JP6079554B2 - Manufacturing method of semiconductor wafer - Google Patents

Description

  The present invention relates to a method for manufacturing a semiconductor wafer, particularly a single crystal silicon wafer.

  In general, a large-diameter silicon wafer represented by a diameter of 300 mm is manufactured by the following processing flow. However, description of the silicon wafer cleaning process and the inspection process performed between the processes is omitted below. First, in a cutting process, a thin silicon wafer is cut out from a work (silicon single crystal ingot). At this time, a free abrasive slurry in which abrasive grains such as silicon carbide are suspended is supplied to a plurality of wire trains that reciprocate at high speed, and the workpiece is pressed against the wire train to which the slurry is adhered while being fed at a predetermined speed, so that the thin plate A wafer is cut out.

In the chamfering step, the outer peripheral portion of the cut silicon wafer is rounded using a rotating diamond grindstone having a total groove. By rounding the outer periphery of the silicon wafer, chipping and cracking can be prevented from occurring in the silicon wafer in the subsequent process.
In the lapping step, a plurality of chamfered silicon wafers held by a carrier are sandwiched between cast iron upper and lower surface plates to which a load is applied. A plurality of chamfered silicon wafers are rotated and lapped between upper and lower surface plates while supplying a grinding liquid in which loose abrasive grains made of alumina, zirconia, or the like are suspended.

In the etching process, the lapped silicon wafer is immersed in a high-temperature sodium hydroxide aqueous solution or potassium hydroxide aqueous solution to remove the work-affected layer (damage layer) introduced into the front and back surfaces and chamfered portions.
In the edge polishing step, a resin pad such as urethane is pressed against the chamfered portion of the silicon wafer with a predetermined pressure to mirror the chamfered portion. At this time, the chamfered portion is mirror-finished while supplying slurry containing colloidal silica or the like adjusted to pH to the surface of the resin pad.

In the double-side polishing step, a silicon wafer held by a carrier is sandwiched between resin pads such as urethane attached to an upper and lower surface plate to which a load is applied. Then, while supplying the slurry containing colloidal silica or the like adjusted in pH, the upper and lower surface plates are rotated, and the etched and edge-polished silicon wafer is polished and rotated, and both surfaces are mirrored simultaneously.
Finally, in the final polishing step, using a slurry with adjusted pH containing colloidal silica or the like, pressure is applied to the surface plate with a resin pad such as urethane applied from the back surface of the silicon wafer that has been polished on both sides. Only the surface of the silicon wafer is brought into contact, and fine surface roughness is adjusted.

JP 2008-78473 A JP 2008-161992 A JP 2009-190125 A JP 2000-31099 A

  In advanced devices employing a large diameter silicon wafer typified by a diameter of 300 mm, in recent years, the size of the surface swell component of the wafer called nanotopography is regarded as important. Nanotopography is a kind of surface shape of a wafer, and shows a concavo-convex of a wavelength component of 0.2 to 20 mm having a wavelength shorter than that of warp or warp and a wavelength longer than the surface roughness, and PV value (Peak to Valley) is a very shallow wave component of 0.1 to 0.2 μm. This nanotopography affects the yield of STI (Shallow Trench Isolation) process in the device process. For this reason, along with miniaturization of design rules, a strict level is required for nanotopography of the surface of a silicon wafer that is a device substrate.

  Nanotopography is created by a silicon wafer processing process. Particularly, it is easy to deteriorate in a processing method having no reference surface, for example, a cutting process using a wire saw or a grinding process using a double-head grinding apparatus, and improvement and management of each process are important. Nanotopography on the surface of a wafer cut by a wire saw can be evaluated in advance by measuring pseudo nanotopography (hereinafter referred to as pseudo-nanotopography) measured by a capacitance measuring instrument (see Patent Document 1). ). According to Patent Document 1, pseudo-nanotopography is a method in which a numerical value correlated with a polished wafer is simulated by applying a bandpass filter simulating the processing characteristics of grinding or polishing to the warp cross-sectional waveform of the wafer after cutting. To gain. Nanotopography is obtained by measuring the surface of a wafer after polishing, while pseudo nanotopography is obtained from the surface of a wafer after cutting.

