TWI712095B - Substrate bevel and back protection device - Google Patents

Abstract

The invention discloses a protection device for the oblique edge and back surface of a substrate. The device includes a vacuum chuck, a protection device, an air supply device, a rotary actuator and a vertical actuator. The vacuum chuck carries and fixes the substrate. The protection device includes a base and a supporting part, the supporting part is close to the substrate and a gap is formed between the supporting part and the substrate. The supporting part is provided with a plurality of gas inlets for supplying gas into the gap and a plurality of gas outlets for discharging the gas in the gap. The base is provided with multiple gas channels, and each gas channel is connected with a gas inlet. The gas supply device supplies gas to the gas channel of the protection device. The multiple gas inlets supply air into the gap so that the air pressure in the gap is greater than the atmospheric pressure, and the gas in the gap acts as a gas barrier layer to protect the hypotenuse and the back surface of the substrate. The rotary actuator drives the vacuum chuck and the protection device to rotate. The vertical actuator drives the vacuum chuck to move vertically.

Description

Substrate bevel and back protection device

The present invention relates to a substrate processing device, in particular to a device that uses a gas barrier layer to protect the bevel and back of the substrate to prevent the bevel and back of the substrate from being damaged in a wet process. The wet process includes cleaning, etching, and development. , Photoresist coating or removal.

During the manufacturing process of semiconductor devices, the hypotenuse and backside of the substrate need to be protected from chemical damage. In some applications, the bevel and back of the substrate are very sensitive to chemicals. When processing the front of the substrate, such as cleaning, etching, development, and photoresist coating or removal, one of the challenges is to protect the substrate. The sides and back are not damaged.

In one case, a substrate, such as a silicon wafer, is pasted on a substrate carrier made of semiconductor substrate, glass or sapphire. After a series of processes, the substrate will be separated from the substrate carrier. In a specific wet process, chemicals are used to treat the surface of the substrate. Since there is no effective device or method to protect the bevel and back of the substrate carrier, the bevel and back of the substrate carrier will be exposed to chemicals during the chemical treatment of the substrate surface. Damage. However, due to the subsequent process or the need for reuse of the substrate carrier, the substrate carrier should be protected to avoid damage.

Therefore, in the process of processing the front surface of the substrate, a device for protecting the oblique side and the back surface of the substrate is required.

The present invention provides a substrate bevel and back protection device, which includes a vacuum chuck, a protection device, an air supply device, a rotary actuator and a vertical actuator. The vacuum chuck carries and fixes the substrate. The protection device includes a base and a supporting part, the supporting part is close to the substrate and a gap is formed between the supporting part and the substrate. The supporting part is provided with a plurality of gas inlets for supplying gas into the gap and a plurality of gas outlets for discharging the gas in the gap. The base is provided with multiple gas channels, and each gas channel is connected with a gas inlet. The gas supply device supplies gas to the gas channel of the protection device. The multiple gas inlets supply air into the gap so that the air pressure in the gap is greater than the atmospheric pressure, and the gas in the gap acts as a gas barrier layer to protect the hypotenuse and the back surface of the substrate. The rotary actuator drives the vacuum chuck and the protection device to rotate. The vertical actuator drives the vacuum chuck to move vertically.

In the present invention, a protective device is used to form a gas barrier layer to protect the oblique side and back surface of the substrate, and when the substrate is processed, the oblique side and back surface of the substrate are prevented from being damaged.

