JP6078854B2 - Transmission wave control board - Google Patents

Description

  The present invention relates to a transmitted wave control board that selectively transmits a signal having a specific frequency according to an incident angle.

Conventionally, as a substrate that selectively contributes to an electromagnetic wave of a specific frequency, a selective electromagnetic blocking substrate having a frequency selective surface that selectively transmits an electromagnetic wave of a specific frequency and blocks an electromagnetic wave of another frequency is known. (For example, refer to Patent Document 1).
Similarly, there are known selective electromagnetic blocking substrates having a frequency selective surface that selectively blocks electromagnetic waves of a specific frequency and transmits electromagnetic waves of other frequencies (for example, Patent Document 2 and Patent Document). 3).

  The selective electromagnetic shielding substrate described in Patent Document 1 is an example that selectively transmits electromagnetic waves of a specific frequency and blocks electromagnetic waves of other frequencies, and its structure is shown in FIG. FIG. 11 is a diagram showing the structure of a selective electromagnetic shielding substrate that selectively transmits electromagnetic waves of a specific frequency and blocks electromagnetic waves of other frequencies. In FIG. 11, the selective electromagnetic cut-off element is a substrate that transmits electromagnetic waves by combining a plurality of frequency selective surface plates each having a square lattice formed by a periodic structure. Here, the size of the square grating 60 in the selective electromagnetic cut-off element is adjusted, the frequency of parallel resonance between the capacitance component and the inductance of the square grating 60 is arbitrarily set, and selective transmission of electromagnetic waves of the set frequency is realized. doing.

  Moreover, the selective electromagnetic shielding substrate described in Patent Document 2 is an example in which an electromagnetic wave with a specific frequency is blocked and an electromagnetic wave with another frequency is transmitted, and the structure thereof is shown in FIGS. 12 and 13. Each of FIG. 12 and FIG. 13 is a diagram showing the structure of a selective electromagnetic shielding substrate that blocks electromagnetic waves of a specific frequency and transmits electromagnetic waves of other frequencies. A selective electromagnetic shielding substrate 63 shown in FIG. 12 is a substrate in which a loop antenna element 62 is formed of a circular metal on a glass plate 61. A selective electromagnetic shielding substrate 67 shown in FIG. 13 is a substrate in which three linear antenna elements 64, 65, and 66 are formed on a glass plate. Without relying on, the electromagnetic wave of the resonance frequency of each antenna element is cut off.

  The selective electromagnetic shielding substrate described in Patent Document 3 is an example that blocks electromagnetic waves of a specific frequency and transmits electromagnetic waves of other frequencies. The structure is shown in FIG. 14 and the structure of a single element is shown in FIG. Shown in FIG. 14 is a diagram showing a triangular closed-loop element 68 composed of three linear antennas 69, 70, 71. On the other hand, FIG. 15 is a diagram showing a substrate in which three linear antennas 74 are arranged in a triangular loop 73 shown in FIG. By arranging triangular structures with different resonance frequencies on the substrate, electromagnetic waves of two frequencies are blocked without depending on the plane of polarization.

Japanese Examined Patent Publication No. 62-031844 JP-A-11-163585 JP 2000-68675 A

However, since the conventional selective electromagnetic shielding substrate only blocks or transmits an electromagnetic wave having a specific frequency, the propagation path of the incident signal cannot be controlled.
For this reason, when controlling the propagation path spatially, it is necessary to control the antenna itself that emits the incident electromagnetic wave.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a transmitted wave control board that controls the propagation path of an incident electromagnetic wave without controlling the antenna itself that emits the electromagnetic wave.

The present invention has been made to solve the above-described problems, and a transmitted wave control board according to the present invention includes a dielectric substrate, a first conductor plate formed on a surface of the dielectric substrate, and the first conductor. A second conductor plate formed on the back surface of the dielectric substrate, and penetrating the dielectric substrate, and each of the first conductor plate and the second conductor plate is replaced with the first conductor plate. Having a basic structure composed of a conductor plate and a conductor column connecting the respective centers of the second conductor plate, and having a capacitance component on the same plane as each of the first conductor plate and the second conductor plate the capacitance value C _1, the inductance of the inductive component on each flush of the first conductive plate and said second conductive plate and L _1, a capacitance component in the conductor post between the surface and the back surface and C ₂ , L ₂ is the induction component in the conductor column between the front and back surfaces, When an electromagnetic wave having the same frequency as the resonance frequency is incident on a substrate on which a basic structure satisfying the expression (1) indicating the resonance frequency f _R of the two is arranged with a two-dimensional period, the transmission depends on the incident angle of the electromagnetic wave. It has a quantity and a reflection quantity.

  In the transmitted wave control board of the present invention, the shape of the first conductor plate and the second conductor plate is n (n = 3, 4, 6), and each of the first conductor plate and the second conductor plate. Are arranged in a two-dimensional cycle so as to face the respective sides of the n-sided first conductor plate and the second conductor plate of another adjacent basic structure.

  In the transmitted wave control board of the present invention, the basic structure is hexagonal, each of the first conductive plate and the second conductive plate is circular, and the sides of the adjacent hexagonal basic structure are adjacent to each other. The hexagonal basic structure is arranged in a two-dimensional period so as to face the sides of the basic structure.

  In the transmitted wave control board of the present invention, n is any of 3, 4, 6 and θ = 2π / n, and the shape of the conductor plate is 0, θ, 2θ,. , (N−1) is a shape obtained by combining the shapes rotated at an angle of θ, and the adjacent basic structures are two-dimensionally in the 0, θ, 2θ,..., (N−1) θ directions of the basic structures. It is characterized by periodic arrangement.

  According to the present invention, a transmission wave control board that transmits electromagnetic waves at a specific frequency and has different characteristics in transmission amount and reflection amount according to the incident angle of the electromagnetic waves, that is, without controlling the antenna itself that emits electromagnetic waves. It is possible to provide a transmitted wave control board that spatially controls the propagation path of incident electromagnetic waves.

It is a figure which shows the structural example of the transmitted wave control board | substrate 100 by the 1st Embodiment of this invention. It is the side view which cut | disconnected the basic structure 101 of the transmitted wave control board | substrate 100 in FIG. 1 with the continuous line AA. It is a figure which shows the equivalent circuit which simplified the basic structure 101 of the transmitted wave control board | substrate 100 in FIG. It is a figure which shows the measurement result of the transmission characteristic of the transmitted wave control board | substrate in this embodiment. It is a figure which shows the structural example of the transmitted wave control board by the 2nd Embodiment of this invention. It is a figure which shows the structural example of the transmitted wave control board by the 3rd Embodiment of this invention. It is a figure which shows the structural example of the transmitted wave control board by the 4th Embodiment of this invention. It is a figure which shows the structural example of the transmitted wave control board by the 5th Embodiment of this invention. It is a figure which shows the structural example of the transmitted wave control board by the 6th Embodiment of this invention. It is a figure which shows the structural example of the transmitted wave control board by the 7th Embodiment of this invention. It is a figure which shows the structure of the selective electromagnetic shielding board which selectively permeate | transmits the electromagnetic wave of a specific frequency, and interrupts | blocks the electromagnetic wave of another frequency. It is a figure which shows the structure of the selective electromagnetic shielding board which interrupts | blocks the electromagnetic wave of a specific frequency, and permeate | transmits the electromagnetic wave of another frequency. It is a figure which shows the structure of the selective electromagnetic shielding board which interrupts | blocks the electromagnetic wave of a specific frequency, and permeate | transmits the electromagnetic wave of another frequency. It is a figure which shows the element of the triangle closed loop structure which consists of three linear antennas. It is a figure which shows the board | substrate which has arrange | positioned three linear antennas in the triangular loop shown in FIG.

