JP6037714B2 - Docking connector - Google Patents

Description

  The present invention relates to a docking connector incorporated into a docking station, and more particularly to a docking connector incorporating a chip connector.

A portable electronic device such as a portable personal computer (hereinafter referred to as a notebook PC) is designed to be thin and compact so that a disk drive device and a plurality of expansion functions are omitted. For this purpose, a docking station is provided that allows these functions to be expanded. The function can be expanded by connecting the notebook PC to the docking station.
The notebook PC is connected by fitting a docking connector protruding from the mounting surface of the thin box-shaped docking station and an expansion connector provided on the bottom surface of the notebook PC.

JP 2001-066711 A Japanese Patent Application Laid-Open No. 06-168062

  However, when the amount of signal transmission increases and the number of connector poles increases, the operation for connecting the notebook PC to the docking station becomes difficult. For example, there is a risk of damage to the electronic device due to an increase in the force required for fitting the connector. Further, since the docking connector is provided with a hole formed in the mounting surface of the docking station and facing the hole, there is a possibility that dust and water droplets may enter the docking station through the gap generated here. In addition, since the docking connector is provided in a protruding shape with a relatively high height on the flat mounting surface, it may collide with the electronic device during attachment and detachment, and both may be damaged. In addition, an increase in the number of poles also increases the space required for the capacitors assembled on the wiring board in order to remove noise.

  The present invention has been made in view of the above circumstances, and one of its purposes is to provide a docking connector that can reduce the force required to insert and remove a notebook PC. Another object is to provide a docking connector in which no holes or gaps are formed on the surface of the docking station. Yet another object is to provide a docking connector with a flat docking station surface. Still another object is to provide a docking connector that can reduce the space required for a capacitor assembled on a wiring board.

In order to achieve the above object, a docking connector of the present invention includes (1) a flat columnar chip capacitor having electrodes on both end faces, and an insulating housing having an upper surface and a bottom surface for holding the chip capacitor, Of the electrodes of the chip capacitor, when the bottom surface direction is the height direction, the direction orthogonal to the height direction is the axial direction, and the direction orthogonal to both the height direction and the axial direction is the width direction At least the upper surface side electrode is regularly and regularly held along the axial direction or the width direction in such a manner that it is exposed on the surface of the housing , and at least the upper surface side electrode among the exposed electrodes. Is characterized in that it has a conductive member having elasticity.

According to the present invention, the docking connector incorporates the chip capacitor, the flat electrode of the chip capacitor is exposed at least on the upper surface side of the housing, and the surface of the electrode is coated with the conductive member. Thereby, the flat electrode of the chip capacitor coated with the conductive member can be used as the electrode of the docking connector. Therefore, since the electrode of the docking connector which is flat and elastic can be obtained, for example, the extension connector on the notebook PC side is provided with an electrode which is flat with respect to the bottom surface, and the position (arrangement) of the electrode If the positions (arrangements) of the electrodes of the docking connector are matched, electrical connection can be established simply by placing the notebook PC at a predetermined location of the docking station. As a result, the force required for the insertion / removal operation of the notebook PC with the docking station can be reduced.

  The chip capacitor electrode may be exposed not only on the upper surface side of the housing but also on the bottom surface side. In this case, the flat electrode of the chip capacitor may be coated with an elastic conductive member. Alternatively, an original metal electrode that is not coated with a conductive member may be used.

  The conductive member may be a conductive resin imparted with conductivity by carbon particles added to the synthetic resin, or may be, for example, a conductive rubber imparted with conductivity to silicone rubber. Further, it may be a conductive elastomer that is a resin having elasticity. Moreover, instead of carbon, conductivity may be imparted with metal particles such as a silver filler, or conductive particles with the surface of resin beads plated with gold may be added.

  According to the present invention, since the docking connector has a built-in chip capacitor, it is provided with a filter function that allows only a necessary frequency to pass by selecting its capacitance. Therefore, it is possible to configure a high-pass filter that removes noise components in a relatively low frequency band. As a result, there is no need to mount a capacitor on the wiring board, and the space for this can be used effectively.

  The chip capacitor may be selected from a ceramic multilayer chip capacitor, a chip tantalum electrolytic capacitor, a chip aluminum electrolytic capacitor, or the like that is generally available on the market. These chip capacitors are block bodies in which elements are sealed with a thermosetting resin or the like, and electrodes may be formed on both end faces with a copper alloy such as phosphor bronze or an iron alloy such as 42 alloy. .

