JP6156680B2 - Substrate thickness measuring device - Google Patents

Description

  The present invention relates to a substrate thickness measuring apparatus, and more particularly to a substrate thickness measuring apparatus that can measure the thickness of a curved substrate.

  In order to measure the thickness of the curved substrate, for example, as shown in the explanatory diagrams of FIGS. 4 and 5, a substrate thickness measuring apparatus in which the substrate 2 is sandwiched between a pair of spherical surfaces has been proposed ( For example, see Patent Documents 1 and 2).

Japanese Utility Model Publication No. 01-051805 Japanese Utility Model Publication No. 02-039107

  However, the above-described substrate thickness measuring apparatus requires an operation of adjusting the height of a ball, a contact or the like that contacts the lower surface of the substrate. Since the measurement is performed with the upper surface side of the substrate protruding, handling of the substrate is troublesome when the substrate is attached or detached or positioned. Therefore, it is difficult to perform measurement work efficiently.

  Further, in the substrate thickness measuring apparatus of the above method, since both ends of the curved substrate are in contact with the base plate, the end portion of the substrate having low mechanical strength may be damaged.

  Further, in the substrate thickness measuring apparatus of the above method, the size of the substrate that can be measured is limited by the size of the base plate.

  Further, depending on the substrate, irregularities may be formed on the main surface by external electrodes or the like. When the thickness of such a substrate is measured using the above-described substrate thickness measuring apparatus, the measured value of the substrate thickness may vary depending on the position where the spherical surface contacts the main surface of the substrate.

  In view of such circumstances, the present invention is capable of (a) performing measurement work efficiently, (b) preventing damage to the substrate, (c) limiting the size of the substrate that can be measured, d) An object of the present invention is to provide a substrate thickness measuring apparatus capable of suppressing variations in measured values of substrate thickness.

  In order to solve the above problems, the present invention provides a substrate thickness measuring apparatus configured as follows.

The substrate thickness measurement apparatus includes one substrate support member having a substrate support surface and an opening. The substrate support surface includes a facing portion where the gauges face each other with a space therebetween, and a peripheral portion surrounding the facing portion. The opening is formed in the peripheral portion, surrounds the facing portion, and is vacuumed. The substrate supporting surface is placed so that a main surface of the curved substrate protruding side faces the facing portion, and a part of the substrate is sucked and held by vacuum suction from the opening. and it is configured so that Ru is. The substrate support surface has a smaller area than the substrate. While the part of the substrate is adsorbed and held on the substrate support surface, the height of the part of the main surface on the retracted side of the substrate facing the gauge is measured using the gauge. To do.

  In the above configuration, since the opening surrounds the facing portion, the curved substrate can be adsorbed and held.

  According to the above configuration, there is no need to adjust the height of a ball, a contact or the like that contacts the lower surface of the substrate. Since the bent end of the substrate can be floated when the substrate is attached or detached or positioned, the substrate can be handled easily. Therefore, the measurement work can be performed efficiently.

  Further, the curved substrate can be prevented from floating in the air and coming into contact with other members except for the portion to be adsorbed. Thereby, damage to the substrate can be prevented.

  Further, since the measurement location of the substrate and its vicinity are adsorbed and held on the substrate support surface, the size of the substrate that can be measured is not easily restricted.

  Furthermore, when unevenness is formed on the main surface of the substrate, the measurement value of the substrate thickness varies by measuring the thickness of the substrate in a state where the main surface on which the unevenness is formed is opposed to the flat facing portion. Can be suppressed.

Group Ita支lifting surface has a smaller area than the board.

  In this case, the substrate support member can be reduced in size.

Preferably, the substrate thickness measuring apparatus further includes an auxiliary member having an auxiliary surface. The auxiliary surface is disposed around the substrate supporting lifting surface, a portion of the substrate by vacuum suction from the opening is opposed to the substrate without interfering with the substrate when it is held adsorbed.

  In this case, the substrate can be prevented from being damaged by the auxiliary member. For example, the impact applied to the substrate when the substrate protruding from the substrate support portion falls due to suction release or the like can be mitigated by the auxiliary member.

  Preferably, the opening has an annular shape surrounding the opposed portion.

  In this case, since the force for adsorbing and holding the substrate can be made constant regardless of the direction in which the substrate is disposed with respect to the substrate support surface, the direction in which the substrate is disposed with respect to the substrate support surface can be freely selected. Measurement work becomes easier.

  According to the present invention, (a) the measurement operation can be performed efficiently, (b) the substrate can be prevented from being damaged, (c) the size of the substrate that can be measured is hardly restricted, and (d) the substrate The variation in the measured thickness value can be suppressed.

