JP6086765B2 - Grinding wheel - Google Patents

Grinding wheel Download PDF

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JP6086765B2
JP6086765B2 JP2013049418A JP2013049418A JP6086765B2 JP 6086765 B2 JP6086765 B2 JP 6086765B2 JP 2013049418 A JP2013049418 A JP 2013049418A JP 2013049418 A JP2013049418 A JP 2013049418A JP 6086765 B2 JP6086765 B2 JP 6086765B2
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grinding
grinding wheel
wheel
auxiliary
grindstone
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JP2014172147A (en
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山本　節男
節男 山本
関家　臣之典
臣之典 関家
拓也 三原
拓也 三原
亜樹 高橋
亜樹 高橋
俊 濱岡
俊 濱岡
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Disco Corp
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Disco Corp
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Priority to JP2013049418A priority Critical patent/JP6086765B2/en
Priority to KR1020140022400A priority patent/KR102119908B1/en
Priority to CN201410085262.2A priority patent/CN104044047B/en
Publication of JP2014172147A publication Critical patent/JP2014172147A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • B24B5/045—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally with the grinding wheel axis perpendicular to the workpiece axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、研削装置の研削ホイールに関する。   The present invention relates to a grinding wheel of a grinding apparatus.

ＩＣ、ＬＳＩ、ＬＥＤ等の数多くのデバイスが表面に形成され、且つ個々のデバイスが分割予定ライン（ストリート）によって区画されたウエーハは、研削装置によって裏面が研削されて所定の厚みに加工された後、レーザー加工装置によって個々のデバイスに分割され、分割されたデバイスは携帯電話やパソコン、照明器具等の電気機器に広く利用されている。   A wafer in which a number of devices such as IC, LSI, LED, etc. are formed on the surface, and each device is partitioned by a line to be divided (street), after the back surface is ground by a grinding machine and processed to a predetermined thickness The device is divided into individual devices by a laser processing apparatus, and the divided devices are widely used in electric devices such as mobile phones, personal computers, and lighting equipment.

また、ＩＣ、ＬＳＩ、ＬＥＤ等のデバイスが形成されるシリコンウエーハ、サファイア基板、ＳｉＣ基板はデバイスが形成される前に研削装置によって両面が平坦に研削され、更に必要に応じて研磨装置により研磨されて鏡面に加工される。   In addition, silicon wafers, sapphire substrates, and SiC substrates on which devices such as ICs, LSIs, and LEDs are formed are both ground flat by a grinding device before the devices are formed, and further polished by a polishing device as necessary. And processed into a mirror surface.

研削装置は、ウエーハ等の被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を研削する研削砥石が配設された研削ホイールを回転可能に支持する研削手段と、研削領域に研削水を供給する研削水供給手段とを備えており、ウエーハ又は基板を高精度に所望の厚みに研削することができる。   The grinding apparatus includes a chuck table for holding a workpiece such as a wafer, a grinding means for rotatably supporting a grinding wheel provided with a grinding wheel for grinding the workpiece held on the chuck table, Grinding water supply means for supplying grinding water to the region is provided, and the wafer or substrate can be ground to a desired thickness with high accuracy.

研削ホイールは、研削ユニットを構成するホイールマウントに装着される環状に形成された装着部と該装着部の反対側で環状に形成された自由端部とを有するホイール基台と、該ホイール基台の自由端部に間隔をおいて固着された複数のセグメント砥石とから構成され、セグメント砥石に研削水が供給される構成になっている（例えば、特開２００６−１９８７３７号公報参照）。   A grinding wheel includes a wheel base having a ring-shaped mounting part mounted on a wheel mount constituting a grinding unit, and a free end formed in a ring shape on the opposite side of the mounting part, and the wheel base And a plurality of segment grindstones fixed to the free end portion at intervals. Grinding water is supplied to the segment grindstone (see, for example, JP-A-2006-198737).