  The chip capacitor may be embedded in the housing by a so-called insert molding method. That is, the chip capacitor is set at a predetermined position in the housing molding die, and the base material is cast into the cavity in this state. According to this method, since the chip capacitor is embedded simultaneously with the molding of the housing, the working efficiency can be improved. In addition, when a ceramic multilayer capacitor is selected as the chip capacitor, the capacitor itself is generally fired at a temperature of several thousand hundred degrees, so that there is no possibility of deterioration of the element at the molding temperature.

  The housing material may be an insulating synthetic resin, a synthetic rubber such as silicone or urethane, or a flexible elastomer. When rubber or elastomer is selected, a thin and flexible sheet-like docking connector can be obtained.

More preferably, the docking connector of the present invention includes (2) an opening for housing the chip capacitor on the one surface of the housing, and a housing chamber connected to the opening, and is incorporated in the housing. (1) characterized in that it comprises a conductive member comprising a connection portion connected to the electrode on the side opposite to the opening of the chip capacitor and a mounting portion exposed to the bottom surface of the housing connected to the connection portion. As described.

  According to the present invention, since the chip capacitor is assembled in the completed housing after molding, the housing can be molded efficiently. The housing includes a conductive member for connecting the electrode of the chip capacitor and the wiring board on the bottom surface. For example, when a plate-like copper alloy is used for the conductive member, a solder reflow method can be used as means for connecting the docking connector to the docking station.

  The conductive member may be a conductive resin imparted with conductivity by carbon particles, or a conductive rubber. Further, it may be a conductive elastomer that is a resin having elasticity. Moreover, what was provided with electroconductivity by the metal particle may be added, and the electroconductive particle by which the surface of the resin bead was gold-plated may be added.

More preferably, in the docking connector of the present invention, (3) the opening includes a cover, the cover includes a flat elastic external electrode, and the electrode of the chip capacitor is connected to the external electrode. (2) which is characterized in that it is provided with a connecting means.

  According to the present invention, since the opening of the housing is sealed with the cover having the flat elastic electrode, the docking connector has a recess for the docking connector on the mounting surface of the notebook PC of the docking station. The docking connector can be mounted flush with the mounting surface by fitting the docking connector into the recess. Thereby, the docking connector which does not produce a protrusion part in a mounting surface can be assembled | attached.

  According to the present invention, the docking connector is fitted into the recess formed in the mounting surface of the docking station. Since the docking connector has a housing chamber for housing a block-shaped chip capacitor therein and flat electrodes on the upper and lower surfaces, the outer shape thereof can take a simple rectangular shape, for example. As a result, the docking connector can be fitted into the recess without a relatively gap, and entry of dust and water droplets can be suppressed.

  More preferably, in the docking connector of the present invention, (4) the cover is made of an elastic conductive member, and the conductive member is electrically connected to the electrode on the opening side of the chip capacitor, and the cover The outer surface of is described in (3) characterized in that an external electrode is formed.

  According to the present invention, since the cover is made of an elastic conductive member, the cover itself is provided with connection means for connecting the electrode of the chip capacitor to the external electrode. Thereby, the structure of the cover becomes simpler, and it becomes easier to reduce the flushness with the mounting surface of the docking station and the recess.

  The conductive member may be a conductive resin, a conductive elastomer, a conductive rubber, or an anisotropic conductive sheet having a property of flowing electricity in a specific direction, and these are carbon particles added to the base material. In addition, metal particles such as silver and gold, or those plated with these metal particles may be used. Of course, the cover may be formed of metal.

  More preferably, the docking connector of the present invention is (5) described in (4), wherein the conductive member is a conductive resin obtained by dispersing carbon particles in a synthetic resin material.

  According to this invention, since the cover is made of a conductive resin added with carbon, a docking connector having excellent corrosion resistance can be obtained.

  More preferably, the docking connector of the present invention is characterized in that (6) the cover is made of a conductive resin, and the cover is secondarily formed in a state where the chip capacitor is housed in the housing chamber of the housing. (5) which has this.

  According to the present invention, since the cover is made of conductive resin and is subjected to secondary molding in a state in which the chip capacitor is accommodated, the sealing operation is facilitated and the outer shape of the cover is obtained as usual. Thereby, a flat surface is obtained with respect to the mounting surface of the docking station. Further, the gap with the recess is also reduced.

More preferably, the docking connector of the present invention is (7) the chip capacitor according to any one of (1) to (6) characterized in that the chip capacitor has a capacity of 50 nF to 200 nF (nanofarad). is there.

