JP6053907B1 - Chiller device - Google Patents

Abstract

The present invention provides a chiller device having a low-cost configuration and a function capable of simultaneously and accurately controlling a workpiece having different heat retention range conditions without overloading a compressor without impairing cooling performance. In this apparatus, a bypass flow path including a first flow path to a fourth flow path connected to a refrigeration cycle 100 sharing an evaporator 101-1 of a refrigerant cycle 200-1 to which a work W1 is connected. When flowing the cooled refrigerant to the evaporator 101-2 of the refrigerant cycle 200-2 to which the workpiece W2 is connected through the CPU, the CPU PID-calculated the refrigerant pressure at the sensor P of the cycle 100 and the refrigerant temperature at the sensor T3. Based on the pulse signal generated based on the result, the opening degree of the valve EV2 of the second flow path is made constant, and the refrigerant flow rate circulating from there to the electric compressor 102 via a part of the first flow path is the target. The opening of the third flow path valve EV3 is variably set so as to converge to the value, and a drive control signal is output to variably control the operating frequency in the compressor 102 within a predetermined range. [Selection] Figure 1

Description

  The present invention relates to a chiller device for keeping temperature by selectively setting a temperature within a predetermined temperature range (for example, −10 ° C. to 100 ° C.) with various customer devices to be kept warm as workpieces. A function of controlling the number of rotations of the electric compressor provided in the refrigeration cycle for cooling and the heating temperature of the heating device provided in the refrigerant cycle for heating by the control device according to the temperature difference between the set temperature and the workpiece temperature. It relates to a chiller device.

  Conventionally, in this type of chiller device, as a single type proposed by the present applicant, a set temperature is set at a heat retention setting with a small temperature difference close to the workpiece temperature (for example, 5 ° C. to 10 ° C.), particularly in a refrigeration cycle Improved the structure and function of the electric compressor that keeps operating even though there is almost no refrigerant temperature difference between the refrigerant suction side and the refrigerant discharge side of the evaporator and the refrigerant does not need to flow to the evaporator. A “chiller device” (see Patent Document 1) can be mentioned.

Japanese Patent No. 5721875

  The chiller device according to Patent Document 1 described above uses an electric compressor in the refrigeration cycle, and when a highly efficient Freon gas (such as R410A) is used as the refrigerant, the refrigeration function is significantly improved over previous products. The liquid refrigerant of the refrigerant cycle (the refrigerant cycle may be called a brine supply circuit in order to circulate a heat medium called brine in practical use) can be effectively exchanged by cooling with an evaporator, As a function, it performs rotation control of the electric compressor according to the heat load, and realizes high-precision heat retention control for the customer device (work) having two stages of cooling and heating.

  However, in the case of the chiller device according to Patent Document 1, on the basic structure, one refrigeration cycle called a single type and one refrigerant cycle share one evaporator, and become a customer device on the refrigerant cycle side. Since the specification is such that one workpiece can be kept warm, there is a problem that it is difficult to meet the purpose of use in which different temperature keeping range conditions are required at the same time as when the customer's device is a semiconductor etching device, for example.

  Therefore, although it is assumed that the refrigerant cycle side is multi-staged to form multiple systems and the work can be connected separately in each system, the refrigerant cycle including the evaporator is actually simply configured in multiple stages. Even if it tries to do so, the refrigerant routing and the flow rate control using the bypass flow path by the piping become complicated, and the cooling performance in the refrigeration cycle corresponding to the cooling of the liquid refrigerant by the added evaporator is impaired. At the same time, since the burden of the heat load increase also increases in the rotation control of the electric compressor, it is difficult to easily modify it. Therefore, it is desired to commercialize a chiller device that has a low-cost configuration and does not impair the cooling performance without overloading the compressor, and capable of simultaneously maintaining high-precision heat control of customer devices having different heat retention range conditions. However, it is not realized at present.

  The present invention has been made to solve such problems, and its technical problem is that it has a low-cost configuration and does not impair the cooling performance without overloading the compressor. It is intended to provide a chiller device having a function capable of simultaneously controlling the temperature with high accuracy.

