JP6046375B2 - Semiconductor device, semiconductor device manufacturing method, and semiconductor device manufacturing apparatus - Google Patents

Description

  The present invention relates to a semiconductor device, a semiconductor device manufacturing method for manufacturing the semiconductor device, and a semiconductor device manufacturing apparatus.

  Generally, a transfer mold method is widely used as a technique for sealing an optically coupled semiconductor device. Transfer molds can be broadly classified into two types: a single transfer mold type and a double transfer mold type.

  Here, FIG. 1-1 shows an example of a single transfer mold type. FIG. 1-2 shows an example of a double transfer mold type.

  Referring to FIG. 1-1, in the single transfer mold type, a mold 6 is formed with a light-shielding resin, and the light emitting side lead frame 3 on which the light emitting element 1 is mounted and the light receiving side lead frame 4 on which the light receiving element 2 is mounted are opposed to each other. The silicone resin 5 is filled between them.

  On the other hand, referring to FIG. 1-2, in the double transfer mold type, the light-emitting side lead frame 3 on which the light-emitting element 1 is mounted and the light-receiving side lead frame 4 on which the light-receiving element 2 is mounted are arranged opposite to each other to have semi-translucency. The primary mold 7 is formed of resin. Further, in the double transfer mold type, the primary mold 7 is completely covered by forming the secondary mold 8 with a light-shielding resin.

  In both cases of the single transfer mold type and the double transfer mold type, the light emitting element is mounted on the light emitting side lead frame and the light receiving element is mounted on the light receiving side lead frame as a pretreatment of the transfer mold process. The light-emitting side lead frame and the light-receiving side lead frame are superposed in an opposing arrangement (hereinafter referred to as “superposition process” as appropriate).

  As a method for executing the superimposition process, various methods as described below are employed.

  First, a general first method will be described with reference to FIG.

  In the first method, the light emitting side lead frame 3 having the light emitting side header portion 9 to which the light emitting element 1 is die bonded as shown in FIG. 2 and the light receiving side header portion 10 to which the light receiving element 2 is die bonded. The light receiving side lead frame 4 having the above is disposed so as to face each other as shown in FIG. At this time, the light emitting side header portion 9 and the light receiving side header portion are overlapped by overlapping the light emitting side lead frame 3 and the light receiving side lead frame 4 with reference to the reference hole 11 provided in the frame frame 13 and the frame frame 14. 10 is opposed. After that, as shown in FIG. 4, the welding point 12 provided in the frame frame 13 or the tie bar portion 15 is sandwiched between the upper electrode 17 and the lower electrode 18 in order to suppress the variation in the opposing arrangement position and fix the position. Then, welding is fixed by spot welding applied at a high voltage. This weld-fixed portion is the weld bond 19 shown in FIG.

  Further, Patent Document 1 describes a second method that is an extension of the first method. In the second method described in Patent Document 1, when the light emitting side lead frame on which the light emitting element is mounted and the light receiving side lead frame on which the light receiving element is mounted are overlapped with each other, the two lead frames are simply fitted. Keep it. Then, the main fitting is performed with a mold load at the time of molding, and the fitting portion is covered with resin.

  Further, Patent Document 2 describes a third method that is an extension of the first method. In the third method described in Patent Document 2, a tie bar portion having a header portion on which a light emitting element is mounted and a tie bar portion having a header portion on which a light receiving element is mounted are alternately arranged on one lead frame. Cut off the tie bar on the element side. Then, the cut-out portion is inverted and placed opposite to the other element. At that time, in order to suppress misalignment, the cut-off tie bar portion and one tie bar portion are fitted and fixed by welding.

Japanese Patent Laid-Open No. 06-132561 JP 2007-300053 A

  By adopting the general first method as described above and the methods described in Patent Literature 1 and Patent Literature 2 described above, it is possible to execute the overlay processing. However, the general first method and the methods described in Patent Document 1 and Patent Document 2 have the following problems.

  In the first method, as described above, the light-emitting side lead frame 3 on which the light-emitting element 1 is mounted and the light-receiving side lead frame 4 on which the light-receiving element 2 is mounted are connected to the light-emitting side header portion 9 and the light-receiving side header as shown in FIG. The parts 10 are arranged to face each other. Then, both lead frames (the light-emitting side lead frame 3 and the light-receiving side lead frame 4) are welded and fixed by spot welding as shown in FIG. 4 to suppress positional deviation.

