JP6039750B1 - Resin material supply device and compression molding device for compression molding device - Google Patents

Abstract

A resin material supply device for a compression molding apparatus that can uniformly supply a resin material to a cavity and does not contaminate the periphery of the device or hinder normal operation. In a resin material supply device of a compression molding apparatus, an upper slit plate (31) having a plurality of resin holding slits (33) and a lower slit plate (32) for closing and opening the resin holding slits (33) is provided. A flat portion is not provided on the top of the crosspiece 35 between the slits 33. Thereby, when the resin material is put into the resin holding slit 33, the resin material is not placed on the upper portion of the crosspiece 35, and when the resin material is supplied from the resin holding slit 33 to the cavity, excess resin material is supplied to the cavity. Instead, the planned uniform supply is realized. Further, since the resin material is not dropped when the resin material supply device is disposed on or removed from the cavity, the periphery of the device is not soiled or the normal operation thereof is not hindered. [Selection] Figure 2

Description

  The present invention relates to an apparatus for resin-sealing an electronic component such as a semiconductor chip, and in particular, a granular or powdery resin material for compression molding (hereinafter, these are collectively referred to simply as “resin material”). The present invention relates to a device that supplies a mold cavity to a mold cavity and a compression molding device.

  With the downsizing of electronic components and the resulting reduction in the diameter of bonding wires such as semiconductor chips, compression molding has been used for sealing molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a release film, heated and melted, and then clamped with an upper mold on which a substrate on which electronic components are mounted is clamped to compress the resin. Thus, molding is performed. In such compression molding, in order to perform molding without defects over the entire large-sized substrate, it is important to supply a predetermined amount of resin material to the cavities without excess or deficiency. If the amount of the resin material supplied to the cavity is non-uniform, the resin material flows (moves) in the cavity during mold clamping, which adversely affects wiring such as bonding wires on the electronic component substrate.

  In order to evenly supply a predetermined amount of resin material to the cavity, instead of directly supplying the resin material to the cavity from the supply unit storing the resin material, the resin material is once supplied to the resin tray with a uniform thickness, Thereafter, there is a method in which the resin material is dropped all over the cavity by opening a shutter on the lower surface of the resin tray (Patent Document 1, [0004]).

  However, in this method, when the shutter is opened, the resin material in the resin tray is dragged by friction with the upper surface of the shutter, and there are few in the first opening part (center part) and many in the last opening part (both end parts). The tendency to fall is seen (patent document 1, FIG. 6 (1)).

  For example, epoxy resins and silicone resins (these are called base resins) are used as resin materials for sealing electronic components, but in addition to these base resins, other substances (filled with this) are used for various purposes. May also be included). For example, silica (silicon oxide) powder, silica crystal, or the like may be included as a filler for the purpose of improving the thermal conductivity or reducing the thermal expansion coefficient. When such a resin material is supplied to a lower mold whose temperature is increased to about 170 ° C., for example, the base resin, which is a thermosetting resin having a melting temperature of 170 ° C. or less, melts, but some of the filler (for example, silica If so, the melting point is 1000 ° C. or higher.) Maintains a solid state. Since the compounding ratio (content ratio) of the filler such as silica in the resin material for sealing is usually 60 to 80 wt%, the base resin is melted when the resin material is supplied to the lower mold cavity. However, the shape of the resin material as a whole is maintained to some extent. Therefore, when the resin material is supplied to the lower mold in an uneven state, the resin material flows (from a portion with a large amount of supplied resin to a portion with a small amount of resin) by sealing and molding the mold. Resin flow) occurs, and electronic components are adversely affected (for example, the bonding wires are deformed and the wires come into contact with each other, or the bonding wires are disconnected).

  Therefore, in order to supply the resin material more evenly in the cavity, Patent Document 1 uses a method as shown in FIG. That is, a plurality of slit-shaped holding portions 132 are provided on the resin tray 131 (FIG. 12 is a cross-sectional view of a plane perpendicular to the longitudinal direction of the slit-shaped holding portions 132, and a cross section of the three slit-shaped holding portions 132. The resin material is evenly supplied from the supply section to the slit-shaped holding sections 132 of the resin tray 131. Then, by opening the shutter 133 at the bottom of the resin tray 131 in a direction perpendicular to the longitudinal direction of the slit-shaped holding part 132 (left and right in FIG. 12), the resin material falls into the cavity 134 from each slit-shaped holding part 132. (This is called a slit / shutter method).

