JP6084799B2 - イメージセンサによるデータ取得方法 - Google Patents
イメージセンサによるデータ取得方法 Download PDFInfo
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- JP6084799B2 JP6084799B2 JP2012221489A JP2012221489A JP6084799B2 JP 6084799 B2 JP6084799 B2 JP 6084799B2 JP 2012221489 A JP2012221489 A JP 2012221489A JP 2012221489 A JP2012221489 A JP 2012221489A JP 6084799 B2 JP6084799 B2 JP 6084799B2
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- 238000000034 method Methods 0.000 title claims description 40
- 239000002245 particle Substances 0.000 claims description 27
- 238000001514 detection method Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Measurement Of Radiation (AREA)
Description
− 当該方法は、3回目に前記画素の第3読み取り値として前記画素の電圧を読み取る後続の工程を有する。
− 前記2回目に前記画素の電圧を読み取る工程と前記3回目に前記画素の電圧を読み取る後続の工程との間では、リセットが起こらない。
− 当該方法は、前記第3読み取り値から前記第2読み取り値を減ずることによって第2信号を決定する工程を有する。
102 所定の信号レベル
103 電圧値
104 電圧値
105 電圧値
106 リセット電圧値
Claims (9)
- 粒子又は光子を検出するためのイメージセンサによるデータ取得方法であって、該イメージセンサが多数の画素を有し、リセットを用いて前記画素を所定の状態にし、
画素の電圧をリセットする工程、
1回目に前記画素の電圧を読み取る工程であり、前記画素の第1読み取り値を得る工程、
2回目に各画素の電圧を読み取る工程であり、前記画素の第2読み取り値を得る工程、
前記画素の前記第2読み取り値から前記第1読み取り値を減ずることによって第1信号を決定する工程、
3回目に前記画素の電圧を読み取る後続の工程であり、前記画素の第3読み取り値を得、前記の2回目に画素の電圧を読み取る工程と前記の3回目に画素の電圧を読み取る後続の工程との間にリセットが起こらない、工程、
前記第3読み取り値から前記第2読み取り値を減ずることによって第2信号を決定する工程、及び
後続で得た読み取り値との間の変化を、衝突する粒子が生じさせる最小値と比較することにより粒子又は光子の衝突を決定する工程、
を有することを特徴とする方法。 - 前記の3回目に前記画素の電圧を読み取る工程後に、リセットが起こる前に前記画素が複数回読み取られ、複数の読み取り値を得て、読み取り値を前回の読み取り値から減ずるという対の処理によって複数の信号を決定する、
請求項1に記載の方法。 - 前記粒子が、電子、中性子及び陽電子からなる群から選ばれる、請求項1又は2に記載の方法。
- 一群の隣接する画素の信号の変化から、粒子又は光子の衝突の検出が推定される、
請求項1乃至3のいずれか1項に記載の方法。 - 前記イメージセンサはCMOSセンサで、かつ
各画素は、所定数の読み取り後にリセットされる、
請求項1乃至4のうちのいずれか1項に記載の方法。 - 前記イメージセンサはCMOSセンサで、かつ
最後の像を表す一連の読み取りにおいて、少なくとも1つの画素が、所定の値よりも大きな読み取り値を有するときにリセットが生成される、
請求項1乃至4のうちのいずれか1項に記載の方法。 - 前記イメージセンサはCMOSセンサで、かつ
画素が所定の値よりも大きな読み取り値を有するときに、該画素についてリセットが独立に生成される、
請求項1乃至4のうちのいずれか1項に記載の方法。 - 前記イメージセンサはCCDセンサで、かつ
リセットされる画素は、一連の画素の出力ノードである、
請求項1乃至4のうちのいずれか1項に記載の方法。 - 放射線を検出するカメラであって、イメージセンサと、該イメージセンサの読み取り及びリセットを制御する制御装置とを有し、
前記制御装置は、請求項1乃至8のうちいずれか1項に記載の方法を実行するようにプログラムされていることを特徴とする、
カメラ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11184107.8A EP2579575A1 (en) | 2011-10-06 | 2011-10-06 | Method for acquiring data with an image sensor |
EP11184107.8 | 2011-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013085241A JP2013085241A (ja) | 2013-05-09 |
JP6084799B2 true JP6084799B2 (ja) | 2017-02-22 |
Family
ID=45558429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012221489A Active JP6084799B2 (ja) | 2011-10-06 | 2012-10-03 | イメージセンサによるデータ取得方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8817148B2 (ja) |
EP (2) | EP2579575A1 (ja) |
JP (1) | JP6084799B2 (ja) |
CN (1) | CN103037175B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3012710B1 (fr) * | 2013-10-29 | 2017-02-10 | Commissariat Energie Atomique | Procede de traitement de signaux delivres par des pixels d'un detecteur |
US9986179B2 (en) * | 2014-09-30 | 2018-05-29 | Qualcomm Incorporated | Sensor architecture using frame-based and event-based hybrid scheme |
EP3120897A1 (en) | 2015-07-22 | 2017-01-25 | Université Pierre et Marie Curie (Paris 6) | Method for downsampling a signal outputted by an asynchronous sensor |
CN105258804B (zh) * | 2015-08-17 | 2018-10-26 | 电子科技大学 | 发送和接收太赫兹或者红外焦平面探测器阵列数据的方法 |
US10122946B2 (en) | 2015-11-11 | 2018-11-06 | Fei Company | Method for detecting particulate radiation |
