JP6177430B2 - Polysiloxane copolymer and antistatic agent containing the same - Google Patents
Polysiloxane copolymer and antistatic agent containing the same Download PDFInfo
- Publication number
- JP6177430B2 JP6177430B2 JP2016514802A JP2016514802A JP6177430B2 JP 6177430 B2 JP6177430 B2 JP 6177430B2 JP 2016514802 A JP2016514802 A JP 2016514802A JP 2016514802 A JP2016514802 A JP 2016514802A JP 6177430 B2 JP6177430 B2 JP 6177430B2
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- JP
- Japan
- Prior art keywords
- bis
- imide
- trifluoromethanesulfonyl
- formula
- trimethoxysilyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- -1 Polysiloxane copolymer Polymers 0.000 title claims description 94
- 229920001296 polysiloxane Polymers 0.000 title claims description 45
- 239000002216 antistatic agent Substances 0.000 title claims description 14
- 150000003839 salts Chemical class 0.000 claims description 48
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 229920005668 polycarbonate resin Polymers 0.000 claims description 17
- 239000004431 polycarbonate resin Substances 0.000 claims description 17
- 229920002050 silicone resin Polymers 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 10
- 150000001450 anions Chemical class 0.000 claims description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- JHYNEQNPKGIOQF-UHFFFAOYSA-N 3,4-dihydro-2h-phosphole Chemical group C1CC=PC1 JHYNEQNPKGIOQF-UHFFFAOYSA-N 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical group C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 150000001768 cations Chemical class 0.000 claims description 3
- VXTFGYMINLXJPW-UHFFFAOYSA-N phosphinane Chemical group C1CCPCC1 VXTFGYMINLXJPW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003386 piperidinyl group Chemical group 0.000 claims description 3
- 229960002017 echothiophate Drugs 0.000 claims description 2
- BJOLKYGKSZKIGU-UHFFFAOYSA-N ecothiopate Chemical compound CCOP(=O)(OCC)SCC[N+](C)(C)C BJOLKYGKSZKIGU-UHFFFAOYSA-N 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- VBQCHPIMZGQLAZ-UHFFFAOYSA-N phosphorane Chemical group [PH5] VBQCHPIMZGQLAZ-UHFFFAOYSA-N 0.000 claims 1
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 102
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 21
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 18
- 150000004820 halides Chemical group 0.000 description 17
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
- 150000003949 imides Chemical class 0.000 description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 229910017053 inorganic salt Inorganic materials 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 150000001350 alkyl halides Chemical class 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 150000003003 phosphines Chemical class 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- AXWLKJWVMMAXBD-UHFFFAOYSA-N 1-butylpiperidine Chemical compound CCCCN1CCCCC1 AXWLKJWVMMAXBD-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- KXIXHISTUVHOCY-UHFFFAOYSA-N 1-propan-2-ylpiperidine Chemical compound CC(C)N1CCCCC1 KXIXHISTUVHOCY-UHFFFAOYSA-N 0.000 description 2
- VTDIWMPYBAVEDY-UHFFFAOYSA-N 1-propylpiperidine Chemical compound CCCN1CCCCC1 VTDIWMPYBAVEDY-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- OIALIKXMLIAOSN-UHFFFAOYSA-N 2-Propylpyridine Chemical compound CCCC1=CC=CC=N1 OIALIKXMLIAOSN-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- MFEIKQPHQINPRI-UHFFFAOYSA-N 3-Ethylpyridine Chemical compound CCC1=CC=CN=C1 MFEIKQPHQINPRI-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- PUACTIIESPYWSI-UHFFFAOYSA-N 3-propan-2-ylpyridine Chemical compound CC(C)C1=CC=CN=C1 PUACTIIESPYWSI-UHFFFAOYSA-N 0.000 description 2
- POQRQSUQCQZASR-UHFFFAOYSA-N 3-propyl-3,4-dihydro-2H-phosphole Chemical compound C(CC)C1CC=PC1 POQRQSUQCQZASR-UHFFFAOYSA-N 0.000 description 2
- MLAXEZHEGARMPE-UHFFFAOYSA-N 3-propylpyridine Chemical compound CCCC1=CC=CN=C1 MLAXEZHEGARMPE-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- LCCHCLXDCCGYQK-UHFFFAOYSA-N 4-propyl-3,4-dihydro-2H-phosphole Chemical compound C(CC)C1C=PCC1 LCCHCLXDCCGYQK-UHFFFAOYSA-N 0.000 description 2
- JAWZAONCXMJLFT-UHFFFAOYSA-N 4-propylpyridine Chemical compound CCCC1=CC=NC=C1 JAWZAONCXMJLFT-UHFFFAOYSA-N 0.000 description 2
- XCHUBMBQXFQJEV-UHFFFAOYSA-N 5-propyl-3,4-dihydro-2H-phosphole Chemical compound C(CC)C1=PCCC1 XCHUBMBQXFQJEV-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- RWKQWDPOHYXZJV-UHFFFAOYSA-N C(CC)[PH4] Chemical compound C(CC)[PH4] RWKQWDPOHYXZJV-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 238000005956 quaternization reaction Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 2
- 238000010977 unit operation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RHPOPDNHFKUJHC-UHFFFAOYSA-N 1,2-dimethylphosphinane Chemical compound CC1CCCCP1C RHPOPDNHFKUJHC-UHFFFAOYSA-N 0.000 description 1
- MWUISCCBFHLWLY-UHFFFAOYSA-N 1,2-dimethylpiperidine Chemical compound CC1CCCCN1C MWUISCCBFHLWLY-UHFFFAOYSA-N 0.000 description 1
- PXHHIBMOFPCBJQ-UHFFFAOYSA-N 1,2-dimethylpyrrolidine Chemical compound CC1CCCN1C PXHHIBMOFPCBJQ-UHFFFAOYSA-N 0.000 description 1
- KVUWUSFSNYANBJ-UHFFFAOYSA-N 1,3-dimethylphosphinane Chemical compound CC1CCCP(C)C1 KVUWUSFSNYANBJ-UHFFFAOYSA-N 0.000 description 1
- ONQLCPDIXPYJSS-UHFFFAOYSA-N 1,3-dimethylpiperidine Chemical compound CC1CCCN(C)C1 ONQLCPDIXPYJSS-UHFFFAOYSA-N 0.000 description 1
- IGNGFGXAWDQJGP-UHFFFAOYSA-N 1,3-dimethylpyrrolidine Chemical compound CC1CCN(C)C1 IGNGFGXAWDQJGP-UHFFFAOYSA-N 0.000 description 1
- NBXYSSFGRSXKCT-UHFFFAOYSA-N 1,4-dimethylphosphinane Chemical compound CC1CCP(C)CC1 NBXYSSFGRSXKCT-UHFFFAOYSA-N 0.000 description 1
- TVSMLBGFGKLKOO-UHFFFAOYSA-N 1,4-dimethylpiperidine Chemical compound CC1CCN(C)CC1 TVSMLBGFGKLKOO-UHFFFAOYSA-N 0.000 description 1
- SUFLAGNMNCBHRT-UHFFFAOYSA-N 1-butylphosphinane Chemical compound CCCCP1CCCCC1 SUFLAGNMNCBHRT-UHFFFAOYSA-N 0.000 description 1
- JSHASCFKOSDFHY-UHFFFAOYSA-N 1-butylpyrrolidine Chemical compound CCCCN1CCCC1 JSHASCFKOSDFHY-UHFFFAOYSA-N 0.000 description 1
- OFKCFUCRFXSKRV-UHFFFAOYSA-N 1-ethylphosphinane Chemical compound CCP1CCCCC1 OFKCFUCRFXSKRV-UHFFFAOYSA-N 0.000 description 1
- ONQBOTKLCMXPOF-UHFFFAOYSA-N 1-ethylpyrrolidine Chemical compound CCN1CCCC1 ONQBOTKLCMXPOF-UHFFFAOYSA-N 0.000 description 1
- LCDKAAWGBCNNLE-UHFFFAOYSA-N 1-hexylphosphinane Chemical compound CCCCCCP1CCCCC1 LCDKAAWGBCNNLE-UHFFFAOYSA-N 0.000 description 1
- BBYSGWAYRRMWOW-UHFFFAOYSA-N 1-hexylpiperidine Chemical compound CCCCCCN1CCCCC1 BBYSGWAYRRMWOW-UHFFFAOYSA-N 0.000 description 1
- OUKZCQQNMWXMNE-UHFFFAOYSA-N 1-hexylpyrrolidine Chemical compound CCCCCCN1CCCC1 OUKZCQQNMWXMNE-UHFFFAOYSA-N 0.000 description 1
- BYSFOADOCJNCMQ-UHFFFAOYSA-N 1-methyl-2-propan-2-ylpyrrolidine Chemical compound CC(C)C1CCCN1C BYSFOADOCJNCMQ-UHFFFAOYSA-N 0.000 description 1
- JDRHIFCXIYRAKL-UHFFFAOYSA-N 1-methyl-2-propylpyrrolidine Chemical compound CCCC1CCCN1C JDRHIFCXIYRAKL-UHFFFAOYSA-N 0.000 description 1
- WKJBDCNEMDIONX-UHFFFAOYSA-N 1-methylphosphinane Chemical compound CP1CCCCC1 WKJBDCNEMDIONX-UHFFFAOYSA-N 0.000 description 1
- AVFZOVWCLRSYKC-UHFFFAOYSA-N 1-methylpyrrolidine Chemical compound CN1CCCC1 AVFZOVWCLRSYKC-UHFFFAOYSA-N 0.000 description 1
- HSGVNWNJJBJLQF-UHFFFAOYSA-N 1-pentylphosphinane Chemical compound CCCCCP1CCCCC1 HSGVNWNJJBJLQF-UHFFFAOYSA-N 0.000 description 1
- LQWJONARYDIOSE-UHFFFAOYSA-N 1-pentylpiperidine Chemical compound CCCCCN1CCCCC1 LQWJONARYDIOSE-UHFFFAOYSA-N 0.000 description 1
- NWRUFJHICAREBX-UHFFFAOYSA-N 1-pentylpyrrolidine Chemical compound CCCCCN1CCCC1 NWRUFJHICAREBX-UHFFFAOYSA-N 0.000 description 1
- OJOIPYGGLAIDJH-UHFFFAOYSA-N 1-propan-2-ylphosphinane Chemical compound CC(C)P1CCCCC1 OJOIPYGGLAIDJH-UHFFFAOYSA-N 0.000 description 1
- YQOPNAOQGQSUHF-UHFFFAOYSA-N 1-propan-2-ylpyrrolidine Chemical compound CC(C)N1CCCC1 YQOPNAOQGQSUHF-UHFFFAOYSA-N 0.000 description 1
- LHQYPQFGWOVTCF-UHFFFAOYSA-N 1-propylphosphinane Chemical compound CCCP1CCCCC1 LHQYPQFGWOVTCF-UHFFFAOYSA-N 0.000 description 1
- HLNRRPIYRBBHSQ-UHFFFAOYSA-N 1-propylpyrrolidine Chemical compound CCCN1CCCC1 HLNRRPIYRBBHSQ-UHFFFAOYSA-N 0.000 description 1