  According to the present invention, since the chip capacitor of 50 nF to 200 nF is built in, a high-pass filter that cuts a relatively low frequency of 10 kHz or less is configured. As a result, a high-frequency signal with reduced noise components can be obtained.

FIG. 1 is an external perspective view and a partially exploded view of a docking connector according to an embodiment of the present invention. FIG. 2 is an external perspective view of the docking connector viewed from the bottom. FIG. 3 is a sectional view taken along line III-III in FIG. FIG. 4 is an external perspective view of a contact of the docking connector according to the embodiment of the present invention. FIG. 5 is an external perspective view of the chip capacitor of the docking connector. FIG. 6 is an external perspective view of the cover of the docking connector. FIG. 7 is a cross-sectional view showing a method for mounting the docking connector. FIG. 8 is an external perspective view showing a method for connecting a docking stage incorporating the docking connector and a notebook computer. 9 is a cross-sectional view taken along line VIII-VIII in FIG.

  Although embodiments of the present invention will be described with reference to the accompanying drawings, the technical scope of the present invention is not limited by these embodiments, and can be implemented without departing from the spirit of the invention. FIG. 1 is an external perspective view and a partially exploded view of a docking connector according to an embodiment of the present invention. FIG. 2 is an external perspective view of the docking connector viewed from the bottom. FIG. 3 is a sectional view taken along line III-III in FIG. FIG. 4 is an external perspective view of a contact of the docking connector according to the embodiment of the present invention. FIG. 5 is an external perspective view of the chip capacitor of the docking connector. FIG. 6 is an external perspective view of the cover of the docking connector. In addition, unless otherwise indicated, the indication direction in description follows the direction indication defined in drawing.

<Outline of docking connector>
As shown in FIG. 1, the docking connector 1 according to the embodiment of the present invention houses a chip capacitor 40 in a pocket-shaped housing chamber 101 provided in a two-row arrangement in a housing 10, and an opening 102 thereof covers a cover 20. It is sealed with. The cover 20 is made of a conductive resin and also has an electrode function. The housing 10 may be a synthetic resin injection molded product such as PBT or nylon.

<housing>
As shown in FIG. 1, the housing 10 accommodates a block-shaped chip capacitor 40 along the direction of the electrode axis provided on both sides, and has a bottom wall having a depth such that the chip capacitor 40 is not exposed from the perforations, and The housing chamber 101 is provided with a side wall having a clearance that does not interfere with the outer periphery of the chip capacitor 40. The storage chamber 101 has a rectangular cross section and is provided in two rows at equal intervals in a housing 10 having a shape extending in the front-rear direction.

  As shown in FIG. 1, the upper surface 10 a of the housing 10 is assembled with partition walls extending in the front, rear, left, and right directions that define the storage chamber 101, and includes an opening 102 that communicates with the storage chamber 101 therebetween. The upper surface of the housing 10 is configured as a flat surface except for the recess due to the opening 102. The housing 10 includes a front surface 10c, a rear surface 10d, and left and right side surfaces 10e and 10f, all of which are generally flat.

  As shown in FIG. 2, the bottom surface 10 b of the housing 10 includes a protrusion 105 extending in the longitudinal direction (front-rear direction) at the center in the short direction (left-right direction). The protrusion 105 has a flat surface with a predetermined height with respect to the bottom surface 10 b of the housing 10. When the docking connector 1 is solder-mounted, the protruding portion 105 stabilizes the floating of the central portion of the housing 10 caused by the thickness of the mounting portion 301 of the contact 30 by expanding the portion.

As shown in FIG. 2, the housing 10 has the mounting portions 301 of the contacts 30 arranged at equal intervals in the recesses 106 provided at the left and right ends of the bottom surface 10b. The mounting portion 301 is a plate-like body having a rectangular shape in plan view and slightly protrudes from the bottom surface 10 b of the housing 10. The plate surface of the mounting portion 301 projects slightly outward (downward) from the flat surface of the protruding portion 105 in consideration of the mounting state.
As shown in FIG. 3, the mounting portion 301 extends slightly from the side edge of the bottom surface 10 b of the housing 10 to the lower side, and extends in the side surface direction in contact with the bottom surface 10 b. The mounting portion 301 is bent inside the housing 10, and the other end forms a connection portion 302 and extends to the bottom wall of the storage chamber 101.