In order to achieve the above technical problem, according to one aspect of the present invention, there is provided a refrigeration cycle in which a refrigerant for cooling circulates and a first evaporator provided in the refrigeration cycle in which a liquid refrigerant for heating circulates. The refrigerant circulates in the second evaporator separate from the first evaporator through one refrigerant cycle and a bypass passage bypassed by piping at a predetermined location of the refrigeration cycle, and for heating in a separate system A predetermined temperature range for a user using as a workpiece various customer devices that are intervened and connected to the second refrigerant cycle in which the liquid refrigerant circulates, the first refrigerant cycle, and the second refrigerant cycle, respectively. And the temperature of the electric compressor provided in the refrigeration cycle, as well as for heating the liquid refrigerant circulating through the first refrigerant cycle and the second refrigerant cycle. The workpiece temperature detected by the first temperature sensor provided near the workpiece side of the set temperature set by the user and the first refrigerant cycle and the second refrigerant cycle as the heating temperature in the heating device in chiller apparatus having a control device for controlling in response to the temperature difference between the temperature, and the first refrigerant cycle and second refrigerant cycle, the refrigerant discharged from the first evaporator and a second evaporator A second temperature sensor provided on the front side of the liquid refrigerant inflow to the heating device to detect the temperature of the liquid refrigerant , and a liquid refrigerant for the workpiece on the refrigerant suction side of the first evaporator and the second evaporator. A fourth temperature sensor provided on the outflow side for detecting the temperature of the liquid refrigerant, and the refrigeration cycle is on the refrigerant suction side of the electric compressor and on the refrigerant discharge side of the first evaporator Provided refrigerant temperature A third temperature sensor for detecting a pressure sensor for detecting a refrigerant pressure is provided to the third near the temperature sensor in the refrigerant suction side of the electric compressor, the refrigerant suction side of the first evaporator A first refrigerant supply electronic expansion valve for adjusting the flow rate, which is connected via an intervening connection, and the bypass flow path from the refrigerant discharge side of the second evaporator in the second refrigerant cycle to the first in the refrigeration cycle A first flow path connected to a position between the refrigerant discharge side of the evaporator and the refrigerant suction side of the electric compressor, and an electronic expansion valve for high-pressure refrigerant for adjusting the flow rate from the middle position of the first flow path A second flow path connected to a location between the refrigerant suction side of the condenser provided in the refrigeration cycle and the refrigerant discharge side of the electric compressor, and the flow path adjustment for extending the first flow path Refrigerant of condenser in refrigeration cycle through electronic expansion valve for injection A third flow path connected to a location on the refrigerant flow pre-acquisition side of the first refrigerant supply electronic expansion valve between the discharge side and the refrigerant suction side of the first evaporator, and a first refrigerant supply in the refrigeration cycle The flow rate adjustment second portion is located closer to the refrigerant suction side of the first evaporator than the third flow path of the electronic expansion valve before the refrigerant flow is obtained and to the refrigerant suction side of the second evaporator in the second refrigerant cycle . And a fourth flow path connected by interposing and connecting two refrigerant supply electronic expansion valves, and the control device is proportional, integral, and differential with respect to the workpiece temperature detected by the first temperature sensor. It controls each of the heating amount of the heating device by the generated control signals in a first refrigerant cycle and second refrigerant cycle based on a result of the PID operation including liquid respectively detected by the second temperature sensor Proportional, integral, and refrigerant temperature The pulse signal generated based on the result of the PID operation including the partial opening and closing at the first refrigerant supply electronic expansion valve and the second refrigerant supply electronic expansion valve respectively controlled to the refrigeration cycle and the bypass channel The refrigerant flow rate was controlled, and the PID calculation including the proportional, integral and derivative results for the refrigerant pressure detected by the pressure sensor and the PID calculation including the proportional, integral and derivative results for the refrigerant temperature detected by the third temperature sensor the pulse signal generated based on the results and to maintain the opening degree of the high-pressure refrigerant electronic expansion valve constant over a portion of the first flow path from the second flow path in the bypass flow path the frozen The opening of the electronic expansion valve for injection is variably set so that the high-pressure refrigerant bypass operation flow rate that circulates to the refrigerant suction side of the electric compressor of the cycle converges to the target predetermined value. In addition to controlling the refrigerant flow rate in the bypass flow path and the entire refrigeration cycle, the drive control signal generated to drive the electric compressor is output to the inverter, so that the operating frequency of the electric compressor is reduced. A variable control is performed in accordance with the refrigerant temperature within a predetermined range.

  According to the chiller apparatus of the present invention, the above-described configuration provides a function capable of simultaneously maintaining heat with high accuracy for a workpiece having different heat retention range conditions without overloading the compressor without impairing the cooling performance with an inexpensive configuration. Be able to. Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

1 is an overall schematic diagram showing a basic configuration of a chiller device according to an embodiment of the present invention including a cooling circuit for connecting to a work in a refrigerant cycle and cooling a condenser in a refrigeration cycle. It is the schematic of the principal part shown in order to demonstrate the flow of the refrigerant | coolant centering on the bypass flow path with which the chiller apparatus shown in FIG. 1 is equipped. The high-pressure refrigerant bypass that flows through the second flow path and a part of the first flow path in the bypass flow path by the control device provided in the chiller device shown in FIG. 1 and circulates to the refrigerant suction side of the electric compressor of the refrigeration cycle. It is the schematic diagram which contrasted and showed the high-pressure refrigerant bypass operation flow rate-compressor operation frequency characteristic with respect to the elapsed time shown in order to demonstrate variable control of the operation frequency in the electric compressor according to the operation flow rate. It is a Mollier diagram shown in order to demonstrate the cooling performance in the chiller apparatus shown in FIG.

  Hereinafter, examples of the chiller device of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows the basic configuration of a chiller device according to an embodiment of the present invention for connection to the workpieces W1 and W2 in the refrigerant cycles 200-1 and 200-2 and for cooling the condenser 103 in the refrigeration cycle 100. 1 is an overall schematic diagram including a cooling circuit 300. FIG.

Referring to FIG. 1, this chiller device has a basic configuration in which a refrigeration cycle 100 in which a cooling refrigerant (R410 and the like) circulates and a first evaporator (heat exchanger) 101 provided in the refrigeration cycle 100 are provided . -1 is shared with the first refrigerant cycle 200-1 in which the liquid refrigerant for heating circulates, and the first evaporator 101-1 through a bypass passage bypassed by piping at a predetermined location of the refrigeration cycle 100. Is a second refrigerant cycle 200-2 in which a refrigerant circulates in a separate second evaporator (heat exchanger) 101-2 and a liquid refrigerant for heating circulates in a separate system, and a first refrigerant Various customer devices that are intervened and connected to the cycle 200-1 and the second refrigerant cycle 200-2 and are to be kept warm are workpieces W1 and W2, and selective temperature setting within a predetermined temperature range for the user ( War W1 is −10 ° C. to + 100 ° C., and the workpiece W2 is + 30 ° C. to + 100 ° C.), the rotation speed of the electric compressor 102 provided in the refrigeration cycle 100, and the first refrigerant The heating temperature in the heating devices (heaters) 202-1 and 202-2 for heating the liquid refrigerant circulating in the cycle 200-1 and the second refrigerant cycle 200-2 is set to the set temperature set by the user and The temperature of the first refrigerant cycle 200-1 and the second refrigerant cycle 200-2 with the workpiece temperature detected by the first temperature sensors T1-1, T1-2 provided at the positions closer to the workpieces W1, W2 respectively. And a control device configured as a device control unit having a CPU (Central Processing Unit) function to control according to the difference. It is.