<First Embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration example of a transmitted wave control board 100 according to the first embodiment of the present invention.
FIG. 1 is a plan view showing the surface of the transmitted wave control board 100 according to the first embodiment, and shows a configuration example of the surface pattern of the transmitted wave control board 100. In FIG. 1, a portion surrounded by a thick dotted line portion shows a basic structure 101 in the transmitted wave control board 100 of the present embodiment. The basic structure 101 has a rectangular shape (square shape).

  Here, the conductor plate 1011 (first conductor plate) is a rectangular (rectangular) conductor pattern formed on the surface of the dielectric substrate 1013. The conductor column 1012 penetrates the dielectric substrate 1013 and is electrically connected to the conductor plate 1011 on the surface of the dielectric substrate 1013. In the transmitted wave control board 100, the basic structures 101 are periodically arranged in a two-dimensional manner and arranged in a matrix so that each side of the basic structure 101 is parallel to the opposite sides of the other basic structures.

  FIG. 2 is a side view of the basic structure 101 of the transmitted wave control board 100 in FIG. 1 cut along a solid line AA. The conductor pillar 1012 penetrates the dielectric substrate 1013, and the conductor plate 1011 on the surface of the dielectric substrate 1013 and the conductor plate 1014 (second conductor plate) on the back surface of the dielectric substrate 1013 are connected to the conductor plate 1011 and the conductor plate. 1014 is electrically connected at the center of each planar shape. The conductor plate 1011 and the conductor plate 1014 are formed in an overlapping shape in plan view. Each of the conductor plate 1011, the conductor plate 1014, and the conductor column 1012 may be a metal or another conductor that is not metal.

  FIG. 3 is a diagram showing an equivalent circuit in which the basic structure 101 of the transmitted wave control board 100 in FIG. 1 is simplified. In FIG. 3, each of the connection terminals 1, 2, 3, and 4 indicates a terminal that is connected to another basic structure in which each side of the rectangular conductor plate 1011 in FIG. 1 is adjacent. Each of the capacitors 5, 6, 7, and 8 indicates a capacitance component on the same plane as the conductor plate 1011 that the conductor plate 1011 has. Each of the inductors 9, 10, 11, and 12 represents an inductive component on the same plane as the conductor plate 1011 that the conductor plate 1011 has.

Capacitor 13 represents a capacitance component between conductive plate 1011 on the front surface and conductive plate 1014 on the back surface of dielectric substrate 1013. The inductor 14 represents an inductive component between the conductor plate 1011 on the front surface and the conductor plate 1014 on the back surface of the dielectric substrate 1013. In FIG. 1, the periodic arrangement of the basic structure 101 is two-dimensionally arranged in each direction of the basic structure to form a matrix. On the other hand, the equivalent circuit of the basic structure of FIG. 3 has a circuit configuration in which the basic structure is arranged in a one-dimensional manner in order to simplify the description. Further, the resistance components of the conductor plate 1011 and the conductor plate 1014 are also omitted for the sake of simplicity. Each of the capacitor (capacitance component) 5,6,7,8 capacitance value of _{C 1.} Each of the inductor (inductive component) 9, 10, 11, 12, the inductance is _{L 1.} Capacitor 13, the capacitance value of _{C 2.} The inductor 14, the inductance is _{L 2.}

According to the dielectric constant of the dielectric substrate 1013 and the film thickness of the dielectric substrate 1013 of the transmission wave control substrate 100 satisfying the following expression (1), the shapes and dimensions of the basic structure conductor plate 1011 and conductor plate 1014 The shape and dimensions of the conductor post 1012 are designed. Equation (1) is an equation representing the resonance frequency f _R of the basic structure 101.

To satisfy the above-mentioned (1), the conductive plate 1011, each of the conductor post 1012 and the conductive plate 1014 has the same resonance frequency _{f R.} Thus, electromagnetic waves in the frequency band of the resonance frequency f _R and the resonant frequency f _R vicinity, if incident normal to the surface of the transmitted wave control board 100, to excite the plane propagating wave of the transmitted wave control board 100. The in-plane propagation wave is synthesized with isotope homologous amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface re-radiates in the same direction as the incident direction of the electromagnetic wave. That is, when electromagnetic waves enter perpendicularly from the upper surface of the transmitted wave control board 100 (the surface on which the conductor plate 1011 is disposed), the in-plane propagation wave of the transmitted wave control board 100 is excited and re-radiated. The transmitted wave control board 100 is transmitted.

  On the other hand, when electromagnetic waves are incident on the transmitted wave control board 100 at a predetermined angle, the transmission characteristics of the transmitted wave control board 100 are different between TM (Transverse Magnetic) waves and TE (Transverse Electric) waves in the electromagnetic waves. Different. As for the TM wave, the in-plane propagation wave of the transmitted wave control substrate 100 is excited in the same manner as when electromagnetic waves are incident on the transmitted wave control substrate 100 perpendicularly. Then, the in-plane propagation wave is synthesized with the isotopic amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface is re-radiated in the same direction as the incident direction of the TM wave and passes through the transmitted wave control substrate 100. Further, the TE wave is reflected without being able to excite the in-plane propagation wave when the incident angle is close to the perpendicular to the transmitted wave control substrate 100. Therefore, it is possible to realize the transmitted wave control board 100 having characteristics in which the transmission amount and the reflection amount are different according to each of the polarization direction and the incident angle of the electromagnetic wave.

  FIG. 4 is a diagram showing the measurement results of the transmission characteristics of the transmitted wave control board in this embodiment. The transmission control substrate measured in FIG. 4 is designed using a dielectric substrate having a relative dielectric constant of 2.17 and a thickness of 0.127 mm and a resonance frequency fR of 62 GHz. In FIG. 4, the horizontal axis indicates the frequency of the electromagnetic wave, and the vertical axis indicates the transmission characteristic of the electromagnetic wave. In the measurement, a board (transmission control board in this embodiment) is placed at a position 600 mm away from the transmitting horn antenna with a gain of 20 dBi (with a board), and another horn antenna with a gain of 20 dBi is placed 600 mm away from the board. And implemented. Calibration was carried out using the TRL (THRU-REFLECT-LINE) method with the waveguide port surfaces of both horn antennas taken as the reference plane. For comparison, the measurement was performed when no substrate was placed (no substrate). When the transmission control board in the present embodiment was placed, a higher value was obtained as the transmission characteristics than when the board was not placed near 62 GHz. From the above, it can be seen that in the vicinity of the resonance frequency fR, the in-plane propagation wave is excited by the incident wave and the transmitted wave control board re-radiates.