特開２００６−１９８７３７号公報JP 2006-198737 A

しかし、サファイア基板、ＳｉＣ基板のようにモース高度が高い被加工物を研削すると、研削抵抗が大きく被加工物の研削面の面精度が悪化するという問題がある。そこで、研削抵抗を小さくするためにセグメント砥石の厚みを薄くすると、セグメント砥石に微細な振動（ビビリ振動）が生じて研削面にうねりが生じるという問題がある。   However, when a workpiece having a high Mohs height, such as a sapphire substrate or a SiC substrate, is ground, there is a problem that the grinding resistance is large and the surface accuracy of the ground surface of the workpiece is deteriorated. Therefore, if the thickness of the segment grindstone is reduced in order to reduce the grinding resistance, there is a problem that fine vibration (chatter vibration) is generated in the segment grindstone, and the grinding surface is wavy.

本発明はこのような点に鑑みてなされたものであり、その目的とするところは、研削抵抗が小さいとともにビビリ振動が生じることのない研削ホイールを提供することである。   The present invention has been made in view of these points, and an object of the present invention is to provide a grinding wheel that has low grinding resistance and does not generate chatter vibration.

本発明によると、研削手段のホイールマウントに装着される研削ホイールであって、該ホイールマウントに装着される環状に形成された装着部と該装着部の反対側で環状に形成された自由端部とを有するホイール基台と、該ホイール基台の該自由端部に配設されリング状に連なる複数の砥石と、を備え、該複数の砥石のそれぞれは、ボンド材にダイアモンド砥粒を混入して焼結した研削砥石と、ボンド材のみを焼結した補助砥石とを含み、該複数の砥石のそれぞれに含まれる該補助砥石は、互いにリング状に連なって該研削砥石を内側から補強し、又は互いにリング状に連なって該研削砥石を外側から補強し、該研削砥石と、該補助砥石と、は、該ホイール基台からの高さが略同一であることを特徴とする研削ホイールが提供される。 According to the present invention, a grinding wheel to be mounted on a wheel mount of a grinding means, wherein an annular mounting portion mounted on the wheel mount and a free end portion formed annularly on the opposite side of the mounting portion And a plurality of grindstones arranged in a ring shape at the free end of the wheel base, each of the grindstones mixed with diamond abrasive grains in the bond material Te and grinding wheel sintered, and a auxiliary grinding wheel obtained by sintering only Bo command member, the auxiliary wheels included in each of the grinding wheel wherein the plurality of reinforced the grinding grindstone continuous with the ring to each other from the inside , or together to reinforce the grinding grindstone continuous with the ring from the outside, and the grinding whetstone, and the auxiliary grinding wheel, the grinding wheel whose height from the wheel base is characterized substantially the same der Rukoto Is provided.

好ましくは、砥石は、研削砥石を内側と外側とから補助砥石によってサンドイッチ状に挟み込んで構成される。或いは、砥石は、補助砥石を内側と外側とから研削砥石によってサンドイッチ状に挟み込んで構成される。好ましくは、ボンド材は、ビトリファイドボンドから構成される。   Preferably, the grindstone is configured by sandwiching the grinding grindstone from the inside and the outside by an auxiliary grindstone. Alternatively, the grindstone is configured by sandwiching an auxiliary grindstone from the inside and the outside by a grinding grindstone. Preferably, the bond material is composed of a vitrified bond.

本発明の研削ホイールによると、ホイール基台の自由端部に配設される砥石は、ボンド材にダイアモンド砥粒を混入して焼結した研削砥石と、研削砥石を内側又は外側から補強するボンド材のみを焼結した補助砥石とから構成されているので、研削砥石の厚みを薄くして研削抵抗を小さくできるとともに補助砥石によって研削砥石が補強され、微細な振動（ビビリ振動）が抑制されて研削面にうねりが生じるという問題を解消できる。   According to the grinding wheel of the present invention, the grindstone disposed at the free end of the wheel base includes a grindstone in which diamond abrasive grains are mixed and sintered in a bond material, and a bond that reinforces the grindstone from the inside or the outside. Since it consists of an auxiliary grinding stone that is made by sintering only the material, the grinding wheel can be reduced in thickness by reducing the thickness of the grinding wheel, and the grinding wheel is reinforced by the auxiliary grinding stone, and fine vibrations (chatter vibration) are suppressed. The problem of waviness on the ground surface can be solved.