  The workpieces W1 and W2 here are assumed to correspond to the purpose of use in which different heat retention range conditions are required at the same time as in the case where the customer apparatus is a semiconductor etching apparatus, and the set temperature for heat retention of the work W1. The range of −10 ° C. to + 100 ° C. can be applied to the lower electrode, and the set temperature range + 30 ° C. to + 100 ° C. for keeping the work W2 can be applied to the upper electrode. The first temperature sensors T1-1 and T1-2 for detecting the workpiece temperatures of the workpieces W1 and W2 are from the refrigerant tanks 201-1 and 201-2 provided in the refrigerant cycles 200-1 and 200-2. It is provided on the refrigerant discharge side of the pumps 203-1 and 203-2 for sucking the liquid refrigerant, on the refrigerant inflow side near the workpieces W1 and W2, and detects the liquid refrigerant temperature and sends it to the device control unit (CPU). In addition, the fourth temperature sensors T4-1 and T4 are provided on the refrigerant suction side of the evaporators 101-1 and 101-2 and on the liquid refrigerant outflow side near the workpieces W1 and W2. -2 may be input to the equipment control unit (CPU), and the workpiece temperature may be detected using both detection results. Incidentally, since the first temperature sensors T1-1 and T1-2 require high detection accuracy, it is necessary to use a Pt sensor using a platinum resistance band that can change the resistance value from 100 ohms to 0 ohms. preferable. On the other hand, the fourth temperature sensors T4-1 and T4-2 do not require detection accuracy as much as the first temperature sensors T1-1 and T1-2. It is preferable to use a thermocouple sensor using a pair.

  Among them, the refrigeration cycle 100 compresses the refrigerant gas by the electric compressor 102 and sends it as a high-pressure gas to the discharge-side condenser 103, and the condenser 103 condenses the high-pressure gas and schematically shows a decompression mechanism. The circuit configuration is such that the pressure is reduced via the air and then sent to the evaporator 101-1, and the evaporator 101-1 evaporates the decompressed low-pressure gas and sucks it into the suction side of the electric compressor 102 to repeat the compression again. Primary temperature adjustment circuit. Further, here, the pipe is connected to the condenser 103 so as to be folded back, and the cooling water is taken in via a schematic valve provided on the pipe on the inlet side to cool the inside of the condenser 103 and then the outlet side. A cooling circuit 300 having a structure of returning to the outside via a water control valve (WPR) provided in the pipe is provided. In addition, the cooling function for the condenser 103 by the cooling circuit 300 described here may be configured to cool with cold air using a cooling fan.

  The refrigerant cycle 200-1 shares the evaporator 101-1 of the refrigeration cycle 100, collects and stores the liquid refrigerant in the refrigerant tank 201-1, and also has a heating device (heater) 201 attached to the refrigerant tank 201-1. -1 of a circuit configuration in which the liquid refrigerant is appropriately heated at -1, or the liquid refrigerant sucked by the pump 203-1 from the refrigerant tank 201-1 without being heated is returned to the evaporator 101-1 through the work W1. Secondary temperature adjustment circuit. Further, a flow rate detection sensor F is provided in the piping on the outflow side of the liquid refrigerant in the pump 203-1, and the flow rate of the liquid refrigerant detected by the flow rate detection sensor F is input to an equipment control unit (CPU) for equipment control. The inverter INV to which the unit (CPU) is attached is driven to control the liquid refrigerant suction amount in the pump 203-1. Thereby, in the refrigerant | coolant tank 201-1, a liquid refrigerant | coolant is kept by the logic (LG) and a substantially constant quantity.

  The refrigerant cycle 200-2 has the same configuration, and the refrigerant circulates in the evaporator 101-2 through a bypass passage, which will be described in detail later, after being bypassed by piping at a predetermined location of the refrigeration cycle 100. The refrigerant is collected and stored in the refrigerant tank 201-2, and the liquid refrigerant is appropriately heated by the heating device (heater) 201-2 attached to the refrigerant tank 201-2, or the refrigerant tank 201-2 is heated without being heated. Is a secondary temperature adjustment circuit of another system having a circuit configuration in which the liquid refrigerant sucked by the pump 203-2 is returned to the evaporator 101-2 through the work W2. Also here, the flow rate detection sensor F is provided in the pipe on the outflow side of the liquid refrigerant in the pump 203-2, and the flow rate of the liquid refrigerant detected by the flow rate detection sensor F is input to an equipment control unit (CPU) for equipment control. The inverter INV to which the unit (CPU) is attached is driven to control the suction amount of the liquid refrigerant in the pump 203-2, and the liquid refrigerant is kept at a substantially constant amount by the logic (LG) in the refrigerant tank 201-2. . In addition, although a detailed structure is schematically shown, a valve is schematically provided in a pipe connected to the liquid refrigerant discharge side of the evaporators 101-1 and 101-2 and pipes connected to the refrigerant tanks 201-1 and 201-2. The valve is connected to a common pipe and connected to a drain for drainage treatment to drain the liquid, or a valve schematically shown on the pipes on the inflow side and the outflow side of the liquid refrigerant in the workpieces W1 and W2. It is preferable to employ a structure that prevents leakage of liquid refrigerant when the workpieces W1 and W2 are piped to the local portions of the refrigerant cycles 200-1 and 200-2.

Further, the refrigerant cycles 200-1 and 200-2 are provided on the liquid refrigerant discharge side of the evaporators 101-1 and 101-2 on the front side of the liquid refrigerant inflow to the heating devices 202-1 and 202-2, respectively. Second temperature sensors T2-1 and T2-2 for detecting the refrigerant temperature are included. In addition, the refrigeration cycle 100 is provided on the refrigerant suction side of the electric compressor 102 and on the refrigerant discharge side of the evaporator 101-1, and is electrically driven with a third temperature sensor T3 for detecting the refrigerant temperature. A pressure sensor P provided in the vicinity of the third temperature sensor T3 on the refrigerant suction side of the compressor 102 to detect the refrigerant pressure, and a first for flow rate adjustment connected to the refrigerant suction side of the evaporator 101-1 . And an electronic expansion valve EV1-1 for refrigerant supply. Incidentally, the second temperature sensors T2-1 and T2-2 here are also preferably Pt sensors using a platinum resistance band because high detection accuracy is required. Further, the third temperature sensor T3 is preferably a thermocouple sensor using a thermocouple similarly to the fourth temperature sensors T4-1 and T4-2.

