JP6052870B2 - Package for electronic components - Google Patents

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JP6052870B2
JP6052870B2 JP2012262763A JP2012262763A JP6052870B2 JP 6052870 B2 JP6052870 B2 JP 6052870B2 JP 2012262763 A JP2012262763 A JP 2012262763A JP 2012262763 A JP2012262763 A JP 2012262763A JP 6052870 B2 JP6052870 B2 JP 6052870B2
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substrate
main surface
film material
conductive film
substrate portion
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JP2014110273A (en
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真司 塩田
真司 塩田
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Kyocera Crystal Device Corp
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Description

本発明は、電子機器に用いられる電子部品用パッケージに関する。   The present invention relates to an electronic component package used in an electronic device.

従来より、携帯電話、コンピュータ、電子化された自動車部品などの電子機器には電子部品が用いられている。
例えば、電子部品は、凹部を有し一方の主面に素子部品を搭載するための搭載パッドと他方の主面にマザーボードなどの外部基板に実装するための外部端子とが備えられた電子部品用パッケージが用いられ、これに素子部品を搭載し、必要に応じてこの素子部品を気密封止する蓋部材を前記電子部品用パッケージに接合した構造となっている。このような電子部品は、電子部品用パッケージの外部端子とマザーボードとを半田で接合している。
その一例として、圧電振動子について説明する。
従来の圧電振動子は、素子部品である圧電振動素子と、この圧電振動素子を搭載するための搭載パッドと外部に実装するための外部端子とを備えた電子部品用パッケージと、圧電振動素子を気密封止する蓋部材とを備え、電子部品用パッケージに設けられた凹部内に、前記圧電振動素子が搭載され、凹部を塞ぐように蓋部材が電子部品用パッケージに接合されて構成されている。
ここで、電子部品用パッケージは、凹部が設けられる主面とは反対側の主面の四隅にそれぞれ四角形状の外部端子が設けられている。 Conventionally, electronic parts are used in electronic devices such as mobile phones, computers, and electronic automobile parts.
For example, the electronic component is for an electronic component having a recess and a mounting pad for mounting an element component on one main surface and an external terminal for mounting on an external substrate such as a motherboard on the other main surface. A package is used. An element component is mounted on the package, and a lid member that hermetically seals the element component is bonded to the electronic component package as necessary. In such an electronic component, an external terminal of the electronic component package and the mother board are joined by soldering.
As an example, a piezoelectric vibrator will be described.
A conventional piezoelectric vibrator includes an electronic component package including a piezoelectric vibration element as an element component, a mounting pad for mounting the piezoelectric vibration element and an external terminal for mounting outside, and a piezoelectric vibration element. The piezoelectric vibration element is mounted in a recess provided in the electronic component package, and the lid member is joined to the electronic component package so as to close the recess. .
Here, the electronic component package is provided with quadrangular external terminals at the four corners of the main surface opposite to the main surface on which the recess is provided.

特開２０１０−１０９８３３号公報JP 2010-109833 A

しかしながら、このような電子部品は、例えば、自動車などに組み込まれた場合、使用環境とする設定温度の差が大きく、そのような環境下で使用された場合、電子部品用パッケージに設けられている外部端子とマザーボードとを接合している半田にクラックが生じる恐れがあった。
この半田にクラックが入ると、例えば、マザーボードとの接合状態が維持できなくなり、電子部品がマザーボードから剥がれる恐れがある。
また、集積回路素子などのＩＣ素子を搭載して用いる場合は、マザーボードなどへの基板への搭載において、電子部品用パッケージと基板との接合強度が低下する恐れがあり、使用中に剥がれて機能不能になる恐れがある。
これは、熱が加わることで、電子部品用パッケージに設けられた外部端子と電子部品用パッケージ本体とで熱膨張又は収縮のしかたが異なり、発生した応力に耐えられずに半田にクラックが発生するものと考えられる。 However, such an electronic component has a large set temperature difference when used in an automobile, for example, and is provided in an electronic component package when used in such an environment. There was a risk of cracks in the solder joining the external terminals and the motherboard.
If the solder is cracked, for example, the joining state with the mother board cannot be maintained, and the electronic component may be peeled off from the mother board.
Also, when an IC element such as an integrated circuit element is mounted and used, there is a risk that the bonding strength between the electronic component package and the substrate may be reduced in mounting on a substrate on a mother board or the like. There is a risk of becoming impossible.
This is because heat expands and contracts differently between the external terminals provided in the electronic component package and the electronic component package body due to the application of heat, and cracks occur in the solder without being able to withstand the generated stress. It is considered a thing.

