductor or the like for connecting the two inside the wiring board, thereby reducing the size of the high-frequency module. Can be planned.

Further, the filter component includes a first filter component in which the first filter circuit is formed, and a second filter component that is provided separately from the first filter component and in which a second filter circuit is formed, The plurality of one side electrodes are connected to the switching electrode by the wiring electrode, and a second switch side mounting electrode to which one end side of the second filter circuit is connected and a second side to which the other end side of the second filter circuit is connected 2 mounting electrodes, wherein the plurality of other electrodes further includes a second connection electrode connected to the second mounting electrode by the wiring electrode, and the one main main wiring board on which the switching electrode is formed. the surface, the third measurement electrode may be further formed by the wiring electrode connected to the second mounting electrode.

  By configuring in this way, even if the filter component is configured by the first filter component and the second filter component that are individually provided, the first filter from the one main surface side of the wiring board. A switching electrode to which one end of each of the circuit and the second filter circuit is connected, a first measurement electrode to which the other end of the first filter circuit is connected, and a third measurement to which the other end of the second filter circuit is connected Each of the first and second filter components can be inspected using only the first filter component and the second filter component mounted on the wiring board by using the electrode.

Further, the filter component includes a first filter component in which the first filter circuit is formed, and a second filter component that is provided separately from the first filter component and in which a second filter circuit is formed, The plurality of one side electrodes are connected to the switching electrode by the wiring electrode, and a second switch side mounting electrode to which one end side of the second filter circuit is connected and a second side to which the other end side of the second filter circuit is connected The plurality of other electrodes may further include a second connection electrode connected to the second mounting electrode by the wiring electrode. According to this configuration, from the other main surface side of the wiring board, the second measurement electrode connected to one end side of each of the first and second filter circuits, and the second electrode connected to the other end side of the first filter circuit. Using the first connection electrode and the second connection electrode connected to the other end of the second filter circuit, only the first filter component and the second filter component are mounted on the wiring board. The characteristic inspection of each filter component can be performed.

  Further, one main surface of the wiring board may be resin-sealed. For example, when the first measurement electrode is formed on one main surface of the wiring board, the electrode is basically not used after the characteristic inspection. Therefore, it is necessary to perform an insulation process after the characteristic inspection. By sealing the one main surface of the resin with the resin, the insulation treatment after the inspection becomes unnecessary.

  The method of manufacturing a high-frequency module according to the present invention includes a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to one of the plurality of switching terminals, and a wiring board on which a filter component is mounted on one main surface thereof A plurality of one-side electrodes for mounting the switch IC and the filter component on one main surface of the wiring board, and a first measurement electrode for evaluating the characteristics of the filter component A second step of forming a plurality of other-side electrodes for external connection on the other main surface of the wiring board, and a first step of mounting the filter component on the one main surface of the wiring board. 3, a fourth step of evaluating the characteristics of the filter component using the predetermined one-side electrode and the first measurement electrode of the wiring board, and the switch IC A fifth step of mounting on one main surface of the wiring board, wherein the plurality of one-side electrodes are a switching electrode to which any one of the plurality of switching terminals of the switch IC is connected, and the wiring board A first switch-side mounting electrode connected to one end side of the first filter circuit provided in the filter component and a second end side of the first filter circuit connected to the switching electrode by a wiring electrode provided in The first measurement electrode is connected to the first mounting electrode by the wiring electrode provided on the wiring board.

  In this case, in the first step, a first measurement electrode connected to the other end side of the first filter circuit via the first mounting electrode is formed on one main surface of the wiring board, and the fourth step. In FIG. 2, in the state where only the filter component is mounted on the wiring board, the characteristic evaluation of the filter component is performed from the one main surface side of the wiring board using the predetermined one-side electrode and the first measurement electrode. Therefore, even if the defect of the filter component is found in the fourth step, not only the filter component but also the switch IC is not wasted like the conventional high frequency module. Can be manufactured.

  Further, in the first step, a third mounting electrode for mounting another component connected to the filter component is formed by the first measurement electrode, and in the fifth step, the switch IC In addition, the other component may be mounted on one main surface of the wiring board. Thus, by forming the third electrode for mounting other components connected to the filter component by the first measurement electrode, the third electrode for mounting other components is separately provided on the wiring board. On the other hand, since it is not necessary to form on the main surface, the manufacturing cost of the high frequency module can be reduced.