The functional configuration described above can be implemented by applying a well-known technique. The features according to the embodiment will be described below. The structural feature is the above-described bypass flow path, specifically speaking, from the refrigerant discharge side of the evaporator 101-2 in the second refrigerant cycle 200-2 to the evaporator 101-1 in the refrigeration cycle 100. A first flow path connected to a location between the refrigerant discharge side and the refrigerant suction side of the electric compressor 102, and a high-pressure refrigerant electronic expansion valve EV2 for adjusting the flow rate are interposed from a midpoint of the first flow path. The second flow path connected to the location between the refrigerant suction side of the condenser 103 and the refrigerant discharge side of the electric compressor 102 provided in the refrigeration cycle 100, and the flow rate adjustment extending from the first flow path Before obtaining the refrigerant flow of the refrigerant supply electronic expansion valve EV1-1 between the refrigerant discharge side of the condenser 103 and the refrigerant suction side of the evaporator 101-1 in the refrigeration cycle 100 via the injection electronic expansion valve EV3. ~ side A third flow path connected to the location, a location closer to the refrigerant suction side of the evaporator 101-1 than the third flow path on the refrigerant supply electronic expansion valve EV <b> 1-1 in the refrigeration cycle 100 before obtaining the refrigerant flow, and the second flow path. And a fourth flow path that is connected to the refrigerant suction side of the evaporator 101-2 in the refrigerant cycle 200-2 by interposing and connecting the second refrigerant supply electronic expansion valve EV1-2 for flow rate adjustment. Formed. Incidentally, each of the refrigerant supply electronic expansion valves EV1-1 and EV1-2, the high-pressure refrigerant electronic expansion valve EV2, and the injection electronic expansion valve EV3 includes a stepping motor disclosed in Patent Document 1. It is preferable to apply an electronic expansion valve having the same structure.

Moreover, the control characteristic predicated on such a bypass flow path structure is borne by the processing function of the above-described device control unit (CPU). More specifically, the refrigerant cycle 200-1 is generated by a control signal generated based on a result of PID calculation including proportionality, integral, and differentiation with respect to the workpiece temperatures detected by the first temperature sensors T1-1 and T1-2. , 200-2, the respective heating amounts of the heating devices 202-1 and 202-2 are controlled, and the liquid refrigerant temperatures detected by the second temperature sensors T2-1 and T2-2 are proportional, integral, and differential, respectively. Control the opening and closing of the refrigerant supply electronic expansion valves EV1-1 and EV1-2 by pulse signals generated based on the PID calculation result including the refrigerant flow in the refrigeration cycle 100 and the bypass flow path, About the refrigerant | coolant pressure detected by the 3rd temperature sensor T3 and the result of PID calculation including proportionality, integral, and a differentiation about the refrigerant | coolant pressure detected by the pressure sensor P For example, the opening degree of the electronic expansion valve EV2 for high-pressure refrigerant is constant (for example, 20% with respect to 100% full open) by a pulse signal generated based on the result of PID calculation including integration and differentiation. The target is the high-pressure refrigerant bypass operation flow rate that is maintained and circulated from the second flow path in the bypass flow path to the refrigerant suction side of the electric compressor 102 of the refrigeration cycle 100 via a part of the first flow path. The opening of the electronic expansion valve EV3 for injection is variably set so as to be converged to a predetermined value to control the refrigerant flow rate in the entire bypass flow path and the refrigeration cycle 100, and the electric compressor 102 is driven. The drive control signal generated for this purpose is output to the inverter INV, and the operating frequency of the electric compressor 102 is set within a predetermined range according to the refrigerant temperature detected by the third temperature sensor T3. Variably controls.

  In addition, the device control unit (CPU) is detected by the first temperature sensors T1-1 and T1-2 and the fourth temperature sensors T4-1 and T4-2 in the refrigerant cycles 200-1 and 200-2, respectively. The result of individually calculating the thermal load amount on the work W1, W2 side based on the difference value of the liquid refrigerant temperature obtained by the PID calculation based on the refrigerant pressure detected by the pressure sensor P and the third temperature sensor T3 Feed-forward control is performed to correct the cooling control by reflecting the result of the PID calculation based on the detected refrigerant temperature. More specifically, the device control unit (CPU), when there is a thermal load according to the result of calculating the amount of heat load for the opening at the injection electronic expansion valve EV3, than when there is no heat load. In addition to increasing the opening, the electric compressor of the refrigeration cycle 100 than during the temperature raising operation to the workpieces W1 and W2 by heating in the heating devices 202-1 and 202-2 in the refrigerant cycles 200-1 and 200-2. The opening degree at the electronic expansion valve EV3 for injection during the temperature lowering operation to the workpieces W1 and W2 by heat exchange in the evaporators 101-1 and 101-2 by driving the 102 is increased.

  FIG. 2 is a schematic view of a main part shown to explain the flow of the refrigerant centering on the bypass flow path provided in the chiller device according to the embodiment.

