JP6168801B2 - Piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic device, and radio clock - Google Patents

Description

  The present invention relates to a piezoelectric vibrating piece, a piezoelectric vibrator, an oscillator, an electronic device, and a radio timepiece.

  2. Description of the Related Art In recent years, a piezoelectric vibrator using a crystal or the like is used as a time source, a timing source such as a control signal, a reference signal source, and the like in mobile phones and portable information terminal devices. Various types of piezoelectric vibrators of this type are known. For example, as one of them, from the base that connects the ends of a pair of vibrating arms to the outside of the vibrating arms, the same direction as the vibrating arms Some have a piezoelectric vibrating piece provided with a pair of support arm portions extending in the direction (for example, see Patent Document 1).

JP 2008-72705 A

However, the conventional piezoelectric vibrator has the following problems.
The piezoelectric vibrating piece as described above is mounted by adhering the vicinity of the end portion of the support arm portion onto the base substrate with a conductive adhesive. As an adhesion procedure, an uncured conductive adhesive is applied on the base substrate, and then the vicinity of the end of the support arm portion of the piezoelectric vibrating piece is brought into contact with the conductive adhesive. Then, the piezoelectric vibrating piece and the base substrate are bonded by curing the uncured conductive adhesive.

  At this time, the operation of installing the piezoelectric vibrating piece is performed visually, and the piezoelectric vibrating piece and the base substrate are bonded via a conductive adhesive. Since the uncured conductive adhesive is soft, the piezoelectric substrate is visually observed in a desired posture with respect to the base substrate (for example, a posture in which the piezoelectric resonator element is parallel to the base substrate). It is difficult to adhere to. Therefore, when the mounted piezoelectric vibrating piece has a posture different from the desired posture, the piezoelectric vibrating piece collides with the inner surface of the package (for example, the base substrate) when receiving an external impact after mounting, and as a result The piezoelectric vibrating piece may be damaged.

  The present invention has been made to solve the above problems, and an object thereof is to provide a piezoelectric vibrating piece that can be easily mounted on a package in a desired posture. In addition, the present invention provides a piezoelectric vibrator, an oscillator, an electronic device, and a radio timepiece that are excellent in reliability by including the piezoelectric vibrating piece so that the mounted piezoelectric vibrating piece is not easily damaged even when subjected to an external impact. The purpose is to do.

  The piezoelectric vibrating piece of the present invention includes a pair of vibrating arm portions arranged side by side in one direction, a base portion to which the pair of vibrating arm portions are connected, a mount portion provided at a predetermined position on one surface, A convex portion having an abutment surface provided on one surface, and the mount portion is provided on the one surface at a position between the convex portion and the vibrating arm portion.

  According to this configuration, the piezoelectric vibrating piece includes the convex portion having the contact surface. For this reason, when mounting on the piezoelectric vibrator, the mounting surface of the package and the contact surface of the convex portion are in contact with each other, so that the piezoelectric vibrating piece is angled on one surface of the piezoelectric vibrating piece with respect to the mounting surface. However, it can be mounted on the package in a state where it is held in a posture that is the same as the angle formed by the contact surface of the convex portion and one surface of the piezoelectric vibrating piece. Therefore, by setting the angle of the contact surface of the convex portion with respect to one surface of the piezoelectric vibrating piece to a desired value, the piezoelectric vibrating piece can be easily installed on the mounting surface in a desired posture.

  In addition, since the mount part is provided between the convex part and the vibrating arm part, the convex part is located farther from the vibrating arm part than the mounting surface of the package of the piezoelectric vibrator and the mounted part. Is provided. Therefore, the vibration transmitted from the vibrating arm portion is sufficiently attenuated in the convex portion, and leakage of the vibration of the piezoelectric vibrating piece to the package can be suppressed by the contact between the convex portion and the mounting surface.

The contact surface may be parallel to the one surface of the piezoelectric vibrating piece.
According to this configuration, the piezoelectric vibrating piece can be easily mounted in a state where one surface of the piezoelectric vibrating piece and the mounting surface of the package are parallel by bringing the contact surface of the convex portion into contact with the mounting surface of the package. be able to.

The contact surface may have a predetermined angle with respect to the one surface of the piezoelectric vibrating piece.
According to this configuration, the piezoelectric vibrating piece can be easily formed in a state where one surface of the piezoelectric vibrating piece and the mounting surface of the package have a predetermined angle by bringing the contact surface of the convex portion into contact with the mounting surface of the package. Can be implemented.

  For example, in the case where the mount portion is provided at a position deviated from the center of gravity of the piezoelectric vibrating piece, the piezoelectric vibrating piece may be inclined by its own weight after the piezoelectric vibrating piece is mounted, and the posture may change. is there. Therefore, the piezoelectric vibrating piece may collide with the inner surface of the package due to an external impact or the like, and may be damaged.

  On the other hand, it seems that the piezoelectric vibrating piece is inclined in advance in a direction opposite to the direction in which the piezoelectric vibrating piece is expected to be inclined (the direction in which the center of gravity is located with respect to the mount portion approaches the mounting surface). By installing the piezoelectric vibrating piece on the mounting surface of the package in a proper posture, the posture of the piezoelectric vibrating piece can be suppressed within an appropriate range even when the posture of the piezoelectric vibrating piece changes due to its own weight. Thereby, even when the posture of the piezoelectric vibrating piece is changed, it is possible to suppress the piezoelectric vibrating piece from colliding with the inner surface of the package due to an external impact or the like and being damaged.

  In such a case, when the posture of the piezoelectric vibrating piece changes, the contact surface of the convex portion and the mounting surface of the package are separated from each other. Thereby, it can suppress that the vibration of a piezoelectric vibrating piece leaks from a convex part to a package.

The convex portion may be provided in the center of the one direction in the base portion.
According to this configuration, since the convex portion is provided at the center of the base of the piezoelectric vibrating piece, the posture of the piezoelectric vibrating piece is stabilized when it is installed on the mounting surface of the package even if there is only one convex portion. Cheap.

The convex portion may be provided at a tip of the support arm portion connected to the base portion on the side opposite to the side connected to the base portion.
According to this configuration, since the convex portion is provided at the tip of the support arm portion, the distance from the convex portion to the vibrating arm portion on one surface of the piezoelectric vibrating piece is increased, and is transmitted from the vibrating arm portion to the convex portion. The vibration is sufficiently damped. Therefore, the vibration of the piezoelectric vibrating piece that leaks into the package from the contact surface of the convex portion can be reduced.

According to another aspect of the present invention, there is provided a package including a base member, a lid member that is overlapped and bonded to the base member and that forms a hermetically sealed cavity with the base member, and the base A piezoelectric vibrating piece of the present invention mounted on a mounting surface of the member and housed in the cavity.
According to this configuration, since the piezoelectric vibrating piece according to the present invention is provided, the piezoelectric vibrating piece can be prevented from colliding with the inner surface of the package due to an external impact or the like and being damaged, and a highly reliable piezoelectric vibrator can be obtained. .

  According to another aspect of the present invention, there is provided a package including a base member, a lid member that is overlapped and bonded to the base member and that forms a hermetically sealed cavity with the base member, and the base A piezoelectric vibrating piece mounted on a mounting surface of the member and accommodated in the cavity, wherein the piezoelectric vibrating piece includes a pair of vibrating arm portions arranged in one direction, and the pair of vibrating arms. A base part to which the parts are connected, and a mount part provided at a predetermined position on one surface, wherein the base member is a second contact surface that contacts the one surface of the piezoelectric vibrating piece on the mounting surface The contact position on the one surface of the piezoelectric vibrating piece is in contact with the second contact surface of the second protrusion, and the contact position on the one surface is the contact position on the one surface. While following the vibrating arm The mounting portion is a position such as that provided in the position.

  According to this configuration, the base member includes the second convex portion having the second contact surface that contacts the one surface of the piezoelectric vibrating piece. Therefore, since one surface of the piezoelectric vibrating piece is in contact with the second contact surface of the second convex portion, the posture of the piezoelectric vibrating piece is such that the angle of one surface of the piezoelectric vibrating piece with respect to the mounting surface of the base member is The posture is the same as the angle formed by the second contact surface of the second convex portion and the mounting surface of the base member. Therefore, by setting the angle of the second abutment surface of the second convex portion with respect to the mounting surface of the base member to a desired value, the piezoelectric vibration piece having a desired posture is mounted and having excellent reliability. A child is obtained.

