WO2024047810A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2024047810A1
WO2024047810A1 PCT/JP2022/032831 JP2022032831W WO2024047810A1 WO 2024047810 A1 WO2024047810 A1 WO 2024047810A1 JP 2022032831 W JP2022032831 W JP 2022032831W WO 2024047810 A1 WO2024047810 A1 WO 2024047810A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat sink
control device
electronic control
heat
Prior art date
Application number
PCT/JP2022/032831
Other languages
French (fr)
Japanese (ja)
Inventor
章 瀧井
俊明 高井
祐輝 中村
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to PCT/JP2022/032831 priority Critical patent/WO2024047810A1/en
Publication of WO2024047810A1 publication Critical patent/WO2024047810A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electronic control device.
  • the electronic control device that controls the vehicle includes a main electronic control device that outputs control commands, and multiple sub-electronic control devices that perform engine control, automatic brake control, display control, etc. based on control commands from the main electronic control device. It is composed of Furthermore, vehicles are equipped with many sensors for recognizing external conditions (road conditions, etc.). The electronic control device controls the vehicle while a sub electronic control device connected to the main electronic control device processes sensor signals.
  • the main electronic control unit or sub electronic control unit is equipped with a mechanism that provides basic functions in each electronic control unit and does not affect vehicle operation even if some abnormality occurs, and redundancy of each function is ensured. Guaranteed.
  • Electronic control devices are becoming more multi-functional, including redundancy, and may be configured to include a plurality of circuit boards. Further, as each circuit board of an electronic control device becomes multifunctional, multiple microcomputers and DDR memories with high operating frequencies are used, and there is a high possibility that the number of electronic components that generate heat will increase. As a result, noise countermeasures and heat countermeasures are essential for electronic control devices.
  • Patent Document 1 describes a rack mounting board that is connected to a motherboard of a rack and has a heat sink installed between a plurality of daughter cards arranged parallel to each other.
  • the electronic component mounting surfaces of a plurality of daughter cards are respectively arranged facing outward, and a heat sink arranged between the plurality of daughter cards is connected to the ground of each daughter card. be done.
  • heat generated in the electronic components is transported to the daughter card and then to the heat sink. Therefore, when the number of mounted electronic components increases or the amount of heat generated by the electronic components increases, the rack mounting board described in Patent Document 1 may not be able to reliably reduce the temperature of the electronic components. There is.
  • the present invention has been made in view of the above, and an object of the present invention is to reliably take heat countermeasures for electronic components mounted on a plurality of circuit boards included in an electronic control device.
  • an electronic control device of the present invention includes a first circuit board and a second circuit board in which the mounting surfaces of the respective electronic components are arranged facing each other with a gap between them, and a circuit board mounted on the first circuit board.
  • a heat dissipation plate disposed between the electronic component mounted on the electronic component and the electronic component mounted on the second circuit board; a heat dissipation material in contact with the electronic component and the heat dissipation plate;
  • a casing that accommodates the second circuit board, the heat sink, and the heat sink material, and a heat sink provided outside the casing, the heat sink passing through or through the casing. connected to the heat sink.
  • heat countermeasures can be reliably taken for electronic components mounted on a plurality of circuit boards included in an electronic control device. Problems, configurations, and effects other than those described above will be made clear by the description of the embodiments below.
  • FIG. 1 is an exploded perspective view of the electronic control device of Embodiment 1.
  • FIG. 2 is a sectional view of the electronic control device shown in FIG. 1.
  • FIG. 3 is an exploded perspective view of an electronic control device according to a second embodiment. 5 is a sectional view of the electronic control device shown in FIG. 4.
  • FIG. FIG. 3 is a configuration diagram of a heat sink, a heat sink, and a shielding member.
  • FIG. 1 is an exploded perspective view of an electronic control device 100 according to a first embodiment.
  • FIG. 2 is a sectional view of the electronic control device 100 shown in FIG.
  • FIG. 3 is a configuration diagram of the heat sink 15 and the heat sink 17.
  • the electronic control device 100 is an electronic control device including a plurality of circuit boards.
  • the electronic control device 100 may be an ECU (Electronic Control Unit) that is mounted on a vehicle and controls the vehicle.
  • ECU Electronic Control Unit
  • the electronic control device 100 includes casings 1 and 2, a first circuit board 4 and a second circuit board 5, an electronic component 8, a heat sink 15, a heat sink 17, a heat sink material 18, and a bracket 11. Be prepared.
  • the casings 1 and 2 accommodate the first circuit board 4, the second circuit board 5, the heat sink 15, and the heat sink material 18.
  • the casings 1 and 2 are formed in the shape of a hollow rectangular parallelepiped.
  • the casings 1 and 2 are made of metal or resin.
  • the casings 1 and 2 are composed of a casing base 1 that constitutes the four walls and a ceiling of the casings 1 and 2, and a casing cover 2 that constitutes the floor of the casings 1 and 2.
  • the walls of the casings 1 and 2, that is, one wall of the casing base 1, has an opening 3 that exposes an external connector 6 connected to an external device.
  • the external connector 6 is mounted on the mounting surface 4a of the first circuit board 4, and is connected to external equipment via a harness or cable.
  • the first circuit board 4 and the second circuit board 5 are arranged to face each other with their respective electronic component 8 mounting surfaces 4a and 5a spaced apart.
  • the first circuit board 4 and the second circuit board 5 are arranged parallel to each other.
  • the electronic component 8 is a semiconductor device such as a microcomputer and a DDR memory.
  • Each of the first circuit board 4 and the second circuit board 5 mounts a plurality of electronic components 8.
  • the first circuit board 4 and the second circuit board 5 are provided with a ground circuit pattern.
  • Each of the first circuit board 4 and the second circuit board 5 is provided with a signal ground 12 and a frame ground 13 as the grounds. Alternatively, only the signal ground 12 may be provided on each of the first circuit board 4 and the second circuit board 5.
  • the first circuit board 4 and the second circuit board 5 are connected to each other by an inter-board connector 7.
  • the first circuit board 4 and the second circuit board 5 are spaced apart from each other by a spacer 14 .
  • the spacer 14 is, for example, a highly rigid rod-shaped member that has one end fastened to the first circuit board 4 with a screw or the like, and the other end fastened to the second circuit board 5 with a screw or the like. Spacer 14 is fixed to heat sink 15 .
  • the heat sink 15 is arranged between the electronic component 8 mounted on the first circuit board 4 and the electronic component 8 mounted on the second circuit board 5.
  • the heat sink 15 is arranged along the first circuit board 4 and the second circuit board 5.
  • the heat sink 15 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber.
  • the heat sink 15 is connected to the heat sink 17 through or through the housings 1 and 2.
  • the heat sink 15 is formed integrally with the heat sink 17.
  • the heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and a second pedestal 16b that protrudes toward the electronic component 8 mounted on the second circuit board 5. , has.
  • the area of each top surface of the first pedestal 16a and the second pedestal 16b may be greater than or equal to the area of each top surface of the electronic component 8 corresponding to the first pedestal 16a and the second pedestal 16b, respectively.
  • the first pedestal 16a and the second pedestal 16b may be provided for electronic components 8 that generate a large amount of heat and are mounted on the first circuit board 4 and the second circuit board 5, respectively. 8 may not be provided.
  • the heat sink 15 has a region on the surface facing the first circuit board 4 where the first pedestal 16a is not provided, and a region on the surface facing the second circuit board 5 where the second pedestal 16b is not provided. Each may be formed in a concave shape so as to be spaced apart from the first circuit board 4 and the second circuit board 5.
  • the heat sink 15 includes a first heat sink column 19a that protrudes toward an unmounted area where no electronic component 8 is mounted on the mounting surface 4a of the first circuit board 4, and a second circuit board 5.
  • a second heat dissipation column 19b may be provided that protrudes toward a non-mounted area where no electronic component 8 is mounted on the mounting surface 5a.
  • the first heat dissipation column 19a and the second heat dissipation column 19b are arranged so as to contact high temperature regions of the first circuit board 4 and the second circuit board 5, respectively, where heat generated in the electronic component 8 is concentrated.
  • each of the first heat radiation pillar 19a and the second heat radiation pillar 19b is not particularly limited, and may be, for example, a square pillar with a square or rectangular cross section, a cylinder, a cylinder, or an elliptical cylinder.
  • the heat dissipation material 18 is a member that comes into contact with the electronic component 8 and the heat dissipation plate 15.
  • the heat dissipation material 18 is composed of, for example, heat dissipation grease or a heat dissipation sheet.
  • the heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do. Furthermore, the heat dissipation material 18 contacts the first circuit board 4 and the second circuit board 5 and the heat dissipation plate 15 .
  • the heat dissipation material 18 fills the gap between the unmounted area of the first circuit board 4 and the first heat dissipation column 19a, and the gap between the unmounted area of the second circuit board 5 and the second heat dissipation column 19b. Fill.
  • the heat sink 17 is provided outside the casings 1 and 2.
  • the heat sink 17 is provided so as to be in contact with the outer surfaces of the casings 1 and 2.
  • the heat sink 17 is provided on the outer surface of the casings 1 and 2, away from the openings 3 of the casings 1 and 2, and closer to the electronic component 8 that generates a larger amount of heat than the electronic component 8 that generates a smaller amount of heat.
  • the heat sink 17 has a plurality of fins 17a extending along the direction of gravity (vertical direction) and spaced apart from each other in the horizontal direction (front-back direction or left-right direction).
  • a plurality of fins 17a extend along the direction of gravity and are spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2.
  • the heat sink 17 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber.
  • the heat sink 17 is formed integrally with the heat sink 15.
  • the heat sink 17 and the heat sink 15 are connected to and
  • the bracket 11 fixes the electronic control device 100 to the vehicle body.
  • the bracket 11 connects the casings 1 and 2 to the frame ground of the vehicle body via the heat sink 17.
  • the bracket 11 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber.
  • the bracket 11 is connected to the housings 1 and 2 via a heat sink 17.
  • the electronic control device 100 of the first embodiment includes the first circuit board 4 and the second circuit board 5, in which the mounting surfaces 4a and 5a of the respective electronic components 8 are arranged facing each other with an interval, and A heat dissipation plate 15 disposed between the electronic component 8 mounted on the circuit board 4 and the electronic component 8 mounted on the second circuit board 5; and a heat dissipation material 18 in contact with the electronic component 8 and the heat dissipation plate 15.
  • housings 1 and 2 that accommodate a first circuit board 4, a second circuit board 5, a heat sink 15, and a heat radiation material 18, and a heat sink 17 provided outside the housings 1 and 2.
  • the heat sink 15 is connected to the heat sink 17 through or through the housings 1 and 2.
  • the electronic control device 100 of the first embodiment can immediately transport the heat generated in the electronic component 8 to the heat sink 15 without passing through the first circuit board 4 and the second circuit board 5.
