JP6077769B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus.

  Patent Document 1 describes a substrate processing apparatus in which a cylindrical scattering prevention member is provided vertically above the outer periphery of a side wall portion of a cup. In the substrate processing apparatus described in Patent Document 1, a ventilation hole is provided in the scattering prevention member, and a contaminated air flow generated in the scattering prevention member is exhausted to the outside through the ventilation hole.

Japanese Patent Laid-Open No. 9-148218 (released on June 6, 1997)

  In a substrate processing apparatus, as a method for supplying a processing liquid to a substrate, there is a method for discharging the processing liquid from a spray nozzle provided on the substrate. When the processing liquid is discharged from the spray nozzle to the substrate, the substrate is placed in a cup-shaped container and processed as in the substrate processing apparatus described in Patent Document 1, and the processing liquid is placed around the substrate. To prevent splashing.

  However, when the processing liquid is discharged from the spray type nozzle, there is a problem that a mist-like processing liquid is generated and scattered outside the cup, thereby contaminating the periphery of the cup.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing capable of preventing the periphery of a cup containing a substrate from being contaminated by a processing liquid discharged from a spray type nozzle. To provide an apparatus.

  In order to solve the above-described problems, a substrate processing apparatus according to the present invention is a substrate processing apparatus that processes a substrate with a mist-like liquid sprayed from a nozzle, and is positioned above the substrate and on the substrate. An upper exhaust port for exhausting the gas flowing from above the outer periphery of the substrate, and extending from the upper exhaust port in the direction of the substrate, so that the gas flowing on the substrate flows into the upper exhaust port And a first shielding part for changing a direction in which the gas flows.

  According to the substrate processing apparatus of the present invention, the upper exhaust port that is located above the substrate and exhausts the gas flowing on the substrate from above the outer periphery of the substrate, and extends from the upper exhaust port in the direction of the substrate. And a first shielding part that changes the flow direction of the gas so that the gas flowing on the substrate flows into the upper exhaust port, so that the periphery of the cup containing the substrate is contaminated. Can be prevented.

1 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an enlarged periphery of each exhaust port of the substrate processing apparatus shown in FIG. (A) And (b) is a figure which shows the mist scattering prevention effect using the substrate processing apparatus which concerns on one Embodiment of this invention. It is general | schematic sectional drawing of the substrate processing apparatus which concerns on other embodiment of this invention. (A) which shows the structure of the principal part of the substrate processing apparatus shown in FIG. 4 is a bottom view, (b) is the sectional view on the AA line of (a).

<Embodiment 1>
Hereinafter, an embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view showing an enlarged periphery of each exhaust port of the substrate processing apparatus shown in FIG. FIGS. 3A and 3B are views showing the effect of preventing mist scattering using the substrate processing apparatus according to one embodiment of the present invention.

[Substrate Processing Apparatus 10]
As shown in FIGS. 1 and 2, the substrate processing apparatus 10 includes an upper exhaust port 1 and a first shielding portion 2. Further, the substrate processing apparatus 10 may include the second shielding unit 3, the lower exhaust port 4, the airflow changing unit 5, the spin chuck 6, the nozzle 11, and the cup 15. In the substrate processing apparatus 10, the substrate 12 is placed on the spin chuck 6 accommodated in the cup 15, and the substrate 12 is rotated by rotating the spin chuck 6, while the substrate 11 is rotated and the substrate 11 is processed. The liquid (liquid) is discharged. Therefore, the upper part of the substrate 12 placed on the spin chuck 6 in the cup 15 is opened to receive the processing liquid from the nozzle 11.

  In the present embodiment, the substrate 12 to be processed in the substrate processing apparatus 10 has a dicing tape 13 and a dicing frame 14 bonded to the surface opposite to the processing surface. Moreover, in the substrate processing apparatus 10, the nozzle 11 is a spray type nozzle and may be provided with two or more. Alternatively, the processing liquid may be discharged while the nozzle 11 is swung in the radial direction of the substrate 12. As the processing liquid discharged from the nozzle 11, various conventionally known processing liquids can be selected in accordance with the processing on the substrate 12.