  In addition, a mounting portion is provided at a position where the contact position on the one surface of the piezoelectric vibrating piece with which the second contact surface of the second convex portion contacts is between the contact position and the vibrating arm portion. It is such a position. Therefore, the contact position on one surface of the piezoelectric vibrating piece is a position farther from the vibrating arm portion than the mount portion on one surface of the piezoelectric vibrating piece. Therefore, at the contact position on one surface of the piezoelectric vibrating piece, the vibration transmitted from the vibrating arm portion is sufficiently attenuated, and the one surface of the piezoelectric vibrating piece and the second contact surface of the second convex portion are in contact with each other. The vibration leakage of the piezoelectric vibrating piece to the package due to the contact can be suppressed.

The second contact surface may be parallel to the mounting surface of the base member.
According to this configuration, since one surface of the piezoelectric vibrating piece is in contact with the second contact surface of the second convex portion, the piezoelectric vibrating piece is piezoelectric in a state where the one surface of the piezoelectric vibrating piece is parallel to the package mounting surface. A piezoelectric vibrator having a vibrating piece mounted thereon is obtained.

The second contact surface may have a predetermined angle with respect to the mounting surface of the base member.
According to this configuration, since one surface of the piezoelectric vibrating piece and the second contact surface of the second convex portion are in contact, one surface of the piezoelectric vibrating piece and the mounting surface of the package have a predetermined angle. In this state, a piezoelectric vibrator on which the piezoelectric vibrating piece is mounted is obtained.

The position on the one surface of the piezoelectric vibrating piece with which the second contact surface abuts may be the center in the one direction at the base.
According to this configuration, a piezoelectric vibrator in which the piezoelectric vibrating piece is stably mounted can be obtained.

The second contact surface of the second convex portion is in contact with a tip end portion of the support arm portion connected to the base portion of the piezoelectric vibrating piece, on the opposite side to the side connected to the base portion. Also good.
According to this configuration, it is possible to suppress leakage of the vibration of the piezoelectric vibrating piece from the second contact surface to the package.

An oscillator according to the present invention includes the piezoelectric vibrator according to the present invention, and the piezoelectric vibrator is electrically connected to an integrated circuit as an oscillator.
According to this configuration, an oscillator having excellent reliability can be obtained.

An electronic apparatus according to the present invention includes the piezoelectric vibrator according to the present invention, and the piezoelectric vibrator is electrically connected to a timer unit.
According to this configuration, an electronic apparatus having excellent reliability can be obtained.

The radio timepiece of the present invention includes the piezoelectric vibrator of the present invention, and the piezoelectric vibrator is electrically connected to a filter portion.
According to this configuration, a radio timepiece having excellent reliability can be obtained.

  According to the present invention, the piezoelectric vibrating piece can be easily mounted on the package of the piezoelectric vibrator while being held in a desired posture. Therefore, even when the piezoelectric vibrator on which the piezoelectric vibrating piece is mounted receives an external impact or the like, the mounted piezoelectric vibrating piece can be prevented from coming into contact with the inside of the package and being damaged.

1 is an external perspective view showing a piezoelectric vibrating piece according to a first embodiment. It is a figure which shows the piezoelectric vibrating piece of 1st Embodiment, (a) is a top view, (b) is a front view. It is the flowchart which showed the process of forming the convex part of the piezoelectric vibrating piece of 1st Embodiment. It is sectional drawing and the top view which showed the procedure which forms the convex part of the piezoelectric vibrating piece of 1st Embodiment. It is sectional drawing which showed the adhesion | attachment procedure of the piezoelectric vibrating piece of 1st Embodiment. It is a figure which shows the piezoelectric vibrating piece of the modification in 1st Embodiment, (a) is an external appearance perspective view, (b) is a front view. It is sectional drawing which shows the mounting state of the piezoelectric vibrating piece of the modification in 1st Embodiment, (a) is a figure which shows the state immediately after mounting, (b) is the case where a piezoelectric vibrating piece inclines after progress for a predetermined time. FIG. It is an external appearance perspective view which shows the piezoelectric vibrating piece of 2nd Embodiment. It is a figure which shows the piezoelectric vibrating piece of 2nd Embodiment, (a) is a top view, (b) is a front view. It is an external appearance perspective view which shows the piezoelectric vibrating piece of 3rd Embodiment. It is a figure which shows the piezoelectric vibrating piece of 3rd Embodiment, (a) is a top view, (b) is a front view. 1 is an external perspective view showing a first embodiment of a piezoelectric vibrator. It is a top view which shows the internal structure of 1st Embodiment of a piezoelectric vibrator. It is a figure which shows 1st Embodiment of a piezoelectric vibrator, Comprising: It is AA sectional drawing in FIG. It is a figure which shows 1st Embodiment of a piezoelectric vibrator, Comprising: It is the disassembled perspective view which decomposed | disassembled each part. It is a top view which shows the internal structure of 2nd Embodiment of a piezoelectric vibrator. It is a figure which shows 2nd Embodiment of a piezoelectric vibrator, Comprising: It is BB sectional drawing in FIG. It is a figure which shows 2nd Embodiment of a piezoelectric vibrator, Comprising: It is the disassembled perspective view which decomposed | disassembled each part. It is a top view which shows the internal structure in the modification of 2nd Embodiment of a piezoelectric vibrator. It is a figure which shows the modification of 2nd Embodiment of a piezoelectric vibrator, Comprising: It is CC sectional drawing in FIG. (A) is a figure which shows the state immediately after mounting a piezoelectric vibrating piece, (b) is a figure which shows the case where a piezoelectric vibrating piece inclines after predetermined time progress. It is a figure which shows the modification of 2nd Embodiment of a piezoelectric vibrator, Comprising: It is the disassembled external appearance perspective view which decomposed | disassembled each part. It is a block diagram which shows one Embodiment of an oscillator. It is a lineblock diagram showing one embodiment of electronic equipment. It is a block diagram which shows one Embodiment of a radio timepiece.

Hereinafter, a piezoelectric vibrating piece and a piezoelectric vibrator according to an embodiment of the present invention will be described with reference to the drawings.
The scope of the present invention is not limited to the following embodiment, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure may be different from the scale, number, or the like in each structure.
In the description from FIG. 1 to FIG. 11, an XYZ coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ coordinate system. At this time, the direction perpendicular to the surface of the piezoelectric vibrating piece is the Z-axis direction, the longitudinal direction of the vibrating arm is the Y-axis direction, and the direction orthogonal to both the Y-axis direction and the Z-axis direction is the X-axis direction. Further, the direction from the base toward the tip of the vibrating arm is defined as + Y direction, and the direction in which the convex portion extends is defined as + Z direction.

[First Embodiment]
(Piezoelectric vibrating piece)
First, the piezoelectric vibrating piece 1 of this embodiment will be described.
1 and 2 are views showing the piezoelectric vibrating piece of the present embodiment. 1 is an external perspective view, FIG. 2A is a plan view, and FIG. 2B is a front view.
In FIGS. 1 and 2, an opposing surface (one surface) 18 a that faces the mounting surface of the package when mounted on a piezoelectric vibrator, which will be described later, is shown on the upper side (+ Z direction side).

As shown in FIGS. 1 and 2, the piezoelectric vibrating reed 1 according to this embodiment has a flat plate shape. The piezoelectric vibrating piece 1 includes a base 10, vibrating arm portions 11 and 12, hammer portions 13 and 14, support arm portions 15 and 16, and a convex portion 17.
The piezoelectric vibrating piece 1 is a side arm type vibrating piece formed of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, and vibrates when a predetermined voltage is applied.
The thickness (Z-axis direction length) in the direction perpendicular to the surface of the piezoelectric vibrating piece 1 can be set to 30 μm, for example.

  The pair of vibrating arm portions 11 and 12 extend from the base portion 10 in the same direction (+ Y direction). The vibrating arm portions 11 and 12 are provided side by side in the direction (one direction) perpendicular to the longitudinal direction (Y-axis direction) and parallel to the surface of the piezoelectric vibrating piece 1, that is, in the X-axis direction. Excitation electrodes (not shown) that vibrate the pair of vibrating arm portions 11 and 12 are formed on the outer surfaces of the pair of vibrating arm portions 11 and 12.

