JP6127726B2 - Plating equipment - Google Patents

Description

  The present invention relates to a plating apparatus.

  In recent years, with the miniaturization of electronic devices, electronic components used are also required to be miniaturized. As a wiring material used in the manufacture of such electronic components, a metal obtained by forming a thin metal layer on an organic resin film such as a polyimide film and electroplating copper on the metal layer with a thickness of several μm to several tens of μm A coated resin substrate is known (see, for example, Patent Document 1).

  A metal-coated resin substrate manufactured by electroplating has a fine wiring pattern formed on the surface by photolithography, and is used for a wiring substrate for connecting a liquid crystal panel such as a mobile phone or a TV and a driver IC. .

  The following apparatuses are known as a plating apparatus for performing an electroplating process when manufacturing such a metal-coated resin substrate.

  For example, there is known a plating apparatus in which the width direction of a long sheet-like workpiece in which a thin metal layer is formed on an organic resin film is held horizontally, and passes through a plurality of plating tanks while supplying power to the metal layer. .

  Also, in Patent Document 2, the width direction of a long sheet-shaped workpiece in which a thin metal layer is formed on a polyimide film is set to the up and down direction, and the upper end and the lower end of the workpiece are clamped and fed in a plating tank while supplying power. A plating apparatus for applying the above is disclosed. In such a plating apparatus, it is possible to perform electroplating at a high speed in one plating tank.

JP 2010-031316 A JP 2009-120889 A

  However, in a conventional plating apparatus, there is a case where the workpiece is deflected in the plating tank, and there is a problem that the plating thickness distribution in the workpiece fluctuates when the workpiece is deflected.

  Then, in view of the problem which the said prior art has, this invention aims at providing the plating apparatus which can suppress generation | occurrence | production of the workpiece | work deflection | deviation in a plating tank and can reduce the fluctuation | variation of plating thickness distribution more.

The present invention for solving the aforementioned problems is a plating apparatus for plating a long sheet-shaped workpiece, is formed on the side wall of the plating tank, an outlet for discharging the plating solution in the plating tank A jet nozzle for spraying a plating solution to the workpiece, and the long sheet-shaped workpiece is supplied to the plating tank in a state where the width direction of the long sheet-shaped workpiece is held in the vertical direction. The discharge port is provided such that the upper end in the height direction is higher than the level of the plating solution in the plating tank, and the lower end reaches the lower end clamp that grips the lower end of the workpiece. To do.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the workpiece | work bending in a plating tank can be suppressed, and the plating apparatus which can reduce the fluctuation | variation of plating thickness distribution more can be provided.

Sectional view of conventional plating equipment (schematic diagram of workpiece deflection) Top view of conventional plating equipment The top view of the plating apparatus concerning Embodiment 1 of the present invention. Side view of the plating apparatus according to Embodiment 1 of the present invention. Sectional drawing of the other structural example of the plating apparatus which concerns on Embodiment 1 of this invention. Deflection amount of workpiece in plating tank in Example 1 and Comparative Example 1 according to the present invention Plating thickness distribution of plating layer formed on workpiece surface in Example 1 according to the present invention Plating thickness distribution of plating layer formed on workpiece surface in Comparative Example 1 The top view which showed an example of the plating apparatus which concerns on Embodiment 2 of this invention The perspective view which showed an example of the liquid draining box of the plating apparatus which concerns on Embodiment 2 of this invention. The enlarged view which showed an example of the structure of the liquid draining box vicinity in the plating tank of the plating apparatus which concerns on Embodiment 2 of this invention. The figure which showed the implementation result in Example 2 of this invention

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and the following embodiments are not departed from the scope of the present invention. Various modifications and substitutions can be made.

Embodiment 1
In the present embodiment, a configuration example of the plating apparatus of the present invention will be described.

  The plating apparatus of this embodiment is a plating apparatus for plating a long sheet-like workpiece, and is formed on a side wall of a plating tank and has a discharge port for discharging a plating solution.

  The inventors of the present invention have examined the cause of the deflection of the workpiece in the conventional plating apparatus. As one of the causes, a vortex is generated when the plating solution is flowed in the plating tank, and the deflection of the workpiece is caused by the vortex. It was inferred that this occurred. This will be described below.