  However, in the first method, both lead frames are warped due to residual strain generated in the welding process, the interval between the light emitting side header portion 9 and the light receiving side header portion 10 is not stable, and the optical coupling efficiency between light emission and light reception varies. . Therefore, the current transfer rate of the optically coupled semiconductor device also varies, which causes a quality problem.

  Further, when the apparatus for spot welding the optically coupled semiconductor device is continuously operated, the upper electrode 17 and the lower electrode 18 for welding are worn. Then, due to instability of contact with both lead frames caused by this wear and adhesion of dirt to the upper electrode 17 and the lower electrode 18, spatter is generated during welding, and the welding strength cannot be obtained satisfactorily. The problem can occur.

  In order to prevent this problem, it is necessary to clean the electrodes in a certain period, and during that time, the operation of the equipment for spot welding the optically coupled semiconductor device must be stopped. As a result, productivity has deteriorated.

  On the other hand, according to the method described in Patent Document 1, a light-emitting side lead frame on which a light-emitting element is mounted and a light-receiving side lead frame on which a light-receiving element is mounted are fitted to each other in an opposing arrangement. However, the fitting at the time of superimposing is not strong, and a strong fitting is not achieved until the fitting portion is crushed by the load of the mold and encapsulated with a resin mold. For this reason, misalignment of both lead frames may occur during conveyance up to encapsulation.

  On the other hand, in the method described in Patent Document 2, one element side is cut off from the tie bar part, inverted so as to be opposed to the other element side, and the cut part and the lead frame are fitted. The cutting process increases and the efficiency is poor. In addition, when the tie bar portion is cut off, stress may be generated and the lead frame may be bent. In addition, since the cut tie bar portion and the lead frame are fixed by welding, there is a problem that the electrode needs to be cleaned for a certain period of time as in the first method.

  Therefore, the present invention provides a distance between light emission and light reception without using spot welding when the light emitting side lead frame on which the light emitting element is mounted and the light receiving side lead frame on which the light receiving element is mounted are arranged to face each other. It is an object of the present invention to provide a semiconductor device, a semiconductor device manufacturing method, and a semiconductor device manufacturing apparatus capable of stabilizing the above and suppressing positional deviation.

According to a first aspect of the present invention, a first lead frame on which a semiconductor element is mounted and a second lead frame on which the semiconductor element is mounted, the first lead frame and the second lead frame are provided. Either or both of them fit the first lead frame and the second lead frame by bending the first lead frame and the second lead frame to face each other when the first lead frame and the second lead frame are arranged to face each other. while have a protrusion for coupling fixing, the surface that is the other face and the lead frame when the first lead frame the second lead frame is disposed opposite the first surface, the When the back surface of the first surface is the second surface, the protrusion is brought into contact with the second surface of the other lead frame that does not have the protrusion so that the fitting and fixing are not performed. The semiconductor device is provided, characterized in that that.
According to a second aspect of the present invention, a first lead frame on which a semiconductor element is mounted and a second lead frame on which the semiconductor element is mounted, the first lead frame and the second lead frame are provided. Either or both of them fit the first lead frame and the second lead frame by bending the first lead frame and the second lead frame to face each other when the first lead frame and the second lead frame are arranged to face each other. A T-shaped protrusion in plan view for mating and fixing, and a convex-shaped opening in plan view for insertion of the protrusion when the protrusion is bent; and the first lead frame When the surface facing the other lead frame when the second lead frame is disposed opposite to the first surface is the first surface and the back surface of the first surface is the second surface, T-shaped When the T-shaped bottom portion is bent toward the opening, the top of the T-shaped bites the second surface of the portion adjacent to both ends of the top of the convex-shaped opening. A semiconductor device is provided.
According to a third aspect of the present invention, a first lead frame on which a semiconductor element is mounted and a second lead frame on which the semiconductor element is mounted, the first lead frame and the second lead frame are provided. When both the first lead frame and the second lead frame are arranged to face each other, the first lead frame and the second lead frame are fitted and fixed by bending to the other lead frame side. And the first lead frame and the second lead frame both have openings into which the protrusions enter when the other protrusion is bent. A semiconductor device is provided.

