JP6146248B2 - Heat dissipation device - Google Patents

Description

The present invention relates to a heat radiating device that transmits heat generated in a heat-generating component to a heat radiator.

As heat-generating components mounted on electric boards used in communication devices, optical switching devices, optical information processing devices, and the like, those with higher heat generation are employed as the speed increases. In addition, devices to be mounted tend to be miniaturized. Therefore, it is important to increase the heat dissipation efficiency of the heat generating components.

A general heat dissipation structure for a heat generating component mounted on an electric board will be described with reference to FIGS. 16 and 17. FIG. 16 shows a general structure for radiating heat from a plurality of heat generating components on a substrate. Heat generating components 162a and 162b are arranged on the substrate 161, and spacers 165a and 165b standing on the substrate 161 are fixed by screws 166a and 166b, respectively. Next, the fixing blocks 164a and 164b are fixed to the heat radiator 163 with screws or the like, the heat radiation sheet 167a is set on the heat generating component 162a, the heat radiation sheet 167b is set on the heat generating component 162b, and the heat radiator is placed on the spacers 165a and 165b. 163 is set, and the spacers 165a and 165b and the radiator 163 are fixed using screws 168a and 168b. At this time, the heat dissipation sheets 167a and 167b are compressed and sandwiched. In this structure, it is necessary to use a compressible material for the heat radiating sheet, and to make the thickness of the heat radiating sheet thicker than the gap between the heat generating component and the fixed block. Therefore, since the heat radiating sheet is sandwiched between the fixed block and the heat generating component, the heat resistance of the heat radiating sheet portion is large, and the heat of the heat generating component cannot be efficiently radiated to the radiator.

FIG. 17 shows a general structure for radiating heat from a plurality of heat generating components on a substrate. Heat generating components 162a and 162b are arranged on the substrate 161, and spacers 165a, 165b, 165c and 165d standing on the substrate 161 are fixed by screws 166a, 166b, 166c and 166d, respectively. Next, the fixing block 164 is fixed to the radiator 163a with screws or the like. Thermal interface material 167a, 167b is applied over the heat generating parts 162a, 162b. Next, a radiator 163a is set on the spacers 165a and 165b, and screws 168a and 168b are fixed to the spacers 165a and 165b through the radiator 163a through springs 171a and 171b, respectively. Similarly, the radiator 163b is set on the spacers 165c and 165d, and the screws 168c and 168d are passed through the radiator 163b through the springs 171c and 171d, respectively, and fixed to the spacers 165c and 165d. In this structure, by making the height of the spacers 165a and 165b lower than the combined height of the heat generating component 162a and the fixed block 164, the fixing block 164 is pressed onto the heat generating component 162a by the elastic force of the springs 171a and 171b. Further, by making the height of the spacers 165c and 165d lower than the height of the heat generating component 162b, the radiator 163b is pressed onto the heat generating component 162b by the elastic force of the springs 171c and 171d. In this structure, it is necessary to configure an independent radiator for each heat generating component. Therefore, the product size increases and the number of parts increases.

Patent Document 1 discloses a heat transfer structure in which three blocks of a fixed block, a spherical block, and an inclined block are overlapped between a heat generating component and a radiator. The spherical block can adjust the inclination of the heat generating component, and the inclined block can adjust the height of the heat generating component. However, three layers of blocks are required. Therefore, there are three contact surfaces, and the thermal resistance is about three times that of the case where the radiator is directly brought into contact with the heat-generating component. In addition, since the three-layer heat transfer structure is included between the radiator and the heat generating component, the installation height of the radiator with respect to the substrate is increased.

JP 2004-327987 A

An object of the present invention is to obtain a heat radiating device capable of efficiently radiating heat by reducing the thermal resistance between a heat generating component and a heat radiator. Another object of the present invention is to obtain a heat dissipation device that can reduce the installation height of the heatsink with respect to the substrate.