- HZNVUJQVZSTENZ-UHFFFAOYSA-N 2,3-dichloro-5,6-dicyano-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(C#N)=C(C#N)C1=O HZNVUJQVZSTENZ-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- BBVSPSDWPYWMOR-UHFFFAOYSA-N 2-(2-Methylpropyl)pyridine Chemical compound CC(C)CC1=CC=CC=N1 BBVSPSDWPYWMOR-UHFFFAOYSA-N 0.000 description 1
- QJSWSWRLOIILFQ-UHFFFAOYSA-N 2-bromoethyl(tributoxy)silane Chemical compound CCCCO[Si](CCBr)(OCCCC)OCCCC QJSWSWRLOIILFQ-UHFFFAOYSA-N 0.000 description 1
- RPOGHLNIRUYQIM-UHFFFAOYSA-N 2-bromoethyl(triethoxy)silane Chemical compound CCO[Si](CCBr)(OCC)OCC RPOGHLNIRUYQIM-UHFFFAOYSA-N 0.000 description 1
- YSECXHPVBRBYSH-UHFFFAOYSA-N 2-bromoethyl(tripropoxy)silane Chemical compound CCCO[Si](CCBr)(OCCC)OCCC YSECXHPVBRBYSH-UHFFFAOYSA-N 0.000 description 1
- PPJBTPJCACXLGB-UHFFFAOYSA-N 2-butan-2-yl-1-methylpyrrolidine Chemical compound CCC(C)C1CCCN1C PPJBTPJCACXLGB-UHFFFAOYSA-N 0.000 description 1
- YRVJJJKVAKFOJV-UHFFFAOYSA-N 2-butan-2-ylpyridine Chemical compound CCC(C)C1=CC=CC=N1 YRVJJJKVAKFOJV-UHFFFAOYSA-N 0.000 description 1
- PWVDAYXZBXAOSA-UHFFFAOYSA-N 2-butyl-1-methylpyrrolidine Chemical compound CCCCC1CCCN1C PWVDAYXZBXAOSA-UHFFFAOYSA-N 0.000 description 1
- ADSOSINJPNKUJK-UHFFFAOYSA-N 2-butylpyridine Chemical compound CCCCC1=CC=CC=N1 ADSOSINJPNKUJK-UHFFFAOYSA-N 0.000 description 1
- CASYTJWXPQRCFF-UHFFFAOYSA-N 2-chloroethyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCl CASYTJWXPQRCFF-UHFFFAOYSA-N 0.000 description 1
- ARJAWFOHPRXXTB-UHFFFAOYSA-N 2-chloroethyl(tripropoxy)silane Chemical compound CCCO[Si](CCCl)(OCCC)OCCC ARJAWFOHPRXXTB-UHFFFAOYSA-N 0.000 description 1
- IDQXZLKEWHBPCA-UHFFFAOYSA-N 2-ethyl-1-methylpyrrolidine Chemical compound CCC1CCCN1C IDQXZLKEWHBPCA-UHFFFAOYSA-N 0.000 description 1
- CQZZWCCRPAFRQB-UHFFFAOYSA-N 2-ethylphosphinine Chemical compound CCC1=CC=CC=P1 CQZZWCCRPAFRQB-UHFFFAOYSA-N 0.000 description 1
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- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- ALFJOLYGZMCHHC-UHFFFAOYSA-N triethoxy(iodomethyl)silane Chemical compound CCO[Si](CI)(OCC)OCC ALFJOLYGZMCHHC-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- OSRJBXRUXTUMBY-UHFFFAOYSA-N triheptylphosphane Chemical compound CCCCCCCP(CCCCCCC)CCCCCCC OSRJBXRUXTUMBY-UHFFFAOYSA-N 0.000 description 1
- FPZZZGJWXOHLDJ-UHFFFAOYSA-N trihexylphosphane Chemical compound CCCCCCP(CCCCCC)CCCCCC FPZZZGJWXOHLDJ-UHFFFAOYSA-N 0.000 description 1
- MDXWYZNTLDXRHV-UHFFFAOYSA-N trimethoxy(2-pyridin-1-ium-1-ylethyl)silane Chemical compound CO[Si](OC)(OC)CC[N+]1=CC=CC=C1 MDXWYZNTLDXRHV-UHFFFAOYSA-N 0.000 description 1
- IXOCYJDFSAFVDS-UHFFFAOYSA-N trimethoxy(3-pyridin-1-ium-1-ylpropyl)silane Chemical compound CO[Si](OC)(OC)CCC[N+]1=CC=CC=C1 IXOCYJDFSAFVDS-UHFFFAOYSA-N 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- HTBFYMOLGOMSNK-UHFFFAOYSA-N trimethoxy-[2-(2-methylpyridin-1-ium-1-yl)ethyl]silane Chemical compound CO[Si](OC)(OC)CC[N+]1=CC=CC=C1C HTBFYMOLGOMSNK-UHFFFAOYSA-N 0.000 description 1
- HYJHVRLWTCKETM-UHFFFAOYSA-N trimethoxy-[3-(3-methylpyridin-1-ium-1-yl)propyl]silane Chemical compound CO[Si](OC)(OC)CCC[N+]1=CC=CC(C)=C1 HYJHVRLWTCKETM-UHFFFAOYSA-N 0.000 description 1
- PLCYUACFALRXKL-UHFFFAOYSA-N trimethoxy-[3-(4-methylpyridin-1-ium-1-yl)propyl]silane Chemical compound CO[Si](OC)(OC)CCC[N+]1=CC=C(C)C=C1 PLCYUACFALRXKL-UHFFFAOYSA-N 0.000 description 1
- PHPGKIATZDCVHL-UHFFFAOYSA-N trimethyl(propoxy)silane Chemical compound CCCO[Si](C)(C)C PHPGKIATZDCVHL-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- IWPNEBZUNGZQQQ-UHFFFAOYSA-N tripentylphosphane Chemical compound CCCCCP(CCCCC)CCCCC IWPNEBZUNGZQQQ-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/30—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen phosphorus-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/16—Anti-static materials
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
[関連出願の相互参照]
本出願は、2014年4月21日に出願された、日本国特許出願第2014−086978号明細書(その開示全体が参照により本明細書中に援用される)に基づく優先権を主張する。[Cross-reference of related applications]
This application claims priority based on Japanese Patent Application No. 2014-086978, filed on Apr. 21, 2014, the entire disclosure of which is incorporated herein by reference.
本発明は、ポリシロキサン共重合体及びそれを含有する帯電防止剤に関する。 The present invention relates to a polysiloxane copolymer and an antistatic agent containing the same.
カチオンがトリアルコキシシリルアルキル基を有するアンモニウム又はホスホニウムであり、アニオンがパーフルオロアルキルスルホニルイミドであるオニウム塩は、フッ素樹脂用の低分子型帯電防止剤として用いることができる旨の報告がなされている(特許文献1参照)。しかしながら、本発明者らが前記オニウム塩の1種である1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミドをポリカーボネート樹脂、アクリル樹脂及びシリコーン樹脂の帯電防止剤として用いたところ、シリコーン樹脂に対しては帯電防止性能を付与できたものの、ポリカーボネート樹脂及びアクリル樹脂に対しては実用的な帯電防止性能を付与できないことが分かった。また、シリコーン樹脂に対しては、シリコーン樹脂の硬化反応が十分に進行せず、光学用粘着剤として実用的な強度特性のシリコーン樹脂組成物が得られないことが分かった(後述の比較例参照)。 It has been reported that an onium salt in which the cation is ammonium or phosphonium having a trialkoxysilylalkyl group and the anion is perfluoroalkylsulfonylimide can be used as a low molecular weight antistatic agent for a fluororesin. (See Patent Document 1). However, the present inventors used 1- (3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium bis (trifluoromethanesulfonyl) imide, which is one of the onium salts, as polycarbonate resin, acrylic resin, and silicone. When used as an antistatic agent for resins, it was found that although antistatic performance could be imparted to silicone resins, practical antistatic performance could not be imparted to polycarbonate resins and acrylic resins. Further, it was found that the silicone resin curing reaction did not proceed sufficiently for the silicone resin, and a silicone resin composition having practical strength characteristics as an optical pressure-sensitive adhesive could not be obtained (see the comparative example described later). ).
本発明は、ポリカーボネート樹脂、アクリル樹脂及びシリコーン樹脂に対して高い帯電防止性を付与でき、かつ光学用粘着剤として実用的な強度特性を有するシリコーン樹脂を製造できるポリシロキサン共重合体及び当該ポリシロキサン共重合体を含有する帯電防止剤を提供することを課題とする。 The present invention relates to a polysiloxane copolymer capable of providing a high antistatic property to a polycarbonate resin, an acrylic resin, and a silicone resin, and capable of producing a silicone resin having practical strength characteristics as an optical adhesive, and the polysiloxane It is an object to provide an antistatic agent containing a copolymer.
本発明者らが上記課題を解決するために鋭意検討を行ったところ、式(1)で示されるオニウム塩と式(2)で示されるジアルコキシシランを共重合することで得られるポリシロキサン共重合体を見出し、さらに当該ポリシロキサン共重合体を帯電防止剤としてポリカーボネート樹脂、アクリル樹脂及びシリコーン樹脂に使用したところ、各々の樹脂に対して高い帯電防止性能を付与できることを見出した。また、シリコーン樹脂の硬化反応が円滑に進行し、光学用粘着剤として実用的な強度特性を有するシリコーン樹脂組成物が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies by the present inventors to solve the above-mentioned problems, a polysiloxane copolymer obtained by copolymerizing an onium salt represented by the formula (1) and a dialkoxysilane represented by the formula (2) is used. When a polymer was found and the polysiloxane copolymer was used as an antistatic agent in a polycarbonate resin, an acrylic resin and a silicone resin, it was found that high antistatic performance could be imparted to each resin. Further, the present inventors have found that a silicone resin composition having a practical strength characteristic as an optical pressure-sensitive adhesive can be obtained by smoothly proceeding the curing reaction of the silicone resin, and completed the present invention.
即ち本発明は、式(1)で示されるオニウム塩(以下、オニウム塩(1)という)と式(2)で示されるジアルコキシシラン(以下、ジアルコキシシラン(2)という)を共重合することにより得られるポリシロキサン共重合体(以下、ポリシロキサン共重合体という)に関する。 That is, the present invention copolymerizes an onium salt represented by formula (1) (hereinafter referred to as onium salt (1)) and a dialkoxysilane represented by formula (2) (hereinafter referred to as dialkoxysilane (2)). The polysiloxane copolymer (henceforth a polysiloxane copolymer) obtained by this.
式(1): Formula (1):
式(2): Formula (2):
本発明のポリシロキサン共重合体は、帯電防止剤として用いることができ、当該帯電防止剤をポリカーボネート樹脂、アクリル樹脂及びシリコーン樹脂に用いることで、高い帯電防止性能を有する樹脂組成物を製造できる。また、本発明のポリシロキサン共重合体を用いると光学用粘着剤として実用的な強度特性を有するシリコーン樹脂組成物を製造することができる。 The polysiloxane copolymer of the present invention can be used as an antistatic agent, and a resin composition having high antistatic performance can be produced by using the antistatic agent in a polycarbonate resin, an acrylic resin, and a silicone resin. Moreover, when the polysiloxane copolymer of the present invention is used, a silicone resin composition having practical strength characteristics as an optical pressure-sensitive adhesive can be produced.