  • the electronic control device 100 of the first embodiment can immediately transport the heat transported to the heat sink 15 to the heat sink 17 outside the casings 1 and 2, and radiate the heat from the heat sink 17. Therefore, the electronic control device 100 of the first embodiment can immediately radiate the heat generated in the electronic component 8 to the outside of the casings 1 and 2, so that the temperature of the electronic component 8 can be reliably reduced. Can be done. Therefore, the electronic control device 100 of the first embodiment can reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • the heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and an electronic component mounted on the second circuit board 5. It has a second pedestal 16b that protrudes toward the component 8.
  • the heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do.
  • the electronic control device 100 of the first embodiment can reduce the thermal resistance between the electronic component 8 and the heat sink 15, so that the heat generated in the electronic component 8 can be transferred to the heat sink 15 more quickly. Can be transported. Therefore, the electronic control device 100 of the first embodiment can further reliably reduce the temperature of the electronic component 8. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • the casings 1 and 2 have an opening 3 that exposes an external connector 6 connected to an external device.
  • the heat sink 17 is provided on the outer surface of the casings 1 and 2, away from the openings 3 of the casings 1 and 2, and closer to the electronic component 8 that generates a larger amount of heat than the electronic component 8 that generates a smaller amount of heat.
  • the electronic control device 100 of the first embodiment can insert and remove the harness etc. into the external connector 6 without interfering with the heat sink 17. Furthermore, since the electronic control device 100 of the first embodiment can shorten the length of the heat transfer path from the electronic component 8 that generates a large amount of heat to the heat sink 17, the temperature of the electronic component 8 that generates a large amount of heat can be maintained more reliably. can be reduced to Therefore, the electronic control device 100 of the first embodiment can perform the work related to the external connector 6 while more reliably taking measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. It is possible to ensure sex.
  • the heat sink 17 has a plurality of fins 17a extending along the direction of gravity and spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2. .
  • the electronic control device 100 of the first embodiment can further quickly dissipate the heat transferred to the heat sink 17 regardless of the installation posture of the casings 1 and 2, so that the temperature of the electronic component 8 can be further reduced. This can be definitely reduced. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • the heat sink 15 includes a first heat sink pillar 19a that protrudes toward an unmounted area where the electronic component 8 is not mounted on the mounting surface 4a of the first circuit board 4; It has a second heat dissipation column 19b that protrudes toward an unmounted area on the mounting surface 5a of the second circuit board 5 where no electronic component 8 is mounted.
  • the heat radiation material 18 fills the gap between the unmounted area of the first circuit board 4 and the first heat radiation pillar 19a, and the gap between the unmounted area of the second circuit board 5 and the second heat radiation pillar 19b.
  • the electronic control device 100 of the first embodiment not only immediately transports the heat generated in the electronic component 8 to the heat sink 15, but also transfers the heat of the first circuit board 4 and the second circuit board 5 to the heat sink 15. can be immediately transported to Therefore, the electronic control device 100 of the first embodiment can further reliably reduce the temperature of the electronic component 8. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • each of the heat sink 15 and the heat sink 17 is formed using aluminum, copper, or carbon fiber.
  • the electronic control device 100 of the first embodiment can form the heat sink 15 and the heat sink 17 without using special materials. Therefore, the electronic control device 100 of the first embodiment can reliably and easily take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • the electronic control device 100 of the first embodiment further includes a spacer 14 that maintains the distance between the first circuit board 4 and the second circuit board 5. Spacer 14 is fixed to heat sink 15 .
  • the electronic control device 100 of the first embodiment prevents the first circuit board 4 and the second circuit board 5 from being misaligned and interfering with each other due to vibration, and preventing the inter-board connector 7 from coming off. be able to. Therefore, the electronic control device 100 of the first embodiment can improve the vibration resistance while reliably taking measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100. can.
  • the casings 1 and 2 are made of metal or resin.
  • the electronic control device 100 of the first embodiment can form the casings 1 and 2 without using special materials. Therefore, the electronic control device 100 of the first embodiment can reliably and easily take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
  • FIG. 4 is an exploded perspective view of the electronic control device 100 of the second embodiment.
  • FIG. 5 is a cross-sectional view of the electronic control device 100 shown in FIG. 4.
  • FIG. 6 is a configuration diagram of the heat sink 15, the heat sink 17, and the shielding member 9.
  • the electronic control device 100 of the second embodiment can take heat countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5. Furthermore, the electronic control device 100 of the second embodiment can take measures against noise in the electronic components 8 mounted on the plurality of circuit boards 4 and 5.
  • the electronic control device 100 of the second embodiment includes a shielding member 9 and conductive members 10a and 10b.
  • the shielding member 9 is a member that is arranged at a distance between the first circuit board 4 and the second circuit board 5 and shields noise.
  • the shielding member 9 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • the shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and is arranged according to the distance between the first circuit board 4 and the second circuit board 5. It is a frame that forms a closed path with a width of The shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and cooperates with the first circuit board 4 and the second circuit board 5. Thus, a closed space is formed between the first circuit board 4 and the second circuit board 5.
  • the shielding member 9 may be composed of a plurality of shielding plates. 4 and 6 show an example in which the shielding member 9 is constituted by four shielding plates provided along each side of the rectangular first circuit board 4 and second circuit board 5.
  • One shielding plate has a direction in which the first circuit board 4 and the second circuit board 5 are separated from each other or close to each other (the normal direction of the first circuit board 4 or the second circuit board 5), and a direction in which the first circuit board 4 and the second circuit board 5 are 2. This is a shielding plate that extends in the direction along one side of the circuit board 5.
  • the number of electronic components 8 surrounded by the shielding member 9 is not particularly limited. That is, the shielding member 9 surrounds some or all of the electronic components 8 mounted on the first circuit board 4, and also surrounds some or all of the electronic components 8 mounted on the second circuit board 5. Surround the entire circumference of the part 8.
  • the conductive members 10a and 10b are members that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9.
  • the conductive members 10a and 10b may be formed integrally with the shielding member 9 using the same material as the shielding member 9.
  • the conductive members 10a and 10b include a first conductive member 10a that connects a first end surface 9a of the shielding member 9 on the first circuit board 4 side and a mounting surface 4a of the first circuit board 4, and a second circuit of the shielding member 9. It has a second conductive member 10b that connects the second end surface 9b on the substrate 5 side and the mounting surface 5a of the second circuit board 5.
  • the first conductive member 10a is connected to a ground provided on the first circuit board 4.
  • the second conductive member 10b is connected to a ground provided on the second circuit board 5.
  • the first conductive member 10a and the second conductive member 10b are connected to the first conductive member 10a and the second conductive member 10b, respectively. It is connected to the frame ground 13 of the circuit board 4 and the frame ground 13 of the second circuit board 5.
  • the first conductive member 10a and the second conductive member 10b are connected to the signal ground 12 and the second conductive member 12 of the first circuit board 4, respectively. It is connected to the signal ground 12 of the second circuit board 5.
  • the first conductive member 10a is connected to the first end face 9a with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ . Multiple locations are placed along the The plurality of first conductive members 10a are arranged at equal distances from each other.
  • the second conductive member 10b is connected to the second end face 9b with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ . Multiple locations are placed along the The plurality of second conductive members 10b are arranged at equal distances from each other.
  • noise One type of noise composed of electromagnetic waves is noise (hereinafter referred to as noise) that is emitted outside the electronic control device 100 and attempts to irradiate electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5.
  • noise One type of noise composed of electromagnetic waves is noise (hereinafter referred to as “noise") that is radiated from electronic components 8 mounted on each of the first circuit board 4 and second circuit board 5 and tries to go to the outside of the electronic control device 100.
  • the wavelength ⁇ of the electromagnetic waves that make up the noise may be the wavelength of the electromagnetic waves that make up the irradiation noise, or the wavelength of the electromagnetic waves that make up the radiation noise.
  • CISPR25 is known as a standard related to measurement of EMI (Electromagnetic Interference) of in-vehicle equipment.
  • the electronic control device 100 which is an in-vehicle device, is implemented with noise countermeasures that comply with CISPR25.
  • the frequency range of radiated emissions is 0.15MHz to 2500MHz.
  • the frequency range of "GLONASS L1" of CISPR25 is 1591 MHz to 1616 MHz, which can be said to be a high frequency.
  • the heat sink 15 of the second embodiment is arranged inside the shielding member 9 and connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2.
  • the heat sink 15 of the second embodiment is connected to the shielding member 9.
  • the heat sink 17 of the second embodiment is connected to the shielding member 9 via the heat sink 15.
  • the heat sink 15, the heat sink 17, and the shielding member 9 are integrally formed.
  • the bracket 11 of the second embodiment is connected to the shielding member 9 via a heat sink 17 and a heat sink 15.
  • the bracket 11 of the second embodiment is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • the heat sink 15, the heat sink 17, and the shielding member 9 are connected and fixed to the casings 1 and 2 so as to be able to withstand vibrations of the electronic control device 100 or shocks when the electronic control device 100 is dropped.
  • These fixing methods may be the following methods.
  • a method may be used in which a screw mechanism or a hook mechanism (a mechanism using a claw and a hole) is provided on the outer surface of the shielding member 9 and the inner surface of the housing base 1 to connect the two.
  • a method of fixing the heat sink 17 and the outer surface of the housing base 1 by providing a screw mechanism or a hook mechanism to connect the two may be used.
  • the housing base 1 and the housing cover 2 may be fixed by providing a screw mechanism or a hook mechanism on the housing base 1 and the housing cover 2 to connect the two.
  • the electronic control device 100 includes the shielding member 9 that is arranged at a distance between the first circuit board 4 and the second circuit board 5 and that shields noise, and the shielding member 9 that is arranged between the first circuit board 4 and the second circuit board 5, and It further includes conductive members 10a and 10b that connect the substrate 5 and the shielding member 9.
  • the shielding member 9 is a frame that surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and forms a closed circuit having a width corresponding to the interval. be.
  • the heat sink 15 is disposed inside the shielding member 9 and is connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2.
  • the shielding member 9 can block or attenuate the irradiation noise attempting to irradiate the electronic component 8 and the radiation noise radiated from the electronic component 8. Therefore, the electronic control device 100 of the second embodiment can effectively take EMI countermeasures and EMS countermeasures for the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures can be taken for the electronic components 8 mounted on the electronic components 8.
  • the heat sink 15, the heat sink 17, and the shielding member 9 are integrally formed.