  Here, the mechanism of deflection generation in the conventional plating apparatus found by the inventors of the present invention will be described by taking as an example a plating apparatus that supplies the plating tank with the width direction of the workpiece in the vertical direction and performs plating.

  FIG. 1 shows a cross-sectional view of a plating tank portion of a conventional plating apparatus, and also shows a schematic diagram of deflection of a workpiece. FIG. 2 shows a top view of the plating tank portion of the plating apparatus.

  In the conventional plating apparatus shown in FIG. 1 and FIG. 2, the workpiece 3 is gripped and conveyed by the upper end clamp 1 and the lower end clamp 2, and slit-shaped workpiece introduction ports 21 provided at both ends of the plating tank, The workpiece 3 is introduced into and out of the plating tank from the outlet 22.

  The plating bath 5 is filled with the plating solution 5, and the plating solution is supplied into the plating bath from a plurality of jet nozzles 6 provided in the plating bath, and the plating solution is jetted onto the work surface by the jet nozzle 6. The metal ions are supplied to the work surface. Further, in order to keep the level of the plating solution in the plating tank substantially constant, the plating solution is mainly overflowed from the upper part of the plating tank as shown by an arrow A in FIG. Furthermore, a part of the plating solution is also discharged from the gap between the workpiece introduction port 21 and the workpiece carry-out port 22.

  In the plating tank, the workpiece 3 is plated by connecting the upper end clamp 1 serving as power supply and the electrode (anode) 4 to a power source.

  As a result of the examination of the plating apparatus, as shown in FIG. 2, the flow of the plating solution along the workpiece is observed in the vicinity of the workpiece introduction port 21 and the workpiece carry-out port 22 as indicated by arrows in the drawing. It was confirmed that the eddy current 23 was generated between the adjacent jet nozzles in the other portions. If the force pushing the workpiece generated by the vortex 23 makes the force pushing the one surface side and the other surface side of the workpiece uneven, it is assumed that the workpiece is deflected. As a result, when the workpiece is deflected in the plating tank, the distance between the electrode (anode) 4 and the workpiece 3 becomes uneven on the front and back sides, and it is considered that the plating thickness distribution in the workpiece has changed. .

  The inventors of the present invention further examined the cause of eddy currents generated in the plating tank of the plating apparatus, and found that the cause is mainly due to the structure of the discharge means for discharging the plating solution from the upper end of the plating tank by overflow. It was done.

  Therefore, in the plating apparatus of this embodiment, as shown in FIG. 3 and FIG. 4, a discharge port 30 is formed on the side wall of the plating tank as a plating solution discharge means to suppress or prevent overflow of the plating solution. It was configured not to be made. FIG. 3 shows a top view of the plating apparatus of the present embodiment, and FIG. 4 shows a side view of a portion of the plating tank in which the discharge port 30 is provided.

  In addition, the sectional view of the plating apparatus (the portion where the electrode is provided) shows that the deflection of the workpiece is suppressed, the plating solution overflow from the upper part of the plating tank (arrow A in the figure) is not made, or Except for being suppressed, the configuration is the same as in FIG.

  In such a plating apparatus, since the discharge port 30 is provided on the side wall of the plating tank, the plating solution supplied from the jet nozzle 6 toward the workpiece surface flows after flowing along the workpiece surface as shown in FIG. A flow toward the discharge port 30 can be formed. For this reason, it is thought that generation | occurrence | production of the eddy current by the plating solution supplied from the jet nozzle toward the workpiece | work surface can be suppressed.

  Although the shape of the discharge port 30 is not particularly limited, for example, as shown in FIG.

  The size of the discharge port 30 is not particularly limited, and can be defined according to the required discharge amount of the plating solution.

  However, the height of the discharge port 30 (the length represented by h in FIG. 4) is preferably formed so as to be higher than the level of the plating solution in the plating tank. This is because it is preferable to form the flow along the workpiece surface as described above over the entire height direction (depth direction) of the plating solution in the plating tank so as to suppress the generation of vortex flow. .

