JP6264212B2 - Power converter - Google Patents

Description

The present invention relates to a power conversion device.

  A hybrid vehicle, an electric vehicle, and the like are equipped with a DC-DC converter that is a power conversion device for converting a voltage of DC power into a different voltage. The DC-DC converter has a plurality of electronic components such as a transformer, a primary side circuit component, a secondary side circuit component, and a choke coil. An example of such a DC-DC converter is disclosed in Patent Document 1. The DC-DC converter disclosed in Patent Document 1 has a plurality of electronic components arranged in a plane on a base plate.

JP 2007-221919 A

  However, when a plurality of electronic components are arranged side by side on the base plate as in the DC-DC converter described in Patent Document 1, an arrangement space for arranging the plurality of electronic components in the plane direction of the base plate is secured. There is a need. Therefore, there exists a problem that a DC-DC converter tends to enlarge in the plane direction of a baseplate.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a power converter that can be miniaturized.

The present invention, transformer and a primary side circuit portion constituting a primary circuit which is electrically connected to the primary coil of the transformer, the secondary coil of the transformer having a primary coil and a secondary coil In a power conversion device comprising a secondary side circuit unit that constitutes a secondary side circuit electrically connected to the secondary side circuit unit, and a choke coil that is electrically connected to the secondary side circuit unit, the primary side circuit unit and the The secondary circuit portion is integrated to form a composite semiconductor component, the transformer is stacked on the composite semiconductor component to form a first stacked region, and the choke coil is connected to the composite semiconductor component The power conversion device is characterized in that the second laminated region is laminated.

  In the power conversion device of the present invention, the transformer and the choke coil are stacked on the composite semiconductor component to form a first stacked region and a second stacked region, respectively. Therefore, the arrangement space of the transformer and the choke coil can be omitted as compared with the configuration in which the transformer, the choke coil, and the composite electronic component are all arranged in the plane direction of the base plate. Therefore, the power converter in the planar direction of the base plate can be reduced in size.

Explanatory drawing of the power converter device in Example 1. FIG. The A arrow directional view in FIG. The circuit diagram of the power converter device in Example 1. FIG. Explanatory drawing of the power converter device in Example 2. FIG. B arrow view in FIG. Explanatory drawing of the power converter device in Example 3. FIG. C arrow line view in FIG. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example. Explanatory drawing of the power converter device in another Example.

Example 1
The power converter in a present Example is demonstrated using FIGS. 1-3.

  The power converter 1 in the present embodiment is a DC-DC converter 1 for converting a DC voltage supplied from a DC power source into a different voltage. As shown in FIG. 1, the DC-DC converter 1 includes a transformer 2, a primary side circuit unit 4, a secondary side circuit unit 5, a choke coil 3, a plurality of connecting members 7, a primary DC wiring 100 and a secondary DC wiring 31. Have The transformer 2 is for transforming input AC power, and has a primary coil 21 and a secondary coil 22. The primary side circuit unit 4 and the transformer 2, the transformer 2 and the secondary side circuit unit 5, and the secondary side circuit unit 5 and the choke coil 3 are electrically connected. The connection member 7 in the present embodiment is made of a conductive member, and electrically connects the primary side connection member 72 that electrically connects the primary side circuit portion 4 and the transformer 2, and the transformer 2 and the secondary side circuit portion 5. The intermediate connection member 71 and the secondary side connection member 73 that electrically connects the secondary side circuit unit 5 and the choke coil 3 are provided. The primary DC wiring 100 electrically connects the DC power supply 10 (see FIG. 3) and the primary side circuit unit 4. The secondary DC wiring 31 electrically connects the choke coil 3 and the low-voltage DC power supply 13. The primary side connection member 72 and the intermediate connection member 71 are alternating current wirings, and the primary direct current wiring, the secondary direct current wiring, and the secondary side connection member 73 are direct current wirings.

  Next, a circuit diagram of a voltage conversion circuit in the DC-DC converter 1 will be described with reference to FIG. The voltage conversion circuit according to the present embodiment includes a high-voltage DC power source 10, a primary side circuit unit 4, a transformer 2, a secondary side circuit unit 5, a choke coil 3, smoothing capacitors 11 and 12, and a low-voltage DC power source 13. The primary side circuit unit 4 is electrically connected to the positive and negative electrodes of the high-voltage DC power supply 10 by the primary DC wiring 100. The primary side circuit unit 4 includes four switching elements 110, and these four switching elements 110 constitute an H bridge circuit. An output terminal 72 of the primary side circuit unit 4 is connected to the transformer 2.