  Regarding wire saws used in the cutting process, in recent years, instead of loose abrasive methods, fixed abrasive method wire saws using wires in which fixed abrasive particles such as diamond are electrodeposited and fixed on the wire surface have been studied. Yes. When cutting a large-diameter silicon ingot with a fixed-abrasive wire saw, the cutting time can be significantly reduced compared to cutting with a loose-abrasive wire saw, but the representative is the pseudo-nanotopography of the wafer after cutting. It is known that the shape quality to be remarkably inferior.

  On the other hand, Patent Document 2 describes a method of cutting while supplying free abrasive slurry to a fixed abrasive wire. Patent Document 2 describes that the sharpness is maintained by dressing the surface of the fixed abrasive wire with the free abrasive slurry and the cutting accuracy is improved. However, in the method of combining fixed abrasive grains and loose abrasive grains, the dressing effect is easily affected by cutting conditions, the wafer shape deteriorates after cutting due to insufficient dressing, and the life of the fixed abrasive wire decreases due to excessive dressing. There is a problem that it is easy to invite.

  With respect to the lapping process, when processing is performed using the above-described lapping apparatus including the cast iron upper and lower surface plates, since the occupied area of the wafer with respect to the surface plate is not uniform, the surface plate is likely to be unevenly worn. Therefore, the shape of the wafer is likely to deteriorate, and there is a limit to processing a wafer with high flatness. Further, it is difficult to make the fine abrasive grains used for lapping fine, and this is a processing method that is unsuitable for reducing the depth of the damaged layer of the wafer. In order to solve such a problem, a single wafer grinding method has been proposed as an alternative to the lapping method described above.

For example, Patent Document 3 proposes a method of grinding both surfaces of a wafer simultaneously with a grindstone using abrasive grains such as diamond (hereinafter referred to as a double-head grinding method). In this double-head grinding method, first, a wafer is inserted into a hole of a resin or metal ring-shaped holder that is thinner than the wafer. Then, the wafer is rotated and held by the engagement between the notch portion of the wafer and the protrusion formed on the holder, two opposing grindstones substantially equal to the radius of the wafer are rotated, and the wafer is simultaneously ground from both sides. When using fixed abrasive grains, grinding can be performed at a higher speed than when using loose abrasive slurry. By making the abrasive grains finer, the processing is shallower than when grinding with loose abrasive grains. Wafers with altered layers can be obtained.
In recent years, studies on grinding with a grindstone using diamond grains having a count of # 8000 or more (average abrasive grain size of 1 μm or less) are also in progress. In this way, if grinding is performed using abrasive grains having a large count, it is possible to significantly reduce the polishing amount and polishing time in the double-side polishing step, which is a subsequent step.

  However, when a grinding method using a grindstone using abrasive grains having a count of # 8000 or more is performed on a wafer immediately after being cut out with a wire saw, it is impossible to obtain a normal ground surface. This is because the surface roughness of the wafer immediately after the cutting process is large, and diamond abrasive grains are severely dropped during grinding. Therefore, for example, as disclosed in Patent Document 4, primary double-head grinding for removing the surface roughness of the wafer is necessary before grinding with a grindstone using high-grade abrasive grains. In the primary double-head grinding process, diamond grains having a vitrified bond count of # 2000 to # 3000 (average abrasive grain size of 2 to 8 μm) are generally used, and after being cut by a fixed abrasive grain type wire saw It is possible to grind even a wafer having a large surface roughness. And since the surface roughness of a wafer improves in this primary double-head grinding process, it becomes possible to grind using a grindstone using a high count abrasive grain.

  As described above, conventionally, when using a grindstone using a # 8000 or more abrasive grain, the amount of polishing and the polishing time in the double-side polishing process, which is a subsequent process, can be greatly reduced, but grinding is frequently performed. There is a problem that it is necessary to carry out in stages, and deterioration of productivity due to an increase in the number of grinding steps is unavoidable. There is also a problem that the kerf loss of the wafer increases due to an increase in the grinding process.