  Referring to FIG. 2, the electric compressor 102 of the refrigeration cycle 100 can be performed in the chiller apparatus according to the present embodiment by performing various controls by the device control unit (CPU) targeting the above-described bypass flow path structure. The refrigerant gas (referred to as hot gas) compressed to a high pressure by the first flow passes through the high-pressure refrigerant electronic expansion valve EV2 in which the opening degree in the second flow path of the bypass flow path is maintained constant (20%). A state is shown in which the refrigerant circulates to the refrigerant suction side of the electric compressor 102 of the refrigeration cycle 100 via a part of the path. Further, at this time, as shown in a dotted frame in FIG. 2, the opening degree of the electronic expansion valve EV3 for injection is set variably, and the refrigerant gas from the condenser 103 is electrically driven via the third flow path. Although it flows to the refrigerant suction side of the compressor 102, the opening degree is set depending on the performance of the electric compressor 102. For example, as a basic performance of the electric compressor 102, assuming a use range in which the discharge pressure is 120 ° C. or less and the suction pressure is 0.23 MPa or more at −24 ° C., the liquid to the work W1 of the refrigerant cycle 200-1 is assumed. When the target value of the refrigerant supply is 0 ° C. or less and the target value of the suction pressure for the electric compressor 102 in the electronic expansion valve EV2 for high pressure refrigerant is −20 ° C., the electric compressor 102 in the electronic expansion valve EV3 for injection is −0.3 MPa. The target value of the suction temperature for the electric compressor 102 in the high-pressure refrigerant electronic expansion valve EV2 when the target value of the suction temperature is -15 ° C. and the target value of the liquid refrigerant supply to the work W1 of the refrigerant cycle 200-1 exceeds 0 ° C. The value is 0.47 MPa at −10 ° C., and the target value of the suction temperature for the electric compressor 102 in the electronic expansion valve EV3 for injection is −5 ° C. Assume that control conditions.

  If the chiller device is operating under such control conditions and the target value of liquid refrigerant supply to the workpiece W1 of the refrigerant cycle 200-1 is set to -10 ° C and there is no thermal load, the electric type in the electronic expansion valve EV2 for high pressure refrigerant The suction pressure for the compressor 102 is 0.30 MPa, the opening degree of the electronic expansion valve EV2 for high-pressure refrigerant is 20%, the suction temperature for the electric compressor 102 in the injection electronic expansion valve EV3 is −15 ° C., and the electronic expansion valve EV3 for injection A case where the opening degree is 20% can be illustrated. In addition, when the chiller device is in operation and the target value of liquid refrigerant supply to the work W1 of the refrigerant cycle 200-1 is set to -10 ° C. and there is a thermal load, the electric compressor in the high-pressure refrigerant electronic expansion valve EV2 The suction pressure with respect to 102 is 0.30 MPa, the opening degree of the high-pressure refrigerant electronic expansion valve EV2 is 20%, the suction temperature with respect to the electric compressor 102 in the injection electronic expansion valve EV3 is −15 ° C., and the injection electronic expansion valve EV3 is opened. A case where the degree is 50% can be exemplified. Furthermore, when the chiller device is in operation and the target value of liquid refrigerant supply to the workpiece W1 of the refrigerant cycle 200-1 is set to 0 ° C. or higher and there is no thermal load, the electric compressor 102 in the high-pressure refrigerant electronic expansion valve EV2 is used. The suction pressure is 0.47 MPa, the opening degree of the high-pressure refrigerant electronic expansion valve EV2 is 20%, the suction temperature to the electric compressor 102 in the injection electronic expansion valve EV3 is −5 ° C., and the opening degree of the injection electronic expansion valve EV3 Can be exemplified as 20%. In addition, if the chiller device is in operation and the target value of liquid refrigerant supply to the workpiece W1 of the refrigerant cycle 200-1 is set to 0 ° C. or higher and there is no thermal load, the electric compressor in the high-pressure refrigerant electronic expansion valve EV2 The suction pressure with respect to 102 is 0.47 MPa, the opening degree of the high-pressure refrigerant electronic expansion valve EV2 is 20%, the suction temperature with respect to the electric compressor 102 in the injection electronic expansion valve EV3 is −5 ° C., and the injection electronic expansion valve EV3 is opened. A case where the degree is 50% can be exemplified. In addition, when the target value of liquid refrigerant supply is set from −10 ° C. to + 100 ° C. during the temperature rising operation to the workpiece W1 by heating with the heating device 202-1 in the refrigerant cycle 200-1, the high pressure refrigerant is set. The suction pressure for the electric compressor 102 in the electronic expansion valve EV2 is 0.47 MPa, the opening degree of the electronic expansion valve EV2 for high-pressure refrigerant is 20%, and the suction temperature for the electric compressor 102 in the injection electronic expansion valve EV3 is -5. A case where the opening degree of the electronic expansion valve EV3 for injection is 20% can be illustrated. On the other hand, the target value of the liquid refrigerant supply is + 100 ° C. during the temperature lowering operation to the workpiece W1 by the heat exchange in the evaporator 101-1 when the chiller device drives the electric compressor 102 of the refrigeration cycle 100. To −10 ° C., the suction pressure for the electric compressor 102 in the high-pressure refrigerant electronic expansion valve EV2 is 0.47 MPa, the opening degree of the high-pressure refrigerant electronic expansion valve EV2 is 20%, and the injection electronic expansion valve EV3. The case where the suction temperature with respect to the electric compressor 102 is -15 ° C. and the opening degree of the electronic expansion valve EV3 for injection is 50% can be exemplified.

  In short, the role of the electronic expansion valve EV2 for high-pressure refrigerant is that the refrigerant gas compressed to a high pressure by the electric compressor 102 is supplied to the electric compressor 102 so that the suction pressure to the electric compressor 102 becomes 0.3 MPa. The purpose is to increase the pressure by merging to the refrigerant suction side. If the high-pressure refrigerant bypass operation flow rate is large, the electric compressor 102 will be used correspondingly, so the opening degree of the high-pressure refrigerant electronic expansion valve EV2 is 20% so that the required minimum cooling capacity is obtained. As described above, the operation frequency in the electric compressor 102 is variably controlled so that the optimum energy saving operation can be performed under any operation condition. The role of the electronic expansion valve EV3 for injection is to supply the refrigerant gas compressed to a high pressure by the electric compressor 102 to the refrigerant suction side of the electric compressor 102 so that the suction temperature to the electric compressor 102 is always constant. It is to raise the temperature by joining. However, since the suction pressure and the suction temperature for the electric compressor 102 vary depending on the use environment conditions, the target value is changed accordingly. For example, the case where the target value of the suction temperature for the electric compressor 102 is changed to about + 5 ° C. can be exemplified.