本発明の研削ホイールを具備した研削装置の斜視図である。It is a perspective view of a grinding device provided with a grinding wheel of the present invention. 半導体ウエーハの表面に保護テープを貼着する様子を示す斜視図である。It is a perspective view which shows a mode that a protective tape is stuck on the surface of a semiconductor wafer. 図３（Ａ）はホイール基台の底面図、図３（Ｂ）は図３（Ａ）の３Ｂ−３Ｂ線断面図である。3A is a bottom view of the wheel base, and FIG. 3B is a cross-sectional view taken along line 3B-3B of FIG. 3A. 本発明実施形態にかかる研削ホイールの斜視図である。1 is a perspective view of a grinding wheel according to an embodiment of the present invention. セグメント砥石の配列方法を模式的に示す図である。It is a figure which shows typically the arrangement method of a segment grindstone. セグメント砥石の他の配列方法を模式的に示す図である。It is a figure which shows typically the other arrangement | sequence method of a segment grindstone. 実施形態の研削ホイールを使用してウエーハの裏面を研削している様子を示す斜視図である。It is a perspective view which shows a mode that the back surface of a wafer is ground using the grinding wheel of embodiment.

以下、本発明の実施形態を図面を参照して詳細に説明する。図１を参照すると、本発明の研削ホイールを具備した研削装置２の外観斜視図が示されている。４は研削装置２のベースであり、ベース４の後方にはコラム６が立設されている。コラム６には、上下方向に伸びる一対のガイドレール８が固定されている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an external perspective view of a grinding apparatus 2 equipped with a grinding wheel of the present invention is shown. Reference numeral 4 denotes a base of the grinding apparatus 2, and a column 6 is erected on the rear side of the base 4. A pair of guide rails 8 extending in the vertical direction is fixed to the column 6.

この一対のガイドレール８に沿って研削ユニット（研削手段）１０が上下方向に移動可能に装着されている。研削ユニット１０は、スピンドルハウジング１２と、スピンドルハウジング１２を保持する支持部１４を有しており、支持部１４が一対のガイドレール８に沿って上下方向に移動する移動基台１６に取り付けられている。   A grinding unit (grinding means) 10 is mounted along the pair of guide rails 8 so as to be movable in the vertical direction. The grinding unit 10 includes a spindle housing 12 and a support portion 14 that holds the spindle housing 12, and the support portion 14 is attached to a moving base 16 that moves up and down along a pair of guide rails 8. Yes.

研削ユニット１０は、スピンドルハウジング１２中に回転可能に収容されたスピンドル１８と、スピンドル１８を回転駆動するモータ２０と、スピンドル１８の先端に固定されたホイールマウント２２と、ホイールマウント２２に着脱可能に装着された研削ホイール２４とを含んでいる。   The grinding unit 10 includes a spindle 18 rotatably accommodated in a spindle housing 12, a motor 20 that rotationally drives the spindle 18, a wheel mount 22 fixed to the tip of the spindle 18, and a detachable attachment to the wheel mount 22. And a mounted grinding wheel 24.

研削装置２は、研削ユニット１０を一対の案内レール８に沿って上下方向に移動するボールねじ３０とパルスモータ３２とから構成される研削ユニット送り機構３４を備えている。パルスモータ３２を駆動すると、ボールねじ３０が回転し、移動基台１６が上下方向に移動される。   The grinding apparatus 2 includes a grinding unit feed mechanism 34 including a ball screw 30 and a pulse motor 32 that move the grinding unit 10 in the vertical direction along the pair of guide rails 8. When the pulse motor 32 is driven, the ball screw 30 rotates and the moving base 16 is moved in the vertical direction.