  • the electronic control device 100 of the second embodiment can transport the heat of the first circuit board 4 and the second circuit board 5 to the heat sink 15 via the shielding member 9. Furthermore, the electronic control device 100 of the second embodiment can reduce the thermal resistance between the shielding member 9 and the heat sink 15 and the thermal resistance between the heat sink 15 and the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can more quickly transport the heat generated in the first circuit board 4, the second circuit board 5, and the electronic component 8 to the heat sink 15, so that the electronic component 8 temperature can be further reliably reduced. Therefore, the electronic control device 100 of the second embodiment provides more reliable heat protection for the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures can be taken for the electronic components 8 mounted on the electronic components 5.
  • each of the shielding member 9, the heat sink 15, and the heat sink 17 is formed using aluminum, copper, or carbon fiber.
  • the electronic control device 100 of the second embodiment can form the shielding member 9, the heat sink 15, and the heat sink 17 without using special materials. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures for the electronic components 8 mounted on the electronic components 8 can be easily taken.
  • the electronic control device 100 of the second embodiment further includes a bracket 11 that is mounted on a vehicle and connects the casings 1 and 2 to the frame ground of the vehicle body. Bracket 11 is connected to heat sink 17. The heat sink 17 is connected to the shielding member 9 via the heat sink 15.
  • the electronic control device 100 of the second embodiment removes static electricity charged on the first circuit board 4, the second circuit board 5, and the casings 1 and 2 by using the shielding member 9, the heat sink 15, the heat sink 17, and the bracket 11. can escape to the vehicle frame ground through the
  • the electronic control device 100 of the second embodiment reliably prevents malfunctions or failures of the electronic control device 100, such as malfunctions or failures of the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. can do. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Not only can noise countermeasures be taken against the electronic components 8 mounted on the electronic components 8, but also static electricity countermeasures can be taken.
  • the bracket 11 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • the electronic control device 100 of the second embodiment can form the bracket 11 without using any special material. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures for the electronic components 8 mounted on the electronic components 8 can be easily taken.
  • the present invention is not limited to the above embodiments, and includes various modifications.
  • the above embodiments have been described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The purpose of the present invention is to reliably take countermeasures against heat for electronic components mounted on a plurality of circuit boards provided to an electronic control device. An electronic control device 100 comprises: a first circuit board 4 and a second circuit board 5 that are disposed such that respective mounting surfaces 4a, 5a thereof, on which electronic components 8 are mounted, are disposed to be opposite to each other with a gap therebetween; a heat dissipation plate 15 disposed between the electronic components 8 that are mounted on the first circuit board 4 and the electronic components 8 that are mounted on the second circuit board 5; heat dissipation materials 18 that come into contact with the electronic components 8 and the heat dissipation plate 15; housings 1, 2 that accommodate the first circuit board 4, the second circuit board 5, the heat dissipation plate 15, and the heat dissipation materials 18; and a heat sink 17 provided outside the housings 1, 2. The heat dissipation plate 15 is connected to the heat sink 17 by penetrating through, or having interposed therebetween, the housings 1, 2.

Description

電子制御装置electronic control unit
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　車両を制御する電子制御装置は、制御指令を出力するメイン電子制御装置と、メイン電子制御装置からの制御指令に基づいてエンジン制御、自動ブレーキ制御及び表示制御等をそれぞれ行う複数のサブ電子制御装置とによって構成される。また、車両には、外界状況（道路状況等）を認識するための多くのセンサが搭載されている。電子制御装置は、メイン電子制御装置に接続されるサブ電子制御装置がセンサ信号を処理しながら、車両制御を行っている。 The electronic control device that controls the vehicle includes a main electronic control device that outputs control commands, and multiple sub-electronic control devices that perform engine control, automatic brake control, display control, etc. based on control commands from the main electronic control device. It is composed of Furthermore, vehicles are equipped with many sensors for recognizing external conditions (road conditions, etc.). The electronic control device controls the vehicle while a sub electronic control device connected to the main electronic control device processes sensor signals.
　メイン電子制御装置又はサブ電子制御装置は、何らかの異常を起こした場合でも各電子制御装置において基本的な機能を提供して車両走行に影響がない仕組みが搭載されており、各機能の冗長性が担保されている。電子制御装置では、冗長性を含む多機能化が進み、複数の回路基板を備える構成が考えられる。また、電子制御装置の各回路基板は、多機能化により、動作周波数が高いマイコンやＤＤＲメモリが複数使用され、発熱する電子部品も多くなる可能性が高い。これにより、電子制御装置では、ノイズ対策や熱対策が必須となる。 The main electronic control unit or sub electronic control unit is equipped with a mechanism that provides basic functions in each electronic control unit and does not affect vehicle operation even if some abnormality occurs, and redundancy of each function is ensured. Guaranteed. Electronic control devices are becoming more multi-functional, including redundancy, and may be configured to include a plurality of circuit boards. Further, as each circuit board of an electronic control device becomes multifunctional, multiple microcomputers and DDR memories with high operating frequencies are used, and there is a high possibility that the number of electronic components that generate heat will increase. As a result, noise countermeasures and heat countermeasures are essential for electronic control devices.
　本技術分野における先行技術文献として特許文献１がある。特許文献１には、ラックのマザーボードに接続され、互いに平行に配置された複数のドーターカードの間に放熱板を設置するラック装着用基板が記載されている。 There is Patent Document 1 as a prior art document in this technical field. Patent Document 1 describes a rack mounting board that is connected to a motherboard of a rack and has a heat sink installed between a plurality of daughter cards arranged parallel to each other.
特開２００１－１１１２６２号公報Japanese Patent Application Publication No. 2001-111262
　特許文献１に記載のラック装着用基板では、複数のドーターカードの電子部品の搭載面がそれぞれ外向きに配置され、複数のドーターカードの間に配置された放熱板が各ドーターカードのアースに接続される。特許文献１に記載のラック装着用基板では、電子部品にて発生した熱が、ドーターカードに輸送された後に放熱板へと輸送される。したがって、電子部品の搭載数が多くなったり、電子部品の発熱量が大きくなったりする場合、特許文献１に記載のラック装着用基板は、電子部品の温度を確実に低減することができない可能性がある。 In the rack mounting board described in Patent Document 1, the electronic component mounting surfaces of a plurality of daughter cards are respectively arranged facing outward, and a heat sink arranged between the plurality of daughter cards is connected to the ground of each daughter card. be done. In the rack mounting board described in Patent Document 1, heat generated in the electronic components is transported to the daughter card and then to the heat sink. Therefore, when the number of mounted electronic components increases or the amount of heat generated by the electronic components increases, the rack mounting board described in Patent Document 1 may not be able to reliably reduce the temperature of the electronic components. There is.
　本発明は、上記に鑑みてなされたものであり、電子制御装置に備えられた複数の回路基板に搭載された電子部品の熱対策を確実に行うことを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to reliably take heat countermeasures for electronic components mounted on a plurality of circuit boards included in an electronic control device.
　上記課題を解決するために、本発明の電子制御装置は、それぞれの電子部品の搭載面が間隔を空けて対向配置された第１回路基板及び第２回路基板と、前記第１回路基板に搭載された前記電子部品と前記第２回路基板に搭載された前記電子部品との間に配置された放熱板と、前記電子部品と前記放熱板とに接触する放熱材料と、前記第１回路基板及び前記第２回路基板、前記放熱板並びに前記放熱材料を収容する筐体と、前記筐体の外部に設けられたヒートシンクと、を備え、前記放熱板は、前記筐体を貫通して又は介して前記ヒートシンクに接続される。 In order to solve the above problems, an electronic control device of the present invention includes a first circuit board and a second circuit board in which the mounting surfaces of the respective electronic components are arranged facing each other with a gap between them, and a circuit board mounted on the first circuit board. a heat dissipation plate disposed between the electronic component mounted on the electronic component and the electronic component mounted on the second circuit board; a heat dissipation material in contact with the electronic component and the heat dissipation plate; A casing that accommodates the second circuit board, the heat sink, and the heat sink material, and a heat sink provided outside the casing, the heat sink passing through or through the casing. connected to the heat sink.
　本発明によれば、電子制御装置に備えられた複数の回路基板に搭載された電子部品の熱対策を確実に行うことができる。
　上記以外の課題、構成および効果は、以下の実施形態の説明により明らかにされる。 According to the present invention, heat countermeasures can be reliably taken for electronic components mounted on a plurality of circuit boards included in an electronic control device.
Problems, configurations, and effects other than those described above will be made clear by the description of the embodiments below.
実施形態１の電子制御装置の分解斜視図。1 is an exploded perspective view of the electronic control device of Embodiment 1. FIG. 図１に示す電子制御装置の断面図。2 is a sectional view of the electronic control device shown in FIG. 1. FIG. 放熱板及びヒートシンクの構成図。A configuration diagram of a heat sink and a heat sink. 実施形態２の電子制御装置の分解斜視図。FIG. 3 is an exploded perspective view of an electronic control device according to a second embodiment. 図４に示す電子制御装置の断面図。5 is a sectional view of the electronic control device shown in FIG. 4. FIG. 放熱板、ヒートシンク及び遮蔽部材の構成図。FIG. 3 is a configuration diagram of a heat sink, a heat sink, and a shielding member.
　以下、本発明の実施形態について図面を用いて説明する。なお、各実施形態において同一の符号を付された構成については、特に言及しない限り、各実施形態において同様の機能を有し、その説明を省略する。 Hereinafter, embodiments of the present invention will be described using the drawings. In addition, unless otherwise mentioned, the configurations with the same reference numerals in each embodiment have the same functions in each embodiment, and the description thereof will be omitted.
［実施形態１］
　図１～図３を用いて、実施形態１の電子制御装置１００について説明する。図１は、実施形態１の電子制御装置１００の分解斜視図である。図２は、図１に示す電子制御装置１００の断面図である。図３は、放熱板１５及びヒートシンク１７の構成図である。 [Embodiment 1]
The electronic control device 100 of the first embodiment will be described using FIGS. 1 to 3. FIG. 1 is an exploded perspective view of an electronic control device 100 according to a first embodiment. FIG. 2 is a sectional view of the electronic control device 100 shown in FIG. FIG. 3 is a configuration diagram of the heat sink 15 and the heat sink 17.
　電子制御装置１００は、複数の回路基板を備える電子制御装置である。電子制御装置１００は、車両に搭載され、車両を制御するＥＣＵ（Electronic Control Unit）であってもよい。 The electronic control device 100 is an electronic control device including a plurality of circuit boards. The electronic control device 100 may be an ECU (Electronic Control Unit) that is mounted on a vehicle and controls the vehicle.
　電子制御装置１００は、筐体１，２と、第１回路基板４及び第２回路基板５と、電子部品８と、放熱板１５と、ヒートシンク１７と、放熱材料１８と、ブラケット１１と、を備える。 The electronic control device 100 includes casings 1 and 2, a first circuit board 4 and a second circuit board 5, an electronic component 8, a heat sink 15, a heat sink 17, a heat sink material 18, and a bracket 11. Be prepared.