  The present invention has been made in view of the above-described problems, and has reduced the number of grinding steps and kerf loss, while greatly reducing the polishing amount and polishing time in the double-side polishing step, and has a highly accurate shape quality semiconductor. An object of the present invention is to provide a semiconductor wafer manufacturing method capable of obtaining a wafer.

  In order to achieve the above object, according to the present invention, a wire to which abrasive grains are fixed is wound around a plurality of grooved rollers, the wire is reciprocated in an axial direction, and a workpiece is placed on the reciprocating wire. A semiconductor wafer manufacturing method including a cutting step of cutting a wafer from the workpiece by pressing, a grinding step of grinding both surfaces of the cut wafer, and a double-side polishing step of polishing both surfaces of the ground wafer. In the cutting step, a wafer is cut out from the workpiece with an average wire traveling speed when cutting the workpiece of 700 m / min or more, and in the grinding step, a grindstone using diamond abrasive grains of # 8000 or more is used. Grinding both sides of the wafer once and then polishing both sides of the wafer in the double-side polishing step To provide a method of manufacturing a semiconductor wafer, comprising.

  Thus, if the wafer is cut out with the average wire traveling speed when cutting the workpiece being 700 m / min or more, the surface roughness of the cut out wafer can be reduced. Thereby, even a wafer immediately after cutting with a wire saw can be ground with a grindstone containing diamond abrasive grains having a count of # 8000 or more (average abrasive grain size of 1 μm or less). Therefore, the grinding process can be performed once, the kerf loss can be reduced, and the polishing amount and the polishing time in the subsequent double-side polishing process can be greatly reduced. As a result, a semiconductor wafer with good shape accuracy can be obtained efficiently. Furthermore, the yield in the manufacture of semiconductor wafers can be improved.

At this time, in the cutting step, it is preferable that the wafer is cut out from the workpiece with an average wire traveling speed when the workpiece is cut at 800 m / min or more.
In this way, the surface roughness of the wafer cut out from the workpiece can be made smaller, and a semiconductor wafer with better shape accuracy can be obtained efficiently.

At this time, in the cutting step, it is preferable that the abrasive grains are fixed to the wire so that the average abrasive grain size is 1 to 12 μm and the number of abrasive grains is 500 pieces / mm ² or more.
In this way, the load on each abrasive grain fixed to the wire can be reduced and the cutting efficiency can be increased, so that the shape accuracy of the wafer, such as pseudo nanotopography, after cutting with a wire saw is improved. As a result, the shape accuracy of the finally manufactured semiconductor wafer can be further improved.

At this time, it is preferable to grind both surfaces of the wafer simultaneously in the grinding step.
If both surfaces of the wafer are ground simultaneously in this way, the time required for the grinding process can be further reduced, and a semiconductor wafer with better shape accuracy can be obtained more efficiently.

  With the method for producing a semiconductor wafer of the present invention, even a wafer immediately after cutting with a wire saw can be ground with a grindstone using diamond abrasive grains having a count of # 8000 or more, so that the shape quality can be efficiently and highly accurate. A semiconductor wafer can be obtained. Furthermore, the yield in the manufacture of semiconductor wafers can be improved.

It is a flowchart which shows an example of the manufacturing method of the semiconductor wafer of this invention. It is the schematic which shows an example of the wire saw used at a cutting process. It is the schematic which shows an example of the double-headed grinding apparatus used at a grinding process. It is the schematic which shows an example of the double-side polish apparatus used at a double-side polish process. It is a figure which shows the surface roughness of the wafer after the cutting process in Example 1, 2 and the comparative example 1. FIG. It is a figure which shows the pseudo nano topography of the wafer after the cutting process in Example 3. FIG.