ベース４の上面には凹部４ａが形成されており、この凹部４ａにチャックテーブル機構３６が配設されている。チャックテーブル機構３６はチャックテーブル３８を有し、図示しない移動機構によりウエーハ着脱位置Ａと、研削ユニット１０に対向する研削位置Ｂとの間でＹ軸方向に移動される。４０，４２は蛇腹である。ベース４の前方側には、研削装置２のオペレータが研削条件等を入力する操作パネル４４が配設されている。   A recess 4a is formed on the upper surface of the base 4, and a chuck table mechanism 36 is disposed in the recess 4a. The chuck table mechanism 36 has a chuck table 38 and is moved in the Y-axis direction between a wafer attaching / detaching position A and a grinding position B facing the grinding unit 10 by a moving mechanism (not shown). 40 and 42 are bellows. An operation panel 44 is provided on the front side of the base 4 so that an operator of the grinding apparatus 2 can input grinding conditions and the like.

図２を参照すると、半導体ウエーハ１１は、例えば厚さが７００μｍのシリコンウエーハからなっており、表面１１ａに複数のストリート(分割予定ライン)１３が格子状に形成されているとともに、複数のストリート１３によって区画された各領域にＩＣ、ＬＳＩ等のデバイス１５が形成されている。   Referring to FIG. 2, the semiconductor wafer 11 is made of, for example, a silicon wafer having a thickness of 700 μm, and a plurality of streets (division lines) 13 are formed in a lattice shape on the surface 11a. A device 15 such as an IC or an LSI is formed in each of the areas partitioned by.

このように構成された半導体ウエーハ１１は、デバイス１５が形成されているデバイス領域１７と、デバイス領域１７を囲繞する外周余剰領域１９を備えている。また、半導体ウエーハ１１の外周にはシリコンウエーハの結晶方位を示すマークとしてのノッチ２１が形成されている。   The semiconductor wafer 11 configured as described above includes a device region 17 in which the device 15 is formed, and an outer peripheral surplus region 19 that surrounds the device region 17. A notch 21 is formed on the outer periphery of the semiconductor wafer 11 as a mark indicating the crystal orientation of the silicon wafer.

ウエーハ１１の裏面１１ｂの研削に先立って、ウエーハ１１の表面１１ａには、保護テープ貼着工程により保護テープ２３が貼着される。保護テープ２３は、例えばポリエチレン塩化ビニル、ポリオリフィン等の一面に紫外線硬化型粘着材（糊層）を配設した紫外線硬化型粘着テープである。   Prior to grinding the back surface 11b of the wafer 11, the protective tape 23 is attached to the front surface 11a of the wafer 11 by a protective tape attaching process. The protective tape 23 is an ultraviolet curable adhesive tape in which an ultraviolet curable adhesive material (glue layer) is disposed on one surface of, for example, polyethylene vinyl chloride or polyolefin.

図３（Ａ）を参照すると、図４に示された研削ホイール２４を構成するホイール基台２６の底面図が示されている。図３（Ｂ）は図３（Ａ）の３Ｂ−３Ｂ線断面図である。図４に示すように、研削ホイール２４のホイール基台２６は、ホイールマウント２２に装着される環状に形成された装着部２６ａと、装着部２６ａの反対側で同じく環状に形成された自由端部２６ｂを有している。図３（Ａ）に示されるように、ホイール基台２６の自由端部２６ｂには所定深さの環状嵌合溝２７が形成されている。   Referring to FIG. 3A, a bottom view of the wheel base 26 constituting the grinding wheel 24 shown in FIG. 4 is shown. FIG. 3B is a cross-sectional view taken along line 3B-3B of FIG. As shown in FIG. 4, the wheel base 26 of the grinding wheel 24 includes an annular mounting portion 26a to be mounted on the wheel mount 22, and a free end portion that is also annularly formed on the opposite side of the mounting portion 26a. 26b. As shown in FIG. 3A, an annular fitting groove 27 having a predetermined depth is formed in the free end portion 26 b of the wheel base 26.