以下、本発明を具体的に説明する。 Hereinafter, the present invention will be specifically described.
式(1)中、Q+は窒素カチオン又はリンカチオンを示し、リンカチオンが好ましい。R1は炭素数1〜3のアルキル基であり、具体的には、メチル基、エチル基、プロピル基及びイソプロピル基が挙げられ、メチル基及びエチル基が好ましく、メチル基が特に好ましい。R2〜R4は炭素数1〜8のアルキル基を示し、直鎖及び分枝鎖状のいずれであってもよく、好ましくは直鎖状のアルキル基である。具体的には、例えば、メチル基、エチル基、プロピル基、ブチル基、ヘキシル基、オクチル基等が挙げられ、メチル基、エチル基、プロピル基及びブチル基が好ましく、ブチル基が特に好ましい。R2とR3は末端で互いに結合し、ピロリジン環、ピペリジン環、ピリジン環、ホスホラン環、ホスホリナン環又はホスホリン環を形成してもよい。但し、R2とR3は末端で互いに結合してピリジン環又はホスホリン環を形成する場合は、R4は存在しない。X−はアニオンを示す。X−としてはハロゲンアニオン又は含フッ素アニオンが挙げられ、ハロゲンアニオンとしてはクロロアニオン、ブロモアニオン、ヨードアニオンが好ましく、クロロアニオンがより好ましい。含フッ素アニオンとしてはトリフルオロメタンスルホン酸アニオン、ビス(トリフルオロメタンスルホニル)イミドアニオン、テトラフルオロボレートアニオン、ヘキサフルオロホスフェートアニオンが好ましく、ビス(トリフルオロメタンスルホニル)イミドアニオンがより好ましい。In the formula (1), Q + represents a nitrogen cation or a phosphorus cation, and preferably a phosphorus cation. R 1 is an alkyl group having 1 to 3 carbon atoms, and specific examples include a methyl group, an ethyl group, a propyl group, and an isopropyl group. A methyl group and an ethyl group are preferable, and a methyl group is particularly preferable. R 2 to R 4 represent an alkyl group having 1 to 8 carbon atoms, which may be linear or branched, and is preferably a linear alkyl group. Specific examples include a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, and an octyl group. A methyl group, an ethyl group, a propyl group, and a butyl group are preferable, and a butyl group is particularly preferable. R 2 and R 3 may be bonded to each other at the terminal to form a pyrrolidine ring, piperidine ring, pyridine ring, phosphorane ring, phosphorinane ring or phospholine ring. However, when R 2 and R 3 are bonded to each other at the terminal to form a pyridine ring or a phospholine ring, R 4 does not exist. X − represents an anion. X − includes a halogen anion or a fluorine-containing anion, and the halogen anion is preferably a chloro anion, a bromo anion, or an iodo anion, and more preferably a chloro anion. As the fluorine-containing anion, a trifluoromethanesulfonic acid anion, a bis (trifluoromethanesulfonyl) imide anion, a tetrafluoroborate anion, and a hexafluorophosphate anion are preferable, and a bis (trifluoromethanesulfonyl) imide anion is more preferable.
オニウム塩(1)の具体例としては、1,1,1−トリメチル−1−[(トリメトキシシリル)メチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[2−(トリメトキシシリル)エチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[3−(トリメトキシシリル)プロピル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[4−(トリメトキシシリル)ブチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[(トリメトキシシリル)メチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[2−(トリメトキシシリル)エチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[3−(トリメトキシシリル)プロピル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[4−(トリメトキシシリル)ブチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[(トリメトキシシリル)メチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[2−(トリメトキシシリル)エチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[3−(トリメトキシシリル)プロピル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[4−(トリメトキシシリル)ブチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[(トリメトキシシリル)メチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[2−(トリメトキシシリル)エチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[3−(トリメトキシシリル)プロピル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[4−(トリメトキシシリル)ブチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[(トリメトキシシリル)メチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[2−(トリメトキシシリル)エチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[3−(トリメトキシシリル)プロピル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[4−(トリメトキシシリル)ブチル]アンモニウム=ビス(トリフルオロメタンスルホニル)イミド、 Specific examples of the onium salt (1) include 1,1,1-trimethyl-1-[(trimethoxysilyl) methyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-trimethyl-1- [ 2- (trimethoxysilyl) ethyl] ammonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trimethyl-1- [3- (trimethoxysilyl) propyl] ammonium = bis (trifluoromethanesulfonyl) imide, , 1,1-trimethyl-1- [4- (trimethoxysilyl) butyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1-[(trimethoxysilyl) methyl] ammonium bis (Trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1- 2- (trimethoxysilyl) ethyl] ammonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1- [3- (trimethoxysilyl) propyl] ammonium = bis (trifluoromethanesulfonyl) imide, , 1,1-triethyl-1- [4- (trimethoxysilyl) butyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1-[(trimethoxysilyl) methyl] ammonium bis (Trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1- [2- (trimethoxysilyl) ethyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1- [3- (Trimethoxysilyl) propyl] ammonium bis ( Trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1- [4- (trimethoxysilyl) butyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1-[(tri Methoxysilyl) methyl] ammonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1- [2- (trimethoxysilyl) ethyl] ammonium = bis (trifluoromethanesulfonyl) imide, 1,1,1 -Trihexyl-1- [3- (trimethoxysilyl) propyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1- [4- (trimethoxysilyl) butyl] ammonium bis (trifluoro) Lomethanesulfonyl) imide, 1,1,1-to Riooctyl-1-[(trimethoxysilyl) methyl] ammonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trioctyl-1- [2- (trimethoxysilyl) ethyl] ammonium = bis (trifluoromethanesulfonyl) Imido, 1,1,1-trioctyl-1- [3- (trimethoxysilyl) propyl] ammonium bis (trifluoromethanesulfonyl) imide, 1,1,1-trioctyl-1- [4- (trimethoxysilyl) Butyl] ammonium bis (trifluoromethanesulfonyl) imide,
1,1,1−トリメチル−1−[(トリメトキシシリル)メチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[2−(トリメトキシシリル)エチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[3−(トリメトキシシリル)プロピル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリメチル−1−[4−(トリメトキシシリル)ブチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[(トリメトキシシリル)メチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[2−(トリメトキシシリル)エチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[3−(トリメトキシシリル)プロピル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリエチル−1−[4−(トリメトキシシリル)ブチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[(トリメトキシシリル)メチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[2−(トリメトキシシリル)エチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[3−(トリメトキシシリル)プロピル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリブチル−1−[4−(トリメトキシシリル)ブチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[(トリメトキシシリル)メチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[2−(トリメトキシシリル)エチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[3−(トリメトキシシリル)プロピル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリヘキシル−1−[4−(トリメトキシシリル)ブチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[(トリメトキシシリル)メチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[2−(トリメトキシシリル)エチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[3−(トリメトキシシリル)プロピル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、1,1,1−トリオクチル−1−[4−(トリメトキシシリル)ブチル]ホスホニウム=ビス(トリフルオロメタンスルホニル)イミド、 1,1,1-trimethyl-1-[(trimethoxysilyl) methyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trimethyl-1- [2- (trimethoxysilyl) ethyl] phosphonium = Bis (trifluoromethanesulfonyl) imide, 1,1,1-trimethyl-1- [3- (trimethoxysilyl) propyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trimethyl-1- [4 -(Trimethoxysilyl) butyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1-[(trimethoxysilyl) methyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1, 1-triethyl-1- [2- (trimethoxysilyl) ethyl Phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1- [3- (trimethoxysilyl) propyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-triethyl-1- [4- (trimethoxysilyl) butyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1-[(trimethoxysilyl) methyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1, 1,1-tributyl-1- [2- (trimethoxysilyl) ethyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-tributyl-1- [3- (trimethoxysilyl) propyl] phosphonium = Bis (trifluoromethanesulfonyl) imi 1,1,1-tributyl-1- [4- (trimethoxysilyl) butyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1-[(trimethoxysilyl) methyl] phosphonium = Bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1- [2- (trimethoxysilyl) ethyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1- [ 3- (trimethoxysilyl) propyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trihexyl-1- [4- (trimethoxysilyl) butyl] phosphonium = bis (trifluoromethanesulfonyl) imide, , 1,1-trioctyl-1-[(trimethoxysilane Ryl) methyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trioctyl-1- [2- (trimethoxysilyl) ethyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1- Trioctyl-1- [3- (trimethoxysilyl) propyl] phosphonium = bis (trifluoromethanesulfonyl) imide, 1,1,1-trioctyl-1- [4- (trimethoxysilyl) butyl] phosphonium = bis (trifluoromethane Sulfonyl) imide,