According to a fourth aspect of the present invention, there is provided a semiconductor device manufacturing method performed by a semiconductor device manufacturing apparatus, wherein a first lead frame mounting a semiconductor element is opposed to a second lead frame mounting a semiconductor element. a step for arranging a protruding portion having any one or both of the previous SL first lead frame and the second lead frame, the first by bending the other lead frame of the lead frame having a protrusion portion only including the steps of fitting and fixing the lead frame and the second lead frame, wherein the first and faces the other lead frame upon the lead frame second lead frame is disposed opposite When the first surface is the first surface and the back surface of the first surface is the second surface, the protruding portion of the other lead frame that does not have the protruding portion The semiconductor device manufacturing method characterized by performing the fitting fixed by bending the said projections to contact the surface is provided.

According to a fifth aspect of the present invention, there is provided a semiconductor device manufacturing apparatus for manufacturing a semiconductor device, wherein a first lead frame mounting a semiconductor element and a second lead frame mounting a semiconductor element are arranged to face each other. means and, before Symbol first lead frame and the protrusions having any one or both of the second lead frame, projecting the first lead by bending the other lead frame of the lead frame having a raised portion see contains means for fitting and fixing the frame and the second lead frame, wherein the surface facing the other lead frame when the first lead frame and the second lead frame is disposed opposite Is the first surface, and the back surface of the first surface is the second surface, the projecting portion contacts the second surface of the other lead frame that does not have the projecting portion. The protrusion semiconductor device manufacturing apparatus which is characterized in that the fitting fixed by bending said are provided as.

  According to the present invention, when a light emitting side lead frame mounted with a light emitting element and a light receiving side lead frame mounted with a light receiving element are arranged to face each other and the overlay process is performed, the distance between the light emitting and the light receiving is not used without spot welding. It is possible to stabilize the position and suppress positional deviation.

It is sectional drawing (1/2) showing the schematic structure of an optical coupling element. It is sectional drawing (2/2) showing the schematic structure of an optical coupling element. It is the side view and top view showing a structural example of the light emission side lead frame and the light reception side lead frame. It is the top view and side view showing the example of 1 structure at the time of superimposing the light emission side lead frame and the light reception side lead frame. FIG. 6 is a cross-sectional view when a light emitting side lead frame and a light receiving side lead frame are fixed by welding. It is the top view and side view showing the example of 1 structure of the light emission side lead frame and light reception side lead frame in embodiment of this invention. It is an enlarged view showing one structural example of the protrusion part and opening part in embodiment of this invention. FIG. 4 is a plan view and a side view illustrating a configuration example when the light emitting side lead frame and the light receiving side lead frame are overlapped and fitted in the embodiment of the present invention. It is an enlarged view showing the example of 1 structure of the fitting mechanism part in embodiment of this invention. It is a flowchart showing the basic operation | movement of embodiment of this invention. It is the modification of embodiment of this invention, Comprising: It is the top view and side view showing a structural example in the case of implement | achieving this embodiment by one lead frame. FIG. 9 is a plan view illustrating a configuration example in a case where both the protrusion and the opening are provided in each lead frame, which is a modification of the embodiment of the present invention. FIG. 9 is a side view showing a modification example of the embodiment of the present invention, and showing a configuration example when a light emitting side lead frame and a light receiving side lead frame are overlapped and fitted.

  First, an outline of an embodiment of the present invention will be described. In an embodiment of the present invention, a light emitting side lead frame on which a light emitting element is mounted and a light receiving side lead frame on which a light receiving element is mounted are arranged opposite to each other, and a portion where the light emitting side lead frame and the light receiving side lead frame are fitted after the opposing arrangement is provided. Including. By including this fitting part, in this embodiment, it becomes possible to stabilize the distance between light emission and light reception and suppress positional deviation without using spot welding. The above is the outline of the embodiment of the present invention.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view schematically showing an optical coupling element such as a photocoupler, which is created by sealing the optical coupling semiconductor device according to the present embodiment by a transfer molding method.

  This type of optical coupling element includes a single transfer mold type shown in FIG. 1-1 and a double transfer mold type shown in FIG. 1-2. In addition, since description regarding the single transfer mold type and the double transfer mold type has already been described in the [Technical Background] column, description thereof is omitted here.