  The width of the discharge port 30 can be selected depending on the amount of plating solution supplied to the plating tank and the number of discharge ports, and is not particularly limited. However, it is preferable to select the width so that the level of the plating solution in the plating tank does not decrease locally only around the discharge port 30.

  In particular, in a suspension type plating apparatus as shown in FIG. 3, as shown in FIG. 3, a work introduction port 21 for introducing a long sheet-like work into the plating tank on the side wall of the plating tank, and a long sheet shape A work exit 22 for unloading the work from the plating tank will be provided. As described above, when the workpiece introduction port 21 and the workpiece carry-out port 22 are provided, the plating solution is discharged only from the workpiece introduction port, the workpiece carry-out port, and the discharge port. It is preferable that With this configuration, the plating solution can be prevented from being discharged from the upper portion of the plating tank due to overflow, and the flow of the plating solution along the workpiece surface can be more easily formed. It is because generation | occurrence | production of can be suppressed.

  If the amount of plating solution supplied to the plating tank varies depending on the plating conditions, a plate (discharging port opening / closing plate) that can be moved in the width direction of the discharging port is provided at the discharging port 30. It is also possible to configure so that the amount of plating solution discharged can be adjusted.

  As shown in FIG. 3 and FIG. 4, the outlet 30 is not particularly limited as long as it is provided on the side wall of the plating tank. Is preferably formed on the side wall facing the plating surface of the workpiece 3. That is, in the case of FIG. 3, it is preferably provided on the side wall 31 and / or the side wall 32. As described above, the discharge port 30 is provided to form a flow toward the discharge port after the plating solution supplied to the workpiece surface flows along the workpiece surface, and is configured as described above. This is because such a flow is easily formed.

  Moreover, the number of the discharge ports 30 to be provided is not particularly limited, and can be selected according to the size of the plating tank, the supply amount of the plating solution, and the like. In particular, it is preferable that a plurality of discharge ports 30 are provided, that is, two or more discharge ports 30 are provided. When a plurality of such discharge ports 30 are provided, it is preferable to provide the discharge ports 30 at positions facing each other as shown in FIG.

  By configuring in this way, for example, as shown in FIG. 3, it is possible to easily form a substantially symmetrical flow of the plating solution on both sides of the workpiece 3, so that the deflection of the workpiece 3 can be further suppressed.

  Furthermore, when providing the discharge port 30 with two or more in one side wall, it is preferable to form in the side wall of a plating tank for every fixed space | interval between the one end part of the side wall and the other end part. That is, it is preferable to configure so that W1, W2, and W3 in FIG. 4 are equal. By configuring in this way, the flow rate of the plating solution along the workpiece inside the plating tank can be made uniform, so that the deflection of the workpiece can be further suppressed.

  The plating solution discharged from the discharge port etc. is collected by a plating solution collecting means (not shown), the deposits in the plating solution are removed with a filter, etc., and in some cases, the components of the plating solution are added and then again from the jet nozzle. It can also be supplied to the plating tank.

  A configuration other than the discharge port of the plating apparatus of the present embodiment will be described.

  In the plating apparatus of this embodiment, it can be set as the structure which has arrange | positioned the electrode (anode) 4 spaced apart from the plating surface of the workpiece | work (work conveyance path | route) by a fixed distance.

  For example, as shown in FIG. 3, the electrodes can be arranged in the plating tank so as to face the front and back plating surfaces of the workpiece being conveyed. In this case, it is preferable that the distances (distances represented by the distances 33 and 34 in the figure) between the respective plating surfaces of the work and the electrodes are the same with the work as the center. By arranging in this way, the plating thickness distribution on both surfaces of the workpiece can be made uniform.

  The distance between the electrode and the work (work transport path), that is, the distance 33 and the distance 34 in FIG. 3 can be selected depending on the plating conditions, and is not particularly limited. However, if the distance between the electrode and the workpiece is too short, eddy currents are easily generated by the plating solution supplied from the jet nozzle, and bending of the workpiece is likely to occur. Further, if the distance between the electrode and the workpiece is too large, in addition to an increase in production cost due to an increase in voltage, it may be difficult to obtain a uniform plating thickness distribution. For this reason, it is preferable that the distance between an electrode and a workpiece | work is 70 mm or more and 120 mm or less in a plating tank, and it is more preferable that it is 85 mm or more and 110 mm or less.