It is explanatory drawing which shows the structure of a board | substrate thickness measuring apparatus. (Example 1) It is (a) top view of a board | substrate support part, (b) principal part sectional drawing. (Example 1) It is a top view of a board | substrate support part. (Modification 1) It is explanatory drawing which shows the structure of a board | substrate thickness measuring apparatus. (Conventional example 1) It is explanatory drawing which shows the structure of a board | substrate thickness measuring apparatus. (Conventional example 2)

  Embodiments of the present invention will be described below with reference to FIGS.

  Example 1 A substrate thickness measuring apparatus 10 of Example 1 will be described with reference to FIGS. 1 and 2.

  FIG. 1 is an explanatory diagram showing the configuration of the substrate thickness measuring apparatus 10. As shown in FIG. 1, the substrate thickness measuring apparatus 10 includes a substrate support member 20 and a gauge 40.

  The substrate support member 20 is installed on the reference surface 12 such as a surface plate, for example. The upper surface 20a of the substrate support member 20 is a flat substrate support surface. The upper surface 20a of the substrate support member 20 is preferably formed using a material that is hard and has excellent wear resistance.

  The gauge 40 is disposed above the substrate support member 20. The gauge 40 is supported, for example, using a magnet base (not shown) that is magnetized and fixed to the reference surface 12. As the gauge 40, a contact type such as a dial gauge is easy to use, but a non-contact type such as an optical distance sensor can also be used.

  FIG. 2A is a plan view of the substrate support member 20. FIG. 2B is a cross-sectional view of the main part taken along line AA in FIG. As shown in FIG. 2, the upper surface 20 a of the substrate support member 20 is circular, but may have other shapes. An annular opening 20b that is vacuum-sucked is formed on the upper surface 20a. A groove 22 communicating with the opening 20 b and a connection hole 24 connected to the groove 22 are formed inside the substrate support member 20. The connection hole 24 is connected to a vacuum source (not shown) and is vacuum-sucked as indicated by an arrow in FIG.

  The inner region surrounded by the opening 20b in the upper surface 20a of the substrate support member 20 includes a facing portion 20s facing the gauge 40 with a gap. That is, the opening 20b surrounds the facing portion 20s. The measurement location of the substrate is placed on the facing portion 20s.

  As shown in FIG. 1, the substrate 2 is mounted using a gauge 40 in a state where the main surface 2 b on the protruding side of the curved substrate 2 faces the upper surface 20 a of the substrate support member 20. The thickness of is measured. Specifically, the substrate 2 is placed so that the main surface 2b of the substrate 2 faces the facing portion 20s of the upper surface 20a of the substrate support member 20, and the substrate 2 is sucked and held by vacuum suction from the opening 20b. In this state, using the gauge 40, the height of the portion of the main surface 2a on the retracted side of the substrate 2 where the gauge 40 faces is measured, and the difference from the height of the facing portion 20s is determined. Calculated as thickness. When the substrate 2 is attached or detached, the vacuum suction is turned off.

  The upper surface 20a of the substrate support member 20 is configured to suck and hold the substrate 2. For example, if the opening 20b is too far from the facing part 20s, too close to the facing part 20s, or the area of the opening 20b is too large or too small, the substrate 2 cannot be adsorbed and held.

  As shown in FIG. 1, when the main surface 2a on the protruding side of the curved substrate 2 is attracted and held by the substrate support member 20, the substrate 2 floats in the air except for the measurement location and its vicinity. It can be made not to touch a member. Thereby, damage to the substrate can be prevented.

  Moreover, since the edge part of the curved board | substrate 2 floats at the time of attachment or detachment of a board | substrate 2, or positioning, the handling of the board | substrate 2 is easy. The substrate thickness measuring apparatus 10 does not need to adjust the height of a ball, a contact, or the like that contacts the lower surface of the substrate. Therefore, the measurement work can be performed efficiently.

  Further, since a part of the substrate 2 is attracted and held, the size of the substrate 2 that can be measured is not easily restricted.

  As shown in FIG. 1, an auxiliary member 30 having an auxiliary surface 30 a may be provided around the substrate support member 20. The auxiliary surface 30a is disposed around the upper surface 20a of the substrate support member 20, and faces the substrate 2 that is attracted and held by vacuum suction from the opening 20b.

  By providing the auxiliary member 30, damage to the substrate 2 can be prevented. For example, the impact applied to the substrate 2 when the substrate 2 that protrudes from the substrate support member 20 drops due to suction release or the like can be mitigated by the auxiliary member 30. The auxiliary member 30 can be formed so as to mitigate the impact on the substrate 2 by selecting an appropriate material.

  The auxiliary surface 30a is preferably the same height as the upper surface 20a of the substrate support member 20 or slightly lower than the upper surface 20a of the substrate support member 20, because the auxiliary member 30 does not become an obstacle when the substrate 2 is attached or detached. The auxiliary surface 30 a may be higher than the upper surface 20 a of the substrate support member 20 as long as it does not interfere with the substrate 2 and does not adversely affect the substrate 2.