  The heat dissipating device of the present invention includes a fixed block fixed to the heat dissipator, and a movable block that is installed between the fixed block and the heat generating component and can move the installation position. A fixed heat dissipating surface and a fixed block side contact surface that is on the opposite side of the heat dissipating surface, is inclined with respect to the heat dissipating surface, and has a shape consisting of part of a substantially cylindrical side surface, or a fixed block side contact surface. The block includes a heat receiving surface that is in contact with the heat generating component, and a movable block side contact surface that is a concave surface or a convex surface that is on the opposite side of the heat receiving surface, corresponds to the convex surface or the concave portion of the fixed block, and has a shape along the surface. The side contact surface contacts the fixed block side contact surface so as to be able to slide in the tilt direction and to be rotatable in a plane perpendicular to the tilt direction.

  The block between the heat-generating component and the radiator can be a two-layer structure. As a result, a heat dissipation device capable of efficiently dissipating heat is obtained by reducing the thermal resistance between the heat-generating component and the heatsink. Further, the installation height of the radiator with respect to the substrate can be reduced.

1 is a front view illustrating a structure of a heat dissipation device according to Embodiment 1. FIG. 3 is a side view showing the structure of the heat dissipation device of Embodiment 1. FIG. 3 is a top view of a screw 9 used in the structure of Embodiment 1. FIG. 3 is a side view of a screw 9 used in the structure of Embodiment 1. FIG. It is a front view which shows the structure of the thermal radiation apparatus of Embodiment 1 in the case of dissipating several heat-emitting components on a board | substrate. It is a side view which shows the structure of the thermal radiation apparatus of Embodiment 1 in the case of dissipating several heat-emitting components on a board | substrate. It is a front view which shows the structure of the thermal radiation apparatus of Embodiment 2. It is a side view which shows the structure of the thermal radiation apparatus of Embodiment 2. It is a top view which shows the structure of the thermal radiation apparatus of Embodiment 2. FIG. 6 is a front view showing a structure of a heat dissipation device of a third embodiment. FIG. 6 is a side view showing the structure of a heat dissipation device according to Embodiment 3. It is a front view which shows the structure of the thermal radiation apparatus of Embodiment 4. It is a side view of the movable block holding state which shows the structure of the thermal radiation apparatus of Embodiment 4. FIG. 10 is a top view showing a structure of a heat dissipation device in a fourth embodiment. It is a side view of the movable block release state which shows the structure of the thermal radiation apparatus of Embodiment 4. This is a general structure for radiating heat from a plurality of heat generating components on a substrate. This is a general structure for radiating heat from a plurality of heat generating components on a substrate.

Embodiment 1 FIG.
The first embodiment will be described with reference to FIGS. FIG. 1 is a front view showing the structure of the heat dissipation device of the first embodiment. FIG. 2 is a side view showing the structure of the heat dissipation device of the first embodiment.

The substrate 1 on which the heat generating component 2 is arranged and the radiator 3 for radiating the heat generated by the heat generating component 2 are fixed by fixing the spacer 11 standing on the substrate 1 with screws 12.

  A radiator block 3 and a fixed block 4 fixed on the heat radiation surface, and a movable block 5 capable of moving the installation position between the fixed block 4 and the heat generating component 2 are provided.

  The fixed block 4 has a fixed block side contact surface on the side opposite to the heat dissipation surface. The fixed block side contact surface is inclined with respect to the heat radiating surface. The fixed block side contact surface may have an inclination with respect to the substrate 1 or the heat generating component 2. The fixed block side contact surface is a convex surface having a curved surface. As a specific example of the curved surface, it is assumed that the convex surface is formed of a part of a side surface of a cylinder. The fixed block 4 may be integrated with the radiator 3. In that case, the fixed block side contact surface may be formed by scraping the radiator 3.