そこで、本発明では、前記した問題を解決し、応力の発生を軽減して半田へのクラックが発生しにくくする電子部品用パッケージを提供することを課題とする。   Therefore, an object of the present invention is to provide an electronic component package that solves the above-described problems and reduces the occurrence of stress to make it difficult for cracks to occur in solder.

前記課題を解決するため、本発明は、平板状の基板部が用いられる電子部品用パッケージであって、導電膜材からなる２つ一対の外部端子が前記基板部の所定の主面側に設けられ、それぞれの前記外部端子となる導電膜材が、前記基板部の隣り合う２つの角部を覆うように前記基板部の３つの側面と前記基板部の他方の主面とに設けられつつ、前記導電膜材が、前記基板部の他方の主面側で曲線状の輪郭が形成され、前記基板部を挟んで平行する２つの側面側で直線の輪郭が形成され、前記２つ一対の外部端子の間隔が前記基板部の他方の主面の中央側に近づくにつれて狭くなるように形成され、前記基板部を挟む２つの側面に形成される外部端子の導電膜材が、略三角形に形成されて構成されることを特徴とする。 In order to solve the above-described problems, the present invention provides an electronic component package in which a flat substrate portion is used, and two pairs of external terminals made of a conductive film material are provided on a predetermined main surface side of the substrate portion. The conductive film material that becomes each of the external terminals is provided on the three side surfaces of the substrate unit and the other main surface of the substrate unit so as to cover two adjacent corners of the substrate unit, the conductive film material, wherein the curved profile on the other main surface side of the substrate portion is formed, the linearly contour formed by two side surfaces parallel across the substrate portion, before Symbol two pair of The outer terminal conductive film material formed on the two side surfaces sandwiching the substrate portion is formed in a substantially triangular shape so that the interval between the external terminals becomes narrower as it approaches the center side of the other main surface of the substrate portion. It is characterized by being configured.

また、本発明は、平板状の基板部が用いられる電子部品用パッケージであって、導電膜材からなる２つ一対の外部端子が前記基板部の所定の主面側に設けられ、それぞれの前記外部端子となる導電膜材が、前記基板部の隣り合う２つの角部を覆うように前記基板部の３つの側面と前記基板部の他方の主面とに設けられつつ、前記導電膜材が、前記基板部の他方の主面側で曲線状の輪郭が形成され、前記基板部を挟んで平行する２つの側面側で直線の輪郭が形成され、前記２つ一対の外部端子の間隔が前記基板部の他方の主面の中央側に近づくにつれて狭くなるように形成され、前記基板部を挟む２つの側面に形成される外部端子の導電膜材が、略三角形に形成されて構成されることを特徴とする。 Further, the present invention is an electronic component package in which a flat substrate portion is used, and two pairs of external terminals made of a conductive film material are provided on a predetermined main surface side of the substrate portion, The conductive film material serving as an external terminal is provided on the three side surfaces of the substrate unit and the other main surface of the substrate unit so as to cover two adjacent corners of the substrate unit, the substrate portion curved profile on the other principal surface side is formed of the straight line contours in the two side surfaces parallel across the substrate portion is formed, the interval before Symbol two pair of external terminals The conductive material of the external terminal formed on the two side surfaces sandwiching the substrate portion is formed in a substantially triangular shape and is formed so as to become narrower as it approaches the center side of the other main surface of the substrate portion. It is characterized by that.