<Second Embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 5 is a diagram showing a configuration example of a transmitted wave control board according to the second embodiment of the present invention.
FIG. 5 is a plan view showing the surface of the transmitted wave control board 200 according to the second embodiment, and shows a configuration example of the surface pattern of the transmitted wave control board 200. In FIG. 5, a portion surrounded by a thick dotted line portion shows a basic structure 201 in the transmitted wave control board 200 of the present embodiment. The basic structure 201 has a triangular shape (regular triangle).

  Here, the conductor plate 2011 is a triangular (regular triangle) conductor pattern formed on the surface of the dielectric substrate 2013. The conductor pillar 2012 penetrates the dielectric substrate 2013 and is electrically connected to the conductor plate 2011 on the surface of the dielectric substrate 2013. In the transmitted wave control board 200, the basic structure 201 is periodically arranged on a two-dimensional plane so that each side of the basic structure 201 is parallel to the side of the other basic structure facing each other.

  Also, on the back surface of the transmitted wave control board 200, a conductive plate (not shown) having the same shape as the conductive plate 2011 is located at a position overlapping the conductive plate 2011 in a plan view, like the basic structure 101 of the first embodiment. Has been placed. The conductor pillar 2012 penetrates the dielectric substrate 2013, and the conductor plate 2011 on the surface of the dielectric substrate 2013 and the conductor plate on the back surface of the dielectric substrate 2013 are connected to the conductor plate 2011 and the conductor plate on the back surface of the dielectric substrate 2013. Are electrically connected at the center of each planar shape.

  The basic structure 201 is an equivalent circuit similar to the configuration shown in FIG. 3 of the first embodiment. In FIG. 3, each of the connection terminals 1, 2, 3, 4 represents a terminal connected to a side of another basic structure in which each side of the triangular conductor plate 2011 in FIG. 5 is adjacent. Each of the capacitors 5, 6, 7, and 8 indicates a capacitance component on the same plane as the conductor plate 2011 that the conductor plate 2011 has. Each of the inductors 9, 10, 11, and 12 represents an inductive component on the same plane as the conductor plate 2011 that the conductor plate 2011 has.

  The capacitor 13 indicates a capacitance component between the front conductive plate 2011 and the back conductive plate of the dielectric substrate 2013. The inductor 14 represents an inductive component between the conductor plate 2011 on the front surface and the conductor plate on the back surface of the dielectric substrate 2013. In FIG. 5, the periodic arrangement of the basic structure 201 is two-dimensionally arranged in a direction perpendicular to the sides of the basic structure 201 and faces the sides of three other basic structures.

On the other hand, the equivalent circuit of the basic structure of FIG. 3 has a circuit configuration in which the basic structure is arranged in a one-dimensional manner in order to simplify the description. Further, the resistance components of the conductor plate 2011 on the front surface and the conductor plate on the back surface are also omitted for simplification. Each capacitor 5,6,7,8 capacitance value of _{C 1.} Each inductor 9, 10, 11, 12, the inductance is _{L 1.} Capacitor 13, the capacitance value of _{C 2.} The inductor 14, the inductance is _{L 2.}

  Further, as in the first embodiment, the dielectric of the basic structure 201 according to the dielectric constant of the dielectric substrate 2013 of the transmission wave control substrate 200 and the film thickness of the dielectric substrate 2013 satisfying the above expression (1). The shape and size of the conductor plate 2011 on the front surface and the conductor plate on the back surface of the substrate 2013 and the shape and size of the conductor column 2012 are designed.

To satisfy the above-described (1), the conductive plate 2011, each of the back side of the conductor plate facing the conductor columns 2012 and the conductive plate 2011 has the same resonance frequency f _R. Thus, electromagnetic waves in the frequency band of the resonance frequency f _R and the resonant frequency f _R vicinity, if incident normal to the surface of the transmitted wave control board 200, to excite the plane propagating wave of the transmitted wave control board 200. The in-plane propagation wave is synthesized with isotope homologous amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface re-radiates in the same direction as the incident direction of the electromagnetic wave. That is, when electromagnetic waves are incident vertically from the upper surface of the transmitted wave control board 200 (surface on which the conductor plate 2011 is disposed), the in-plane propagation wave of the transmitted wave control board 200 is excited and re-radiated, The transmitted wave control board 200 is transmitted.

  On the other hand, when electromagnetic waves are incident on the transmitted wave control board 200 with a predetermined angle, the transmission characteristics of the transmitted wave control board 200 are different between the TM wave and the TE wave. As for the TM wave, the in-plane propagation wave of the transmitted wave control substrate 200 is excited in the same manner as when the electromagnetic wave is perpendicularly incident on the transmitted wave control substrate 200. Then, the in-plane propagation wave is synthesized with the isotopic amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface is re-radiated in the same direction as the incident direction of the TM wave and passes through the transmitted wave control board 200. Also, the TE wave is reflected without being able to excite the in-plane propagation wave when the incident angle is close to perpendicular to the transmitted wave control substrate 200. Therefore, as in the first embodiment, it is possible to realize the transmitted wave control board 200 having characteristics with different transmission amounts and reflection amounts shown in FIG. 4 according to each of the polarization direction and the incident angle of the electromagnetic waves. Become.

<Third Embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 6 is a diagram showing a configuration example of a transmitted wave control board according to the third embodiment of the present invention.
FIG. 6 is a plan view showing the surface of the transmitted wave control board 300 according to the third embodiment, and shows a configuration example of the surface pattern of the transmitted wave control board 300. In FIG. 6, a portion surrounded by a thick dotted line portion shows a basic structure 301 in the transmitted wave control board 300 of this embodiment. The basic structure 301 has a hexagonal shape (regular hexagonal shape).

  Here, the conductor plate 3011 is a hexagonal (regular hexagonal) conductor pattern formed on the surface of the dielectric substrate 3013. The conductor pillar 3012 penetrates the dielectric substrate 3013 and is electrically connected to the conductor plate 3011 on the surface of the dielectric substrate 3013. In the transmitted wave control board 300, the basic structure 301 is periodically arranged on a two-dimensional plane so that each side of the basic structure 301 is parallel to the opposite side of the other basic structure.

  Also, on the back surface of the transmitted wave control board 300, a conductive plate (not shown) having the same shape as the conductive plate 3011 is located at a position overlapping the conductive plate 3011 in a plan view, like the basic structure 101 of the first embodiment. Has been placed. The conductive pillar 3012 passes through the dielectric substrate 3013, and the conductive plate 3011 on the surface of the dielectric substrate 3013 and the conductive plate on the back surface of the dielectric substrate 3013 are connected to the conductive plate 3011 and the conductive plate on the back surface of the dielectric substrate 3013. Are electrically connected at the center of each planar shape.