  The movable block 5 contacts the heat generating component 2 at the heat receiving surface. The heat receiving surface of the movable block 5 and the heat generating component 2 may be in contact with each other via a thermal interface material 17. The movable block 5 has a movable block side contact surface in contact with the fixed block side contact surface on the opposite side of the heat receiving surface. The fixed block side contact surface and the movable block side contact surface may be in contact with each other via the thermal interface material 16. In FIG. 1 and FIG. 2, the fixed block side contact surface and the movable block side contact surface are shown together as a contact surface 6. The movable block side contact surface is inclined with respect to the heat radiating surface. The movable block side contact surface may be inclined with respect to the substrate 1 or the heat generating component 2. The movable block side contact surface is a concave surface formed of a curved surface. As a specific example of the curved surface, it is a concave surface having a shape that is substantially part of a side surface of a cylinder. The movable block side contact surface has a shape along the fixed block side contact surface. Therefore, the fixed block side contact surface may be a concave surface and the movable block side contact surface may be a convex surface.

  The fixed block side contact surface and the movable block side contact surface are in contact with each other so as to be able to slide in the inclined direction. Moreover, it contacts so that rotation operation | movement is possible in the surface perpendicular | vertical to an inclination direction. The sliding motion is, for example, an arrow 15a in FIG. The rotation operation is, for example, the arrow 14 in FIG. The sliding operation is realized by the inclination of the fixed block side contact surface and the movable block side contact surface. The rotation operation is realized by the curved surface of the fixed block side contact surface and the movable block side contact surface.

A movable block position adjusting tool for adjusting the installation position of the movable block is provided. The specific example in Embodiment 1 of a movable block position adjustment tool is disclosed below. A movable block position adjuster that applies force to the movable block 5 is provided so that the movable block 5 moves in a direction in which the movable block 5 fills the gap between the radiator 3 and the heat generating component 2. The movable block position adjuster applies force to the movable block 5 from one direction. Since the contact surface 6 is inclined, the movable block 5 can fill the gap between the radiator 3 and the heat generating component 2 by applying force to the movable block 5 from one direction. The direction in which the movable block moves in the direction in which the movable block fills the gap between the radiator 3 and the heat generating component 2 is, for example, the direction of the arrow 15b in FIG. Specific examples of how to apply force include tightening with a screw, elastic force, and air pressure.

The fixing plate 7 having the long holes 8a and 8b is fixed to the side surface of the fixing block 4 with screws or the like. The spring 10 is sandwiched between the fixed plate 7 and the side surface of the movable block 5, and the screw 9 is screwed to the movable block 5 with the long hole 8 and the spring 10 passing through. The spring 10 may be an elastic body on which an elastic force works. Specific examples of the elastic body include rubber. In FIG. 2, the fixed plate 7, the spring 10, and the screw 9 serve as a movable block position adjuster.
.

3 and 4 are detailed views of the screw 9 used in the structure of the first embodiment. FIG. 3 is a top view and FIG. 4 is a side view.
The screw head 9m and the spring 10 of the screw 9 are sized so as not to pass through the long hole 8, and the body 9n of the screw 9 has a thickness that can pass through the long hole 8 and can be guided at the same time as it passes through the spring 10. The seating surface is configured to be able to be screwed by hitting the side surface of the movable block 5. Since the screw 9 moves in the height direction and the tilt direction with respect to the substrate 1 in accordance with the vertical movement (sliding motion in the tilt direction) and tilt motion (rotational motion in a plane perpendicular to the tilt direction) of the movable block, the long hole 8 has a length and a width corresponding to its moving range.

  Next, a specific example of the method of assembling the heat radiating device of the first embodiment will be described. The substrate 1 on which the heat generating component 2 is arranged and the spacer 11 standing on the substrate 1 are fixed by fixing with screws 12. The fixed plate 7 having the long holes 8a and 8b is fixed to the side surface of the fixed block 4 with screws or the like, and the movable block side contact surface is brought into contact with the fixed block side contact surface in a state where the thermal interface material 16 is applied. The screw 9 is screwed to the movable block 5 in a state where the long hole 8 and the spring 10 are penetrated while the pin 10 is sandwiched between the fixed plate 7 and the side surface of the movable block 5.