  The hammer portions 13 and 14 are formed so as to extend from the tips of the vibrating arm portions 11 and 12 along the longitudinal direction (Y-axis direction) of the vibrating arm portions 11 and 12, respectively. The width (X-axis direction length) of the hammer portions 13 and 14 is formed larger than the width (X-axis direction length) of the vibrating arm portions 11 and 12. The hammer portions 13 and 14 are set as free ends that vibrate in the width direction (X-axis direction) with the base portion 10 as a fixed end.

  The pair of support arm portions 15 and 16 extend from the base portion 10 on both sides in the width direction (X-axis direction) of the vibrating arm portions 11 and 12 and then in the longitudinal direction (Y-axis direction) of the vibrating arm portions 11 and 12. Along the end of the vibrating arm portions 11 and 12, the arm portions are bent and extended toward the tip end side (+ Y direction side).

Convex portions 17 are respectively provided on the facing surface 18a of the piezoelectric vibrating reed 1 at the distal ends of the support arm portions 15 and 16 on the extending direction side (+ Y direction side).
The convex part 17 is provided with the contact surface 17a which contact | abuts the mounting surface of the package mentioned later. The contact surface 17a is parallel to the facing surface 18a.
The thickness h1 in the direction (Z-axis direction) perpendicular to the facing surface 18a of the convex portion 17 shown in FIG. 2B is a package to be mounted (mainly a second to be described later) when the piezoelectric vibrating piece 1 vibrates. There is no particular limitation as long as it does not come into contact with the base substrate. For example, it can be 30 μm or more.

  The support arm portions 15 and 16 include mount portions 15a and 16a, respectively. The mount portions 15a and 16a are near the tips of the support arm portions 15 and 16 in the extending direction side (+ Y direction side) on the opposing surface 18a of the piezoelectric vibrating reed 1 and on the base 10 side (− (Y direction side). The positions where the mount portions 15a and 16a are provided are positions that become nodes of vibration when the support arm portions 15 and 16 vibrate.

  Mount electrodes (not shown) are formed on the mount portions 15a and 16a of the support arm portions 15 and 16, and are connected to excitation electrodes formed on the outer surfaces of the vibrating arm portions 11 and 12 by extraction electrodes (not shown). ing. When a predetermined voltage is applied to each of these electrodes, the pair of vibrating arm portions 11 and 12 approach or separate from each other due to the interaction between the excitation electrodes of both of the pair of vibrating arm portions 11 and 12. Vibrates at a predetermined resonance frequency (in the X-axis direction).

(Method for forming convex portions of piezoelectric vibrating piece)
Next, a method for forming the convex portion 17 of the piezoelectric vibrating piece 1 described above will be described.
3 and 4 are diagrams showing a method of forming the convex portion 17. FIG. 3 is a flowchart showing a process of forming the convex portion 17, and FIG. 4 is a cross-sectional view and a plan view schematically showing the procedure of each process.

  First, as shown in FIG. 3, after slicing a rough Lambert quartz crystal at a predetermined angle and lapping a rough wafer, roughing the wafer, and then removing the work-affected layer by etching. A mirror polishing process is performed to prepare a wafer S (see FIG. 4A) having a predetermined thickness (step S01).

Next, as shown in FIG. 4A, an etching protective film 40 and a photoresist film 41 are formed on both main surfaces of the wafer S, respectively (step S02).
The etching protective film 40 is, for example, a laminated structure in which a first etching protective film 40a in which chromium (Cr) is deposited to several tens of nm and a second etching protective film 40b in which gold (Au) is deposited to several tens of nm are sequentially laminated. It is a membrane.

In step S02, first, a first etching protective film 40a and a second etching protective film 40b are sequentially formed on both main surfaces of the wafer S by a sputtering method, a vapor deposition method, or the like.
Next, a resist material is applied on the etching protection film 40 by a spin coating method or the like to form a photoresist film 41.
As a resist material used in the present embodiment, a rubber negative resist mainly composed of cyclized rubber (for example, cyclized isoprene) is preferably used. The rubber negative resist is refined by dissolving cyclized rubber in an organic solvent, adding a bisazide photosensitizer, filtering, and removing impurities.

Next, both main surfaces of the wafer S on which the etching protective film 40 and the photoresist film 41 are formed are exposed and developed in a lump using a photomask on which a convex pattern is formed.
Thereby, as shown in FIG. 4B, a convex pattern 41A is formed on one side (the upper side in the figure) of the photoresist film 41 (step S03).
The convex part pattern 41 </ b> A has a shape along the outer shape of the convex part 17. The convex pattern 41 </ b> A is formed at the same interval as the interval between the support arm portions 15 and 16.

Next, etching is performed using the photoresist film 41 on which the convex pattern 41A is formed as a mask, and only the second etching protective film 40b of the unmasked etching protective film 40 is selectively removed (step S04).
Next, after the etching process, the photoresist film 41 is peeled off (step S05).
As a result, as shown in FIG. 4C, a convex pattern 40bA is formed on one side of the second etching protective film 40b.

For the etching process, a wet etching method in which the wafer S on which the etching protective film 40 and the photoresist film 41 are formed is immersed in a chemical solution can be used.
Specifically, for example, the second etching protective film 40b formed with gold (Au) can be etched using iodine as a chemical solution.
Note that this patterning is performed collectively for the number of the piezoelectric vibrating reeds 1.

Next, etching is performed using the second etching protective film 40b on which the convex pattern 40bA is formed as a mask, and the first etching protective film 40a of the unmasked etching protective film 40 is selectively removed (step S06). .
Thereby, as shown in FIG. 4D, a convex pattern 40aA is formed on one side of the first etching protective film 40a.

Next, the unmasked wafer S is selectively half-etched using the convex pattern 40bA of the second etching protective film 40b and the convex pattern 40aA of the first etching protective film 40a as a mask (step S07).
Thereby, as shown in FIG. 4E, a convex portion 17 is formed on the wafer S.

Next, as shown in FIG. 4F, etching is performed to selectively remove only the convex pattern 40bA of the second etching protection film 40b (step S08).
Next, similarly, an etching process for selectively removing only the convex pattern 40aA of the first etching protective film 40a is performed (step S09).

Through the above steps, the wafer S on which the convex portions 17 are formed is obtained.
Thereafter, the piezoelectric vibrating reed 1 is manufactured in such a manner that the formed convex portion 17 is provided at the tip end portions of the support arm portions 15 and 16. As a method for manufacturing the piezoelectric vibrating piece 1, for example, a method as disclosed in Japanese Unexamined Patent Application Publication No. 2012-175673 can be used.

(Piezoelectric vibrating piece mounting method)
Next, a method for mounting the piezoelectric vibrating reed 1 of this embodiment on a package of a piezoelectric vibrator will be described.
FIG. 5 is a diagram showing a procedure for installing the piezoelectric vibrating piece 1 on the second base substrate 560 of the piezoelectric vibrator 4 to be described later. When the piezoelectric vibrating piece 1 is mounted, the longitudinal direction of the support arm portion 15 is shown. 6 is a cross-sectional view taken along a plane perpendicular to the mounting surface 560a of the second base substrate 560 along the direction. In FIG. 5, the components of the piezoelectric vibrator 4 are omitted as appropriate.

First, as shown in FIG. 5A, an uncured conductive adhesive 75 is applied on the electrode pads 610A (610B) provided on the mounting surface 560a of the second base substrate 560.
As the uncured conductive adhesive 75, for example, an adhesive having thermosetting properties can be used.

Next, as illustrated in FIG. 5B, the piezoelectric vibrating reed 1 is installed on the second base substrate 560 such that the facing surface 18 a faces the mounting surface 560 a of the second base substrate 560.
At this time, the contact surface 17a of the convex portion 17 is brought into contact with the mounting surface 560a of the second base substrate 560. Accordingly, since the contact surface 17a is parallel to the facing surface 18a of the piezoelectric vibrating piece 1, the facing surface 18a of the piezoelectric vibrating piece 1 is in a posture parallel to the mounting surface 560a of the second base substrate 560.
The mount portion 15a (16a) comes into contact with the uncured conductive adhesive 75. As a result, the mount 15a (16a) and the electrode pad 610A (610B) are bonded via the uncured conductive adhesive 75.