  According to another method of manufacturing the high-frequency module of the present invention, a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to any one of the plurality of switching terminals and a filter component are mounted on one main surface. In a method for manufacturing a high-frequency module including a wiring board, a sixth step of forming a plurality of one-side electrodes for mounting the switch IC and the filter component on one main surface of the wiring board, and the wiring board A seventh step of forming a plurality of other-side electrodes for external connection and a second measurement electrode for evaluating characteristics of the filter component on the other main surface of the filter substrate; An eighth step of mounting on the main surface; a ninth step of evaluating the characteristics of the filter component using the predetermined second electrode and the second measurement electrode of the wiring board; A switch IC to be mounted on one main surface of the wiring board, wherein the plurality of one-side electrodes include a switching electrode to which any one of the plurality of switching terminals of the switch IC is connected. A first switch-side mounting electrode connected to the switching electrode by a wiring electrode provided on the wiring board and connected to one end side of the first filter circuit provided in the filter component; and other than the first filter circuit A first mounting electrode connected to the end side, the plurality of other electrodes include a first connection electrode connected to the first mounting electrode by the wiring electrode, and the second measurement electrode is The wiring electrode provided on the wiring board is connected to the switching electrode.

  In this case, in the seventh step, a second measurement electrode connected to the switching electrode connected to the one end side of the first filter circuit via the first switch side mounting electrode is provided on the other main surface of the wiring board. In the ninth step, in the state where only the filter component is mounted on the wiring substrate, the filter component of the filter component is formed from the other main surface side of the wiring substrate using the predetermined other electrode and the second measurement electrode. Perform characterization. Therefore, even if the defect of the filter component is found in the ninth step, not only the filter component but also the switch IC is not wasted like the conventional high frequency module. Can be manufactured.

According to the present invention, in a high-frequency module including a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to any one of the plurality of switching terminals, and a wiring board on which a filter component is mounted on one main surface thereof , it provided on one main surface of the wiring board, comprising a first measuring electrodes connected to the other end of the first filter circuit provided on the filter components.

Thus, with only the filter components on the wiring board is mounted, the hand main surface side of the wiring substrate, it is possible to perform the characteristic test of the filter components, when performing characteristic test of filter components, only the filter components In addition, unlike conventional high-frequency modules that require mounting of switch ICs, there is no problem that switch ICs are wasted when defects are found by characteristic inspection of filter components. Can be reduced.

It is a top view of the high frequency module concerning a 1st embodiment of the present invention. It is a figure for demonstrating the connection relation of the high frequency module of FIG. It is a circuit block diagram of the high frequency module of FIG. It is a modification of an inspection electrode. It is a bottom view of the high frequency module concerning a 2nd embodiment of the present invention. It is a figure for demonstrating the connection relation of the high frequency module of FIG. It is a top view of the high frequency module concerning a 3rd embodiment of the present invention. It is a circuit block diagram of the high frequency module of FIG. It is sectional drawing of the conventional high frequency module.

<First Embodiment>
A high-frequency module according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a plan view of the high-frequency module 1 according to the first embodiment, FIG. 2 is a diagram for explaining a connection relationship of the high-frequency module 1, and FIG. 3 is a circuit configuration diagram of the high-frequency module 1. In FIG. 1, some parts are indicated by broken lines.

  The high-frequency module 1 of this embodiment is a front-end module mounted on an electronic device such as a mobile phone, and is mounted on a wiring board 2 and one main surface of the wiring board 2, respectively, as shown in FIGS. The switch IC 3, the filter component 4, and the matching mounting components 5 a and 5 b are provided.

  The switch IC 3 is a semiconductor element formed of Si, GaAs, or the like, and includes a plurality of switching terminals 3b and a common terminal 3a that is switched and connected to one of the switching terminals. It is mounted using a well-known surface mounting technique.

The filter component 4 includes a surface acoustic wave duplexer in which a reception filter circuit (corresponding to the first filter circuit of the present invention) and a transmission filter circuit (corresponding to the second filter circuit of the present invention) are integrally formed. It is mounted on one main surface of the wiring board 2 using a known surface mounting technique. At this time, one end side of the filter component 4 is connected to one of the switching terminals of the switch IC 3. In this embodiment, the filter component 4 includes a filter-side common terminal 4a in which one end of each of the first and second filter circuits is connected in the filter component 4, and a first, Second receiving terminals 4b and 4c, a transmitting terminal 4d on the other end side of the second filter circuit, and a ground terminal 4e are provided.

  One of the matching mounting components 5 a and 5 b is provided for impedance matching between the switch IC 3 and the filter component 4, and the other matching mounting component 5 b is provided from the filter component 4. It is provided for impedance matching between reception signals that are balanced and output. In this embodiment, each of the matching mounting components 5a and 5b is formed of a chip inductor.

  The wiring board 2 is a multilayer board in which a plurality of insulating layers each made of ceramic, glass epoxy resin, or glass are laminated, and various wiring electrodes and via conductors are formed therein. In addition, a plurality of one-side electrodes for mounting the switch IC 3, the filter component 4, and the matching mounting component 5a and first to fourth inspection electrodes 6a to 6d described later are formed on the one main surface, On the other main surface, a plurality of other electrodes for connection to an external mother substrate or the like are formed. The wiring board 2 may have a single layer structure.