  Similarly, as a method of using a resin tray having a plurality of slit-shaped holding portions, there is also a method shown in FIG. In this method, the resin tray 140 is composed of an upper tray 141 and a lower tray 142, and a number of parallel slits are formed in both. In this resin tray 140, the slit 143 of the upper tray 141 functions as a resin holding portion for holding the resin, and the slit 144 of the lower tray 142 is for dropping the resin material held in the slit 143 of the upper tray 141. Functions as an opening. The resin material is supplied to the slit 143 of the upper tray 141 in a state where the slits 143 and 144 of the upper and lower trays 141 and 142 are completely different (that is, the non-opening portion of the lower tray 142 blocks the opening portion of the upper tray 141). The resin tray 140 is placed on the cavity 155 (FIG. 13A). Then, by moving the upper tray 141 in a direction perpendicular to the slit 143, the resin material in the slit 143 of the upper tray 141 is dropped into the cavity 155 through the slit 144 of the lower tray 142 (FIG. 13B). Is called the vertical slit method).

  By using the slit / shutter method and the upper / lower slit method, the difference in the amount of resin material supplied between the center and the end of the cavity is eliminated. Further, by narrowing the slit width and increasing the number of slits, the resin material can be supplied almost evenly even in a wide cavity.

JP 2007-125783 A

  In both the slit / shutter method and the upper / lower slit method, first, a resin material is supplied to the slit 143 (the slit-shaped holding portion 132 in the slit / shutter method) of the upper tray 141 (resin tray 131 in the slit / shutter method). I have to leave. As shown in FIG. 14, the resin material is supplied to the slit 143 (slit-shaped holding portion 132 in the slit shutter system) of the slit plate (upper tray) 141 (resin tray 131 in the slit shutter system) as shown in FIG. This is performed by a resin supply mechanism 40 using a feeder. More specifically, while the resin material accommodated in the hopper 41 of the resin supply mechanism 40 is dropped from the supply port 42a at the tip of the linear feeder by the linear feeder 42 that vibrates at a predetermined frequency, the resin tray 140 (slit -In the shutter method, the mounting table 45 on which the resin tray 131) is mounted is moved at a predetermined speed, and the resin material is uniformly fed into the slit 143 of the upper slit 141 (in the slit shutter method, the slit-shaped holding portion 132 of the resin tray 131). I will do it. When the resin tray 140 (resin tray 131 in the slit / shutter method) is larger than the length of the linear feeder 42, the resin tray 140 is divided into a plurality of regions, and a resin material is introduced into each region. Also good. In FIG. 14C, since the length l of the linear feeder 42 is shorter than the length L of the resin tray 140, the resin tray 140 is divided into two regions, and after the resin material is put into one region, the motor M The mounting table 45 is rotated 180 ° (FIG. 14D), and the resin material is put into the other region.

  As described above, the linear feeder 42 supplies the resin material to each slit 143 in the manner of one-stroke writing. When the supply port 42a at the front end is closed and the supply of the resin material is stopped, the resin material stays in the supply port 42a, and when the supply port 42a is opened at the first position of the next slit 143, the staying resin The material is supplied there at once, and a larger amount of resin material is supplied than in other places. Therefore, even when the non-opening portion 145 between the slits 143 is straddled, the resin material is supplied as it is without closing the supply port 42a, so that the resin material is placed on the non-opening portion 145 (FIG. 14 (d)).

  In addition, when the resin material is supplied to the slit 143 portion, the resin material spreads while being dropped from the supply port 42a of the linear feeder, or a part of the resin material is not allowed to flow by a slight air flow. It will rest on the opening 145.

  The resin material placed on the non-opening is simultaneously supplied when the resin material in the slit is supplied to the cavity through the shutter (in the case of the slit shutter method) and the slit in the lower tray (in the case of the upper and lower slit method). Although the resin material in the slit is supplied uniformly, the amount of the resin material placed on the non-opening is not uniform, so that the resin material in the slit is not evenly distributed. The supply of the resin material becomes uneven. Even when the resin material placed on the non-opening is not supplied into the cavity and is left as it is, when the resin tray 131 or the resin tray 140 is placed on the cavity or removed from the cavity, it is in the vicinity of the lower mold. There is a risk of falling and soiling the periphery of the compression molding apparatus or entering a gap to hinder its normal operation.

  A problem to be solved by the present invention is to provide a resin material supply device for a compression molding apparatus that can uniformly supply resin material to a cavity and that does not contaminate the periphery of the apparatus or prevent normal operation. That is.