  A force is applied to the movable block using the movable block position adjusting tool only from one direction so that the movable block 5 moves in a direction in which the movable block 5 fills the gap between the radiator 3 and the heat generating component 2. As a specific example of the force from only one direction, a pressing force is applied from the side where the movable block is thick, or a force is applied which is pulled from the side where the movable block is thin. In FIG. 2, it is the direction of the arrow 15b. Referring to FIG. 2, as a specific example of applying a pressing force from the side where the movable block is thick, the screw 9 is screwed from the side where the movable block is thick. The screw 9 moves in the height direction and the tilt direction with respect to the substrate 1 according to the vertical movement and tilt of the movable block.

  In the state up to this point, the movable block 5 receives the reaction force of the spring 10 and moves to the maximum in the movable direction 15b, and the movable block 5 fills the gap between the radiator 3 and the heat generating component 2. Therefore, since the movable block contact surface (contact surface 6) is inclined, the heat receiving surface of the movable block 5 is lowered to the maximum in the direction of the heat generating component 2.

  Next, the fixing block 4 is fixed to the radiator 3 with screws or the like, and the thermal interface material 17 is applied on the heat generating component 2.

Next, the radiator 3 is set on the spacer 11, and the spacer 11 and the radiator 3 are fixed using screws 13. At this time, the heat receiving surface of the movable block 5 starts to contact the heat generating component 2, and the movable block 5 is pushed back in the direction in which the spring 10 is compressed. The direction in which the movable block 5 is pushed back is opposite to the arrow 15b in FIG. In other words, it is a direction (moving direction) in which the movable block 5 does not fill the gap between the radiator 3 and the heat generating component 2.

  Further, when the surface of the heat generating component 2 and the heat receiving surface of the movable block 5 are relatively inclined, since the contact surface 6 is a curved surface, the movable block 5 rotates in a direction in which the inclination is reduced.

  The movable block 5 fills the gap between the radiator 3 and the heat generating component 2 by the screw 13 and the force applied to move the movable block 5 in the direction in which the movable block 5 fills the gap between the radiator 3 and the heat generating component 2 by the screw 9. The force applied so that the movable block 5 moves in the non-moving direction is balanced, and finally, the fixed block 4 and the movable block 5 remain in close contact with each other, and the heat receiving surface of the movable block 5 and the upper surface of the heat generating component 2 are substantially in close contact with each other. Become. FIGS. 1 and 2 show this almost intimate contact state. Finally, the heat generating component 2 and the movable block 5 are almost in close contact with each other, the movable block 5 and the fixed block 4 are almost in close contact with each other, and the fixed block 4 is in close contact with the radiator 3. Heat can be transferred to the radiator 3.

  FIG. 5 shows the heat dissipation device of the first embodiment in the case where a plurality of heat generating components 2a and 2b (the number is not limited to this in FIG. 5) is dissipated on the substrate. It is a front view which shows a structure. FIG. 6 is a side view showing the structure of the heat dissipation device according to the first embodiment when a plurality (two) of heat generating components 2a and 2b are radiated on the substrate. 5 and FIG. 6, parts corresponding to those in FIG. 1 and FIG. In this example, the height of the fixing blocks 4a and 4b is changed in accordance with the height of each of the heat generating components 2a and 2b so that the two heat generating components 2a and 2b can be radiated by one radiator 3. . In addition, you may change the height of movable block 7a, 7b. In the heat dissipation device of the present embodiment, even if there is non-uniformity in the height of each heat generating component 2a, 2b, each movable block having the same structure is in close contact with the surface of each heat generating component 2a, 2b. Therefore, the heat and heat of each heat generating component can be efficiently conducted to one radiator 3.

  As described above, according to the heat dissipation device of the present embodiment, the block between the heatsink and the heat generating component can be made into two layers of the fixed block and the movable block.

  The fixed block side contact surface and the movable block side contact surface, which are contact surfaces of the fixed block and the movable block, are inclined with respect to the substrate, and are formed into a shape made of a curved surface, for example, a part of a substantially cylindrical side surface. Accordingly, the fixed block side contact surface and the movable block side contact surface are in contact with each other so as to be able to slide in the tilt direction, and are in contact with each other so as to be capable of rotating in a plane perpendicular to the tilt direction. The height of the heat generating component can be adjusted by making contact so as to be able to slide, and the inclination of the heat generating component can be adjusted by making contact so as to be able to rotate. That is, the height of the heat generating component and the adjustment of the inclination of the heat generating component can be adjusted with one contact surface.