  FIG. 5 is a diagram illustrating a plane and a side surface of a configuration example of the present embodiment. Referring to FIG. 5, the present embodiment includes a light emitting side lead frame 20 and a light receiving side lead frame 21. Here, the light emitting side lead frame 20 corresponds to the light emitting side lead frame 3 of FIG. Similarly, the light receiving side lead frame 21 corresponds to the light receiving side lead frame 4 of FIG.

  The light emitting side lead frame 20 includes a light emitting side header portion 22, a frame frame 24, a frame frame 25, a tie bar portion 26, a lead 27 and a projection portion 28. On the other hand, the light receiving side lead frame 21 includes a light receiving side header portion 23, a frame frame 24, a frame frame 25, a tie bar portion 26, a lead 27 and an opening 29.

  The light emitting element 1 is die-bonded to the light emitting side header portion 22. Similarly, the light receiving element 2 is die-bonded to the light receiving side header portion 23. The light emitting element 1 is realized by a light emitting diode such as an LED (Light Emitting Diode). The light receiving element 2 is realized by, for example, a photodiode. Both the light emitting diode and the photodiode are elements realized by a semiconductor. Therefore, both the light emitting element 1 and the light receiving element 2 correspond to the “semiconductor element” of the present invention. In the present embodiment, a lead frame including these semiconductor elements is fitted. And a semiconductor device is created using the lead frame after fitting. Therefore, the lead frame including these semiconductor elements is a part of the semiconductor device, and this embodiment corresponds to the “semiconductor device” of the present invention. The light emitting element 1 and the light receiving element 2 are examples of semiconductor elements. A semiconductor element other than the light emitting element 1 and the light receiving element 2 may be used as the semiconductor element.

  In the present embodiment, like the lead frame shown in FIG. 2, the tie bar portion is substantially orthogonal to the frame frame 24 and the frame frame 25 of both lead frames (the light-emitting side lead frame 20 and the light-receiving side lead frame 21). 26 extends from the tie bar portion 26 and leads 27 substantially parallel to the frame frame 24 and the frame frame 25, and the light emitting side header portion 22 and the light receiving side header portion 23 are connected to the tips of the leads 27.

  On the other hand, since it is not necessary to perform welding in the present embodiment, a welded portion that the lead frame shown in FIG. 2 has is not provided. Further, in the present embodiment, the light emitting side lead frame 20 and the light receiving side lead frame 21 include a protrusion 28 and an opening 29 which will be described later, and the light emitting side lead frame 20 and the light receiving side lead frame 21 are arranged to face each other. Since it is possible to use it as a reference for alignment at the time of forming, there is no reference hole as the lead frame shown in FIG. 2 has. However, this is not intended to prohibit the provision of a reference hole, and a reference hole may be provided.

  The protrusions 28 of the light emitting side lead frame 20 are provided for fitting and fixing both the lead frames after the light receiving side lead frame 21 and the light emitting side lead frame 20 are arranged to face each other. Further, the opening 29 of the light receiving side lead frame 21 is bent at the same position as the protrusion 28 provided on the light emitting side lead frame 20 when the light emitting side lead frame 20 and the light receiving side lead frame 21 are arranged to face each other. The projections 28 are provided so as not to interfere with the projections 28.

  FIG. 6 is an enlarged view of the protrusion 28 and the opening 29. Referring to FIG. 6, the protruding portion 28 includes a bent portion 30. A fitting claw 31 is provided at the end of the bent portion 30.

  The opening 29 includes an opening location 32.

  The bent portion 30 becomes a bent portion toward the opening 29 of the light receiving side lead frame 21 after the light emitting side lead frame 20 and the light receiving side lead frame 21 are arranged to face each other. When bent, the bent portion 30 has its root (a part represented by a broken line as an example in FIG. 6. As will be described later with reference to FIG. 8, the edge of the fitting claw 31 and the opening part 32 when fitted. Is determined by the relative positional relationship between and. Further, the fitting claw 31 is a claw having acute angles on both sides for fitting the light emitting side lead frame 20 and the light receiving side lead frame 21 together.

  The opening 32 has a shape that allows the fitting claw 31 to be fitted into the frame without interference when the protrusion 28 is bent. The opening 32 may have the same size as that of the bent portion 30, but it is preferable that the opening is slightly larger than the size of the bent portion 30 in consideration of the dimensional tolerance of the lead frame.