　筐体１，２は、第１回路基板４及び第２回路基板５、放熱板１５並びに放熱材料１８を収容する。筐体１，２は、中空の直方体状に形成される。筐体１，２は、金属製又は樹脂製である。筐体１，２は、筐体１，２の４つの壁部及び天井部を構成する筐体ベース１と、筐体１，２の床部を構成する筐体カバー２とから成る。筐体１，２の壁部、すなわち、筐体ベース１の１つの壁部は、外部機器に接続される外部コネクタ６を露出させる開口部３を有する。外部コネクタ６は、第１回路基板４の搭載面４ａに搭載され、ハーネス又はケーブルを介して外部機器に接続される。 The casings 1 and 2 accommodate the first circuit board 4, the second circuit board 5, the heat sink 15, and the heat sink material 18. The casings 1 and 2 are formed in the shape of a hollow rectangular parallelepiped. The casings 1 and 2 are made of metal or resin. The casings 1 and 2 are composed of a casing base 1 that constitutes the four walls and a ceiling of the casings 1 and 2, and a casing cover 2 that constitutes the floor of the casings 1 and 2. The walls of the casings 1 and 2, that is, one wall of the casing base 1, has an opening 3 that exposes an external connector 6 connected to an external device. The external connector 6 is mounted on the mounting surface 4a of the first circuit board 4, and is connected to external equipment via a harness or cable.
　第１回路基板４及び第２回路基板５は、それぞれの電子部品８の搭載面４ａ，５ａが間隔を空けて対向配置される。第１回路基板４及び第２回路基板５は、互いに平行に配置される。電子部品８は、マイコン及びＤＤＲメモリ等の半導体素子である。第１回路基板４及び第２回路基板５のそれぞれは、複数の電子部品８を搭載する。第１回路基板４及び第２回路基板５には、グランドの回路パターンが設けられている。第１回路基板４及び第２回路基板５のそれぞれには、当該グランドとして、シグナルグランド１２及びフレームグランド１３が設けられる。或いは、第１回路基板４及び第２回路基板５のそれぞれには、シグナルグランド１２だけが設けられていてもよい。 The first circuit board 4 and the second circuit board 5 are arranged to face each other with their respective electronic component 8 mounting surfaces 4a and 5a spaced apart. The first circuit board 4 and the second circuit board 5 are arranged parallel to each other. The electronic component 8 is a semiconductor device such as a microcomputer and a DDR memory. Each of the first circuit board 4 and the second circuit board 5 mounts a plurality of electronic components 8. The first circuit board 4 and the second circuit board 5 are provided with a ground circuit pattern. Each of the first circuit board 4 and the second circuit board 5 is provided with a signal ground 12 and a frame ground 13 as the grounds. Alternatively, only the signal ground 12 may be provided on each of the first circuit board 4 and the second circuit board 5.
　第１回路基板４及び第２回路基板５は、基板間コネクタ７によって互いに接続される。第１回路基板４及び第２回路基板５は、スペーサ１４によって互いの間隔が保持されている。スペーサ１４は、例えば、一端が第１回路基板４にねじ等により締結され、他端が第２回路基板５にねじ等により締結される高剛性の棒状部材である。スペーサ１４は、放熱板１５に固定される。 The first circuit board 4 and the second circuit board 5 are connected to each other by an inter-board connector 7. The first circuit board 4 and the second circuit board 5 are spaced apart from each other by a spacer 14 . The spacer 14 is, for example, a highly rigid rod-shaped member that has one end fastened to the first circuit board 4 with a screw or the like, and the other end fastened to the second circuit board 5 with a screw or the like. Spacer 14 is fixed to heat sink 15 .
　放熱板１５は、第１回路基板４に搭載された電子部品８と第２回路基板５に搭載された電子部品８との間に配置される。放熱板１５は、第１回路基板４及び第２回路基板５に沿って配置される。放熱板１５は、アルミ、銅又は炭素繊維等の高熱伝導率の材料を用いて形成される。放熱板１５は、筐体１，２を貫通して又は介してヒートシンク１７に接続される。放熱板１５は、ヒートシンク１７と一体的に形成される。 The heat sink 15 is arranged between the electronic component 8 mounted on the first circuit board 4 and the electronic component 8 mounted on the second circuit board 5. The heat sink 15 is arranged along the first circuit board 4 and the second circuit board 5. The heat sink 15 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber. The heat sink 15 is connected to the heat sink 17 through or through the housings 1 and 2. The heat sink 15 is formed integrally with the heat sink 17.
　放熱板１５は、第１回路基板４に搭載された電子部品８に向かって突出する第１台座１６ａと、第２回路基板５に搭載された電子部品８に向かって突出する第２台座１６ｂと、を有する。第１台座１６ａ及び第２台座１６ｂのそれぞれの天面の面積は、第１台座１６ａ及び第２台座１６ｂにそれぞれ対応する電子部品８のそれぞれの天面の面積以上であってもよい。第１台座１６ａ及び第２台座１６ｂは、第１回路基板４及び第２回路基板５のそれぞれに搭載された発熱量の大きな電子部品８に対して設けられてもよく、発熱量の小さな電子部品８に対しては設けられていなくてもよい。放熱板１５は、第１回路基板４との対向面の第１台座１６ａが設けられていない領域、及び、第２回路基板５との対向面の第２台座１６ｂが設けられていない領域が、それぞれ、第１回路基板４及び第２回路基板５から離隔するように凹形状に形成されてもよい。 The heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and a second pedestal 16b that protrudes toward the electronic component 8 mounted on the second circuit board 5. , has. The area of each top surface of the first pedestal 16a and the second pedestal 16b may be greater than or equal to the area of each top surface of the electronic component 8 corresponding to the first pedestal 16a and the second pedestal 16b, respectively. The first pedestal 16a and the second pedestal 16b may be provided for electronic components 8 that generate a large amount of heat and are mounted on the first circuit board 4 and the second circuit board 5, respectively. 8 may not be provided. The heat sink 15 has a region on the surface facing the first circuit board 4 where the first pedestal 16a is not provided, and a region on the surface facing the second circuit board 5 where the second pedestal 16b is not provided. Each may be formed in a concave shape so as to be spaced apart from the first circuit board 4 and the second circuit board 5.
　放熱板１５は、図３に示すように、第１回路基板４の搭載面４ａにおいて電子部品８が搭載されていない未搭載領域に向かって突出する第１放熱柱１９ａと、第２回路基板５の搭載面５ａにおいて電子部品８が搭載されていない未搭載領域に向かって突出する第２放熱柱１９ｂと、を有していてもよい。第１放熱柱１９ａ及び第２放熱柱１９ｂは、電子部品８にて発生した熱が集中する第１回路基板４及び第２回路基板５のそれぞれの高温領域に接触するように配置される。第１放熱柱１９ａ及び第２放熱柱１９ｂのそれぞれの形状は、特に限定されず、例えば、断面が正方形若しくは長方形の角柱、円筒、円柱又は楕円柱であってもよい。 As shown in FIG. 3, the heat sink 15 includes a first heat sink column 19a that protrudes toward an unmounted area where no electronic component 8 is mounted on the mounting surface 4a of the first circuit board 4, and a second circuit board 5. A second heat dissipation column 19b may be provided that protrudes toward a non-mounted area where no electronic component 8 is mounted on the mounting surface 5a. The first heat dissipation column 19a and the second heat dissipation column 19b are arranged so as to contact high temperature regions of the first circuit board 4 and the second circuit board 5, respectively, where heat generated in the electronic component 8 is concentrated. The shape of each of the first heat radiation pillar 19a and the second heat radiation pillar 19b is not particularly limited, and may be, for example, a square pillar with a square or rectangular cross section, a cylinder, a cylinder, or an elliptical cylinder.
　放熱材料１８は、電子部品８と放熱板１５とに接触する部材である。放熱材料１８は、例えば、放熱グリス又は放熱シートによって構成される。放熱材料１８は、第１回路基板４に搭載された電子部品８と第１台座１６ａとの隙間、及び、第２回路基板５に搭載された電子部品８と第２台座１６ｂとの隙間を充填する。更に、放熱材料１８は、第１回路基板４及び第２回路基板５と放熱板１５とに接触する。具体的には、放熱材料１８は、第１回路基板４の未搭載領域と第１放熱柱１９ａとの隙間、及び、第２回路基板５の未搭載領域と第２放熱柱１９ｂとの隙間を充填する。 The heat dissipation material 18 is a member that comes into contact with the electronic component 8 and the heat dissipation plate 15. The heat dissipation material 18 is composed of, for example, heat dissipation grease or a heat dissipation sheet. The heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do. Furthermore, the heat dissipation material 18 contacts the first circuit board 4 and the second circuit board 5 and the heat dissipation plate 15 . Specifically, the heat dissipation material 18 fills the gap between the unmounted area of the first circuit board 4 and the first heat dissipation column 19a, and the gap between the unmounted area of the second circuit board 5 and the second heat dissipation column 19b. Fill.
　ヒートシンク１７は、筐体１，２の外部に設けられる。ヒートシンク１７は、筐体１，２の外面に接触するように設けられる。ヒートシンク１７は、筐体１，２の開口部３から離隔し、且つ、発熱量の小さな電子部品８よりも発熱量の大きな電子部品８に近接する筐体１，２の外面に設けられる。ヒートシンク１７は、重力方向（上下方向）に沿って延び水平方向（前後方向又は左右方向）に互いに離隔して配置された複数のフィン１７ａを有する。フィン１７ａは、筐体１，２の設置姿勢に関わらず、重力方向に沿って延び水平方向に互いに離隔して複数配置される。ヒートシンク１７は、アルミ、銅又は炭素繊維等の高熱伝導率の材料を用いて形成される。ヒートシンク１７は、放熱板１５と一体的に形成される。ヒートシンク１７及び放熱板１５は、筐体１，２に接続され固定される。 The heat sink 17 is provided outside the casings 1 and 2. The heat sink 17 is provided so as to be in contact with the outer surfaces of the casings 1 and 2. The heat sink 17 is provided on the outer surface of the casings 1 and 2, away from the openings 3 of the casings 1 and 2, and closer to the electronic component 8 that generates a larger amount of heat than the electronic component 8 that generates a smaller amount of heat. The heat sink 17 has a plurality of fins 17a extending along the direction of gravity (vertical direction) and spaced apart from each other in the horizontal direction (front-back direction or left-right direction). A plurality of fins 17a extend along the direction of gravity and are spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2. The heat sink 17 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber. The heat sink 17 is formed integrally with the heat sink 15. The heat sink 17 and the heat sink 15 are connected to and fixed to the casings 1 and 2.