  The basic structure 301 is an equivalent circuit similar to the configuration shown in FIG. 3 of the first embodiment. In FIG. 3, each of the connection terminals 1, 2, 3, and 4 indicates a terminal that is connected to a side of another basic structure in which each side of the hexagonal conductor plate 3011 in FIG. 6 is adjacent. Each of the capacitors 5, 6, 7, and 8 indicates a capacitance component on the same plane as the conductor plate 3011 that the conductor plate 3011 has. Each of the inductors 9, 10, 11, and 12 represents an inductive component on the same plane as the conductor plate 3011 that the conductor plate 3011 has.

  Capacitor 13 represents a capacitance component between conductive plate 3011 on the front surface and conductive plate on the back surface of dielectric substrate 3013. The inductor 14 represents an inductive component between the conductor plate 3011 on the front surface and the conductor plate on the back surface of the dielectric substrate 3013. In FIG. 6, the periodic arrangement of the basic structure 301 is two-dimensionally arranged in a direction perpendicular to the sides of the basic structure 301 and faces the sides of six other basic structures.

On the other hand, the equivalent circuit of the basic structure of FIG. 3 has a circuit configuration in which the basic structure is arranged in a one-dimensional manner in order to simplify the description. Further, the resistance components of the conductor plate 3011 on the front surface and the conductor plate on the back surface are also omitted for simplification. Each capacitor 5,6,7,8 capacitance value of _{C 1.} Each inductor 9, 10, 11, 12, the inductance is _{L 1.} Capacitor 13, the capacitance value of _{C 2.} The inductor 14, the inductance is _{L 2.}

  Similarly to the first embodiment, the dielectric of the basic structure 301 according to the dielectric constant of the dielectric substrate 3013 and the film thickness of the dielectric substrate 3013 of the transmission wave control substrate 300 satisfying the above expression (1). The shape and size of the conductive plate 3011 on the front surface and the conductive plate on the back surface of the substrate 3013 and the shape and size of the conductive pillar 3012 are designed.

To satisfy the above-described (1), the conductive plate 3011, each of the back side of the conductor plate facing the conductor columns 3012 and the conductive plate 3011 has the same resonance frequency f _R. Thus, electromagnetic waves in the frequency band of the resonance frequency f _R and the resonant frequency f _R vicinity, if incident normal to the surface of the transmitted wave control board 300, to excite the plane propagating wave of the transmitted wave control board 300. The in-plane propagation wave is synthesized with isotope homologous amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface re-radiates in the same direction as the incident direction of the electromagnetic wave. That is, when electromagnetic waves are incident vertically from the upper surface of the transmitted wave control board 300 (the surface on which the conductor plate 3011 is disposed), the in-plane propagation wave of the transmitted wave control board 300 is excited and re-radiated, The transmitted wave control board 300 is transmitted.

  On the other hand, when the electromagnetic waves are incident on the transmitted wave control board 300 with a predetermined angle, the transmission characteristics of the transmitted wave control board 300 are different between the TM wave and the TE wave in the electromagnetic waves. Regarding the TM wave, the in-plane propagation wave of the transmitted wave control substrate 300 is excited in the same manner as when the electromagnetic wave is incident on the transmitted wave control substrate 300 perpendicularly. Then, the in-plane propagation wave is synthesized with the isotopic amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface is re-radiated in the same direction as the incident direction of the TM wave and passes through the transmitted wave control substrate 300. Further, the TE wave is reflected without being able to excite the in-plane propagation wave when the incident angle is close to the transmission wave control substrate 300. Therefore, as in the first embodiment, it is possible to realize the transmitted wave control board 300 having different characteristics of the transmission amount and the reflection amount shown in FIG. 4 according to each of the polarization direction and the incident angle of the electromagnetic wave. Become.

<Fourth embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 7 is a diagram showing a configuration example of a transmitted wave control board according to the fourth embodiment of the present invention.
FIG. 7 is a plan view showing the surface of the transmitted wave control board 400 according to the fourth embodiment, and shows a configuration example of the surface pattern of the transmitted wave control board 400. In FIG. 7, a portion surrounded by a thick dotted line portion shows a basic structure 401 in the transmitted wave control board 400 of the present embodiment. The basic structure 401 has a hexagonal (regular hexagonal) shape.

  Here, the conductor plate 4011 is a circular (regular) conductive pattern formed on the surface of the dielectric substrate 4013. The conductor column 4012 penetrates the dielectric substrate 4013 and is electrically connected to the conductor plate 4011 on the surface of the dielectric substrate 4013. In the transmitted wave control substrate 400, the basic structure 401 is periodically arranged on a two-dimensional plane so that each side of the basic structure 401 is parallel to the opposite side of the other basic structure.

  Also, on the back surface of the transmitted wave control board 400, a conductor plate (not shown) having the same shape as that of the conductor plate 4011 is located at a position overlapping the conductor plate 4011 in a plan view, similarly to the basic structure 101 of the first embodiment. Has been placed. The conductive pillar 4012 penetrates the dielectric substrate 4013, and the conductive plate 4011 on the surface of the dielectric substrate 4013 and the conductive plate on the back surface of the dielectric substrate 4013 are connected to the conductive plate 4011 and the conductive plate on the back surface of the dielectric substrate 4013. Are electrically connected at the center of each planar shape.

  The basic structure 401 is an equivalent circuit similar to the configuration shown in FIG. 3 of the first embodiment. In FIG. 7, each of the connection terminals 1, 2, 3, and 4 indicates a terminal that is connected to a side of another basic structure in which each side of the hexagonal basic structure 401 in FIG. 7 is adjacent. Each of the capacitors 5, 6, 7, and 8 indicates a capacitance component on the same plane as the conductor plate 4011 that the conductor plate 4011 has. Each of the inductors 9, 10, 11, and 12 represents an inductive component on the same plane as the conductor plate 4011 that the conductor plate 4011 has.

  The capacitor 13 represents a capacitance component between the front conductive plate 4011 and the back conductive plate of the dielectric substrate 4013. The inductor 14 represents an inductive component between the front conductor plate 4011 and the back conductor plate of the dielectric substrate 4013. In FIG. 7, the periodic arrangement of the basic structure 401 is two-dimensionally arranged in a direction perpendicular to the sides of the basic structure 401 and faces the sides of six other basic structures.