  Next, refer to FIG. Like FIG. 3, FIG. 7 is a plan view showing a state in which the light emitting side lead frame 22 and the light receiving side lead frame 23 are overlapped.

  Referring to FIG. 7, in this embodiment, the light emitting side lead frame 20 and the light receiving side lead frame 21 of the light receiving side lead frame 21 are opposed to each other, and both lead frames (the light emitting side lead frame 20 and the light receiving side lead 23) are opposed. The frames 21) are overlapped. After the overlapping, the protrusions 28 of the light emitting side lead frame 20 are bent in the direction of the opening 29 of the light receiving side lead frame 21 to fit both lead frames (the light emitting side lead frame 20 and the light receiving side lead frame 21). Fix it together.

  FIG. 8 is an enlarged view showing the fitting mechanism in the present embodiment.

  As shown in the left diagram (a) of FIG. 8, after the lead frames are overlapped, the bent portion 30 including the fitting claws 31 is clamped by a bending jig 33 having a clamping mechanism and a mechanism for bending 90 degrees. .

  Then, as shown in the right figure (b), the bent portion 30 is bent from the base of the bent portion 30 to the opening 29 side, and the fitting claw 31 and the light receiving side lead frame 21 are fitted. At this time, when the light receiving side lead frame 21 and the light emitting side lead frame 20 are disposed to face each other, the surface facing the other lead frame is defined as the first surface, and the surface on the back side of the first surface is defined as the second surface. In the case of a surface, the tip of the fitting claw 31 contacts the second surface of the light receiving side lead frame 21 with a predetermined pressure. The shape of the fitting claw 31 can be any shape depending on the pressure at which the fitting claw 31 is desired to be fitted, the strength of the fitting claw 31, the size of the fitting claw 31, and the like. In this respect, at the time of fitting, the fitting claw 31 preferably has a shape enough to bite into the light receiving side lead frame 21.

  Since the present embodiment described above can be fitted using the fitting claws, the light emitting side lead frame on which the light emitting element is mounted and the light receiving side lead frame on which the light receiving element is mounted are arranged opposite to each other to perform the overlapping process. When performing, it becomes possible to stabilize the distance between light emission and light reception without using spot welding and to suppress positional deviation.

  In addition, the shape of each part represented by FIG. 5 thru | or FIG. 8 is only an illustration. In the present embodiment, any shape or the like can be selected without departing from the gist of the present embodiment. For example, any shape, number, arrangement, etc. of each part included in the light emitting side lead frame 20 and the light receiving side lead frame 21 can be selected.

  In addition, this embodiment will be described on the assumption that this embodiment is applied to an optically coupled semiconductor device, but this embodiment is applicable to any semiconductor device other than an optically coupled semiconductor device.

[Description of operation]
Next, the operation of the present invention will be described in detail with reference to the accompanying drawings.

  The light emitting side lead frame 20 including the fitting protrusion 28 shown in FIG. 5 and the light emitting side header portion 22 and the light receiving side header portion 23 of the light receiving side lead frame 21 provided with the opening 29 are arranged to face each other. Both lead frames (light emitting side lead frame 20 and light receiving side lead frame 21) are overlapped (step S101). When superposed, the protrusion 28 and the opening 29 are arranged at the same position.

  After the overlapping, as shown in FIG. 8a, the center of the fitting claw 31 at the tip of the projection 28 is clamped by the bending jig 33 (step S102).

  After clamping, the bending jig 33 is moved to bend so that it bends from the base of the bent portion 30, and the bent portion 30 is bent toward the opening 29 (step S103). When bending, the moving direction and moving speed of the bending jig 33 are adjusted so that the protrusion 28 is not cut. When the bending portion 30 is bent forward, the projection 28 enters the opening 29, and the fitting claw 31 at the tip contacts the bottom surface of the light receiving side lead frame 21. As shown in FIG. 8 b, the fitting claw 31 is further bent until the bottom surface of the projection 28 that faces the opening end face is bent to be brought into contact with the opening end face. Bite into and fit.

  After completion of the fitting, the clamp of the bending jig 33 is released (step S104). If the fitting of all the protrusions 28 has not been completed (No in step S105), the protrusions 28 in the next row are clamped by the bending jig 33 (step S102), and the protrusions in this next row Step S103 is executed for 28.