(Upper exhaust port 1)
In the substrate processing apparatus 10, the upper exhaust port 1 is located above the spin chuck 6 accommodated in the cup 15. That is, the upper exhaust port 1 is positioned above the substrate 12 placed on the spin chuck 6. The upper exhaust port 1 is provided on the side surface side of the cup 15. That is, it is provided outside the outer periphery of the substrate 12 provided on the spin chuck 6. Thus, the upper exhaust port 1 exhausts the gas flowing on the substrate 12 from above the outer periphery of the substrate 12.

(First shielding part 2)
The first shielding portion 2 is provided so as to extend from the upper exhaust port 1 toward the spin chuck 6, that is, toward the substrate 12 placed on the spin chuck 6. The first shielding part 2 is connected to the upper wall that continues to the upper exhaust port 1. As shown by an arrow in FIG. 2, the first shielding unit 2 changes the flow direction of the gas so that the gas flowing on the substrate 12 flows into the upper exhaust port 1. That is, the first shielding part 2 is a gas that flows on the substrate 12, and is positioned in the traveling direction of the gas upward from the substrate 12, so that the flow is blocked and the first shielding part 2 is changed to the upper exhaust port 1. To do.

  In general, in an apparatus that discharges processing liquid onto a substrate from a spray nozzle, the discharged mist processing liquid (processing liquid mist) scatters from the opening above the cup on which the substrate is placed and contaminates the periphery of the cup. There is a risk of it. In particular, when a plurality of nozzles are used or when the processing liquid is discharged while swinging the nozzles, the processing liquid mist is more diffused and the surroundings of the apparatus become conspicuous.

  On the other hand, since the substrate processing apparatus 10 includes the upper exhaust port 1 and the first shielding part 2, the gas flowing on the substrate 12 can be efficiently exhausted from above the outer periphery of the substrate 12. With this gas exhaust, the processing liquid mist can be discharged (drained) from the upper exhaust port 1 to the outside of the cup 15. Therefore, the surroundings of the cup 15 can be prevented from being contaminated.

  As shown in FIG. 2, the first shielding portion 2 is provided in a stepped manner from the upper wall that continues to the upper exhaust port 1 so as to be further away from the upper wall, that is, the distance from the substrate 12. It may be. The first shielding unit 2 is provided on the outer periphery of the substrate 12 in a circumferential shape. Thereby, the gas which goes upwards of the board | substrate 12 can be guide | induced to the upper exhaust port 1 more reliably.

  The substrate processing apparatus 10 may include a plurality of upper exhaust ports 1. When two upper exhaust ports 1 are provided, it is preferable that these are arranged at substantially diagonal positions across the substrate 12. Further, when three or more upper exhaust ports 1 are provided, it is preferable that these are arranged at equal intervals on a concentric circle of the substrate 12. Thereby, the gas flowing on the substrate 12 can be exhausted more reliably, and the surroundings of the cup 15 can be prevented from being contaminated.

  Here, the substrate processing apparatus 10 may further include a suction unit (not shown) that sucks the gas on the substrate 12 through the upper exhaust port 1. By sucking the gas on the substrate 12 from the upper exhaust port 1 by the suction means, an airflow flowing toward the upper exhaust port 1 is generated on the substrate 12, and the gas on the substrate 12 is more efficiently discharged from the upper exhaust port 1. Can be exhausted.

  Further, instead of using the suction means, an airflow that flows toward the upper exhaust port 1 may be generated on the substrate 12 by blowing a gas onto the substrate 12. At this time, for example, the gas may be blown from one of the two upper exhaust ports 1 disposed substantially diagonally across the substrate 12 toward the other.

