JP6079088B2 - Connector terminal structure - Google Patents

Connector terminal structure Download PDF

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JP6079088B2
JP6079088B2 JP2012207655A JP2012207655A JP6079088B2 JP 6079088 B2 JP6079088 B2 JP 6079088B2 JP 2012207655 A JP2012207655 A JP 2012207655A JP 2012207655 A JP2012207655 A JP 2012207655A JP 6079088 B2 JP6079088 B2 JP 6079088B2
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aluminum
connector terminal
contact
connector
edge portion
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JP2014063624A (en
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耕平 林
耕平 林
田中　克佳
克佳 田中
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SMK Corp
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Description

本発明はリジット基板、ＦＰＣ（フレキシブルプリント配線板）及びＦＦＣ（フレキシブルフラットケーブル）等の間をコネクタ接続するのに用いるコネクタの端子構造に関する。   The present invention relates to a connector terminal structure used for connector connection between a rigid substrate, an FPC (flexible printed wiring board), an FFC (flexible flat cable) and the like.

これまで、パターン配線された回路基板の接続部とＦＰＣやＦＦＣ等とを接続する方法に、異方導電性フィルム（ＡＣＦ）を挟み、加圧及び加熱する接続方法、ワイヤーボンディングを用いる方法、導電性の接着剤を用いて接続する方法等が行われている。
しかし、このような方法では専用設備が必要で作業工数も多い。
特許文献１はアルミの導体層を盛り上がり形成し、この盛り上がり部を基板と平行に切り込んで接続する方法を開示する。
しかし、この方向は接続部に盛り上がり部が必要であり、必ずしも実用的ではない。 Up to now, the connection method of connecting and connecting FPC, FFC, etc. of the circuit board connected with the pattern wiring, sandwiching the anisotropic conductive film (ACF), pressurizing and heating, the method using wire bonding, the conductive For example, a method of connecting using an adhesive is used.
However, such a method requires dedicated equipment and requires a lot of work.
Patent Document 1 discloses a method in which an aluminum conductor layer is formed in a raised shape, and this raised portion is cut and connected in parallel with a substrate.
However, this direction requires a raised portion at the connecting portion, which is not always practical.

特許第３２９３３４７号公報Japanese Patent No. 3293347

本発明はアルミニウムで形成された接続部に対して安定的に電気接続できるコネクタの端子構造の提供を目的とする。   An object of this invention is to provide the terminal structure of the connector which can be stably electrically connected with respect to the connection part formed with aluminum.

本発明に係るコネクタ端子構造は、アルミニウムを用いてパターン形成された接続部にコネクタ接続するためのコネクタ端子であって、前記コネクタ端子は接触部が前記アルミニウムで形成された接続部に向けて付勢する付勢手段を有し、前記接触部はプレス破断面にて形成された、アルミニウム表面に食い込むエッジ部を有し、前記エッジ部はアルミニウム表面に有する不動態膜を破断させて、前記アルミニウム側に押し付けた状態で、前記不動態膜を突き破り、エッジ部側面にてアルミニウムの新生面と接触するものであることを特徴とする。 The connector terminal structure according to the present invention is a connector terminal for connecting a connector to a connection portion patterned using aluminum, and the connector terminal is attached toward the connection portion where the contact portion is formed of aluminum. The contact portion has an edge portion that cuts into the aluminum surface, and the edge portion breaks the passive film on the aluminum surface to form the aluminum In the state of pressing to the side, the passivation film is pierced and comes into contact with the new aluminum surface at the side surface of the edge portion.

ここで、アルミニウムとは純アルミニウムのみならず、アルミニウムの合金を含み、このようなアルミニウムを用いて配線パターンを形成すると、従来の銅を用いた配線パターンよりも安価に製造することができる。
しかし、アルミニウム等は表面に自然酸化膜が形成されやすく、この自然酸化膜が不動態膜となり、絶縁性を有することから接触不良が発生しやすい。
そこで、本発明はコネクタの端子の端触部にエッジ部を形成することで、このエッジ部にて不動態膜を押し破り、そのままエッジ部の側面でアルミニウムに形成された新生面（不動態膜が形成されていないアルミニウムの破断面）と電気接続させたものである。
アルミニウムを用いた配線パターンは、アルミ箔層を積層したリジット基板，ＦＰＣ用基板及びＦＦＣ用基板を用いて常法のパターンマスキング及びエッチング処理等にてパターン配線を形成することができる。 Here, aluminum includes not only pure aluminum but also an alloy of aluminum. When a wiring pattern is formed using such aluminum, it can be manufactured at a lower cost than a wiring pattern using conventional copper.
However, a natural oxide film is likely to be formed on the surface of aluminum or the like, and this natural oxide film becomes a passive film, and since it has insulating properties, poor contact is likely to occur.
Therefore, in the present invention, by forming an edge portion at the contact portion of the terminal of the connector, the passive film is pushed through at the edge portion, and a new surface (passive film is formed on the side surface of the edge portion as it is). It is electrically connected to an unformed aluminum fracture surface.
The wiring pattern using aluminum can form a pattern wiring by a conventional pattern masking, etching process, etc. using the rigid board | substrate which laminated | stacked the aluminum foil layer, the board | substrate for FPC, and the board | substrate for FFC.