  By completing the fitting of all the protrusions (Yes in step S105), the positions of the light emitting side lead frame 20 and the light receiving side lead frame 21 can be fitted and fixed.

  In addition, you may make it perform step S102, S103, and step S104 using the some bending jig | tool 33 and making the some bending part 30 into object simultaneously.

  Further, when the protrusions 28 provided on the frame frame 24 and the frame frame 25 of the lead frame are bent and fitted in step S103, the protrusions 28 facing the frame frame 24 and the frame frame 25 are simultaneously bent. It is preferable to clamp and bend and fit. By doing so, since the same load is applied to both sides (the frame frame 24 side and the frame frame 25 side), the displacement due to the load can be offset and stable fitting is possible.

  The embodiment of the present invention described above has many effects as described below.

  The first effect is that no residual distortion, warping, or bending occurs.

  The reason is that there is no need for spot welding or cutting the tie bar, and after the light-emitting side lead frame and the light-receiving side lead frame are placed opposite to each other, the effects of the heat generated by welding are achieved by fitting the two lead frames together. This is because it is possible to prevent residual distortion and warpage due to the occurrence of bending due to stress generated when the tie bar portion is cut off.

  The second effect is that there is no fear of misalignment in conveyance or the like due to the strong fitting.

  The reason is that, after the light emitting side lead frame and the light receiving side lead frame are arranged to face each other, the two lead frames are firmly fitted to each other, so that it is possible to prevent positional deviation caused by vibrations caused by conveyance.

  The third effect is that work time by electrode cleaning can be reduced.

  The reason is that the electrode cleaning time required to stabilize the welding fixation periodically because the method of fixing the opposing positions of both lead frames by fitting without using spot welding is used. It is because it can reduce.

  The fourth effect is that the position can be fixed without residual strain due to the welding process, and there is no need to consider the variation in welding strength.

  This is because spot welding is not used in order to fix the opposing positions of both lead frames by fitting.

  Moreover, although the above-described embodiment is a preferred embodiment of the present invention, the scope of the present invention is not limited only to the above-described embodiment, and various modifications are made without departing from the gist of the present invention. Implementation in the form is possible. An example of the change is described below.

  In the above-described embodiment, two lead frames, that is, the light-emitting side lead frame and the light-receiving side lead frame are arranged to be opposed to each other and fixed. However, the same result can be obtained by changing this so that one lead frame includes both the light-emitting side and the light-receiving side, and either the light-emitting side or the light-receiving side is reversed and disposed opposite to the other. . Referring to the left side of FIG. 10, one lead frame 100 includes both the light emitting side lead frame 20 and the light receiving side lead frame 21. An inversion reference line 101 is provided between the light emitting side lead frame 20 and the light receiving side lead frame 21.

  Then, the light emitting side lead frame 20 and the light receiving side lead frame 21 are reversed with respect to the other with the reversal reference line 101 as the center. Referring to the right side of FIG. 10, the shape after inversion is shown. After the reversal, by performing the processing from step S101 to step S105 in FIG. 9, it is possible to perform fitting as in the above-described embodiment.

  The components of the light emitting side lead frame 20 and the light receiving side lead frame 21 shown in FIG. 10 are the same as those of the light emitting side lead frame 20 and the light receiving side lead frame 21 shown in FIG. Illustration of components is omitted.

  Further, regarding the fitting, in the above-described embodiment, the protrusion is provided on the light-emitting side lead frame and the opening is provided on the light-receiving side lead frame. However, you may change so that this may be provided reversely. That is, the same result as in the above-described embodiment can be obtained even when the protrusion is provided on the light receiving side lead frame and the opening is provided on the light emitting side lead frame.

  Furthermore, both the light emitting side lead frame and the light receiving side lead frame may be provided with both a protrusion and an opening, respectively. In this case, if a protrusion is provided on one lead frame of the light-emitting side lead frame and the light-receiving side lead frame, an opening is provided on the other lead frame at a position facing this protrusion when they are overlapped. do it. Referring to FIG. 11, a light emitting side lead frame 20 and a light receiving side lead frame 21 are shown. As an example, the light emitting side lead frame 20 is provided with a protrusion 28, an opening 29, and a protrusion 28 from left to right. In addition, the light receiving side lead frame 21 is provided with an opening 29, a protrusion 28, and an opening 29 from left to right as an example. As described above, both the light emitting side lead frame 20 and the light receiving side lead frame 21 may include both the protrusions 28 and the openings 29, respectively. Then, the facing arrangement as shown in FIG. 7 is performed, and by performing the processing from step S101 to step S105 in FIG. 9, the fitting can be performed in the same manner as in the above-described embodiment.