The resin material supply device of the compression molding device according to the present invention , which has been made to solve the above problems,
And resin retaining plate having a plurality of first resin holding hole, and a shutter mechanism for closing and opening the first resin holding hole, flat on top of the resin retaining plate between the first resin holding hole A first resin material supply unit having no part;
A plurality of resin material supply regions provided below the first resin material supply unit and corresponding to the resin holding plate are juxtaposed, and a plurality of resin material supply regions disposed in each of the plurality of resin material supply regions. A second resin material supply part having a second resin holding hole and a mechanism for supplying the resin material held in the second resin holding hole to the cavity of the lower mold;
The first resin material supply unit and the second resin are arranged such that the first resin material supply unit is disposed on any one of the plurality of resin material supply regions of the second resin material supply unit. A global movement unit that moves the relative position of the material supply unit;
It is characterized by providing .

In the resin material supply device of the compression molding apparatus according to the present invention, first, the plurality of first resin holding holes of the resin holding plate are closed by the shutter mechanism, and in this state, the resin material is placed in the plurality of first resin holding holes. And keep it in place. Then, by opening the first resin holding hole of the plurality of the shutter mechanism, dropping the resin material held in a plurality of first resin holding hole.

A resin material feeding apparatus of a compression molding apparatus according to the present invention does not be have a flat portion at the top of the resin retaining plate between the first resin holding hole, when placing a resin material to a plurality of first resin holding hole There is no resin material placed on top of the resin holding plate. Therefore, without extra minute resin material is supplied to the cavity, a uniform supply scheduled by a plurality of first resin holding hole is achieved.
Also, when this resin material supply device is placed on or removed from the cavity, the resin material falls to the vicinity of the lower mold and soils the periphery of the compression molding device, or enters the gap to prevent its normal operation. There is nothing.

In the resin material supply device of the compression molding apparatus according to the present invention, the plurality of first resin holding holes can be a plurality of parallel slit-like holes. In this case, the resin holding plate between the plurality of slit-like holes is a cross-like portion, but according to the present invention, there is no flat portion on the top of the cross-piece.

  In this case, the resin holding plate can be composed of a plurality of parallel bars and frames that fix the bars at both ends.

  Alternatively, the plurality of parallel bars and a frame for fixing the bars at both ends can be integrally formed.

When the plurality of first resin holding holes are formed in a plurality of parallel slits in this way, the shutter mechanism may be a shutter such as the slit / shutter method, or the same as the upper / lower slit method. It is good also as a slit board which has a parallel slit.

In the resin material supply device of the compression molding apparatus according to the present invention, the plurality of first resin holding holes may be holes having a square shape such as a quadrangle, a triangle, a circle, and an ellipse. In this case, these first resin holding holes are two-dimensionally arranged.
Also in this case, the shutter mechanism may be a shutter constituted by one or two plates that cover and open the lower surface of the resin holding plate, as in the slit / shutter method, or as in the upper / lower slit method. It is also possible to use a plate on which a plurality of similar holes are arranged.

According to the resin material supplying device of a compression molding apparatus according to the present invention, since there is no flat portion on top of the resin holding plate between a plurality of first resin holding hole, a resin material into a plurality of first resin holding hole supply When doing so, there is no resin material. Therefore, without excess resin material at the time of supplying the lower die cavity thereof compression molding apparatus of the resin material from a plurality of first resin holding hole it is supplied to the cavity, scheduled by a plurality of first resin holding hole Even supply is achieved.
Also, when this resin material supply device is placed on or removed from the cavity, the resin material falls to the vicinity of the lower mold and soils the periphery of the compression molding device, or enters the gap to prevent its normal operation. There is nothing.