On the other hand, the equivalent circuit of the basic structure of FIG. 3 has a circuit configuration in which the basic structure is arranged in a one-dimensional manner in order to simplify the description. In addition, the resistance components of the conductor plate 4011 on the front surface and the conductor plate on the back surface are also omitted for simplification. Each capacitor 5,6,7,8 capacitance value of _{C 1.} Each inductor 9, 10, 11, 12, the inductance is _{L 1.} Capacitor 13, the capacitance value of _{C 2.} The inductor 14, the inductance is _{L 2.}

  Similarly to the first embodiment, the dielectric of the basic structure 401 according to the dielectric constant of the dielectric substrate 4013 of the transmission wave control substrate 400 and the film thickness of the dielectric substrate 4013 satisfying the above expression (1). The shape and size of the conductor plate 4011 on the front surface and the conductor plate on the back surface of the substrate 4013 and the shape and size of the conductor column 4012 are designed.

To satisfy the above-described (1), the conductive plate 4011, each of the back side of the conductor plate facing the conductor columns 4012 and the conductive plate 4011 has the same resonance frequency f _R. Thus, electromagnetic waves in the frequency band of the resonance frequency f _R and the resonant frequency f _R vicinity, if incident normal to the surface of the transmitted wave control board 400, to excite the plane propagating wave of the transmitted wave control board 400. The in-plane propagation wave is synthesized with isotope homologous amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface re-radiates in the same direction as the incident direction of the electromagnetic wave. That is, when electromagnetic waves enter perpendicularly from the upper surface of the transmitted wave control board 400 (the surface on which the conductor plate 4011 is disposed), the in-plane propagating wave of the transmission control board 400 is excited and re-radiated to transmit the electromagnetic waves. It passes through the wave control board 400.

  On the other hand, when electromagnetic waves are incident on the transmitted wave control board 400 at a predetermined angle, the transmission characteristics of the transmitted wave control board 400 are different between the TM wave and the TE wave in the electromagnetic waves. For the TM wave, the in-plane propagation wave of the transmitted wave control substrate 400 is excited in the same manner as when the electromagnetic wave is incident on the transmitted wave control substrate 400 perpendicularly. Then, the in-plane propagation wave is synthesized with the isotopic amplitude on the back surface of the incident surface. Since the frequency of the in-plane propagation wave is in the radiation region, the in-plane propagation wave on the back surface is re-radiated in the same direction as the incident direction of the TM wave and passes through the transmitted wave control substrate 400. In addition, the TE wave is reflected without being able to excite the in-plane propagation wave when the incident angle is close to perpendicular to the transmitted wave control substrate 400. Therefore, as in the first embodiment, it is possible to realize the transmitted wave control board 400 having different characteristics of the transmission amount and the reflection amount shown in FIG. 4 according to each of the polarization direction and the incident angle of the electromagnetic wave. Become.

<Fifth Embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 8 is a diagram showing a configuration example of a transmitted wave control board according to the fifth embodiment of the present invention.
In FIG. 8, the example of the shape of the conductor board of the basic structure in the transmitted wave control board | substrate is shown. Similar to the first embodiment shown in FIG. 2, conductor plates having the same shape are arranged at positions overlapping the conductor plates in FIG. 8 in plan view via the dielectric substrate, and each conductor plate is a conductor pillar. Are connected in the same manner as in the first to fourth embodiments. Further, in order to satisfy the above-mentioned (1), the conductor plate of the surface of the dielectric substrate, each of the back side of the conductor plate opposite to the conductive plate of the conductor post and the surface have the same resonant frequency f _R . Therefore, similarly to each of the first to fourth embodiments, a transmitted wave control board having characteristics in which the amount of transmitted light and the amount of reflected light differ according to the polarization direction and incident angle of electromagnetic waves is realized. It becomes possible.

  In the fifth embodiment, the basic structure is divided into four parts every 90 degrees with respect to the center of the basic structure itself. When the structures are rotated by 90 degrees, 180 degrees, and 270 degrees, respectively, they all have the same shape. It is the structure which becomes. Further, in the two-dimensional array on the transmitted wave control board, a shape in which a part of another adjacent basic structure is included in the dielectric body of the basic structure is included. Two-dimensional periodic arrangement at 0 °, 90 ° (π / 2), 180 ° (π), and 270 ° (3π / 2) at an arbitrary starting angle with respect to the center of the basic structure in the fifth embodiment It has a structure to do.

  In FIG. 8A, the conductor plate 5011 in the basic structure 501 is formed on the surface of the dielectric substrate 5013 so that the rectangular wiring pattern P1 and the wiring pattern P2 intersect at a right angle. Here, the short sides of the wiring patterns P1 and P2 in the conductor plate 5011 are connected to conductor plates in another basic structure adjacent to each other. Similar to the first to fourth embodiments described above, a conductor plate having the same shape as the conductor plate 5011 is formed on the back surface of the dielectric substrate 5013 so as to overlap the conductor plate 5011 in a plan view. ing.

Similarly to the first to fourth embodiments, the conductor plate 5011, the conductor plate on the back surface of the dielectric substrate 5013, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor column penetrating 5013 is formed.
The basic structure 501 is equally divided into four unit structures by orthogonal lines D1 and D2 that pass through the center of the basic structure 501 itself. Accordingly, when the basic structure 501 is rotated at an angle θ of 90 degrees, 180 degrees, and 270 degrees with the center of the basic structure 501 as the rotation axis, it has the same shape as 0 degrees, that is, when it is not rotated.

  8B (or FIG. 8C), the conductor plate 5021 in the basic structure 502 has a rectangular wiring pattern P1 and a wiring pattern P2 crossing at a right angle with respect to the center of the pattern in FIG. 8A. The wiring patterns P3 (patterns P4) are stacked on the surface of the dielectric substrate 5023 so that the centers of the rectangular wiring patterns P3 (circular wiring patterns P4) overlap. Here, the short sides of the wiring patterns P1 and P2 in the conductor plate 5021 are connected to the conductor plate in another basic structure adjacent thereto. As in the first to fourth embodiments already described, a conductive plate having the same shape as the conductive plate 5021 is formed on the back surface of the dielectric substrate 5023 so as to overlap the conductive plate 5021 in plan view. ing.

Similarly to the first to fourth embodiments, the conductor plate 5021, the conductor plate on the back surface of the dielectric substrate 5023, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor pillar penetrating 5023 is formed.
The basic structure 502 is equally divided into four unit structures by orthogonal lines D1 and D2 passing through the center of the basic structure 502 itself. Accordingly, when the basic structure 502 is rotated at angles of 90 degrees, 180 degrees, and 270 degrees with the center of the basic structure 502 as the rotation axis, the shape is the same as that when the base structure 502 is not rotated.

  In FIG. 8D (or FIG. 8E and FIG. 8F), the conductor plate 5031 in the basic structure 503 has a center of the square wiring pattern P3 with respect to the center of the inverted pattern P5. The wiring pattern P3 is formed on the surface of the dielectric substrate 5033 so as to overlap. Here, the side P51 of the wiring pattern P5 in the conductor plate 5031 is connected to the conductor plate in another adjacent basic structure. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5031 is formed on the back surface of the dielectric substrate 5033 so as to overlap the conductor plate 5031 in plan view. ing.