(Second shielding part 3)
The second shield 3 is located above the spin chuck 6, that is, between the upper surface of the substrate 12 and the upper exhaust port 1. The second shielding part 3 is located closer to the substrate 12 than the first shielding part 2 and extends from the upper exhaust port 1 toward the spin chuck 6, that is, toward the substrate 12 placed on the spin chuck 6. Is provided. The second shielding part 3 is located below the upper wall to which the first shielding part 2 is connected, and is connected to the lower wall that continues to the upper exhaust port 1. As shown by an arrow in FIG. 2, the second shielding unit 3 changes the flow direction of the gas so that the gas flowing upward of the substrate 12 flows downward of the substrate 12. That is, the second shielding unit 3 is a gas that flows on the substrate 12, and is located in the traveling direction of the gas upward from the substrate 12, so that the flow is blocked and the second shielding unit 3 is directed downward from the substrate 12. Change to

  As described above, the gas whose flow is changed by the second shielding unit 3 so as to be directed downward from the substrate 12 is exhausted through the lower exhaust port 4 described later. Accordingly, the processing liquid mist diffused on the substrate 12 can be discharged to the outside of the cup 15 as the gas is exhausted from the lower exhaust port 4. Thereby, it can prevent more reliably that the circumference | surroundings of the cup 15 are contaminated.

  Each of the first shielding part 2 and the second shielding part 3 is a plate-like body extending in the direction of the substrate 12 and may be provided at a position where they overlap each other when viewed from the substrate 12 side. You may protrude in the direction of the board | substrate 12 by extending | stretching in the direction of the board | substrate 12 more than the other. Further, the first shielding part 2 and the second shielding part 3 may be provided horizontally with respect to the substrate 12, and the gas flow toward the upper side of the substrate 12 is directed to the upper exhaust port 1 or the lower exhaust port 4. As long as it can be changed, it does not need to be provided horizontally with respect to the substrate 12. The first shielding part 2 and the second shielding part 3 are surface-treated (coated) with, for example, a fluororesin so that the treatment liquid mist is difficult to adhere.

  Of the gas traveling upward from the substrate 12, the flow of the gas whose flow path is blocked by the second shielding portion 3 is changed by the second shielding portion 3 so as to be directed downward from the substrate 12. Even if the gas flows upward from the substrate 12 and flows in a position away from the second shielding part 3, the gas whose flow path is blocked by the first shielding part 2 is further reduced by the first shielding part 2. The flow is changed toward the upper exhaust port 1.

  Thus, since the two-stage airflow change by the first shielding part 2 and the second shielding part 3 is performed on the gas directed upward of the substrate 12, the gas flowing on the substrate 12 is more reliably transferred to the upper exhaust port 1. And can be led to the lower exhaust port 4. As a result, the processing liquid mist can be discharged from the upper exhaust port 1 and the lower exhaust port 4 along with the gas guided to the upper exhaust port 1 and the lower exhaust port 4. Thus, according to the substrate processing apparatus 10, since the processing liquid mist is not scattered outside the cup 15, it is possible to more reliably prevent the periphery of the cup 15 from being contaminated.

  The upper exhaust port 1 and the first shielding part 2 and the cup 15 provided with the lower wall to which the second shielding part 3 is connected are provided independently of each other. 1 and 2, the upper exhaust port 1 is located at the end of the upper wall, and the opening diameter thereof is the inner diameter of the exhaust passage formed from the upper portion of the substrate 12 to the upper exhaust port 1 by the upper wall. However, the configuration of the upper exhaust port 1 is not limited to this.

  Note that the second shielding part 3 is provided on the outer periphery of the substrate 12 in a circumferential shape, similarly to the first shielding part 2.

  Moreover, it is preferable that the distance A between the 2nd shielding part 3 shown in FIG. 1 and the outer periphery of the board | substrate 12 is 3-20 mm, and the distance B between the 2nd shielding part 3 and the upper surface of the board | substrate 12 is shown. Is preferably 10 to 50 mm. Thereby, generation | occurrence | production of the gas which goes upwards beyond the 2nd shielding part 3 from the board | substrate 12 can be suppressed, and scattering of the process liquid mist by the said gas can be prevented. The distance A and the distance B can be changed as appropriate according to the size of the substrate 12, the number of rotations of the substrate 12, the number of nozzles 11, and the like. For example, as shown in the examples described later, when the treatment liquid is sprayed from six nozzles while rotating the substrate 12 having a diameter of 300 mm at a rotation speed of 1200 rpm, the distance A is 5 mm and the distance B is 20 mm. It is preferable.