  The transformer 2 has a primary coil 21 and a secondary coil 22. The output terminal 72 of the primary side circuit unit 4 is connected to the primary coil 21. The output terminal 71 of the secondary coil 22 is connected to the secondary side circuit unit 5. The center tap 52 of the secondary coil 22 is connected to the ground.

  The secondary side circuit unit 5 includes two diodes 111. The output terminal 73 of the secondary side circuit unit 5 is connected to the choke coil 3. A smoothing capacitor 12 is connected between the output terminal 31 of the choke coil 3 and the ground. A low voltage DC power supply 13 is connected to the output terminal 31 of the choke coil 3.

  As an operation of this circuit, the control circuit board (not shown) controls the operation of the switching element 110 of the primary side circuit unit 4 so that the DC voltage supplied from the high-voltage DC power supply 10 through the primary DC wiring 100 is AC. Is applied to the primary coil 21. Then, the primary coil 21 and the secondary coil 22 step down the primary voltage converted into alternating current to generate a secondary voltage. Next, the output AC current of the secondary coil 22 is rectified using the diode 111 of the secondary side circuit unit 5 to obtain DC power. The output current rectified using the choke coil 3 is smoothed. Further, the output voltage of the secondary side circuit unit 5 is smoothed using the smoothing capacitor 12. Note that the circuit configuration of the power conversion device 1 in the present embodiment is not limited to that in FIG. 3. For example, the number of switching elements 110 in the primary side circuit unit 4 is not limited to that in FIG. It may be.

  Next, the main part of a present Example is demonstrated.

  As shown in FIG. 1, the primary side circuit portion 4 and the secondary side circuit portion 5 are integrally sealed with resin to constitute a composite semiconductor component 6. In addition, you may integrate the primary side circuit part 4 and the secondary side circuit part 5 by accommodating in one housing | casing. The composite semiconductor component 6 is fixed on a metal base plate 8. Hereinafter, the normal direction of the base plate 8 is referred to as a stacking direction Z, and the planar direction of the base plate 8 in FIG. The transformer 2 and the composite semiconductor component 6 are stacked in the stacking direction Z to form a first stacked region 61. The choke coil 3 and the composite semiconductor component 6 are stacked in the stacking direction Z to form a second stacked region 62. Specifically, as shown in FIG. 1, in the stacking direction Z, the transformer 2 and the primary side circuit unit 4 are arranged on a straight line, and the choke coil 3 and the secondary side circuit unit 5 are arranged on a straight line. ing. The direction in which the transformer 2 is laminated and the direction in which the choke coil 3 is laminated are parallel to each other. In the stacking direction Z, a non-stacked region 63 where the transformer 2 and the choke coil 3 are not stacked exists on the opposite side of the composite semiconductor component 6 from the base plate 8. In the present specification, the non-stacked region 63 corresponds to a region surrounded by at least one of the transformer 2 and the choke coil 3 and the composite semiconductor component 6.

  One end of the primary side connection member 72 is connected to one surface of the primary side circuit portion 4 opposite to the base plate 8, and the other end is connected to a side surface facing the second stacked region 62 of the transformer 2. One end of the intermediate connection member 71 is connected to one surface opposite to the base plate 8 of the secondary side circuit unit 5, and the other end is connected to a side surface facing the second laminated region 62 of the transformer 2. One end of the secondary side connection member 73 is connected to one surface of the secondary side circuit unit 5 opposite to the base plate 8, and the other end is connected to the side surface of the choke coil 3 facing the first laminated region 61. ing. The primary DC wiring 100 is connected to the side surface opposite to the second stacked region 62 of the primary side circuit unit 4. The secondary DC wiring 31 is connected to the side surface of the choke coil 3 opposite to the first laminated region 61 and is disposed so as to pass through the region S3. The primary DC wiring 100, the primary side connection member 72, and the intermediate connection member 71 are arranged on the opposite side with the first stacked region 61 interposed therebetween. The secondary DC wiring 31, the primary side connection member 72, and the intermediate connection member 71 are disposed on the opposite side with the second stacked region 62 interposed therebetween.