Hereinafter, although an embodiment is described about the present invention, the present invention is not limited to this.
Conventionally, a wafer cut out from a workpiece using a fixed-abrasive wire saw has a large surface roughness, and before grinding with a grindstone using diamond grains having a high count of # 8000 or higher, the surface roughness of the wafer is increased. Grinding to remove the roughness was necessary. Therefore, it is necessary to perform grinding in multiple stages, and there is a problem in that productivity and yield in manufacturing a semiconductor wafer are reduced.

  In view of this, the present inventor examined a method for reducing the surface roughness of a wafer cut out from a workpiece to such an extent that grinding with a grindstone using high-numbered diamond abrasive grains having a count of # 8000 or more can be performed. As a result, it was found that by setting the average wire traveling speed to 700 m / min or more, the sharpness of the fixed abrasive wire was improved and the surface roughness was significantly reduced. Then, after performing such a cutting process, grinding with a grindstone using diamond abrasive grains of # 8000 or more is performed without performing grinding or the like to remove surface roughness on the wafer. The present invention has been completed by conceiving that the problem can be solved by combining the above-described cutting step and grinding step.

Hereinafter, the semiconductor wafer manufacturing method of the present invention will be described with reference to FIGS.
FIG. 1 is a flowchart showing an example of a method for producing a semiconductor wafer according to the present invention.
First, a fixed-abrasive wire saw used for cutting a workpiece in a cutting step (S101 in FIG. 1), which is the first step of the semiconductor wafer manufacturing method of the present invention, will be described with reference to FIG.

As shown in FIG. 2, the fixed abrasive type wire saw 1 is mainly composed of a wire 2 for cutting a workpiece W ₁ , a grooved roller 3, a wire tension applying mechanism 4, 4 ′, a workpiece feeding means 5, a working fluid. It is comprised by the supply means 6 grade | etc.,. Abrasive grains are fixed to the wire 2 with metal or resin.

  The wire 2 is fed out from one wire reel 7 and enters the grooved roller 3 through a traverser through a wire tension applying mechanism 4 including a powder clutch (constant torque motor) and a dancer roller (dead weight). The grooved roller 3 is a roller in which polyurethane resin is press-fitted around a steel cylinder and grooves are cut at a predetermined pitch on the surface thereof.

  A wire train is formed by winding the wire 2 around the plurality of grooved rollers 3 about 300 to 400 times. The wire 2 is wound around a wire reel 7 'through another wire tension applying mechanism 4'. The wire 2 wound in this way can be reciprocated by the drive motor 10.

  The processing liquid supply means 6 includes a tank 8, a chiller 9, a nozzle 11 and the like. The nozzle 11 is disposed above the wire row formed by winding the wire 2 around the grooved roller 3. The nozzle 11 is connected to the tank 8, and the processing liquid is supplied to the wire 2 from the nozzle 11 with the supply temperature controlled by the chiller 9.

The workpiece W ₁ is held by the workpiece feeding means 5. The work feeding means 5 by depressing the workpiece W ₁ from above the wire downward, pressing the workpiece W ₁ to the wire 2 to be round trip. In this case, it is possible to control so as to feed the workpiece W ₁ held by a predetermined feeding amount at pre-programmed feedrate computer control. Further, the feed direction cuts the workpiece W ₁ by reversing the feeding direction of the workpiece W ₁ can send in the opposite direction. At this time, erosion of the workpiece W ₁ can also be controlled.

Next, a method of cutting a workpiece by cutting a workpiece using the wire saw 1 described above will be described.
First, the workpiece W ₁ is held by the workpiece feeding means 5. The wire 2 is reciprocated in the axial direction while applying tension by the tension applying mechanisms 4 and 4 ′. At this time, in the present invention, the average wire traveling speed of the wire 2 is set to 700 m / min or more. Then, the machining liquid supply means 6 while supplying a machining liquid to the wire 2, the workpiece W ₁ by the workpiece feeding means 5, relatively depressed, the work W ₁ by pressing a workpiece W ₁ to the wire 2 Cut the wafer.