Process drawing explaining the procedure (a)-(f) which performs compression molding using 1st Example of the resin material supply apparatus which concerns on this invention. A perspective view (a) and a sectional view (b) of the resin holding tray of the resin material supply apparatus of the same embodiment, and a plan view (c) and a sectional view (d) showing a state where the granular resin is put into the opening ). The flowchart explaining the procedure which supplies granular resin to a cavity by the resin material supply apparatus of the Example. Sectional drawing of the other example of the resin holding tray of the resin material supply apparatus of the Example. Sectional drawing (a) of resin holding tray of 2nd Example of the resin material supply apparatus which concerns on this invention, The figure (b) which shows the state which has injected | thrown-in granular resin to the resin holding part, and resin holding after that The figure which shows the state which shakes a tray and smoothes granular resin (c). The flowchart explaining the procedure which supplies granular resin to a cavity by the resin material supply apparatus of the Example. The top view (a) of the resin tray of 3rd Example of the resin material supply apparatus which concerns on this invention, XX 'sectional drawing (b), and sectional drawing (c), (d) of a modification. The top view (a) of the other resin tray of the resin material supply apparatus of the Example, XX 'sectional drawing (b), and YY' sectional drawing (c). The flowchart explaining the procedure which supplies granular resin to a cavity by the resin material supply apparatus of the Example. The top view (a) of the state which accumulated the small resin holding tray and the large resin holding tray of 4th Example of the resin material supply apparatus which concerns on this invention, and granular resin is supplied to a large resin holding tray from a small resin holding tray Sectional drawing (b) which shows a mode to do. The flowchart explaining the procedure which supplies granular resin to a cavity by the resin material supply apparatus of the Example. Explanatory drawing which shows the state which supplies the resin material to a cavity by the conventional slit shutter system. Explanatory drawing which shows the state which supplies the resin material to a cavity by the conventional up-and-down slit system. The perspective view (a) and side view (b) of the conventional resin holding tray of the up-and-down slit system, and the top view (c) and side view (d) which show the state which has poured the granular resin into the slit.

(First embodiment)
A procedure for compression molding of an electronic component using the first embodiment of the resin material supply apparatus 20 according to the present invention will be described with reference to FIG. The mold of the compression molding apparatus 10 used here includes an upper mold 11, a lower mold 12, and an intermediate plate 13. A cavity 121 of the lower mold 12 is rectangular in plan view. It should be noted that the present invention can be applied without change even if the plane shape of the cavity is a triangle, square, rhombus, ellipse, circle or the like. The resin material supply device 20 includes a resin holding tray 21 composed of upper and lower slit plates and a slit plate moving mechanism 22 that moves the slit plates of the resin holding tray 21. The resin material supply device 20 will be described in detail later. In this embodiment, a granular resin is used as the resin material, but it may be in the form of powder or the like as long as it can be put into the resin holding tray 21 and can be supplied from the slit to the cavity.

  First, the substrate 15 on which the electronic component is mounted is set on the substrate setting portion 111 of the upper mold 11 with the mounting surface facing downward (FIG. 1 (a)). Before or after that, the release film roll on the supply side and the take-up side provided across the lower mold 12 is rotated, and a new release film 16 drawn from the release film roll on the supply side is inserted into the cavity of the lower mold 12. It is stretched above 121. Next, the lower die 12 is raised with the intermediate plate 13 fixed, and the intermediate plate 13 and the film presser 122 of the lower die 12 are brought into contact with each other through the release film 16. Further, by raising the lower mold 12 with the intermediate plate 13 fixed, the contact surface between the intermediate plate 13 and the film presser 122 of the lower mold 12 is pushed down with respect to the cavity 121. The release film 16 on the cavity 121 is stretched by pressing down the contact surface between the intermediate plate 13 and the film presser 122 of the lower mold 12. And the cavity 121 is coat | covered with the release film 16 by attracting | sucking the release film 16 from the cavity 121 side (FIG. 1 (a), (b)).

  The resin holding tray 21 for holding the granular resin is disposed on the cavity 121 as shown in FIG. 1B, and the granular resin is supplied into the cavity 121 (FIG. 1C). After the granular resin is melted by the heat of the lower mold 12 (FIG. 1 (d)), the lower mold 12 is brought close to the upper mold 11, the electronic component is immersed in the molten resin, and the resin is pressed by the cavity bottom member 123. (FIG. 1 (e)). After the resin is cured, the upper mold 11, the lower mold 12 and the intermediate plate 13 are opened to obtain a resin-sealed molded product of an electronic component (FIG. 1 (f)).

