JP6071800B2 - On-vehicle equipment - Google Patents

Description

  The present invention relates to on-vehicle equipment mounted on a vehicle, and is particularly suitable for application to on-vehicle equipment in a railway system.

  Conventionally, in a railway system composed of on-board equipment and ground equipment, the on-board equipment includes a signal amplification device and transmits a power wave for driving power (driving power wave) to a ground equipment without a power source. On the other hand, an information signal (output information wave) output from the ground device is received.

  The output information wave output from the ground device has a very small power compared to the driving power wave. Therefore, noise generated from the drive power wave transmission unit in the on-board device may leak into the output information wave reception unit, and it is necessary to minimize the noise leakage.

  In general, a signal amplifying apparatus employs a configuration (rack insertion type) in which various substrates are inserted into a rack in order to ensure the ease of replacement of the various substrates. Of the various substrates, the substrate that generates the driving power wave generates heat when the driving power wave becomes high power, and thus a heat sink is mounted as a countermeasure against heat generation.

  The area of the heat sink often occupies 80% or more with respect to the area of the substrate on which the heat sink is mounted. In the case of the rack insertion type, the rear side (substrate insertion destination) fixing portion has only a connector for insertion into the backboard. For this reason, the board on which the heat sink is mounted is increased in weight by the heat sink. In particular, if it continues to vibrate for a long time in the component surface-solder surface direction (perpendicular to the substrate surface), there is a risk of damage due to large stress. .

  Therefore, onboard equipment, if a heat sink is mounted as a countermeasure against heat generation, it may be damaged by vibration. On the other hand, it is necessary to minimize noise leakage as described above. And a technique for taking countermeasures for both noise and noise is desired.

  Here, as a conventional technique, for example, in Patent Documents 1 to 3, a control board is cooled by a heat sink, and both are supported by fastening means, and a metal portion of the heat sink is used to control noise generated from the control board. A configuration for connecting to the signal ground is disclosed.

Japanese Patent Laid-Open No. 11-346477 JP 2007-258385 A JP 2012-114186 A

  However, only the techniques of Patent Documents 1 to 3 cannot take measures against heat generation, vibration and noise in on-board equipment. Specifically, even if the techniques of Patent Documents 1 to 3 capable of suppressing heat generation and noise are simply used for on-board equipment, vibration cannot be suppressed.

  The present invention has been made in consideration of the above points, and proposes an on-vehicle device capable of suppressing heat generation, noise, and vibration.

  In order to solve such a problem, an on-board device in the present invention is an on-board device that transmits a driving power wave to a ground device, the on-board device includes a rack, and the rack includes a heat sink, a substrate, a connection body, and Anti-vibration components are installed, the heat sink is connected to the solder side of the board and electrically connected to the signal ground, and the board is connected to the heat sink and the component side is connected to the connection body. Connected, electrically connected to signal ground, the connection body is an insulator, one end is connected to the component side of the board, the other end is connected to the vibration countermeasure component, and the board and vibration countermeasure The components are physically connected to each other, and the vibration countermeasure component is connected to a connecting body, connected to a rack, and electrically connected to a frame ground.

  According to the present invention, heat generation, noise, and vibration can be suppressed.

It is a whole lineblock diagram of a railroad system in this embodiment. It is a top surface lineblock diagram of a signal amplification device. It is a connection relation figure of vibration countermeasure parts, a transmission board, and a heat sink. It is a top surface lineblock diagram of a heat sink.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows an overall configuration of a railway system 1 in the present embodiment. The railway system 1 includes an on-board device 10 disposed in the moving body M1 and a ground device 20 disposed in the track R1. The on-board device 10 is configured to include a signal amplifying device 100, and the signal amplifying device 100 amplifies a driving power wave P <b> 1 for driving the ground device 20. The on-board device 10 transmits the driving power wave P <b> 1 amplified by the signal amplification device 100 to the ground device 20.

  When the ground device 20 receives the driving power wave P <b> 1 from the on-board device 10, the ground device 20 generates an output information wave P <b> 2 and transmits the generated output information wave P <b> 2 to the on-board device 10. The output information wave P2 includes, for example, information indicating that the moving body M1 is approaching the stop signal or information indicating that the moving body M1 exceeds the speed limit.