  Thus, by setting the average wire traveling speed to 700 m / min or more, the sharpness of the wire 2 is improved, and then a grindstone using diamond abrasive grains having an average abrasive grain size of # 8000 or more and an average abrasive grain size of 1 μm or less is used. The surface roughness of the wafer can be kept small to such an extent that the conventional grinding can be performed. As a result, the number of grinding steps and kerf loss can be reduced, and productivity and yield can be improved. Furthermore, the average wire traveling speed is preferably set to 800 m / min or more. In this way, the surface roughness of the wafer can be further reduced.

In the present invention, diamond abrasive grains and cubic boron nitride (cBN) are suitable as the abrasive grains to be fixed to the surface of the wire 2. And it is preferable that the average abrasive grain diameter of the abrasive grains fixed to the surface of the wire 2 is 1 to 12 μm and the number of abrasive grains is 500 pieces / mm ² or more.

  With such an average abrasive grain size and the number of abrasive grains, it is possible to greatly suppress the deterioration of the pseudo-nanotopography of the wafer after being cut with a fixed abrasive grain type wire saw. One of the causes of the deterioration of pseudo nanotopography and the like is that the wires meander during the cutting of the workpiece. Therefore, the present inventor presumes that the meandering of the wire is due to the force received by the abrasive grains fixed to the wire at the time of cutting, and the abrasive grain size is reduced in order to reduce the area where each abrasive grain contacts the workpiece. I tried to make it smaller, but I couldn't get enough effect. As a result of further investigations, it was possible to significantly improve the shape by reducing the abrasive grain size and fixing the abrasive grains to the outer peripheral surface of the wire 2 with a certain number of abrasive grains (abrasive density). I found out. That is, by reducing the abrasive grain size, the area where each abrasive grain contacts the workpiece is reduced, and at the same time, by increasing the number of abrasive grains that work in cutting, the load on each abrasive grain is reduced and sharpness is reduced. The present inventor has discovered that it is possible to maintain and suppress wire meandering.

  Next, a chamfering process for rounding the outer periphery of the wafer cut out in the cutting process is performed (S102 in FIG. 1). In the chamfering process, the outer peripheral portion of the wafer is chamfered using a grindstone containing rotating diamond abrasive grains having a total groove to prevent chipping and cracking.

Next, the chamfered wafer is ground in the grinding process (S103 in FIG. 1). Here, a grinding apparatus used for grinding the wafer surface in the grinding step will be described with reference to FIG.
As shown in FIG. 3, the double-head grinding device 21 includes a rotatable wafer holder 22, a static pressure support member 23, and a pair of grindstones 24. Wafer holder 22 is supported from the outer peripheral side along the wafer W ₂ in the radial direction. The pair of static pressure support members 23 are located on both sides of the wafer holder 22 and support the wafer holder 22 from both sides along the axis direction of rotation by non-contact by the static pressure of the fluid. The grindstone 24 uses diamond abrasive grains with a count of # 8000 or more. Further, the grindstone 24 is attached to motor 25, while high speed, simultaneously grinding both surfaces of the wafer W ₂ which is supported by the wafer holder 22.

Using such a double-disc grinding apparatus 21, when grinding the both surfaces of the wafer W _2, first, to support the wafer W ₂ by the wafer holder 22. Incidentally, by rotating the wafer holder 22, the wafer W2 can be rotated. Further, fluid is supplied from the respective static pressure support members 23 on both sides between the wafer holder 22 and the static pressure support member 23, and the wafer holder 22 is supported by the static pressure of the fluid along the axial direction of rotation. Then, both surfaces of the wafer W ₂ supported and rotated by the wafer holder 22 and the static pressure support member 23 in this way are ground once using the grindstone 24 that rotates at high speed by the motor 25.

  Conventionally, in double-headed grinding, diamond with an average abrasive grain size of # 8000 or more and 1 μm or less is used for wafers with large surface roughness, such as wafers that have been cut using a fixed-abrasive wire saw. Double-head grinding with a grindstone using abrasive grains could not be carried out. That is, in order to carry out double-head grinding using a grindstone using diamond abrasive grains of count # 8000 or higher, it is essential that the surface roughness of the wafer to be ground is small. Therefore, the present inventor studied a method for reducing the surface roughness of the wafer after the cutting process. As a result, since the surface roughness is small if the wafer has been subjected to the cutting process with the wire that has been run at a high speed in the semiconductor wafer manufacturing method of the present invention as described above, the surface roughness is removed in advance. Thus, it was found that grinding using diamond abrasive grains having a count of # 8000 or more could be performed immediately.