Next, the resin material supply apparatus 20 of the present embodiment will be described in detail with reference to FIGS.
As shown in FIGS. 2A and 2B, the resin holding tray 21 includes an upper slit plate 31 and a lower slit plate 32 that are in contact with each other. Each of the upper slit plate 31 and the lower slit plate 32 has eight slits 33 and 34 that are parallel openings, and crosspieces 35 and 36 that are non-openings therebetween. In the lower slit plate 32, the slit 34 and the crosspiece 36 have the same width. As shown in FIG. 2 (b), each slit 33 of the upper slit plate 31 has the same width as the slit 34 of the lower slit plate 32 on the lower surface of the upper slit plate 31, and gradually increases from there to the upper surface side. It expands, and adjacent slits 33 come into contact with each other on the upper surface. That is, the crosspiece 35 has a mountain shape in cross section, and there is no flat portion at the top. The cross section of the crosspiece 35 may have an inclined portion only at the upper portion as shown in FIG. 4 (a), or the upper portion is semicircular as shown in FIG. 4 (b). It may be a thing. Note that, in each of the lower surface of the upper slit plate 31 and the lower slit plate 32, the width of the slit and the width of the non-opening portion between adjacent slits may not be the same. Of course, the number of slits 33 and 34 is not limited to eight. Furthermore, the width of the slit 34 of the lower slit plate 32 may be larger than the width of the lower surface side of the slit 33 of the upper slit plate 31.

  The upper slit plate 31 may be an integrated type in which a plurality of bars 35 and a frame 37 for fixing them are integrally formed, or may be an assembled type in which both parts are assembled. The same applies to the lower slit plate 32.

  The upper slit plate 31 and the slit 33 of the upper slit plate 31 act as a resin holding plate and a resin holding hole, respectively, and the slit 34 of the lower slit plate 32 is held by the resin holding hole (the slit 33 of the upper slit plate 31). Acts as an opening for dropping the granular resin. The crosspiece 36 between the adjacent slits 34 of the lower slit plate 32 acts as a shutter that closes the slit 33 of the upper slit plate 31. In the initial state, the resin holding tray 21 has the upper slit plate 31 and the lower slit plate 32 overlapped so that all the slits 33 of the upper slit plate 31 are completely closed by the crosspieces 36 of the lower slit plate 32. (FIGS. 2 (b) and (c)).

  The resin holding tray 21 is provided with a slit plate moving mechanism 22, which is in a state where the upper surface of the lower slit plate 32 of the resin holding tray 21 is in contact with the lower surface of the upper slit plate 31, and The upper slit plate 31 is moved in a direction perpendicular to the longitudinal direction of the slits 33 and 34 while keeping the slits 33 and 34 of both the slit plates 31 and 32 in parallel. The lower slit plate 32 does not necessarily need to be in contact with the lower surface of the upper slit plate 31, and may be at least close to the granular resin. As a drive source of the slit plate moving mechanism 22, a motor, an air cylinder, a hydraulic cylinder, or the like can be used. The operation of the slit plate moving mechanism 22 may be performed manually by providing a handle on the upper slit plate 31.

The operation of each part when the granular resin is supplied into the cavity of the compression molding apparatus using the resin material supply apparatus 20 is as follows (FIG. 3).
First, a predetermined amount of granular resin is uniformly charged into the eight slits (resin holding portions) 33 of the upper slit plate 31 of the resin holding tray 21 (step S11). The granular resin can be charged in a one-stroke manner using the above-described resin supply mechanism 40 (FIG. 2 (c)).

  At this time, the crosspiece 35 of the upper slit plate 31 has a mountain shape in cross section, and there is no flat portion at the top, so that the crosspiece 35 is moved while the supply port 42a at the tip of the linear feeder 42 moves by one stroke. The granular resin dropped on the crosspiece 35 when straddling is dropped into one of the front and rear slits 33. That is, the granular resin does not remain on the crosspiece 35 of the upper slit plate 31 as in the prior art.

  Thereafter, the resin holding tray 21 holding the granular resin in the slit 33 of the upper slit plate 31 is moved together with the slit plate moving mechanism 22 onto the cavity 121 covered with the release film 16 of the compression molding apparatus 10. A base table 23 having an opening having the same shape as the cavity 121 is provided on the lower surface of the resin holding tray 21, and the resin holding tray 21 can be moved on the base table 23. By placing the base 23 on the periphery of the cavity 121, the resin holding tray 21 is disposed immediately above the cavity 121 (step S12, FIG. 1B). Note that the size of the opening of the base table 23 is the same as or slightly smaller than the size of the opening of the cavity 121.

  Thereafter, the upper slit plate 31 is moved by the slit plate moving mechanism 22 with the lower surface kept in contact with the upper surface of the lower slit plate 32 as described above, and the slits 33 and 34 of both the slit plates 31 and 32 are moved. While maintaining the parallel state, the slits 33 and 34 are moved at a predetermined speed in a direction perpendicular to the longitudinal direction of the slits 33 and 34 (step S13).