1−メチル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[(トリメトキシシリル)メチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[2−(トリメトキシシリル)エチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[3−(トリメトキシシリル)プロピル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[4−(トリメトキシシリル)ブチル]ピロリジニウム=ビス(トリフルオロメタンスルホニル)イミド、 1-methyl-1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1- Propyl-1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-hexyl- 1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1-[(trimethoxysilyl) methyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-methyl- -[2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-propyl -1- [2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1 -Hexyl-1- [2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [2- (trimethoxysilyl) ethyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide , -Methyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide 1-propyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (trifluoromethanesulfonyl) ) Imide, 1-hexyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [3- (trimethoxysilyl) propyl] pyrrolidinium = bis (tri Fluorometa Sulfonyl) imide, 1-methyl-1- [4- (trimethoxysilyl) butyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [4- (trimethoxysilyl) butyl] pyrrolidinium = bis (Trifluoromethanesulfonyl) imide, 1-propyl-1- [4- (trimethoxysilyl) butyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [4- (trimethoxysilyl) butyl] pyrrolidinium = Bis (trifluoromethanesulfonyl) imide, 1-hexyl-1- [4- (trimethoxysilyl) butyl] pyrrolidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [4- (trimethoxysilyl) butyl ] Pyrrolidinium bis (tri Le Oro) imide,
1−メチル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[(トリメトキシシリル)メチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[2−(トリメトキシシリル)エチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[3−(トリメトキシシリル)プロピル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−メチル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−エチル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−プロピル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ブチル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−ヘキシル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−オクチル−1−[4−(トリメトキシシリル)ブチル]ピペリジニウム=ビス(トリフルオロメタンスルホニル)イミド、 1-methyl-1-[(trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1-[(trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1- Propyl-1-[(trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1-[(trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-hexyl- 1-[(Trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1-[(trimethoxysilyl) methyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-methyl- -[2- (Trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [2- (trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-propyl -1- [2- (trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [2- (trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide, -Hexyl-1- [2- (trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [2- (trimethoxysilyl) ethyl] piperidinium = bis (trifluoromethanesulfonyl) imide , -Methyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (trifluoromethanesulfonyl) imide 1-propyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (trifluoromethanesulfonyl) ) Imide, 1-hexyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [3- (trimethoxysilyl) propyl] piperidinium = bis (tri Fluorometa Sulfonyl) imide, 1-methyl-1- [4- (trimethoxysilyl) butyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-ethyl-1- [4- (trimethoxysilyl) butyl] piperidinium = bis (Trifluoromethanesulfonyl) imide, 1-propyl-1- [4- (trimethoxysilyl) butyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-butyl-1- [4- (trimethoxysilyl) butyl] piperidinium = Bis (trifluoromethanesulfonyl) imide, 1-hexyl-1- [4- (trimethoxysilyl) butyl] piperidinium = bis (trifluoromethanesulfonyl) imide, 1-octyl-1- [4- (trimethoxysilyl) butyl ] Piperidinium bis (tri Le Oro) imide,
1−[(トリメトキシシリル)メチル]ピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[2−(トリメトキシシリル)エチル]ピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[3−(トリメトキシシリル)プロピル]ピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[4−(トリメトキシシリル)ブチル]ピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[(トリメトキシシリル)メチル]−2−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[2−(トリメトキシシリル)エチル]−2−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[3−(トリメトキシシリル)プロピル]−2−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[4−(トリメトキシシリル)ブチル]−2−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[(トリメトキシシリル)メチル]−3−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[2−(トリメトキシシリル)エチル]−3−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[3−(トリメトキシシリル)プロピル]−3−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[4−(トリメトキシシリル)ブチル]−3−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[(トリメトキシシリル)メチル]−4−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[2−(トリメトキシシリル)エチル]−4−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[3−(トリメトキシシリル)プロピル]−4−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド、1−[4−(トリメトキシシリル)ブチル]−4−メチルピリジニウム=ビス(トリフルオロメタンスルホニル)イミド等が挙げられる。 1-[(trimethoxysilyl) methyl] pyridinium bis (trifluoromethanesulfonyl) imide, 1- [2- (trimethoxysilyl) ethyl] pyridinium bis (trifluoromethanesulfonyl) imide, 1- [3- (trimethoxy Silyl) propyl] pyridinium bis (trifluoromethanesulfonyl) imide, 1- [4- (trimethoxysilyl) butyl] pyridinium bis (trifluoromethanesulfonyl) imide, 1-[(trimethoxysilyl) methyl] -2-methyl Pyridinium bis (trifluoromethanesulfonyl) imide, 1- [2- (trimethoxysilyl) ethyl] -2-methylpyridinium bis (trifluoromethanesulfonyl) imide, 1- [3- (trimethoxysilyl) propyl] -2 -Methylpyridi Um = bis (trifluoromethanesulfonyl) imide, 1- [4- (trimethoxysilyl) butyl] -2-methylpyridinium = bis (trifluoromethanesulfonyl) imide, 1-[(trimethoxysilyl) methyl] -3-methyl Pyridinium bis (trifluoromethanesulfonyl) imide, 1- [2- (trimethoxysilyl) ethyl] -3-methylpyridinium bis (trifluoromethanesulfonyl) imide, 1- [3- (trimethoxysilyl) propyl] -3 -Methylpyridinium bis (trifluoromethanesulfonyl) imide, 1- [4- (trimethoxysilyl) butyl] -3-methylpyridinium bis (trifluoromethanesulfonyl) imide, 1-[(trimethoxysilyl) methyl] -4 -Methylpyridinium bis Trifluoromethanesulfonyl) imide, 1- [2- (trimethoxysilyl) ethyl] -4-methylpyridinium = bis (trifluoromethanesulfonyl) imide, 1- [3- (trimethoxysilyl) propyl] -4-methylpyridinium = And bis (trifluoromethanesulfonyl) imide, 1- [4- (trimethoxysilyl) butyl] -4-methylpyridinium = bis (trifluoromethanesulfonyl) imide, and the like.
本発明で用いるオニウム塩(1)は、特開2010−248165号公報に記載の方法に準じて製造することができる。その代表的な方法を下記の反応式1において説明する。なお、当該反応式中、R1、R2、R3、R4、Q、X及びnは前記に同じであり、Zはハロゲン原子を示し、Mはアルカリ金属を示す。The onium salt (1) used in the present invention can be produced according to the method described in JP 2010-248165 A. The representative method is illustrated in the following reaction formula 1. In the reaction formula, R 1 , R 2 , R 3 , R 4 , Q, X and n are the same as above, Z represents a halogen atom, and M represents an alkali metal.
式(5)で表されるアミン類(以下、アミン類(5a)という。)又はホスフィン類(以下、ホスフィン類(5b)という。)を、式(6)で表されるアルキルハライド類(以下、アルキルハライド類(6)という。)と四級化反応させて、式(7)で表されるオニウム=ハライド(以下、オニウム=ハライド類(7)という。)が製造される。X−がハロゲンアニオンである場合、オニウム=ハライド類(7)を、オニウム塩(1)として使用することができる。An amine represented by formula (5) (hereinafter referred to as amine (5a)) or phosphine (hereinafter referred to as phosphine (5b)) is converted to an alkyl halide represented by formula (6) (hereinafter referred to as “phosphine”). And quaternization reaction with alkyl halides (6)) to produce onium = halide represented by formula (7) (hereinafter referred to as onium = halides (7)). When X − is a halogen anion, onium halides (7) can be used as the onium salt (1).
次に、オニウム=ハライド類(7)と、式(8)で表されるアルキル金属塩という。)とのイオン交換反応により、オニウム塩(1)が製造できる。 Next, onium = halides (7) and an alkyl metal salt represented by the formula (8) are referred to. The onium salt (1) can be produced by an ion exchange reaction with
アミン類(5a)としては、トリメチルアミン、トリエチルアミン、トリプロピルアミン、トリブチルアミン、トリペンチルアミン、トリヘキシルアミン、トリヘプチルアミン、トリオクチルアミン、 Examples of amines (5a) include trimethylamine, triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine,
1−メチルピロリジン、1−メチルピペリジン、1−エチルピロリジン、1−エチルピペリジン、1−プロピルピロリジン、1−プロピルピペリジン、1−イソプロピルピロリジン、1−イソプロピルピペリジン、1−ブチルピロリジン、1−ブチルピペリジン、1−ペンチルピロリジン、1−ペンチルピペリジン、1−ヘキシルピロリジン、1−ヘキシルピペリジン、1−メチル−2−メチルピロリジン、1−メチル−2−メチルピペリジン、1−メチル−3−メチルピロリジン、1−メチル−3−メチルピペリジン、1−メチル−4−メチルピペリジン、1−メチル−2−エチルピロリジン、1−メチル−2−プロピルピロリジン、1−メチル−2−イソプロピルピロリジン、1−メチル−2−ブチルピロリジン、1−メチル−2−イソブチルピロリジン、1−メチル−2−sec−ブチルピロリジン、1−メチル−2−tert−ブチルピロリジン、 1-methylpyrrolidine, 1-methylpiperidine, 1-ethylpyrrolidine, 1-ethylpiperidine, 1-propylpyrrolidine, 1-propylpiperidine, 1-isopropylpyrrolidine, 1-isopropylpiperidine, 1-butylpyrrolidine, 1-butylpiperidine, 1-pentylpyrrolidine, 1-pentylpiperidine, 1-hexylpyrrolidine, 1-hexylpiperidine, 1-methyl-2-methylpyrrolidine, 1-methyl-2-methylpiperidine, 1-methyl-3-methylpyrrolidine, 1-methyl -3-methylpiperidine, 1-methyl-4-methylpiperidine, 1-methyl-2-ethylpyrrolidine, 1-methyl-2-propylpyrrolidine, 1-methyl-2-isopropylpyrrolidine, 1-methyl-2-butylpyrrolidine 1-methyl-2-iso Chirupirorijin, 1-methyl -2-sec-butyl pyrrolidine, 1-methyl -2-tert- butyl pyrrolidine,
ピリジン、2−メチルピリジン、3−メチルピリジン、4−メチルピリジン、2−エチルピリジン、3−エチルピリジン、4−エチルピリジン、2−プロピルピリジン、3−プロピルピリジン、4−プロピルピリジン、2−プロピルピリジン、3−プロピルピリジン、4−プロピルピリジン、2−イソプロピルピリジン、3−イソプロピルピリジン、4−イソプロピルピリジン、2−ブチルピリジン、3−ブチルピリジン、4−ブチルピリジン、2−イソブチルピリジン、3−イソブチルピリジン、4−イソブチルピリジン、2−sec−ブチルピリジン、3−sec−ブチルピリジン、4−sec−ブチルピリジン、2−tert−ブチルピリジン、3−tert−ブチルピリジン、4−tert−ブチルピリジン等が挙げられる。 Pyridine, 2-methylpyridine, 3-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 3-ethylpyridine, 4-ethylpyridine, 2-propylpyridine, 3-propylpyridine, 4-propylpyridine, 2-propyl Pyridine, 3-propylpyridine, 4-propylpyridine, 2-isopropylpyridine, 3-isopropylpyridine, 4-isopropylpyridine, 2-butylpyridine, 3-butylpyridine, 4-butylpyridine, 2-isobutylpyridine, 3-isobutyl Pyridine, 4-isobutylpyridine, 2-sec-butylpyridine, 3-sec-butylpyridine, 4-sec-butylpyridine, 2-tert-butylpyridine, 3-tert-butylpyridine, 4-tert-butylpyridine and the like Can be mentioned.