  In FIG. 3, it is described that the electrode 4 is provided in contact with the side wall, but the electrode 4 and the side wall of the plating tank may be provided separately. Moreover, it can also comprise so that the position of the electrode 4 can be displaced so that the distance between the electrode 4 and the workpiece | work 3 can be changed according to the conditions of plating.

  The range in which the electrode 4 is disposed in the plating tank is not particularly limited, and can be arbitrarily selected depending on the thickness of the plating layer to be formed. In particular, in order to increase the productivity, the electrode 4 can be continuously applied in the plating tank, for example, along the work transfer path in the plating tank and over the entire work transfer path as shown in FIG. It is preferable to install.

  Moreover, the plating solution supply means which supplies a plating solution to a plating tank can be provided. The plating solution supply means is not particularly limited, and the installation location is not limited. In particular, in order to improve the efficiency of the plating treatment, it is preferable to provide a plating solution supply means so that a new plating solution can be continuously supplied to the workpiece surface. For this reason, as shown in FIG. 3, it can be set as the structure which has the jet nozzle 6 which sprays a plating solution with respect to a workpiece | work in a plating tank, for example.

  The jet nozzles are preferably provided at predetermined intervals along the workpiece conveyance path as shown in FIG.

  Further, when the plating solution is sprayed onto the workpiece by the jet nozzle, the workpiece is pressed by the plating solution. For this reason, it is preferable to arrange a pair of jet nozzles so that the jet nozzles are opposed to each other with the workpiece sandwiched between them, so that the distances from both the jet nozzles to the workpiece are equal. It is preferable that the supply amount be equal on the front surface and the back surface of the workpiece.

  The spray angle of the plating solution when the jet nozzle 6 sprays the plating solution onto the workpiece is not particularly limited, and can be selected according to the installation position of each jet nozzle.

  In addition to the above members, various members can be provided as necessary. For example, a shielding plate can be provided between the electrode and the work so that a potential can be uniformly applied to the work surface.

  The configuration example of the plating apparatus of the present embodiment has been described above. However, the plating apparatus of the present embodiment is a suspended type that supplies the plating tank with the width direction of the long sheet-like workpiece in the vertical direction and performs plating. It is not limited to a plating apparatus. For example, as shown in FIG. 5, the width direction of a long sheet-like workpiece in which a thin metal layer is formed on an organic resin film is horizontal (on the ground), and a plurality of plating tanks are passed while feeding the metal layer. Similarly, it is preferable to provide a discharge port in the plating tank of the plating apparatus. FIG. 5 shows a cross-sectional configuration diagram of such a plating apparatus, which is an apparatus for carrying the plating process by conveying the work 3 by a plurality of rollers 51 and immersing it in a plating solution. Although the jet nozzle is not shown in FIG. 5, a jet nozzle for supplying a plating solution to the workpiece surface can be provided as in FIGS. 3 and 4, and in this case as well, a vortex is formed between the jet nozzles. In some cases, the work may bend. For this reason, generation | occurrence | production of a workpiece | work bending can be suppressed by forming a discharge port in the side wall of a plating tank. Since the discharge port is installed so that the plating solution flows along the workpiece, it is preferable to form the discharge port, for example, on the front surface (front side of the paper) and the back side wall in the drawing. Since other configurations can be the same as those of the suspension type plating apparatus, description thereof is omitted here.

  However, in the plating apparatus in which the width direction of the workpiece is held horizontally and supplied to the plating tank, since the workpiece is conveyed by the plurality of conveyance rollers 51, a certain degree of tension is applied to the workpiece. Therefore, the deflection of the workpiece is less likely to occur as compared with the above-described suspension type plating apparatus in which the width direction of the workpiece is held up and down and only the end in the width direction is held.

  For this reason, since the plating apparatus of the present embodiment is particularly effective in a suspension type plating apparatus in which the workpiece is likely to bend, the plating tank is maintained in the vertical direction while maintaining the width direction of the long workpiece. It is more preferable to apply in a supply type plating apparatus to be supplied.