エッジ部の形状は、アルミニウム表面の不動態膜を押し破ることができれば特に限定されない。
コネクタ端子の接触部の材質も導電性を有する限りにおいて特に制限はないが、リン青銅等アルミニウムよりも硬いものがよい。
エッジ部にて不動態膜を押し破るには、接触圧が５０ＭＰａ以上になるように付勢力を設定するとともに、新生面における接触面を確保できるように接触部の面積は０．０１ｍｍ２〜０．２ｍｍ２の範囲がよい。 The shape of the edge portion is not particularly limited as long as it can break through the passive film on the aluminum surface.
The material of the contact portion of the connector terminal is not particularly limited as long as it has conductivity, but a material harder than aluminum such as phosphor bronze is preferable.
In order to break through the passive film at the edge portion, the urging force is set so that the contact pressure is 50 MPa or more, and the area of the contact portion is 0.01 mm 2 to 0. A range of 2 mm 2 is preferable.

本発明におけるコネクタとは、リジット基板，ＦＰＣ及びＦＦＣ等との間を電気接続するためのコネクタをいう。
また、コネクタ端子の接触部がアルミニウムの表面に向けて押圧力が作用するように付勢力が生じればコネクタ構造において、コネクタ端子側を押圧しても基板側を押圧してもよい。 The connector in the present invention refers to a connector for electrically connecting a rigid board, FPC, FFC and the like.
In addition, in the connector structure, the connector terminal side may be pressed or the board side may be pressed if an urging force is generated so that a pressing force is applied to the contact portion of the connector terminal toward the aluminum surface.

本発明に係るコネクタ端子構造は、アルミニウムにてパターン配線された接続部にコネクタ端子側の接触部を押し当てるだけでアルミニウムの新生面と電気接続できるので、接続安定性に優れる。
また、エッジ部で不動態膜を押し破り、このエッジ部の側部でアルミニウムの新生面と接触することになるので、特許文献１のようにアルミニウムの盛り上がり部を形成する必要がなく、薄いアルミ層のパターンを破壊することもない。
従来のＡＣＦ接続、ワイヤーボンデング接続及び導電性接着剤を用いる方法に比較して加熱処理等の専用設備が不要でコネクタ化が可能であるために接続作業が容易である。 The connector terminal structure according to the present invention is excellent in connection stability because it can be electrically connected to the new aluminum surface simply by pressing the contact portion on the connector terminal side against the connection portion patterned with aluminum.
Further, since the passive film is pushed through at the edge portion and is in contact with the new aluminum surface at the side portion of the edge portion, it is not necessary to form a raised portion of aluminum as in Patent Document 1, and a thin aluminum layer is formed. It will not destroy the pattern.
Compared to the conventional methods using ACF connection, wire bonding connection, and conductive adhesive, dedicated equipment such as heat treatment is not required and connectorization is possible, so connection work is easy.

本発明に係るコネクタ端子の接触部の形状例を示し、（ａ）は接触部の前後方向の断面図、（ｂ）は左右方向（幅方向）の拡大断面図を示す。The shape example of the contact part of the connector terminal which concerns on this invention is shown, (a) is sectional drawing of the front-back direction of a contact part, (b) shows the expanded sectional view of the left-right direction (width direction). （ａ）はコネクタ端子の形状例、（ｂ）〜（ｄ）はコネクタに基板を接続する手順例を示す。(A) shows the example of a shape of a connector terminal, (b)-(d) shows the example of a procedure which connects a board | substrate to a connector. エッジ部の形状例を示し、（ａ）は外観図、（ｂ）は接触状態の断面図を示す。The example of a shape of an edge part is shown, (a) is an external view, (b) shows sectional drawing of a contact state. （ａ）〜（ｃ）はエッジ部の他の形状例を示す。(A)-(c) shows the other example of a shape of an edge part.