  At this time, each one-side electrode includes, as an electrode for mounting the switch IC3, a one-side antenna electrode 7a connected to the common terminal 3a of the switch IC3 and a plurality of switching electrodes 7b connected to each switching terminal 3b. In addition, as mounting electrodes for the filter component 4, a first switch-side mounting electrode 7c connected to the filter-side common terminal 4a of the filter component 4 and a first-side first receiving electrode 7d connected to the first receiving terminal 4b And one side second reception electrode 7e connected to the second reception terminal 4c, one side transmission electrode 7f connected to the transmission terminal 4d, and one side ground electrode 7g connected to the ground terminal 4e, As the mounting electrodes of the matching mounting component 5a, two matching mounting electrodes 7h, 7i are included. The first-side first and second receiving electrodes 7d and 7e correspond to the first mounting electrode of the present invention, and the one-side transmitting electrode 7f corresponds to the second mounting electrode of the present invention.

  The first to fourth inspection electrodes 6a to 6d are provided with only the filter component 4 mounted on the wiring board 2, and the isolation characteristics, insertion loss, attenuation characteristics, etc. of the filter part 4 from one main surface side of the wiring board 2. It is an electrode for inspecting the high-frequency characteristics of. At this time, the first and second inspection electrodes 6a and 6b are also used as electrodes for mounting the matching mounting component 5b provided for impedance matching between the reception signals output from the filter component 4 in a balanced manner. The first to fourth inspection electrodes 6a to 6d correspond to the first measurement electrode and the third measurement electrode of the present invention, and the first and second inspection electrodes 6a and 6b are the first and second measurement electrodes of the present invention. It corresponds to 3 mounting electrodes. The first and second inspection electrodes 6a and 6b may be provided individually without being used as mounting electrodes for the matching mounting component 5b.

  Each of the other side electrodes serves as an external connection electrode, the other side antenna electrode 8a, the other side transmission electrode 8b, the other side ground electrode 8c, the other side first reception electrode 8d, and the other side second reception electrode 8e. Including. The other side first and second receiving electrodes 8d and 8e correspond to the first connection electrode of the present invention, and the other side transmission electrode 8b corresponds to the second connection electrode of the present invention.

  Next, the main part of the connection relationship between the one side electrodes and the other side electrodes provided on both main surfaces of the wiring board will be described with reference to FIGS.

  The other-side antenna electrode 8a on the other main surface of the wiring board 2 connected to an antenna disposed on an external mother board or the like is connected to the one-side antenna electrode 7a on the one main surface of the wiring board 2, and a switch Connected to the first switch-side mounting electrode 7c connected to the filter-side common terminal 4a of the filter component 4 through a predetermined electrode among the plurality of switching electrodes 7b that are switched and connected to the one-side antenna electrode 7a by the IC3. The Therefore, the external antenna and the filter component 4 are connected via the switch IC 3.

  Among the electrodes for mounting the filter component 4, the first first receiving electrode 7 d, the first second receiving electrode 7 e, the one transmitting electrode 7 f, and the one ground electrode excluding the first switch side mounting electrode 7 c. 7g is connected to the corresponding other first receiving electrode 8d, other second receiving electrode 8e, other transmitting electrode 8b, and other ground electrode 8c on the other main surface of the wiring board 2, respectively.

  In addition, one of the matching mounting electrodes 7h and 7i of the matching mounting component 5a for impedance matching between the switch IC 3 and the filter component 4 is the other side ground of the other main surface of the wiring board 2. The other electrode 7 h is connected to a path connecting the switching electrode 7 b for mounting the switch IC 3 and the first switch side mounting electrode 7 c for mounting the filter component 4 while being connected to the electrode 8 c.

  Further, the first inspection electrode 6 a provided on the one main surface of the wiring board 2 includes the first receiving electrode 7 d for mounting the filter component 4 and the first receiving electrode 8 d on the other side of the other main surface of the wiring board 2. Is connected to the path connecting the first and second receiving electrodes 7e and the other second receiving electrode 8e on the other main surface of the wiring board 2.

  Further, the third inspection electrode 6c provided on the one main surface of the wiring board 2 is on a path connecting the one side transmission electrode 7f for mounting the filter component 4 and the other side transmission electrode 8b on the other main surface of the wiring board 2. The fourth inspection electrode 6 d is connected to a path connecting the matching mounting electrode 7 i of the matching mounting component 5 a and the other-side ground electrode 8 c on the other main surface of the wiring board 2. Each connection described above is made by various wiring electrodes including via conductors provided inside the wiring board 2.