  Using a heat dissipating device having a similar structure, it is possible to dissipate a plurality of heat generating components having different heights on the board with a single heat dissipator.

  Since the structure of the block 2 layers (fixed block, movable block) can be adopted, the contact surface can be two surfaces, the contact surface has a lower thermal resistance than the three surfaces, and the radiator for the substrate It is possible to reduce the installation height.

  Further, by providing a movable block position adjusting tool that applies force only from one direction, an effect of easy assembly can be obtained as compared with a heat radiating device including a movable block position adjusting tool that needs to apply force from a plurality of directions. be able to.

  The effect of Embodiment 1 is demonstrated below using a specific numerical example. In the structure of FIG. 16, a heat dissipation sheet is sandwiched between the fixed block and the heat generating component. For example, in the example where the upper surface size of the heat generating component is 30 mm × 30 mm, the heat generation amount is 50 W, the heat radiating sheet thickness is 1 mm, and the heat conductivity of the heat radiating sheet is 2 W / mk, A simple calculation of the temperature difference on the bottom surface of the block yields ΔT = 50W × (1 / (2W / mk / (1mm / 1000)) / (30mm / 1000) ^ 2) = 27.8 ° C., and the thermal resistance is Highly problematic.

  In the structure of FIG. 17, the heat resistance is relatively low because the heatsink is directly brought into contact with the heat-generating component by a spring force, or the heatsink is brought into contact with the heat-generating component through a fixed block. For example, in the example in which the upper surface size of the heat generating component is 30 mm × 30 mm, the heat generation amount is 50 W, the thickness of the low viscosity thermal interface material of the contact portion is 0.05 mm, and the thermal conductivity of the thermal interface material is 2 W / mk, A simple calculation of the temperature difference in the thickness of the thermal interface material (or the temperature difference between the surface of the heat generating component and the bottom surface of the fixed block) ΔT = 50W × (1 / (2W / mk / (0.05mm / 1000)) ) / (30 mm / 1000) ^ 2) = 1.4 ° C., and the thermal resistance is lower than that of the structure of FIG. However, in this structure, the height of each heat generating component is different, and there is also uneven height, so it is not possible to efficiently radiate heat from a plurality of heat generating components on the board with a single heat radiator. Since it is necessary to provide a dedicated heatsink for the parts, there are problems that the product size increases and the number of parts increases.

  The heat transfer structure in which the fixed block, the spherical block, and the inclined block in Patent Document 1 are overlapped is, for example, a thermal interface having a heat generating component with an upper surface size of 30 mm × 30 mm, a heat generation amount of 50 W, and a low viscosity at the contact portion. In the example where the thickness of the material is 0.05 mm, the size of the contact surface between each block is 30 mm × 30 mm, and the thermal conductivity of the thermal interface material is 2 W / mk, the thickness portion of the thermal interface material for three surfaces When the temperature difference (or the temperature difference between the heat generating component surface and the fixed block lower surface) is simply calculated, ΔT = 50 W × (1 / (2 W / mk / (3 surfaces × 0.05 mm / 1000)) / (30 mm / 1000) ^ 2) = 4.2 ° C., and the thermal resistance is lower than that of the structure of FIG. However, in this structure, three layers of metal blocks are required, so there are also three contact surfaces, and there is a problem that the thermal resistance is about three times that of the case where the radiator is in direct contact with the heat-generating component. . In addition, since the three-layered heat transfer structure is sandwiched between the radiator and the heat generating component, there is a problem that the installation height of the radiator with respect to the substrate is increased. In addition, since there are three contact surfaces, the overall friction is large, and it is necessary to apply a heat sink to the heat generating component with a large external force in order to adhere the contact surface according to the inclination and height of the heat generating component upper surface. There was a problem that the radiator and the substrate were easily deformed.