Next, as shown in FIG. 5C, the uncured conductive adhesive 75 is cured.
As a curing method, for example, when an uncured conductive adhesive 75 having thermosetting properties is used, a heating method can be selected. Thereby, the uncured conductive adhesive 75 is cured, and the mounting portion 15a (16a) of the piezoelectric vibrating piece 1 and the electrode pad 610A (610B) installed on the second base substrate 560 are conductively bonded. The piezoelectric vibrating reed 1 is fixed on the second base substrate 560 by being fixed via the agent 80.

  As described above, the piezoelectric vibrating reed 1 is mounted on the piezoelectric vibrator package such that the facing surface 18a is parallel to the package mounting surface.

According to the piezoelectric vibrating piece 1 of the present embodiment, since the piezoelectric vibrating piece 1 has the convex portion 17, the piezoelectric vibrating piece 1 is brought into contact with the mounting surface of the package by bringing the contact surface 17 a of the convex portion 17 into contact with the mounting surface of the package. It is easy to mount the piezoelectric vibrating reed 1 on the package of the piezoelectric vibrator while maintaining the posture 1 in a desired posture (in this embodiment, the facing surface 18a and the mounting surface of the package are parallel). It is.
Thereby, even when a shock is applied to the piezoelectric vibrator from the outside, it is possible to suppress damage of the mounted piezoelectric vibrating piece in contact with the inside of the package.

  Moreover, the convex part 17 is provided in the front end side (+ Y direction side) of the support arm parts 15 and 16 rather than the mount parts 15a and 16a. The mount portions 15a and 16a are provided at positions serving as vibration nodes, and are bonded to the second base substrate 560 by the conductive adhesive 80 when mounted on the package of the piezoelectric vibrator. Therefore, the vibration transmitted to the front end side (+ Y direction side) of the support arm portions 15 and 16 rather than the mount portions 15a and 16a is sufficiently damped. Therefore, the vibration transmitted from the vibrating arm portions 11 and 12 to the convex portion 17 is sufficiently attenuated, and the leakage of vibration from the convex portion 17 to the package of the piezoelectric vibrator can be suppressed.

The piezoelectric vibrating reed generally has a heavier base and a center of gravity closer to the base. Therefore, in the piezoelectric vibrating piece in which the mount portion is provided near the tip of the support arm portion, such as the side arm type of this embodiment or the center arm type described later, the heavy base side is lowered (package mounting). The posture of the piezoelectric vibrating piece may change.
On the other hand, in the piezoelectric vibrating piece 1 of the present embodiment, the convex portion 17 is provided at the tip of the mounting portions 15a and 16a of the support arm portions 15 and 16, so that the center of gravity is mounted from the base 10 side to the mounting portion 15a. , 16a approach. Thereby, it is suppressed that the attitude | position of the piezoelectric vibrating piece 1 changes.

  In the present embodiment, the following configuration can also be adopted.

  In the present embodiment, the piezoelectric vibrating piece having no vibrating groove formed on the vibrating arm portion is used. However, the piezoelectric vibrating piece may be formed with a groove.

[Modification of First Embodiment]
Next, with respect to the piezoelectric vibrating piece 1 of the present embodiment described above, a modification of the present embodiment is different in that the contact surface of the convex portion has a predetermined angle with the opposing surface of the piezoelectric vibrating piece. explain.
FIG. 6 is a diagram showing a piezoelectric vibrating piece 1A according to this modification. 6A is an external perspective view, and FIG. 6B is a front view.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted. The planar shape of the piezoelectric vibrating piece 1A is the same as the planar shape of the piezoelectric vibrating piece 1 shown in FIG.

The piezoelectric vibrating piece 1A of the present modification includes a convex portion 50 on the facing surface 18b that faces the mounting surface of the package when mounted on the piezoelectric vibrator.
The convex portion 50 is provided at the tip of the support arm portions 15 and 16 on the extending direction side (+ Y direction side), as in the present embodiment. The convex part 50 is provided with the contact surface 50a.

  The thickness of the convex portion 50 in the direction perpendicular to the surface of the piezoelectric vibrating piece 1A (Z-axis direction) is the end of the convex portion 50 on the base 10 side (−Y direction side) as shown in FIG. , The maximum thickness is h2, and the thickness becomes smaller toward the extending direction side (+ Y direction side) of the support arm portions 15 and 16. Thereby, the contact surface 50a is a slope inclined at an angle θ1 with respect to the facing surface 18b.

  The thickness of the convex portion 50 and the angle θ1 of the contact surface 50a are not particularly limited as long as the piezoelectric vibrating reed 1A does not contact the inside of the package when mounted. The maximum thickness h2 of the convex portion 50 can be set to 30 μm or more, for example.

  The piezoelectric vibrating piece 1A can be mounted on a package of a piezoelectric vibrator in the same manner as the mounting method of the present embodiment described above. Since the contact surface 50a of the convex portion 50 of the piezoelectric vibrating piece 1A is inclined at an angle θ1 with respect to the opposing surface 18b, the orientation of the piezoelectric vibrating piece 1A when mounted is such that the opposing surface 18b is relative to the mounting surface. The angle is inclined by the angle θ1 with respect to the package mounting surface.

  According to the piezoelectric vibrating piece 1A of this modification, even when the posture of the piezoelectric vibrating piece changes after mounting the piezoelectric vibrating piece, the piezoelectric vibrating piece is prevented from coming into contact with the inside of the package and being damaged. can do.

  As described above, for example, in the piezoelectric vibrating piece, when the mount portion that contacts the base substrate of the package by the conductive adhesive is provided at a position away from the center of gravity of the piezoelectric vibrating piece (for example, the side In the case of the arm type or the center arm type), the posture of the mounted piezoelectric vibrating piece may change due to the weight of the piezoelectric vibrating piece after a predetermined time has elapsed. That is, the side (mainly the base side) where the center of gravity is located with respect to the position of the mount portion of the piezoelectric vibrating piece may be lowered (approaching the mounting surface). In such a case, the piezoelectric vibrating piece may come into contact with the inside of the package (mainly the mounting surface) due to an external impact or the like.

On the other hand, according to this modification, the angle of the contact surface 50a of the convex portion 50 is mounted so that the piezoelectric vibrating reed 1A is mounted in a posture inclined in a direction opposite to a direction expected to be inclined in advance. By setting θ1, even if the posture of the piezoelectric vibrating piece 1A changes, it can be suppressed that the piezoelectric vibrating piece 1A comes into contact with the inside of the package due to an external impact or the like and is damaged.
This will be specifically described below.

  FIG. 7 is a cross-sectional view showing a case where the piezoelectric vibrating piece 1A of this modification is mounted on a piezoelectric vibrator 4 described later. FIG. 7A is a diagram illustrating a state immediately after mounting, and FIG. 7B is a diagram illustrating a case where the posture of the piezoelectric vibrating piece 1A is changed over time after mounting. FIG. 7 shows a case of cutting along the same cross section as FIG. 5, and the components of the piezoelectric vibrator 4 are omitted as appropriate.

  In FIG. 7A, the piezoelectric vibrating piece 1A is installed on the second base substrate 560 such that the facing surface 18b and the mounting surface 560a of the second base substrate 560 face each other. The posture of the piezoelectric vibrating piece 1 </ b> A is such that the facing surface 18 b of the piezoelectric vibrating piece 1 </ b> A is mounted on the mounting surface of the second base substrate 560 because the abutment surface 50 a of the convex portion 50 is inclined at the angle θ < The posture is inclined at θ1 with respect to 560a. In other words, the mounting surface 560a of the second base substrate 560 proceeds in the direction from the side where the hammer portion 13 (14) is provided in the vibrating arm portion 11 (12) of the piezoelectric vibrating piece 1A toward the base portion 10 side. And the distance from the facing surface 18b of the piezoelectric vibrating piece 1A is large.

  The side arm type piezoelectric vibrating piece such as the piezoelectric vibrating piece 1A of the present modification has a center of gravity close to the base 10, so that the mounting portions 15a and 16a are provided near the distal ends of the supporting arm portions 15 and 16 in the extending direction. If provided, the base 10 side may be lowered (approaching the mounting surface 560a) by its own weight.

  Even in such a case, as shown in FIG. 7B, according to the present modification, the piezoelectric vibrating reed 1A is mounted in a posture inclined in the direction opposite to the direction expected to be inclined in advance. Therefore, the piezoelectric vibrating reed 1 </ b> A is prevented from coming into contact with the second base substrate 560 when the posture is changed.