  By connecting as described above, the high-frequency module 1 has the switching electrode 7b connected to one end of the first and second filter circuits, or the matching mounting for impedance matching between the switch IC 3 and the filter component 4. The matching mounting electrode 7h of the component 5a, the first and second inspection electrodes 6a and 6b connected to the other end of the first filter circuit of the filter component 4, and the other end of the second filter circuit With only the filter component 4 mounted on one main surface of the wiring substrate 2 using the third inspection electrode 6c and the fourth inspection electrode 6d connected to the ground terminal 4e of the filter component 4, the wiring substrate 2 On the other hand, the high frequency characteristic of the filter component 4 can be inspected from the main surface side. Note that the fourth inspection electrode 6d connected to the other-side ground electrode 8c on the other main surface of the wiring board 2 is not necessarily provided. Further, instead of providing the fourth inspection electrode 6d, the matching mounting electrode 7i of the matching mounting component 5a for impedance matching between the switch IC 3 and the filter component 4 connected to the other-side ground electrode 8c is used. Thus, the characteristic inspection of the filter component 4 may be performed.

(Manufacturing method of high frequency module)
Next, the manufacturing method of the high frequency module 1 is demonstrated. First, a wiring substrate 2 having via conductors and various wiring electrodes formed therein is prepared, and a plurality of switch ICs 3, a filter component 4 and a matching mounting component 5a are mounted on one main surface of the wiring substrate 2. The first and second inspection electrodes 6a and 6b, which serve as electrodes for the characteristic inspection of the filter component 4 and the mounting component 5b for matching, and the first for the characteristic inspection of the filter component 4 are formed. 3. Form the fourth inspection electrodes 6c and 6d (first step). At this time, each one side electrode and 1st-4th test | inspection electrode 6a-6d are formed using well-known electrode formation techniques, such as printing using the electrically conductive paste containing Cu etc., and a plating process. As described above, each one-side electrode includes the switching electrode 7b, the first switch-side mounting electrode 7c, the one-side first and second receiving electrodes 7d and 7e, and the one-side transmitting electrode 7f. The electrodes for mounting the matching mounting component 5b and the first and second inspection electrodes 6a and 6b for characteristic inspection of the filter component 4 may be formed separately.

  Next, a plurality of other-side electrodes for external connection are formed on the other main surface of the wiring board 2 in the same manner as the one-side electrodes and the first to fourth inspection electrodes 6a to 6d (second step). At this time, each other side electrode includes the other side first and second receiving electrodes 8d, 8e and the other side transmitting electrode 8b as described above. Note that the order of the first and second steps may be reversed.

  Next, the filter component 4 is mounted on one main surface of the wiring board 2 using a known surface mounting technique (third step). At this time, the filter-side common terminal 4a of the filter component 4 and the first switch-side mounting electrode 7c formed on one main surface of the wiring board 2, the first receiving terminal 4b, the one-side first receiving electrode 7d, and the second receiving terminal 4c is connected to one second receiving electrode 7e, the transmitting terminal 4d is connected to one transmitting electrode 7f, and the ground terminal 4e is connected to one ground electrode 7g.

  Next, using the switching electrode 7b or the matching mounting electrode 7h and the first to fourth inspection electrodes 6a to 6d formed on the one main surface of the wiring board 2, a high-frequency characteristic inspection (for example, isolation) of the filter component 4 is performed. Characteristics (insertion loss, attenuation characteristics, etc.) are performed to check whether or not the characteristics of the filter component 4 are within a predetermined range (good / bad determination) (fourth step). This inspection can be performed using a probe card or the like.

  Next, the switch IC 3 and the matching mounting components 5a on the one main surface of the wiring board 2 for those in which the characteristics of the filter component 4 are determined to be within a predetermined range in the inspection of the fourth step. 5b is mounted using a known surface mounting technique (fifth step). At this time, the common terminal 3a of the switch IC is connected to the one-side antenna electrode 7a formed on one main surface of the wiring substrate 2, the switching terminals 3b, and the switching electrodes 7b. Also, a matching mounting component 5b provided for impedance matching between the reception signals balanced-output from the filter component 4 is mounted on the first and second inspection electrodes 6a and 6b.

  Finally, the high frequency module 1 is manufactured by performing an inspection for determining the quality of the completed high frequency module 1. This inspection can also be performed using a probe card or the like.

(Modification of inspection electrode)
Next, a modified example of the first to fourth inspection electrodes 6a to 6d will be described with reference to FIG. FIG. 4 is a diagram for explaining a modification of the first to fourth inspection electrodes 6 a to 6 d and is a partial plan view of the high-frequency module 1.