ホスフィン類(5b)としては、トリメチルホスフィン、トリエチルホスフィン、トリプロピルホスフィン、トリブチルホスフィン、トリペンチルホスフィン、トリヘキシルホスフィン、トリヘプチルホスフィン、トリオクチルホスフィン、 Examples of phosphines (5b) include trimethylphosphine, triethylphosphine, tripropylphosphine, tributylphosphine, tripentylphosphine, trihexylphosphine, triheptylphosphine, trioctylphosphine,
1−メチルホスホラン、1−メチルホスホリナン、1−エチルホスホラン、1−エチルホスホリナン、1−プロピルホスホラン、1−プロピルホスホリナン、1−イソプロピルホスホラン、1−イソプロピルホスホリナン、1−ブチルホスホラン、1−ブチルホスホリナン、1−ペンチルホスホラン、1−ペンチルホスホリナン、1−ヘキシルホスホラン、1−ヘキシルホスホリナン、1−メチル−2−メチルホスホラン、1−メチル−2−メチルホスホリナン、1−メチル−3−メチルホスホラン、1−メチル−3−メチルホスホリナン、1−メチル−4−メチルホスホリナン、1−メチル−2−エチルホスホラン、1−メチル−2−プロピルホスホラン、1−メチル−2−イソプロピルホスホラン、1−メチル−2−ブチルホスホラン、1−メチル−2−イソブチルホスホラン、1−メチル−2−sec−ブチルホスホラン、1−メチル−2−tert−ブチルホスホラン、 1-methylphosphorane, 1-methylphosphorinane, 1-ethylphosphorane, 1-ethylphosphorinane, 1-propylphosphorane, 1-propylphosphorinane, 1-isopropylphosphorane, 1-isopropylphosphorinane, 1- Butylphosphorane, 1-butylphosphorinane, 1-pentylphosphorane, 1-pentylphosphorinane, 1-hexylphosphorane, 1-hexylphosphorinane, 1-methyl-2-methylphosphorane, 1-methyl-2- Methylphosphorinane, 1-methyl-3-methylphosphorane, 1-methyl-3-methylphosphorinane, 1-methyl-4-methylphosphorinane, 1-methyl-2-ethylphosphorane, 1-methyl-2- Propyl phosphorane, 1-methyl-2-isopropylphosphorane, 1-methyl-2-butylphosphorane, - methyl-2-isobutyl phosphorane, 1-methyl -2-sec-butyl phosphorane, 1-methyl -2-tert- butyl phosphorane,
ホスホリン、2−メチルホスホリン、3−メチルホスホリン、4−メチルホスホリン、2−エチルホスホリン、3−エチルホスホリン、4−エチルホスホリン、2−プロピルホスホリン、3−プロピルホスホリン、4−プロピルホスホリン、2−プロピルホスホリン、3−プロピルホスホリン、4−プロピルホスホリン、2−イソプロピルホスホリン、3−イソプロピルホスホリン、4−イソプロピルホスホリン、2−ブチルホスホリン、3−ブチルホスホリン、4−ブチルホスホリン、2−イソブチルホスホリン、3−イソブチルホスホリン、4−イソブチルホスホリン、2−sec−ブチルホスホリン、3−sec−ブチルホスホリン、4−sec−ブチルホスホリン、2−tert−ブチルホスホリン、3−tert−ブチルホスホリン、4−tert−ブチルホスホリン等が挙げられる。 Phospholine, 2-methylphosphorin, 3-methylphospholine, 4-methylphospholine, 2-ethylphosphorin, 3-ethylphosphorine, 4-ethylphosphorine, 2-propylphospholine, 3-propylphospholine, 4-propyl phospholine, 2-propyl phospholine, 3-propyl phospholine, 4-propyl phospholine, 2-isopropyl phospholine, 3-isopropyl phospholine, 4-isopropyl phospholine, 2-butyl phospholine, 3- Butyl phospholine, 4-butyl phospholine, 2-isobutyl phospholine, 3-isobutyl phospholine, 4-isobutyl phospholine, 2-sec-butyl phospholine, 3-sec-butyl phospholine, 4-sec-butyl phospho Phosphorus, 2-tert-butylphosphorine, 3-tert-butylphosphoryl , 4-tert Buchiruhosuhorin the like.
アルキルハライド類(6)としては、例えば、クロロメチルトリメトキシシラン、2−クロロエチルトリメトキシラン、3−クロロプロピルトリメトキシシラン、4−クロロブチルトリメトキシラン、クロロメチルトリエトキシシラン、2−クロロエチルトリエトキシラン、3−クロロプロピルトリエトキシシラン、4−クロロブチルトリエトキシラン、クロロメチルトリプロポキシシラン、2−クロロエチルトリプロポキシラン、3−クロロプロピルトリプロポキシシラン、4−クロロブチルトリプロポキシラン、クロロメチルトリブトキシシラン、2−クロロエチルトリブトキシラン、3−クロロプロピルトリブトキシシラン、4−クロロブチルトリブトキシラン、ブロモメチルトリメトキシシラン、2−ブロモエチルトリメトキシラン、3−ブロモプロピルトリメトキシシラン、4−ブロモブチルトリメトキシラン、ブロモメチルトリエトキシシラン、2−ブロモエチルトリエトキシラン、3−ブロモプロピルトリエトキシシラン、4−ブロモブチルトリエトキシラン、ブロモメチルトリプロポキシシラン、2−ブロモエチルトリプロポキシラン、3−ブロモプロピルトリプロポキシシラン、4−ブロモブチルトリプロポキシラン、ブロモメチルトリブトキシシラン、2−ブロモエチルトリブトキシラン、3−ブロモプロピルトリブトキシシラン、4−ブロモブチルトリブトキシラン、ヨ−ドメチルトリメトキシシラン、2−ヨ−ドエチルトリメトキシラン、3−ヨ−ドプロピルトリメトキシシラン、4−ヨ−ドブチルトリメトキシラン、ヨ−ドメチルトリエトキシシラン、2−ヨ−ドエチルトリエトキシラン、3−ヨ−ドプロピルトリエトキシシラン、4−ヨ−ドブチルトリエトキシラン、ヨ−ドメチルトリプロポキシシラン、2−ヨ−ドエチルトリプロポキシラン、3−ヨ−ドプロピルトリポロポキシシラン、4−ヨ−ドブチルトリプロポキシラン、ヨ−ドメチルトリブトキシシラン、2−ヨ−ドエチルトリブトキシラン、3−ヨ−ドプロピルトリブトキシシラン、4−ヨ−ドブチルトリブトキシラン等が挙げられる。 Examples of the alkyl halides (6) include chloromethyltrimethoxysilane, 2-chloroethyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 4-chlorobutyltrimethoxysilane, chloromethyltriethoxysilane, and 2-chloro. Ethyltriethoxysilane, 3-chloropropyltriethoxysilane, 4-chlorobutyltriethoxysilane, chloromethyltripropoxysilane, 2-chloroethyltripropoxysilane, 3-chloropropyltripropoxysilane, 4-chlorobutyltripropoxysilane Chloromethyltributoxysilane, 2-chloroethyltributoxysilane, 3-chloropropyltributoxysilane, 4-chlorobutyltributoxysilane, bromomethyltrimethoxysilane, 2-bromoethyltrimethoxysilane 3-bromopropyltrimethoxysilane, 4-bromobutyltrimethoxysilane, bromomethyltriethoxysilane, 2-bromoethyltriethoxysilane, 3-bromopropyltriethoxysilane, 4-bromobutyltriethoxysilane, bromomethyltripropoxy Silane, 2-bromoethyltripropoxysilane, 3-bromopropyltripropoxysilane, 4-bromobutyltripropoxysilane, bromomethyltributoxysilane, 2-bromoethyltributoxysilane, 3-bromopropyltributoxysilane, 4- Bromobutyl tributoxylan, iodomethyltrimethoxysilane, 2-iodoethyltrimethoxysilane, 3-iodopropyltrimethoxysilane, 4-iodobutyltrimethoxylane, iodomethyltriethoxy Silane, -Iodoethyltriethoxysilane, 3-iodopropyltriethoxysilane, 4-iodobutyltriethoxylane, iodomethyltripropoxysilane, 2-iodoethyltripropoxysilane, 3-iodo -Dopropyltripropoxysilane, 4-iodobutyltripropoxysilane, iodomethyltributoxysilane, 2-iodoethyltributoxysilane, 3-iodopropyltributoxysilane, 4-iodo Examples include dobutyltributoxylan.
式(5)で表されるアミン類又はホスフィン類と、アルキルハライド類(6)との四級化反応は、溶媒を使用してもしなくてもよい。溶媒を使用するときの溶媒としては、メタノール、エタノール、2−プロパノール等のアルコール類、アセトニトリル、酢酸エチル、テトラヒドロフラン、ジメチルホルムアミド等が挙げられる。 The quaternization reaction of the amines or phosphines represented by the formula (5) and the alkyl halides (6) may or may not use a solvent. Examples of the solvent when using the solvent include alcohols such as methanol, ethanol and 2-propanol, acetonitrile, ethyl acetate, tetrahydrofuran, dimethylformamide and the like.
アルキルハライド類(6)の使用量は、式(5)で表されるアミン類又はホスフィン類1モルに対して0.7モル以上であればよく、好ましくは0、9〜1.5モルである。 The amount of alkyl halides (6) used may be 0.7 moles or more, preferably 0, 9 to 1.5 moles per mole of amines or phosphines represented by formula (5). is there.
アルカリ金属塩(8)としては、ビス(トリフルオロメタンスルホニル)イミドリチウム、ビス(トリフルオロメタンスルホニル)イミドナトリウム、ビス(トリフルオロメタンスルホニル)イミドカリウム、テトラフルオロボレートリチウム、テトラフルオロボレートナトリウム、テトラフルオロボレートカリウム、ヘキサフルオロホスフェートリチウム、ヘキサフルオロホスフェートナトリウム、ヘキサフルオロホスフェートカリウム等の含フッ素アニオンのアルカリ金属塩が挙げられる。 Examples of the alkali metal salt (8) include bis (trifluoromethanesulfonyl) imide lithium, bis (trifluoromethanesulfonyl) imide sodium, bis (trifluoromethanesulfonyl) imide potassium, tetrafluoroborate lithium, tetrafluoroborate sodium, and tetrafluoroborate potassium. And alkali metal salts of fluorine-containing anions such as lithium hexafluorophosphate, sodium hexafluorophosphate, potassium hexafluorophosphate, and the like.
アニオンのカウンターカチオンを形成するアルカリ金属としては、リチウム、ナトリウム、カリウムが挙げられる。 Examples of the alkali metal that forms an anion counter cation include lithium, sodium, and potassium.
イオン交換反応におけるアルカリ金属塩(6)の使用量は、オニウム=ハライド類(5)1モルに対して、通常0.8モル以上、好ましくは0.9モル〜1.2モルであり、より好ましくは1〜1.05モルである。 The amount of the alkali metal salt (6) used in the ion exchange reaction is usually 0.8 mol or more, preferably 0.9 mol to 1.2 mol, relative to 1 mol of onium = halides (5). Preferably it is 1-1.05 mol.
イオン交換反応は通常溶媒中で行われる。溶媒としては、アセトン、メチルエチルケトン等のケトン類、メタノール、エタノール、2−プロパノール等のアルコール類、アセトニトリル、酢酸エチル、テトラヒドロフラン、ジメチルホルムアミド等が挙げられる。使用量は特に制限はないが、オニウム=ハライド類(5)1重量部に対して通常10重量部以下、好ましくは1〜10重量部であり、特に好ましくは2〜6重量部である。 The ion exchange reaction is usually performed in a solvent. Examples of the solvent include ketones such as acetone and methyl ethyl ketone, alcohols such as methanol, ethanol and 2-propanol, acetonitrile, ethyl acetate, tetrahydrofuran and dimethylformamide. The amount used is not particularly limited, but is usually 10 parts by weight or less, preferably 1 to 10 parts by weight, particularly preferably 2 to 6 parts by weight, based on 1 part by weight of onium halides (5).
オニウム=ハライド類(5)、アルカリ金属塩(6)及び溶媒の混合順序は特に限定されず、オニウム=ハライド類(5)と溶媒を混合した後にアルカリ金属塩(6)を添加してもよいし、アルカリ金属塩(6)と溶媒を混合した後にオニウム=ハライド類(5)を添加してもよい。 The mixing order of the onium = halides (5), alkali metal salt (6) and solvent is not particularly limited, and the alkali metal salt (6) may be added after mixing the onium = halides (5) and the solvent. The onium halides (5) may be added after mixing the alkali metal salt (6) and the solvent.