図４に示すように、ホイール基台２６の装着部２６ａには研削ホイール２４をホイールマウント２２に装着するためのねじ穴３３と、ホイール基台２６を上下方向に貫通する円周方向に所定間隔離間した複数の研削水供給孔３１が形成されている。   As shown in FIG. 4, the mounting portion 26a of the wheel base 26 has a screw hole 33 for mounting the grinding wheel 24 to the wheel mount 22, and a predetermined interval in the circumferential direction penetrating the wheel base 26 in the vertical direction. A plurality of spaced grinding water supply holes 31 are formed.

図５（Ａ）及び図４に示すように、第１実施形態の研削ホイール２４では、ホイール基台２６の自由端部２６ｂには、研削砥石２８ａと、研削砥石２８ａを外側から補強する補助砥石２８ｂを半径方向に密着させて環状嵌合溝２７中にリング状に配設し、複数個の砥石２８が接着剤により嵌合溝２７中に固定されている。   As shown in FIGS. 5A and 4, in the grinding wheel 24 of the first embodiment, a grinding wheel 28 a and an auxiliary grinding wheel that reinforces the grinding wheel 28 a from the outside are provided on the free end portion 26 b of the wheel base 26. 28b is closely attached in the radial direction and arranged in a ring shape in the annular fitting groove 27, and a plurality of grindstones 28 are fixed in the fitting groove 27 by an adhesive.

即ち、本実施形態の研削ホイール２４では、砥石２８が、ボンド剤にダイアモンド砥粒を混入して焼結した研削砥石２８ａと、ボンド剤のみを焼結した補助砥石２８ｂとを含み、研削砥石２８ａを内側に補助砥石２８ｂを外側に半径方向に密着させて配置し、複数の研削砥石２８ａと補助砥石２８ｂとが嵌合溝２７中にリング状に固定されている。本実施形態では、ボンド材としてビトリファイドボンドを採用した。   That is, in the grinding wheel 24 of the present embodiment, the grindstone 28 includes a grindstone 28a that is sintered by mixing diamond abrasive grains in the bond agent, and an auxiliary grindstone 28b that is obtained by sintering only the bond agent, and the grindstone 28a. Auxiliary grindstones 28b are arranged in close contact with each other in the radial direction, and a plurality of grinding grindstones 28a and auxiliary grindstones 28b are fixed in a ring shape in the fitting groove 27. In this embodiment, vitrified bond is adopted as the bond material.

図５（Ｂ）を参照すると、複数の砥石２８の他の配列方法の模式図が示されている。本実施形態では、研削砥石２８ａを外側に補助砥石２８ｂを内側にして半径方向に密着させて配置し、複数の研削砥石２８ａ及び補助砥石２８ｂを嵌合溝２７中にリング状に固定している。   With reference to FIG. 5 (B), the schematic diagram of the other arrangement | sequence method of the some grindstone 28 is shown. In the present embodiment, the grinding wheel 28 a is disposed outside and the auxiliary grinding wheel 28 b is disposed inside in close contact with each other in the radial direction, and the plurality of grinding wheels 28 a and the auxiliary grinding stone 28 b are fixed in a ring shape in the fitting groove 27. .