  In addition, the role of the refrigerant supply electronic expansion valve EV1-1 on the refrigerant suction side of the evaporator 101-1 in the refrigeration cycle 100 shown in FIG. 2 is to control the flow rate of the refrigerant flowing from the condenser 103 to the evaporator 101-1. The purpose is to moderately cool the liquid refrigerant circulating through the refrigerant cycle 200-1 by heat exchange in the evaporator 101-1. Further, the role of the refrigerant supply electronic expansion valve EV1-2 intervened in the fourth flow path of the bypass flow path in the refrigeration cycle 100 is the same, and the refrigerant flowing from the condenser 103 to the evaporator 101-2 is also similar. The flow rate is adjusted, and the liquid refrigerant circulating in the refrigerant cycle 200-2 is appropriately cooled by heat exchange in the evaporator 101-2. For any of the refrigerant supply electronic expansion valves EV1-1 and EV-2, the liquid refrigerant in the refrigerant cycles 200-1 and 200-2 is about 2 ° C. by heat exchange in the evaporators 101-1 and 101-2 by adjusting the flow rate. Can be cooled. In particular, the refrigerant supply electronic expansion valve EV1-2 in the fourth flow path is not related to the heat exchange function in the evaporator 101-1 in the refrigeration cycle 100, and is based on the configuration of the bypass flow path described above. In the device control unit (CPU), the opening degree of the injection electronic expansion valve EV3 in the third flow path is variably set with the opening degree of the high pressure refrigerant electronic expansion valve EV2 in the second flow path being constant. By performing the refrigerant flow control in the refrigeration cycle 100 and the bypass flow path, the cooling function in the evaporator 101-2 is intentionally lowered to differ between the dual configuration refrigerant cycles 200-1 and 200-2. It has an auxiliary framework for achieving the function of maintaining the temperature of the workpieces W1 and W2 under the heat retention range condition at the same time with high accuracy.

  FIG. 3 shows the electric motor of the refrigeration cycle 100 through the second flow path and a part of the first flow path in the bypass flow path by the device control unit (CPU) as a control device provided in the chiller device according to the embodiment. High pressure refrigerant bypass operation flow rate vs. elapsed time shown for explaining variable control of the operation frequency in the electric compressor 102 according to the high pressure refrigerant bypass operation flow rate circulating to the refrigerant suction side of the compressor 102-compressor operation It is the schematic diagram which contrasted and showed the frequency characteristic.

  Referring to FIG. 3, the refrigerant suction side of the electric compressor 102 of the refrigeration cycle 100 flows here through the second flow path and a part of the first flow path in the bypass flow path by the device control unit (CPU). For the high-pressure refrigerant bypass operation flow that circulates to the target temperature, the measured value indicated by the solid line as an example of the characteristic is compared with 20% of the target value and converged to the target value of 20%. A drive control signal generated based on the result of PID calculation of the refrigerant temperature and the refrigerant pressure from the pressure sensor P is output to the inverter INV, and the operation frequency in the electric compressor 102 corresponds to a flow rate of 0% to 100%. The variable control is performed according to the refrigerant temperature within the frequency range of 7 Hz to 140 Hz. At this time, the opening of the high-pressure refrigerant electronic expansion valve EV2 in the second flow path is maintained at 20%. The opening degree of the third flow injection electronic expansion valve in passage EV3 variably set. Here, the difference between the measured value of the high-pressure refrigerant bypass operation flow rate and the target value is processed by performing a moving average to moderate the amount of change, but the target value of 20% and the frequency of the drive control signal are exemplified. The range of 7 Hz to 140 Hz can be varied according to the use conditions.

  According to the chiller device according to the embodiment, the bypass by the first flow path to the fourth flow path connected to the refrigeration cycle 100 sharing the evaporator 101-1 of the refrigerant cycle 200-1 to which the workpiece W1 is connected. Cooling is reduced by controlling the opening degree of the refrigerant supply electronic expansion valve EV1-2 connected in the fourth flow path to the evaporator 101-2 of the refrigerant cycle 200-2 to which the work W2 is connected through the flow path. When the generated refrigerant is flown, the device control unit (CPU) is based on the result of PID calculation of the liquid refrigerant temperature detected by the first temperature sensors T1-1 and T1-2 in the refrigerant cycles 200-1 and 200-2. Based on the result of PID calculation of the liquid refrigerant temperature detected by the second temperature sensors T1-1 and T1-2, while controlling the heating amount in the heating devices 202-1 and 202-2 by the control signal generated in this way. Z The refrigerant supply electronic expansion valve EV1-1 on the refrigerant suction side of the evaporator 101-1 of the evaporator 101-1 of the refrigeration cycle 100 and the refrigerant expansion electronic expansion intervened in the fourth flow path by the pulse signal generated in this way The opening degree of the valve EV1-2 is controlled, and the second pressure signal is generated by a pulse signal generated based on the result of PID calculation of the refrigerant pressure at the pressure sensor P and the refrigerant temperature at the third temperature sensor T3 in the refrigeration cycle 100. The flow rate of the high-pressure refrigerant bypass operation flow that circulates to the electric compressor 102 through a part of the first flow path with the opening degree of the electronic expansion valve EV2 for the high-pressure refrigerant in the flow path made constant is converged to the target value. As described above, the opening degree of the third flow passage electronic expansion valve EV3 is variably set, a drive control signal is output, and the operation frequency of the compressor 102 is set within a predetermined range according to the refrigerant temperature. Variable control Therefore, it is possible to cool performance inexpensive configuration can not overload the electric compressor 102 without impaired, incubated controlled to different insulation range condition simultaneously high precision workpieces W1, W2 of. As a result, for example, the work W1 connected to the first refrigerant cycle 200-1 is used for heat insulation with respect to the lower electrode in the semiconductor etching apparatus, and the work W2 connected to the second refrigerant cycle 200-2 is used as the semiconductor etching apparatus. If it is applied as a heat retaining material for the upper electrode, the semiconductor etching on the target can be performed with high accuracy without temperature unevenness.