イオン交換反応における反応温度は、通常10℃以上、好ましくは10〜60℃、特に好ましくは10〜30℃である。 The reaction temperature in the ion exchange reaction is usually 10 ° C. or higher, preferably 10 to 60 ° C., particularly preferably 10 to 30 ° C.
反応終了後の反応液からオニウム塩(1)を分離するには、溶媒及び生成する無機塩を反応液から除去する。得られた反応液中に無機塩が析出していれば、反応液を濾過して析出の無機塩を除き、次いで濃縮、ろ過、抽出等の単位操作を適宜組み合わせて、オニウム塩(1)を単離する。また、得られた反応液中に無機塩が析出していない場合には、反応液を濃縮して無機塩を析出させ、ろ過で無機塩を除去した後、濃縮、ろ過、抽出等の単位操作を適宜組み合わせて、オニウム塩(1)を単離する。 In order to separate the onium salt (1) from the reaction solution after completion of the reaction, the solvent and the generated inorganic salt are removed from the reaction solution. If an inorganic salt is precipitated in the obtained reaction solution, the reaction solution is filtered to remove the precipitated inorganic salt, and then unit operations such as concentration, filtration, extraction and the like are appropriately combined to obtain an onium salt (1). Isolate. In addition, when no inorganic salt is precipitated in the obtained reaction solution, the reaction solution is concentrated to precipitate the inorganic salt, and after removing the inorganic salt by filtration, unit operations such as concentration, filtration, extraction, etc. Are appropriately combined to isolate the onium salt (1).
式(2)中、R5は炭素数1〜10のアルキル基、炭素数6〜10のアリール基、又は炭素数7〜10のアラルキル基を表す。R5は同一または異なっていてもよく、R5としては具体的には、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、へプチル基、オクチル基、ノニル基、デシル基、フェニル基、ベンジル基、ナフチル基等が挙げられ、メチル基及びフェニル基が好ましく、メチル基が特に好ましい。R6は炭素数1〜3のアルキル基を示し、具体的には、メチル基、エチル基、プロピル基等が挙げられ、メチル基及びエチル基が好ましく、メチル基が特に好ましい。In formula (2), R 5 represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aralkyl group having 7 to 10 carbon atoms. R 5 may be the same or different. Specific examples of R 5 include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group. , A phenyl group, a benzyl group, a naphthyl group, and the like. A methyl group and a phenyl group are preferable, and a methyl group is particularly preferable. R 6 represents an alkyl group having 1 to 3 carbon atoms, and specific examples thereof include a methyl group, an ethyl group, and a propyl group. A methyl group and an ethyl group are preferable, and a methyl group is particularly preferable.
ジアルコキシシラン(2)の具体例としては、ジメチルジメトキシシラン、ジエチルジメトキシシラン、ジプロピルジメトキシシラン、メチルエチルジメトキシシラン、メチルプロピルジメトキシシラン、メチルブチルジメトキシシラン、メチルペンチルジメトキシシラン、メチルヘキシルジメトキシシラン、メチルへプチルジメトキシシラン、メチルオクチルジメトキシシラン、メチルノニルジメトキシシラン、メチルデシルジメトキシシラン、メチルフェニルジメトキシシラン、メチルベンジルジメトキシシラン、メチルナフチルジメトキシシラン、ジメチルジエトキシシラン、ジエチルジエトキシシラン、ジプロピルジエトキシシラン、メチルエチルジエトキシシラン、メチルプロピルジエトキシシラン、メチルブチルジエトキシシラン、メチルペンチルジエトキシシラン、メチルヘキシルジエトキシシラン、メチルへプチルジエトキシシラン、メチルオクチルジエトキシシラン、メチルノニルジエトキシシラン、メチルデシルジエトキシシラン、メチルフェニルジエトキシシラン、メチルベンジルジエトキシシラン、メチルナフチルジエトキシシラン、ジメチルジプロポキシシラン、ジエチルジプロポキシシラン、ジプロピルジプロポキシシラン、メチルエチルジプロポキシシラン、メチルプロピルジプロポキシシラン、メチルブチルジプロポキシシラン、メチルペンチルジプロポキシシラン、メチルヘキシルジプロポキシシラン、メチルへプチルジプロポキシシラン、メチルオクチルジプロポキシシラン、メチルノニルジプロポキシシラン、メチルデシルジプロポキシシラン、メチルフェニルジプロポキシシラン、メチルベンジルジプロポキシシラン、メチルナフチルジプロポキシシラン、ジフェニルジメトキシシラン、ジフェニルジエトキシシラン、ジフェニルジプロポキシシラン等が挙げられ、ジメチルジメトキシシランが好ましい。 Specific examples of dialkoxysilane (2) include dimethyldimethoxysilane, diethyldimethoxysilane, dipropyldimethoxysilane, methylethyldimethoxysilane, methylpropyldimethoxysilane, methylbutyldimethoxysilane, methylpentyldimethoxysilane, methylhexyldimethoxysilane, Methylheptyldimethoxysilane, methyloctyldimethoxysilane, methylnonyldimethoxysilane, methyldecyldimethoxysilane, methylphenyldimethoxysilane, methylbenzyldimethoxysilane, methylnaphthyldimethoxysilane, dimethyldiethoxysilane, diethyldiethoxysilane, dipropyldiethoxy Silane, methylethyldiethoxysilane, methylpropyldiethoxysilane, methylbutyldiethoxysilane Methylpentyldiethoxysilane, methylhexyldiethoxysilane, methylheptyldiethoxysilane, methyloctyldiethoxysilane, methylnonyldiethoxysilane, methyldecyldiethoxysilane, methylphenyldiethoxysilane, methylbenzyldiethoxysilane, Methylnaphthyldiethoxysilane, dimethyldipropoxysilane, diethyldipropoxysilane, dipropyldipropoxysilane, methylethyldipropoxysilane, methylpropyldipropoxysilane, methylbutyldipropoxysilane, methylpentyldipropoxysilane, methylhexyldipropoxy Silane, methyl heptyl dipropoxy silane, methyl octyl dipropoxy silane, methyl nonyl dipropoxy silane, methyl decyl dipropoxy silane Emissions, methylphenyl dipropoxy silane, methyl benzyl di-propoxysilane, methyl naphthyl dipropoxy silane, diphenyl dimethoxy silane, diphenyl diethoxy silane, diphenyl propoxysilane, and the like, dimethyldimethoxysilane is preferable.
ジアルコキシシラン(2)は市販品を用いてもよいし、公知の製造方法により製造したものを用いてもよい。 As the dialkoxysilane (2), a commercially available product may be used, or a product produced by a known production method may be used.
オニウム塩(1)とジアルコキシシラン(2)との共重合は、通常、オニウム塩(1)とジアルコキシシラン(2)の混合物に、オニウム塩(1)及びジアルコキシシラン(2)の両方を溶解する有機溶媒(例えばメタノール、エタノール、イソプロピルアルコール、アセトン等)を加えて溶液とした後、その溶液に加水分解反応の触媒となる酸(以下、酸(3)という。)又は塩基(以下、塩基(4)という。)と水を滴下して行われる。酸(3)又は塩基(4)は、水溶液で滴下しても良い。オニウム塩(1)とジアルコキシシラン(2)の量論比は、通常オニウム塩(1)1モルに対してジアルコキシシラン(2)4〜49モル、好ましくはオニウム塩(1)1モルに対してジアルコキシシラン(2)4〜16モル、より好ましくはオニウム塩(1)1モルに対してジアルコキシシラン(2)4〜8モルである。なお、オニウム塩(1)とジアルコキシシラン(2)との共重合において、メチルトリメトキシシラン、ビニルトリメトキシシラン等のトリアルコキシシランを含有させて得た共重合体は、上記トリアルコキシシランを含有させないポリシロキサン共重合体に比べて、樹脂に対する帯電防止付与性能が低下する傾向がある。このため、オニウム塩(1)とジアルコキシシラン(2)との共重合体は、上記トリアルコキシシランを含有しないものである。また、その他の任意成分として、帯電防止性発現の効果を損なわない範囲でモノアルコキシシラン、テトラアルコキシシランを混合し共重合しても良い。モノアルコキシシランの具体例としては、トリメチルメトキシシラン、ビニルジメチルメトキシシラン、トリメチルエトキシシラン、ビニルジメチルエトキシシラン、トリメチルプロポキシシラン、ビニルジメチルプロポキシシラン等が挙げられ、テトラアルコキシシランの具体例としては、テトラメトキシシラン、テトラエトキシシラン、テトラプロポキシシラン等が挙げられる。 The copolymerization of the onium salt (1) and the dialkoxysilane (2) is usually performed by mixing both the onium salt (1) and the dialkoxysilane (2) into a mixture of the onium salt (1) and the dialkoxysilane (2). An organic solvent (for example, methanol, ethanol, isopropyl alcohol, acetone, etc.) that dissolves the solution is added to obtain a solution, and then an acid (hereinafter referred to as acid (3)) or a base (hereinafter referred to as acid (3)) is used as a catalyst for the hydrolysis reaction. , Base (4)) and water. The acid (3) or base (4) may be added dropwise with an aqueous solution. The stoichiometric ratio of the onium salt (1) to the dialkoxysilane (2) is usually 4 to 49 moles of dialkoxysilane (2), preferably 1 mole of onium salt (1) with respect to 1 mole of the onium salt (1). The amount of dialkoxysilane (2) is 4 to 16 mol, more preferably 4 to 8 mol of dialkoxysilane (2) with respect to 1 mol of onium salt (1). In the copolymerization of the onium salt (1) and the dialkoxysilane (2), a copolymer obtained by adding a trialkoxysilane such as methyltrimethoxysilane or vinyltrimethoxysilane contains the trialkoxysilane. Compared to a polysiloxane copolymer that is not contained, the antistatic imparting performance to the resin tends to be reduced. For this reason, the copolymer of onium salt (1) and dialkoxysilane (2) does not contain the trialkoxysilane. Further, as other optional components, monoalkoxysilane and tetraalkoxysilane may be mixed and copolymerized as long as the effect of antistatic property is not impaired. Specific examples of monoalkoxysilane include trimethylmethoxysilane, vinyldimethylmethoxysilane, trimethylethoxysilane, vinyldimethylethoxysilane, trimethylpropoxysilane, and vinyldimethylpropoxysilane. Specific examples of tetraalkoxysilane include tetra Examples include methoxysilane, tetraethoxysilane, and tetrapropoxysilane.
オニウム塩(1)とジアルコキシシラン(2)を溶解する有機溶媒の使用量は、特に制限はないが、通常、オニウム塩(1)1重量部に対して通常20重量部以下、好ましくは0.5〜10重量部であり、特に好ましくは1〜5重量部である。 The amount of the organic solvent used for dissolving the onium salt (1) and the dialkoxysilane (2) is not particularly limited, but is usually 20 parts by weight or less, preferably 0 with respect to 1 part by weight of the onium salt (1). 0.5 to 10 parts by weight, particularly preferably 1 to 5 parts by weight.