JP6700828B2 (ja) | 2016-02-10 | 2020-05-27 | キヤノン株式会社 | 放射線撮像装置、その駆動方法及び撮像システム |
US10516841B2 (en) * | 2017-03-08 | 2019-12-24 | Samsung Electronics Co., Ltd. | Pixel, pixel driving circuit, and vision sensor including the same |
US10014158B1 (en) | 2017-05-09 | 2018-07-03 | Fei Company | Innovative image processing in charged particle microscopy |
CN112399115A (zh) * | 2019-08-15 | 2021-02-23 | 天津大学青岛海洋技术研究院 | 一种提高小尺寸像素图像传感器动态范围的工作方式 |
US11297276B1 (en) * | 2020-09-30 | 2022-04-05 | Fei Company | Method and system for high speed signal processing |
US11694874B2 (en) | 2021-07-13 | 2023-07-04 | Fei Company | Method and system for generating a diffraction image |
EP4322199A1 (en) | 2022-08-09 | 2024-02-14 | Fei Company | System for sensor protection in electron imaging applications |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3631114B2 (ja) * | 2000-08-01 | 2005-03-23 | キヤノン株式会社 | 撮像装置 |
JP4251811B2 (ja) * | 2002-02-07 | 2009-04-08 | 富士通マイクロエレクトロニクス株式会社 | 相関二重サンプリング回路とこの相関二重サンプリング回路を備えたcmosイメージセンサ |
EP1391932A1 (en) | 2002-08-22 | 2004-02-25 | STMicroelectronics Limited | Solid state image sensor |
JP4468083B2 (ja) * | 2003-08-26 | 2010-05-26 | キヤノン株式会社 | 放射線撮影装置、放射線撮影方法 |
US7262411B2 (en) | 2004-12-08 | 2007-08-28 | The Regents Of The University Of California | Direct collection transmission electron microscopy |
US7714903B2 (en) * | 2006-08-29 | 2010-05-11 | Zoran Corporation | Wide dynamic range image capturing system method and apparatus |
EP2009422B1 (en) | 2007-06-29 | 2009-08-12 | FEI Company | Method for attaching a sample to a manipulator |
EP2051280A1 (en) | 2007-10-18 | 2009-04-22 | The Regents of the University of California | Motorized manipulator for positioning a TEM specimen |
US9584710B2 (en) * | 2008-02-28 | 2017-02-28 | Avigilon Analytics Corporation | Intelligent high resolution video system |
JP5521721B2 (ja) * | 2009-08-28 | 2014-06-18 | ソニー株式会社 | 撮像素子およびカメラシステム |
TWI441512B (zh) * | 2009-10-01 | 2014-06-11 | Sony Corp | 影像取得裝置及照相機系統 |
EP2381236A1 (en) | 2010-04-23 | 2011-10-26 | Fei Company | Apparatus for preparing a cryogenic TEM specimen |
EP2383769A1 (en) | 2010-04-28 | 2011-11-02 | Fei Company | Method of using a direct electron detector for a TEM |
JP5065516B2 (ja) | 2010-08-04 | 2012-11-07 | エフ イー アイ カンパニ | 薄い電子検出器における後方散乱の減少 |
EP2461347A1 (en) | 2010-12-06 | 2012-06-06 | Fei Company | Detector system for transmission electron microscope |
EP2461348A1 (en) | 2010-12-06 | 2012-06-06 | FEI Company | Detector system for use with transmission electron microscope spectroscopy |
EP2509097A1 (en) | 2011-04-07 | 2012-10-10 | FEI Company | Method of protecting a radiation detector in a charged particle instrument |
-
2011
- 2011-10-06 EP EP11184107.8A patent/EP2579575A1/en not_active Withdrawn
-
2012
- 2012-09-29 CN CN201210370953.8A patent/CN103037175B/zh active Active
- 2012-10-03 JP JP2012221489A patent/JP6084799B2/ja active Active
- 2012-10-05 EP EP12187329.3A patent/EP2579578B1/en active Active
- 2012-10-05 US US13/645,725 patent/US8817148B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103037175B (zh) | 2016-09-28 |
EP2579578B1 (en) | 2014-06-25 |
US20130093931A1 (en) | 2013-04-18 |
EP2579578A1 (en) | 2013-04-10 |
CN103037175A (zh) | 2013-04-10 |
JP2013085241A (ja) | 2013-05-09 |
EP2579575A1 (en) | 2013-04-10 |
US8817148B2 (en) | 2014-08-26 |
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