  In this way, a grinding process is performed by combining a cutting process with an average wire traveling speed of 700 m / min or more and a grinding process in which both sides of the wafer are ground once with a grindstone using diamond abrasive grains having a count of # 8000 or more. The polishing amount and polishing time in the subsequent double-side polishing step can be greatly reduced. As a result, a semiconductor wafer with good shape accuracy can be obtained efficiently. Furthermore, since it is sufficient to perform the grinding process once on both sides of the wafer, kerf loss can be greatly reduced, and the yield in the manufacture of semiconductor wafers can be improved.

  In this case, double-sided grinding may be performed once for each side, but it is preferable to grind both sides of the wafer simultaneously using a double-headed grinding machine or the like as described above. If both surfaces of the wafer are ground simultaneously in this way, the time required for the grinding process can be further reduced, and a semiconductor wafer with better shape accuracy can be obtained more efficiently.

  Next, an etching process is performed (S104 in FIG. 1). In this etching step, the ground wafer is immersed in a high-temperature sodium hydroxide aqueous solution or potassium hydroxide aqueous solution, and the work-affected layer (damage layer) introduced into the front and back surfaces and the chamfered portion is removed.

  After the etching process is completed, an edge polishing process is performed (S105 in FIG. 1). In the edge polishing step, a resin pad such as urethane is pressed against the chamfered portion of the silicon wafer with a predetermined pressure to mirror the chamfered portion. At this time, the chamfered portion is mirror-finished while supplying slurry containing colloidal silica or the like adjusted to pH to the surface of the resin pad.

After the edge polishing process is completed, a double-side polishing process is performed (S106 in FIG. 1). In the double-side polishing step, both surfaces of the wafer are mirrored simultaneously. A double-side polishing apparatus used for mirroring both sides of the wafer will be described with reference to FIG.
As shown in FIG. 4, the double-side polishing apparatus 31 includes an upper surface plate 32 and a lower surface plate 33 provided so as to face each other, and a polishing cloth 34 is attached to each surface plate 32, 33. Has been. A sun gear 35 is provided at the center between the upper surface plate 32 and the lower surface plate 33, and an internal gear 36 is provided at the peripheral portion. Wafer W ₂ is held in the holding hole of carrier 37 and is sandwiched between upper surface plate 32 and lower surface plate 33.

Further, the teeth of the sun gear 35 and the internal gear 36 are engaged with the outer peripheral teeth of the carrier 37, and the carrier 37 is rotated as the upper surface plate 32 and the lower surface plate 33 are rotated by a driving source (not shown). Revolves around the sun gear 35 while rotating. At this time, the wafer W ₂ held by the carrier 37 is polished to have a mirror surface by simultaneously polishing both surfaces by the upper and lower polishing cloths 34. At the time of polishing the wafer, a polishing liquid is supplied from a nozzle (not shown).
In the present invention, since the grinding is performed using fine diamond abrasive grains having a count of # 8000 or more as described above in the grinding process, the amount of polishing in the double-side polishing process can be reduced. Therefore, the polishing time can be greatly shortened, and productivity can be improved.

  After the double-side polishing process is completed, a final polishing process is performed (S107 in FIG. 1). In the final polishing process, using a slurry with adjusted pH containing colloidal silica or the like, pressure is applied from the back surface of the silicon wafer subjected to double-side polishing to a surface plate on which a resin pad such as urethane is applied. Only the surface is brought into contact, and fine surface roughness is adjusted.

The semiconductor wafer is manufactured as described above. In the description given above, the wafer W ₂ in the grinding step is not simultaneously limited thereto was ground course both surfaces using a double-disc grinding apparatus 21, once the one side separately using a surface grinding device such as a grinding You may do it.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these.

