JP6167963B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device.

  For example, a configuration having a transformer and a rectifier circuit provided on the output side of the transformer is known as a power conversion device used in a vehicle such as an automobile. In this case, a technique is known in which a bridge rectifier circuit is configured using four diodes as a rectifier circuit (see, for example, Patent Document 1).

JP 2000-102252 A

  In recent years, reductions in the number of parts and downsizing have been demanded in various in-vehicle devices, and it is considered that there is room for technical improvement in meeting such demands in power conversion devices. Specifically, it is conceivable to reduce the number of parts and reduce the size of the power converter by simplifying the configuration related to the rectifier circuit. For example, in a power conversion device, it is assumed that a circuit board is housed in a housing and a plurality of DC-DC conversion circuits are mounted on the circuit board. Each of the plurality of DC-DC conversion circuits includes each conversion circuit. Is provided with a rectifier circuit. In this case, downsizing of the circuit board and the like accompanying simplification of the configuration of the rectifier circuit is expected.

  The main object of the present invention is to provide a power converter capable of simplifying the configuration for constructing a rectifier circuit.

  Hereinafter, means for solving the above-described problems and the effects thereof will be described.

  The present invention is a power conversion device including a bridge-type rectifier circuit (40) that rectifies an AC voltage, and the rectifier circuit includes a plurality of diodes (41 to 44) provided in an upper arm and a lower arm, respectively. doing. Among the plurality of diodes, the diodes (43, 44) provided on the upper arm are integrally packed with two diode chips (54, 55) provided in parallel with each other, and two anode terminals (51, 44). 52) and an upper arm module (D3) composed of a three-terminal diode module having one cathode terminal (53). In the upper arm module, the two anode terminals are respectively connected to the lower arm branched in two directions, and the cathode terminal is connected to a positive output portion of the rectifier circuit.

  In the bridge-type rectifier circuit, two diodes are provided on the upper arm and the lower arm, and the AC voltage is rectified by the diodes. In the above configuration, the number of modules mounted on the circuit board can be reduced by using a three-terminal upper arm module with two anodes and one cathode (common terminal) as the upper arm diode. ing. Further, the number of terminals connected to the circuit board can be reduced as compared with the case where four modules are used. As a result, the configuration for constructing the rectifier circuit can be simplified.

The circuit diagram which shows the electrical basic composition of a DDC circuit. The top view which shows the structure of a diode module. The circuit diagram which shows the structure of the rectifier circuit using three diode modules. The top view which shows the structure of the power converter device in a storage case. The top view which expands and shows the attachment part of each module. The figure which shows the shape of the terminal of a diode module. The figure which shows the through-hole and slit of a circuit board. The figure which shows the through-hole and slit of a circuit board. The figure which shows the wiring pattern of a circuit board.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings. The present embodiment assumes a case where the present invention is embodied as an in-vehicle power conversion device mounted on a vehicle such as an automobile. In the power converter, after AC power (AC power) is input, the AC power is converted into DC power (DC power) by the AC-DC converter, and the DC power is converted by the DC-DC converter. Output. The power conversion device is used, for example, as a charging device for a plug-in hybrid vehicle. FIG. 1 shows an electrical basic configuration of a DDC circuit 11 that performs DC-DC conversion in the power converter 10.

  In FIG. 1, the DDC circuit 11 includes a switching circuit 20, a transformer 30, and a rectifier circuit 40. The switching circuit 20 is composed of a full bridge circuit having a plurality of switching elements 21, 22, 23, and 24 made of, for example, MOSFETs or the like, and the input DC power ( Vin, Iin) is converted into AC power.

  The transformer 30 has a primary coil 31 and a secondary coil 32 and transforms the output voltage of the switching circuit 20.

  The rectifier circuit 40 is a bridge-type full-wave rectifier circuit that rectifies the AC voltage output from the transformer 30, and includes diodes 41, 42, 43, and 44 as rectifier elements. In the rectifier circuit 40, anodes of lower arm side diodes 41 and 42 are connected to the negative output point N1, and cathodes of upper arm side diodes 43 and 44 are connected to the positive output point N2. Further, the secondary coil 32 of the transformer 30 is connected to the intermediate point N3 of the diodes 41 and 43 and the intermediate point N4 of the diodes 42 and 44 that are connected in series in the same direction.