  In the above-described embodiment, the first to fourth inspection electrodes 6a to 6d are configured to be connected to a predetermined path or electrode by via conductors and various wiring electrodes provided in the wiring board 2, for example, As shown in FIG. 4, the third inspection electrode 6c and the one-side transmission electrode 7f are directly connected by the wiring electrode 9a formed on one main surface of the wiring board 2, and the fourth inspection electrode 6d and the one-side ground electrode are connected. 7g may be directly connected to the wiring electrode 9b formed on one main surface of the wiring board 2. The same applies to the first and second inspection electrodes 6a and 6b.

  In this case, the lengths of the wiring electrode 9a connecting the third inspection electrode 6c and the one-side transmission electrode 7f and the wiring electrode 9b connecting the fourth inspection electrode 6d and the one-side ground electrode 7g are shortened. In addition, it is possible to prevent an increase in parasitic inductance due to the length of the wiring electrodes connecting them. In addition, since it is not necessary to provide via conductors or the like for connection inside the wiring board 2, the high-frequency module 1 can be reduced in size.

  Therefore, according to the above-described embodiment, the first and second inspection electrodes 6a connected to the other end of the first filter circuit of the filter component 4 via the first and second receiving electrodes 7d and 7e on the one side. , 6b, a third inspection electrode 6c connected to the other end of the second filter circuit via one transmission electrode 7f, and a ground terminal 4e of the filter component 4 connected to one end ground electrode 7g. Since each of the fourth inspection electrodes 6d is provided on one main surface of the wiring board 2, the high frequency characteristics of the filter component 4 can be seen from the one main surface side of the wiring board 2 with only the filter component 4 mounted on the wiring board 2. Inspection can be performed. Therefore, when performing the characteristic inspection of the filter part 4, the filter part 4 does not satisfy the desired characteristic in the inspection result as in the conventional high-frequency module in which not only the filter part 4 but also the switch IC 3 must be mounted. In such a case, there is no problem that the switch IC 3 is wasted, so that the manufacturing cost of the high-frequency module 1 can be reduced.

  Also in the manufacturing method of the high-frequency module 1, in the fourth step, the switching electrode 7b or the matching mounting electrode 7h, and the first to the first mounting surfaces with only the filter component 4 mounted on one main surface of the wiring board 2 The high frequency characteristic inspection of the filter component 4 is performed using the fourth inspection electrodes 6a to 6d, and only the switch IC 3 and the matching component mounting component 5a that are determined to be non-defective products by the inspection result in the fifth step. , 5b, the switch IC 3 is not wasted as in the conventional high-frequency module, and the high-frequency module 1 can be manufactured at a low cost.

  Further, the first and second inspection electrodes 6a and 6b are also used as mounting electrodes for the matching mounting component 5b provided for impedance matching between the reception signals output from the filter component 4 in a balanced manner. Since it is not necessary to form an electrode for mounting the matching mounting component 5b on the one main surface of the wiring board 2, the manufacturing cost of the high-frequency module 1 can be reduced.

Second Embodiment
A high frequency module 1a according to a second embodiment of the present invention will be described with reference to FIGS. 5 is a bottom view of the high-frequency module 1a, and FIG. 6 is a diagram for explaining the connection relationship of FIG.

  The high-frequency module 1a according to this embodiment differs from the high-frequency module 1 according to the first embodiment described with reference to FIGS. 1 to 3 in that one main part of the wiring board 2 as shown in FIGS. Instead of the third and fourth inspection electrodes 6c and 6d formed on the surface, the fifth inspection electrode 6e is provided on the other main surface of the wiring board 2, and only the filter component 4 is mounted on the wiring board 2. Thus, the high frequency characteristic inspection of the filter component 4 can be performed from the other main surface side of the wiring board 2. Since other configurations are the same as those of the high-frequency module 1 of the first embodiment, description thereof is omitted by attaching the same reference numerals. In this embodiment, the first and second inspection electrodes 6a and 6b are formed as mounting electrodes for the matching mounting component 5b.

  For example, in the high-frequency module 1 according to the first embodiment, when the high-frequency characteristic inspection of the filter component 4 is performed from the other main surface side of the wiring board 2, as shown in FIG. The first and second receiving terminals 4b and 4c on the other end side are connected to the other first and second receiving electrodes 8d and 8e formed on the other main surface of the wiring board 2, and the other end of the second filter circuit. Since the side transmission terminal 4d is connected to the other side transmission electrode 8b and the ground terminal 4e is connected to the other side ground electrode 8c, these electrodes 8b to 8e can be used as inspection electrodes. However, since one end side (first switch side mounting electrode 7c) of each of the first and second filter circuits is connected to the other side antenna electrode 8a on the other main surface of the wiring board 2 via the switch IC3, this In order to use the other antenna electrode 8a as an inspection electrode, not only the filter component 4 but also the switch IC 3 must be mounted on the wiring board 2 and the switch IC 3 must be driven.