Example 1
The workpiece was cut using a fixed abrasive grain type wire saw as shown in FIG. Then, the surface roughness Ra of the wafer after cutting was measured, and it was determined whether or not the measured surface roughness could be ground with a grindstone using diamond abrasive grains having a count of # 8000 or more. A silicon ingot having a diameter of 300 mm and a length of 200 mm was used as a workpiece to be cut. As the wire for cutting, a wire in which diamond abrasive grains were fixed by electrodeposition so that the number of abrasive grains was 600 pieces / mm ² was used on the entire outer periphery of a wire having a diameter of 0.12 mm. The average abrasive grain size of the fixed diamond abrasive grains was 1 to 8 μm.
Further, the wire tension of the wire saw was 25 N, the new wire supply amount was 4 m / min, the forward / reverse cycle in the traveling direction in the reciprocating traveling was 120 sec, and the average wire traveling speed was 700 m / min.

  FIG. 5 shows the surface roughness Ra of the wafer after cutting. As shown in FIG. 5, the surface roughness Ra of the wafer after cutting was 0.28 μm, and the surface roughness was such that the count could be ground with a grindstone using diamond abrasive grains of # 8000 or more. If the wafer has such a surface roughness, it is not necessary to perform grinding for removing the surface roughness in the subsequent grinding process, and it can be ground once with a grindstone using diamond abrasive grains of # 8000 or more. For this reason, it was confirmed that a semiconductor wafer with high-precision shape quality can be obtained efficiently and the yield in the manufacture of semiconductor wafers can be improved.

Moreover, the cutting of the silicon ingot was repeated in the same procedure while changing the average wire traveling speed to 800 m / min and 900 m / min.
As a result, as shown in FIG. 5, when the average wire traveling speed was set to 800 m / min, the surface roughness Ra was 0.23 μm. Further, when the average wire travel speed was set to 900 m / min, the surface roughness Ra was 0.22 μm.
From this result, if the average wire traveling speed is set to 800 m / min or more, the surface roughness Ra is smaller than that in the case where the average wire traveling speed is set to 700 m / min, and a semiconductor wafer having a more accurate shape quality can be obtained. It was confirmed that it was obtained.

(Example 2)
The workpiece was cut under the same conditions as in Example 1 except that the average abrasive grain size of the diamond abrasive grains fixed to the wire was 8 to 12 μm. Then, the roughness Ra of the wafer after cutting was measured, and it was determined whether or not the measured surface roughness could be ground with a grindstone using diamond abrasive grains having a count of # 8000 or more.

As a result, as shown in FIG. 5, when the average wire traveling speed was 700 m / min, the surface roughness Ra was 0.30 μm. When the average wire traveling speed was 800 m / min, the surface roughness Ra was 0.24 μm. Further, when the average wire traveling speed was 900 m / min, the surface roughness Ra was 0.25 μm.
As described above, in any case of Example 2, it was confirmed that a wafer having a surface roughness that can be ground with a grindstone using a diamond abrasive grain of # 8000 or more was obtained. And if it is a wafer of such surface roughness, it is not necessary to carry out grinding for removing the surface roughness in the subsequent grinding step, and it can be ground with a grindstone using diamond abrasive grains of # 8000 or more. It was confirmed that a semiconductor wafer with high-precision shape quality can be obtained efficiently and that the yield in the production of semiconductor wafers can be improved.

(Comparative Example 1)
The workpiece was cut under the same conditions as in Example 1 except that the average wire traveling speed was 600 m / min. Then, the roughness Ra of the wafer after cutting was measured, and it was determined whether or not the measured surface roughness could be ground with a grindstone using diamond abrasive grains having a count of # 8000 or more. Here, in Comparative Example 1, two kinds of cutting were performed, when the average abrasive grain size of the diamond abrasive grains fixed to the wire was 1 to 8 μm and when the average abrasive grain size was 8 to 12 μm.
As a result, as shown in FIG. 5, when the average abrasive grain size of the diamond abrasive grains fixed to the wire was 1 to 8 μm, the surface roughness Ra was 0.40 μm. Further, when the average abrasive grain size of the diamond abrasive grains fixed to the wire was 8 to 12 μm, the surface roughness Ra was 0.45 μm.
In such a surface roughness wafer, it is necessary to perform grinding for removing the surface roughness before grinding with a grindstone using diamond abrasive grains of # 8000 or more in the subsequent grinding process. It was confirmed that productivity would decrease.