  Further, the piezoelectric vibrating piece 1A is oscillated around the mount portion 15a (16a) bonded to the electrode pad 610A (610B) installed on the second base substrate 560 via the conductive adhesive 80. It changes around the direction in which the arm parts 11 and 12 are arranged (direction perpendicular to the paper surface). Therefore, when the base portion 10 side of the piezoelectric vibrating piece 1A is lowered, the side on which the hammer portion 13 (14) is provided is raised (separated from the mounting surface 560a). Thereby, the contact surface 50a and the mounting surface 560a that have been in contact with each other are separated from each other, and a gap 63 is formed. As a result, the vibration of the piezoelectric vibrating piece 1 </ b> A can be prevented from leaking from the convex portion 50 to the second base substrate 560.

[Second Embodiment]
Next, a second embodiment in which a convex portion is provided on a tuning fork type piezoelectric vibrating piece will be described.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

8 and 9 are views showing the piezoelectric vibrating piece 2 of the present embodiment. FIG. 8 is an external perspective view, FIG. 9A is a plan view, and FIG. 9B is a front view.
As shown in FIGS. 8 and 9, the piezoelectric vibrating piece 2 of the present embodiment has a flat plate shape. The piezoelectric vibrating piece 2 includes a base portion 70, vibrating arm portions 72 and 73, and a convex portion 71.
Two mount portions 70 a are provided side by side in the width direction (X-axis direction) of the base portion 70 at the central portion of the base portion 70 on the facing surface 74 of the base portion 70. A mount electrode (not shown) is formed on the mount portion 70a.

  The pair of vibrating arm portions 72 and 73 extend from the base portion 70 in the same direction (+ Y direction). The pair of vibrating arm portions 72 and 73 are provided side by side in a direction (X-axis direction) perpendicular to the longitudinal direction and parallel to the surface of the piezoelectric vibrating piece 2. Excitation electrodes (not shown) that vibrate the pair of vibrating arm portions 72 and 73 are formed on the outer surfaces of the pair of vibrating arm portions 72 and 73.

  The mount electrode provided in the mount part 70a is connected to the excitation electrode formed on the outer surface of the vibrating arm parts 72 and 73 by a lead electrode (not shown). When a predetermined voltage is applied to each of these electrodes, the pair of vibrating arm portions 72 and 73 approach or separate from each other due to the interaction between the excitation electrodes of both the pair of vibrating arm portions 72 and 73. Vibrates at a predetermined resonance frequency (in the X-axis direction).

  The convex portion 71 is the center of the base 70 in the width direction (X-axis direction) on the facing surface 74 of the base 70 and the end of the vibrating arms 72 and 73 on the longitudinal base 70 side (−Y direction side). Is provided. The convex portion 71 includes a contact surface 71 a, and the contact surface 71 a is parallel to the facing surface 74 of the piezoelectric vibrating piece 2.

  Similarly to the piezoelectric vibrating piece 1 of the first embodiment, the piezoelectric vibrating piece 2 is mounted such that the facing surface 74 and the mounting surface of the package face each other. At this time, the contact surface 71a of the convex portion 71 contacts the mounting surface, and the mount portion 70a is bonded to the electrode pad provided on the mounting surface via a conductive adhesive. Since the abutting surface 71a is parallel to the facing surface 74, the piezoelectric vibrating piece 2 has a posture in which the facing surface 74 is parallel to the mounting surface.

  According to the piezoelectric vibrating piece 1A of the present embodiment, since the convex portion 71 is provided at the center in the width direction of the base portion 70, even if there is one convex portion 71, the posture of the piezoelectric vibrating piece 2 can be stably achieved. Can be easily mounted in a state where it is held in a desired posture (in this embodiment, the facing surface 74 of the piezoelectric vibrating piece 2 and the mounting surface of the package are parallel).

  In the present embodiment, the following configuration can also be adopted.

  In the present embodiment, the contact surface 71a of the convex portion 71 is a surface parallel to the facing surface 74. However, similar to the piezoelectric vibrating piece 1A of the modified example of the first embodiment described above, The slope may be inclined at a predetermined angle.

  The convex portion 71 may be provided at the center in the width direction (X-axis direction) of the base portion 70 on the vibrating arm portions 72 and 73 side (+ Y direction side) across the mount portion 70a.

  A plurality of convex portions 71 may be provided. For example, two are provided at the end (−Y direction side) opposite to the vibrating arm portions 72 and 73 across the mount portion 70a of the base portion 70 with the center in the width direction (X-axis direction) of the base portion 70 interposed therebetween. be able to.

  In the present embodiment, the piezoelectric vibrating piece having no vibrating groove formed on the vibrating arm portion is used. However, the piezoelectric vibrating piece may be formed with a groove.

[Third Embodiment]
Next, a third embodiment in which a convex portion is provided on a center arm type piezoelectric vibrating piece will be described.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

10 and 11 are diagrams showing the piezoelectric vibrating piece 3 of the present embodiment. 10 is an external perspective view, FIG. 11A is a plan view, and FIG. 11B is a front view.
As shown in FIGS. 10 and 11, the piezoelectric vibrating reed 3 according to the present embodiment has a flat plate shape. The piezoelectric vibrating piece 3 includes a base 90, vibrating arm portions 93 and 94, hammer portions 95 and 96, a support arm portion 91, and a convex portion 92.

  The pair of vibrating arm portions 93 and 94 extend from the base portion 90 in the same direction (+ Y direction). The vibrating arm portions 93 and 94 are provided side by side in a direction (X-axis direction) perpendicular to the longitudinal direction and parallel to the surface of the piezoelectric vibrating piece 3. Excitation electrodes (not shown) that vibrate the pair of vibrating arm portions 93 and 94 are formed on the outer surfaces of the pair of vibrating arm portions 93 and 94.

  The hammer portions 95 and 96 are formed so as to extend along the longitudinal direction (Y-axis direction) of the vibrating arm portions 93 and 94 from the tips of the vibrating arm portions 93 and 94, respectively. The widths (X-axis direction length) of the hammer portions 95 and 96 are formed larger than the widths (X-axis direction length) of the vibrating arm portions 93 and 94. The hammer portions 95 and 96 are set as free ends that vibrate in the width direction (X-axis direction) with the base portion 90 as a fixed end.

  The support arm portion 91 is a vibrating arm portion along the longitudinal direction (Y-axis direction) of the vibrating arm portions 93 and 94 from between the portions of the base 90 where the vibrating arm portion 93 and the vibrating arm portion 94 extend. 93 and 94 are extended toward the front end side (+ Y direction side).

A convex portion 92 is provided on the facing surface 97 of the piezoelectric vibrating piece 3 at the distal end portion of the support arm portion 91 in the extending direction side (+ Y direction side).
The convex portion 92 includes an abutting surface 92a that abuts against a package mounting surface described later. The contact surface 92 a is parallel to the facing surface 97.

  The support arm portion 91 includes a mount portion 91a. The mount portion 91a is in the longitudinal direction (Y) near the distal end of the support arm portion 91 on the opposing surface 97 of the piezoelectric vibrating piece 3 (+ Y direction side) and closer to the base 90 side than the convex portion 92. Two are provided side by side in the axial direction. The position where the mount portion 91a is provided is a position sandwiching a position that becomes a vibration node when the support arm portion 91 vibrates.

  A mount electrode (not shown) is formed on the mount portion 91a of the support arm portion 91, and is connected to an excitation electrode formed on the outer surface of the vibrating arm portions 93 and 94 by a lead electrode (not shown). When a predetermined voltage is applied to each of these electrodes, the direction in which the pair of vibrating arm portions 93 and 94 approach or separate from each other due to the interaction between the excitation electrodes of the pair of vibrating arm portions 93 and 94. Vibrates at a predetermined resonance frequency (in the X-axis direction).

  Similarly to the piezoelectric vibrating piece 1 of the first embodiment, the piezoelectric vibrating piece 3 is mounted such that the facing surface 97 faces the mounting surface of the package. At this time, the contact surface 92a of the convex portion 92 contacts the mounting surface, and the mount portion 90a is bonded to the electrode pad provided on the mounting surface via a conductive adhesive. Since the abutting surface 92a is parallel to the opposing surface 97, the piezoelectric vibrating piece 3 has a posture in which the opposing surface 97 is parallel to the mounting surface.