<contact>
As shown in FIG. 4, the contact 30 is obtained by bending a plate-like metal in a step shape, and includes a mounting portion 301 and a connection portion 302 on flat portions, respectively. In the case of this embodiment, the contact 30 is set in a molding die of the housing 10 in a state of being processed in a staircase shape, and a synthetic resin is poured into the housing 10 and incorporated into the housing 10. The advantage of assembling in advance in this way is that the burden of assembling later is eliminated, and the adhesiveness at the interface between the contact 30 and the housing 10 is improved, and a gap is less likely to be formed there. Of course, the contact 30 may be assembled to the molded housing 10 later, for example, a press-fitting method.

  The contact 30 is preferably a rigid metal, and a copper alloy such as phosphor bronze or oxygen-free copper or an iron alloy such as 42 alloy may be used. If the contact 30 is required to have excellent corrosion resistance, the surface of the contact 30 may be plated with tin or gold. By plating the surface in this manner, solderability and connection reliability can be improved.

<Chip capacitor>
As shown in FIG. 5, the chip capacitor 40 has a square block shape in plan view, and includes electrodes 402 and 403 on the upper surface and the lower surface. The chip capacitor 40 of the present embodiment is a multilayer capacitor that uses a ceramic thin film as a dielectric, and is small and 100 nF (nanofarad). Of course, the type and capacity of the chip capacitor 40 are not limited to this specification, and can be appropriately selected according to the purpose.

The chip capacitor 40 has a ceramic laminate inside and is covered with a synthetic resin, and the upper and lower surfaces facing each other constitute electrodes 402 and 403. The electrodes 402 and 403 are plated with tin or gold. By connecting the electrodes 402 and 403 to a necessary circuit, a filter circuit that allows only a specific frequency to pass is configured. In the present invention, a capacitor is used to cut low-frequency noise generated by connection of a connector from a circuit. Note that the structure of the chip capacitor is not limited to the structure of the present embodiment.

<cover>
As shown in FIG. 6, the cover 20 is provided with a flange 201 over the entire circumference of the upper surface. The cover 20 is a molded body of conductive resin. In the case of this embodiment, the opening 102 of the housing 10 is sealed by secondary molding. The surface of the cover 20 functions as the electrode 20a with the opening 102 sealed. The external electrode used in the claims includes the electrode 20a used in this paragraph (the same applies hereinafter).
In the case of the present embodiment, the conductive resin is obtained by dispersing and adding a carbon filler to an epoxy resin, and the curing conditions for secondary molding are 150 to 200 ° C. and several minutes to several tens of minutes. Carbon-based conductive resins are superior in terms of corrosion resistance compared to metal-based resins.

<Assembly of docking connector>
As shown in FIG. 3, the docking connector 1 is assembled by assembling the contacts 30 into the housing 10 in advance by insert molding, incorporating the chip capacitor 40 in the housing chamber 101 of the housing 10, and sealing the opening 102 with the cover 20. Complete by stopping. FIG. 3 shows a mode in which the cover 20 having a predetermined shape seals the opening 102 so that the sealing procedure can be easily understood, but the cover 20 is formed by secondary molding of conductive resin. It may be an aspect that is formed. By utilizing the secondary molding of the conductive resin in this way, the cover 20 can be brought into close contact with the opening 102 of the housing 10 without providing a separate engagement structure, and a thin cover that is difficult for a molded product. 20 can seal the opening 102. The surface of the cover 20 functions as the electrode 20a.

  As shown in FIG. 3, the connection portion 302 of the contact 30 is exposed on the bottom wall 101 a of the housing chamber 101 of the housing 10. The connecting portion 302 is flat and substantially covers the entire bottom wall 101a. A solder paste 50 is applied to the surface of the connection portion 302. The solder paste 50 electrically and mechanically connects the electrode 403 of the chip capacitor 40 and the connection portion 302. Later, heat is applied under predetermined conditions to cure.

  The chip capacitor 40 is inserted into the housing chamber 101 so that one electrode 403 of the chip capacitor 40 is connected to the connection portion 302 to which the solder paste 50 is applied. Since the ceramic capacitor used in this embodiment is a nonpolar type, any of the electrodes 402 and 403 may be connected to the connection portion 302 (in FIG. 3, the electrode 403 is connected). A clearance is provided between the outer peripheral surface of the chip capacitor 40 and the inner peripheral surface of the storage chamber 101 so that the chip capacitor 40 is held in a stationary state and can be easily inserted.