(Example 3)
In Example 3, using a fixed abrasive type wire saw as shown in FIG. 2, the workpiece is cut, the pseudo nanotopography of the wafer after cutting, the average abrasive grain size of the diamond abrasive grains, and the abrasive grains The relationship with number was investigated. A silicon ingot having a diameter of 300 mm and a length of 200 mm was used as a workpiece to be cut.
Further, the wire tension of the wire saw was 25 N, the new wire supply amount was 4 m / min, the forward / reverse cycle in the traveling direction in the reciprocating traveling was 120 sec, and the average wire traveling speed was 700 m / min.
And the workpiece | work was repeatedly cut | disconnected as an average abrasive grain diameter and the number of abrasive grains of the abrasive grain which adheres to the wire used for a cutting | disconnection as shown in the following Table 1.

As a result, as shown in FIG. 6 and Table 2, in particular, when the average abrasive grain size is 1 to 12 μm and the number of abrasive grains is 500 pieces / mm ² or more, the pseudo-nanotopography is 0. It was found to be an extremely small value of 53 to 0.62.
Therefore, by fixing to the outer peripheral surface of the wire so that the average abrasive grain size is 1 to 12 μm and the number of abrasive grains is 500 pieces / mm ² or more, the pseudo-nanopotography can be greatly improved. As a result, it was found that a semiconductor wafer with higher accuracy in shape quality can be obtained efficiently.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

1 ... wire saw, 2 ... wire, 3 ... grooved roller,
4, 4 '... wire tension applying mechanism, 5 ... work feeding means,
6 ... working fluid supply means 7, 7 '... wire reel,
8 ... Tank, 9 ... Chiller, 10 ... Drive motor, 11 ... Nozzle,
21 ... Double-head grinding device, 22 ... Wafer holder, 23 ... Static pressure support member,
24 ... Whetstone, 25 ... Motor,
31 ... Double-side polishing machine, 32 ... Upper platen, 33 ... Lower platen, 34 ... Polishing cloth,
35 ... Sun gear, 36 ... Internal gear, 37 ... Carrier,
W ₁ ... Work, W ₂ ... Wafer.

Claims (4)

A cutting step of winding a wire with abrasive grains fixed around a plurality of rollers with grooves, reciprocating the wire in the axial direction, and cutting the wafer from the work by pressing the work against the reciprocating wire. A method for manufacturing a semiconductor wafer, comprising a grinding step for grinding both sides of the cut wafer, and a double-side polishing step for polishing both sides of the ground wafer,
In the cutting step, an average wire traveling speed when cutting the workpiece is set to 700 m / min or more, and a wafer is cut out from the workpiece. In the grinding step, the wafer is made of a grindstone using diamond abrasive grains having a count of # 8000 or more. the only ground once both sides, then, subjected to the double side polishing step without lapping step, in the double-side polishing step, a method of manufacturing a semiconductor wafer, comprising double-sided polishing the wafer.   2. The method of manufacturing a semiconductor wafer according to claim 1, wherein in the cutting step, the wafer is cut out from the workpiece at an average wire traveling speed of 800 m / min or more when the workpiece is cut. The said cutting process WHEREIN: It adheres to the said wire so that the average abrasive grain diameter of the said abrasive grain may be 1-12 micrometers, and the number of abrasive grains may be 500 pieces / mm < ² > or more. The manufacturing method of the semiconductor wafer of description.   4. The method of manufacturing a semiconductor wafer according to claim 1, wherein in the grinding step, both surfaces of the wafer are ground simultaneously. 5.

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