酸(3)としては、例えば、塩酸、硫酸、硝酸、酢酸、パラトルエンスルホン酸一水和物等が挙げられ、塩酸が特に好ましい。酸(3)の使用量は、通常、オニウム塩(1)1モルに対して、0.001〜1モル、好ましくは0.01〜0.2モルである。 Examples of the acid (3) include hydrochloric acid, sulfuric acid, nitric acid, acetic acid, paratoluenesulfonic acid monohydrate, and hydrochloric acid is particularly preferable. The usage-amount of an acid (3) is 0.001-1 mol normally with respect to 1 mol of onium salts (1), Preferably it is 0.01-0.2 mol.
塩基(4)としては、例えば、水酸化ナトリウム、水酸化カリウム、水酸化リチウム等が挙げられる。塩基(4)の使用量は、通常、オニウム塩(1)1モルに対して、0.001〜1モル、好ましくは0.01〜0.2モルである。 Examples of the base (4) include sodium hydroxide, potassium hydroxide, lithium hydroxide and the like. The usage-amount of a base (4) is 0.001-1 mol normally with respect to 1 mol of onium salts (1), Preferably it is 0.01-0.2 mol.
共重合に用いる水の使用量は、通常、オニウム塩(1)1モルに対して、4〜49モルである。 The amount of water used for the copolymerization is usually 4 to 49 mol with respect to 1 mol of the onium salt (1).
オニウム塩(1)とジアルコキシシラン(2)との共重合の反応温度は特に制限はないが、通常10〜80℃、好ましくは20〜40℃である。反応時間としては、通常3時間以上、好ましくは3〜72時間である。 The reaction temperature for the copolymerization of the onium salt (1) and dialkoxysilane (2) is not particularly limited, but is usually 10 to 80 ° C, preferably 20 to 40 ° C. The reaction time is usually 3 hours or longer, preferably 3 to 72 hours.
ポリシロキサン共重合体は前記反応によって得られる反応混合物を濃縮することで得られ、得られたポリシロキサン共重合体は必要に応じて混和しない有機溶媒(ヘキサン、ヘプタン、ベンゼン、トルエン等)で洗浄してもよい。 The polysiloxane copolymer is obtained by concentrating the reaction mixture obtained by the above reaction, and the obtained polysiloxane copolymer is washed with an immiscible organic solvent (hexane, heptane, benzene, toluene, etc.) as necessary. May be.
共重合に用いる有機溶媒の使用量に特に制限はないが、通常、オニウム塩(1)1重量部に対して通常20重量部以下、好ましくは2〜9重量部である。 Although there is no restriction | limiting in particular in the usage-amount of the organic solvent used for copolymerization, Usually, it is 20 weight part or less with respect to 1 weight part of onium salt (1), Preferably it is 2-9 weight part.
反応混合物の濃縮温度に特に制限はないが、通常10〜120℃、好ましくは60〜80℃である。 Although there is no restriction | limiting in particular in the concentration temperature of a reaction mixture, Usually, 10-120 degreeC, Preferably it is 60-80 degreeC.
このようにして得られたポリシロキサン共重合体は、樹脂に練りこむことで、樹脂に対して帯電防止性能を付与することができる。前記樹脂としては、例えばポリカーボネート樹脂、アクリル樹脂及びシリコーン樹脂が挙げられる。従って、本発明は、上記ポリシロキサン共重合体を樹脂に添加(例えば、混練。)する工程を含む、樹脂に対して帯電防止性能を付与する方法をも提供する。さらに、本発明は、上記ポリシロキサン共重合体の、帯電防止剤としての、特に、樹脂に対して帯電防止性能を付与するための使用をも提供する。 The polysiloxane copolymer thus obtained can be imparted with antistatic performance to the resin by being kneaded into the resin. Examples of the resin include polycarbonate resin, acrylic resin, and silicone resin. Therefore, the present invention also provides a method for imparting antistatic performance to a resin, including a step of adding (for example, kneading) the polysiloxane copolymer to the resin. Furthermore, the present invention also provides the use of the polysiloxane copolymer as an antistatic agent, particularly for imparting antistatic performance to a resin.
また、ポリシロキサン共重合体を樹脂に練りこむ際は、加熱溶融して混練しても良いし、適当な溶媒(例えば、ジクロロメタン、酢酸エチル、トルエン等)と混合して溶液を調製した後、当該溶液を塗布し、溶媒を除去する等の方法により、樹脂を成型しても良い。光硬化性の樹脂の場合、ポリシロキサン共重合体を含む樹脂又はその溶液を塗布後、当該塗布面を紫外線照射により硬化させても良い。 Further, when kneading the polysiloxane copolymer into the resin, it may be heated and melted and kneaded, or after mixing with an appropriate solvent (for example, dichloromethane, ethyl acetate, toluene, etc.) to prepare a solution, The resin may be molded by a method such as applying the solution and removing the solvent. In the case of a photocurable resin, after applying a resin containing a polysiloxane copolymer or a solution thereof, the coated surface may be cured by ultraviolet irradiation.
ポリシロキサン共重合体の樹脂に対する添加量に関しては、特に制限はないが、好ましくは樹脂1重量部に対して0.01〜1重量%、特に好ましくは0.05〜0.5重量%である。 The amount of polysiloxane copolymer added to the resin is not particularly limited, but is preferably 0.01 to 1% by weight, particularly preferably 0.05 to 0.5% by weight, based on 1 part by weight of the resin. .
次に、本発明を実施例に基づいて具体的に説明するが、本発明はなんらこれらに限定されるものではない。実施例中、1H−NMRは日本電子データム株式会社製AL−400を使用し、400MHzでテトラメチルシランを基準としてケミカルシフトを算出した。また、表面抵抗率は、三菱化学株式会社製ハイレスターUP(MCP−HT450)を用いて、23±3℃、湿度45±5%の条件下で測定した。Next, the present invention will be specifically described based on examples, but the present invention is not limited thereto. In Examples, 1 H-NMR used AL-400 manufactured by JEOL Datum Co., Ltd., and chemical shifts were calculated based on tetramethylsilane at 400 MHz. Further, the surface resistivity was measured under the conditions of 23 ± 3 ° C. and humidity 45 ± 5% using Hirester UP (MCP-HT450) manufactured by Mitsubishi Chemical Corporation.
製造例1
撹拌装置を備えた500mLのガラス反応器に、窒素雰囲気下、ジメトキシジメチルシラン51.64g(0.4モル)、イソプロピルアルコール40.34g及び特開2010−248165号公報に記載の方法により製造した1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミド30.77g(0.05モル)を仕込んだ。得られた混合物に対して、0.1規定塩酸8.47gを室温で滴下した後、さらに室温で16時間撹拌して得た反応混合物をロータリーエバポレーターで80℃下4時間濃縮した。得られた濃縮残渣をn−ヘキサン80gで2回分液洗浄し、さらにロータリーエバポレーターを用いて80℃で5時間濃縮することにより、淡黄色液体のポリシロキサン共重合体A33.14gを得た。その1H−NMR分析結果を以下に示す。Production Example 1
1 prepared in a 500 mL glass reactor equipped with a stirrer in a nitrogen atmosphere by the method described in 51.64 g (0.4 mol) of dimethoxydimethylsilane, 40.34 g of isopropyl alcohol and JP 2010-248165 A 30.77 g (0.05 mol) of-(3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium bis (trifluoromethanesulfonyl) imide was charged. To the obtained mixture, 8.47 g of 0.1N hydrochloric acid was added dropwise at room temperature, and the reaction mixture obtained by further stirring at room temperature for 16 hours was concentrated at 80 ° C. for 4 hours with a rotary evaporator. The obtained concentrated residue was separated and washed twice with 80 g of n-hexane, and further concentrated at 80 ° C. for 5 hours using a rotary evaporator to obtain 33.14 g of a light yellow liquid polysiloxane copolymer A. The 1 H-NMR analysis results are shown below.
1H−NMR(CDCl3)δ(ppm)4.40−4.00(m,0.5H),3.70−3.40(m,2H),2.40−2.00(m,8H),1.80−1.60(m,2H),1.60−1.40(m,12H),1.30−1.10(m,3H),1.10−0.90(m,9H),0.90−0.70(m,2H),0.30−0.00(m,20H) 1 H-NMR (CDCl 3 ) δ (ppm) 4.40-4.00 (m, 0.5H), 3.70-3.40 (m, 2H), 2.40-2.00 (m, 8H), 1.80-1.60 (m, 2H), 1.60-1.40 (m, 12H), 1.30-1.10 (m, 3H), 1.10-0.90 ( m, 9H), 0.90-0.70 (m, 2H), 0.30-0.00 (m, 20H)
製造例2
0.1規定塩酸を10.83g用いた以外は、製造例1と同様にして白色懸濁液体のポリシロキサン共重合体B38.56gを得た。Production Example 2
38.56 g of a white suspension polysiloxane copolymer B was obtained in the same manner as in Production Example 1, except that 10.83 g of 0.1 N hydrochloric acid was used.
実施例1
50mLのサンプル瓶にポリカーボネート樹脂(住友ダウ株式会社製、カリバー(登録商標)200−13 NAT)3.2gとジクロロメタン20mLを入れ、ポリカーボネート樹脂を溶解させてポリカーボネート樹脂のジクロロメタン溶液を調製した。その溶液に帯電防止剤として製造例1で得たポリシロキサン共重合体A1.6mgを添加し、完溶させた後に金型(縦12cm×横20cm×深さ2cm)へ流し込み、室温で1時間、40℃で1時間乾燥させ、ポリカーボネート樹脂組成物の試験片(膜厚0.1±0.02mm)を作成した。得られた試験片の表面抵抗率の測定結果を表1に示す。Example 1
A 50 mL sample bottle was charged with 3.2 g of polycarbonate resin (manufactured by Sumitomo Dow Co., Ltd., Caliber (registered trademark) 200-13 NAT) and 20 mL of dichloromethane, and the polycarbonate resin was dissolved to prepare a dichloromethane solution of the polycarbonate resin. To the solution, 1.6 mg of the polysiloxane copolymer A obtained in Production Example 1 was added as an antistatic agent, and after complete dissolution, the solution was poured into a mold (length 12 cm × width 20 cm × depth 2 cm), and at room temperature for 1 hour And dried at 40 ° C. for 1 hour to prepare a polycarbonate resin composition test piece (film thickness 0.1 ± 0.02 mm). Table 1 shows the measurement results of the surface resistivity of the obtained test pieces.
実施例2
ポリシロキサン共重合体Aを3.2mg用いた以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Example 2
A test piece of the polycarbonate resin composition was prepared in the same manner as in Example 1 except that 3.2 mg of the polysiloxane copolymer A was used, and the surface resistivity was measured. The results are shown in Table 1.
実施例3
ポリシロキサン共重合体Aを16mg用いた以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Example 3
A test piece of a polycarbonate resin composition was prepared in the same manner as in Example 1 except that 16 mg of the polysiloxane copolymer A was used, and the surface resistivity was measured. The results are shown in Table 1.
実施例4
ポリシロキサン共重合体Aを32mg用いた以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Example 4
A test piece of a polycarbonate resin composition was prepared in the same manner as in Example 1 except that 32 mg of polysiloxane copolymer A was used, and the surface resistivity was measured. The results are shown in Table 1.