  The primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are disposed in the non-stacked region 63. Specifically, they are arranged so as to be within a region S1 surrounded by the transformer 2, the choke coil 3 and the composite semiconductor component 6. Further, as shown in FIG. 2, the transformer 2, the choke coil 3, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are within the projection plane of the composite semiconductor component 6 in the stacking direction Z. Is arranged. The connection member 7 may be formed of a conductive bus bar or a terminal such as a coil.

  Next, the effect of the power converter device 1 of a present Example is demonstrated.

  (1) The transformer 2 and the choke coil 3 are stacked on the composite semiconductor component 6 to form a first stacked region 61 and a second stacked region 62, respectively. Therefore, as compared with the configuration in which the transformer 2, the choke coil 3 and the composite semiconductor component 6 are arranged side by side in the plane direction X on the base plate 8, a space for arranging the transformer 2 and the choke coil 3 in the plane direction X. Can be omitted. Therefore, the power converter 1 in the planar direction X can be reduced in size.

  (2) The transformer 2, the choke coil 3, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are arranged so as to be within the projection plane of the composite semiconductor component 6 in the stacking direction Z. Therefore, the physique of the power conversion device 1 in the plane direction X is equivalent to the physique of the composite semiconductor component 6. Therefore, any one of the transformer 2, the choke coil 3, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 is compared with the configuration arranged outside the projection surface of the composite semiconductor component 6. Thus, the power conversion device 1 can be downsized.

  (3) The primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are arranged so as to be accommodated in the non-stacked region 63. Therefore, the physique of the power conversion device 1 in the stacking direction Z is equivalent to the physique of the first stacked region 61 or the second stacked region 62. Therefore, as compared with the configuration in which any one of the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 is disposed outside the non-stacked region 63, the power conversion device 1 can be downsized. Is possible.

(Example 2)
Next, Example 2 will be described with reference to FIGS. However, description of parts substantially the same as those of the first embodiment will be omitted or simplified, and parts different from those of the first embodiment will be mainly described.

  In the present embodiment, one end of the primary side connection member 72 is connected to one surface on the opposite side to the base plate 8 of the primary side circuit portion 4, and the other end is on the opposite side to the second laminated region 62 of the transformer 2. Connected to the side. One end of the intermediate connection member 71 is connected to one surface opposite to the base plate 8 of the secondary side circuit unit 5, and the other end is connected to a side surface facing the second laminated region 62 of the transformer 2. One end of the secondary side connection member 73 is connected to one surface on the opposite side of the base plate 8 of the secondary side circuit portion 5, and the other end is connected to the side surface on the opposite side to the first laminated region 61 of the choke coil 3. Has been.

  The primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are disposed in the non-stacked region 63. Specifically, the primary side connection member 72 is disposed so as to be within the region S <b> 2 opposite to the second stacked region 62 and surrounded by the transformer 2 and the composite semiconductor component 6. Further, the secondary side connection member 73 is disposed so as to be within the region S3 opposite to the first stacked region 61 and surrounded by the choke coil 3 and the composite semiconductor component 6.

  Also in the power converter device 1 of this example, the same effect as that of the first embodiment can be obtained.

(Example 3)
Next, Example 3 will be described with reference to FIGS. However, description of parts substantially the same as those in the first and second embodiments will be omitted or simplified, and parts different from the first and second embodiments will be mainly described.

  As shown in FIG. 6, the power conversion device 1 according to the present embodiment includes a case 9 that houses a transformer 2, a choke coil 3, a composite semiconductor component 6, and a plurality of connection members 7.

  The case 9 includes a first side wall 91 adjacent to the first stacked region 61, a second side wall 92 adjacent to the second stacked region 62, and two relay side walls connecting the first side wall 91 and the second side wall 92. 94, and a bottom wall portion 93 that closes a space surrounded by the first side wall portion 91, the second side wall portion 92, and the two relay side wall portions 94.

  The composite semiconductor component 6 is fixed to the bottom wall portion 93 and is in contact with the inner walls of the first side wall portion 91, the second side wall portion 92, and the two relay side wall portions 94. The transformer 2 and the choke coil 3 are separated from the first side wall 91, the second side wall 92, and the two relay side walls 94.