101‧‧‧Substrate

102‧‧‧Substrate carrier

103‧‧‧Vacuum Chuck

104‧‧‧Support

105‧‧‧Gap

106‧‧‧Rotating axis

107‧‧‧Gas inlet

108‧‧‧Gas outlet

110‧‧‧Base

111‧‧‧Gas channel

112‧‧‧Nozzle

113‧‧‧Vertical actuator

114‧‧‧Air supply device

115‧‧‧Rotary Actuator

115a‧‧‧Gap

115b‧‧‧Another gap

116‧‧‧Vacuum channel

118‧‧‧Protection Cover

127‧‧‧Voltage Regulator

128‧‧‧Gas tube

129‧‧‧Mass flow controller

131‧‧‧Protrusions

132‧‧‧Slot

201‧‧‧Substrate

202‧‧‧Substrate carrier

204‧‧‧Support

205‧‧‧Gap

234‧‧‧Pointed protrusions

235‧‧‧Flat protrusions

301‧‧‧Substrate

302‧‧‧Substrate carrier

303‧‧‧Vacuum Chuck

304‧‧‧Support

305‧‧‧Gap

306‧‧‧Rotating axis

307‧‧‧Gas inlet

308‧‧‧Gas outlet

310‧‧‧Base

311‧‧‧Gas Channel

312‧‧‧Nozzle

313‧‧‧Vertical actuator

314‧‧‧Air supply device

315‧‧‧Rotary Actuator

315a‧‧‧Gap

315b‧‧‧Another gap

316‧‧‧Vacuum channel

318‧‧‧Upper protective cover

319‧‧‧ Lower protective cover

320a‧‧‧Robot

320b‧‧‧Robot

327‧‧‧Voltage Regulator

328‧‧‧Gas pipe

329‧‧‧Mass Flow Controller

331‧‧‧Protrusions

332‧‧‧Slot

Those skilled in the art can clearly understand the content of the present invention by reading the description of the specific embodiments and referring to the accompanying drawings. The accompanying drawings include: Figures 1A and 1B are cross-sectional views of a specific embodiment of the substrate bevel and back protection device of the present invention; Figure 1C is a cross-sectional view of Figure 1A along line AA; Figure 1D is a cross-sectional view of Figure 1A along line BB; Figure 2A is A top view of a specific embodiment of the substrate bevel and back protection device of the present invention; FIG. 2B is a top view of another specific embodiment of the substrate bevel and back protection device of the present invention; FIGS. 3A-3C are the substrate bevel and back of the present invention A cross-sectional view of another specific embodiment of the protection device; FIG. 3D is a cross-sectional view of FIG. 3A along line AA.

Referring to FIGS. 1A-1D, a specific embodiment of the substrate bevel and back protection device of the present invention is illustrated. The device includes a vacuum chuck 103 that uses vacuum suction to hold and fix the back of the substrate, a protection device that surrounds the vacuum chuck 103 to protect the oblique edge and back of the substrate, and supplies air to the protection device to form a gas barrier to protect the oblique edge and the back of the substrate. The air supply device 114 on the back side is connected to the vacuum chuck 103 and is used to drive the vacuum chuck 103 and the protection device to rotate, and the rotary actuator 115 is used to drive the vacuum chuck 103 to move vertically.

The vacuum chuck 103 is connected to the rotary actuator 115 through the rotary shaft 106. One end of the rotating shaft 106 is connected to the vacuum chuck 103, and the other end of the rotating shaft 106 is connected to the rotating actuator 115. The vacuum channel 116 passes through the rotating The center of the actuator 115 and the center of the rotating shaft 106 extend to the vacuum chuck 103 to provide vacuum suction to carry and fix the substrate. The vacuum channel 116 is provided with a pressure regulator 127 for controlling the pressure in the vacuum channel 116.

The protection device includes a base 110 and a support 104 detachably installed on the base 110. The supporting part 104 is provided with a plurality of gas inlets 107 and a plurality of gas outlets 108. The plurality of gas inlets 107 and the plurality of gas outlets 108 are arranged circularly on the supporting portion 104 respectively. Each gas inlet 107 is inclined and forms an angle with the bottom surface of the supporting part 104 to guide the gas to diffuse outward. The base 110 is provided with a plurality of gas passages 111, and each gas passage 111 is connected to a gas inlet 107 to supply gas to the gas inlet 107. As shown in FIG. 1C, the outer wall of the rotating shaft 106 is provided with at least two protrusions 131, the protrusions 131 extend along the axial direction of the rotating shaft 106, and correspondingly, the inner wall of the base 110 is provided with at least two protrusions. The slot 132 of the thing 131. When the rotary actuator 115 drives the vacuum chuck 103 to rotate through the rotation shaft 106, the base 110 follows the vacuum chuck 103 and rotates at the same speed. Therefore, during the process, the vacuum chuck 103, the substrate and the base 110 and the support 104 of the protection device rotate together at a set speed.