  According to the piezoelectric vibrating piece 3 of the present embodiment, the center arm type piezoelectric vibrating piece can be easily mounted on the piezoelectric vibrator package in a desired posture.

  In the present embodiment, the following configuration can also be adopted.

  In the present embodiment, the contact surface 92a of the convex portion 92 is a surface parallel to the facing surface 97. However, like the piezoelectric vibrating piece 1A of the modified example of the first embodiment described above, The slope may be inclined at a predetermined angle.

  In the present embodiment, the piezoelectric vibrating piece having no vibrating groove formed on the vibrating arm portion is used. However, the piezoelectric vibrating piece may be formed with a groove.

[First Embodiment of Piezoelectric Vibrator]
Next, a ceramic package type surface-mount type vibrator will be described as a first embodiment of a piezoelectric vibrator using the piezoelectric vibrating piece 1 described above.
12 to 15 are views showing the piezoelectric vibrator 4 of the present embodiment, FIG. 12 is an external perspective view, FIG. 13 is a plan view showing the internal configuration of the piezoelectric vibrator, with the sealing plate removed, and FIG. 14 is a cross-sectional view taken along line AA in FIG. 13, and FIG. 15 is an exploded perspective view of the piezoelectric vibrator 4.

  As shown in FIGS. 12 to 15, the piezoelectric vibrator 4 of the present embodiment includes a package 510 having a cavity C hermetically sealed therein, the above-described piezoelectric vibrating piece 1 housed in the cavity C, Is provided.

  The piezoelectric vibrator 4 is formed in a substantially rectangular parallelepiped shape. In this embodiment, the longitudinal direction of the piezoelectric vibrator 4 is referred to as a length direction and the short side direction is referred to as a width direction in plan view. A direction perpendicular to the width direction is referred to as a thickness direction.

  The package 510 includes a package body (base member) 530 and a sealing plate (lid member) 540 that is bonded to the package body 530 and forms a cavity C between the package body 530 and the package body 530. .

The package main body 530 includes a first base substrate 550 and a second base substrate 560 that are joined in a state of being overlapped with each other, and a seal ring 570 that is joined onto the second base substrate 560.
The first base substrate 550 is a ceramic substrate formed in a substantially rectangular shape in plan view. The second base substrate 560 is a ceramic substrate formed in a substantially rectangular shape in plan view having the same outer shape as the first base substrate 550, and is sintered in a state of being stacked on the first base substrate 550. Etc. are integrally joined together.

At the four corners of the first base substrate 550 and the second base substrate 560, cutout portions 580 having a ¼ arc shape in plan view are formed over the entire thickness direction of both the substrates 550 and 560. The first base substrate 550 and the second base substrate 560 are formed by, for example, forming a plurality of through-holes penetrating both ceramic substrates in a matrix after two wafer-shaped ceramic substrates are joined together. It is produced by cutting both ceramic substrates into a lattice shape with the through hole as a reference. At that time, the through-hole is divided into four, so that the above-described notch 580 is obtained.
The upper surface of the second base substrate 560 is a mounting surface 560a on which the piezoelectric vibrating reed 1 is mounted.

  Although the first base substrate 550 and the second base substrate 560 are made of ceramics, specific ceramic materials thereof include, for example, HTCC (High Temperature Co-Fired Ceramic) made of alumina, or LTCC (made of glass ceramics). Low Temperature Co-Fired Ceramic) and the like.

The seal ring 570 is a conductive frame member that is slightly smaller than the outer shape of the first base substrate 550 and the second base substrate 560, and is joined to the mounting surface 560 a of the second base substrate 560.
Specifically, the seal ring 570 is bonded onto the mounting surface 560a by baking with a brazing material such as silver brazing or a solder material, or formed on the mounting surface 560a (for example, in addition to electrolytic plating and electroless plating, Bonding is performed by welding or the like to a metal bonding layer formed by vapor deposition or sputtering.

The material of the seal ring 570 includes, for example, a nickel-based alloy. Specifically, the seal ring 570 may be selected from Kovar, Elinvar, Invar, 42-alloy, and the like. In particular, it is preferable to select a material for the seal ring 570 having a thermal expansion coefficient close to that of the first base substrate 550 and the second base substrate 560 made of ceramic. For example, when alumina having a thermal expansion coefficient of 6.8 × 10 ⁻⁶ / ° C. is used as the first base substrate 550 and the second base substrate 560, the seal ring 570 has a thermal expansion coefficient of 5.2 × 10 ⁻ It is preferable to use ⁶ / ° C. Kovar or 42-alloy having a thermal expansion coefficient of 4.5 × 10 ⁻⁶ / ° C. or more and 6.5 × 10 ⁻⁶ / ° C. or less.

  The sealing plate 540 is a conductive substrate stacked on the seal ring 570, and is hermetically bonded to the seal ring 570 by baking with a brazing material such as silver brazing or a solder material. In the bonding to the seal ring 570, the space defined by the sealing plate 540, the seal ring 570, and the mounting surface 560a of the second base substrate 560 functions as the above-described cavity C hermetically sealed.

  Examples of the welding method of the sealing plate 540 include seam welding by bringing a roller electrode into contact, laser welding, ultrasonic welding, and the like. Further, in order to make the welding between the sealing plate 540 and the seal ring 570 more reliable, a bonding layer such as nickel or gold that is familiar to each other is provided at least on the lower surface of the sealing plate 540 and the upper surface of the seal ring 570, respectively. It is preferable to form.

Meanwhile, a pair of electrode pads 610A and 610B that are connection electrodes to the piezoelectric vibrating reed 1 are formed on the mounting surface 560a of the second base substrate 560 at intervals in the width direction, and the first base substrate 550 is formed. A pair of external electrodes 620A and 620B are formed on the lower surface of the substrate at intervals in the length direction.
The electrode pads 610A and 610B and the external electrodes 620A and 620B are, for example, a single-layer film made of a single metal formed by vapor deposition or sputtering, or a stacked film in which different metals are stacked, and are electrically connected to each other. .

This point will be described in detail.
As shown in FIG. 14, the first base substrate 550 is formed with one first through electrode 630A that is electrically connected to one external electrode 620A and penetrates the first base substrate 550 in the thickness direction. The second base substrate 560 is formed with one second through electrode 640A that is electrically connected to one electrode pad 610A and penetrates the second base substrate 560 in the thickness direction. Between the first base substrate 550 and the second base substrate 560, one connection electrode 650A that connects one first through electrode 630A and one second through electrode 640A is formed. Thereby, one electrode pad 610A and one external electrode 620A are electrically connected to each other.

In addition, the first base substrate 550 is electrically connected to the other external electrode 620B, and the other first through electrode 630B passing through the first base substrate 550 in the thickness direction is formed. Is electrically connected to the other electrode pad 610B, and the other second through electrode 640B penetrating the second base substrate 560 in the thickness direction is formed. The other connection electrode 650B that connects the other first through electrode 630B and the other second through electrode 640B is formed between the first base substrate 550 and the second base substrate 560. Thereby, the other electrode pad 610B and the other external electrode 620B are electrically connected to each other.
The other connection electrode 650B is patterned so as to extend along the seal ring 570, for example, below the seal ring 570 so as to avoid a recess 660 described later.

  As shown in FIGS. 13 and 14, the mounting surface 560 a of the second base substrate 560 has a vibrating arm portion 11, 12 due to an impact of a drop or the like on a portion facing the tip portion of the vibrating arm portion 11, 12. Is formed with a recess 660 that avoids contact with the vibrating arm portions 11 and 12 when displaced in the thickness direction (deflection deformation). The recess 660 is a through-hole penetrating the second base substrate 560 and is formed in a square shape in plan view with rounded four corners inside the seal ring 570.

Then, as shown in FIG. 14, the piezoelectric vibrating reed 1 is configured such that mount electrodes (not shown) formed on the mount portions 15a and 16a are in contact with the electrode pads 610A and 610B via the conductive adhesive 80. Mounted. At this time, the contact surface 17a of the convex portion 17 in the piezoelectric vibrating piece 1 is in contact with the mounting surface 560a.
Thereby, the piezoelectric vibrating reed 1 is supported in a state where the facing surface 18a is parallel to the mounting surface 560a of the second base substrate 560, and is electrically connected to the pair of electrode pads 610A and 610B, respectively. It is in a state.