Further, similarly to the first to fourth embodiments, the conductor plate 5031, the conductor plate on the back surface of the dielectric substrate 5033, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor pillar penetrating 5033 is formed.
The basic structure 503 is equally divided into four unit structures by orthogonal lines D1 and D2 that pass through the center of the basic structure 503 itself. Accordingly, when the basic structure 503 is rotated at angles of 90 degrees, 180 degrees, and 270 degrees with the center of the basic structure 503 as the rotation axis, it has the same shape as that of 0 degrees, that is, when it is not rotated.

<Sixth Embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 9 is a diagram showing a configuration example of a transmitted wave control board according to the sixth embodiment of the present invention. Similar to the first embodiment shown in FIG. 2, conductor plates having the same shape are arranged at positions overlapping with the conductor plates in FIG. 9 through the dielectric substrate in plan view, and each conductor plate is a conductor pillar. Are connected in the same manner as in the first to fourth embodiments. Further, in order to satisfy the above-mentioned (1), the conductor plate of the surface of the dielectric substrate, each of the back side of the conductor plate opposite to the conductive plate of the conductor post and the surface have the same resonant frequency f _R . Therefore, similarly to each of the first to fourth embodiments, a transmitted wave control board having characteristics in which the amount of transmitted light and the amount of reflected light differ according to the polarization direction and incident angle of electromagnetic waves is realized. It becomes possible.

  FIG. 9 shows an example of the shape of the conductor plate of the basic structure (regular triangle structure) in the transmitted wave control board. In the sixth embodiment, the basic structure is a structure that is divided into three parts every 120 degrees with respect to the center of the basic structure itself and has the same shape when rotated by 120 degrees and 240 degrees, respectively. Further, in the two-dimensional array on the transmitted wave control board, a shape in which a part of another adjacent basic structure is included in the dielectric body of the basic structure is included. A structure that is two-dimensionally arranged at an angle θ of 0 degrees, 120 degrees (2π / 3), and 240 degrees (4π / 3) at an arbitrary starting angle with respect to the center of the basic structure in the sixth embodiment. It has become.

In FIG. 9A, the conductor plate 5041 in the basic structure 504 has rectangular patterns P7, P8 having short sides having the same length as each side of the pattern P6 with respect to each side of the regular triangle pattern P6. One of the short sides of P9 is connected to each other and formed on the surface of the dielectric substrate 5043. Here, the other short sides of the wiring patterns P7, P8, and P9 in the conductor plate 5041 are connected to the conductor plate in another basic structure adjacent thereto. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5041 is formed on the back surface of the dielectric substrate 5043 so as to overlap the conductor plate 5041 in a plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5041, the conductor plate on the back surface of the dielectric substrate 5043, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5043 is formed.
The basic structure 504 passes through the center of the basic structure 504 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 504 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 504 as the rotation axis, it has the same shape as that of the case where it is not rotated, that is, 0 degrees.

  9B and 9C, the center of the conductor plate 5041 and the regular triangle pattern P10 whose side is longer than the pattern P6 with respect to the conductor plate 5041 of the basic structure 504 in FIG. 9A. A conductor plate 5041A is formed on the surface of the dielectric substrate 5043 so as to overlap the pattern P10 so as to coincide with the center. Here, the other short sides of the wiring patterns P7, P8, P9 in the conductor plate 5041A are connected to the conductor plates in another basic structure adjacent to each other. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5041A is formed on the back surface of the dielectric substrate 5043 so as to overlap the conductor plate 5041A in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5041A, the conductor plate on the back surface of the dielectric substrate 5043, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5043 is formed.

The basic structure 504 passes through the center of the basic structure 504 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 504 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 504 as the rotation axis, the shape is the same as that of 0 degrees, that is, when the basic structure 504 is not rotated.
In FIG. 9B, the pattern P10 is arranged so that the long sides of the patterns P7, P8, and P9 are parallel to the line segment from the center of the pattern P10 to each vertex. In FIG. 9C, the pattern P10 is arranged so that the long sides of the patterns P7, P8, and P9 are orthogonal to the sides of the pattern P10.

In FIG. 9D, with respect to the conductor plate 5041 in FIG. 9A in the basic structure 504, the center of the conductor plate 5041 and the center of the regular circular pattern P11 including the pattern P6 coincide with each other. The conductor plate 5041B is formed on the surface of the dielectric substrate 5043 so as to overlap the pattern P11. Here, the other short sides of the wiring patterns P7, P8, and P9 in the conductor plate 5041B are connected to the conductor plates in another basic structure adjacent to each other. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5041B is formed on the back surface of the dielectric substrate 5043 so as to overlap the conductor plate 5041B in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5041B, the conductor plate on the back surface of the dielectric substrate 5043, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5043 is formed.
The basic structure 504 passes through the center of the basic structure 504 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 504 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 504 as the rotation axis, the shape is the same as that of 0 degrees, that is, when the basic structure 504 is not rotated.

9 (e) and 9 (f), the conductor plate 5051 in the basic structure 505 connects the L-shaped patterns P13, P14, and P15 to the sides of the regular triangular pattern P12, respectively. It is formed on the surface of body substrate 5053. Here, the sides of the wiring patterns P13, P14, and P15 in the conductor plate 5051 parallel to the outer periphery of the basic structure 505 are connected to the conductor plates in other adjacent basic structures. Similar to the first to fourth embodiments already described, a conductive plate having the same shape as the conductive plate 5051 is formed on the back surface of the dielectric substrate 5053 so as to overlap the conductive plate 5051 in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5051, the conductor plate on the back surface of the dielectric substrate 5053, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5053 is formed.
The basic structure 505 passes through the center of the basic structure 505 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 505 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 505 as the rotation axis, the shape is the same as that of 0 degrees, that is, when the basic structure 505 is not rotated.

In FIG. 9G, the conductor plate 5051A in the basic structure 505 has L-shaped patterns P13, P14, and P15 as the sides of the basic structure 505 and the basic structure 505 for each vertex of the regular triangle pattern P12. The patterns P 13, P 14, and P 15 facing the sides are connected so that the sides are parallel to each other, and are formed on the surface of the dielectric substrate 5053. Here, the sides of the wiring patterns P13, P14, and P15 in the conductor plate 5051A parallel to the outer periphery of the basic structure 505 are connected to the conductor plates in another adjacent basic structure. Similar to the first to fourth embodiments already described, a conductive plate having the same shape as the conductive plate 5051A is formed on the back surface of the dielectric substrate 5053 so as to overlap the conductive plate 5051A in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5051A, the conductor plate on the back surface of the dielectric substrate 5053, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5053 is formed.
The basic structure 505 passes through the center of the basic structure 505 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 505 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 505 as the rotation axis, the shape is the same as that of 0 degrees, that is, when the basic structure 505 is not rotated.