  The output voltage rectified by the rectifier circuit 40 is output to a smoothing circuit 47 including a choke coil 45 (smoothing coil) and a smoothing capacitor 46, and after being smoothed by the smoothing circuit 47, output to a battery or the like. (Vout, Iout, Pout).

  In the present embodiment, in order to simplify the configuration of the rectifier circuit 40, the four diodes 41 to 44 configuring the rectifier circuit 40 are configured using three modules D1, D2, and D3 that are three-terminal diode modules. The details will be described below. FIG. 2 shows a configuration of modules D1 to D3, and FIG. 3 shows a configuration of a rectifier circuit 40 using three modules D1 to D3.

  As shown in FIG. 2, the modules D1 to D3 have a total of three metal terminals including two anode terminals 51 and 52 and one cathode terminal 53, and two diode chips 54 and 55. Two diode chips 54 and 55 are integrally packaged (resin-sealed) with a synthetic resin or the like in the main body 56. The two diode chips 54 and 55 are provided in a direction parallel to each other.

  As shown in FIG. 3, the rectifier circuit 40 is configured by arranging two lower arm modules D1 and D2 on the lower arm and arranging one upper arm module D3 on the upper arm. That is, the two diode chips 54 and 55 built in the upper arm module D3 are respectively arranged on the upper arm that branches in two directions. In this case, in comparison with the basic circuit of FIG. 1, the lower arm diodes 41 and 42 are respectively constituted by lower arm modules D1 and D2, and the upper arm diodes 43 and 44 are diode chips of the upper arm module D3. 54, 55. In the upper arm module D3, the two anode terminals 51 and 52 are respectively connected to the cathode terminals 53 of the lower arm modules D1 and D2 in the lower arm branched in two directions, and the cathode terminal 53 is the positive output of the rectifier circuit 40. Connected to point N2.

  Next, the mounting structure of the DDC circuit 11 will be described. Here, the outline of the structure related to the DDC circuit portion will be described with reference to FIG. FIG. 4 is a plan view illustrating the configuration of the power conversion device 10 in the storage case 61. FIG. 4A illustrates the configuration in the storage case 61 in a state where the circuit board 71 is not attached in the power conversion device 10. (B) has shown the structure in the accommodation case 61 in the state which attached the circuit board 71 in the power converter device 10. FIG. The power conversion apparatus 10 has two DDC circuits 11, and FIGS. 4A and 4B show two DDC circuits 11 on the upper and lower sides, respectively, but the mounting structure is the same. Therefore, one of the DDC circuits 11 will be described below.

  The housing case 61 has a bottomed box shape formed of a metal such as aluminum or a synthetic resin, and includes a peripheral wall portion 62 and a bottom portion 63. 4 (a) and 4 (b) show a state in which the housing case 61 is opened to the front side of the drawing, but a cover (not shown) is attached to the top of the peripheral wall portion 62. . Power input / output terminals 64 and 65 are provided on one side surface of the peripheral wall 62.

  Then, as shown in FIG. 4A, various electrical components constituting the DDC circuit 11 are mounted on the bottom 63 of the housing case 61. Specifically, a transformer 30, three modules D1 to D3, a choke coil 45, and the like are mounted. Further, as shown in FIG. 4B, a circuit board 71 is fixed in a direction facing the bottom 63, and various electrical components constituting the DDC circuit 11 are mounted on the circuit board 71. Specifically, switching elements 21 to 24, an arithmetic device, and the like are mounted. In this case, the modules D1 to D3 are disposed on the back side of the circuit board 71 (between the bottom 63 and the circuit board 71). The circuit board 71 is provided with a notch 72, and the transformer 30 and the choke coil 45 are arranged in the notch 72.

  Here, a configuration related to the connection between the three modules D1 to D3 and the circuit board 71 will be described. FIG. 5 is an enlarged plan view showing a mounting portion of the modules D1 to D3. FIG. 5A shows three modules D1 to D3 mounted on the bottom 63 of the housing case 61, and FIG. The circuit board 71 on D1-D3 is shown.