図６（Ａ）を参照すると、複数の砥石２８の配列方法の他の実施形態が示されている。本実施形態では、研削砥石２８ａを内側と外側とから補助砥石２８ｂによってサンドイッチ状に挟み込み、この組合せを嵌合溝２７中に複数個配列してリング状に構成している。   Referring to FIG. 6A, another embodiment of a method for arranging a plurality of grindstones 28 is shown. In this embodiment, the grinding wheel 28a is sandwiched between the inner side and the outer side by the auxiliary wheel 28b, and a plurality of these combinations are arranged in the fitting groove 27 to form a ring shape.

図６（Ｂ）を参照すると、複数の砥石２８の配列方法の更に他の実施形態が示されている。本実施形態では、補助研削砥石２８ｂを内側と外側とから研削砥石２８ａによってサンドイッチ状に挟み込み、この組合せを嵌合溝２７中に複数個配列してリング状に構成している。   Referring to FIG. 6B, still another embodiment of a method for arranging a plurality of grindstones 28 is shown. In the present embodiment, the auxiliary grinding wheel 28b is sandwiched between the inner side and the outer side by the grinding wheel 28a, and a plurality of these combinations are arranged in the fitting groove 27 to form a ring shape.

以下、上述した各実施形態の砥石２８を構成する研削砥石２８ａ及び補助砥石２８ｂの製造方法の一例について説明する。   Hereinafter, an example of a method for manufacturing the grinding wheel 28a and the auxiliary grinding wheel 28b constituting the grinding wheel 28 of each embodiment described above will be described.

研削砥石２８ａ及び補助砥石２８ｂの製造方法
（１）粒径φ０．５μｍ（＃８０００）のダイアモンド砥粒と、ＳｉＯ２を主成分としＮａＯ、Ｂ２Ｏ３、ＣａＯ等を副成分とするビトリファイドボンド材と、珪酸ナトリウム（ゲル状の無機質発泡剤）と、粒径φ５０μｍ前後の有機物粒子「ポリスチレン（ＰＳ）系、ポリメタクリル酸エステル（ＰＭＭＡ）系の有機物粒子（商品名ガッツパール：ガッツ化成株式会社）」とを混練して造粒し顆粒物（粒径φ３５０μｍ〜φ５０μｍ）を生成する。
（２）ＳｉＯ２を主成分としＮａＯ、Ｂ２Ｏ３、ＣａＯ等を副成分とするビトリファイドボンド材と、珪酸ナトリウム（ゲル状の無機質発泡剤）と、粒径φ５０μｍ前後の有機物粒子「ポリスチレン（ＰＳ）系、ポリメタクリル酸エステル（ＰＭＭＡ）系の有機物粒子（商品名ガッツパール：ガッツ化成株式会社）」とを混練して造粒し顆粒物（粒径φ３５０μｍ〜φ５０μｍ）を生成する。
（３）セグメントを形成する枠体内に（１）の顆粒物と（２）の顆粒物とを層状に積層して充填し所定の形状に加圧成形する。
（４）焼結炉内に成形された顆粒物を搬入する。
（５）焼結炉内の温度を約２時間かけて６５０℃まで上昇させ、その後６５０℃を約６時間維持した後、約６時間かけて常温に戻して研削砥石２８ａと補助砥石２８ｂとを一体に形成する。
（６）焼結炉内から一体になった研削砥石２８ａと補助砥石２８ｂを搬出し、切断加工等によってセグメント形状に整形する。 Manufacturing method of grinding wheel 28a and auxiliary wheel 28b (1) Diamond abrasive grains having a particle diameter of 0.5 μm (# 8000) and vitrified bond having SiO 2 as a main component and NaO, B 2 O 3 , CaO, etc. as auxiliary components Material, sodium silicate (gel-like inorganic foaming agent), organic particles with a particle diameter of around 50 μm “polystyrene (PS) -based, polymethacrylic acid ester (PMMA) -based organic particles (trade name Gutspearl: Guts Kasei Co., Ltd.) And kneaded and granulated to produce granules (particle size φ350 μm to φ50 μm).
(2) A vitrified bond material containing SiO 2 as a main component and NaO, B 2 O 3 , CaO or the like as a minor component, sodium silicate (gel-like inorganic foaming agent), and organic particles “polystyrene (diameter around φ50 μm) PS) -based and polymethacrylic acid ester (PMMA) -based organic particles (trade name Gutspearl: Guts Kasei Co., Ltd.) are kneaded and granulated to produce granules (particle size φ350 μm to φ50 μm).
(3) The granule of (1) and the granule of (2) are laminated and filled in a frame forming a segment, and pressure-molded into a predetermined shape.
(4) Bring the formed granule into the sintering furnace.
(5) The temperature in the sintering furnace is raised to 650 ° C. over about 2 hours, and then maintained at 650 ° C. for about 6 hours. Then, the temperature is returned to room temperature over about 6 hours, and the grinding wheel 28a and the auxiliary wheel 28b are Integrally formed
(6) The grindstone 28a and the auxiliary grindstone 28b integrated from the inside of the sintering furnace are taken out and shaped into a segment shape by cutting or the like.