In FIG. 9 (h), the conductor plate 5051B in the basic structure 505 includes the L-shaped patterns P13, P14, and P15 at the positions of 120 degrees on the circumference of the regular circular pattern P16. And the sides of the patterns P 13, P 14, and P 15 facing the sides of the basic structure 505 are connected in parallel to each other and formed on the surface of the dielectric substrate 5053. Here, the sides of the wiring patterns P13, P14, and P15 in the conductor plate 5051B parallel to the outer periphery of the basic structure 505 are connected to the conductor plates in the other adjacent basic structure. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5051B is formed on the back surface of the dielectric substrate 5053 so as to overlap the conductor plate 5051B in plan view. ing. Further, similarly to the first to fourth embodiments, the conductor plate 5051B, the conductor plate on the back surface of the dielectric substrate 5053, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5053 is formed.
The basic structure 505 passes through the center of the basic structure 505 itself and is equally divided into three unit structures by each of straight lines D3, D4, and D5 having an angle of 120 degrees. Therefore, when the basic structure 505 is rotated at an angle of 120 degrees and 240 degrees with the center of the basic structure 505 as the rotation axis, the shape is the same as that of 0 degrees, that is, when the basic structure 505 is not rotated.

<Seventh embodiment>
Embodiments of the present invention will be described below with reference to the drawings. FIG. 10 is a diagram showing a configuration example of a transmitted wave control board according to the seventh embodiment of the present invention. Similar to the first embodiment shown in FIG. 2, a conductor plate having the same shape is arranged at a position overlapping the conductor plate in FIG. 10 in plan view via a dielectric substrate, and each conductor plate is a conductor pillar. Are connected in the same manner as in the first to fourth embodiments. Further, in order to satisfy the above-mentioned (1), the conductor plate of the surface of the dielectric substrate, each of the back side of the conductor plate opposite to the conductive plate of the conductor post and the surface have the same resonant frequency f _R . Therefore, similarly to each of the first to fourth embodiments, a transmitted wave control board having characteristics in which the amount of transmitted light and the amount of reflected light differ according to the polarization direction and incident angle of electromagnetic waves is realized. It becomes possible.

  Further, FIG. 10 shows an example of the shape of the conductor plate having the basic structure (regular hexagonal structure) in the transmitted wave control board. In the seventh embodiment, the basic structure is divided into six parts every 60 degrees with respect to the center of the basic structure itself when rotated to 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees, respectively. All have the same shape. Further, in the two-dimensional array on the transmitted wave control board, a shape in which a part of another adjacent basic structure is included in the dielectric body of the basic structure is included. With respect to the center of the basic structure in the seventh embodiment, at an arbitrary starting angle, 0 degrees, 60 degrees (π / 3), 120 degrees (2π / 3), 180 degrees (π), 240 degrees (4π / 3) ), 300 (5π / 3).

In FIG. 10A, the conductive plates 5061 in the basic structure 506 are rectangular patterns P17, P18 having short sides having the same length as each side of the pattern P16A with respect to each side of the regular hexagonal pattern P16A. One of the short sides of P19, P20, P21, and P22 is connected to each other and formed on the surface of the dielectric substrate 5063. Here, the other short sides of the wiring patterns P17, P18, P19, P20, P21, and P22 in the conductor plate 5061 are connected to the conductor plates in other basic structures adjacent to each other. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5061 is formed on the back surface of the dielectric substrate 5063 so as to overlap the conductor plate 5061 in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5061, the conductor plate on the back surface of the dielectric substrate 5063, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor pillar penetrating 5063 is formed.
The basic structure 506 is equally divided into six unit structures by each of straight lines D6, D7, and D8 passing through the center of the basic structure 506 itself and having an angle of 60 degrees. Therefore, when the basic structure 506 is rotated at angles of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees with the center of the basic structure 506 as the rotation axis, 0 degrees, that is, the same shape as when not rotated It becomes.

  10 (b) and 10 (c), with respect to the conductor plate 5061 of FIG. 10 (a) in the basic structure 506, the center of the conductor plate 5061 and a regular hexagonal pattern P23 whose side is longer than the pattern P16A. A conductor plate 5061A is formed on the surface of the dielectric substrate 5063 so as to overlap the pattern P23 so as to coincide with the center. Here, the other short sides of the wiring patterns P17, P18, P19, P20, P21, and P22 in the conductor plate 5061A are connected to the conductor plates in other basic structures adjacent to each other. Similar to the first to fourth embodiments described above, a conductor plate having the same shape as the conductor plate 5061A is formed on the back surface of the dielectric substrate 5063 so as to overlap the conductor plate 5061A in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5061A, the conductor plate on the back surface of the dielectric substrate 5063, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor pillar penetrating 5063 is formed.

The basic structure 506 is equally divided into six unit structures by each of straight lines D6, D7, and D8 passing through the center of the basic structure 506 itself and having an angle of 60 degrees. Therefore, when the basic structure 506 is rotated at angles of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees with the center of the basic structure 506 as the rotation axis, 0 degrees, that is, the same shape as when not rotated It becomes.
Further, in FIG. 10C, the pattern P23 is arranged such that the long sides of the patterns P17, P18, P19, P20, P21, and P22 are parallel to the line segment from the center of the pattern P23 to each vertex. Has been placed. In FIG. 10B, the pattern P23 is arranged so that the long sides of the patterns P17, P18, P19, P20, P21, and P22 are orthogonal to the sides of the pattern P23.

In FIG. 10D, with respect to the conductor plate 5061 in FIG. 10A in the basic structure 506, the center of the conductor plate 5061 and the center of the regular circular pattern P24 including the pattern P16A coincide with each other. The conductor plate 5061B is formed on the surface of the dielectric substrate 5063 so as to overlap the pattern P24. Here, the other short sides of the wiring patterns P17, P18, P19, P20, P21, and P22 in the conductor plate 5061B are connected to the conductor plate in another basic structure adjacent thereto. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5061B is formed on the back surface of the dielectric substrate 5063 so as to overlap the conductor plate 5061B in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5061B, the conductor plate on the back surface of the dielectric substrate 5063, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor pillar penetrating 5063 is formed.
The basic structure 506 passes through the center of the basic structure 506 itself, and is equally divided into six unit structures by each of straight lines D6, D7, and D8 each having an angle of 60 degrees. Therefore, when the basic structure 506 is rotated at angles of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees with the center of the basic structure 506 as the rotation axis, 0 degrees, that is, the same shape as when not rotated It becomes.

10 (e) and 10 (f), the conductor plate 5071 in the basic structure 507 has L-shaped wiring patterns P26, P27, P28, P29, P30, with respect to each side of the regular hexagonal pattern P25. P31 is connected to each other and formed on the surface of the dielectric substrate 5073. Here, the sides of the wiring patterns P26, P27, P28, P29, P30, and P31 in the conductor plate 5071 parallel to the outer periphery of the basic structure 507 are connected to the conductor plates in other adjacent basic structures. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5071 is formed on the back surface of the dielectric substrate 5073 so as to overlap the conductor plate 5071 in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5071, the conductor plate on the back surface of the dielectric substrate 5073, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5073 is formed.
The basic structure 507 passes through the center of the basic structure 507 itself and is equally divided into six unit structures by each of straight lines D6, D7 and D8 having an angle of 60 degrees. Therefore, when the basic structure 507 is rotated at an angle of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees with the center of the basic structure 507 as the rotation axis, the same shape as that when the center structure 507 is not rotated is 0 degrees. It becomes.