このような電子部品用パッケージによれば、外部端子となる導電膜材が、基板部の隣り合う２つの角部を覆うように基板部の３つの側面と基板部とに設けられつつ、導電膜材が、基板部側で曲線状の輪郭が形成され、基板部を挟んで平行する２つの側面側で直線の輪郭が形成され、基板部側の２つ一対の外部端子の間隔が前記基板部の中央側に近づくにつれて狭くなるように形成されて構成されるので、加熱と冷却によって生じる応力が発生しても基板部に形成される外部端子となる導電膜材の形状に角となる部分がないため、マザーボードに実装された後の半田へのクラックが発生しにくくすることができる。   According to such an electronic component package, the conductive film material serving as the external terminal is provided on the three side surfaces of the substrate portion and the substrate portion so as to cover the two adjacent corner portions of the substrate portion. The material has a curved contour on the substrate portion side, a straight contour is formed on two side surfaces parallel to each other with the substrate portion interposed therebetween, and the distance between the pair of external terminals on the substrate portion side is the substrate portion Since it is formed so as to become narrower as it approaches the center side of the substrate, even if stress generated by heating and cooling occurs, the corner portion of the shape of the conductive film material that becomes the external terminal formed on the substrate portion Therefore, cracks in the solder after being mounted on the mother board can be made difficult to occur.

また、このような電子部品用パッケージによれば、基板部の側面にもつながって外部端子となる導電膜材が設けられているため、外部端子となる導電膜材が基板部の角となる部分の多くを覆った構成となるため、加熱と冷却によって生じる応力が発生しても半田へのクラックが発生しにくくすることができる。   Further, according to such an electronic component package, since the conductive film material that is connected to the side surface of the substrate portion and serves as an external terminal is provided, the conductive film material that serves as the external terminal is a corner portion of the substrate portion. Therefore, even if stress generated by heating and cooling is generated, cracks in the solder can be hardly generated.

本発明の第一の実施形態に係る電子部品用パッケージの一例を示す斜視図である。It is a perspective view which shows an example of the package for electronic components which concerns on 1st embodiment of this invention. 本発明の第一の実施形態に係る電子部品用パッケージから外部端子を省略した状態の一例を示す斜視図である。It is a perspective view which shows an example of the state which abbreviate | omitted the external terminal from the package for electronic components which concerns on 1st embodiment of this invention. 本発明の第一の実施形態に係る電子部品用パッケージの一例を示す側面図である。It is a side view which shows an example of the package for electronic components which concerns on 1st embodiment of this invention. 本発明の第二の実施形態に係る電子部品用パッケージの一例を示す斜視図である。It is a perspective view which shows an example of the package for electronic components which concerns on 2nd embodiment of this invention. 本発明の第三の実施形態に係る電子部品用パッケージの一例を示す斜視図である。It is a perspective view which shows an example of the package for electronic components which concerns on 3rd embodiment of this invention.

次に、本発明を実施するための最良の形態（以下、「実施形態」という。）について、適宜図面を参照しながら詳細に説明する。なお、各構成要素について、状態をわかりやすくするために、誇張して図示している。また、同一の構成要素には同一の符号を付し、重複する説明を省略する。   Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. Note that each component is exaggerated for easy understanding of the state. Moreover, the same code | symbol is attached | subjected to the same component and the overlapping description is abbreviate | omitted.

（第一の実施形態）
図１及び図２に示すように、本発明の第一の実施形態に係る電子部品用パッケージ１０１は、基板部１０、枠部１１、外部端子１２から主に構成されている。 (First embodiment)
As shown in FIGS. 1 and 2, the electronic component package 101 according to the first embodiment of the present invention mainly includes a substrate part 10, a frame part 11, and external terminals 12.