　ブラケット１１は、電子制御装置１００を車体に固定する。ブラケット１１は、ヒートシンク１７を介して筐体１，２を車体のフレームグランドに接続する。ブラケット１１は、アルミ、銅又は炭素繊維等の高熱伝導率の材料を用いて形成される。ブラケット１１は、ヒートシンク１７を介して筐体１，２に接続される。 The bracket 11 fixes the electronic control device 100 to the vehicle body. The bracket 11 connects the casings 1 and 2 to the frame ground of the vehicle body via the heat sink 17. The bracket 11 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber. The bracket 11 is connected to the housings 1 and 2 via a heat sink 17.
　以上のように、実施形態１の電子制御装置１００は、それぞれの電子部品８の搭載面４ａ，５ａが間隔を空けて対向配置された第１回路基板４及び第２回路基板５と、第１回路基板４に搭載された電子部品８と第２回路基板５に搭載された電子部品８との間に配置された放熱板１５と、電子部品８と放熱板１５とに接触する放熱材料１８と、第１回路基板４及び第２回路基板５、放熱板１５並びに放熱材料１８を収容する筐体１，２と、筐体１，２の外部に設けられたヒートシンク１７と、を備える。放熱板１５は、筐体１，２を貫通して又は介してヒートシンク１７に接続される。 As described above, the electronic control device 100 of the first embodiment includes the first circuit board 4 and the second circuit board 5, in which the mounting surfaces 4a and 5a of the respective electronic components 8 are arranged facing each other with an interval, and A heat dissipation plate 15 disposed between the electronic component 8 mounted on the circuit board 4 and the electronic component 8 mounted on the second circuit board 5; and a heat dissipation material 18 in contact with the electronic component 8 and the heat dissipation plate 15. , housings 1 and 2 that accommodate a first circuit board 4, a second circuit board 5, a heat sink 15, and a heat radiation material 18, and a heat sink 17 provided outside the housings 1 and 2. The heat sink 15 is connected to the heat sink 17 through or through the housings 1 and 2.
　これにより、実施形態１の電子制御装置１００は、電子部品８にて発生した熱を、第１回路基板４及び第２回路基板５を介することなく直ちに放熱板１５に輸送することができる。実施形態１の電子制御装置１００は、放熱板１５に輸送された熱を、筐体１，２の外部のヒートシンク１７に直ちに輸送し、ヒートシンク１７から放熱することができる。したがって、実施形態１の電子制御装置１００は、電子部品８にて発生した熱を、筐体１，２の外部にて直ちに放熱することができるので、電子部品８の温度を確実に低減することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行うことができる。 Thereby, the electronic control device 100 of the first embodiment can immediately transport the heat generated in the electronic component 8 to the heat sink 15 without passing through the first circuit board 4 and the second circuit board 5. The electronic control device 100 of the first embodiment can immediately transport the heat transported to the heat sink 15 to the heat sink 17 outside the casings 1 and 2, and radiate the heat from the heat sink 17. Therefore, the electronic control device 100 of the first embodiment can immediately radiate the heat generated in the electronic component 8 to the outside of the casings 1 and 2, so that the temperature of the electronic component 8 can be reliably reduced. Can be done. Therefore, the electronic control device 100 of the first embodiment can reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
　更に、実施形態１の電子制御装置１００において、放熱板１５は、第１回路基板４に搭載された電子部品８に向かって突出する第１台座１６ａと、第２回路基板５に搭載された電子部品８に向かって突出する第２台座１６ｂと、を有する。放熱材料１８は、第１回路基板４に搭載された電子部品８と第１台座１６ａとの隙間、及び、第２回路基板５に搭載された電子部品８と第２台座１６ｂとの隙間を充填する。 Furthermore, in the electronic control device 100 of the first embodiment, the heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and an electronic component mounted on the second circuit board 5. It has a second pedestal 16b that protrudes toward the component 8. The heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do.
　これにより、実施形態１の電子制御装置１００は、電子部品８と放熱板１５との間における熱抵抗を低減することができるので、電子部品８にて発生した熱を更に迅速に放熱板１５に輸送することができる。したがって、実施形態１の電子制御装置１００は、電子部品８の温度を更に確実に低減することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を更に確実に行うことができる。 Thereby, the electronic control device 100 of the first embodiment can reduce the thermal resistance between the electronic component 8 and the heat sink 15, so that the heat generated in the electronic component 8 can be transferred to the heat sink 15 more quickly. Can be transported. Therefore, the electronic control device 100 of the first embodiment can further reliably reduce the temperature of the electronic component 8. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
　更に、実施形態１の電子制御装置１００において、筐体１，２は、外部機器に接続される外部コネクタ６を露出させる開口部３を有する。ヒートシンク１７は、筐体１，２の開口部３から離隔し、且つ、発熱量の小さな電子部品８よりも発熱量の大きな電子部品８に近接する筐体１，２の外面に設けられる。 Further, in the electronic control device 100 of the first embodiment, the casings 1 and 2 have an opening 3 that exposes an external connector 6 connected to an external device. The heat sink 17 is provided on the outer surface of the casings 1 and 2, away from the openings 3 of the casings 1 and 2, and closer to the electronic component 8 that generates a larger amount of heat than the electronic component 8 that generates a smaller amount of heat.
　これにより、実施形態１の電子制御装置１００は、ヒートシンク１７に干渉することなくハーネス等を外部コネクタ６に挿抜することができる。更に、実施形態１の電子制御装置１００は、発熱量の大きな電子部品８からヒートシンク１７までの伝熱経路の長さを短くすることができるので、発熱量の大きな電子部品８の温度を更に確実に低減することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を更に確実に行いながら、外部コネクタ６に係る作業性を確保することができる。 Thereby, the electronic control device 100 of the first embodiment can insert and remove the harness etc. into the external connector 6 without interfering with the heat sink 17. Furthermore, since the electronic control device 100 of the first embodiment can shorten the length of the heat transfer path from the electronic component 8 that generates a large amount of heat to the heat sink 17, the temperature of the electronic component 8 that generates a large amount of heat can be maintained more reliably. can be reduced to Therefore, the electronic control device 100 of the first embodiment can perform the work related to the external connector 6 while more reliably taking measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. It is possible to ensure sex.
　更に、実施形態１の電子制御装置１００において、ヒートシンク１７は、筐体１，２の設置姿勢に関わらず、重力方向に沿って延び水平方向に互いに離隔して配置された複数のフィン１７ａを有する。 Furthermore, in the electronic control device 100 of the first embodiment, the heat sink 17 has a plurality of fins 17a extending along the direction of gravity and spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2. .
　これにより、実施形態１の電子制御装置１００は、筐体１，２の設置姿勢に関わらず、ヒートシンク１７に輸送された熱を更に迅速に放熱させることができるので、電子部品８の温度を更に確実に低減することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を更に確実に行うことができる。 As a result, the electronic control device 100 of the first embodiment can further quickly dissipate the heat transferred to the heat sink 17 regardless of the installation posture of the casings 1 and 2, so that the temperature of the electronic component 8 can be further reduced. This can be definitely reduced. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
　更に、実施形態１の電子制御装置１００において、放熱板１５は、第１回路基板４の搭載面４ａにおいて電子部品８が搭載されていない未搭載領域に向かって突出する第１放熱柱１９ａと、第２回路基板５の搭載面５ａにおいて電子部品８が搭載されていない未搭載領域に向かって突出する第２放熱柱１９ｂと、を有する。放熱材料１８は、第１回路基板４の未搭載領域と第１放熱柱１９ａとの隙間、及び、第２回路基板５の未搭載領域と第２放熱柱１９ｂとの隙間を充填する。 Furthermore, in the electronic control device 100 of the first embodiment, the heat sink 15 includes a first heat sink pillar 19a that protrudes toward an unmounted area where the electronic component 8 is not mounted on the mounting surface 4a of the first circuit board 4; It has a second heat dissipation column 19b that protrudes toward an unmounted area on the mounting surface 5a of the second circuit board 5 where no electronic component 8 is mounted. The heat radiation material 18 fills the gap between the unmounted area of the first circuit board 4 and the first heat radiation pillar 19a, and the gap between the unmounted area of the second circuit board 5 and the second heat radiation pillar 19b.
　これにより、実施形態１の電子制御装置１００は、電子部品８にて発生した熱を放熱板１５に直ちに輸送するだけでなく、第１回路基板４及び第２回路基板５の熱を放熱板１５に直ちに輸送することができる。したがって、実施形態１の電子制御装置１００は、電子部品８の温度を更に確実に低減することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を更に確実に行うことができる。 As a result, the electronic control device 100 of the first embodiment not only immediately transports the heat generated in the electronic component 8 to the heat sink 15, but also transfers the heat of the first circuit board 4 and the second circuit board 5 to the heat sink 15. can be immediately transported to Therefore, the electronic control device 100 of the first embodiment can further reliably reduce the temperature of the electronic component 8. Therefore, the electronic control device 100 of the first embodiment can more reliably take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
　更に、実施形態１の電子制御装置１００において、放熱板１５及びヒートシンク１７のそれぞれは、アルミ、銅又は炭素繊維を用いて形成される。 Furthermore, in the electronic control device 100 of the first embodiment, each of the heat sink 15 and the heat sink 17 is formed using aluminum, copper, or carbon fiber.
　これにより、実施形態１の電子制御装置１００は、特別な材料を用いることなく放熱板１５及びヒートシンク１７を形成することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実且つ容易に行うことができる。 Thereby, the electronic control device 100 of the first embodiment can form the heat sink 15 and the heat sink 17 without using special materials. Therefore, the electronic control device 100 of the first embodiment can reliably and easily take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
　更に、実施形態１の電子制御装置１００は、第１回路基板４及び第２回路基板５の間隔を保持するスペーサ１４を更に備える。スペーサ１４は、放熱板１５に固定される。 Further, the electronic control device 100 of the first embodiment further includes a spacer 14 that maintains the distance between the first circuit board 4 and the second circuit board 5. Spacer 14 is fixed to heat sink 15 .
　これにより、実施形態１の電子制御装置１００は、振動によって第１回路基板４と第２回路基板５とが位置ずれを起こして互いに干渉したり、基板間コネクタ７が外れたりすることを防止することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行いながら、耐振性を向上させることができる。 Thereby, the electronic control device 100 of the first embodiment prevents the first circuit board 4 and the second circuit board 5 from being misaligned and interfering with each other due to vibration, and preventing the inter-board connector 7 from coming off. be able to. Therefore, the electronic control device 100 of the first embodiment can improve the vibration resistance while reliably taking measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100. can.
　更に、実施形態１の電子制御装置１００において、筐体１，２は、金属製又は樹脂製である。 Further, in the electronic control device 100 of the first embodiment, the casings 1 and 2 are made of metal or resin.