In FIG. 10 (g), the conductor plate 5071A in the basic structure 507 has the L-shaped patterns P26, P27, P28, P29, P30, and P31 of the basic structure 507 for each vertex of the regular hexagonal pattern P25. The sides are connected so that the sides of the patterns 26, P 27, P 28, P 29, P 30, P 31 facing the sides of the basic structure 507 are parallel to each other, and are formed on the surface of the dielectric substrate 5073. Here, the sides of the wiring patterns P26, P27, P28, P29, P30, and P31 in the conductor plate 5071A, which are parallel to the outer periphery of the basic structure 507, are connected to the conductor plates in other adjacent basic structures. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5071A is formed on the back surface of the dielectric substrate 5073 so as to overlap the conductor plate 5071A in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5071A, the conductor plate on the back surface of the dielectric substrate 5073, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5073 is formed.
The basic structure 507 passes through the center of the basic structure 507 itself and is equally divided into six unit structures by each of straight lines D6, D7 and D8 having an angle of 60 degrees. Therefore, when the basic structure 507 is rotated at an angle of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 degrees with the center of the basic structure 507 as the rotation axis, the same shape as that when the center structure 507 is not rotated is 0 degrees. It becomes.

In FIG. 10H, the conductor plate 5071B in the basic structure 507 has L-shaped patterns P26, P27, P28, P29, P30, and P31 at every 60 degrees on the circumference of the regular circular pattern P32. These are connected to each other so that the sides of the basic structure 507 and the sides of the patterns P26, P27, P28, P29, P30, and P31 facing the sides of the basic structure 507 are parallel to each other, and are formed on the surface of the dielectric substrate 5073. ing. Here, the sides of the wiring patterns P26, P27, P28, P29, P30, and P31 in the conductor plate 5071B that are parallel to the outer periphery of the basic structure 507 are connected to the conductor plates in other adjacent basic structures. As in the first to fourth embodiments already described, a conductor plate having the same shape as the conductor plate 5071B is formed on the back surface of the dielectric substrate 5073 so as to overlap the conductor plate 5071B in plan view. ing. Similarly to the first to fourth embodiments, the conductor plate 5071B, the conductor plate on the back surface of the dielectric substrate 5073, and the dielectric substrate (not shown) having a capacitance value and an inductance satisfying the expression (1) A conductor post penetrating 5053 is formed.
The basic structure 507 passes through the center of the basic structure 507 itself and is equally divided into six unit structures by each of straight lines D6, D7 and D8 having an angle of 60 degrees. Accordingly, when the basic structure 507 is rotated at angles of 60 degrees, 120 degrees, 180 degrees, 240 degrees, and 300 with the center of the basic structure 507 as the rotation axis, it has the same shape as 0 degrees, that is, when not rotated. Become.

  As described above, in the fifth to seventh embodiments, the conductor plate has n of 3, 4, or 6 and θ = 2π / n, with respect to the center of the basic structure, The angle is 0, θ, 2θ,..., (N−1) θ, and is rotated and rotated on a two-dimensional surface (each surface of the dielectric substrate) to periodically form a combined shape. ing. That is, the conductor plate has a structure in which the adjacent basic structures are periodically arranged two-dimensionally in the 0, θ, 2θ,..., (N−1) θ directions of the basic structure.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and includes design and the like within a scope not departing from the gist of the present invention. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

1, 2, 3, 4 ... connection terminals 5, 6, 7, 8 ... capacitors 9, 10, 11, 12 ... inductors 100, 200, 300, 400 ... transmitted wave control boards 101, 201, 401, 501, 502, 503, 504, 505, 506, 507 ... Basic structure 1011, 1014, 20111, 3011, 4011, 5011, 5021, 5031, 5041, 5041A, 5041B, 5051, 5051A, 5051B, 5061, 5061A, 5061B, 5071, 5071A, 5071B ... Conductor plate 1012, 2012, 3012, 4012 ... Conductor column 1013, 2013, 3013, 4013, 5013, 5023, 5033, 5043, 5053, 5063, 5073 ... Dielectric substrate P1, P2, P3, P4, P5, P6 , P7, P8, P9, P 0, P11, P12, P13, P14, P15, P16, P17, P18, P19, P20, P21, P22, P23, P24, P25, P26, P27, P28, P29, P30, P31, P32 ... wiring pattern D1, D2, D3, D4, D5, D6, D7, D8 ... straight line

Claims (4)

A dielectric substrate;
A first conductor plate formed on the surface of the dielectric substrate;
A second conductor plate having the same shape as the first conductor plate and formed on the back surface of the dielectric substrate;
A basic structure that includes a conductor pillar that penetrates the dielectric substrate and connects each of the first conductor plate and the second conductor plate to the center of each of the first conductor plate and the second conductor plate. Has a structure,
Said first conductive plate and the capacitance component on each flush of the second conductive plate to a volume value C _1, the inductance of the inductive component on each flush of the first conductive plate and said second conductive plate L ₁ , the capacitive component in the conductor column between the front and back surfaces is C ₂ , the inductive component in the conductor column between the front and back surfaces is L ₂ , and the following resonance frequency f _R is shown (1 ) When an electromagnetic wave having a frequency similar to the resonance frequency is incident on a substrate on which a basic structure satisfying the formula is arranged in a two-dimensional cycle, each of the transmission amount and the reflection amount depends on the incident angle of the electromagnetic wave. Transmitted wave control board characterized by.

The first conductor plate and the second conductor plate have an n (n = 3, 4, 6) square shape, and each of the sides of the first conductor plate and the second conductor plate is adjacent to another base. 2. The transmitted wave control board according to claim 1, wherein the transmission wave control board is arranged in a two-dimensional period so as to face each side of the n-shaped first conductor plate and the second conductor plate having a structure. The basic structure is hexagonal, each of the first conductive plate and the second conductive plate is circular, and the side of the adjacent hexagonal basic structure is opposite to the side of another adjacent hexagonal basic structure The transmitted wave control board according to claim 1, wherein the transmission wave control board is arranged in a two-dimensional cycle. When n is 3, 4, or 6 and θ = 2π / n, the shape of the conductor plate is an angle of 0, θ, 2θ,..., (n−1) θ with respect to the center of the basic structure. The shape rotated in the above is a synthesized shape, and the adjacent basic structures are periodically arranged in two dimensions in the 0, θ, 2θ,..., (N−1) θ directions of the basic structures. The transmitted wave control board according to claim 1.

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