次に、本実施形態の研削ホイール２４を使用したウエーハ１１の研削方法について図７を参照して説明する。図７に示すように、研削ユニット１０のスピンドル１８の先端に固定されたホイールマウント２２には、複数のねじ３５により研削ホイール２４が着脱可能に装着されている。研削ホイール２４は、ホイール基台２６の自由端部に研削砥石２８ａと補助砥石２８ｂとを半径方向に密着させてリング状に固着して構成されている。   Next, a method for grinding the wafer 11 using the grinding wheel 24 of the present embodiment will be described with reference to FIG. As shown in FIG. 7, a grinding wheel 24 is detachably attached to a wheel mount 22 fixed to the tip of the spindle 18 of the grinding unit 10 by a plurality of screws 35. The grinding wheel 24 is configured by adhering a grinding wheel 28a and an auxiliary wheel 28b to a free end portion of a wheel base 26 in the radial direction and fixing them in a ring shape.

研削装置のチャックテーブル３８でウエーハ１１の表面に貼着された保護テープ２３側を吸着保持し、チャックテーブル３８を矢印ａで示す方向に例えば３００ｒｐｍで回転しつつ、研削ホイール２４を矢印ｂで示す方向に例えば６０００ｒｐｍで回転させるとともに、研削ユニット送り機構３４を駆動して研削ホイール２４の研削砥石２８ａ及び補助砥石２８ｂをウエーハ１１の裏面１１ｂに接触させる。   The grinding tape 24 is indicated by an arrow b while the chuck table 38 of the grinding device sucks and holds the protective tape 23 attached to the surface of the wafer 11 and rotates the chuck table 38 in the direction indicated by the arrow a at, for example, 300 rpm. For example, the grinding unit feeding mechanism 34 is driven to bring the grinding wheel 28 a and the auxiliary grinding wheel 28 b of the grinding wheel 24 into contact with the back surface 11 b of the wafer 11.

そして、研削ホイール２４を所定の研削送り速度（例えば１μｍ／ｓ）で下方に所定量研削送りしてウエーハ１１の研削を実施する。接触式又は非接触式の厚み測定ゲージでウエーハ１１の厚さを測定しながら、ウエーハ１１を所望の厚さ、例えば１００μｍに研削する。   Then, the wafer 11 is ground by feeding a predetermined amount of the grinding wheel 24 downward at a predetermined grinding feed rate (for example, 1 μm / s). While measuring the thickness of the wafer 11 with a contact-type or non-contact-type thickness measurement gauge, the wafer 11 is ground to a desired thickness, for example, 100 μm.

