JP6036105B2 - Magnetic concealment card with metallic luster layer - Google Patents

Description

The present invention relates to a magnetic card used for a credit card, a cash card, an employee ID card, and the like. In particular, the present invention relates to a magnetic concealment card that has a high gloss metal vapor deposition layer on the surface for concealing the magnetic layer of the magnetic card, while preventing electrostatic damage caused by the metal vapor deposition layer.

A card having a metallic luster on the surface is conventionally preferred as a high-grade card because it has a unique metallic color tone and glitter.
However, this type of conventional card using a metal vapor-deposited layer or the like causes an electrostatic failure due to the charging of the metal layer, and therefore has a magnetic recording layer (magnetic tape or stripe) on the metal surface side of the card. It was normal to make it not. Therefore, when magnetic recording is necessary, the magnetic tape is unavoidably provided only on the side opposite to the metallic glossy side of the card.
However, in the Japanese market, it is necessary to provide a JIS II-specific magnetic tape on the outermost surface of the card. Furthermore, it is necessary to provide a card with excellent design by concealing this magnetic tape with a printed layer due to the problem of design. This is because the magnetic tape has a black or brown color derived from the color of the magnetic powder, and restricts the degree of freedom of card design.

Examples of the electrostatic failure caused by the charging of the metal layer include problems such as electrostatic discharge (ESD) to the magnetic head, magnetic data read / write instability associated therewith, and damage to the magnetic data.
In addition, it is necessary to consider the magnetic properties for the convenience of forming a metal vapor-deposited layer, adhesive layer, and design printing on the magnetic tape, resulting in limitations on the thickness of the adhesive layer and printing ink layer that can be used. There was a problem that some metallic radiance could not be reproduced.

As prior patent documents related to the present application, there are Patent Documents 1 to 3 and the like.
Patent Document 1 has a magnetic tape 5 on an oversheet 13 on the surface side, and is provided with a concealed silver print layer 5, a white ink print layer 3, and a lame print layer 2 on the magnetic tape 5. The printing layer 5 is made of printing ink in which metal aluminum powder or the like is dispersed, and the metallic gloss is different from that of the present application by vapor deposition.
In Patent Document 2, the reflection layer 5 on the lower surface of the hologram forming layer 4 is provided with a countermeasure against static electricity, but it does not consider the metallic luster of the entire card.
Patent Document 3 describes a diffraction effect layer 5 formed in contact with a magnetic recording layer 6 as a measure for preventing sparking of a magnetic card. However, the one in the same document transfers the entire diffraction structure forming layer 4, diffraction effect layer (also a metal reflection layer) 5, and magnetic recording layer 6, and is different from the configuration of the present application.

JP 2008-200895 A JP 2012-88532 A JP 2008-15071 A

As described above, a magnetic card having a metal vapor deposition layer on the surface causes various obstacles due to the metal layer being charged. Therefore, a magnetic tape is not provided on the surface side (metal vapor deposition layer side surface) of the card. Is customary. An object of the present application is to take measures against static electricity by using a metal vapor-deposited layer as an insulating property of the sea / island structure (island structure, island shape, island shape), and to conceal the magnetic tape so as not to impair the magnetic properties. To do.

The first of the gist of the present invention for solving the above problems is to laminate a white core sheet as a central layer with an oversheet on both sides thereof, and laminate a metal vapor deposition layer by vapor deposition on the magnetic tape transfer surface of one oversheet, Further, in the magnetic card having the design printed on the surface of the metal vapor-deposited layer, the metal vapor-deposited layer is an insulating one having a sea / island structure, and the core sheet surface in contact with the one oversheet is black-printed with a silk screen. A magnetic concealment card with a metallic luster layer, characterized in that

The second of the gist of the present invention to solve the above problems is to laminate an oversheet on both sides of a black core sheet as a central layer, and laminate a metal vapor deposition layer by vapor deposition on the magnetic tape transfer surface of one oversheet, Furthermore, the present invention provides a magnetic concealment card provided with a metallic luster layer, wherein the metal vapor deposition layer is an insulating one having a sea / island structure.

In the magnetic concealment card having the metallic luster layer, the metal vapor deposition layer may be made of tin (Sn) or a tin-aluminum (Sn-Al) alloy, and the metal vapor deposition layer has a surface resistivity of 10 A range of ¹⁰ to 10 ²⁵ Ω / □ is preferable for eliminating static electricity disturbance.