  When unevenness is formed on the main surface 2b on the protruding side of the substrate 2, the thickness of the substrate 2 is measured in a state where the main surface 2b on the protruding side is opposed to the flat facing portion 20s. Variations in measured thickness values can be suppressed.

  For example, the substrate 2 is a collective substrate that is divided into individual pieces after measurement. A plurality of elements are mounted on the upper surface of the substrate body, and a resin layer in which the elements are embedded is formed on the upper surface of the substrate body. . Since the resin for forming the resin layer shrinks during curing, the substrate 2 is curved. The substrate 2 has a size of about 70 mm × about 100 mm, and when the one end side of the substrate 2 is sucked and held as shown in FIG. 1B, the other end side of the substrate 2 is lifted by about 10 to 15 mm. Since the substrate 2 is provided with a plurality of external electrodes of the same thickness protruding from the substrate body on the lower surface of the substrate body, the main surface 2b attracted to the substrate support member 20 is formed with irregularities.

  Using the substrate support member 20 in which a groove 22 having an inner diameter of 6.25 mm, an outer diameter of 6.75 mm, and a depth of 0.5 mm is formed on the upper surface 20a of the substrate support member 20 having an outer diameter of about 10 mm, the substrate 2 is mounted. Adsorbed and held, the gauge 40 is used to measure the thickness of a total of five locations near and at the four corners of the substrate 2. The upper surface 20a of the substrate support member 20 is configured such that when the measurement location of the substrate 2 is placed on the facing portion 20s, at least three external electrodes at or near the measurement location of the substrate 2 face the facing portion 20s. Therefore, variation in the measured value of the thickness of the substrate 2 can be suppressed and measurement can be performed with high accuracy.

  As shown in FIG. 2A, when the opening 20b has an annular shape surrounding the facing portion 20s, the substrate 2 can be moved with a constant force regardless of the orientation of the substrate 2 with respect to the substrate support surface 20a. Can be adsorbed and held. Since the direction in which the substrate is arranged with respect to the substrate support portion is not restricted, the measurement operation is facilitated. In addition, the shape of the opening 20b can be an annular shape such as a triangle, a rectangle, a polygon, an ellipse, and a star.

  <Modification 1> Like the substrate support member 20x of Modification 1 shown in the plan view of FIG. 3, a plurality of openings 20q surrounding the opposing portion 20s are formed on the upper surface 20p of the substrate support member 20x, and vacuum is formed from the openings 20q. You may suck. In this case, at least one opening is provided in any of the three regions divided around 120 ° around the opposing portion 20s, preferably 6 regions divided every 60 °, more preferably 12 regions divided every 30 °. If 20q is included, the opening 20q can surround the facing portion 20s. The shape in which the openings 20q are arranged is not limited to the circular shape illustrated, and various shapes such as a triangle, a rectangle, a polygon, an ellipse, and a star can be selected. Further, the shape of the opening is arbitrary, and for example, it may be a shape obtained by dividing an annular shape.

  <Summary> As described above, by forming the opening 20b for vacuum suction on the upper surface 20a of the substrate support member 20, and adsorbing and fixing the curved substrate 2, (a) the measurement operation is efficiently performed. (B) it is possible to prevent damage to the substrate, (c) it is difficult to limit the size of the substrate that can be measured, and (d) variation in the measured value of the thickness of the substrate can be suppressed.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  The substrate thickness measuring apparatus of the present invention can be suitably used when irregularities are formed on the main surface of the substrate or when the substrate is curved, but the application is not limited to these cases. Absent.

2 Substrate 2a, 2b Main surface 10 Substrate thickness measuring device 12 Reference surface 20, 20x Substrate support member 20a, 20p Upper surface (substrate support surface)
20b, 20q opening 20s facing part 22 groove 24 connection hole 40 gauge

Claims (3)

One substrate support member having a planar substrate support surface including a facing portion where the gauges face each other with a gap therebetween and a peripheral portion surrounding the facing portion;
An opening formed in the peripheral portion, surrounding the opposing portion, and being vacuum-sucked;
With
The substrate supporting surface is placed so that a main surface of the curved substrate protruding side faces the facing portion, and a part of the substrate is sucked and held by vacuum suction from the opening. It is configured to be Ru is,
The substrate support surface has a smaller area than the substrate;
While the part of the substrate is adsorbed and held on the substrate support surface, the height of the part of the main surface on the retracted side of the substrate facing the gauge is measured using the gauge. A substrate thickness measuring apparatus. Is disposed around the substrate supporting lifting surface, an auxiliary member having an auxiliary surface facing the substrate without interfering with the substrate when the portion of the substrate by vacuum suction from the opening is held adsorbed, The substrate thickness measuring apparatus according to claim 1, further comprising: The opening is characterized by having an annular shape surrounding the facing portion, the substrate thickness measuring apparatus according to claim 1 or 2.

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