基板部１０は、所定の厚みを有する四角形の平板状で形成されている。この基板部１０には、後述する外部端子と素子用搭載パッド（図示せず）が設けられる。
なお、この基板部１０は、例えば、セラミックが用いられる。
枠部１１は、環状に形成されており、その外周が基板部１０の外周と合わせて形成されている。この枠部１１は、基板部１０の一方の主面に設けられる。これにより、基板部の一方の主面側には凹部Ｋ（図３参照）が形成される。この凹部Ｋ内であって基板部１０の一方の主面に前記素子用搭載パッド（図示せず）が設けられる。 The substrate unit 10 is formed in a rectangular flat plate shape having a predetermined thickness. The substrate part 10 is provided with external terminals and element mounting pads (not shown) which will be described later.
In addition, this board | substrate part 10 uses a ceramic, for example.
The frame portion 11 is formed in an annular shape, and the outer periphery thereof is formed together with the outer periphery of the substrate portion 10. The frame portion 11 is provided on one main surface of the substrate portion 10. Thereby, the recessed part K (refer FIG. 3) is formed in the one main surface side of a board | substrate part. The element mounting pad (not shown) is provided in one main surface of the substrate portion 10 in the recess K.

外部端子１２は、通電可能な導電膜材から構成されている。
この外部端子１２となる導電膜材は、基板部１０の隣り合う２つの角部を覆うように基板部１０の３つの側面（１０Ｂ，１０Ｃ）と基板部１０の主面１０Ａとに設けられつつ、導電膜材が、基板部１０の主面１０Ａに曲線状の輪郭が形成され、基板部１０を挟んで平行する２つの側面１０Ｂ，１０Ｂ側で直線の輪郭が形成され、基板部１０側の２つ一対の外部端子の間隔が基板部１０の中央側に近づくにつれて狭くなるように形成されている。 The external terminal 12 is made of a conductive film material that can be energized.
The conductive film material to be the external terminals 12 is provided on the three side surfaces (10B, 10C) of the substrate unit 10 and the main surface 10A of the substrate unit 10 so as to cover two adjacent corners of the substrate unit 10. In the conductive film material, a curved contour is formed on the main surface 10A of the substrate portion 10, and a linear contour is formed on the two side surfaces 10B and 10B side parallel to each other with the substrate portion 10 interposed therebetween. It is formed so that the distance between the pair of external terminals becomes narrower as it approaches the center side of the substrate part 10.

例えば、基板部１０の最も広い面を主面として、凹部が設けられている側とは反対側の主面を主面１０Ａとし、長辺側の側面を側面１０Ｂとし、短辺側の側面を側面１０Ｃとする。
このとき、外部端子１２となる導電膜材は、基板部１０の他方の主面１０Ａに設けられる導電膜材１２Ａと、長辺側の側面１０Ｂに設けられる導電膜材１２Ｂと、短辺側の側面１０Ｃに設けられる導電膜材１２Ｃとから構成される。 For example, the widest surface of the substrate part 10 is the main surface, the main surface opposite to the side where the recess is provided is the main surface 10A, the side surface on the long side is the side surface 10B, and the side surface on the short side is The side surface is 10C.
At this time, the conductive film material to be the external terminal 12 includes a conductive film material 12A provided on the other main surface 10A of the substrate part 10, a conductive film material 12B provided on the long side 10B, and a short side. The conductive film material 12C is provided on the side surface 10C.

これら導電膜材１２Ａ，１２Ｂ，１２Ｃは、接合した状態となっている。また、接合した状態の導電膜材１２Ａ，１２Ｂ，１２Ｃは、基板部１０の隣り合う２つの角部を覆った状態になっている。
また、基板部１０の他方の主面１０Ａに設けられる導電膜材１２Ａは、他方の主面１０Ａの中央側を向く方に曲線の輪郭が形成されており、その輪郭部分から短辺側及び長辺側の縁を覆って設けられている。 These conductive film materials 12A, 12B, and 12C are in a joined state. In addition, the conductive film materials 12A, 12B, and 12C in the joined state cover the two adjacent corners of the substrate unit 10.
Further, the conductive film material 12A provided on the other main surface 10A of the substrate part 10 has a curved outline formed in a direction facing the center side of the other main surface 10A, and the short side and the long side from the outline portion. It is provided to cover the edge on the side.