  As mentioned above, in this embodiment, although the structural example of the plating apparatus of this invention was demonstrated, according to the plating apparatus which concerns, generation | occurrence | production of the bending of the workpiece | work in a plating tank can be suppressed, and the fluctuation | variation of plating thickness distribution can be reduced more. it can.

  Specific examples will be described below, but the present invention is not limited to these examples.

First, evaluation methods in the following examples and comparative examples will be described.
(Measurement of workpiece deflection)
In the following examples and comparative examples, when a long workpiece is supplied to the plating tank and the plating process for the workpiece is started, a certain time has elapsed, and the workpiece in the plating tank is stable when the operation state of the plating apparatus is stable. The amount of deflection was measured.

  The deflection of the workpiece is measured at the central position as seen in the conveying direction of the workpiece conveying path in the plating tank, in the entire width direction of the long workpiece (the height direction of the plating tank), that is, for example, the upper end clamp in the state of FIG. Measurement was performed between 1 and the lower end clamp 2, and the most bent position was defined as the amount of deflection of the workpiece.

The measurement measured the space | interval of a jet nozzle and a workpiece | work using the ruler, and calculated | required the deflection amount of the workpiece | work from the amount of change.
(Measurement of plating thickness)
For the samples plated in the following examples and comparative examples, the plating thickness variation distribution of the plating layer was measured. The measurement was performed over the entire width direction of the workpiece and at both the front and back surfaces of the workpiece at an arbitrary position in the workpiece length direction (the same direction as the workpiece conveyance direction).

  In Example 1 below, measurement is performed on four lots (lots A to D), and in Comparative Example 1, measurement is performed on two lots (lots 1 and 2). The work width (vertical axis) in FIGS. 7 and 8 showing the measurement results in Example 1 and Comparative Example 1 means the distance from one end to the measurement point when viewed in the width direction of the work. doing.

For measurement, a fluorescent X-ray film thickness measuring instrument SFT3300 manufactured by Seiko Instruments Inc. was used.
[Example 1]
In this example, the workpiece was plated under the plating conditions shown in Table 1 using a plating apparatus equipped with the same plating tank as in FIGS.

上記のようにめっき装置は図３と同様の装置を用いているが、噴流ノズル６はワーク搬送経路に沿って、ワークの各面側（表面側、裏面側）にそれぞれ７５本、すなわち、めっき槽内に計１５０本配置した。噴流ノズルは図３と同様にワークを挟んで噴流ノズル同士が対向するように配置した。そして、各噴流ノズルからのめっき液の供給量は２５Ｌ／ｍｉｎとした。このため、めっき槽に対するめっき液の供給量は表１に示すように、３７５０Ｌ／ｍｉｎとした。

As described above, the plating apparatus uses the same apparatus as that shown in FIG. 3, but 75 jet nozzles 6 are provided on each surface side (front surface side, back surface side) of the work along the work conveyance path, that is, plating. A total of 150 were placed in the tank. The jet nozzles were arranged so that the jet nozzles were opposed to each other with the workpiece sandwiched as in FIG. And the supply amount of the plating solution from each jet nozzle was 25 L / min. For this reason, as shown in Table 1, the supply amount of the plating solution to the plating tank was set to 3750 L / min.

  And, as shown in Table 1, the discharge amount from the work introduction port and the work discharge port was formed on the side wall of the plating tank so that the discharge amount of the plating solution from the plating tank was balanced with the supply amount. The discharge amount from the discharge port was 2250 L / min.

  In addition, the discharge port was arrange | positioned so that the space | interval between discharge ports might be set to 6 m respectively on the two side walls facing the plating surface of a workpiece | work similarly to FIG. Each discharge port is formed in a quadrangular shape (rectangular shape) as shown in FIG. 4, and its height is formed over the range from the bottom of the plating tank to the surface of the plating solution. In addition, the width is adjusted to be the above discharge amount. In this example, it was not confirmed that the level of the plating solution locally decreased around the discharge port.

  Moreover, as shown in FIG. 3, the workpiece introduction port 21 and the workpiece carry-out port 22 have a rectangular opening formed on the side wall of the plating vessel so that the workpiece can be introduced into and removed from the plating vessel. It was not confirmed that the liquid level of the plating solution was also locally reduced in the vicinity of the workpiece introduction port and the workpiece carry-out port.