  In the present embodiment, the primary side connection member 72 is connected to the transformer connection part 721 directly connected to the transformer 2, the primary side relay part 722 and the primary side relay part 722 formed continuously to the transformer connection part 721. The primary side circuit connection part 723 formed and directly connected to the primary side circuit part 4 is provided. One end of the transformer connection portion 721 is connected to the side surface of the transformer 2 opposite to the second stacked region 62, extends in the plane direction X, and the other end is inserted into the first side wall portion 91. One end of the primary side relay portion 722 is connected to the end portion of the transformer connection portion 721 that is inserted into the first side wall portion 91, extends in the stacking direction Z, and the other end of the primary side circuit connection portion 723. Connected to one end. The primary side relay portion 722 is completely sealed by the first side wall portion 91 of the case 9. One end of the primary side circuit connection portion 723 is connected to the end portion of the primary side relay portion 722 opposite to the side to which the transformer connection portion 721 is connected. The primary side circuit part 4 is connected to the side surface in contact with the first side wall part 91.

  The secondary side connection member 73 is continuous to the choke coil connection part 731 directly connected to the choke coil 3, the secondary side relay part 732 formed continuously to the choke coil connection part 731, and the secondary side relay part 732. And a secondary circuit connection part 733 that is directly connected to the secondary circuit part 5. One end of the choke coil connection portion 731 is connected to the side surface of the choke coil 3 opposite to the first laminated region 61, extends in the plane direction X, and the other end is inserted into the second side wall portion 92. One end of the secondary side relay portion 732 is connected to the end portion of the choke coil connection portion 731 on the side inserted into the second side wall portion 92, extends in the stacking direction Z, and the other end is connected to the secondary side circuit. It is connected to one end of the part 733. The secondary side relay part 732 is completely sealed by the second side wall part 92 of the case 9. One end of the secondary side circuit connection part 733 is connected to the end of the secondary side relay part 732 opposite to the side to which the choke coil connection part 731 is connected, and extends in the planar direction X. The other end is connected to the side surface in contact with the second side wall portion 92 of the secondary circuit portion 5.

  One end of the intermediate connection member 71 is connected to one surface opposite to the bottom wall portion 93 of the secondary side circuit portion 5, and the other end is connected to a side surface facing the second stacked region 62 of the transformer 2. Yes.

  The primary side connection member 72, a part of the secondary side connection member 73, and the intermediate connection member 71 are disposed in the non-stacked region 63. Specifically, a part of the transformer connection part 721 is disposed in the region S2. A part of the choke coil connection portion 731 is disposed in the region S3.

  As shown in FIG. 6, the transformer 2, the choke coil 3, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are arranged so as to fit within the outer shape of the case 9 in the planar direction X. . Further, as shown in FIG. 7, the transformer 2, the choke coil 3, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are arranged so as to be within the projection plane of the case 9 in the stacking direction Z. Has been. In FIGS. 6 and 7 in the present embodiment, the primary DC wiring 100 and the secondary DC wiring 31 are omitted.

  Next, the effect of the power converter device 1 in a present Example is demonstrated.

  In the power conversion device 1 of the present embodiment, the primary side connection member 72 and the secondary side connection member 73 are partially sealed in the case 9. Further, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are disposed so as to be within the outer shape of the case 9 in the plane direction X and within the projection plane of the case 9 in the stacking direction Z. By adopting such a configuration, even when it is not possible to ensure a sufficient space for accommodating all of the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 in the non-laminated region 63, The space of the case 9 can be utilized to arrange the connecting member 7. Therefore, the physique of power converter 1 provided with case 9 does not become large compared with the composition which leaves the space for arranging connecting member 7 inside case 9. Therefore, the power conversion device 1 can be downsized as compared with a configuration in which a space for disposing the connection member 7 is provided inside the case 9.

  In addition, the same effects as those of the first embodiment can be obtained.

(Other examples)
In addition, this invention is not limited to the said Example, As long as it belongs to the technical scope of this invention, you may deform | transform as follows.

  -In the said Example 1, although the primary side connection member 72, the secondary side connection member 73, and the intermediate | middle connection member 71 are arrange | positioned so that all may be settled in area | region S1, some are arrange | positioned outside area | region S1. May be. For example, as shown in FIG. 8, one end of the secondary side connection member 73 may be connected to the side surface of the choke coil 3 opposite to the first laminated region 61. In this case, the primary side connection member 72 is disposed so as to be within the region S1, and the secondary side connection member 73 is disposed so as to be within the region S3. On the other hand, the primary side connection member 72 may be disposed so as to be within the region S2, and the secondary side connection member 73 may be disposed so as to be within the region S1. In the case of this modification, the primary DC wiring 100 that is a DC wiring, and the primary side connection member 72 and the intermediate connection member 71 that are AC wirings are arranged on the opposite side across the first stacked region 61. Further, the secondary DC wiring 31 and the secondary side connection member 73 that are DC wirings, and the primary side connection member 72 and the intermediate connection member 71 that are AC wirings are arranged on the opposite side across the second stacked region 62. Yes. Therefore, the first laminated region 61 and the second laminated region 62 serve as noise shielding, and noise caused by the alternating current flowing through the primary side connecting member 72 and the intermediate connecting member 71 is caused by the primary DC wiring 100 and the secondary DC wiring 31. Can be suppressed.

