JP6074357B2 - 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 - Google Patents

接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 Download PDF

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Publication number
JP6074357B2
JP6074357B2 JP2013265652A JP2013265652A JP6074357B2 JP 6074357 B2 JP6074357 B2 JP 6074357B2 JP 2013265652 A JP2013265652 A JP 2013265652A JP 2013265652 A JP2013265652 A JP 2013265652A JP 6074357 B2 JP6074357 B2 JP 6074357B2
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adhesive film
semiconductor element
film
adherend
semiconductor
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Japanese (ja)
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JP2015122422A5 (https=
JP2015122422A (ja
Inventor
雄一郎 宍戸
雄一郎 宍戸
三隅　貞仁
貞仁 三隅
謙司 大西
謙司 大西
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Nitto Denko Corp
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Nitto Denko Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013265652A 2013-12-24 2013-12-24 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 Active JP6074357B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013265652A JP6074357B2 (ja) 2013-12-24 2013-12-24 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013265652A JP6074357B2 (ja) 2013-12-24 2013-12-24 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

Publications (3)

Publication Number Publication Date
JP2015122422A JP2015122422A (ja) 2015-07-02
JP2015122422A5 JP2015122422A5 (https=) 2016-06-16
JP6074357B2 true JP6074357B2 (ja) 2017-02-01

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JP2013265652A Active JP6074357B2 (ja) 2013-12-24 2013-12-24 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018207920A1 (ja) * 2017-05-12 2018-11-15 日産化学株式会社 半導体装置密着層形成用エポキシ樹脂組成物
JP2020043258A (ja) * 2018-09-12 2020-03-19 キオクシア株式会社 半導体メモリおよびその製造方法
JP2022115581A (ja) * 2021-01-28 2022-08-09 昭和電工マテリアルズ株式会社 半導体装置及びその製造方法、並びに、熱硬化性樹脂組成物、接着フィルム及びダイシング・ダイボンディング一体型フィルム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327789A (ja) * 2004-05-12 2005-11-24 Sharp Corp ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法
JP2010118554A (ja) * 2008-11-13 2010-05-27 Nec Electronics Corp 半導体装置およびその製造方法
JP2011102383A (ja) * 2009-10-14 2011-05-26 Nitto Denko Corp 熱硬化型ダイボンドフィルム
CN102842541A (zh) * 2011-06-22 2012-12-26 日东电工株式会社 层叠膜及其使用
JP5930625B2 (ja) * 2011-08-03 2016-06-08 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
JP6094031B2 (ja) * 2012-01-05 2017-03-15 日立化成株式会社 接着剤組成物、接着シート及び半導体装置

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