  When the on-board device 10 receives the output information wave P2 from the ground device 20, the on-board device 10 executes, for example, a control for stopping the moving body M1 or a control for moving the mobile body M1 below the speed limit based on the received output information wave P2.

  Here, in general, a substrate (transmission substrate) that amplifies and transmits the driving power wave P1 in the signal amplifying device 100 generates heat due to a rise in temperature because the driving power wave P1 is high power. Therefore, a relatively large heat sink is mounted on the transmission board. At this time, if the transmission board whose weight is increased by the heat sink continues to be vibrated, a large stress is applied and the transmission board may be damaged.

  In the present embodiment, the vibration countermeasure component that suppresses the vibration of the transmission board is installed in the on-board device 10 (signal amplification device 100), thereby realizing the countermeasure against vibration while realizing the countermeasure against heat generation by the heat sink. To do.

  In addition, this embodiment relates to the installation of vibration countermeasure components, which are physically connected to the heat sink and the transmission board on which the heat sink is mounted, but are electrically connected to the frame ground. In other words, by installing the physical connection and the electrical connection differently, the signal ground and the frame ground are not connected to try to prevent noise from the frame ground from entering the signal ground. Is.

  FIG. 2 shows an upper surface configuration of the signal amplifying apparatus 100. The signal amplifying apparatus 100 is configured by inserting a transmission board 101 and various boards 109 for realizing the functions as the on-board equipment 10 into a metal rack 107.

  In the signal amplifying apparatus 100, the transmission board 101 is a multilayer printed board for amplifying the driving power wave P1 (FIG. 1). A metal heat sink 102 is connected to the transmission board 101 in order to suppress the temperature rise of the heat generating components mounted on the transmission board 101.

  The transmission substrate 101 and the heat sink 102 are connected by an insulating connector 103. The insulated connection body 103 is a member formed of an insulator inside and connected to the vibration countermeasure component 104 by a conductor.

  The purpose of connecting the transmission board 101 and the heat sink 102 by the insulating connecting body 103 is to allow components to be mounted on the component surface of the transmission board 101 (the surface opposite to the surface to which the heat sink 102 is connected). . Details of the structure of the insulating connection body 103 will be described later (FIG. 3).

  As described above, one end of the insulating connection body 103 is connected to the transmission board 101 and the heat sink 102, and the other end is connected to the conductive vibration countermeasure component 104. The purpose of mounting the vibration countermeasure component 104 is vibration countermeasure.

  The transmission board 101 and components mounted on the transmission board 101 have a resonance frequency of 150 Hz or less, and the signal amplification apparatus 100 that is mainly subjected to vibration of 150 Hz or less is subjected to vibration for a long time. 101 may be damaged. Accordingly, by mounting the vibration countermeasure component 104, the resonance frequency of the transmission board 101 is set to 150 Hz or more, and it is possible to withstand long-term vibration at a frequency assumed to be vibrated in the signal amplifying apparatus 100. .

  The vibration countermeasure component 104 is connected to the other end of the insulating connector 103, and is connected to the conductive front panel 105 via the conductive connection component 108. The vibration countermeasure component 104 has a shape that is wide on the front panel 105 side and narrows toward the rear side. The purpose of having this shape is to fix firmly by the connecting component 108 on the front panel 105 side, and there is no fixing point on the rear side, so there is no need to make it wide, and the weight is reduced.

  The front panel 105 is connected to the vibration countermeasure component 104 and is connected to the heat sink 102 via a plate member 106 that is an insulator.

  The purpose of connecting the front panel 105 and the heat sink 102 via the plate 106 which is an insulator is to electrically insulate the heat sink 102 and the plate 106 while physically connecting them.

  The front panel 105 is electrically connected to the frame of the rack 107 by inserting the transmission board 101 into the rack 107. The frame of the rack 107 is finally connected to the moving body M1 as a frame ground.

  It is assumed that various other devices besides the signal amplification device 100 are connected to the moving body M1, and noise generated from other various devices may circulate to the frame ground. In the present embodiment, since the heat sink 102 and the plate member 106 are not electrically connected to each other, it is possible to prevent the transmission substrate 101 connected to the signal ground from malfunctioning due to noise that wraps around from the frame ground. .