実施例5
製造例2で得たポリシロキサン共重合体Bを32mg用いた以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Example 5
A test piece of a polycarbonate resin composition was prepared in the same manner as in Example 1 except that 32 mg of the polysiloxane copolymer B obtained in Production Example 2 was used, and the surface resistivity was measured. The results are shown in Table 1.
比較例1
ポリシロキサン共重合体A又はBを添加しない以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Comparative Example 1
Except not adding polysiloxane copolymer A or B, the test piece of the polycarbonate resin composition was created like Example 1, and the surface resistivity was measured. The results are shown in Table 1.
比較例2
ポリシロキサン共重合体A又はBの代わりに、1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミドを用いた以外は、実施例1と同様にしてポリカーボネート樹脂組成物の試験片を作成し、その表面抵抗率を測定した。その結果を表1に示す。Comparative Example 2
The same as Example 1 except that 1- (3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium = bis (trifluoromethanesulfonyl) imide was used in place of the polysiloxane copolymer A or B. Then, a test piece of the polycarbonate resin composition was prepared, and the surface resistivity was measured. The results are shown in Table 1.
実施例6
ジペンタエリスリトールヘキサアクリレート(A−DPH:新中村化学工業株式会社製)0.50g、ペンタエリスリトールトリアクリレート(A−TMN−3LM−N:新中村化学工業株式会社製)1.50g、トリメチロールプロパントリアクリレート(A−TMPT:新中村化学工業株式会社製)0.50g、帯電防止剤として製造例1で得たポリシロキサン共重合体A0.54g、イソプロピルアルコール1.75g、コロイダルシリカのIPA分散液(IPA−ST:シリカ固形分30wt%、日産化学工業株式会社製)3.60g及び光重合開始剤として2−ヒドロキシー2−メチルプロピオフェノン0.15gを混合した。得られた混合物を厚さ100μmのポリエチレンテレフタラートフィルムの片面にバーコーターを用いて乾燥膜厚が約5μmとなるよう塗布した後、塗膜側に高圧水銀UVランプ(120W/cm)の紫外線を積算光量約400mJ/cm2の条件で照射して、塗膜を硬化させることによって、アクリル樹脂でハードコートされた試験片を作成した。得られた試験片のハードコート面の表面抵抗率の測定結果を表2に示す。Example 6
Dipentaerythritol hexaacrylate (A-DPH: Shin-Nakamura Chemical Co., Ltd.) 0.50 g, Pentaerythritol triacrylate (A-TMN-3LM-N: Shin-Nakamura Chemical Co., Ltd.) 1.50 g, trimethylolpropane 0.50 g of triacrylate (A-TMPT: manufactured by Shin-Nakamura Chemical Co., Ltd.), 0.54 g of polysiloxane copolymer A obtained in Production Example 1 as an antistatic agent, 1.75 g of isopropyl alcohol, IPA dispersion of colloidal silica (IPA-ST: Silica solid content 30 wt%, manufactured by Nissan Chemical Industries, Ltd.) 3.60 g and 2-hydroxy-2-methylpropiophenone 0.15 g as a photopolymerization initiator were mixed. The obtained mixture was applied to one side of a 100 μm thick polyethylene terephthalate film using a bar coater so that the dry film thickness was about 5 μm, and then the ultraviolet ray of a high pressure mercury UV lamp (120 W / cm) was applied to the coating side. A test piece hard-coated with an acrylic resin was prepared by irradiating under a condition of an integrated light quantity of about 400 mJ / cm 2 and curing the coating film. Table 2 shows the measurement results of the surface resistivity of the hard coat surface of the obtained test piece.
実施例7
製造例2で得たポリシロキサン共重合体Bを0.54g用いた以外は、実施例6と同様にしてアクリル樹脂でハードコートされた試験片を作成した。得られた試験片のハードコート面の表面抵抗率の測定結果を表2に示す。Example 7
A test piece hard-coated with an acrylic resin was prepared in the same manner as in Example 6 except that 0.54 g of the polysiloxane copolymer B obtained in Production Example 2 was used. Table 2 shows the measurement results of the surface resistivity of the hard coat surface of the obtained test piece.
比較例3
ポリシロキサン共重合体A又はBを添加しない以外は、実施例6と同様にしてアクリル樹脂でハードコートされた試験片を作成した。得られた試験片のハードコート面の表面抵抗率の測定結果を表2に示す。Comparative Example 3
A test piece hard-coated with an acrylic resin was prepared in the same manner as in Example 6 except that the polysiloxane copolymer A or B was not added. Table 2 shows the measurement results of the surface resistivity of the hard coat surface of the obtained test piece.
比較例4
ポリシロキサン共重合体A又はBの代わりに、1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミド0.54gを用いた以外は、実施例6と同様にしてアクリル樹脂でハードコートされた試験片を作成した。得られた試験片のハードコート面の表面抵抗率の測定結果を表2に示す。Comparative Example 4
Example except that 0.54 g of 1- (3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium = bis (trifluoromethanesulfonyl) imide was used in place of the polysiloxane copolymer A or B In the same manner as in Example 6, a test piece hard-coated with an acrylic resin was prepared. Table 2 shows the measurement results of the surface resistivity of the hard coat surface of the obtained test piece.
実施例8
メタクリル酸メチル5.00g、アゾビスイソブチロニトリル0.20g及び帯電防止剤として製造例1で得たポリシロキサン共重合体A5mgを混合し、得られた混合物をプラスティック容器(内径5cm×深さ1.5cmの円筒形)に流し込み、50℃で10時間硬化させて厚さ約2mmのポリメチルメタクリレート樹脂の試験片を作成した。得られた試験片の表面抵抗率の測定結果を表3に示す。Example 8
5.00 g of methyl methacrylate, 0.20 g of azobisisobutyronitrile and 5 mg of the polysiloxane copolymer A obtained in Production Example 1 as an antistatic agent were mixed, and the resulting mixture was made into a plastic container (inner diameter 5 cm × depth). Into a 1.5 cm cylinder) and cured at 50 ° C. for 10 hours to prepare a test piece of polymethyl methacrylate resin having a thickness of about 2 mm. Table 3 shows the measurement results of the surface resistivity of the obtained test pieces.
比較例5
ポリシロキサン共重合体A又はBを添加しない以外は、実施例8と同様にしてポリメチルメタクリレート樹脂の試験片を作成し、その表面抵抗率を測定した。その結果を表3に示す。Comparative Example 5
Except not adding polysiloxane copolymer A or B, the test piece of the polymethylmethacrylate resin was created like Example 8, and the surface resistivity was measured. The results are shown in Table 3.
比較例6
ポリシロキサン共重合体A又はBの代わりに、1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミド5mgを用いた以外は、実施例8と同様にしてポリメチルメタクリレート樹脂の試験片を作成し、その表面抵抗率を測定した。その結果を表3に示す。Comparative Example 6
Example 8 is used except that 5 mg of 1- (3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium = bis (trifluoromethanesulfonyl) imide is used in place of the polysiloxane copolymer A or B. Similarly, a test piece of polymethyl methacrylate resin was prepared, and the surface resistivity was measured. The results are shown in Table 3.
実施例9
過酸化物硬化型シリコーン粘着剤KR−101−10(固形分60%、信越化学工業株式会社製)4.0g、硬化剤BPO(過酸化ベンゾイル)0.08g、酢酸エチル6.2g及び帯電防止剤として実施例1で得たポリシロキサン共重合体A48mgを混合してシリコーン樹脂粘着剤を得た。前記シリコーン樹脂粘着剤をポリエチレンテレフタラートフィルム(離型紙)の片面にバーコーターを用いて乾燥膜厚が約8μmとなるよう塗布し、90℃で3分間、160℃で2分間加熱乾燥させてシリコーン樹脂粘着剤層を作成し、その表面抵抗率を測定した。その結果を表4に示す。
前記粘着剤層を有する面にトリアセチルセルロースフィルム(TACフィルム)を貼り合わせ、25℃、50%RHで1時間エージングして試験用フィルムを作成した。試験用フィルムから離型紙を剥離した際の離型紙への粘着剤の付着状態を目視で評価した。その結果を表4に示す。
A:離型紙への粘着剤の付着が認められない。
B:離型紙への部分的な粘着剤の付着が認められる。
C:離型紙への大部分の粘着剤の付着が認められる。Example 9
Peroxide curing type silicone adhesive KR-101-10 (solid content 60%, manufactured by Shin-Etsu Chemical Co., Ltd.) 4.0 g, curing agent BPO (benzoyl peroxide) 0.08 g, ethyl acetate 6.2 g and antistatic 48 mg of the polysiloxane copolymer A obtained in Example 1 was mixed as an agent to obtain a silicone resin adhesive. The silicone resin adhesive is applied to one side of a polyethylene terephthalate film (release paper) using a bar coater so that the dry film thickness is about 8 μm, and dried by heating at 90 ° C. for 3 minutes and 160 ° C. for 2 minutes. A resin adhesive layer was prepared and the surface resistivity was measured. The results are shown in Table 4.
A triacetyl cellulose film (TAC film) was bonded to the surface having the pressure-sensitive adhesive layer and aged for 1 hour at 25 ° C. and 50% RH to prepare a test film. The adhesive state of the adhesive to the release paper when the release paper was peeled from the test film was visually evaluated. The results are shown in Table 4.
A: Adhesion of the adhesive to the release paper is not recognized.
B: Partial adhesion of the adhesive to the release paper is observed.
C: Adhesion of most of the adhesive to the release paper is observed.
比較例7
ポリシロキサン共重合体A又はBを添加しない以外は実施例9と同様にしてシリコーン樹脂粘着剤層及び試験用フィルムを作成し、その表面抵抗率を測定するとともに、離型紙への粘着剤の付着状態を目視で評価した。その結果を表4に示す。Comparative Example 7
A silicone resin pressure-sensitive adhesive layer and a test film are prepared in the same manner as in Example 9 except that the polysiloxane copolymer A or B is not added, and the surface resistivity is measured and the pressure-sensitive adhesive is attached to the release paper. The state was evaluated visually. The results are shown in Table 4.
比較例8
ポリシロキサン共重合体A又はBの代わりに、1−(3−トリメトキシシリルプロピル)−1,1,1−トリブチルホスホニウム=ビス(トリフルオロメタンスルホニル)イミドを用いた以外は実施例9と同様にしてシリコーン樹脂粘着剤層及び試験用フィルムを作成し、その表面抵抗率を測定するとともに、離型紙への粘着剤の付着状態を目視で評価した。その結果を表4に示す。Comparative Example 8
Instead of polysiloxane copolymer A or B, 1- (3-trimethoxysilylpropyl) -1,1,1-tributylphosphonium = bis (trifluoromethanesulfonyl) imide was used in the same manner as in Example 9. Then, a silicone resin pressure-sensitive adhesive layer and a test film were prepared, the surface resistivity was measured, and the adhesion state of the pressure-sensitive adhesive to the release paper was visually evaluated. The results are shown in Table 4.
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