　これにより、実施形態１の電子制御装置１００は、特別な材料を用いることなく筐体１，２を形成することができる。よって、実施形態１の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実且つ容易に行うことができる。 Thereby, the electronic control device 100 of the first embodiment can form the casings 1 and 2 without using special materials. Therefore, the electronic control device 100 of the first embodiment can reliably and easily take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 included in the electronic control device 100.
［実施形態２］
　図４～図６を用いて、実施形態２の電子制御装置１００について説明する。実施形態２の電子制御装置１００において、実施形態１と同様の構成及び動作については、説明を省略する。図４は、実施形態２の電子制御装置１００の分解斜視図である。図５は、図４に示す電子制御装置１００の断面図である。図６は、放熱板１５、ヒートシンク１７及び遮蔽部材９の構成図である。 [Embodiment 2]
The electronic control device 100 of the second embodiment will be explained using FIGS. 4 to 6. In the electronic control device 100 of the second embodiment, descriptions of the same configurations and operations as those of the first embodiment will be omitted. FIG. 4 is an exploded perspective view of the electronic control device 100 of the second embodiment. FIG. 5 is a cross-sectional view of the electronic control device 100 shown in FIG. 4. FIG. 6 is a configuration diagram of the heat sink 15, the heat sink 17, and the shielding member 9.
　実施形態２の電子制御装置１００は、実施形態１の電子制御装置１００と同様に、複数の回路基板４，５に搭載された電子部品８の熱対策を行うことができる。更に、実施形態２の電子制御装置１００は、複数の回路基板４，５に搭載された電子部品８のノイズ対策を行うことができる。 Similarly to the electronic control device 100 of the first embodiment, the electronic control device 100 of the second embodiment can take heat countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5. Furthermore, the electronic control device 100 of the second embodiment can take measures against noise in the electronic components 8 mounted on the plurality of circuit boards 4 and 5.
　実施形態２の電子制御装置１００は、実施形態１の電子制御装置１００に備えられた構成の他に、遮蔽部材９と、導電部材１０ａ，１０ｂと、を備える。 In addition to the configuration provided in the electronic control device 100 of the first embodiment, the electronic control device 100 of the second embodiment includes a shielding member 9 and conductive members 10a and 10b.
　遮蔽部材９は、第１回路基板４及び第２回路基板５の間隔に配置され、ノイズを遮蔽する部材である。遮蔽部材９は、アルミ、銅、炭素繊維、導電性樹脂、又は、非導電性材料の表面に導電性樹脂を被覆した材料を用いて形成される。 The shielding member 9 is a member that is arranged at a distance between the first circuit board 4 and the second circuit board 5 and shields noise. The shielding member 9 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
　遮蔽部材９は、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８の周りを全周に亘って囲み、第１回路基板４及び第２回路基板５の間隔に応じた幅を有する閉路を形成する枠体である。遮蔽部材９は、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８の周りを全周に亘って囲み、第１回路基板４及び第２回路基板５と協働して、第１回路基板４及び第２回路基板５の間隔に閉空間を形成する。例えば、遮蔽部材９は、複数の遮蔽板によって構成されてもよい。図４及び図６には、遮蔽部材９が、矩形の第１回路基板４及び第２回路基板５の各辺に沿って設けられた４つの遮蔽板によって構成されている例が示されている。１つの遮蔽板は、第１回路基板４及び第２回路基板５が互いに離隔又は近接する方向（第１回路基板４又は第２回路基板５の法線方向）と、第１回路基板４及び第２回路基板５の一辺に沿った方向とに延びる遮蔽板である。 The shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and is arranged according to the distance between the first circuit board 4 and the second circuit board 5. It is a frame that forms a closed path with a width of The shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and cooperates with the first circuit board 4 and the second circuit board 5. Thus, a closed space is formed between the first circuit board 4 and the second circuit board 5. For example, the shielding member 9 may be composed of a plurality of shielding plates. 4 and 6 show an example in which the shielding member 9 is constituted by four shielding plates provided along each side of the rectangular first circuit board 4 and second circuit board 5. . One shielding plate has a direction in which the first circuit board 4 and the second circuit board 5 are separated from each other or close to each other (the normal direction of the first circuit board 4 or the second circuit board 5), and a direction in which the first circuit board 4 and the second circuit board 5 are 2. This is a shielding plate that extends in the direction along one side of the circuit board 5.
　遮蔽部材９が囲む電子部品８の数は、特に限定されない。すなわち、遮蔽部材９は、第１回路基板４に搭載された一部又は全部の電子部品８の周りを全周に亘って囲むと共に、第２回路基板５に搭載された一部又は全部の電子部品８の周りを全周に亘って囲む。 The number of electronic components 8 surrounded by the shielding member 9 is not particularly limited. That is, the shielding member 9 surrounds some or all of the electronic components 8 mounted on the first circuit board 4, and also surrounds some or all of the electronic components 8 mounted on the second circuit board 5. Surround the entire circumference of the part 8.
　導電部材１０ａ，１０ｂは、第１回路基板４及び第２回路基板５と遮蔽部材９とを接続する部材である。導電部材１０ａ，１０ｂは、遮蔽部材９と同一の材料を用いて遮蔽部材９と一体的に形成されてもよい。導電部材１０ａ，１０ｂは、遮蔽部材９の第１回路基板４側の第１端面９ａと第１回路基板４の搭載面４ａとを接続する第１導電部材１０ａと、遮蔽部材９の第２回路基板５側の第２端面９ｂと第２回路基板５の搭載面５ａとを接続する第２導電部材１０ｂと、を有する。 The conductive members 10a and 10b are members that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9. The conductive members 10a and 10b may be formed integrally with the shielding member 9 using the same material as the shielding member 9. The conductive members 10a and 10b include a first conductive member 10a that connects a first end surface 9a of the shielding member 9 on the first circuit board 4 side and a mounting surface 4a of the first circuit board 4, and a second circuit of the shielding member 9. It has a second conductive member 10b that connects the second end surface 9b on the substrate 5 side and the mounting surface 5a of the second circuit board 5.
　第１導電部材１０ａは、第１回路基板４に設けられたグランドに接続される。第２導電部材１０ｂは、第２回路基板５に設けられたグランドに接続される。具体的には、第１回路基板４及び第２回路基板５のそれぞれにシグナルグランド１２及びフレームグランド１３が設けられている場合、第１導電部材１０ａ及び第２導電部材１０ｂは、それぞれ、第１回路基板４のフレームグランド１３及び第２回路基板５のフレームグランド１３に接続される。第１回路基板４及び第２回路基板５のそれぞれにシグナルグランド１２だけが設けられている場合、第１導電部材１０ａ及び第２導電部材１０ｂは、それぞれ、第１回路基板４のシグナルグランド１２及び第２回路基板５のシグナルグランド１２に接続される。 The first conductive member 10a is connected to a ground provided on the first circuit board 4. The second conductive member 10b is connected to a ground provided on the second circuit board 5. Specifically, when the signal ground 12 and the frame ground 13 are provided on the first circuit board 4 and the second circuit board 5, respectively, the first conductive member 10a and the second conductive member 10b are connected to the first conductive member 10a and the second conductive member 10b, respectively. It is connected to the frame ground 13 of the circuit board 4 and the frame ground 13 of the second circuit board 5. When only the signal ground 12 is provided on each of the first circuit board 4 and the second circuit board 5, the first conductive member 10a and the second conductive member 10b are connected to the signal ground 12 and the second conductive member 12 of the first circuit board 4, respectively. It is connected to the signal ground 12 of the second circuit board 5.
　第１導電部材１０ａは、ノイズを構成する電磁波の波長λの半分（λ／２）以下の距離、又は、波長λの四分の一（λ／４）以下の距離を空けて第１端面９ａに沿って複数配置される。複数の第１導電部材１０ａは、互いに等距離を空けて配置される。第２導電部材１０ｂは、ノイズを構成する電磁波の波長λの半分（λ／２）以下の距離、又は、波長λの四分の一（λ／４）以下の距離を空けて第２端面９ｂに沿って複数配置される。複数の第２導電部材１０ｂは、互いに等距離を空けて配置される。 The first conductive member 10a is connected to the first end face 9a with a distance of less than half (λ/2) of the wavelength λ of the electromagnetic waves constituting the noise, or a distance of less than a quarter (λ/4) of the wavelength λ. Multiple locations are placed along the The plurality of first conductive members 10a are arranged at equal distances from each other. The second conductive member 10b is connected to the second end face 9b with a distance of less than half (λ/2) of the wavelength λ of the electromagnetic waves constituting the noise, or a distance of less than a quarter (λ/4) of the wavelength λ. Multiple locations are placed along the The plurality of second conductive members 10b are arranged at equal distances from each other.
　電磁波によって構成されるノイズの１つとしては、電子制御装置１００の外部において放射され、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８を照射しようとするノイズ（以下「照射ノイズ」とも称する）がある。電磁波によって構成されるノイズの１つとしては、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８において放射され、電子制御装置１００の外部に向かおうとするノイズ（以下「放射ノイズ」とも称する）がある。ノイズを構成する電磁波の波長λは、照射ノイズを構成する電磁波の波長であってもよいし、放射ノイズを構成する電磁波の波長であってもよい。 One type of noise composed of electromagnetic waves is noise (hereinafter referred to as noise) that is emitted outside the electronic control device 100 and attempts to irradiate electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. (also called "irradiation noise"). One type of noise composed of electromagnetic waves is noise (hereinafter referred to as "noise") that is radiated from electronic components 8 mounted on each of the first circuit board 4 and second circuit board 5 and tries to go to the outside of the electronic control device 100. (also called "radiated noise"). The wavelength λ of the electromagnetic waves that make up the noise may be the wavelength of the electromagnetic waves that make up the irradiation noise, or the wavelength of the electromagnetic waves that make up the radiation noise.
　車載機器のＥＭＩ（Electromagnetic Interference）の計測に係る規格として、ＣＩＳＰＲ２５が知られている。車載機器である電子制御装置１００は、ＣＩＳＰＲ２５にしたノイズ対策が実施される。放射エミッションの周波数範囲は、０．１５ＭＨｚ～２５００ＭＨｚとなる。例えば、ＣＩＳＰＲ２５の“ＧＬＯＮＡＳＳ Ｌ１”の周波数範囲は、１５９１ＭＨｚ～１６１６ＭＨｚとなり、高周波数といえる。波長λは、下記の式で求められる。
　　波長λ［ｍ］＝伝播速度Ｃ０［ｍ２／ｓ］／周波数［Ｈｚ］ CISPR25 is known as a standard related to measurement of EMI (Electromagnetic Interference) of in-vehicle equipment. The electronic control device 100, which is an in-vehicle device, is implemented with noise countermeasures that comply with CISPR25. The frequency range of radiated emissions is 0.15MHz to 2500MHz. For example, the frequency range of "GLONASS L1" of CISPR25 is 1591 MHz to 1616 MHz, which can be said to be a high frequency. The wavelength λ is determined by the following formula.