  Here, the distance A is intended to be the distance from the outer periphery of the substrate 12 placed on the spin chuck 6 to the second shielding part 3, but in this embodiment, the dicing tape 13 and the dicing frame 14 are attached. Since the combined substrate 12 is used as the object to be processed, the distance A can be the distance from the outermost dicing frame 14 to the second shielding unit 3. The distance B is intended to be the distance from the upper surface of the substrate 12 to the second shielding part 3, but in the present embodiment, the substrate 12 to which the dicing tape 13 and the dicing frame 14 are bonded is used as the object to be processed. Therefore, the distance B can be a distance from the outermost dicing frame to the second shielding part 3.

(Lower exhaust 4)
The lower exhaust port 4 is located below the spin chuck 6, that is, below the substrate 12, and exhausts gas from below the substrate 12. Of the gas flowing on the substrate 12, the gas whose direction of flow is changed so as to flow downward of the substrate 12 by the second shield 3 is exhausted from the lower exhaust port 4. As the gas flows, the processing liquid mist on the substrate 12 is discharged from the lower exhaust port 4. Thus, by providing an exhaust port also below the substrate 12, diffusion of the processing liquid mist can be prevented more reliably. In order to efficiently guide the gas flowing below the substrate 12 to the lower exhaust port 4, the lower exhaust port 4 may be provided at an end of an exhaust duct provided below the substrate 12. A plurality of lower exhaust ports 4 may be provided. In this case, it is preferable that the lower exhaust ports 4 are provided at equal intervals on a concentric circle of the substrate 12.

(Airflow change part 5)
The air flow changing unit 5 is located below the spin chuck 6, that is, below the substrate 12, and changes the gas flow direction so that the gas flowing toward the lower side of the substrate 12 flows into the lower exhaust port 4. Is provided. As shown in FIG. 1, the center of the airflow changing unit 5 may be the same as the center of the spin chuck 6, but the diameter is larger than the diameter of the spin chuck 6 and protrudes outside the outer periphery of the spin chuck 6. Is provided. The airflow changing unit 5 is a plate-like body, and is curved downward from the center to the outer periphery. In other words, the airflow changing unit 5 is curved toward the inlet of the exhaust duct connected to the lower exhaust port 4. Thereby, as shown by an arrow in FIG. 2, the gas flowing toward the lower side of the substrate 12 is changed by the air flow changing unit 5 in the direction of the exhaust duct in which the flow is connected to the lower exhaust port 4. As a result, the gas is efficiently exhausted from the lower exhaust port 4 through the exhaust duct, and the processing liquid mist is discharged accordingly.

<Embodiment 2>
Next, another embodiment according to the present invention will be described below with reference to FIGS. FIG. 4 is a schematic cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention, and FIG. 5 is a bottom view showing the configuration of the main part of the substrate processing apparatus shown in FIG. (B) is the AA arrow directional cross-sectional view of (a). In addition, about the member which has the same function as the member shown in Embodiment 1, the same code | symbol is attached and the description is abbreviate | omitted.

  When the processing liquid mist adheres to the first shielding part 2 and the second shielding part 3 in the substrate processing apparatus 10, the attached processing liquid is separated from the upper exhaust port 1 by an air flow (wind pressure) generated by rotation of the spin chuck 6 and the like. There is a risk of blowing up in the opposite direction, that is, in the direction of the substrate 12. In this case, the processing liquid may be scattered from the end of the first shielding unit 2 or the second shielding unit 3 on the substrate 12 side, and may adhere to the substrate 12 to cause a bad effect such as a watermark.

  Therefore, as shown in FIG. 4, the substrate processing apparatus 10 according to the present embodiment further includes a first collar part 22 and a second collar part 23. The first brim part 22 and the second brim part 23 are surface-treated (coated) with, for example, a fluororesin so that the treatment liquid mist does not easily adhere.