  The distances 33 and 34 between the electrode 4 and the work 3 were both set to 95 mm.

  Under such conditions, a workpiece in which a copper thin film is formed in advance on the front and back surfaces of a long substrate made of polyimide with a film thickness of 25 μm by sputtering with an upper end clamp and a lower end clamp in the same manner as shown in FIG. The workpiece was gripped and conveyed with the width direction of the workpiece as the vertical direction, and supplied to the plating tank. And copper plating was performed so that plating thickness might be set to 2 micrometers about each surface of a workpiece | work within a plating tank.

FIG. 6 shows the measurement result of the deflection amount of the workpiece in the plating tank, and FIG. 7 shows the measurement result of the plating thickness distribution of the plating layer formed on the workpiece surface after the plating treatment.
[Comparative Example 1]
As shown in Table 1, the plating treatment was performed in the same manner as in Example 1 except that the discharge port was not provided on the side wall of the plating tank, and the plating solution was discharged by overflow from the work introduction port, the work discharge port, and the upper part of the plating tank. went.

  FIG. 6 shows the measurement result of the deflection amount of the workpiece in the plating tank, and FIG. 8 shows the measurement result of the plating thickness distribution of the plating layer formed on the workpiece surface after the plating treatment.

  According to the measurement results of the deflection amount of the workpiece of Example 1 and Comparative Example 1 shown in FIG. 6, in Comparative Example 1 using the conventional plating apparatus, the workpiece deflection of 29.5 mm at the maximum was obtained according to the present invention. In Example 1 that satisfies the requirements, it was confirmed that the maximum reduction was 3.7 mm.

  In addition, by suppressing the deflection of the workpiece in the plating tank in this way, in Comparative Example 1 using the conventional plating apparatus, the plating thickness variation (range) is as large as 1.8 μm regardless of only two lots. On the other hand, in Example 1, even if 4 lots were plated, the range was 0.25 μm, and it was confirmed that the fluctuation of the plating thickness distribution could be eliminated.

[Embodiment 2]
Next, a plating apparatus according to Embodiment 2 of the present invention will be described.

  FIG. 9 is a top view showing an example of a plating apparatus according to Embodiment 2 of the present invention. In the plating apparatus according to the second embodiment, the electrode 4 and the jet nozzle 6 are provided in the plating tank 35, and the plating according to the first embodiment is provided in that the discharge ports 30 are provided in the side walls 31 and 32 of the plating tank 35. Although it is the same as the apparatus, it is different from the plating apparatus according to the first embodiment in that a liquid draining box 40 is provided in the plating tank 35. Also, the plating solution outflow suppression plates 8 are provided at both ends in the longitudinal direction of the plating tank 35, which is different from the plating apparatus according to the first embodiment.

  The liquid draining box 40 is a flow path forming means for forming a flow toward the discharge port 30 after the plating solution flows along the workpiece 3. In the plating apparatus according to the first embodiment, only the discharge port 30 is formed on the side walls 31 and 32, thereby forming a flow toward the discharge port 30 naturally. However, in the plating apparatus according to the second embodiment, A flow path for directing the plating solution to the discharge port 30 is formed by the liquid draining box 40, and the plating solution near the surface of the workpiece 3 is more actively guided to the discharge port 30. Therefore, the liquid draining box 40 is provided perpendicular to the longitudinal direction of the plating tank 35 so as to extend from the vicinity of the surface of the work 3 passing through the center of the plating tank 35, that is, from the vicinity of the center of the plating tank 35 to the discharge port 30. ing.

  The plating solution outflow suppression plate 8 is a plate-like member for disposing a plate having a certain thickness at the entrance / exit of the workpiece 3 and suppressing the plating solution outflow by a buffer function. Therefore, in the plating apparatus according to the second embodiment, the workpiece introduction port 21 and the workpiece carry-out port 22 are provided in the plating solution outflow suppression plate 8. The plating solution outflow suppression plate 8 is not essential and may be provided as necessary. In the plating apparatus according to the first embodiment, the plating solution outflow suppression plate 8 may be provided.