  In a state where the chip capacitor 40 is accommodated in the accommodation chamber 101, a gap is generated at the upper end portion of the accommodation chamber 101 as shown in FIG. 3. It seals with the cover 20 so that this clearance gap may be filled up. Sealing uses a conductive resin. The sealing of the conductive resin may be performed by secondary molding using a mold, or a method of filling an uncured conductive resin into the gap by potting and curing it may be used. Whichever method is used, it is desirable to mold the conductive resin so that it is flush with or slightly overhanging the upper surface 10a of the housing 10, and the surface of the conductive resin is desirably flat. By doing in this way, the flat electrode 20a is obtained which is flush with the upper surface 10a of the housing 10. This facilitates electrical connection with the corresponding contact.

  As shown in FIG. 1, the housing 10 in which the opening 102 is sealed with a cover 20 (conductive resin) is a thin plate-like rectangular body, and the upper surface 10a has a flat surface extending in the longitudinal direction (front-rear direction). The electrodes 20a (conductive resin) are arranged in an orderly manner along two lines. As shown in FIG. 2, the bottom surface 10 b has the mounting portions 301 arranged in an orderly manner along both side edges in the longitudinal direction (front-rear direction).

<Mounting the connector>
The mounting of the docking connector 1 will be described with reference to the drawings. FIG. 7 is a cross-sectional view showing a mounting method of the docking connector 1.

  As shown in FIG. 7, the docking connector 1 is mounted by electrically connecting the pad P1 disposed on the wiring board P at the position where the docking connector 1 of the docking station DS is assembled and the mounting portion 301 of the docking connector 1. It is a mechanical connection. The mounting may be performed by a solder reflow method. Paste solder is applied to the surface of the pad P1 of the wiring board P in advance, and the docking connector 1 and other electronic components are placed at predetermined positions corresponding to the pads P1. The wiring board P on which the docking connector 1 or the like is placed is heated and cooled in a predetermined temperature profile, for example, a reflow furnace, and the docking connector 1 or the like is fixed to the wiring board P.

  In order to mount the docking connector 1 at a fixed position, an adhesive for temporary fixing may be applied to the protrusion 105 provided on the bottom surface 10b of the housing 10, and this portion may be bonded to the wiring board P in advance. . The mounting part 301 preferably has a shape that projects beyond the ridge part 105 for such applications.

<Docking station>
A connection between the docking station DS and the notebook personal computer PC will be described with reference to the drawings. FIG. 8 is an external perspective view showing a connection method between the docking station DS in which the docking connector 1 is incorporated and the notebook personal computer PC. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG.

  As shown in FIG. 8, the docking station DS on which the docking connector 1 is mounted is configured such that the portion of the docking connector 1 is flush with the surrounding mounting surface DS3. Further, only a very small clearance is provided around the docking connector 1 in consideration of assembly accuracy and the like, and entry of dust and water droplets is suppressed at a high level. In order to further improve dust resistance and waterproofness, this clearance portion may be filled with a shielding material formed of silicone rubber or the like.

  As shown in FIG. 8, the placement surface DS3 of the docking station DS is provided with positioning pins DS2 for specifying the placement position of the notebook personal computer PC to be placed. Further, an engagement pin DS1 is provided so that the placed notebook personal computer PC is not misaligned by an inadvertent force. The positioning pins DS2 and the engagement pins DS1 may be substituted in a form in which the placement surface DS3 includes a form corresponding to the outer shape of the notebook personal computer PC. In this way, when inserting / removing, there is no mating or unmating operation between the male and female terminals, so that the notebook PC PC can be easily inserted / removed.

As shown in FIG. 8, the notebook personal computer PC includes a positioning hole PC2, an engagement hole PC1, and an expansion connector PCC at predetermined positions on the back surface.
The notebook personal computer PC positioned in the positioning hole PC2 aligns the expansion connector PCC with the position of the docking connector 1 as shown in FIG. Each electrode 20a of the docking connector 1 is in a position corresponding to the electrode PCC1 of the expansion connector PCC, and a predetermined electromechanical connection is made on the spot. The electrode PCC1 on the notebook personal computer PC side may be a metal flat plate, and may have a mechanism having a bent portion and elastically deforming at the time of connection. Moreover, the probe pin which incorporates a coil spring inside may be sufficient. Alternatively, the connecting portion may be made of a flexible material such as a conductive resin or conductive rubber.