  As shown in FIG. 5A, the modules D <b> 1 to D <b> 3 are arranged in a line in a state in which the terminals 51 to 53 are on the transformer 30 side and are arranged side by side on the side of the transformer 30. The three modules D1 to D3 are provided in the order in which the lower arm modules D1 and D2 are on the outside and the upper arm module D3 is on the center.

  As shown in FIG. 6, the terminals 51 to 53 of each module D <b> 1 to D <b> 3 are bent at a substantially right angle at the intermediate portion, and the tip portion is inserted into the through hole 73 (see FIG. 5B) of the circuit board 71. It has become so. In this case, in each of the modules D1 to D3, the bending positions of the anode terminals 51 and 52 and the cathode terminal 53 are different from each other, and the bending positions are staggered at three terminals (each set of three terminals) side by side. It is the arrangement of. In the lower arm modules D1 and D2 and the upper arm module D3, the staggered pattern of the terminals 51 to 53 is opposite to each other.

  As shown in FIG. 5B, the circuit board 71 is formed with a plurality of through holes 73 through which the terminals 51 to 53 of the modules D1 to D3 are inserted. Three through holes 73 are provided in each of the modules D1 to D3, and each of the three through holes 73 is arranged in a staggered manner. Of the three through holes 73, two through holes 73a are for anode connection, and one through hole 73b is for cathode connection. In each of the modules D1 to D3, a through hole 73b for cathode connection is disposed in the center, and two through holes 73a for anode connection are disposed on both sides thereof. Particularly in this case, the lower arm modules D1 and D2 are staggered so that the anode connection through hole 73a is located far from the transformer 30 and the cathode connection through hole 73b is located nearby. On the other hand, the upper arm module D3 is staggered so that the anode connection through hole 73a is located close to the transformer 30 and the cathode connection through hole 73b is located far away.

  Moreover, in each through-hole 73, the terminals 51-53 are soldered to each. However, since the distance between the terminals 51 to 53 is very small (for example, about several mm), a line between the through holes 73 is required to ensure mutual insulation at the terminals 51 to 53. An insulating part is provided. In the present embodiment, each pair of slits 74 is formed in the circuit board 71 as an insulating portion for each of the modules D1 to D3.

  The slit 74 will be supplemented. Considering that the terminals 51 to 53 are soldered in the respective through holes 73, it is desirable that the solder area around the through hole 73 is large. On the other hand, as described above, the insulation at each of the terminals 51 to 53 is ensured. There is a need. Therefore, it is desirable to perform insulation isolation evenly for two terminals that are in an insulating relationship with each other. From this point of view, a pair of slits 74 is formed for each of the modules D1 to D3 in a direction in which the through holes 73 arranged in a staggered manner are not parallel to each other.

  More specifically, as shown in FIG. 7, a pair of slits 74 is formed so as to be orthogonal to a straight line connecting two adjacent through holes 73a and 73b. In this case, the gap between the pair of slits 74 is different between the one end side and the other end side of the slit 74, and the gap L2 on the other end side is larger than the gap L1 on the one end side. For this reason, when a wiring pattern electrically connected to the cathode terminal 53 (the center terminal of the three terminals) is provided on the circuit board 71, it is easy to form the wiring pattern on the side where the distance L2 is provided. However, details of the wiring pattern will be described later.

  Note that the pair of slits 74 (long holes) provided in the circuit board 71 may be continuous. For example, as shown in FIG. 8, the narrow side of the pair of slits 74 may be integrally connected by a connecting portion 75. In short, the pair of slits 74 is formed so as to open at two positions between the through-hole 73b for cathode connection and the two through-holes 73a for anode connection and to expand in a tapered shape on one side. That's fine.

  Next, a wiring pattern provided on the circuit board 71 will be described. The circuit board 71 is a multi-layer board in which a plurality of wiring layers are stacked, and different wiring patterns can be provided in the board thickness direction. FIG. 9A shows a wiring pattern in the first layer 81 of the circuit board 71, and FIG. 9B shows a wiring pattern in the second layer 82 of the circuit board 71. The first layer 81 and the second layer 82 are electrically insulated from each other by an insulating layer (not shown).