  FIG. 10 is a perspective view showing an example of the liquid draining box 40. As shown in FIG. 10, the liquid draining box 40 is configured as a liquid draining member that can be placed in the plating tank 35 for liquid draining, and includes a box body 41, a liquid inlet 42, a liquid outlet 43, and the like. Have

  The box body 41 is a box for forming a flow path for guiding the plating solution, and may be configured in various shapes as long as it can be a flow path for the plating solution. In FIG. 10, a box body 41 configured as a rectangular parallelepiped box is shown.

  The liquid introduction port 42 is an opening for introducing a plating solution near the surface of the workpiece 3, and is formed on the heel side of the box body 41. Further, the liquid inlet 42 is a side surface of the box body 41 perpendicular to the moving direction of the workpiece 3, that is, the workpiece inlet 21 and / or the workpiece carrying so that the flow of the plating solution along the surface of the workpiece 3 can be introduced. It is provided on the surface facing the outlet 22. The shape of the liquid inlet 42 may be various shapes as long as the plating solution can be introduced. However, since the flow along the surface of the long sheet-like workpiece 3 is formed, as shown in FIG. It is preferable to be configured in a vertically long slit shape. The liquid inlets 42 are preferably formed on both side surfaces of the box body 41.

  The liquid discharge port 43 is an opening through which the plating solution introduced from the liquid introduction port 42 and passed through the box body 41 is discharged to the discharge port 30. Therefore, the liquid discharge port 43 is connected to the discharge port 30.

  The liquid draining box 40 may be made of various materials including metals and the like as long as it can serve as a flow path for the plating solution.

  FIG. 11 is an enlarged view showing an example of the configuration near the liquid draining box 40 in the plating tank 35. In FIG. 11, an example of the specific dimension of the liquid draining box 40 is shown. As described with reference to FIG. 10, the liquid draining box 40 is provided so as to extend perpendicular to the longitudinal direction of the plating tank 35, and the discharge port 30 and the liquid discharge port 43 provided on the side wall 32 of the plating tank 35 are provided. Provided in connection. The box body 41 of the liquid draining box 40 extends to the vicinity of the center through which the workpiece 3 passes, and a liquid introduction port 42 is provided slightly outside the ejection nozzle 6. In the example of FIG. 11, the distance between the liquid inlet 42 and the work 3 is 48 mm, and the opening width of the liquid inlet 42 is 2.0 mm. Moreover, the width | variety of the box main body 41 is 40 mm, and the discharge port 30 and the liquid discharge port 43 are 9.0 mm. These dimensions are merely examples, and can be variously changed according to the application, the size of the plating tank 35, the size of the workpiece 3, and the like.

  In the second embodiment, the liquid draining box 40 is configured as a member separate from the plating tank 35 as a liquid draining member, and is installed in the plating tank 35 and fixed and integrated with the plating tank 35 as an example. However, the plating tank 35 itself may be processed into such a configuration and configured as a plating tank 35 provided with a liquid draining box 40.

  By providing the liquid draining box 40, the flow of the plating solution having a component in a direction other than the direction along the longitudinal direction can be actively guided toward the discharge port 30 before the vortex 23 is generated. Generation of the vortex 23 can be prevented more reliably.

[Example 2]
Table 2 shows the plating conditions of Example 2.

実施例２においては、表２のめっき条件で、実施形態１に係るめっき装置と、実施形態２に係るめっき装置でめっき処理を実施し、ワークのたわみ量を測定した。実施形態１に係るめっき装置は、めっき槽の側壁に排出口を有するが、液抜きボックスを有しないめっき装置であり、実施形態２に係るめっき装置は、めっき槽の側壁に排出口を有するとともに、めっき槽内に液抜きボックスを有するめっき装置である。

In Example 2, plating was performed with the plating apparatus according to Embodiment 1 and the plating apparatus according to Embodiment 2 under the plating conditions in Table 2, and the amount of deflection of the workpiece was measured. The plating apparatus according to the first embodiment has a discharge port on the side wall of the plating tank, but does not have a liquid drain box. The plating apparatus according to the second embodiment has a discharge port on the side wall of the plating tank. A plating apparatus having a liquid draining box in the plating tank.