  The upper slit plate 31 may be moved by one pitch of the slit 33 (= width of the slit 33 + width of the crosspiece 35) or may be reciprocated a plurality of times. In any case, the speed at which the upper slit plate 31 is moved is set to such a value that the granular resin held in the slit (resin holding part) 33 falls during such movement. This speed is obtained in advance by experiments.

  After the upper slit plate 31 is moved as described above, the slit plate moving mechanism 22 is stopped (step S14).

  As described above, since the granular resin does not remain in the upper part of the upper slit plate 31, a predetermined amount of the granular resin uniformly fed into the slit 33 is all supplied into the lower mold cavity 121 and is scheduled. Even supply is achieved.

(Second embodiment)
A second embodiment of the resin material supply apparatus of the compression molding apparatus according to the present invention will be described with reference to FIGS. In the resin material supply apparatus of this embodiment, the resin holding tray 50 is composed of an upper slit plate 51 and a lower slit plate 52 as in the first embodiment. The lower slit plate 52 has the same configuration as the lower slit plate 32 of the first embodiment, and includes a slit 54 and a crosspiece 56 that is a non-opening portion. In the upper slit plate 51, as shown in FIG. 5A, the height of the crosspiece 55 is lower than the height of the frame 57 (the position of the upper surface). Therefore, one large space 58 surrounded by the frame 57 is formed above the upper slit plate 51.
In the resin material supply apparatus of the present embodiment, the upper slit plate 51 functions as a resin holding plate, and the slit 53 of the upper slit plate 51 and the space 58 above them function as a resin holding hole. The operation of the other parts is the same as in the first embodiment.

The operation of each part when the granular resin is supplied to the cavity 121 of the compression molding apparatus using this resin material supply apparatus is as follows (FIG. 6).
First, a predetermined amount of granular resin is introduced (supplied) from the feeder 47 into each slit 53 of the upper slit plate 51 constituting the resin holding tray 50 (step S21, FIG. 5 (b)). Here, since the total capacity of each slit 53 is set to be smaller than the amount of granular resin necessary for resin sealing, the granular resin supplied from the feeder 47 enters the space 58 above the slit 53. Is also housed. After charging a predetermined amount of granular resin, the mounting table 45 on which the resin holding tray 50 is placed is vibrated back and forth and left and right, so that the granular resin in the upper slit plate 51 is evenly distributed (step S22, FIG. 5). (c)). Also in step S21, the granular resin may be evenly charged into the slit 53 (and the space 58 above it) in the same manner as in step S11.

  Thereafter, the same operations as in steps S12 to S14 are performed, and the granular resin is uniformly supplied into the cavity 121 of the compression molding apparatus. That is, the resin holding tray 50 is moved together with the slit plate moving mechanism 22 onto the cavity 121 covered with the release film 16 of the compression molding apparatus 10 (step S23), and the upper slit plate 51 is placed on the lower surface of the lower slit plate. 52 with the slits 53 and 54 of both the slit plates 51 and 52 kept parallel to each other and moved in a direction perpendicular to the longitudinal direction of the slits 53 and 54 at a predetermined speed. (Step S24) After moving the upper slit plate 51 by a predetermined distance or number of times, the slit plate moving mechanism 22 is stopped (Step S25).

  Also in this embodiment, since there is no flat portion on the top of each crosspiece 55 of the upper slit plate 51, when resin is supplied from the resin holding tray 50 to the cavity 121, granular resin remains on the crosspiece 55 or remains. The granular resin is not unevenly supplied into the cavity.

(Third embodiment)
A third embodiment of the resin material supply apparatus of the compression molding apparatus according to the present invention will be described with reference to FIG. The resin material supply apparatus of this embodiment includes a plate-like resin tray 61 in which rectangular openings 62 are two-dimensionally arranged, and a plate-like shutter 66 of the same size provided on the lower surface thereof. The plurality of openings 62 are partitioned by a crosspiece 63, and the crosspiece 63 has a mountain-shaped cross section at the top as shown in FIG. 7 (b). The cross-sectional shape of the crosspiece 63 may be semicircular at the top as shown in FIG. 7 (c), and as shown in FIG. It may be. Further, the planar shape of the opening may be a rectangle, a triangle, a diamond, a circle, an ellipse, or the like. As an example, FIG. 8 shows a plan view (a), a cross-sectional view XX ′ (b), and a cross-sectional view YY ′ of the resin tray 67 when the opening 68 defined by the crosspieces 69 is circular. (c) is shown.
In the resin material supply apparatus of this embodiment, the resin tray 61 functions as a resin holding plate, and the opening 62 functions as a resin holding hole.