The air supply device 114 is arranged around the outer wall of the protection device base 110. The air supply device 114 is fixed. When the base 110 rotates, the air supply device 114 does not rotate together with the base 110. In a specific embodiment, the gas supply device 114 may be fixed at the bottom of the process chamber. The gas pipe 128 of the gas supply device 114 supplies gas to the gas channel 111 of the protection device. The gas pipe 128 is provided with a mass flow controller 129 for controlling the gas flow rate, and the gas pipe 128 is also provided with a gas pressure regulator for controlling the gas pressure.

The vertical actuator 113 drives the rotary actuator 115 to move up and down, thereby driving the vacuum chuck 103 to move vertically.

As shown in Figures 1A and 1B, when using this device to process substrates, especially when processing the substrate 101 attached to the substrate carrier 102 made of semiconductor substrate, glass or sapphire, the vacuum chuck 103 is sucked by vacuum suction On the back of the substrate, in this specific embodiment, the substrate carrier 102 is sucked by the vacuum chuck 103. The vertical actuator 113 drives the rotary actuator 115 to move down to the bottom position of the vertical actuator 113. The rotary actuator 115 drives the vacuum chuck 103, the substrate carrier 102 and the protection device to rotate at a speed of 10-3000 RPM during the process. The supporting part 104 of the protection device is very close to the substrate carrier 102 and a gap 105 is formed between the supporting part 104 and the substrate carrier 102. A plurality of gas inlets 107 supply protective gas, such as nitrogen or compressed gas, into the gap 105, and a plurality of gas outlets 108 The shielding gas in the gap 105 is released to prevent the shielding gas from rushing out of the gap between the oblique side of the substrate carrier 102 and the supporting portion 104 to reach above the gap. In this case, a positive pressure is formed in the gap 105, and during the process , The protective gas in the gap 105 acts as a gas barrier layer to protect the oblique side and the back surface of the substrate carrier 102. The nozzle 112 sprays the chemical liquid to the front surface of the substrate 101. The gas barrier layer in the gap 105 prevents the chemical liquid from flowing to the oblique side and back of the substrate carrier 102. At the same time, the chemical liquid passes through the top surface of the support portion 104 and flows outward toward the periphery of the support portion 104. The protective cover 118 shields the chemical liquid from splashing. In a specific embodiment, the wall of the process chamber can be used as a protective cover 118. The gap 105 maintains a constant air pressure and is greater than the atmospheric pressure, and is controlled by the gas flow rate and the air pressure of the gas channel 111.

As shown in FIG. 1B, the vertical actuator 113 drives the rotary actuator 115 to move upward to the top position of the vertical actuator 113, thereby driving the vacuum chuck 103 to move upward, so that the vacuum chuck 103 and the supporting portion 104 are maintained between The vertical distance is set to load or unload the substrate, here is the substrate carrier 102. In order to ensure that the vacuum chuck 103 moves up and down smoothly, a gap 115a is maintained between the rotating shaft 106 and the base 110, and another gap 115b is maintained between the vacuum chuck 103 and the supporting portion 104. The gap 115b should be small enough so that the air pressure in the gap 105 is greater than the atmospheric pressure during the protection of the oblique side and back of the substrate.

2A-2B, in order to maintain the uniformity of the gap 205 around the periphery of the substrate carrier 202, pointed protrusions 234 or flat protrusions 235 are provided on the supporting portion 204 to match the gap of the substrate carrier 202. Correspondingly, the substrate 201 pasted on the substrate carrier 202 is provided with the same notches. The support portion 204 with protrusions of different shapes can be easily replaced to match with different substrates. In another specific embodiment, in order to keep the top surfaces of the supporting portion 204 and the substrate carrier 202 at the same horizontal plane, the supporting portion 204 with different thicknesses can be easily replaced to match different substrate carriers.