  In the first embodiment, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are all disposed so as to be within the non-laminated region 63, but a part thereof is outside the non-laminated region 63. It may be arranged to pass through. For example, as shown in FIG. 9, one end of the primary side connection member 72 is connected to one surface of the transformer 2 opposite to the composite semiconductor component 6, and one end of the secondary side connection member 73 is the composite semiconductor of the choke coil 3. The structure connected to the one surface on the opposite side to the component 6 may be sufficient.

  In the above embodiment, the primary side connection member 72, the secondary side connection member 73, and the intermediate connection member 71 are all disposed outside the first laminated region 61 and the second laminated region 62, but as shown in FIG. In addition, the primary side connection member 72 may be disposed in the first stacked region 61, and the secondary side connection member 73 may be disposed in the second stacked region 62. In FIG. 10, the transformer 2 and the choke coil 3 are separated from the composite semiconductor component 6, but may be connected in a contact state.

  In the above embodiment, the transformer 2 and the primary side circuit unit 4, and the choke coil 3 and the secondary side circuit unit 5 are arranged on a straight line in the stacking direction Z. However, as shown in FIG. And the secondary side circuit unit 5, the choke coil 3, and the primary side circuit unit 4 may be arranged on a straight line in the stacking direction Z, respectively. In this case, as an example of the arrangement of the connection member 7, the primary side connection member 72 and the secondary side connection member 73 can be arranged in the region S1, and the intermediate connection member 71 can be arranged in the region S3. Moreover, as an example of the connection method of the connection member 7, the connection aspect of the primary side connection member 72 and the secondary side connection member 73 is the same as that of the said Example 1, and the intermediate connection member 71 has one end of the transformer 2 at one end. A mode is conceivable in which the second laminated region 62 is connected to the opposite side surface, and the other end is connected to one side of the secondary circuit portion 5 opposite to the base plate 8.

  In the third embodiment, a part of the primary side connection member 72 is sealed by the first side wall part 91 and a part of the secondary side connection member 73 is sealed by the second side wall part 92. One of the member 72 and the secondary side connection member 73 may not be sealed by the first side wall 91 or the second side wall 92. For example, as shown in FIG. 12, even if a part of the primary side connection member 72 is sealed in the first side wall portion 91 and the secondary side connection member 73 is disposed so as to be within the region S3. Good.

  In the above embodiment, the transformer 2 and the choke coil 3 are spaced apart from each other, but may be disposed so as to contact each other directly or indirectly. In FIG. 12, the primary DC wiring 100 and the secondary DC wiring 31 are omitted.

  In the third embodiment, the transformer 2 and the choke coil 3 are partially in contact with the case 9, but may be separated from each other. Moreover, the part which is partly separated may contact. For example, there may be a case where there are no regions S2 and S3 in the non-stacked region 63.

  In the above embodiment, in the stacking direction Z, the transformer 2 and the choke coil 3 are arranged so as to be aligned with the primary circuit section 4 or the secondary circuit section 5, but as viewed from the stacking direction Z. Sometimes, they may be arranged in a state where they are displaced from each other in the plane direction X.

  -In the said Example, although the connection member 7 is arrange | positioned in the position facing the side surface of the 1st lamination | stacking area | region 61 or the 2nd lamination | stacking area | region 62 in the plane direction X, as shown in FIG. 72 may be disposed at a position facing the side surface of the first stacked region 61 in a direction orthogonal to both the planar direction X and the stacking direction Z. Further, as shown in FIG. 14, the secondary side connection member 73 may be disposed at a position facing the side surface of the second stacked region 62 in a direction orthogonal to both the plane direction X and the stacking direction Z.

  In the third embodiment, a part of the connection member 7 is sealed in the case 9, but at least one of the composite semiconductor component 6, the first side wall portion 91, the second side wall portion 92, and the relay side wall portion 94. These may be separated from each other and may be arranged in the separated space.