  Therefore, in this embodiment, as shown in FIGS. 5 and 6, instead of the second and fourth inspection electrodes 6 c and 6 d formed in the first embodiment, the first connected to one end side of the filter component 4. By providing the fifth inspection electrode 6e connected to the path connecting the switch side mounting electrode 7c and the switching electrode 7b for mounting the switch IC 3 on the other main surface of the wiring board 2, only the filter component 4 is provided on the wiring board 2. In the mounted state, the filter component 4 can be inspected from the other main surface side of the wiring board 2. The fifth inspection electrode 6e corresponds to the second measurement electrode of the present invention.

(Manufacturing method of the high frequency module 1a)
Next, the manufacturing method of the high frequency module 1a is demonstrated. The connection relationship between each one-side electrode formed on one main surface of the wiring board 2 and each component (the switch IC 3, the filter component 4, and both matching mounting components 5a and 5b) is the high-frequency of the first embodiment. Since it is the same as module 1, description is abbreviate | omitted. First, in the same manner as the first step of the first embodiment, each one-side electrode and the first and second inspection electrodes 6a and 6b are formed on one main surface of the wiring board 2 (sixth step).

  Next, each other side electrode is formed in the other main surface of the wiring board 2 in the same manner as the second step of the first embodiment (seventh step). At this time, the fifth inspection electrode 6e is also formed.

  Next, the filter component 4 is mounted on one main surface of the wiring board 2 (eighth step), and the fifth inspection electrode 6e, the other side transmission electrode 8b, and the other side formed on the other main surface of the wiring board 2. Using the ground electrode 8c and the first and second receiving electrodes 8d and 8e on the other side, a high frequency characteristic inspection of the filter component 4 is performed to check whether the characteristics of the filter component 4 are within a predetermined range (good or bad). (9th process). This inspection can also be performed using a probe card or the like.

  Next, the switch IC 3 and the matching mounting components 5a, 5a on the one main surface of the wiring board 2 with respect to those in which the characteristics of the filter component 4 are determined to be within a predetermined range in the inspection of the ninth process. 5b is mounted using a known surface mounting technique (tenth step). Finally, the high frequency module 1a is manufactured by performing an inspection for determining the quality of the completed high frequency module 1a. This inspection can also be performed using a probe card or the like.

  Therefore, according to the above-described embodiment, it is possible to inspect the filter component 4 from the other main surface side of the wiring board 2 in a state where only the filter component 4 is mounted on the wiring board 2, and the high frequency according to the first embodiment. The effect similar to the module 1 and its manufacturing method can be acquired.

<Third Embodiment>
A high-frequency module 1b according to a third embodiment of the present invention will be described with reference to FIGS. 7 is a plan view of the high-frequency module 1b, and FIG. 8 is a circuit configuration diagram of the high-frequency module 1b. Further, in FIG. 7, some parts are indicated by broken lines in order to simplify the description.

  The high-frequency module 1b according to this embodiment is different from the high-frequency module 1 of the first embodiment described with reference to FIGS. 1 to 3 in that the filter component 4 is the first component as shown in FIGS. A first filter component 11a in which one filter circuit (for reception) is formed, and a second filter component 11b in which a second filter circuit (for transmission) is formed separately from the first filter component 11a. It is a point that has been. Since other configurations are the same as those of the high-frequency module 1 of the first embodiment, description thereof is omitted by attaching the same reference numerals.

  In this case, as shown in FIG. 8, the second switch side mounting electrode 7j is provided on one main surface of the wiring board 2 as one side electrode connected to the terminal on the one end side (switch IC3 side) of the second filter component 11b. A terminal on one end side of the first filter component 11a is connected to the first switch side mounting electrode 7c, and a terminal on one end side of the second filter component 11b is connected to the second switch side mounting electrode 7j. The first switch side mounting electrode 7c and the second switch side mounting electrode 7j are connected by a wiring electrode formed on the wiring board 2, and are respectively connected to the switching electrode 7b. As in the high frequency module 1a of the second embodiment, the fifth inspection electrode 6e is formed on the other main surface of the wiring board 2, and the high frequency characteristic inspection of the filter component 4 is performed from the other main surface side of the wiring board 2. It may be configured to be able to.

  With this configuration, the switching electrode connected to one end side of the filter component 4 (one end side of each of the first and second filter components 11a and 11b) in a state where only the filter component 4 is mounted on the wiring board 2. 7b or the matching mounting electrode 7h, the first to third inspection electrodes 6a to 6c connected to the other end of the filter component 4, and the fourth inspection electrode 6d connected to the ground terminal. 2, the high frequency characteristics of the filter component 4 can be inspected from the one main surface side. In particular, when the first filter component 11a for reception of the filter component 4 (duplexer) and the second filter component 11b for transmission of the filter component 4 (duplexer) are configured by individual chips as in this embodiment, the first In the individual inspection of each of the second filter parts 11a and 11b, it is effective because it is difficult to evaluate the entire filter part 4, that is, the high frequency characteristics as a duplexer.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, in each of the above-described embodiments, a case has been described in which the high-frequency characteristic inspection of the filter component 4 can be performed from either one of the two main surfaces of the wiring board 2. You may comprise so that a test | inspection can also be performed from the side. In this case, the first to fourth inspection electrodes 6 a to 6 d may be provided on one main surface of the wiring board 2 and the fifth inspection electrode 6 e may be provided on the other main surface of the wiring board 2.