  As shown in FIG. 9A, the first layer 81 has wiring patterns X1 and X2 connected to the secondary coil 32 of the transformer 30 via metal terminals 85 and 86, and a harness 87 on the choke coil 45. And a wiring pattern X3 that is a positive output wiring portion of the rectifier circuit 40 and a wiring pattern X4 that is a negative output wiring portion of the rectifier circuit 40 are provided. 9B, the second layer 82 has wiring patterns Y1 and Y2 connected to the secondary coil 32 of the transformer 30 via metal terminals 85 and 86, and a harness connected to the choke coil 45. 87, a wiring pattern Y3 that is a positive output wiring portion of the rectifier circuit 40 and a wiring pattern Y4 that is a negative output wiring portion of the rectifier circuit 40 are provided.

  The wiring patterns X1 and Y1 are to connect one anode terminal 51 in the upper arm module D3 to the cathode terminal 53 of the lower arm module D1, and the wiring patterns X2 and Y2 are the other anode terminal 52 in the upper arm module D3. Is conducted to the cathode terminal 53 of the lower arm module D2. The wiring patterns X1, Y1 correspond to the “first pattern”, and the wiring patterns X2, Y2 correspond to the “second pattern”. The wiring patterns X3 and Y3 are electrically connected to the cathode terminal 53 of the upper arm module D3, and this corresponds to the “third pattern”. The wiring patterns X4 and Y4 are respectively connected to the anode terminals 51 and 52 of the two lower arm modules D1 and D2, and this corresponds to a “fourth pattern”.

  In the first layer 81 and the second layer 82, X1 and Y1, X2 and Y2, X3 and Y3, X4 and Y4 of each wiring pattern are electrically connected to each other via a conductive member in the substrate thickness direction. Among these, X1 and Y1, X2 and Y2 have the same shape and size, and are formed at the same positions in the first layer 81 and the second layer 82 in plan view of the substrate.

  On the other hand, X3 and Y3 which are the positive output wiring portions are connected to the upper arm module D3 at the center position among the three modules D1 to D3, while X4 and Y4 which are the negative output wiring portions are The upper arm module D3 is sandwiched between the lower arm modules D1 and D2 on both sides. Therefore, the pattern shapes of these X3 and Y3, X4 and Y4 are different between the first layer 81 and the second layer 82, respectively, and the wiring pattern Y4 is divided into two in the second layer 82. The wiring pattern Y3 is arranged between them. In this case, the wiring patterns X3 and Y3 and the wiring patterns X4 and Y4 are provided so as to cross each other in plan view of the substrate.

  In order to reduce the influence of high-frequency noise in the wiring pattern, it can be said that it is desirable to avoid overlapping wiring patterns of different power lines in the substrate thickness direction. In this regard, in the pattern configuration shown in FIG. 9, the overlapping of the wiring patterns in the substrate thickness direction (the overlapping of different power lines) is limited to a part of the wiring patterns Y3 and X4. For this reason, the pattern configuration shown in FIG. 9 is desirable from the viewpoint of suppressing the influence of high-frequency noise.

  In the present embodiment, the transformer 30 and the choke coil 45 are respectively disposed on both sides of the rectifier circuit 40 in the housing case 61. As an outline of each wiring pattern, the wiring patterns X1, X2, Y1, and Y2 are transformers. The wiring patterns X3, X3, Y4, and Y4 are provided at positions near the choke coil 45 (left side in the figure). In other words, the wiring patterns X1, X2, Y1, and Y2 for inputting / outputting electric power to / from the transformer 30 are arranged close to the transformer 30, whereas the wiring patterns X3, X3, which are input / output portions of the rectifier circuit 40 are arranged. Y4 and Y4 are arranged on the opposite side across the terminal connection portions (through holes 73) of the modules D1 to D3. In this case, the wiring patterns X1, X2, Y1, and Y2 on the transformer 30 side and the wiring patterns X3, X3, Y4, and Y4 on the choke coil 45 side (smoothing circuit side) are connected to the through holes 73 in the plan view of the substrate. They are provided so as to extend on opposite sides.