  FIG. 4 is a Mollier diagram shown for explaining the cooling performance in the chiller device according to the embodiment. However, it is assumed that a highly efficient Freon gas (R410A) is used as the refrigerant circulating in the refrigeration cycle 100 and the bypass flow path in the chiller apparatus according to the embodiment.

  Referring to FIG. 4, the chiller device according to the example includes points A to B in the refrigeration cycle on the Mollier diagram indicated by the relationship between the pressure p [MPa] and the specific enthalpy h [kJ / kg]. The interval shows the change in the state of the refrigerant in the electric compressor 102, the change in the state of the refrigerant in the condenser 103 from point B to point C, and the change in the refrigerant in the expansion valve between the point C and point D. The change of state is shown, the point D to the point A show the change of the state of the refrigerant in the evaporator 101-1, the specific enthalpy h immediately after the compression related to the point B is h3 = 470 kJ / kg, and the heat related to the point A It was found that the specific enthalpy h immediately after the exchange was h2 = 420 kJ / kg, and the specific enthalpy h in the expansion after condensation at points C to D was h1 = 255 kJ / kg.

  When the cooling performance is analyzed based on the above results, if h2-h1 indicating the refrigeration effect is 420-255 = 165 kJ / kg and the cooling-side circulation flow rate is 174 kg / hour, these values are multiplied by per second. It was found that the cooling performance was 165 × 174/3600 = 8 kW. Further, when the heating performance is analyzed, h3-h2 indicating a high-pressure compressed refrigerant gas is 470-420 = 50 kJ / kg, and if the bypass circulation flow rate is 50 kg / hour, these values are multiplied per second. Given the calculation result of the division, it was found that the heating performance was 50 × 50/3600 = 0.7 kW. Incidentally, since the chiller device according to Patent Document 1 has a bypass flow path in which the refrigerant gas compressed to a high pressure by the electric compressor is returned to the refrigerant suction side of the evaporator, the heating amount corresponding to the heating performance described above is subtracted. It becomes cool and the cooling performance is 8−0.7 = 7.3 kW. On the other hand, since the chiller device according to the embodiment has a bypass flow path returned to the refrigerant discharge side of the evaporator 101-1, it can be used with a cooling capacity of 8 kW. That is, in the chiller device according to the embodiment, the refrigerant gas compressed to a high pressure by the electric compressor 102 in the refrigeration cycle 100 does not flow into the evaporator 101-1, so that the refrigeration effect can be used 100%. By eliminating the need to flow an extra refrigerant, the chiller device according to the embodiment realizes an energy saving effect of about 10% to 15% as a result as compared with the chiller device according to Patent Document 1.

  In the chiller device according to the example, the device control unit (CPU) performs a PID calculation on the refrigerant temperature of the third temperature sensor T3 provided in the refrigeration cycle 100 and the refrigerant pressure detected by the pressure sensor P. A function for variably controlling the operation frequency of the electric compressor 102 within a predetermined range according to the refrigerant temperature detected by the third temperature sensor T3 by outputting the drive control signal generated based on the above to the inverter INV is explained. However, with respect to the PID calculation for generating the drive control signal, the temperature set by the user and the workpiece temperature detected by the first temperature sensors T1-1 and T1-2 as described in Patent Document 1, The liquid refrigerant temperature detected by the second temperature sensors T2-1 and T2-2 provided in the refrigerant cycles 200-1 and 200-2 at the time of the heat retention setting with a small temperature difference is targeted. A function of generating a drive control signal and variably controlling the operation frequency of the electric compressor 102 within a predetermined range according to the workpiece temperature detected by the first temperature sensors T1-1 and T1-2. Therefore, the chiller device of the present invention is not limited to the form described in the embodiments. However, the chiller device of the present invention has the two refrigerant cycles 200-1 and 200-2 as described above, and uses the bypass flow path to reduce the refrigerant flow rate without impairing the cooling performance of the refrigeration cycle 100. Since the technical gist is to improve the cooling performance by controlling and to save energy, the refrigerant temperature of the third temperature sensor T3 in the refrigeration cycle 100 in the own cycle as described in the embodiment. In addition, it can be said that it is advantageous in terms of followability and accuracy to generate a drive control signal by PID calculation of the refrigerant pressure detected by the pressure sensor P.

100 Refrigeration cycle 101-1, 101-2 Evaporator (heat exchanger)
DESCRIPTION OF SYMBOLS 102 Electric compressor 103 Condenser 200-1, 200-2 Refrigerant cycle 201-1 and 201-2 Refrigerant tank 202-1 and 202-2 Heating device (heater)
203-1, 203-2 Pump 300 Cooling circuit EV1-1, EV1-2 Electronic expansion valve for refrigerant supply EV2 Electronic expansion valve for high-pressure refrigerant EV3 Electronic expansion valve for injection F Flow rate detection sensor P Pressure sensor T1-1, T1- 2 1st temperature sensor T2-1, T2-2 2nd temperature sensor T3 3rd temperature sensor T4-1, T4-2 4th temperature sensor W1, W2 Workpiece

Claims (6)