  When the piezoelectric vibrator 4 configured as described above is operated, a predetermined drive voltage is applied to the external electrodes 620A and 620B. Thereby, a current can be passed through the excitation electrode of the piezoelectric vibrating piece 1, and one vibrating arm portion 11 and the other vibrating arm portion 12 can be vibrated at a predetermined frequency along the surface of the piezoelectric vibrating piece 1. it can. By using this vibration, the piezoelectric vibrator 4 can be used as a time source, a timing source of control signals, a reference signal source, and the like.

  According to the piezoelectric vibrator 4 of the present embodiment, the piezoelectric vibrating reed 1 is accurately mounted on the second base substrate 560 with the facing surface 18a and the mounting surface 560a in a parallel posture. Therefore, it is possible to prevent the piezoelectric vibrating reed 1 from coming into contact with the inside of the package and being damaged by receiving an external impact, and a piezoelectric vibrator having excellent reliability can be obtained.

  In the present embodiment, the following configuration can also be adopted.

  Although the ceramic package type surface mount type vibrator has been described as the piezoelectric vibrator using the piezoelectric vibrating piece 1, the piezoelectric vibrating piece 1 is bonded to the base substrate and the lid substrate formed of a glass material by anodic bonding. It is also possible to apply to a glass package type piezoelectric vibrator.

  In this embodiment, the piezoelectric vibrating reed 1 according to the first embodiment is used as the piezoelectric vibrating reed to be mounted. However, the piezoelectric resonating pieces according to the modified example of the first embodiment, the second embodiment, and the third embodiment are used. May be.

[Second Embodiment of Piezoelectric Vibrator]
Next, a second embodiment of a piezoelectric vibrator, which differs from the first embodiment in that a convex portion is provided on the second base substrate, will be described.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

16 to 18 are views showing the piezoelectric vibrator 5 of the present embodiment. FIG. 16 is a plan view showing the internal configuration of the piezoelectric vibrator with the sealing plate removed, and FIG. FIG. 18 is an exploded perspective view of the piezoelectric vibrator 5. The external perspective view is the same as the piezoelectric vibrator 4 shown in FIG.
The mounted piezoelectric vibrating reed 20 is the same as the piezoelectric vibrating reed 1 of the first embodiment except that the support arms 150 and 160 are not provided with a convex portion at the tip.

  As illustrated in FIGS. 16 to 18, the second base substrate 560 </ b> A includes a convex portion (second convex portion) 81 on the mounting surface 560 </ b> Aa. The convex portion 81 includes a contact surface (second contact surface) 81a, and the contact surface 81a is parallel to the mounting surface 560Aa. The convex portions 81 are provided in the vicinity of the electrode pads 610A and 610B on the extending direction side (the concave portion 660 side) of the support arm portions 150 and 160 in the mounted piezoelectric vibrating reed 20 respectively. Thereby, the contact surface 81a is more than the position (mount part 150a, 160a) in contact with the electrode pads 610A, 610B via the conductive adhesive 80 in the support arm parts 150, 160 of the piezoelectric vibrating piece 20. They are in contact with the position (contact position) on the extending direction side.

  According to the piezoelectric vibrator 5 of the present embodiment, the piezoelectric vibrating piece 20 is accurately mounted on the second base substrate 560A with the facing surface 180 and the mounting surface 560Aa being parallel. Therefore, it is possible to prevent the piezoelectric vibrating reed 20 from coming into contact with the inside of the package and being damaged by receiving an external impact, and a piezoelectric vibrator having excellent reliability can be obtained.

  Further, the contact surface 81 a of the convex portion 81 is in contact with the distal end portion on the extending direction side of the support arm portions 150 and 160 of the piezoelectric vibrating piece 20. Since the vibrations from the vibrating arm portions 11 and 12 are sufficiently damped at the distal end portions of the support arm portions 150 and 160, the leakage of vibration from the piezoelectric vibrating piece 20 to the second base substrate 560A can be suppressed.

  In addition, since it is possible to mount a piezoelectric vibrating piece that does not have a convex portion, such as the piezoelectric vibrating piece 20, the range of selection of the piezoelectric vibrating piece that can be mounted can be widened.

  In the present embodiment, the following configuration can also be adopted.

  In the present embodiment, a side arm type piezoelectric vibrating piece is used, but a tuning fork type or a center arm type may be used. In that case, the position of the convex part 81 can be changed according to the position of the mount part of each piezoelectric vibrating piece.

[Modification of Second Embodiment of Piezoelectric Vibrator]
Next, a modification of the second embodiment of the piezoelectric vibrator, which differs from the piezoelectric vibrator 5 in the present embodiment in that the contact surface of the convex portion is an inclined surface, will be described.
In addition, about the component similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected suitably, and the description is simplified or abbreviate | omitted.

  19 to 21 are diagrams showing a piezoelectric vibrator 5A according to this modification. FIG. 19 is a plan view showing the internal configuration of the piezoelectric vibrator, with the sealing plate removed. 20 is a cross-sectional view taken along the line CC in FIG. 19. FIG. 20A is a view immediately after mounting the piezoelectric vibrating piece, and FIG. 20B is a posture of the piezoelectric vibrating piece after a predetermined time has elapsed. It is a figure which shows the case where changes. FIG. 21 is an exploded perspective view of the piezoelectric vibrator 5A. The external perspective view is the same as the piezoelectric vibrator 4 shown in FIG.

  As illustrated in FIGS. 19 to 21, the second base substrate 560 </ b> B includes a convex portion 82 on the mounting surface 560 </ b> Ba. The convex part 82 is provided with the contact surface 82a. The contact surface 82a of the convex portion 82 is a slope inclined at a predetermined angle with respect to the mounting surface 560Ba. The convex portions 82 are provided in the vicinity of the electrode pads 610 </ b> A and 610 </ b> B on the extending direction side (the concave portion 660 side) of the support arm portions 150 and 160 in the mounted piezoelectric vibrating reed 20. Thereby, the contact surface 82a is more than the position (mount part 150a, 160a) in contact with the electrode pads 610A, 610B via the conductive adhesive 80 in the support arm parts 150, 160 of the piezoelectric vibrating piece 20. They are in contact with the position (contact position) on the extending direction side.

As shown in FIG. 20A, the posture of the piezoelectric vibrating piece 20 is inclined with respect to the mounting surface 560Ba of the substrate 560B at the time of mounting.
However, when a predetermined time has elapsed since the mounting, as described above, the posture of the piezoelectric vibrating piece 20 may change due to its own weight.
In this case, according to the piezoelectric vibrator 5A of the present modified example, even if the posture of the piezoelectric vibrating piece 20 changes as shown in FIG. 20 is inclined in the opposite direction to the second base substrate 560B (in the direction in which the second base substrate 560B approaches the second base substrate 560B), the piezoelectric vibrating reed 20 is suppressed from coming into contact with the second base substrate 560B. In FIG. 20B, the facing surface 180 of the piezoelectric vibrating piece 20 and the mounting surface 560Ba are parallel to each other by changing the posture.

  In this case, the contact surface 82a of the projecting portion 82 that has been in contact with the mounting surface 560Ba of the second base substrate 560B is separated. Therefore, it is possible to suppress the vibration of the piezoelectric vibrating piece 20 from leaking to the second base substrate 560B.

[Oscillator Embodiment]
Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 22, the oscillator 100 according to the present embodiment includes the piezoelectric vibrator 4 as an oscillator electrically connected to the integrated circuit 101. The oscillator 100 includes a substrate 103 on which an electronic component 102 such as a capacitor is mounted. An integrated circuit 101 for an oscillator is mounted on the substrate 103, and the piezoelectric vibrator 4 is mounted in the vicinity of the integrated circuit 101. The electronic component 102, the integrated circuit 101, and the piezoelectric vibrator 4 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 100 configured as described above, when a voltage is applied to the piezoelectric vibrator 4, the piezoelectric vibrating piece 1 in the piezoelectric vibrator 4 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 1 and input to the integrated circuit 101 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 101 and is output as a frequency signal. Thereby, the piezoelectric vibrator 4 functions as an oscillator.
In addition, by selectively setting the configuration of the integrated circuit 101, for example, an RTC (real-time clock) module or the like as required, the operation date and time of the device and external device in addition to a single-function oscillator for a clock, etc. A function for controlling the time, providing a time, a calendar, and the like can be added.

  According to the oscillator 100 of the present embodiment, since the piezoelectric vibrator 4 described above is provided, the oscillator 100 having excellent reliability can be obtained.