  In the electronic component heat dissipation structure according to the present invention, the fixed block and the movable block are configured so that the inclination of the heat generating component and the height of the heat generating component can be adjusted with one contact surface. The upper surface size of the part is 30 mm x 30 mm, the heat generation amount is 50 W, the thickness of the low viscosity thermal interface material at the contact part is 0.05 mm, the size of the contact surface between each block is 30 mm x 30 mm, In the example where the thermal conductivity is 2 W / mk, simply calculating the temperature difference of the thickness portion of the thermal interface material for two surfaces (or the temperature difference between the heat generating component surface and the bottom surface of the fixed block), ΔT = 50 W × (1 / (2 W / mk / (2 surfaces × 0.05 mm / 1000)) / (30 mm / 1000) ^ 2) = 2.8 ° C. The thermal conductivity is about 1.5 than the structure of Patent Document 1. Double superior Since the number of lock layers is two, the installation height of the radiator with respect to the substrate can be reduced to about 2/3 as compared with the structure of Patent Document 1. Also, compared to Patent Document 1 with three contact surfaces, the overall friction is small, and a small external force is applied to the radiator to bring the contact surfaces into close contact according to the inclination and height of the heat generating component upper surface. The effect that can be obtained.

Embodiment 2. FIG.
The second embodiment will be described with reference to FIGS. In the second embodiment, the characteristic part of the second embodiment of the solution of the first embodiment will be mainly described. FIG. 7 is a front view showing the structure of the heat dissipation device of the second embodiment. FIG. 8 is a side view showing the structure of the heat dissipation device of the second embodiment. FIG. 9 is a top view showing the structure of the heat dissipation device of the second embodiment.

  The fixing plate 7 having the long holes 8 is fixed to the radiator 3 with screws 20. The radiator 3 is provided with an elongated hole 18 for allowing the screw 20 to pass therethrough and a counterbore 19 for preventing the screw head from hanging on the radiation fin portion of the radiator. The fixing block 4 is fixed to the radiator 3 with screws or the like. The screw 9 is screwed to the movable block 5 with the long hole 8 being passed therethrough.

  The screw head 9m of the screw 9 is sized so as not to be able to pass through the long hole 8. The body 9n of the screw 9 can pass through the long hole 8, and the seat surface of the thickness hits the side of the movable block 5 and can be screwed. Since the screw 9 moves in the height direction and the tilt direction with respect to the substrate 1 according to the vertical movement and tilt of the movable block, the long hole 8 has a length and a width corresponding to the moving range.

  Next, a specific example of the method for assembling the heat dissipation device of the second embodiment will be described. The fixing plate 7 having the long holes 8 is fixed to the radiator 3 with screws 20. The substrate 1 on which the heat generating component 2 is arranged and the spacer 11 are fixed by fixing with screws 12.

  With the thermal interface material 16 applied to the movable block side contact surface of the movable block 5, it is brought into contact with the fixed block side contact surface of the fixed block, and the fixed plate 7 is movable with the screw 9 passing through the long hole 8. Screw on block 5.

  The screw 20 is slightly loosened so that the fixing plate 7 can move with respect to the radiator 3.

  Next, the movable block 5 is moved together with the fixed plate 7 so that the heat receiving surface of the movable block 5 comes into contact with the heat generating component 2. At this time, when the surface of the heat generating component 2 and the heat receiving surface of the movable block 5 are relatively inclined, the curved surface 6 is cylindrical, so that the movable block 5 rotates in a direction in which the inclination is reduced. Finally, the heat receiving surface of the movable block 5 and the heat generating component 2 are almost in close contact with the fixed block 4 and the movable block 5 in close contact.

  In this state, the screw 20 is fixed so that the fixing plate 7 does not move with respect to the radiator 3. This state is shown in FIG. 7, FIG. 8, and FIG.