A refrigeration cycle in which a refrigerant for cooling circulates, a first refrigerant cycle in which a liquid refrigerant for heating circulates in common with a first evaporator provided in the refrigeration cycle, and piping at predetermined locations of the refrigeration cycle together with the refrigerant of the second evaporator bypass connected through said bypass passage first separate from the evaporator circulates, the second refrigerant cycle in which liquid refrigerant for heating circulates a separate line The various customer devices that are interposed and connected to the first refrigerant cycle and the second refrigerant cycle and are to be kept warm are used for selective temperature setting in a predetermined temperature range for the user. And the number of rotations of the electric compressor provided in the refrigeration cycle, and a heating apparatus for heating the liquid refrigerant circulating through the first refrigerant cycle and the second refrigerant cycle. The thermal temperature is a set temperature set by the user and a workpiece temperature detected by a first temperature sensor provided near the workpiece side of the first refrigerant cycle and the second refrigerant cycle. In a chiller device comprising a control device that controls according to a temperature difference,
Wherein the first refrigerant cycle and second refrigerant cycle, respectively provided on the front side of the liquid refrigerant flowing to said heating device in a refrigerant discharge side of said second evaporator and said first evaporator A second temperature sensor for detecting the temperature of the liquid refrigerant, and a liquid refrigerant temperature on the refrigerant suction side of the first evaporator and the second evaporator on the liquid refrigerant outflow side with respect to the workpiece; A fourth temperature sensor;
The refrigeration cycle is provided on the refrigerant suction side of the electric compressor and on the refrigerant discharge side of the first evaporator, and a third temperature sensor for detecting the refrigerant temperature, and the electric compression A pressure sensor provided in the vicinity of the third temperature sensor on the refrigerant suction side of the machine for detecting the refrigerant pressure, and a first refrigerant supply for flow rate adjustment connected to the refrigerant suction side of the first evaporator An electronic expansion valve for
The bypass flow path extends from a refrigerant discharge side of the second evaporator in the second refrigerant cycle to a refrigerant discharge side of the first evaporator and a refrigerant suction side of the electric compressor in the refrigeration cycle. A first flow path connected to a location in between, a refrigerant suction side of a condenser provided in the refrigeration cycle with an electronic expansion valve for high-pressure refrigerant for adjusting a flow rate from a midpoint of the first flow path, and the In the refrigeration cycle, a second flow path connected to a location between the refrigerant discharge side of the electric compressor and an injection electronic expansion valve for flow rate adjustment extending from the first flow path is interposed. A third flow path connected to a position on the refrigerant flow pre-acquisition side of the first refrigerant supply electronic expansion valve between the refrigerant discharge side of the condenser and the refrigerant suction side of the first evaporator; wherein in cycle first refrigerant supply Flow rate and a refrigerant suction side of the second evaporator in the child expansion valve of the refrigerant inflow front side of the third flow passage wherein the first of said refrigerant suction side closer location of the evaporator the second refrigerant cycle than A fourth flow path connected by interposing and connecting the second refrigerant supply electronic expansion valve for adjustment,
The control device is configured to control the first refrigerant cycle and the second by a control signal generated based on a result of PID calculation including proportionality, integration, and differentiation for the workpiece temperature detected by the first temperature sensor. controls each of the heating amount in the heating device in the refrigerant cycle, the second proportional for the liquid refrigerant temperature detected respectively by the temperature sensor of the integral, generated based on the result of the PID operation including differential pulse Controlling the opening and closing of the first refrigerant supply electronic expansion valve and the second refrigerant supply electronic expansion valve by a signal to control the refrigerant flow rate in the refrigeration cycle and the bypass flow path, and the pressure The result of PID calculation including proportionality, integral, and differentiation with respect to the refrigerant pressure detected by the sensor and the refrigerant temperature detected by the third temperature sensor For proportional, integral, said from said second flow path in the bypass flow path to maintain a constant degree of opening of the high-pressure refrigerant electronic expansion valve by pulse signal generated based on the result of the PID operation includes a differential as high-pressure refrigerant bypass operation flow through a portion of the first flow path to circulate the refrigerant suction side of the electric compressor of the refrigeration cycle is converged to a predetermined value to a target, said injection electronic The opening of the expansion valve is variably set to control the refrigerant flow rate in the bypass flow path and the entire refrigeration cycle, and the drive control signal generated to drive the electric compressor is output to the inverter. The chiller device is characterized in that the operating frequency of the electric compressor is variably controlled in accordance with the refrigerant temperature within a predetermined range. The chiller device according to claim 1,
Wherein the control device, on the basis of the difference value of the first said refrigerant cycle and the first temperature sensor in said second refrigerant cycle fourth temperature sensor and the liquid refrigerant temperature detected respectively by The PID is calculated based on the result of the PID calculation based on the refrigerant pressure detected by the pressure sensor and the refrigerant temperature detected by the third temperature sensor. A chiller device that performs feedforward control that corrects cooling control by reflecting each of the calculated results. The chiller device according to claim 2, wherein
The control device is configured to increase the opening degree in the electronic expansion valve for injection when there is a thermal load according to the calculation result of the thermal load amount, compared to when there is no thermal load. A chiller device. The chiller device according to claim 2 or 3,
The control device, by driving the electric compressor of the refrigeration cycle than during the temperature raising operation to the work by heating by the heating device in the first refrigerant cycle and the second refrigerant cycle A chiller device that increases the opening degree of the electronic expansion valve for injection during the temperature lowering operation to the workpiece by heat exchange in the first evaporator. The chiller device according to claim 1,
The first temperature sensor and the second temperature sensor are Pt sensors using a platinum resistance band, and the third temperature sensor and the fourth temperature sensor are thermocouple sensors using a thermocouple. Chiller device characterized by being. With the use warmth to the lower electrode in a semiconductor etching device the workpiece which is connected to the first refrigerant cycle in the chiller device according to any one of claims 1-5, connected to the second refrigerant cycle chiller apparatus characterized by and supplied for thermal insulation for the upper electrode the workpiece in the semiconductor etching apparatus that.