Wavelength λ [m] = Propagation speed C0 [m 2 /s] / Frequency [Hz]
　ＣＩＳＰＲ２５の“ＧＬＯＮＡＳＳ Ｌ１”の周波数範囲の最大値である１６１６ＭＨｚの波長λは、上記の式から１８５．５［ｍｍ］となる。したがって、１６１６ＭＨｚの放射ノイズを遮蔽したい場合、電子制御装置１００は、複数の第１導電部材１０ａ同士の距離、及び、複数の第２導電部材１０ｂ同士の距離を、それぞれ、例えば、λ／４＝４６［ｍｍ］以下とする。これにより、電子制御装置１００は、第１回路基板４と遮蔽部材９との間を通過しようとする放射ノイズを確実に減衰させることができる。 The wavelength λ of 1616 MHz, which is the maximum value of the frequency range of "GLONASS L1" of CISPR25, is 185.5 [mm] from the above formula. Therefore, when it is desired to shield 1616 MHz radiation noise, the electronic control device 100 sets the distances between the plurality of first conductive members 10a and the distances between the plurality of second conductive members 10b, respectively, for example, λ/4= It shall be 46 [mm] or less. Thereby, the electronic control device 100 can reliably attenuate radiation noise that attempts to pass between the first circuit board 4 and the shielding member 9.
　実施形態２の放熱板１５は、遮蔽部材９の内部に配置され、遮蔽部材９及び筐体１，２を貫通して又は介してヒートシンク１７に接続される。実施形態２の放熱板１５は、遮蔽部材９に接続される。実施形態２のヒートシンク１７は、放熱板１５を介して遮蔽部材９に接続される。放熱板１５、ヒートシンク１７及び遮蔽部材９は、一体的に形成される。実施形態２のブラケット１１は、ヒートシンク１７及び放熱板１５を介して、遮蔽部材９に接続される。実施形態２のブラケット１１は、アルミ、銅、炭素繊維、導電性樹脂、又は、非導電性材料の表面に導電性樹脂を被覆した材料を用いて形成される。 The heat sink 15 of the second embodiment is arranged inside the shielding member 9 and connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2. The heat sink 15 of the second embodiment is connected to the shielding member 9. The heat sink 17 of the second embodiment is connected to the shielding member 9 via the heat sink 15. The heat sink 15, the heat sink 17, and the shielding member 9 are integrally formed. The bracket 11 of the second embodiment is connected to the shielding member 9 via a heat sink 17 and a heat sink 15. The bracket 11 of the second embodiment is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
　放熱板１５、ヒートシンク１７及び遮蔽部材９は、電子制御装置１００の振動又は落下時の衝撃にも耐え得るように、筐体１，２に接続され固定される。これらの固定手法は、次のような手法であってもよい。例えば、遮蔽部材９の外面と筐体ベース１の内面とに、ネジ止め機構又はフック機構（爪と孔を用いた機構）を設けて両者を接続することによって固定する手法であってもよい。例えば、ヒートシンク１７と筐体ベース１の外面とに、ネジ止め機構又はフック機構を設けて両者を接続することによって固定する手法であってもよい。更に、筐体ベース１及び筐体カバー２においても、筐体ベース１と筐体カバー２とに、ネジ止め機構又はフック機構を設けて両者を接続することによって固定されてもよい。 The heat sink 15, the heat sink 17, and the shielding member 9 are connected and fixed to the casings 1 and 2 so as to be able to withstand vibrations of the electronic control device 100 or shocks when the electronic control device 100 is dropped. These fixing methods may be the following methods. For example, a method may be used in which a screw mechanism or a hook mechanism (a mechanism using a claw and a hole) is provided on the outer surface of the shielding member 9 and the inner surface of the housing base 1 to connect the two. For example, a method of fixing the heat sink 17 and the outer surface of the housing base 1 by providing a screw mechanism or a hook mechanism to connect the two may be used. Furthermore, the housing base 1 and the housing cover 2 may be fixed by providing a screw mechanism or a hook mechanism on the housing base 1 and the housing cover 2 to connect the two.
　以上のように、実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５の間隔に配置され、ノイズを遮蔽する遮蔽部材９と、第１回路基板４及び第２回路基板５と遮蔽部材９とを接続する導電部材１０ａ，１０ｂと、を更に備える。遮蔽部材９は、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８の周りを全周に亘って囲み、当該間隔に応じた幅を有する閉路を形成する枠体である。放熱板１５は、遮蔽部材９の内部に配置され、遮蔽部材９及び筐体１，２を貫通して又は介してヒートシンク１７に接続される。 As described above, the electronic control device 100 according to the second embodiment includes the shielding member 9 that is arranged at a distance between the first circuit board 4 and the second circuit board 5 and that shields noise, and the shielding member 9 that is arranged between the first circuit board 4 and the second circuit board 5, and It further includes conductive members 10a and 10b that connect the substrate 5 and the shielding member 9. The shielding member 9 is a frame that surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and forms a closed circuit having a width corresponding to the interval. be. The heat sink 15 is disposed inside the shielding member 9 and is connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2.
　これにより、遮蔽部材９は、電子部品８を照射しようとする照射ノイズや、電子部品８から放射された放射ノイズを遮断又は減衰させることができる。よって、実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８に対してＥＭＩ対策及びＥＭＳ対策を効果的に行うことができる。よって、実施形態２の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行いながら、複数の回路基板４，５に搭載された電子部品８のノイズ対策を行うことができる。 Thereby, the shielding member 9 can block or attenuate the irradiation noise attempting to irradiate the electronic component 8 and the radiation noise radiated from the electronic component 8. Therefore, the electronic control device 100 of the second embodiment can effectively take EMI countermeasures and EMS countermeasures for the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures can be taken for the electronic components 8 mounted on the electronic components 8.
　更に、実施形態２の電子制御装置１００において、放熱板１５、ヒートシンク１７及び遮蔽部材９は、一体的に形成される。 Furthermore, in the electronic control device 100 of the second embodiment, the heat sink 15, the heat sink 17, and the shielding member 9 are integrally formed.
　これにより、実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５の熱を、遮蔽部材９を介して放熱板１５に輸送することができる。更に、実施形態２の電子制御装置１００は、遮蔽部材９と放熱板１５との間の熱抵抗、及び、放熱板１５とヒートシンク１７との間の熱抵抗を低減することができる。したがって、実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５並びに電子部品８にて発生した熱を更に迅速に放熱板１５に輸送することができるので、電子部品８の温度を更に確実に低減することができる。よって、実施形態２の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を更に確実に行いながら、複数の回路基板４，５に搭載された電子部品８のノイズ対策を行うことができる。 Thereby, the electronic control device 100 of the second embodiment can transport the heat of the first circuit board 4 and the second circuit board 5 to the heat sink 15 via the shielding member 9. Furthermore, the electronic control device 100 of the second embodiment can reduce the thermal resistance between the shielding member 9 and the heat sink 15 and the thermal resistance between the heat sink 15 and the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can more quickly transport the heat generated in the first circuit board 4, the second circuit board 5, and the electronic component 8 to the heat sink 15, so that the electronic component 8 temperature can be further reliably reduced. Therefore, the electronic control device 100 of the second embodiment provides more reliable heat protection for the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures can be taken for the electronic components 8 mounted on the electronic components 5.
　更に、実施形態２の電子制御装置１００において、遮蔽部材９、放熱板１５及びヒートシンク１７のそれぞれは、アルミ、銅又は炭素繊維を用いて形成される。 Further, in the electronic control device 100 of the second embodiment, each of the shielding member 9, the heat sink 15, and the heat sink 17 is formed using aluminum, copper, or carbon fiber.
　これにより、実施形態２の電子制御装置１００は、特別な材料を用いることなく遮蔽部材９、放熱板１５及びヒートシンク１７を形成することができる。よって、実施形態２の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行いながら、複数の回路基板４，５に搭載された電子部品８のノイズ対策を容易に行うことができる。 Thereby, the electronic control device 100 of the second embodiment can form the shielding member 9, the heat sink 15, and the heat sink 17 without using special materials. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures for the electronic components 8 mounted on the electronic components 8 can be easily taken.
　更に、実施形態２の電子制御装置１００は、車両に搭載され、筐体１，２を車体のフレームグランドに接続するブラケット１１を更に備える。ブラケット１１は、ヒートシンク１７に接続される。ヒートシンク１７は、放熱板１５を介して遮蔽部材９に接続される。 Furthermore, the electronic control device 100 of the second embodiment further includes a bracket 11 that is mounted on a vehicle and connects the casings 1 and 2 to the frame ground of the vehicle body. Bracket 11 is connected to heat sink 17. The heat sink 17 is connected to the shielding member 9 via the heat sink 15.
　これにより、実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５並びに筐体１，２に帯電した静電気を、遮蔽部材９、放熱板１５、ヒートシンク１７及びブラケット１１を介して車両のフレームグランドに逃がすことができる。実施形態２の電子制御装置１００は、第１回路基板４及び第２回路基板５のそれぞれに搭載された電子部品８の誤動作又は故障のような、電子制御装置１００の誤動作又は故障を確実に防止することができる。よって、実施形態２の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行いながら、複数の回路基板４，５に搭載された電子部品８のノイズ対策だけでなく、静電気対策を行うことができる。 As a result, the electronic control device 100 of the second embodiment removes static electricity charged on the first circuit board 4, the second circuit board 5, and the casings 1 and 2 by using the shielding member 9, the heat sink 15, the heat sink 17, and the bracket 11. can escape to the vehicle frame ground through the The electronic control device 100 of the second embodiment reliably prevents malfunctions or failures of the electronic control device 100, such as malfunctions or failures of the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. can do. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Not only can noise countermeasures be taken against the electronic components 8 mounted on the electronic components 8, but also static electricity countermeasures can be taken.
　更に、実施形態２の電子制御装置１００において、ブラケット１１は、アルミ、銅、炭素繊維、導電性樹脂、又は、非導電性材料の表面に導電性樹脂を被覆した材料を用いて形成される。 Furthermore, in the electronic control device 100 of the second embodiment, the bracket 11 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
　これにより、実施形態２の電子制御装置１００は、特別な材料を用いることなくブラケット１１を形成することができる。よって、実施形態２の電子制御装置１００は、電子制御装置１００に備えられた複数の回路基板４，５に搭載された電子部品８の熱対策を確実に行いながら、複数の回路基板４，５に搭載された電子部品８のノイズ対策を容易に行うことができる。 Thereby, the electronic control device 100 of the second embodiment can form the bracket 11 without using any special material. Therefore, the electronic control device 100 of the second embodiment can securely take measures against the heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5 provided in the electronic control device 100. Noise countermeasures for the electronic components 8 mounted on the electronic components 8 can be easily taken.