本発明に係るコネクタ端子の構造例を以下、図面に基づいて説明する。
図１（ａ）にコネクタ端子１１の前後方向の接続断面図を示し、（ｂ）は左右方向（幅方向）の拡大接続断面図（Ａ視方向断面図）を示す。
コネクタ端子１１は、図１（ｂ）に示すように幅方向端部コーナーが略直角形状になっているエッジ部１２ａを形成した接触部１２となっている。
図１（ｂ）は、図１（ａ）のＡ視方向で拡大した断面図となっていて、Ｌ＝Ｗ＝０．１５ｍｍの例である。
基板２０には、アルミニウム又はその合金でアルミパターン２１が配線されている。
アルミパターン２１の表面には、酸化皮膜からなる極薄い不動態膜２２が形成されているが、コネクタ端子１１の接触部が相対的にアルミパターン２１に向けて付勢されていて、エッジ部１２ａにて不動態膜が押し破られた状態になっている。
接触部１２の先端で押し破られた不動態膜２２ａは、破断しながらアルミ側に押し付けた状態になっていると推定される。
これにより、エッジ部１２ａの側部がそのままアルミ新生面２１ａにて接触している。 A structural example of a connector terminal according to the present invention will be described below with reference to the drawings.
FIG. 1A shows a connection cross-sectional view of the connector terminal 11 in the front-rear direction, and FIG. 1B shows an enlarged connection cross-sectional view (cross-sectional view in the A direction) in the left-right direction (width direction).
As shown in FIG. 1B, the connector terminal 11 is a contact portion 12 in which an edge portion 12a having a substantially right-angled corner in the width direction is formed.
FIG. 1B is a cross-sectional view enlarged in the A viewing direction of FIG. 1A, and is an example where L = W = 0.15 mm.
An aluminum pattern 21 is wired on the substrate 20 with aluminum or an alloy thereof.
An extremely thin passive film 22 made of an oxide film is formed on the surface of the aluminum pattern 21, but the contact portion of the connector terminal 11 is relatively biased toward the aluminum pattern 21, and the edge portion 12a. The passive film has been pushed through.
It is presumed that the passive film 22a that has been pushed and broken at the tip of the contact portion 12 is pressed against the aluminum side while being broken.
Thereby, the side part of the edge part 12a is contacting with the aluminum new surface 21a as it is.

本実施例では、板厚０．１５ｍｍのリン青銅の板材を用いて図２（ａ）に示すような形状のコネクタ端子１１にプレス成形することで、プレス破断面にてエッジ部１２ａを形成した。
このようなコネクタ端子１１を図２（ｂ）〜（ｄ）に示すようなコネクタ１０のハウジングに装着した。
コネクタの構造に制限はないが、コネクタ１０の基板挿入部１０ａを介して基板２０を挿入した後にクランプ１０ｂを回動すると、クランプ部１０ｃにて基板を矢印の方向に押圧し、コネクタ端子１１の接触部１２ａが基板２０側のアルミパターン２１に相対的に押し付けられるようになっている。
コネクタの構造は本実施例に限定されるものではなく、コネクタ端子１１が基板に向けて押圧付勢するものでもよい。 In this example, the edge portion 12a was formed in the press fracture surface by press-molding the connector terminal 11 having a shape as shown in FIG. 2A using a phosphor bronze plate material having a thickness of 0.15 mm. .
Such a connector terminal 11 was mounted on the housing of the connector 10 as shown in FIGS.
Although there is no limitation on the structure of the connector, when the clamp 10b is rotated after the board 20 is inserted through the board insertion part 10a of the connector 10, the board is pressed in the direction of the arrow by the clamp part 10c, and the connector terminal 11 The contact portion 12a is relatively pressed against the aluminum pattern 21 on the substrate 20 side.
The structure of the connector is not limited to this embodiment, and the connector terminal 11 may be urged toward the board.