この導電膜材１０Ａは、曲線の輪郭が円弧形状に形成されており、基板部１０に発生する応力を軽減する役割を果たす。
また、短辺側の側面１０Ｃに設けられる導電膜材１２Ｃは、基板部１０の側面１０Ｃの全面に設けられている。
また、長辺側の側面１０Ｂに設けられる導電膜材１２Ｂは、基板部１０の側面１０Ｂの端部側で略三角形に形成されている。この導電膜材１２Ｂは、導電膜材１０Ａの曲線の輪郭の接線方向に延びるように三角形の輪郭が形成される。これにより、基板部１０は、外部端子１２の角となる部分を従来よりも減らすことができるため、角部分に集中しやすい応力を軽減することができる。 The conductive film material 10 </ b> A has a curved outline formed in an arc shape, and plays a role of reducing stress generated in the substrate portion 10.
The conductive film material 12 </ b> C provided on the short side 10 </ b> C is provided on the entire side 10 </ b> C of the substrate unit 10.
Further, the conductive film material 12 </ b> B provided on the long side surface 10 </ b> B is formed in a substantially triangular shape on the end side of the side surface 10 </ b> B of the substrate portion 10. The conductive film material 12B has a triangular outline extending in a tangential direction of the curved outline of the conductive film material 10A. Thereby, since the board | substrate part 10 can reduce the corner | angular part of the external terminal 12 conventionally, it can reduce the stress which tends to concentrate on a corner | angular part.

なお、基板部１０に生産の際に形成される凹凸により基板部１０の側面１０Ｂ，１０Ｃの形状が一部平面とならない部分が形成される場合があるが、この場合、側面１０Ｂに設けられる導電膜材１２Ｂの形状は、通常の三角形とはならないが、このような場合の形状を略三角形とする。   In some cases, the side surface 10B, 10C of the substrate unit 10 may have a portion where the shape of the side surface 10B or 10C is not a flat surface due to the irregularities formed during production. The shape of the film material 12B is not a regular triangle, but the shape in such a case is a substantially triangle.

また、外部端子１２は、２つ一対で基板部１０に設けられる。
ここで、基板部１０の他方の主面１０Ａに設けられている一方の外部端子１２の導電膜材１２Ａと他方の外部端子１２の導電膜材１２Ａは、基板部１０の中央側に近づくにつれて狭くなるように形成されている。
これにより、外部端子１２は、基板部１０の角となる部分を多く覆うため、加熱や冷却で発生する応力を軽減させることができる。 Further, two external terminals 12 are provided on the substrate unit 10 as a pair.
Here, the conductive film material 12 </ b> A of one external terminal 12 and the conductive film material 12 </ b> A of the other external terminal 12 provided on the other main surface 10 </ b> A of the substrate part 10 become narrower as they approach the center side of the substrate part 10. It is formed to become.
Thereby, since the external terminal 12 covers many corner | angular parts of the board | substrate part 10, it can reduce the stress which generate | occur | produces by heating and cooling.

したがって、本発明の第一の実施形態に係る電子部品用パッケージ１０１によれば、外部端子１２となる導電膜材１２Ａ，１２Ｂ，１２Ｃが、基板部１０の隣り合う２つの角部を覆うように基板部１０の３つの側面１０Ｂ，１０Ｃと基板部の他方の主面１０Ａとに設けられつつ、導電膜材１２Ａ，１２Ｂ，１２Ｃが、基板部１０の他方の主面１０Ａ側で曲線状の輪郭が形成され、基板部１０の他方の主面１０Ａを挟んで平行する２つの側面１０Ｂ，１０Ｂ側で直線の輪郭が形成され、基板部１０側の２つ一対の外部端子１２の間隔が基板部１０他方の主面１０Ａの中央側に近づくにつれて狭くなるように形成されて構成されるので、加熱と冷却によって生じる応力が発生しても基板部１０に形成される外部端子１２となる導電膜材１２Ａ，１２Ｂ，１２Ｃの形状に応力の集中しやすい角となる部分がないためマザーボードに実装された後の半田へのクラックが発生しにくくすることができる。   Therefore, according to the electronic component package 101 according to the first embodiment of the present invention, the conductive film materials 12A, 12B, and 12C serving as the external terminals 12 cover two adjacent corner portions of the substrate portion 10. While being provided on the three side surfaces 10B and 10C of the substrate portion 10 and the other main surface 10A of the substrate portion, the conductive film materials 12A, 12B and 12C are curved contours on the other main surface 10A side of the substrate portion 10. Is formed, a linear outline is formed on the two side surfaces 10B and 10B that are parallel to each other across the other main surface 10A of the substrate unit 10, and the distance between the pair of external terminals 12 on the substrate unit 10 side is the substrate unit 10 The conductive film material that becomes the external terminal 12 formed on the substrate portion 10 even when stress generated by heating and cooling occurs because it is formed so as to become narrower as it approaches the center side of the other main surface 10A. 12A, 1 B, cracks in the solder after being mounted on a mother board because there are no likely to be concentrated corner to become part of the stress in the shape of 12C can be made difficult to occur.