  In each of the above-described embodiments, the case where the filter component 4 is a duplexer having the first and second filter circuits has been described. However, the filter component 4 may have, for example, one filter circuit. Further, it may have three or more filter circuits.

  Further, after mounting the switch IC 3, the filter component 4, and the matching mounting components 5 a and 5 b on the wiring substrate 2, one main surface of the wiring substrate 2 may be resin-sealed. For example, when the first to fourth inspection electrodes 6a to 6d are formed on one main surface of the wiring board 2, the third and fourth inspection electrodes 6c and 6d are basically not used after the inspection, and therefore after the characteristic inspection. Although it is necessary to perform an insulation process, the insulation process after an inspection becomes unnecessary by resin-sealing one main surface of the wiring board 2.

  Further, the first to fourth inspection electrodes 6 a to 6 d described above can be used as identification markings when components such as the switch IC 3 and the filter component 4 are mounted on the wiring board 2.

  The present invention also includes a wiring board, a switch IC mounted on one main surface of the wiring board, and a filter component having a filter circuit therein, and the filter component and an external antenna are connected via the switch IC. It can be applied to various high-frequency modules to be connected.

1, 1a, 1b High-frequency module 2 Wiring board 3 Switch IC
3a common terminal 3b switching terminal 4 filter part 6a first inspection electrode (first measurement electrode, third measurement electrode, third mounting electrode)
6b Second inspection electrode (first measurement electrode, third measurement electrode, third mounting electrode)
6c Third inspection electrode (first measurement electrode, third measurement electrode)
6e Fifth inspection electrode (second measurement electrode)
7b Switching electrode (one side electrode)
7c First switch side mounting electrode (one side electrode)
7d One side first receiving electrode (one side electrode, first mounting electrode)
7e One side second receiving electrode (one side electrode, first mounting electrode)
7f One side transmission electrode (one side electrode, second mounting electrode)
7j Second switch side mounting electrode (one side electrode)
8b The other side transmission electrode (the other side electrode, the second connection electrode)
8d The other side first receiving electrode (the other side electrode, the first connection electrode)
8e Second receiving electrode on the other side (other side electrode, first connection electrode)
11a First filter component 11b Second filter component

Claims (11)