  FIG. 3 shows details of the connection relationship between the vibration countermeasure component 104, the transmission board 101, and the heat sink 102. The screwing part 201 is a through-hole-like screwing part made of metal, and is electrically connected to the signal ground 203 on the inner layer in the transmission board 101.

  The upper surface of the heat sink 102 is configured such that the metal surface exposed portion 204 is exposed. By connecting the transmission board 101 and the heat sink 102 using the insulating connector 103, the signal ground of the transmission board 101 and the heat sink 102 are electrically connected.

  By connecting the heat sink 102 to the signal ground, it is possible to efficiently transmit the heat generated at the signal ground portion of the transmission board 101 to the heat sink 102 to dissipate heat. Further, the heat sink 102 has an electromagnetic shielding effect, and it is possible to reduce noise output from the signal amplification device 100.

  Since the vibration countermeasure component 104 is connected to the front panel 105 and the connection component 108, the vibration countermeasure component 104 and the front panel 105 are electrically connected. Since the front panel 105 is connected to the frame ground, the potential levels of the vibration countermeasure component 104 and the front panel 105 are equal to the frame ground.

  Here, the potential of the vibration countermeasure component 104 is equal to the frame ground, and the potential of the heat sink 102 is equal to the signal ground. Therefore, if the heat sink 102 and the vibration countermeasure component 104 are electrically connected, noise may enter the signal amplifying device 100 from other devices connected to the frame ground as described above, and the signal amplifying device 100 may malfunction. There is sex.

  In order to prevent the noise from wrapping around, the body of the insulating connecting member 103 is made of an insulating material, and the insulating connecting member 103 and the vibration countermeasure component 104 are insulated from the heat sink 102 even if they are connected by the highly rigid connecting member 202. The connection body 103 is not electrically connected. Further, the use of the insulating connector 103 and the plate member 106 prevents the frame ground and the signal ground from being electrically connected.

  FIG. 4 shows the upper surface configuration of the heat sink 102. In addition, a cross-sectional configuration between A1 and A2 is also shown. It is assumed that the signal amplifying apparatus 100 in the present embodiment is realized by the transmission board 101 having an area of 100 mm × 160 mm. In order to realize the function of the signal amplifying device 100, since the mounting area of the component surface of the transmission substrate 101 is small, it is necessary to mount the component also on the solder surface of the transmission substrate 101. Therefore, the heat sink 102 in the present embodiment is configured not to have a connection portion with the transmission substrate 101 other than the metal surface exposed portion 204 having a height higher than the others.

  The solder surface component mounting portion 301 is more open than the other portions so that a hole is formed in the component surface of the transmission substrate 101 and the heat radiating part of the heat generating component can be in contact with the solder surface component mounting portion 301. This is the part that narrows the interval. The height is such that the heat generating component 1011 mounted on the solder surface side can be connected via a thermal interface SI formed of an insulator.

  By providing the solder surface component mounting portion 301, it is possible to mount the heat generating component 1011 on the solder surface of the transmission substrate 101 in the transmission substrate 101 having a limited area of 100 mm × 160 mm. The positions can be dispersed. Therefore, it is possible to effectively dissipate the heat generated by the heat generating component 1011 mounted on the transmission board 101 by the heat sink 102 and suppress the temperature increase of the signal amplifying device 100.

  As described above, in this embodiment, in order to suppress the temperature rise due to heat generation, the metal heat sink 102 having the effect of diffusing the heat of the components is installed. When the heat sink 102 is installed, heat generation can be suppressed, but the weight of the transmission board 101 increases, and the rear side that is not particularly fixed by the low-frequency vibration in which the on-board device 10 is susceptible to vibration is easily affected. Problem arises.

  Therefore, in this embodiment, in order to increase the fixing point on the rear side and simultaneously improve the rigidity of the entire transmission board 101, the front panel 105 and the connection component 108 are screwed together, and the transmission board 101 and the heat sink 102 Metal vibration countermeasure parts 104 that are screwed at multiple points are installed. Note that the screws to be used have a height that allows components to be mounted on the component surface of the transmission board 101.