Referring to FIGS. 3A-3D, another specific embodiment of the substrate bevel and back protection device of the present invention is illustrated. The device includes a vacuum chuck 303 that uses vacuum suction to hold and fix the back of the substrate, a protection device that surrounds the vacuum chuck 303 to protect the oblique side and back of the substrate, and supplies air to the protection device to form a gas barrier to protect the oblique side and the back of the substrate. The air supply device 314 on the back is connected to the vacuum chuck 303 and used to drive the vacuum chuck 303 and protect The rotary actuator 315 used to rotate the device, the vertical actuator 313 used to drive the vacuum chuck 303 to move vertically, the upper shield 318 and the lower shield 319 used to block different types of process liquids, to avoid processing in different process steps Liquid splash.

The vacuum chuck 303 is connected to the rotary actuator 315 through the rotary shaft 306. One end of the rotating shaft 306 is connected to the vacuum chuck 303, and the other end of the rotating shaft 306 is connected to the rotating actuator 315. The vacuum channel 316 passes through the center of the rotary actuator 315 and the center of the rotary shaft 306 and extends to the vacuum chuck 303 to provide vacuum suction to support and fix the substrate. The vacuum channel 316 is provided with a pressure regulator 327 for controlling the pressure in the vacuum channel 316.

The protection device includes a base 310 and a support 304 detachably installed on the base 310. The supporting portion 304 is provided with a plurality of gas inlets 307 and a plurality of gas outlets 308. The plurality of gas inlets 307 and the plurality of gas outlets 308 are arranged circularly on the supporting portion 304 respectively. Each gas inlet 307 is inclined and forms an angle with the bottom surface of the supporting portion 304 to guide the gas to diffuse outward. The base 310 is provided with a plurality of gas passages 311, and each gas passage 311 is connected with a gas inlet 307 to supply gas to the gas inlet 307. As shown in FIG. 3D, the outer wall of the rotating shaft 306 is provided with at least two protrusions 331, the at least two protrusions 331 extending along the axial direction of the rotating shaft 306, correspondingly, the inner wall of the base 310 is provided with at least two Slots 332 for receiving protrusions 331. When the rotary actuator 315 drives the vacuum chuck 303 to rotate through the rotation shaft 306, the base 310 follows the vacuum chuck 303 and rotates at the same speed. Therefore, during the process, the vacuum chuck 303, the base 310 of the substrate and the protection device, and the support 304 rotate together at a set speed.

The air supply device 314 is arranged around the outer wall of the protection device base 310. The air supply device 314 is fixed. When the base 310 rotates, the air supply device 314 does not rotate together with the base 310. In a specific embodiment, the gas supply device 314 may be fixed at the bottom of the process chamber. The gas pipe 328 of the gas supply device 314 supplies gas to the gas channel 311 of the protection device. The gas pipe 328 is provided with a mass flow controller 329 for controlling the gas flow rate, and the gas pipe 328 is also provided with a gas pressure regulator for controlling the gas pressure.

The vertical actuator 313 drives the rotary actuator 315 to move up and down, thereby driving the vacuum chuck 303 to move vertically.