また、本発明の第一の実施形態に係る電子部品用パッケージ１０１によれば、基板部１０の側面１０Ａ，１０Ｂ，１０Ｃにもつながって外部端子１２となる導電膜材１２Ａ，１２Ｂ，１２Ｃが設けられているため、外部端子１２となる導電膜材１２Ａ，１２Ｂ，１２Ｃが基板部１０の角となる部分の多くを覆った構成となるため、加熱と冷却によって生じる応力が発生しても、マザーボードに実装された後の半田へのクラックが発生しにくくすることができる。   In addition, according to the electronic component package 101 according to the first embodiment of the present invention, the conductive film materials 12A, 12B, and 12C that are connected to the side surfaces 10A, 10B, and 10C of the substrate portion 10 and become the external terminals 12 are provided. Therefore, the conductive film materials 12A, 12B, and 12C serving as the external terminals 12 cover most of the corner portions of the substrate portion 10, so that even if stress generated by heating and cooling occurs, the motherboard It is possible to make it difficult for cracks to occur in the solder after being mounted on.

（第二の実施形態）
次に本発明の第二の実施形態に係る電子部品用パッケージ１０２について説明する。
図４に示すように、本発明の第二の実施形態に係る電子部品用パッケージ１０２は、基板部１０と外部端子１２から主に構成され、第一の実施形態に対して枠部がない状態で構成される点で異なる。 (Second embodiment)
Next, an electronic component package 102 according to a second embodiment of the present invention will be described.
As shown in FIG. 4, the electronic component package 102 according to the second embodiment of the present invention is mainly composed of the substrate portion 10 and the external terminals 12, and has no frame portion with respect to the first embodiment. It is different in that it is composed of

図４に示す基板部１０は、所定の厚みを有する四角形の平板状で形成されている。この基板部１０には、後述する外部端子と素子用搭載パッド（図示せず）が設けられる。
なお、この基板部１０は、例えば、セラミックが用いられる。
基板部１０の一方の主面に前記素子用搭載パッド（図示せず）が設けられ、他方の主面に外部端子１２が設けられる。 The substrate portion 10 shown in FIG. 4 is formed in a rectangular flat plate shape having a predetermined thickness. The substrate part 10 is provided with external terminals and element mounting pads (not shown) which will be described later.
In addition, this board | substrate part 10 uses a ceramic, for example.
The element mounting pad (not shown) is provided on one main surface of the substrate portion 10, and the external terminal 12 is provided on the other main surface.

外部端子１２は、通電可能な導電膜材から構成されている。
この外部端子１２となる導電膜材は、基板部１０の隣り合う２つの角部を覆うように基板部１０の３つの側面（１０Ｂ，１０Ｃ）と基板部１０の主面１０Ａとに設けられつつ、導電膜材が、基板部１０の主面１０Ａに曲線状の輪郭が形成され、基板部１０を挟んで平行する２つの側面１０Ｂ，１０Ｂ側で直線の輪郭が形成され、基板部１０側の２つ一対の外部端子の間隔が基板部１０の中央側に近づくにつれて狭くなるように形成されている。 The external terminal 12 is made of a conductive film material that can be energized.
The conductive film material to be the external terminals 12 is provided on the three side surfaces (10B, 10C) of the substrate unit 10 and the main surface 10A of the substrate unit 10 so as to cover two adjacent corners of the substrate unit 10. In the conductive film material, a curved contour is formed on the main surface 10A of the substrate portion 10, and a linear contour is formed on the two side surfaces 10B and 10B side parallel to each other with the substrate portion 10 interposed therebetween. It is formed so that the distance between the pair of external terminals becomes narrower as it approaches the center side of the substrate part 10.