  In comparison with the circuit diagram of the rectifier circuit 40 shown in FIG. 3, the wiring patterns X1, Y1 correspond to the intermediate point N3 in FIG. 3, and the wiring patterns X2, Y2 correspond to the intermediate point N4 in FIG. N3 and N4 can be reversed. Further, the wiring patterns X3 and Y3 correspond to the positive output point N2 in FIG. 3, and the wiring patterns X4 and Y4 correspond to the negative output point N1 in FIG.

  Next, the relationship between the through hole 73 and the slit 74 of the circuit board 71 and the wiring pattern will be described. As described above, in the circuit board 71, the through holes 73 are staggered for each of the modules D1 to D3, and a pair of slits 74 are formed non-parallel (tapered) in accordance with the arrangement of the through holes 73. Of the three through holes 73 for each of the modules D1 to D3, the central through hole 73b is for the cathode, and the through holes 73a on both sides are for the anode.

  In this case, the pair of slits 74 formed between the three through holes 73 in each of the modules D1 to D3 has a tapered shape in which the mutual interval is expanded on one side (see FIG. 7). By using the extended interval, the formation of the wiring of the cathode terminal is optimized.

  For example, in the upper arm module D3, as shown in FIG. 9B, the cathode through hole 73b is shifted in the direction in which the wiring pattern Y3 extends with respect to the straight line connecting the two anode through holes 73a. Thus, these three through holes 73 are arranged in a staggered manner. Further, the pair of slits 74 formed between the through holes 73a and 73b are provided so as to have a tapered shape in which the wiring pattern Y3 side is expanded. A cathode through-hole 73b exists between the pair of slits 74, and the wiring pattern Y3 extends from the wide side of the narrow side and the wide side between the pair of slits 74 to the through-hole 73b. It is the structure which extends. In this case, the distance between the pair of slits 74 is not so large in the first place, but the wiring is easily formed by forming the pair of slits 74 in a tapered shape. That is, by making the direction of the taper of the pair of slits 74 the direction that is expanded on the wiring pattern Y3 side, it is easy to secure the wiring width, and the wiring is easily formed.

  In the lower arm modules D1 and D2, the anode and cathode terminals are arranged in a staggered manner as in the upper arm module D3, but the orientation of the staggered arrangement is opposite to that of the upper arm module D3. That is, in the lower arm modules D1 and D2, as shown in FIG. 9A, the through holes 73b for the cathode extend the wiring patterns X1 and X2 with respect to a straight line connecting the two through holes 73a for the anode. By shifting in the direction, these three through holes 73 are arranged in a staggered manner. Further, the pair of slits 74 formed between the through holes 73a and 73b are provided so as to have a tapered shape in which the wiring patterns X1 and X2 side are expanded. A cathode through hole 73b exists between the pair of slits 74, and the wiring pattern X1 is formed from the wide side between the narrow side and the wide side between the pair of slits 74 with respect to the through hole 73b. , X2 extends. In this case, by ensuring that the taper direction of the pair of slits 74 is extended in the wiring patterns X1 and X2, the wiring width can be easily secured and the wiring can be easily formed.

  According to the embodiment described in detail above, the following excellent effects can be obtained.

  As the upper arm diodes 43 and 44 of the rectifier circuit 40, the number of modules mounted on the circuit board 71 can be reduced by using a three-terminal upper arm module D3 having two anodes and one cathode (common terminal). It was possible to reduce to three. In this case, the number of terminals connected to the circuit board 71 can be reduced as compared with the case where four modules are used. As a result, the configuration for constructing the rectifier circuit 40 can be simplified.

  In the housing case 61, the upper arm module D3 is disposed at a position sandwiched between the two lower arm modules D1 and D2, and the circuit board 71 includes the wiring patterns X1, X2, Y1, and Y2 in the upper arm module D3. The two anode terminals were individually connected to the cathode terminals of the lower arm modules D1 and D2. In this case, the cathode-anode connection of the modules D1 and D3 and the cathode-anode connection of the modules D2 and D3 are preferable while considering that the number of modules of the upper arm is 1 and the number of modules of the lower arm is 2. Can be implemented. Thereby, the formation of the wiring in the circuit board 71 can be optimized.