<Effect> In this embodiment, the following effects can be obtained.
-In the docking connector 1 according to the present embodiment, the electrode 20a is formed of a flat conductive resin. Thereby, the docking connector 1 with a flat surface is obtained. Therefore, a docking station DS with a flat mounting surface DS3 is obtained.
-In the docking connector 1 according to the present embodiment, the electrode 20a is formed of a flat conductive resin. As a result, the electrode PCC1 of the corresponding notebook personal computer PC is pressed against the flat electrode 20a to obtain an electromechanical connection. Therefore, the docking station DS (docking connector 1) that can be easily inserted and removed is obtained.

-The external shape of the docking connector 1 which concerns on this embodiment is a simple rectangle. Thereby, the clearance required around the docking connector 1 incorporated in the docking station DS can be reduced. Therefore, the docking station DS that can suppress dust and water droplets entering from the gap around the docking connector 1 is obtained.
-The docking connector 1 which concerns on this embodiment incorporates the chip capacitor 40. FIG. Thereby, the mounting space of the chip capacitor 40 on the wiring board P assembled in the docking station DS can be saved. Therefore, a docking station DS that can be miniaturized is obtained.
Since the docking connector 1 according to the present embodiment incorporates the completed flat chip capacitor 40, a small and large-capacity capacitor can be incorporated in the flat housing 10. Thereby, the low profile docking connector 1 which can cut the noise of a comparatively low frequency band is obtained.

-The docking connector 1 which concerns on this embodiment uses the conductive resin which uses carbon as a conductive component for the electrode 20a. Thereby, the docking connector 1 (docking station DS) excellent in corrosion resistance is obtained.
-The docking connector 1 which concerns on this embodiment incorporates the chip capacitor 40 of 50-200 nF (nanofarad). Thereby, the docking connector 1 (docking station DS) provided with the filter function which can cut the frequency below 10 kHz (kilohertz) is obtained.
-The docking connector 1 which concerns on this embodiment can be integrated in the docking station DS by a cartridge system. Thereby, by arranging the docking connectors 1 having different capacities of the chip capacitors 40, the docking connector 1 that can be selected according to the required application can be obtained.

  Although the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the inventive idea.

DESCRIPTION OF SYMBOLS 1 Docking connector 10 Housing 10a Upper surface 10b Bottom surface 10c Front surface 10d Rear surface 10e, 10f Side surface 101 Accommodating chamber 101a Bottom wall 102 Opening part 105 Projection part 20 Cover 201 Flange 20a Electrode a
30 Contact 301 Mounting portion 302 Connection portion 40 Chip capacitor 401 Main body 402, 403 Electrode 50 Solder paste 50a Solder paste P after curing Wiring board P1 Pad DS Docking station DS1 Engagement pin DS2 Positioning pin DS3 Mounting surface PC Laptop PC PCC Expansion Connector PCC1 Electrode PC1 Engagement hole PC2 Positioning hole

Claims (7)

A flat columnar chip capacitor having electrodes on both end faces;
An insulating housing having a top surface and a bottom surface for holding the chip capacitor;
When the upper surface bottom direction is the height direction, the direction orthogonal to the height direction is the axial direction, and the height direction and the direction orthogonal to the axial direction are both the width direction,
Of the electrodes of the chip capacitor, at least the upper surface side electrode is regularly and regularly held along the axial direction or the width direction in a manner exposed on the surface of the housing ,
The docking connector is characterized in that at least the upper surface side electrode among the exposed electrodes is provided with a conductive member having elasticity. The housing includes an opening for receiving the chip capacitor on the upper surface, and a storage chamber connected to the opening.
It is characterized by comprising a conductive member that is incorporated in the housing and has a connection part connected to an electrode on the side opposite to the opening of the chip capacitor, and a mounting part exposed to the bottom surface of the housing connected to the connection part. The docking connector according to claim 1. The opening includes a cover;
3. The docking connector according to claim 2, wherein the cover includes a flat elastic external electrode and a connection means for connecting the electrode of the chip capacitor to the external electrode.   The cover is made of an elastic conductive member, and the conductive member is electrically connected to an electrode on the opening side of the chip capacitor, and the outer surface of the cover forms an external electrode. Item 4. The docking connector according to Item 3.   The docking connector according to claim 4, wherein the conductive member is a conductive resin obtained by dispersing carbon particles in a synthetic resin material. The cover is a conductive resin;
The docking connector according to claim 5, wherein the cover is secondarily molded in a state where the chip capacitor is housed in the housing chamber of the housing. The docking connector according to claim 1, wherein the chip capacitor has a capacity of 50 nF to 200 nF (nanofarad).

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