  The plating conditions shown in Table 2 are the same as in Table 1 in most items, but Table 2 shows the flow rate per jet nozzle not shown in Table 1. Under the plating conditions in Table 1, the flow rate per jet nozzle was 25 L / min × 75 × 2 (both sides), but under the plating conditions in Table 2, the flow rate per jet nozzle was 30 L / min ×. Increased to 75 x 2 (both sides).

  FIG. 12 is a diagram showing an implementation result of Example 2. In FIG. 12, it can be seen that the amount of deflection is reduced in the plating apparatus according to the second embodiment than in the plating apparatus according to the first embodiment. Even in the plating apparatus according to the first embodiment, a sufficient effect of reducing the amount of deflection of the workpiece can be obtained. It was shown by Example 2 that the direction which installed can suppress the deflection amount of a workpiece | work more effectively.

  Thus, according to the plating apparatus which concerns on Embodiment 2, it is set as the plating apparatus which has the structure which inserts the liquid removal box which has a slit-shaped opening in a plating tank, and discharges | emits a plating solution from the plating surface vicinity of a workpiece | work. As a result, the lateral flow becomes stronger, and the deflection of the workpiece can be suppressed.

  Note that the fact that the deflection of the workpiece can be suppressed while the flow rate of the jet nozzle is increased means that the plating process may be performed by increasing the flow rate of the jet nozzle. By increasing the value, the amount of plating per hour can be increased. Therefore, when plating with a predetermined (constant) film thickness is performed, by increasing the flow rate and current density of the jet nozzle, it is possible to increase the workpiece conveyance speed and improve the throughput. As described above, according to the plating apparatus according to the second embodiment, it is possible to improve the throughput while reducing the deflection of the workpiece and keeping the plating film in high quality.

3 Work 4 Electrode 5 Plating Solution 6 Jet Nozzle 21 Work Inlet 22 Work Outlet 30 Outlet 35 Plating Tank 40 Liquid Drain Box 41 Box Body 42 Liquid Inlet 43 Liquid Outlet

Claims (9)

A plating apparatus for plating a long sheet-shaped workpiece,
Formed on the side wall of the plating tank, and a discharge port for discharging the plating solution ;
A jet nozzle for spraying a plating solution against the workpiece in the plating tank ,
The long sheet-shaped workpiece is supplied to the plating tank in a state where the width direction of the long sheet-shaped workpiece is held in the vertical direction,
The outlet has an upper end in the height direction is higher than the liquid level of the plating solution in the plating tank, the lower end is formed so as to reach the lower clamp holds the workpiece bottom plating apparatus.   The plating apparatus according to claim 1, wherein the discharge port is formed such that a height thereof is higher than a liquid level of a plating solution in the plating tank. A plurality of the outlets are provided,
The plating apparatus according to claim 1, wherein the discharge ports are provided at positions facing each other. The plating apparatus as described in any one of Claims 1 thru | or 3 whose distance between an electrode and a workpiece | work is 70 mm or more and 120 mm or less in the said plating tank. A workpiece introduction port provided on a side wall of the plating tank, for introducing the long sheet-shaped workpiece into the plating tank;
Provided on the side wall of the plating tank, and has a work outlet for unloading the long sheet-shaped work from the plating tank,
The plating apparatus as described in any one of Claims 1 thru | or 4 which discharge | releases a plating solution only from the said work inlet, the said workpiece outlet, and the said discharge port. The plating apparatus according to any one of claims 1 to 5 , further comprising a liquid draining unit extending from the discharge port toward a center in the plating tank and having a flow path for guiding a plating solution to the discharge port. . The plating apparatus according to claim 6 , wherein the liquid draining means is a box body having a liquid introduction port at a distal end portion and connected to the discharge port on a side opposite to the liquid introduction port. The plating apparatus according to claim 7 , wherein the liquid introduction port opens in a plane perpendicular to the surface of the workpiece. The plating apparatus according to claim 7 or 8 , wherein the liquid draining means is provided so as to extend in a direction perpendicular to a longitudinal direction of the plating tank.

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