[Embodiment of Electronic Device]
Next, an embodiment of an electronic apparatus according to the invention will be described with reference to FIG. Note that a portable information device (electronic device) 110 having the above-described piezoelectric vibrator 4 will be described as an example of the electronic device.
Here, the portable information device 110 of the present embodiment is represented by, for example, a mobile phone, and is a development and improvement of a wrist watch in the prior art. The appearance is similar to that of a wristwatch, and a liquid crystal display is arranged in a portion corresponding to a dial so that the current time and the like can be displayed on this screen. Further, when used as a communication device, it is possible to perform communication similar to that of a conventional mobile phone by using a speaker and a microphone that are removed from the wrist and incorporated in the inner portion of the band. However, it is much smaller and lighter than conventional mobile phones.

  Next, the configuration of the portable information device 110 of this embodiment will be described. As shown in FIG. 23, the portable information device 110 includes the piezoelectric vibrator 4 and a power supply unit 111 for supplying power. The power supply unit 111 is made of, for example, a lithium secondary battery. The power supply unit 111 includes a control unit 112 that performs various controls, a clock unit 113 that counts time, a communication unit 114 that communicates with the outside, a display unit 115 that displays various types of information, A voltage detection unit 116 that detects the voltage of the functional unit is connected in parallel. The power unit 111 supplies power to each functional unit.

  The control unit 112 controls each function unit to perform operation control of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 112 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area of the CPU.

  The timer unit 113 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the piezoelectric vibrator 4. When a voltage is applied to the piezoelectric vibrator 4, the piezoelectric vibrating piece 1 vibrates, and this vibration is converted into an electric signal by the piezoelectric characteristics of the crystal and is input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 112 via the interface circuit, and the current time, current date, calendar information, or the like is displayed on the display unit 115.

The communication unit 114 has functions similar to those of a conventional mobile phone, and includes a radio unit 117, a voice processing unit 118, a switching unit 119, an amplification unit 120, a voice input / output unit 121, a telephone number input unit 122, and a ring tone generation unit. 123 and a call control memory unit 124.
The wireless unit 117 exchanges various data such as audio data with the base station via the antenna 125. The audio processing unit 118 encodes and decodes the audio signal input from the radio unit 117 or the amplification unit 120. The amplifying unit 120 amplifies the signal input from the audio processing unit 118 or the audio input / output unit 121 to a predetermined level. The voice input / output unit 121 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a voice.

In addition, the ring tone generator 123 generates a ring tone in response to a call from the base station. The switching unit 119 switches the amplifying unit 120 connected to the voice processing unit 118 to the ringing tone generating unit 123 only when an incoming call is received, so that the ringing tone generated in the ringing tone generating unit 123 is transmitted via the amplifying unit 120. To the audio input / output unit 121.
The call control memory unit 124 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 122 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys and the like, a telephone number of a call destination is input.

  When the voltage applied to each functional unit such as the control unit 112 by the power supply unit 111 falls below a predetermined value, the voltage detection unit 116 detects the voltage drop and notifies the control unit 112 of the voltage drop. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary for stably operating the communication unit 114, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 116, the control unit 112 prohibits the operations of the radio unit 117, the voice processing unit 118, the switching unit 119, and the ring tone generation unit 123. In particular, it is essential to stop the operation of the wireless unit 117 with high power consumption. Further, the display unit 115 displays that the communication unit 114 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 114 can be prohibited by the voltage detection unit 116 and the control unit 112, and that effect can be displayed on the display unit 115. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 115.
In addition, the function of the communication part 114 can be stopped more reliably by providing the power supply cutoff part 126 that can selectively cut off the power of the part related to the function of the communication part 114.

  According to the portable information device 110 of this embodiment, since the piezoelectric vibrator 4 described above is provided, the portable information device 110 having excellent reliability can be obtained.

[Embodiment of radio clock]
Next, an embodiment of a radio timepiece according to the present invention will be described with reference to FIG.
As shown in FIG. 24, the radio timepiece 130 according to the present embodiment includes the piezoelectric vibrator 4 electrically connected to the filter unit 131, and receives a standard radio wave including timepiece information to accurately It is a clock with a function of automatically correcting and displaying the correct time.
In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), each transmitting standard radio waves. Long waves such as 40 kHz or 60 kHz have both the property of propagating the ground surface and the property of propagating while reflecting the ionosphere and the ground surface, so the propagation range is wide, and the above two transmitting stations cover all of Japan. doing.

Hereinafter, the functional configuration of the radio timepiece 130 will be described in detail.
The antenna 132 receives a long standard wave of 40 kHz or 60 kHz. The long-wave standard radio wave is obtained by subjecting time information called a time code to AM modulation on a 40 kHz or 60 kHz carrier wave. The received long standard radio wave is amplified by the amplifier 133 and filtered and tuned by the filter unit 131 having the plurality of piezoelectric vibrators 4.
The piezoelectric vibrator 4 in this embodiment includes crystal vibrator portions 138 and 139 having resonance frequencies of 40 kHz and 60 kHz that are the same as the carrier frequency described above.

Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 134. Subsequently, the time code is taken out via the waveform shaping circuit 135 and counted by the CPU 136. The CPU 136 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected in the RTC 137, and accurate time information is displayed.
Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrator portions 138 and 139 are preferably vibrators having the tuning-fork type structure described above.

  In addition, although the above-mentioned description was shown in the example in Japan, the frequency of the long standard wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Therefore, when the radio timepiece 130 that can be handled overseas is incorporated in a portable device, the piezoelectric vibrator 4 having a frequency different from that in Japan is required.

  According to the radio timepiece 130 of the present embodiment, since the piezoelectric vibrator 4 described above is provided, the radio timepiece 130 similarly excellent in reliability can be obtained.

  In the oscillator, the electronic device, and the radio timepiece in the above embodiment, the piezoelectric vibrator 4 of the first embodiment is used. However, the piezoelectric vibrator of the second embodiment and the modified example of the second embodiment described above is used. There may be.

  DESCRIPTION OF SYMBOLS 1,1A, 2,3 ... Piezoelectric vibration piece, 4,5,5A ... Piezoelectric vibrator 10, 70, 90 ... Base part, 11, 12, 72, 73, 93, 94 ... Vibration arm part, 15, 16, 91 ... Support arm portion, 15a, 16a, 70a, 91a ... Mount portion, 17, 50, 92 ... Convex portion, 17a, 50a, 71a, 92a ... Abutting surface, 18a, 18b, 74, 97 ... Opposite surface (one surface) ), 100 ... Oscillator, 110 ... Portable information device (electronic device), 130 ... Radio clock, 510 ... Package, 530 ... Package main body (base member), 540 ... Sealing plate (lid member), 560a, 560Aa, 560Ba ... Mounting Surface, C ... cavity

Claims (8)

A pair of vibrating arms arranged side by side in one direction;
A base to which the pair of vibrating arms are connected;
A support arm connected to the base;
A mount portion provided at a predetermined position on one surface of the support arm portion ;
A convex portion provided on the one surface and having a contact surface;
With
On the one surface, the convex portion is a piezoelectric vibrating piece provided on a tip side of the support arm portion with respect to the mount portion .   The piezoelectric vibrating piece according to claim 1, wherein the contact surface is parallel to the one surface of the piezoelectric vibrating piece.   The piezoelectric vibrating piece according to claim 1, wherein the contact surface has a predetermined angle with respect to the one surface of the piezoelectric vibrating piece.   4. The piezoelectric vibrating piece according to claim 1, wherein the convex portion is provided at a center of the base portion in the one direction. 5. A package having a base member and a lid member that is overlapped and joined to the base member and that forms a hermetically sealed cavity with the base member;
A piezoelectric vibrator comprising: the piezoelectric vibrating piece according to claim 1 mounted in a state in which the contact surface is in contact with a mounting surface of the base member and housed in the cavity. An oscillator comprising the piezoelectric vibrator according to claim 1 , wherein the piezoelectric vibrator is electrically connected to an integrated circuit as an oscillator. An electronic apparatus comprising the piezoelectric vibrator according to claim 1 , wherein the piezoelectric vibrator is electrically connected to a timing unit. A radio-controlled timepiece comprising the piezoelectric vibrator according to claim 1 , wherein the piezoelectric vibrator is electrically connected to a filter unit.

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