  The components of the light-emitting side lead frame 20 and the light-receiving side lead frame 21 shown in FIG. 11 are the same as those of the light-emitting side lead frame 20 and the light-receiving side lead frame 21 shown in FIG. Illustration of some of the components is omitted.

  Further, a configuration may be adopted in which a protrusion is provided on one lead frame, the protrusion is bent after overlapping, and the other lead frame is sandwiched and fixed by the protrusion. In this case, a fitting claw need not be provided. This configuration will be described with reference to FIG. FIG. 12 is a view illustrating a side surface in a state where the light-emitting side lead frame 20 and the light-receiving side lead frame 21 are arranged to face each other. As shown in the uppermost part of FIG. 12, the light emitting side lead frame 20 includes a protrusion 28. Then, as shown in the middle part of FIG. 12, the protrusion 28 of the light emitting side lead frame 20 is bent 90 degrees toward the light receiving side lead frame 21. Up to this point, the method is the same as that described above with reference to FIG. However, in this configuration, the protrusion 28 is bent at 90 degrees by the light receiving side lead frame 21. By doing so, the protrusion 28 sandwiches the light receiving side lead frame 21, and the light receiving side lead frame 21 can be fixed without providing a fitting claw. In addition, when adopting this configuration example, the opening 29 may be provided, but the opening 29 may not be provided.

  A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.

(Appendix 1)
A first lead frame mounted with a semiconductor element;
A second lead frame mounted with a semiconductor element;
Either or both of the first lead frame and the second lead frame are bent to the other lead frame side when the first lead frame and the second lead frame are arranged to face each other. A semiconductor device comprising a protrusion for fitting and fixing the first lead frame and the second lead frame.

(Appendix 2)
The semiconductor device according to appendix 1, wherein
Either or both of the first lead frame and the second lead frame include an opening into which the protrusion enters when the protrusion is bent.

(Appendix 3)
The semiconductor device according to appendix 1 or 2,
When the first lead frame and the second lead frame are arranged to face each other, a surface facing the other lead frame is defined as a first surface, and a surface on the back side of the first surface is defined as a second surface. In the case of a surface, the fitting is fixed by contacting the second surface of the other lead frame that does not have the protruding portion with the protruding portion.

(Appendix 4)
The semiconductor device according to attachment 3, wherein
The semiconductor device according to claim 1, wherein the protrusion includes a nail for biting the second surface.

(Appendix 5)
The semiconductor device according to claim 1, wherein the first lead frame is a light emitting side lead frame on which a light emitting element is mounted, and the second lead frame is a light receiving side lead frame on which a light receiving element is mounted.

(Appendix 6)
A semiconductor device manufacturing method performed by a semiconductor device manufacturing apparatus,
Disposing a first lead frame having a semiconductor element mounted thereon and a second lead frame having a semiconductor element mounted thereon,
The first lead frame and the second lead frame are bent by bending a protrusion of one or both of the first lead frame and the second lead frame toward the other lead frame of the lead frame having the protrusion. Fitting and fixing the second lead frame;
A method for manufacturing a semiconductor device, comprising:

(Appendix 7)
A semiconductor device manufacturing apparatus for manufacturing a semiconductor device,
Means for opposingly arranging a first lead frame mounted with a semiconductor element and a second lead frame mounted with a semiconductor element;
The first lead frame and the second lead frame are bent by bending a protrusion of one or both of the first lead frame and the second lead frame toward the other lead frame of the lead frame having the protrusion. Means for fitting and fixing the second lead frame;
A semiconductor device manufacturing apparatus comprising:

  The present invention is suitable for general processing in which lead frames are opposed to each other and overlapped prior to molding, and can be applied to any semiconductor device.