  That is, at the end of the first shielding part 2 on the substrate 12 side, the processing liquid mist adhering to the first shielding part 2 is separated from the upper exhaust port 1 by an air flow (wind pressure) generated by the rotation of the spin chuck 6 and the like. A first brim portion 22 that prevents the air from blowing up in the reverse direction and scattering in the direction of the substrate 12 is provided. The first flange 22 is provided on the end of the first shielding part 2 on the substrate 12 side in a circumferential shape. Thereby, even if the processing liquid mist adheres to the first shielding part 2, the attached processing liquid moves to the lower end part of the first flange 22, and the upper exhaust port 1 is caused by the flow of gas toward the upper exhaust port 1. Discharged from. Therefore, it is possible to further prevent the treatment liquid mist from adhering to the substrate 12. Further, it is possible to further prevent the processing liquid mist from being scattered outside the substrate processing apparatus 10. The length of the first flange portion 22 in the vertical direction may be a length that does not hinder the exhaust through the upper exhaust port 1.

  Further, the processing liquid mist adhering to the second shielding part 3 blows up to the second shielding part 3 in the direction opposite to the upper exhaust port 1 due to the airflow (wind pressure) generated by the rotation of the spin chuck 6 and the like. The 2nd collar part 23 which prevents scattering in the direction of 12 is hung down. The second flange 23 is provided in a substantially circumferential shape at the end of the second shielding part 3 on the upper exhaust port 1 side. Thereby, even if the processing liquid mist adheres to the second shielding part 3, the attached processing liquid moves to the lower end part 23 a side of the second flange part 23, and the lower exhaust is caused by the gas flow toward the lower exhaust port 4. It is discharged from the mouth 4. Therefore, it is possible to further prevent the treatment liquid mist from adhering to the substrate 12. The length of the second flange 23 in the vertical direction may be a length that does not hinder the exhaust through the lower exhaust port 4.

  More specifically, as shown in FIG. 5A, the second flange 23 is provided in a substantially circumferential shape at the end of the second shielding part 3 on the upper exhaust port 1 side, and a notch 24 is provided. That is, at least one notch 24 for draining the processing liquid mist adhering to the second shielding part 3 is formed in the second flange 23 (FIG. 5A shows four notches 24). Is shown). Therefore, the 2nd collar part 23 is divided | segmented into plurality when the two or more notch parts 24 are formed (it is divided | segmented into the same number as the number of the notch parts 24). As shown in FIGS. 5A and 5B, in the portion where the notch portion 24 is formed, the second flange portion 23 spirals so that the front and rear divided portions overlap in the radial direction of the substrate 12. The end of the rotation direction (counterclockwise in FIG. 5 (a)) of the spin chuck 6 and the like (the side where the lower end 23a is formed) is on the outer side (lower exhaust port 4 side). positioned. As a result, even if the processing liquid mist adheres to the second shielding part 3, the attached processing liquid moves to the lower end part 23 a side of the second flange part 23 due to the airflow (wind pressure) generated by the rotation of the spin chuck 6 or the like. The gas is discharged from the lower exhaust port 4 by the gas flow toward the lower exhaust port 4. Therefore, it is possible to further prevent the treatment liquid mist from adhering to the substrate 12. The position where the second flange 23 is provided is not limited to the end of the second shielding part 3 on the upper exhaust port 1 side as long as it does not hinder the exhaust through the lower exhaust port 4. In addition, the number of notches 24, the width (the width in the radial direction of the substrate 12) and the length (the length in the rotational direction of the spin chuck 6 and the like) are effective in preventing the processing liquid mist from scattering by the second flange 23. The number and the width and the length are not limited, and can be appropriately set according to the size and the number of rotations of the spin chuck 6 and the like, the composition of the treatment liquid, and the like.

  The length of the second flange 23 in the vertical direction may be a length that does not hinder the exhaust through the lower exhaust port 4. However, it is preferable that at least a part of the second flange portion 23, specifically, the lower end portion 23a is located below the substrate 12, as shown in FIG. Thereby, it is possible to further prevent the treatment liquid mist from adhering to the substrate 12.

〔Example〕
Using the substrate processing apparatus 10 detailed in the first embodiment, the mist scattering prevention effect was examined. As a comparative example, a conventional substrate having an exhaust port only at the bottom of the substrate, the distance from the side wall of the cup accommodating the substrate to the outer periphery of the substrate is about 40 mm, and the distance from the side wall to the upper surface of the substrate is about 15 mm A processing device was used. As an evaluation condition, in each substrate processing apparatus, a substrate having a diameter of 300 mm was processed at a substrate rotation speed of 1200 rpm using six spray nozzles. The thinner flow rate of each nozzle was 15 ml / min, and the air flow rate was 10 L / min.