  In the circuit board 71, the three through holes 73 provided for each of the modules D1 to D3 are arranged so that the cathode connecting through hole 73b is sandwiched between the anode connecting through holes 73a (the cathode central arrangement). Also, the wiring patterns X1, X2, Y1, Y2 (first and second patterns) and the wiring patterns X3, Y3, X4, Y4 (third and fourth patterns) are opposite to each other in plan view of the circuit board 71. It was formed to extend to the side. Thereby, the wiring pattern for modules D1-D3 can be suitably arranged in plane.

  In the circuit board 71, the three through-holes 73 of the upper arm module D3 are arranged in a staggered manner, the cathode through-holes 73b are shifted in the extending direction of the wiring pattern Y3, and the pair of slits 74 are expanded on the wiring pattern Y3 side. It was provided so as to have a tapered shape. In this case, the wiring pattern Y3 is electrically connected to the cathode through hole 73b existing between the pair of slits 74.

  The wiring patterns X1 and Y1 and the wiring patterns X2 and Y2 were provided in different wiring layers so as to be in the same position in plan view of the substrate. Further, the wiring patterns X3 and Y3 and the wiring patterns X4 and Y4 are provided in different wiring layers so that a part of the wiring pattern X4 and a part of the wiring pattern Y3 intersect each other in plan view of the substrate. In this case, it is possible to design an appropriate artwork using the multilayer structure of the circuit board 71.

  The modules D1 to D3 are arranged in a row in a direction crossing the arrangement direction of the transformer 30 and the choke coil 45 (smoothing circuit 47), and the modules D1 to D3 and the transformer 30 are arranged in a row in a plan view of the board. Wiring patterns X1, Y1, X2, and Y2 were formed at a position between the two. In this case, the wiring length can be shortened in the connection between the transformer 30 and the rectifier circuit 40. In the wiring patterns X1, Y1, X2, and Y2, AC power is switched at a high frequency. However, by shortening the wiring length, it is possible to suppress inconveniences such as noise generation due to a high frequency operation.

  When all of the lower arm modules D1 and D2 and the upper arm module D3 are configured by a three-terminal module, there is a risk of erroneous assembly. In this regard, since the lower arm modules D1 and D2 and the upper arm module D3 have different staggered patterns of the three through-holes 73, specifically, they have mutually opposite patterns. Assembly can be prevented.

  When the rectifier circuit 40 is configured by the three modules D1 to D3 as described above, the lower arm modules D1 and D2 are alternately turned on according to the switching operation of the switching circuit 20, whereas the upper arm module D3 It is continuously turned on. That is, in the upper arm module D3, the energization time is doubled with respect to the lower arm modules D1 and D2, and the amount of heat generation is increased accordingly. Therefore, it is conceivable to make the heat resistance performance different between the lower arm modules D1 and D2 and the upper arm module D3. Thus, if each module becomes a part of a different specification, there may be a problem associated with incorrect assembly. However, by preventing misassembly as described above, it is possible to suppress the occurrence of inconvenience associated with misassembly.

  In the power conversion device 10, the two DDC circuits 11 are constructed using one circuit board 71, but the configuration of the rectifier circuit 40 is simplified as described above, so that the power conversion device 10 is small. It will be able to greatly contribute to the transformation.

(Other embodiments)
You may change the said embodiment as follows, for example.

  Of the three modules D1 to D3 provided as the rectifier circuit 40, a three-terminal diode module (anode 2 terminal and cathode 1 terminal module) is used as the upper arm module D3, and two terminals are used as the lower arm modules D1 and D2. A diode module (a module with one anode and one cathode) may be used.

  In the above embodiment, the modules D1 to D3 are fixed to the bottom 63 of the housing case 61 in the power conversion device 10, and the terminals of the modules D1 to D3 are inserted into the through holes 73 of the circuit board 71 in that state. However, this may be changed. For example, the modules D1 to D3 may be directly mounted on the substrate surface side of the circuit board 71.