例えば、基板部１０の最も広い面を主面として、凹部が設けられている側とは反対側の主面を主面１０Ａとし、長辺側の側面を側面１０Ｂとし、短辺側の側面を側面１０Ｃとする。
このとき、外部端子１２となる導電膜材は、基板部１０の他方の主面１０Ａに設けられる導電膜材１２Ａと、長辺側の側面１０Ｂに設けられる導電膜材１２Ｂと、短辺側の側面１０Ｃに設けられる導電膜材１２Ｃとから構成される。 For example, the widest surface of the substrate part 10 is the main surface, the main surface opposite to the side where the recess is provided is the main surface 10A, the side surface on the long side is the side surface 10B, and the side surface on the short side is The side surface is 10C.
At this time, the conductive film material to be the external terminal 12 includes a conductive film material 12A provided on the other main surface 10A of the substrate part 10, a conductive film material 12B provided on the long side 10B, and a short side. The conductive film material 12C is provided on the side surface 10C.

このように本発明の第一の実施形態に係る電子部品用パッケージ１０２を構成しても、第一の実施形態と同様の効果を奏する。   Thus, even if it comprises the package 102 for electronic components which concerns on 1st embodiment of this invention, there exists an effect similar to 1st embodiment.

（第三の実施形態）
次に本発明の第三の実施形態に係る電子部品用パッケージ１０３について説明する。
図５に示すように、本発明の第三の実施形態に係る電子部品用パッケージ１０３は、基板部１０、枠部１１、外部端子１２から主に構成され、基板部１０の他方の主面１０Ａに設けられる外部端子１２の導電膜材１２Ｄの形状が第一の実施形態と異なる。 (Third embodiment)
Next, an electronic component package 103 according to a third embodiment of the present invention will be described.
As shown in FIG. 5, the electronic component package 103 according to the third embodiment of the present invention is mainly composed of a board part 10, a frame part 11, and external terminals 12, and the other main surface 10 </ b> A of the board part 10. The shape of the conductive film material 12D of the external terminal 12 provided in is different from that of the first embodiment.

基板部１０の他方の主面１０Ａに設けられる外部端子１２の導電膜材１２Ｄは、曲線状の輪郭が、楕円曲線となっている。この導電膜材１２Ｄは、長径側の頂点が基板部１０の他方の主面１０Ａに接しており、短径側の頂点が基板部１０の他方の主面１０Ａの中央側を向いて設けられている。
このように、第三の実施形態を構成しても第一の実施形態と同様の効果を奏する。 The conductive film material 12D of the external terminal 12 provided on the other main surface 10A of the substrate unit 10 has an elliptical curve contour. The conductive film material 12 </ b> D is provided such that the vertex on the long diameter side is in contact with the other main surface 10 </ b> A of the substrate portion 10, and the vertex on the short diameter side faces the center side of the other main surface 10 </ b> A of the substrate portion 10. Yes.
Thus, even if it comprises 3rd embodiment, there exists an effect similar to 1st embodiment.

以上、本発明の実施形態について説明したが、本発明は前記実施形態には限定されない。
例えば、基板部１０の長辺側の側面に設けた外部端子となる三角形の導電膜材は、四角形状で構成しても良い。この場合、基板部１０の一方の主面から他方の主面に渡って設けるのが良い。
また基板部１０は、セラミック以外に絶縁性のある材料であれば適宜用いることができる。
また、導電膜材は、セラミックで基板部を構成する場合は、グリーンシートで形状を形成する際に予め設けておいても良いし、蒸着やスパッタで設けても良い。 As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment.
For example, the triangular conductive film material serving as the external terminal provided on the side surface on the long side of the substrate unit 10 may be formed in a quadrangular shape. In this case, it is good to provide from one main surface of the board | substrate part 10 to the other main surface.
The substrate portion 10 can be appropriately used as long as it is an insulating material other than ceramic.
Further, when the substrate portion is made of ceramic, the conductive film material may be provided in advance when forming the shape with a green sheet, or may be provided by vapor deposition or sputtering.