  The movable block 5 can be moved from only one direction to the movable block 5 so that the heat generating component 2 and the heat receiving surface of the movable block 5 are in close contact with each other, and the movable block side contact surface and the fixed block side contact surface are maintained in close contact with each other. Apply force using the position adjuster. As a specific example of the force from only one direction, a pressing force is applied from the side where the movable block is thick, or a force is applied which is pulled from the side where the movable block is thin. In FIG. 8, it is the direction of the arrow 15b. As a specific example of how to apply force, tighten with screws. In FIG. 8, the fixed plate 7 and the screw 9 serve as a movable block position adjusting tool. Finally, the heat generating component 2 and the heat receiving surface of the movable block 5 are in close contact with each other, the movable block side contact surface and the fixed block side contact surface are in close contact, and the fixed block 4 is in close contact with the radiator 3. The heat of the component 2 can be efficiently transferred to the radiator 3.

  In addition to the effects of the first embodiment, the following effects can be obtained by the heat dissipation device of the second embodiment. Generally, the static friction coefficient is smaller than the dynamic friction coefficient. In the present embodiment, the entire assembly is assembled in a state where the movable block 5 and the heat generating component 2 are not in close contact, and then the movable block 5 is moved together with the fixed plate 7 so that the heat receiving surface of the movable block 5 is in close contact with the heat generating component 2. The fixing plate 7 can be fixed. As a result, the coefficient of friction until the heat receiving surface of the movable block 5 comes into close contact with the heat generating component 2 can be kept low, and the movable block 5 can be set with a low load.

Embodiment 3 FIG.
The third embodiment will be described with reference to FIGS. In the third embodiment, the characteristic part of the third embodiment of the solution of the first embodiment will be mainly described. FIG. 10 is a front view showing the structure of the heat dissipation device of the third embodiment. FIG. 11 is a side view showing the structure of the heat dissipation device of the third embodiment.

The guide 21 is fixed to the side surface of the fixed block 4 with screws or the like. The guide 21 is fixed substantially parallel to the tilt direction. The guide is fixed so as to exceed the fixed block side contact surface of the fixed block 4. The guide 21 may be processed integrally with the fixed block. The guide 21 may be provided on the movable block side, or may be processed integrally with the movable block.

In the third embodiment, the case of combining with the first embodiment has been described, but it may be combined with the second embodiment.

In addition to the effects of the first and second embodiments, the following effects can be obtained by the heat dissipation device of the third embodiment. By providing the guide, the movable range of the movable block is restricted. Thereby, it can prevent that the movable block 5 remove | deviates greatly in the direction perpendicular | vertical to an inclination direction.

Embodiment 4 FIG.
The fourth embodiment will be described with reference to FIGS. In the fourth embodiment, the characteristic part of the fourth embodiment of the solution of the first embodiment will be mainly described. FIG. 12 is a front view showing the structure of the heat dissipation device of the fourth embodiment. FIG. 13 is a side view of the movable block holding state showing the structure of the heat dissipation device of the fourth embodiment. FIG. 14 is a top view showing the structure of the heat dissipation device of the fourth embodiment. FIG. 15 is a side view of the movable block released state showing the structure of the heat dissipation device of the fourth embodiment.

A hooking hole 22 penetrating the radiator 3 is provided. The hanging hole 22 is sized so that the hanging shaft 23a of the hanging bracket 23 can move freely, and guides the movement of the hanging bracket 23. The hanging hole 22 is provided at a position where the movable block 5 can be prevented from being largely disengaged in the inclined direction by the hanging metal fitting 23 installed in the hanging hole 22. A metal fitting 23 installed in the hanging hole 22 is provided at a position where the thin side of the movable block can be held. The length of the hanging bracket 23 is a length exceeding the length obtained by adding the radiator 3 and the fixed block 4. Further, the length of the hanging bracket 23 is a length exceeding the fixed block side contact surface of the fixed block 4. In FIG. 13, the fixed plate 7, the spring 10, the screw 9, the hanging hole 22, and the hanging bracket 23 serve as a movable block position adjusting tool.

