JP6107229B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6107229B2
JP6107229B2 JP2013037948A JP2013037948A JP6107229B2 JP 6107229 B2 JP6107229 B2 JP 6107229B2 JP 2013037948 A JP2013037948 A JP 2013037948A JP 2013037948 A JP2013037948 A JP 2013037948A JP 6107229 B2 JP6107229 B2 JP 6107229B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
light
resin
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013037948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014165468A5 (enExample
JP2014165468A (ja
Inventor
良男 市原
良男 市原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013037948A priority Critical patent/JP6107229B2/ja
Publication of JP2014165468A publication Critical patent/JP2014165468A/ja
Publication of JP2014165468A5 publication Critical patent/JP2014165468A5/ja
Application granted granted Critical
Publication of JP6107229B2 publication Critical patent/JP6107229B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)
JP2013037948A 2013-02-27 2013-02-27 発光装置 Active JP6107229B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013037948A JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013037948A JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Publications (3)

Publication Number Publication Date
JP2014165468A JP2014165468A (ja) 2014-09-08
JP2014165468A5 JP2014165468A5 (enExample) 2016-03-10
JP6107229B2 true JP6107229B2 (ja) 2017-04-05

Family

ID=51615778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013037948A Active JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Country Status (1)

Country Link
JP (1) JP6107229B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6799359B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799356B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799357B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799360B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6793436B2 (ja) * 2017-08-04 2020-12-02 株式会社大一商会 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975646B2 (en) * 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
JP4961978B2 (ja) * 2006-11-30 2012-06-27 日亜化学工業株式会社 発光装置およびその製造方法
US7652297B2 (en) * 2007-09-11 2010-01-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device
WO2012117974A1 (ja) * 2011-02-28 2012-09-07 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JP2014165468A (ja) 2014-09-08

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