１０１，１０２，１０３ 電子部品用パッケージ
１０ 基板部
１０Ａ 他方の主面
１０Ｂ，１０Ｃ 側面
１１ 枠部
１２ 外部端子
１２Ａ，１２Ｂ，１２Ｃ，１２Ｄ 導電膜材 DESCRIPTION OF SYMBOLS 101,102,103 Electronic component package 10 Board | substrate part 10A The other main surface 10B, 10C Side surface 11 Frame part 12 External terminal 12A, 12B, 12C, 12D Conductive material

Claims (2)

平板状の基板部の一方の主面に枠部が設けられて凹部が形成される電子部品用パッケージであって、
導電膜材からなる２つ一対の外部端子が前記基板部の枠部が設けられている主面とは反対の主面側に設けられ、
それぞれの前記外部端子となる導電膜材が、前記基板部の隣り合う２つの角部を覆うように前記基板部の３つの側面と前記基板部の他方の主面とに設けられつつ、前記導電膜材が、前記基板部の他方の主面側で曲線状の輪郭が形成され、前記基板部を挟んで平行する２つの側面側で直線の輪郭が形成され、
前記２つ一対の外部端子の間隔が前記基板部の他方の主面の中央側に近づくにつれて狭くなるように形成され、
前記基板部を挟む２つの側面に形成される外部端子の導電膜材が、略三角形に形成されて構成される
ことを特徴とする電子部品用パッケージ。 A package for an electronic component in which a concave portion is formed by providing a frame portion on one main surface of a flat substrate portion,
Two pairs of external terminals made of a conductive film material are provided on the main surface side opposite to the main surface on which the frame portion of the substrate portion is provided,
The conductive film material serving as each of the external terminals is provided on the three side surfaces of the substrate unit and the other main surface of the substrate unit so as to cover two adjacent corners of the substrate unit. The film material has a curved contour formed on the other main surface side of the substrate portion, and a straight contour is formed on two side surfaces parallel to each other with the substrate portion interposed therebetween.
Is formed so that the distance of the previous SL two pair of external terminals is narrowed toward the center side of the other main surface of the substrate section,
An electronic component package comprising: a conductive film material of external terminals formed on two side surfaces sandwiching the substrate portion formed in a substantially triangular shape . 平板状の基板部が用いられる電子部品用パッケージであって、
導電膜材からなる２つ一対の外部端子が前記基板部の所定の主面側に設けられ、
それぞれの前記外部端子となる導電膜材が、前記基板部の隣り合う２つの角部を覆うように前記基板部の３つの側面と前記基板部の他方の主面とに設けられつつ、前記導電膜材が、前記基板部の他方の主面側で曲線状の輪郭が形成され、前記基板部を挟んで平行する２つの側面側で直線の輪郭が形成され、
前記２つ一対の外部端子の間隔が前記基板部の他方の主面の中央側に近づくにつれて狭くなるように形成され、
前記基板部を挟む２つの側面に形成される外部端子の導電膜材が、略三角形に形成されて構成される
ことを特徴とする電子部品用パッケージ。 A package for an electronic component in which a flat substrate portion is used,
Two pairs of external terminals made of a conductive film material are provided on a predetermined main surface side of the substrate part,
The conductive film material serving as each of the external terminals is provided on the three side surfaces of the substrate unit and the other main surface of the substrate unit so as to cover two adjacent corners of the substrate unit. The film material has a curved contour formed on the other main surface side of the substrate portion, and a straight contour is formed on two side surfaces parallel to each other with the substrate portion interposed therebetween.
Is formed so that the distance of the previous SL two pair of external terminals is narrowed toward the center side of the other main surface of the substrate section,
An electronic component package comprising: a conductive film material of external terminals formed on two side surfaces sandwiching the substrate portion formed in a substantially triangular shape .
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