  The presence or absence of mist-like droplets outside the cup was confirmed by a micrograph. As a result, as shown in FIG. 3A, in the conventional substrate processing apparatus, mist-like liquid droplets were seen outside the cup. However, as shown in FIG. In, no mist-like droplets were observed outside the cup.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The substrate processing apparatus according to the present invention can be used for processing of substrates used in various fields.

DESCRIPTION OF SYMBOLS 1 Upper exhaust port 2 1st shielding part 3 2nd shielding part 4 Lower exhaust port 5 Airflow change part 6 Spin chuck 10 Substrate processing apparatus 11 Nozzle 12 Substrate 13 Dicing tape 14 Dicing frame 22 1st collar part 23 2nd collar part 23a Lower end 24 Notch

Claims (9)

A substrate processing apparatus for processing a substrate with a mist-like liquid sprayed from a nozzle,
An upper exhaust port located above the substrate and exhausting the gas flowing on the substrate from above the outer periphery of the substrate;
A first shielding part that is provided so as to extend from the upper exhaust port in the direction of the substrate, and that changes a flow direction of the gas so that a gas flowing on the substrate flows into the upper exhaust port;
A second shielding part that is located between the upper surface of the substrate and the upper exhaust port, and changes a flow direction of the gas so that a gas flowing upward of the substrate flows downward of the substrate; With
At least a part of the first shielding part is provided horizontally with respect to the substrate ,
The second shield portion is provided with a second collar portion that prevents the liquid adhering to the second shield portion from scattering in the direction of the substrate,
The substrate processing apparatus , wherein at least one notch for draining the liquid adhering to the second shielding part is formed in the second collar part . A substrate processing apparatus for processing a substrate with a mist-like liquid sprayed from a nozzle,
An upper exhaust port located above the substrate and exhausting the gas flowing on the substrate from above the outer periphery of the substrate;
A first shielding part that is provided so as to extend from the upper exhaust port in the direction of the substrate, and that changes a flow direction of the gas so that a gas flowing on the substrate flows into the upper exhaust port;
A second shielding part that is located between the upper surface of the substrate and the upper exhaust port, and changes a flow direction of the gas so that a gas flowing upward of the substrate flows downward of the substrate; With
The first shielding portion is provided in a staircase shape from the upper wall that continues to the upper exhaust port, so that the distance from the substrate is further away from the upper wall ,
The second shield portion is provided with a second collar portion that prevents the liquid adhering to the second shield portion from scattering in the direction of the substrate,
The substrate processing apparatus , wherein at least one notch for draining the liquid adhering to the second shielding part is formed in the second collar part . The distance between the second shielding part and the outer periphery of the substrate is 3 to 20 mm,
The substrate processing apparatus according to claim 1 , wherein a distance between the second shielding unit and the upper surface of the substrate is 10 to 50 mm. The substrate processing apparatus according to claim 1, wherein a lower end of at least a part of the second flange portion is located below the substrate. Wherein the first shielding part, any of claims 1 to 4, wherein the liquid adhering to the first shielding part, characterized in that the first flange portion is perpendicularly provided to prevent splashing toward the substrate The substrate processing apparatus according to claim 1. A lower exhaust port located below the substrate;
An airflow changing unit that changes the flow direction of the gas so that the gas flowing downward of the substrate flows into the lower exhaust port;
The substrate processing apparatus according to claim 1 , further comprising: The substrate processing apparatus according to claim 1 , comprising two upper exhaust ports, and the upper exhaust ports are disposed at substantially diagonal positions with the substrate interposed therebetween. The substrate processing apparatus according to claim 1 , further comprising suction means for sucking a gas on the substrate through the upper exhaust port. The substrate processing apparatus according to claim 1 , wherein the upper exhaust port discharges a mist-like liquid together with the exhaust of the gas.