The operation of each part when the granular resin is supplied into the cavity of the compression molding apparatus using this resin material supply apparatus is as follows (FIG. 9).
First, a predetermined amount of granular resin is uniformly charged into the openings 62 of the resin tray 61 (step S31). The granular resin can be charged in a one-stroke manner using a resin supply mechanism 40 as shown in FIG.

  Thereafter, the resin tray 61 is moved onto the cavity covered with the release film 16 of the compression molding apparatus 10 (step S32). Thereafter, the shutter 66 closing the opening 62 is opened, and the granular resin is spread over the entire surface of the cavity. (Step S33).

  As described above, the cross section of the crosspiece 63 of the resin tray 61 has a mountain shape, and since there is no flat portion at the upper portion, granular resin does not remain on the upper portion of the resin tray as in the past. As a result, excess granular resin is not supplied into the cavity.

(Fourth embodiment)
An embodiment of the resin material supply device according to the present invention in the case where the substrate to be resin-sealed is large (and therefore the cavity is also large) will be described with reference to FIG.
The resin material supply apparatus of this embodiment includes a small resin holding tray 70 and a large resin holding tray 80 that is four times as large as the small resin holding tray 70. The small resin holding tray 70 has the same configuration as the resin holding tray 21 of the first embodiment, and includes an upper slit plate 71 having a slit 73 and a mountain-shaped bar 75 and a lower slit plate 72 having a slit 74 and a bar 76. . The large resin holding tray 80 has the same width as the slit 73 and the crosspiece 75 of the small resin holding tray 70 and the length of the slit 83 and the crosspiece 85 that are twice as long, and the same as the slit 74 and the crosspiece 76, respectively. It consists of a lower slit plate 82 provided with a slit 84 and a crosspiece 86 that are twice as wide as the length.

The operation of each part when the granular resin is supplied to the cavity using this resin material supply device is as follows (FIG. 11).
First, similarly to step S11, a predetermined amount of granular resin is uniformly charged into the slits 73 of the upper slit plate 71 of the small resin holding tray 70 (step S41). The small resin holding tray 70 is placed on the section 1 of the large resin holding tray 80 (step S42), and the lower slit plate 72 is moved in the same manner as in step S13. The above-mentioned amount of granular resin is evenly charged into a slit 83 (step S43). Thereafter, it is determined whether the small resin holding tray 70 is placed on the other sections 2 to 4 of the large resin holding tray 80 and the granular resin is put into the slit 83 (step S44). Repeat steps S41 to S43 for any of the following divisions 2 to 4, and evenly put an appropriate amount of granular resin into the slits 73 of all divisions 2 to 4 of the large resin holding tray 80. To do.

  Since the crosspiece 75 of the upper slit plate 71 of the small resin holding tray 70 and the crosspiece 85 of the upper slit plate 81 of the large resin holding tray 80 do not have a flat portion at the top, the flat plate of the upper slit plate as in the prior art. The granular resin does not remain.

  If Yes in step S44, the process proceeds to the next step, and the granular resin is evenly supplied into the cavity by performing the same operations as in steps S12 to S14 on the large resin holding tray 80 (steps S45 to S45). S47).

The resin material supply apparatus of the above embodiment is an example of the present invention, and appropriate modifications, corrections, and additions are permitted within the scope of the present invention. For example, in the first, second, and fourth embodiments, only the upper slit plate is moved by the slit plate moving mechanism, but it is sufficient if the resin material can be uniformly supplied from the slit of the resin holding tray to the cavity. Only the lower slit plate may be moved, or both the upper slit plate and the lower slit plate may be moved.
Moreover, in the said Example, although granular resin is used as a resin material, the same apparatus can be used even if this is powdered resin.