As shown in Figures 3A to 3C, when using this device to process substrates, especially when processing substrates 301 attached to a substrate carrier 302 made of semiconductor substrate, glass or sapphire, the vacuum chuck 303 sucks the substrate through vacuum suction In this specific embodiment, the vacuum chuck 303 sucks the substrate carrier 302. The vertical actuator 313 drives the rotary actuator 315 to move down to the bottom position of the vertical actuator 313, and the rotary actuator 315 drives the vacuum chuck 303, the substrate carrier 302, and the protection device at 10-3000RPM during the process. Speed rotation. The supporting part 304 of the protection device is very close to the substrate carrier 302 and a gap 305 is formed between the supporting part 304 and the substrate carrier 302. A plurality of gas inlets 307 supply protective gas, such as nitrogen or compressed gas, into the gap 305, and a plurality of gas outlets 308 The protective gas in the gap 305 is released to prevent the protective gas from rushing out of the gap between the hypotenuse of the substrate carrier 302 and the supporting portion 304 to reach above the gap. In this case, a positive pressure is formed in the gap 305, and during the process , The protective gas in the gap 305 serves as a gas barrier layer to protect the hypotenuse and the back surface of the substrate carrier 302. The nozzle 312 sprays the chemical liquid to the front surface of the substrate 301. The gas barrier layer in the gap 305 prevents the chemical liquid from flowing to the oblique side and the back surface of the substrate carrier 302. At the same time, the chemical liquid flows out through the top surface of the support portion 304 and flows down the protective cover 319. The protective cover 319 blocks the chemical liquid from splashing. The gap 305 maintains a constant pressure, and the pressure is greater than the atmospheric pressure, and is controlled by the gas flow rate and the pressure of the gas channel 311.

As shown in FIG. 3B, the vertical actuator 313 drives the rotary actuator 315 to move upward to the middle position of the vertical actuator 313, and the vacuum chuck 303 moves upward along with the rotary actuator 315. Then the nozzle 312 sprays the cleaning liquid to the front surface of the substrate 301. As the gap between the support portion 304 and the substrate carrier 302 becomes larger, it is impossible to form an air curtain for protecting the oblique side and the back of the substrate carrier 302. The cleaning liquid flows back to the substrate carrier 302. Bevel and back. This cleaning step is used to clean the oblique edges and back of the substrate carrier 302 to ensure that there is no chemical residue. The cleaning liquid is blocked by the upper protective cover 318 to prevent splashing. The protective gas is still continuously supplied to the multiple gas inlets 307 to prevent splashed cleaning liquid from collecting on the supporting portion 304 or flowing into the gas channel 311.

As shown in FIG. 3C, the vertical actuator 313 drives the rotary actuator 315 to move up to the top position of the vertical actuator 313, thereby driving the vacuum chuck 303 to move up, so that the vacuum chuck 303 and the supporting portion 304 are maintained between The vertical distance is set for loading or unloading the substrate, here is the substrate carrier 302. In order to ensure that the vacuum chuck 303 moves up and down smoothly, a gap 315a is maintained between the rotating shaft 306 and the base 310, and another gap 315b is maintained between the vacuum chuck 303 and the support portion 304. The gap 315b should be small enough to make the air pressure in the gap 305 large during the protection process of the oblique side and back of the substrate At atmospheric pressure. The robots 320a and 320b are used to load or unload the substrate carrier 302 from the back of the substrate carrier 302.

The invention uses a protective device to form a gas barrier layer to protect the oblique side and the back surface of the substrate, and prevents the oblique side and back surface of the substrate from being damaged during the process when the substrate is processed.

The above are only the preferred embodiments of the present invention, and do not limit the present invention in any form. Anyone familiar with the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make many possible changes and modifications to the technical solution of the present invention, or modify it into equivalent embodiments with equivalent changes. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solutions of the present invention still fall within the protection scope of the technical solutions of the present invention.

101‧‧‧Substrate

102‧‧‧Substrate carrier

103‧‧‧Vacuum Chuck

104‧‧‧Support

105‧‧‧Gap

106‧‧‧Rotating axis

107‧‧‧Gas inlet

108‧‧‧Gas outlet

110‧‧‧Base

111‧‧‧Gas channel

112‧‧‧Nozzle

113‧‧‧Vertical actuator

114‧‧‧Air supply device

115‧‧‧Rotary Actuator

115a‧‧‧Gap

115b‧‧‧Another gap

116‧‧‧Vacuum channel

118‧‧‧Protection Cover

127‧‧‧Voltage Regulator

128‧‧‧Gas tube

129‧‧‧Mass flow controller

Claims (21)