  Next, a specific example of the method for assembling the heat dissipation device of the fourth embodiment will be described. The substrate 1 on which the heat generating component 2 is arranged and the spacer 11 standing on the substrate 1 are fixed by fixing with screws 12. The fixed plate 7 having the long holes 8a and 8b is fixed to the side surface of the fixed block 4 with screws or the like, and the movable block side contact surface is brought into contact with the fixed block side contact surface in a state where the thermal interface material 16 is applied. The screw 9 is screwed to the movable block 5 in a state where the long hole 8 and the spring 10 are penetrated while the pin 10 is sandwiched between the fixed plate 7 and the side surface of the movable block 5. In the state up to this point, the movable block 5 receives the reaction force of the spring 10 and moves to the maximum in the movable direction 15b, and the movable block 5 fills the gap between the radiator 3 and the heat generating component 2. Therefore, since the movable block contact surface (contact surface 6) is inclined, the heat receiving surface of the movable block 5 is lowered to the maximum in the direction of the heat generating component 2.

Next, the fixing block 4 is fixed to the radiator 3 with a screw or the like in a state where the hook 23 is released upward (FIG. 15), and the thermal interface material 17 is applied on the heat generating component 2. Next, the movable block 5 is moved in the direction in which the spring 10 is contracted, and the hanging bracket 23 is moved downward until the hanging bracket stopper 23b hits the radiator 3, so that the movable block 5 comes into contact with the hanging bracket 23. The locked state is set (FIG. 13).

Next, the radiator 3 is set on the spacer 11, and the spacer 11 and the radiator 3 are fixed using screws 13. Next, when the hook 23 is released upward (FIG. 15), the movable block 5 receives the reaction force of the spring 10 and moves in the movable direction 15b, and the movable block side contact surface contacts the heat generating component 2. The hanging bracket 23 may be pulled out completely. When the surface of the heat generating component 2 and the heat receiving surface of the movable block 5 are relatively inclined, the movable surface 5 rotates in a direction in which the inclination decreases because the contact surface 6 is a curved surface. Finally, the heat generating component 2 and the movable block 5 are almost in close contact with each other, the movable block 5 and the fixed block 4 are almost in close contact with each other, and the fixed block 4 is in close contact with the radiator 3. Heat can be transferred to the radiator 3.

  In addition to the effects of the first embodiment, the following effects can be obtained by the heat dissipation device of the fourth embodiment. Generally, the static friction coefficient is smaller than the dynamic friction coefficient. In the present embodiment, the entire assembly is assembled in a state where the movable block 5 and the heat generating component 2 are not in close contact, and then the hook 23 is released, whereby the friction coefficient until the movable block 5 is in close contact with the heat generating component 2 is obtained. Therefore, the movable block 5 can be set with a low load.

1 substrate, 2 heat generating component, 3 radiator, 4 fixed block, 5 movable block, 21 guide, 22 hanging hole.

Claims (5)

A heat dissipation device that transfers heat from a heat-generating component installed on a substrate to a radiator,
A fixed block fixed to the radiator;
A movable block installed between the fixed block and the heat generating component and capable of moving an installation position;
The fixed block is
A heat dissipating surface fixed to the radiator;
The movable block, which is on the opposite side of the heat radiating surface, has a slope with respect to the heat radiating surface, and includes a fixed block side contact surface that is a convex surface or a concave surface having a shape made of a part of a substantially cylindrical side surface,
A heat receiving surface in contact with the heat generating component;
A movable block side contact surface that is on the side opposite to the heat receiving surface, corresponds to the convex surface or concave portion of the fixed block, and is a concave surface or convex surface having a shape along it,
The heat dissipating device, wherein the movable block side contact surface is in contact with the fixed block side contact surface so as to be able to slide in the tilt direction and to be rotatable in a plane perpendicular to the tilt direction. The heat radiating device according to claim 1, further comprising a movable block position adjuster that applies a force to the movable block from one direction so that the movable block moves in a direction in which the movable block fills a gap between the radiator and the heat generating component. . The heat dissipating device according to claim 2, wherein the movable block position adjuster further includes a hook guide capable of holding the movable block. The heat radiating device according to claim 1, further comprising a movable block position adjuster that applies a force from one direction to the movable block so that the movable block side contact surface and the fixed block side contact surface are maintained in close contact with each other. The heat radiating device according to any one of claims 1 to 4, wherein a guide is provided in the fixed block substantially parallel to the tilt direction.

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