In a high-frequency module comprising a switch IC having a plurality of switching terminals and a common terminal that is switch-connected to any one of the plurality of switching terminals and a wiring board on which a filter component is mounted on one main surface thereof,
A plurality of one-side electrodes provided on one main surface of the wiring board on which the switch IC and the filter component are mounted;
A plurality of other electrodes for external connection provided on the other main surface of the wiring board,
The plurality of one-side electrodes are
A switching electrode to which any one of the plurality of switching terminals of the switch IC is connected;
A first switch-side mounting electrode connected to the switching electrode by a wiring electrode provided on the wiring board and connected to one end side of a first filter circuit provided in the filter component;
A first mounting electrode to which the other end side of the first filter circuit is connected;
The plurality of other electrodes are
Including a first connection electrode connected to the first mounting electrode by the wiring electrode;
Wherein the one main surface of the wiring board switching electrodes are formed, a high frequency module, characterized in that the first measuring electrode are connected by the wiring electrode and the first mounting electrode is formed. In a high-frequency module comprising a switch IC having a plurality of switching terminals and a common terminal that is switch-connected to any one of the plurality of switching terminals and a wiring board on which a filter component is mounted on one main surface thereof,
  A plurality of one-side electrodes provided on one main surface of the wiring board on which the switch IC and the filter component are mounted;
  A plurality of other electrodes for external connection provided on the other main surface of the wiring board,
  The plurality of one-side electrodes are
  A switching electrode to which any one of the plurality of switching terminals of the switch IC is connected;
  A first switch-side mounting electrode connected to the switching electrode by a wiring electrode provided on the wiring board and connected to one end side of a first filter circuit provided in the filter component;
  A first mounting electrode to which the other end side of the first filter circuit is connected;
  The plurality of other electrodes are
  Including a first connection electrode connected to the first mounting electrode by the wiring electrode;
  A second measurement electrode connected by the switching electrode and the wiring electrode is formed on the other main surface of the wiring board on which the first connection electrode is formed.
  A high-frequency module characterized by that. 3. The high-frequency module according to claim 2, wherein a first measurement electrode connected to the first mounting electrode by the wiring electrode is formed on one main surface of the wiring board. And other components connected to the filter components are mounted on one main surface of the front Symbol wiring board,
A third mounting electrode formed on one main surface of the wiring board to which the other component is connected ;
RF module according to claim 1 or 3 wherein the third mounting electrode and said Rukoto used as the first measurement electrode. Claim 1, characterized in that the front Symbol first mounting electrode and the first measurement electrode is directly connected by the wiring electrodes formed on one main surface of the wiring board, according to claim 3 and claim Item 5. The high-frequency module according to any one of items 4 to 4 . The filter component includes a first filter component in which the first filter circuit is formed, and a second filter component in which a second filter circuit is formed separately from the first filter component,
The plurality of one-side electrodes are connected to the switching electrode by the wiring electrodes, and are connected to a second switch-side mounting electrode to which one end side of the second filter circuit is connected and the other end side of the second filter circuit. A second mounting electrode;
The plurality of other electrodes further include a second connection electrode connected to the second mounting electrode by the wiring electrode,
On one main surface of the wiring substrate on which the switching electrodes are formed, according to claim 1, characterized in that the third measuring electrode connected to the second mounting electrode by the wiring electrode is further formed , Claim 3, Claim 4 and Claim 5
The high-frequency module according to item 1 . The filter component includes a first filter component in which the first filter circuit is formed, and a second filter component in which a second filter circuit is formed separately from the first filter component,
  The plurality of one-side electrodes are connected to the switching electrode by the wiring electrodes, and are connected to a second switch-side mounting electrode to which one end side of the second filter circuit is connected and the other end side of the second filter circuit. A second mounting electrode;
  The plurality of other electrodes further include a second connection electrode connected to the second mounting electrode by the wiring electrode.
The high-frequency module according to claim 2 or 3, wherein RF module according to any one of claims 1 to 7, characterized in that one main surface of the wiring substrate are sealed with a resin. In a method of manufacturing a high-frequency module including a switch IC having a plurality of switching terminals and a common terminal that is switched and connected to any one of the plurality of switching terminals and a wiring board on which a filter component is mounted on one main surface thereof,
A first step of forming a plurality of one-side electrodes for mounting the switch IC and the filter component on one main surface of the wiring board, and a first measurement electrode for evaluating characteristics of the filter component;
A second step of forming a plurality of other electrodes for external connection on the other main surface of the wiring board;
A third step of mounting the filter component on one main surface of the wiring board;
A fourth step of evaluating the characteristics of the filter component using the predetermined one side electrode of the wiring board and the first measurement electrode;
A fifth step of mounting the switch IC on one main surface of the wiring board,
The plurality of one-side electrodes are
A switching electrode to which any one of the plurality of switching terminals of the switch IC is connected;
A first switch-side mounting electrode connected to the switching electrode by a wiring electrode provided on the wiring board and connected to one end side of a first filter circuit provided in the filter component;
A first mounting electrode to which the other end side of the first filter circuit is connected;
The method for manufacturing a high-frequency module, wherein the first measurement electrode is connected to the first mounting electrode by the wiring electrode provided on the wiring board. In the first step, a third mounting electrode for mounting another component connected to the filter component is formed by the first measurement electrode,
10. The method of manufacturing a high frequency module according to claim 9 , wherein, in the fifth step, the other component is mounted on one main surface of the wiring board in addition to the switch IC. In the method for manufacturing a high-frequency module having a wiring board switch IC and the filter components that are mounted on one main surface and a common terminal which is switched connected to one of a plurality of switching terminals of the plurality of switching Kawatan child,
A sixth step of forming a plurality of one-side electrodes for mounting the switch IC and the filter component on one main surface of the wiring board;
A seventh step of forming a plurality of other electrodes for external connection and a second measurement electrode for evaluating characteristics of the filter component on the other main surface of the wiring board;
An eighth step of mounting the filter component on one main surface of the wiring board;
A ninth step of performing a characteristic evaluation of the filter component using the predetermined second electrode of the wiring board and the second measurement electrode;
A tenth step of mounting the switch IC on one main surface of the wiring board,
The plurality of one-side electrodes are
A switching electrode to which any one of the plurality of switching terminals of the switch IC is connected;
A first switch-side mounting electrode connected to the switching electrode by a wiring electrode provided on the wiring board and connected to one end side of a first filter circuit provided in the filter component;
A first mounting electrode to which the other end side of the first filter circuit is connected;
The plurality of other electrodes are
Including a first connection electrode connected to the first mounting electrode by the wiring electrode;
The method for manufacturing a high-frequency module, wherein the second measurement electrode is connected to the switching electrode by the wiring electrode provided on the wiring board.

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