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light receiving element 3 Light emitting side lead frame 4 Light receiving side lead frame 5 Silicone resin 6 Mold 7 Primary mold 8 Secondary mold 9 Light emitting side header part 10 Light receiving side header part 11 Reference hole 12 Welding points 13, 14 Frame frame 15 Tie bar portion 16 Lead 17 Upper electrode 18 Lower electrode 19 Weld fixing 20 Light emitting side lead frame 21 Light receiving side lead frame 22 Light emitting side header portion 23 Light receiving side header portion 24, 25 Frame frame 26 Tie bar portion 27 Lead 28 Protruding portion 29 Opening portion 30 Bending portion 31 Fitting claw 32 Opening location 33 Bending jig 100 Lead frame 101 Reverse reference line

Claims (7)

A first lead frame mounted with a semiconductor element;
A second lead frame mounted with a semiconductor element;
Either or both of the first lead frame and the second lead frame are bent to the other lead frame side when the first lead frame and the second lead frame are arranged to face each other. with the first lead frame and the second lead frame have a protruding portion for fitting and fixing,
When the first lead frame and the second lead frame are arranged to face each other, a surface facing the other lead frame is defined as a first surface, and a surface on the back side of the first surface is defined as a second surface. In the case of a surface, the fitting is fixed by contacting the second surface of the other lead frame that does not have the protruding portion with the protruding portion .   A first lead frame mounted with a semiconductor element;
  A second lead frame mounted with a semiconductor element;
  Either or both of the first lead frame and the second lead frame are bent to the other lead frame side when the first lead frame and the second lead frame are arranged to face each other. A T-shaped protrusion in plan view for fitting and fixing the first lead frame and the second lead frame, and a convex shape in plan view for the protrusion to enter when the protrusion is bent. And having an opening of
  When the first lead frame and the second lead frame are arranged to face each other, a surface facing the other lead frame is defined as a first surface, and a surface on the back side of the first surface is defined as a second surface. In the case of a surface, when the T-shaped protrusion is bent toward the opening, the T-shaped top is adjacent to both ends of the top of the convex opening. A semiconductor device characterized by engaging with a second surface of the portion. A first lead frame mounted with a semiconductor element;
  A second lead frame mounted with a semiconductor element;
  Both the first lead frame and the second lead frame are bent to the other lead frame side when the first lead frame and the second lead frame are disposed to face each other. A protrusion for fitting and fixing the lead frame and the second lead frame;
  Both the first lead frame and the second lead frame have an opening into which the protrusion is inserted when the other protrusion is bent. The semiconductor device according to claim 1,
Either or both of the first lead frame and the second lead frame include an opening into which the protrusion enters when the protrusion is bent. A semiconductor device according to any one of claims 1 to 4,
The semiconductor device according to claim 1, wherein the first lead frame is a light emitting side lead frame on which a light emitting element is mounted, and the second lead frame is a light receiving side lead frame on which a light receiving element is mounted. A semiconductor device manufacturing method performed by a semiconductor device manufacturing apparatus,
Disposing a first lead frame having a semiconductor element mounted thereon and a second lead frame having a semiconductor element mounted thereon ,
Before SL protrusions having any one or both of the first lead frame and the second lead frame, the first lead frame and the by bending the other lead frame of the lead frame having a protrusion portion Fitting and fixing the second lead frame;
Only including,
When the first lead frame and the second lead frame are arranged to face each other, a surface facing the other lead frame is defined as a first surface, and a surface on the back side of the first surface is defined as a second surface. In the case of a surface, the fitting is fixed by bending the protrusion so that the protrusion contacts the second surface of the other lead frame that does not have the protrusion. Semiconductor device manufacturing method. A semiconductor device manufacturing apparatus for manufacturing a semiconductor device,
Means for opposingly arranging a first lead frame mounted with a semiconductor element and a second lead frame mounted with a semiconductor element ;
Before SL protrusions having any one or both of the first lead frame and the second lead frame, the first lead frame and the by bending the other lead frame of the lead frame having a protrusion portion Means for fitting and fixing the second lead frame;
Only including,
When the first lead frame and the second lead frame are arranged to face each other, a surface facing the other lead frame is defined as a first surface, and a surface on the back side of the first surface is defined as a second surface. When the surface is a surface, the fitting is fixed by bending the protrusion so that the protrusion contacts the second surface of the other lead frame that does not have the protrusion. A semiconductor device manufacturing apparatus.

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