本実施例では接触部１２の面積が、Ｌ＝０．１５ｍｍ，Ｗ＝０．１５ｍｍの０．０２２５ｍｍ２であり、付勢力が約３００ｇに設定されている。
従って接触部１２の接触圧力は約１３０ＭＰａとなっている。
接触部１２の接触面積を増やすと、図１（ｂ）に示すように新生面２２ａとの接触面積を多くとることができるが、それだけ接触部１２の押圧力を大きくしなければならない。
従って、接触部の面積は０．０１ｍｍ２以上で０．２ｍｍ２以下が好ましい。
また、接触圧力は５０ＭＰａ以上が好ましい。 In this embodiment, the area of the contact portion 12 is 0.0225 mm 2 with L = 0.15 mm and W = 0.15 mm, and the urging force is set to about 300 g.
Therefore, the contact pressure of the contact portion 12 is about 130 MPa.
When the contact area of the contact portion 12 is increased, as shown in FIG. 1B, a larger contact area with the new surface 22a can be obtained, but the pressing force of the contact portion 12 must be increased accordingly.
Therefore, the area of the contact portion is preferably 0.01 mm 2 or more and 0.2 mm 2 or less.
The contact pressure is preferably 50 MPa or more.

本発明でエッジ部は不動態膜を押し破りながら、そのままエッジ部の側部（側面）でアルミの新生面と面接触するものであれば、その形状に制限がない。
エッジ部のコーナー部が略直角に近いものとして、図３（ａ）に示すようにエッジ部１１２ａを有する凹部を備えた接触部１１１でもよい。
このときの断面図を図３（ｂ）に示す。
また、その他に図４（ａ）に示すように接触部の先端にエッジ部２１２ａを形成した例、図４（ｂ）に示すようにエッジ状のスリット３１２ａを形成した例、円柱状の突起からなるエッジ部４１２ａを形成した例が挙げられる。
本発明は接触部にエッジ状の接触面を形成した点に特徴があり、先端が尖ったピン形状の接触形状は含まれない。 In the present invention, the shape of the edge portion is not limited as long as it is in surface contact with the new aluminum surface at the side portion (side surface) of the edge portion as it is while breaking through the passive film.
As shown in FIG. 3 (a), the contact portion 111 having a concave portion having an edge portion 112a may be used, assuming that the corner portion of the edge portion is substantially perpendicular.
A cross-sectional view at this time is shown in FIG.
In addition, an example in which an edge portion 212a is formed at the tip of the contact portion as shown in FIG. 4A, an example in which an edge-shaped slit 312a is formed as shown in FIG. The example which formed the edge part 412a which becomes will be mentioned.
The present invention is characterized in that an edge-shaped contact surface is formed in the contact portion, and does not include a pin-shaped contact shape with a sharp tip.

１１ コネクタ端子
１２ 接触部
１２ａ エッジ部
２０ 基板
２１ アルミパターン
２１ａ 新生面
２２ 不動態膜 DESCRIPTION OF SYMBOLS 11 Connector terminal 12 Contact part 12a Edge part 20 Substrate 21 Aluminum pattern 21a New surface 22 Passive film

Claims (2)

アルミニウムを用いてパターン形成された接続部にコネクタ接続するためのコネクタ端子であって、
前記コネクタ端子は接触部が前記アルミニウムで形成された接続部に向けて付勢する付勢手段を有し、
前記接触部はプレス破断面にて形成された、アルミニウム表面に食い込むエッジ部を有し、
前記エッジ部はアルミニウム表面に有する不動態膜を破断させて、前記アルミニウム側に押し付けた状態で、前記不動態膜を突き破り、エッジ部側面にてアルミニウムの新生面と接触するものであることを特徴とするコネクタ端子構造。 A connector terminal for connecting a connector to a connection portion patterned using aluminum,
The connector terminal has a biasing means for biasing the contact portion toward the connection portion formed of the aluminum,
The contact portion is formed by a press fracture surface, and has an edge portion that bites into the aluminum surface,
The edge portion breaks the passivation film on the aluminum surface, pierces the passivation film in a state of being pressed against the aluminum side, and contacts the new aluminum surface on the side surface of the edge portion. Connector terminal structure. 前記接触部の接触面積が０．０１ｍｍ２〜０．２ｍｍ２で接触圧が５０ＭＰａ以上であることを特徴とする請求項１記載のコネクタ端子構造。 Connector terminal structure according to claim 1, wherein the contact pressure contact area with 0.01mm 2 ~0.2mm 2 of the contact part is not less than 50 MPa.
JP2012207655A 2012-09-21 2012-09-21 Connector terminal structure Active JP6079088B2 (en)

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