A substrate bevel and back protection device, which is characterized in that it comprises: a vacuum chuck which carries and fixes the substrate; the protection device comprises a base and a supporting part, the supporting part is close to the substrate and a gap is formed between the supporting part and the substrate. Multiple gas inlets for supplying gas into the gap and multiple gas outlets for discharging the gas in the gap. The multiple gas inlets supply gas into the gap so that the pressure in the gap is greater than atmospheric pressure, and the gas in the gap acts as a gas barrier layer for protection The bevel and back of the substrate are provided with multiple gas channels at the base, and each gas channel is connected to a gas inlet; the gas supply device supplies gas to the gas channel of the protection device; the rotary actuator drives the vacuum chuck and protects The device rotates; and the vertical actuator drives the vacuum chuck to move vertically. The device according to claim 1, wherein the plurality of gas inlets and the plurality of gas outlets are respectively arranged in a circular shape on the supporting part. The device according to claim 1, characterized in that each gas inlet is inclined and forms an angle with the bottom surface of the supporting part to guide the gas to diffuse outward. The device according to claim 1, wherein the supporting part is detachably mounted on the base. The device according to claim 1, wherein the vacuum chuck is connected to the rotary actuator through a rotary shaft. The device according to claim 5, wherein the outer wall of the rotating shaft is provided with at least two protrusions extending along the axial direction of the rotating shaft, and the inner wall of the base is provided with at least two inserts for accommodating the protrusions. Slot, when the rotary actuator drives the vacuum chuck to rotate through the rotating shaft, the base follows the vacuum chuck to rotate at the same speed as the vacuum chuck. The device according to claim 5, further comprising a vacuum channel passing through the center of the rotary actuator and the center of the rotation axis and extending to the vacuum chuck, and the vacuum channel provides vacuum suction to the vacuum chuck to support and fix the substrate . The device according to claim 7, characterized in that it further comprises a pressure regulator arranged on the vacuum passage for controlling the pressure in the vacuum passage. The device according to claim 1, wherein the air supply device is arranged around the outer wall of the base of the protection device, the air supply device is fixed, and when the base rotates, the air supply device does not rotate with the base. The device according to claim 1, wherein the gas supply device includes a gas pipe for supplying gas to the gas passage of the protection device. The device according to claim 10, further comprising a mass flow controller arranged on the gas pipe for controlling the gas flow rate. The device according to claim 10, further comprising a gas pressure regulator arranged on the gas pipe to control the gas pressure. The device according to claim 1, characterized in that a constant gas pressure is maintained in the gap, and the gas pressure in the gap is controlled by the gas flow rate and the gas pressure in the gas channel. The device according to claim 1, characterized in that the vertical actuator drives the rotary actuator to move up and down, thereby driving the vacuum chuck to move vertically. The device according to claim 14, characterized in that the vertical actuator drives the rotary actuator to move down to the bottom position of the vertical actuator, sprays the chemical liquid on the substrate, and the protective cover shields the chemical liquid to avoid the chemical liquid. Splash. The device according to claim 14, characterized in that the vertical actuator drives the rotary actuator to move upward to the middle position of the vertical actuator, and sprays cleaning liquid on the substrate to clean the oblique side and back of the substrate, and the cleaning liquid is replaced by another A protective cover blocks to prevent splashing. The device according to claim 16, characterized in that when cleaning liquid is sprayed on the substrate to clean the oblique side and back of the substrate, gas is still supplied to the multiple gas inlets to prevent the cleaning liquid from accumulating on the support or flowing into the gas channel . The device according to claim 14, characterized in that the vertical actuator drives the rotary actuator to move up to the top position of the vertical actuator to drive the vacuum chuck to move upwards, so that the vacuum chuck and the supporting part Maintain the set vertical distance to load or unload substrates. The device according to claim 1, wherein the support portion of the protection device is provided with pointed protrusions or flat protrusions to match the notches of the substrate. The device according to claim 1, characterized in that the size of the gap surrounding the periphery of the substrate remains unchanged. The device according to claim 1, wherein the top surface of the support portion of the protection device and the substrate are on the same level.

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