上述した各実施形態の研削ホイール２４によると、複数の砥石２８は、ボンド材にダイアモンド砥粒を混入して焼結した研削砥石２８ａと、研削砥石２８ａを内側又は外側から補強する補助砥石２８ｂとから構成されているので、研削砥石２８ａの厚みを薄くして研削抵抗を小さくできるとともに補助砥石２８ｂによって研削砥石２８ａが補強され、微細な振動（ビビリ振動）が抑制されて研削面にうねりが生じるという問題を解消できる。   According to the grinding wheel 24 of each embodiment described above, the plurality of grindstones 28 include a grinding grindstone 28a in which diamond abrasive grains are mixed and sintered in a bond material, and an auxiliary grindstone 28b that reinforces the grindstone 28a from the inside or the outside. Therefore, the grinding wheel 28a can be reduced by reducing the thickness of the grinding wheel 28a, and the auxiliary grinding wheel 28b reinforces the grinding wheel 28a, thereby suppressing minute vibrations (chatter vibrations) and causing waviness on the ground surface. Can be solved.

１０ 切削ユニット（切削手段）
１１ 半導体ウエーハ
２２ ホイールマウント
２３ 保護テープ
２４ 研削ホイール
２６ ホイール基台
２８ 砥石
２８ａ 研削砥石
２８ｂ 補助砥石
３８ チャックテーブル 10 Cutting unit (cutting means)
DESCRIPTION OF SYMBOLS 11 Semiconductor wafer 22 Wheel mount 23 Protective tape 24 Grinding wheel 26 Wheel base 28 Grinding wheel 28a Grinding wheel 28b Auxiliary grindstone 38 Chuck table

Claims (4)

研削手段のホイールマウントに装着される研削ホイールであって、
該ホイールマウントに装着される環状に形成された装着部と該装着部の反対側で環状に形成された自由端部とを有するホイール基台と、
該ホイール基台の該自由端部に配設されリング状に連なる複数の砥石と、を備え、
該複数の砥石のそれぞれは、ボンド材にダイアモンド砥粒を混入して焼結した研削砥石と、ボンド材のみを焼結した補助砥石とを含み、
該複数の砥石のそれぞれに含まれる該補助砥石は、互いにリング状に連なって該研削砥石を内側から補強し、又は互いにリング状に連なって該研削砥石を外側から補強し、
該研削砥石と、該補助砥石と、は、該ホイール基台からの高さが略同一であることを特徴とする研削ホイール。 A grinding wheel mounted on a wheel mount of a grinding means,
A wheel base having a ring-shaped mounting portion mounted on the wheel mount and a free end formed in a ring shape on the opposite side of the mounting portion;
A plurality of grindstones arranged at the free end of the wheel base and connected in a ring shape ,
Each of the plurality of grinding wheel comprises a grinding wheel having sintered by mixing diamond abrasive grains bond material, and an auxiliary grinding wheel obtained by sintering only Bo command member,
The auxiliary whetstones included in each of the plurality of whetstones are connected to each other in a ring shape to reinforce the grinding whetstone from the inside, or connected to each other in a ring shape to reinforce the whetstone from the outside,
And the grinding grindstone, and the auxiliary grinding wheel, the grinding wheel whose height from the wheel base is characterized substantially the same der Rukoto. 該砥石は、該研削砥石を内側と外側とから該補助砥石によってサンドイッチ状に挟み込んで構成される請求項１記載の研削ホイール。   The grinding wheel according to claim 1, wherein the grinding wheel is configured by sandwiching the grinding wheel from the inside and the outside by the auxiliary grinding stone. 該砥石は、該補助砥石を内側と外側とから該研削砥石によってサンドイッチ状に挟み込んで構成される請求項１記載の研削ホイール。   The grinding wheel according to claim 1, wherein the grinding wheel is configured by sandwiching the auxiliary grinding stone from the inside and the outside by the grinding stone. 該ボンド材は、ビトリファイドボンドから構成される請求項１〜３の何れかに記載の研削ホイール。   The grinding wheel according to claim 1, wherein the bond material is made of vitrified bond.
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CN2885506Y (en) * 2005-12-21 2007-04-04 梁建湘 Diamond edge-abrasive wheel
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