  DESCRIPTION OF SYMBOLS 10 ... Power converter, 11 ... DDC circuit, 40 ... Rectifier circuit, 41-44 ... Diode, 51, 52 ... Anode terminal, 53 ... Cathode terminal, 54, 55 ... Diode chip, D1, D2 ... Lower arm module, D3 … Upper arm module.

Claims (7)

A power converter comprising a bridge-type rectifier circuit (40) for rectifying an alternating voltage,
The rectifier circuit includes a plurality of diodes (41 to 44) provided on the upper arm and the lower arm, respectively.
Among the plurality of diodes, the diodes (43, 44) provided on the upper arm are integrally packed with two diode chips (54, 55) provided in parallel with each other, and two anode terminals (51, 52). And an upper arm module (D3) composed of a three-terminal diode module having one cathode terminal (53),
The diode (41, 42) provided in the lower arm is composed of two lower arm modules (D1, D2),
The two anode terminal of the upper arm module, are respectively connected to the cathode terminal of the lower arm module Oite to the lower arm branching to two-way, the cathode terminal of the upper arm module positive side of the rectifier circuit Connected to the output ,
The power conversion device according to claim 1, wherein the upper arm module is disposed at a position sandwiched between the two lower arm modules . A circuit board (71) having a predetermined wiring pattern (X1 to X4, Y1 to Y4) including a portion for performing input / output of the rectifier circuit,
The circuit board is electrically connected to an anode terminal and a cathode terminal of the upper arm module, and is electrically connected to an anode terminal and a cathode terminal of the lower arm module,
The circuit board has a first pattern (X1, Y1) and a second pattern (X2) that individually connect the two anode terminals of the upper arm module to the cathode terminals of the two lower arm modules as the wiring pattern. , Y2). The circuit board has three through holes (73a, 73b) through which the anode and cathode terminals of the upper arm module are inserted, respectively, and is electrically connected to the cathode terminal of the upper arm module as the wiring pattern. Having a third pattern (X3, Y3);
Of the three through holes, a cathode connecting through hole (73b) of the upper arm module is disposed in the center, and two through holes (73a) for anode connection of the upper arm module are disposed on both sides thereof. And
The said 3rd pattern is formed so that it may extend in the opposite side of the said 1st pattern and the said 2nd pattern from the through-hole for cathode connection of the said upper arm module in planar view of the said circuit board. The power converter described. In the circuit board, the cathode connecting through hole of the upper arm module is shifted in the extending direction of the third pattern with respect to a straight line connecting the two through holes for anode connecting of the upper arm module. These three through holes are arranged in a staggered manner, while slits (74) are formed that open at two positions between the through holes for cathode connection and the two through holes for anode connection. ,
4. The power conversion device according to claim 3, wherein the slit is provided to have a tapered shape in which a side of the third pattern is expanded with respect to a side of the first pattern and the second pattern. The circuit board is a multilayer board having a plurality of wiring layers in the board thickness direction, and the circuit board further includes a fourth pattern (X4, Y4) respectively connected to the anode terminals of the two lower arm modules. Have
5. The power conversion device according to claim 3, wherein the third pattern and the fourth pattern are provided in different wiring layers so as to cross each other in a plan view of the circuit board. A transformer (30) for outputting the AC voltage to the rectifier circuit, and a smoothing circuit (47) for smoothing the output voltage after rectification by the rectifier circuit,
In a portion sandwiched between the transformer and the smoothing circuit, the upper arm module and the two lower arm modules are arranged in a line in a direction crossing the arrangement direction of the transformer and the smoothing circuit. ,
6. The first pattern and the second pattern are formed at a position between the modules arranged in the row and the transformer in a plan view of the circuit board. The power converter device described in 1. The two lower arm modules are composed of the three-terminal diode module, similar to the upper arm module,
The circuit board is arranged so as to have a staggered positional relationship with each other in each of the lower arm module and the upper arm module, and has three through holes (73) through which the three terminals are inserted, respectively.
The power converter according to any one of claims 2 to 6, wherein the lower arm module and the upper arm module have different staggered patterns of the three through holes.

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