　なお、本発明は上記の実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上記の実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、或る実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、或る実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 Note that the present invention is not limited to the above embodiments, and includes various modifications. For example, the above embodiments have been described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described. Furthermore, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace some of the configurations of each embodiment with other configurations.
　１，２…筐体、３…開口部、４…第１回路基板、４ａ…搭載面、５…第２回路基板、５ａ…搭載面、６…外部コネクタ、８…電子部品、９…遮蔽部材、９ａ…第１端面、９ｂ…第２端面、１０ａ，１０ｂ…導電部材、１０ａ…第１導電部材、１０ｂ…第２導電部材、１１…ブラケット、１４…スペーサ、１５…放熱板、１６ａ…第１台座、１６ｂ…第２台座、１７…ヒートシンク、１７ａ…フィン、１８…放熱材料、１９ａ…第１放熱柱、１９ｂ…第２放熱柱、１００…電子制御装置 DESCRIPTION OF SYMBOLS 1, 2... Housing, 3... Opening, 4... First circuit board, 4a... Mounting surface, 5... Second circuit board, 5a... Mounting surface, 6... External connector, 8... Electronic component, 9... Shielding member , 9a...first end face, 9b...second end face, 10a, 10b...conductive member, 10a...first conductive member, 10b...second conductive member, 11...bracket, 14...spacer, 15...heat sink, 16a...th 1 pedestal, 16b... second pedestal, 17... heat sink, 17a... fin, 18... heat radiation material, 19a... first heat radiation column, 19b... second heat radiation column, 100... electronic control device

Claims (13)

  1. 　それぞれの電子部品の搭載面が間隔を空けて対向配置された第１回路基板及び第２回路基板と、
    　前記第１回路基板に搭載された前記電子部品と前記第２回路基板に搭載された前記電子部品との間に配置された放熱板と、
    　前記電子部品と前記放熱板とに接触する放熱材料と、
    　前記第１回路基板及び前記第２回路基板、前記放熱板並びに前記放熱材料を収容する筐体と、
    　前記筐体の外部に設けられたヒートシンクと、を備え、
    　前記放熱板は、前記筐体を貫通して又は介して前記ヒートシンクに接続される
    　ことを特徴とする電子制御装置。     A first circuit board and a second circuit board in which mounting surfaces of respective electronic components are arranged facing each other with an interval between them;
    a heat sink disposed between the electronic component mounted on the first circuit board and the electronic component mounted on the second circuit board;
    a heat dissipation material that contacts the electronic component and the heat dissipation plate;
    a casing that accommodates the first circuit board, the second circuit board, the heat sink, and the heat sink material;
    A heat sink provided outside the housing,
    The electronic control device is characterized in that the heat sink is connected to the heat sink through or through the housing.
  2. 　前記放熱板は、前記第１回路基板に搭載された前記電子部品に向かって突出する第１台座と、前記第２回路基板に搭載された前記電子部品に向かって突出する第２台座と、を有し、
    　前記放熱材料は、前記第１回路基板に搭載された前記電子部品と前記第１台座との隙間、及び、前記第２回路基板に搭載された前記電子部品と前記第２台座との隙間を充填する
    　ことを特徴とする請求項１に記載の電子制御装置。     The heat sink includes a first pedestal that protrudes toward the electronic component mounted on the first circuit board, and a second pedestal that protrudes toward the electronic component mounted on the second circuit board. have,
    The heat dissipation material fills a gap between the electronic component mounted on the first circuit board and the first pedestal, and a gap between the electronic component mounted on the second circuit board and the second pedestal. The electronic control device according to claim 1, characterized in that:
  3. 　前記筐体は、外部機器に接続される外部コネクタを露出させる開口部を有し、
    　前記ヒートシンクは、前記筐体の前記開口部から離隔し、且つ、発熱量の小さな前記電子部品よりも発熱量の大きな前記電子部品に近接する前記筐体の外面に設けられる
    　ことを特徴とする請求項１に記載の電子制御装置。     The casing has an opening that exposes an external connector connected to an external device,
    The heat sink is provided on an outer surface of the casing that is spaced apart from the opening of the casing and close to the electronic component that generates a larger amount of heat than the electronic component that generates a smaller amount of heat. Item 1. The electronic control device according to item 1.
  4. 　前記ヒートシンクは、前記筐体の設置姿勢に関わらず、重力方向に沿って延び水平方向に互いに離隔して配置された複数のフィンを有する
    　ことを特徴とする請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the heat sink has a plurality of fins extending along the direction of gravity and spaced apart from each other in the horizontal direction, regardless of the installation orientation of the housing.
  5. 　前記放熱板は、前記第１回路基板の前記搭載面において前記電子部品が搭載されていない未搭載領域に向かって突出する第１放熱柱と、前記第２回路基板の前記搭載面において前記電子部品が搭載されていない未搭載領域に向かって突出する第２放熱柱と、を有し、
    　前記放熱材料は、前記第１回路基板の前記未搭載領域と前記第１放熱柱との隙間、及び、前記第２回路基板の前記未搭載領域と前記第２放熱柱との隙間を充填する
    　ことを特徴とする請求項１に記載の電子制御装置。     The heat dissipation plate includes a first heat dissipation column that protrudes toward an unmounted area where the electronic component is not mounted on the mounting surface of the first circuit board, and a first heat dissipation column that protrudes toward an unmounted area where the electronic component is not mounted on the mounting surface of the second circuit board. a second heat dissipation column that protrudes toward an unmounted area where is not mounted;
    The heat radiation material fills a gap between the unmounted area of the first circuit board and the first heat radiation pillar, and a gap between the unmounted area of the second circuit board and the second heat radiation pillar. The electronic control device according to claim 1, characterized in that:
  6. 　前記放熱板及び前記ヒートシンクのそれぞれは、アルミ、銅又は炭素繊維を用いて形成される
    　ことを特徴とする請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein each of the heat sink and the heat sink is formed using aluminum, copper, or carbon fiber.
  7. 　前記第１回路基板及び前記第２回路基板の前記間隔に配置され、ノイズを遮蔽する遮蔽部材と、
    　前記第１回路基板及び前記第２回路基板と前記遮蔽部材とを接続する導電部材と、を更に備え、
    　前記遮蔽部材は、前記第１回路基板及び前記第２回路基板のそれぞれに搭載された前記電子部品の周りを全周に亘って囲み前記間隔に応じた幅を有する閉路を形成する枠体であり、
    　前記放熱板は、前記遮蔽部材の内部に配置され、前記遮蔽部材及び前記筐体を貫通して又は介して前記ヒートシンクに接続される
    　ことを特徴とする請求項６に記載の電子制御装置。     a shielding member disposed at the interval between the first circuit board and the second circuit board and shielding noise;
    further comprising a conductive member connecting the first circuit board, the second circuit board, and the shielding member,
    The shielding member is a frame that surrounds the entire circumference of the electronic component mounted on each of the first circuit board and the second circuit board and forms a closed circuit having a width corresponding to the interval. ,
    The electronic control device according to claim 6, wherein the heat sink is disposed inside the shielding member and is connected to the heat sink through or through the shielding member and the housing.
  8. 　前記放熱板、前記ヒートシンク及び前記遮蔽部材は、一体的に形成される
    　ことを特徴とする請求項７に記載の電子制御装置。     The electronic control device according to claim 7, wherein the heat sink, the heat sink, and the shielding member are integrally formed.
  9. 　前記遮蔽部材、前記放熱板及び前記ヒートシンクのそれぞれは、アルミ、銅又は炭素繊維を用いて形成される
    　ことを特徴とする請求項８に記載の電子制御装置。     The electronic control device according to claim 8, wherein each of the shielding member, the heat sink, and the heat sink is formed using aluminum, copper, or carbon fiber.
  10. 　前記電子制御装置は、車両に搭載され、
    　前記筐体を車体のフレームグランドに接続するブラケットを更に備え、
    　前記ブラケットは、前記ヒートシンクに接続され、
    　前記ヒートシンクは、前記放熱板を介して前記遮蔽部材に接続される
    　ことを特徴とする請求項７に記載の電子制御装置。     The electronic control device is mounted on a vehicle,
    further comprising a bracket that connects the casing to a frame ground of the vehicle body,
    the bracket is connected to the heat sink;
    The electronic control device according to claim 7, wherein the heat sink is connected to the shielding member via the heat sink.
  11. 　前記ブラケットは、アルミ、銅、炭素繊維、導電性樹脂、又は、非導電性材料の表面に導電性樹脂を被覆した材料を用いて形成される
    　ことを特徴とする請求項１０に記載の電子制御装置。     The electronic control device according to claim 10, wherein the bracket is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with conductive resin. Device.
  12. 　前記第１回路基板及び前記第２回路基板の前記間隔を保持するスペーサを更に備え、
    　前記スペーサは、前記放熱板に固定される
    　ことを特徴とする請求項１に記載の電子制御装置。     further comprising a spacer that maintains the distance between the first circuit board and the second circuit board,
    The electronic control device according to claim 1, wherein the spacer is fixed to the heat sink.
  13. 　前記筐体は、金属製又は樹脂製である
    　ことを特徴とする請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the housing is made of metal or resin.
PCT/JP2022/032831 2022-08-31 2022-08-31 Electronic control device WO2024047810A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379269A (en) * 1976-12-22 1978-07-13 Mitsubishi Electric Corp Method of cooling electronic device components
JPS6367800A (en) * 1986-09-09 1988-03-26 富士通株式会社 Structure for radiation for electronic equipment
JPH01165693U (en) * 1988-05-10 1989-11-20
JP2001257491A (en) * 2000-03-14 2001-09-21 Mitsubishi Electric Corp Electronic controller for automobile
JP2016059167A (en) * 2014-09-09 2016-04-21 株式会社デンソー Power conversion device and manufacturing method for power conversion device
WO2016163135A1 (en) * 2015-04-08 2016-10-13 三菱電機株式会社 Electronic module and electronic device
JP2018513561A (en) * 2015-04-10 2018-05-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ Controller unit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379269A (en) * 1976-12-22 1978-07-13 Mitsubishi Electric Corp Method of cooling electronic device components
JPS6367800A (en) * 1986-09-09 1988-03-26 富士通株式会社 Structure for radiation for electronic equipment
JPH01165693U (en) * 1988-05-10 1989-11-20
JP2001257491A (en) * 2000-03-14 2001-09-21 Mitsubishi Electric Corp Electronic controller for automobile
JP2016059167A (en) * 2014-09-09 2016-04-21 株式会社デンソー Power conversion device and manufacturing method for power conversion device
WO2016163135A1 (en) * 2015-04-08 2016-10-13 三菱電機株式会社 Electronic module and electronic device
JP2018513561A (en) * 2015-04-10 2018-05-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ Controller unit

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