  In the above embodiment, the primary DC wiring 100 and the secondary DC wiring 31 are connected to the side of the primary side circuit portion 4 and the choke coil 3 in the arrangement direction X of the first stacked region 61 and the second stacked region 62, respectively. However, when connected to the side surfaces of the primary circuit section 4 and the choke coil 3 in the direction orthogonal to both the arrangement direction X and the stacking direction Z, or the primary circuit section 4 and the choke coil 3 in the stacking direction Z. It may be connected to the side surface on the side opposite to the base plate 8.

  In the third embodiment, the primary side connection member 72 and the secondary side connection member 73 are partially sealed with the first side wall 91 and the second side wall 92, respectively. It may be stopped.

In the above embodiment, the transformer 2 and the choke coil 3 are disposed so as to be within the projection region of the composite semiconductor component 6 in the stacking direction Z. However, a part of the transformer 2 and the choke coil 3 is a composite semiconductor component. 6 may be arranged outside the projection area.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Transformer 3 Choke coil 4 Primary side circuit part 5 Secondary side circuit part 6 Composite semiconductor component 61 1st lamination | stacking area | region 62 2nd lamination | stacking area | region 63 Non lamination | stacking area | region 7 Connection member 71 Intermediate connection member 72 Primary side connection member 73 Secondary side connecting member 9 Case 91 First side wall 92 Second side wall 93 Bottom wall

Claims (5)

A transformer (2) having a primary coil (21) and a secondary coil (22);
A primary circuit part (4) constituting a primary circuit electrically connected to the primary coil (21) side of the transformer (2);
A secondary side circuit section (5) constituting a secondary side circuit electrically connected to the secondary coil (22) side of the transformer (2);
In a power converter (1) comprising a choke coil (3) electrically connected to the secondary circuit part (5),
The primary circuit part (4) and the secondary circuit part (5) are integrated to form a composite semiconductor component (6),
The transformer (2) is stacked on the composite semiconductor component (6) to form a first stacked region (61),
The choke coil (3) is stacked on the composite semiconductor component (6) to form a second stacked region (62);
The power converter device (1) characterized by these. A plurality of connecting members (7) for electrically connecting the transformer (2), the primary side circuit portion (4), the secondary side circuit portion (5) and the choke coil (3);
At least a part of the plurality of connection members (7) is disposed in the projection plane of the composite semiconductor component (6) in the direction in which the transformer (2) and the choke coil (3) are stacked. ,
The power converter (1) according to claim 1, characterized in that: At least some of the plurality of connecting members (7) are disposed in a region surrounded by at least one of the transformer (2) and the choke coil (3) and the composite semiconductor component (6);
The power conversion device (1) according to claim 2, characterized in that: Wherein the plurality of connecting members (7), the transformer (2) and the primary-side connecting member for electrically connecting a primary side circuit portion (4) (72), the choke coil (3) and the secondary side A secondary connection member (73) for electrically connecting the circuit section (5); and an intermediate connection member (71) for electrically connecting the transformer (2) and the secondary circuit section (5). And
Before Symbol intermediate connecting member (71) is opposed to the side of the plane direction orthogonal to the direction in which the transformer (2) and said choke coil in the first stack region (61) (3) is laminated, yet, the It is disposed at a position facing the side surface in the planar direction in the second stacked region (62) ,
The primary side connection member (72) is on a side surface in the direction perpendicular to both the direction in which the transformer (2) and the choke coil (3) are laminated in the first lamination region (61) and the planar direction. Placed in the opposite position,
It said secondary-side connection member (73) in the direction perpendicular to both of said planar direction in which the transformer (2) and said choke coil prior Symbol second stack region (62) (3) are laminated being disposed in a position facing the side surface,
The power converter device (1) according to claim 2 or 3, characterized by the above. A DC power source (10) for supplying DC power to the power conversion device (1) according to claim 2 and a primary DC wiring (100) for electrically connecting the primary side circuit unit (4),
The plurality of connecting members (7) include a primary side connecting member (72) for electrically connecting the transformer (2) and the primary side circuit portion (4), and the transformer (2) and the secondary side circuit portion. An intermediate connecting member (71) for electrically connecting (5);
The primary DC wiring (100), the primary side connection member (72), and the intermediate connection member (71) are disposed on the opposite side across the first laminated region (61),
The power converter device (1) according to any one of claims 2 to 4, characterized in that:

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