JP6135199B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6135199B2
JP6135199B2 JP2013045284A JP2013045284A JP6135199B2 JP 6135199 B2 JP6135199 B2 JP 6135199B2 JP 2013045284 A JP2013045284 A JP 2013045284A JP 2013045284 A JP2013045284 A JP 2013045284A JP 6135199 B2 JP6135199 B2 JP 6135199B2
Authority
JP
Japan
Prior art keywords
light emitting
substrate
light
emitting elements
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013045284A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014175393A (ja
JP2014175393A5 (enExample
Inventor
山田　元量
元量 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013045284A priority Critical patent/JP6135199B2/ja
Priority to US14/197,560 priority patent/US9119331B2/en
Publication of JP2014175393A publication Critical patent/JP2014175393A/ja
Publication of JP2014175393A5 publication Critical patent/JP2014175393A5/ja
Application granted granted Critical
Publication of JP6135199B2 publication Critical patent/JP6135199B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
JP2013045284A 2013-03-07 2013-03-07 発光装置 Active JP6135199B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013045284A JP6135199B2 (ja) 2013-03-07 2013-03-07 発光装置
US14/197,560 US9119331B2 (en) 2013-03-07 2014-03-05 Light emitting device including sealing members and resin member extending substantially parallel to sealing members

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013045284A JP6135199B2 (ja) 2013-03-07 2013-03-07 発光装置

Publications (3)

Publication Number Publication Date
JP2014175393A JP2014175393A (ja) 2014-09-22
JP2014175393A5 JP2014175393A5 (enExample) 2016-04-07
JP6135199B2 true JP6135199B2 (ja) 2017-05-31

Family

ID=51487593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013045284A Active JP6135199B2 (ja) 2013-03-07 2013-03-07 発光装置

Country Status (2)

Country Link
US (1) US9119331B2 (enExample)
JP (1) JP6135199B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016162778A1 (ja) * 2015-04-09 2016-10-13 株式会社半導体エネルギー研究所 表示装置および電子機器
US10211378B2 (en) * 2016-01-29 2019-02-19 Nichia Corporation Light emitting device and method for manufacturing same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100576865B1 (ko) * 2004-05-03 2006-05-10 삼성전기주식회사 백라이트용 발광 다이오드 어레이 모듈 및 이를 구비한백라이트 유닛
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP2011228602A (ja) * 2010-04-23 2011-11-10 Toray Ind Inc Ｌｅｄ発光装置およびその製造方法
JP2012059736A (ja) * 2010-09-03 2012-03-22 Panasonic Corp 発光装置、バックライトユニット、液晶表示装置及び照明装置
JP2012142382A (ja) * 2010-12-28 2012-07-26 Showa Denko Kk 照明装置
JP2012245750A (ja) * 2011-05-31 2012-12-13 Kyocera Corp 光照射モジュール、および印刷装置
JP5985846B2 (ja) * 2011-06-29 2016-09-06 Ｆｌｅｘｃｅｅｄ株式会社 発光素子搭載用基板及びｌｅｄパッケージ

Also Published As

Publication number Publication date
US9119331B2 (en) 2015-08-25
US20140254182A1 (en) 2014-09-11
JP2014175393A (ja) 2014-09-22

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