  On the other hand, in order to reduce noise output, it is necessary to give an electromagnetic shielding effect to a metal object. Therefore, the vibration countermeasure component 104 and the heat sink 102 are made of metal as a conductor. The vibration countermeasure component 104 is grounded to the frame ground via the front panel 105 and the rack 107, and the heat sink 102 is grounded to the signal ground of the transmission board 101.

  The frame ground is connected to the ground of the moving body M1, but it is assumed that various other devices are grounded to the ground of the moving body M1, and noise is output from the various other devices to the ground. There is a possibility. When the front panel 105 and the heat sink 102 are connected, noise is transmitted to the circuit of the signal amplifying apparatus 100, and the circuit may malfunction.

  Therefore, in the present embodiment, the front panel 105 and the vibration countermeasure component 104 are connected to the signal ground of the transmission board 101 and the heat sink 102 via the insulating connection body 103.

  By employing the configuration as described above, heat generation, noise, and vibration can be suppressed in the on-board device 10.

DESCRIPTION OF SYMBOLS 101 Multilayer printed circuit board 102 Metal heat sink 103 The body is comprised with the insulator, and the connection part is the insulation connection body 104 comprised with the conductor. Conductive vibration countermeasure component 105 The conductive front panel 106 It is comprised with the insulator 107 A metal rack 108 connected to the frame ground A conductive connecting part 109 for connecting the vibration countermeasure part and the front panel 109 A substrate 201 for realizing various functions as an on-vehicle communication device 201 Metal through hole Screw connection portion 202 Metal connection body 203 for connecting the insulating connection body and the vibration countermeasure component Signal ground 204 in the inner layer in the transmission board Metal surface exposed portion 301 on the upper surface of the heat sink Solder surface component mounting location

Claims (4)

In on-board equipment that transmits driving power waves to ground equipment,
The on-board equipment includes a rack,
In the rack, a heat sink, a substrate, a connection body and vibration countermeasure parts are installed,
The heat sink is connected to the solder side of the substrate and electrically connected to a signal ground,
The board has the solder side connected to the heat sink, the component side connected to the connection body, and electrically connected to a signal ground,
The connection body is an insulator, and conductive connection parts are provided at both ends, one end is connected to the component surface side of the substrate, the other end is connected to the vibration countermeasure component, Physically connecting between the vibration countermeasure parts,
The on-vehicle device, wherein the vibration countermeasure component is connected to the other end of the connection body, and is connected to the rack and electrically connected to a frame ground. The vibration countermeasure component is:
In connection with the rack, one end is connected to the front panel side of the rack, the other end is connected to the rear side of the rack, and the one end is connected to the front panel by a plurality of connecting parts in the connection portion with the front panel side. The on-vehicle device according to claim 1, wherein a connection area between the one end and the front panel is larger than a connection area between the other end and the rear side. The rack is provided with a plate material,
The plate member is an insulator, and one is connected to the rack and the other is connected to the heat sink, so that the rack and the heat sink are physically connected without being electrically connected. And
The on-vehicle device according to claim 1, wherein the heat sink is supported by the plate member in the rack. The heat sink is
On the surface facing the substrate, there is provided a metal surface exposed portion where the metal surface is exposed, and the metal surface exposed portion is formed so as to protrude in the solder surface direction of the substrate, thereby being connected to the solder surface side. ,
The substrate is
A multilayer printed circuit board, wherein the multilayer printed circuit board is provided with an inner layer pattern connected to a signal ground and a through-hole-shaped screwing portion, and the screwing portion is electrically connected to the inner layer pattern of the signal ground. By being connected to the signal ground, the screwing portion is connected to the exposed metal surface portion, the solder surface side is connected to the heat sink,
The connection body is
The conductive connection component provided at the one end is connected in contact with the through-hole-shaped screwing portion and the metal surface exposed portion, whereby the one end is connected to the component surface side of the substrate, A conductive connection component provided at the other end is electrically connected to the vibration countermeasure component, thereby electrically connecting the heat sink and the substrate connected to a signal ground and the vibration countermeasure component connected to a frame ground. The on-vehicle device according to claim 1, wherein the on-vehicle device is physically connected without being connected to the vehicle.

Images