DESCRIPTION OF SYMBOLS 10 ... Compression molding apparatus 11 ... Upper mold 111 ... Substrate setting part 12 ... Lower mold 121 ... Cavity 123 ... Cavity bottom member 13 ... Intermediate plate 15 ... Substrate 16 ... Release film 20 ... Resin material supply apparatus 21 ... Resin holding tray 22 ... Slit plate moving mechanism 23 ... Base stand 31 ... Upper slit plate (resin holding plate)
33 ... Slit (resin holding hole)
35 ... Crosspiece 32 ... Lower slit plate 34 ... Slit 36 ... Crosspiece (shutter)
37 ... frame 40 ... resin supply mechanism 41 ... hopper 42 ... linear feeder 42a ... supply port 45 ... mounting table 47 ... feeder 50 ... resin holding tray 51 ... upper slit plate (resin holding plate)
53 ... Slit (resin holding hole)
55 ... Crosspiece 57 ... Frame 58 ... Space (resin holding hole)
52 ... Lower slit plate 54 ... Slit 56 ... Crosspiece (shutter)
61, 67 ... Resin tray (resin holding plate)
62, 68 ... opening (resin holding hole)
63, 69 ... Cross 66 ... Shutter 70 ... Small resin holding tray 71 ... Upper slit plate 73 ... Slit 75 ... Cross 72 ... Lower slit plate 74 ... Slit 76 ... Cross 80 ... Large resin holding tray 81 ... Upper slit plate 83 ... Slit 85 ... Crosspiece 82 ... Lower slit plate 84 ... Slit 86 ... Crosspiece 131 ... Resin tray 132 ... Slit-shaped holding part 133 ... Shutter 134 ... Cavity 140 ... Resin tray 141 ... Upper tray 143 ... Slit 142 ... Lower tray 144 ... Slit 145 ... Non-opening 155 ... cavity

Claims (10)

And resin retaining plate having a plurality of first resin holding hole, and a shutter mechanism for closing and opening the first resin holding hole, flat on top of the resin retaining plate between the first resin holding hole A first resin material supply unit having no part;
A plurality of resin material supply regions provided below the first resin material supply unit and corresponding to the resin holding plate are juxtaposed, and a plurality of resin material supply regions disposed in each of the plurality of resin material supply regions. A second resin material supply part having a second resin holding hole and a mechanism for supplying the resin material held in the second resin holding hole to the cavity of the lower mold;
The first resin material supply unit and the second resin are arranged such that the first resin material supply unit is disposed on any one of the plurality of resin material supply regions of the second resin material supply unit. A global movement unit that moves the relative position of the material supply unit;
Resin material supplying device of a compression molding apparatus comprising: a. The resin material supply device for a compression molding apparatus according to claim 1, wherein the plurality of first resin holding holes are a plurality of parallel slit-shaped holes. The resin material supply device of the compression molding device according to claim 2, wherein a cross-sectional shape of an upper portion of the crosspiece between the plurality of first resin holding holes is a triangle. The resin material supply device of the compression molding apparatus according to claim 2, wherein a cross-sectional shape of an upper portion of the crosspiece between the plurality of first resin holding holes is a semicircular shape.   5. The resin holding plate according to claim 1, wherein the resin holding plate includes a plurality of parallel bars and a frame for fixing the plurality of bars at both ends. Resin material supply device for compression molding equipment.   5. The resin holding plate according to claim 1, wherein a plurality of parallel bars and a frame for fixing the plurality of bars at both ends are integrally formed. The resin material supply apparatus of the compression molding apparatus in any one.   The resin material supply device of a compression molding apparatus according to any one of claims 1 to 6, wherein the shutter mechanism is one or two plates that cover and open the lower surface of the resin holding plate. The shutter mechanism is a plate having a plurality of holes similar to the plurality of first resin holding holes of the resin holding plate that covers and opens the lower surface of the resin holding plate. The resin material supply apparatus of the compression molding apparatus in any one of.   The resin material supply device for a compression molding apparatus according to any one of claims 1 to 8, wherein the resin holding plate includes a frame and a crosspiece having a height lower than the frame. And resin retaining plate having a plurality of first resin holding hole, and a shutter mechanism for closing and opening the first resin holding hole, flat on top of the resin retaining plate between the first resin holding hole A first resin material supply unit having no part;
A plurality of resin material supply regions provided below the first resin material supply unit and corresponding to the resin holding plate are juxtaposed, and a plurality of resin material supply regions disposed in each of the plurality of resin material supply regions. A second resin material supply part having a second resin holding hole and a mechanism for supplying the resin material held in the second resin holding hole to the cavity of the lower mold;
The first resin material supply unit and the second resin are arranged such that the first resin material supply unit is disposed on any one of the plurality of resin material supply regions of the second resin material supply unit. A global movement unit that moves the relative position of the material supply unit;
A compression molding apparatus comprising a resin material supply apparatus having

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