The magnetic concealment card (hereinafter also abbreviated as “magnetic concealment card”) having the metallic luster layer of the present invention has a magnetic tape on the metal vapor deposition layer side of the outermost surface of the card, and the metal thin film has a sea / island structure. Since it is insulative and does not cause electrostatic troubles such as discharge to the magnetic head.
Further, since the core sheet on the back surface of the magnetic tape is printed in black (Claim 1) or the core sheet colored in black is used (Claim 2), the dark magnetic material of the magnetic tape is used. The contrast can be reduced, and the color of the magnetic tape can be appropriately concealed, and the reading performance is not deteriorated. Character embossing is also possible like a normal magnetic card.

It is a figure which shows the layer structure of 1st Embodiment of a magnetic concealment card | curd. It is a figure which shows the layer structure of 2nd Embodiment of a magnetic concealment card | curd. It is a figure which shows the manufacturing process of a magnetic concealment card. It is a schematic plan view explaining the structure of an insulating metal vapor deposition layer. It is a schematic cross section of an insulating metal vapor deposition layer.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram illustrating a layer configuration of the first embodiment of the magnetic concealment card. As shown in FIG. 1, the magnetic concealment card 10 has a structure in which two core sheets 11 and 12 are used as a central layer and oversheets 13 and 14 are laminated on both sides thereof. The core sheet may be a single layer, but if it is printed on both the front and back sides by using two layers, the production may be facilitated. The core sheets 11 and 12 are white, but the oversheets 13 and 14 are transparent.
A magnetic tape 15 is previously transferred to the outer surface of the oversheet 13. In FIG. 1, the magnetic tape 16 is also transferred to the oversheet 14 side, but this is not essential.

On the surface of the core sheet 11 in contact with the oversheet 13, black solid printing (entire printing) 17 is performed by silk screen printing. The magnetic tape 15 is a dark color peculiar to a magnetic material, and the contrast becomes too large in comparison with the surface of the white core sheet 11, so that the background is black and the contrast is reduced to make it inconspicuous.
A thin metal deposition layer 23 is transferred to the outer surface side of the oversheet 13 via an adhesive layer 24. The metal vapor deposition layer 23 is characterized by being insulative. A general metal vapor deposition layer is conductive, but the metal vapor deposition film is controlled so that it does not become a continuous film, and is formed to have a small island structure scattered in the sea. It has been broken. Details of the sea / island structure will be described later.

In general, a design print 33 is further applied to the outer surface of the metal vapor-deposited layer 23 via a peeling protective layer 22 and an adhesive layer 34. A peel protection layer 32 is also formed on the outermost surface of the design print 33.
The metal vapor deposition layer 23 and the design print 33 are generally formed by a transfer method as will be described later, and the release protection layers 22 and 32 are formed after the material used as the release layer in the transfer material is transferred after transfer. It also functions as a protective material for the transfer body (card). Therefore, it can be referred to as a release layer before transfer and a release protective layer after transfer.

FIG. 2 is a diagram showing a layer configuration of the second embodiment of the magnetic concealment card. In the case of FIG. 2 as well, the magnetic concealment card 10 has a configuration in which two core sheets 11 and 12 are used as a central layer, and oversheets 13 and 14 are laminated on both sides thereof. The second embodiment is characterized by using a core sheet of black or a color close to black. The core sheets 11 and 12 themselves are black and black printing is omitted. The core sheet may be a single layer, as in the first embodiment.
As in the first embodiment, the transparent oversheets 13 and 14 are laminated on the outer surface of the core sheet, and the magnetic tape 15 is previously transferred to the outer surface of the oversheet 13.
Similarly, the design printing 33 is further applied to the outer surface of the metal deposition layer 23 via the peeling protection layer 22, and the peeling protection layer 32 is also formed on the outermost surface of the design printing 33. Since it is black, black screen printing is not performed.
As in the first embodiment, a thin metal deposition layer 23 is transferred to the outer surface side of the oversheet 13 via the adhesive layer 24. The configuration of the metal vapor deposition layer 23 is the same as that of the first embodiment. In general, a design print 33 is further applied to the outer surface of the metal vapor-deposited layer 23 via a peeling protective layer 22 and an adhesive layer 34. A peel protection layer 32 is also formed on the outermost surface of the design print 33.

Although a plan view of the magnetic concealment card 10 is not shown, the card size is 53.92 to 54.03 mm × 85.47 to 85.72 mm (ID-1 type) defined by ISO (ISO 7810) or JIS (JIS X6301). ) Card. A magnetic tape 15 is embedded in stripes at predetermined positions parallel to the long side of the card.
The total thickness of the magnetic concealment card 10 is formed to a constant thickness in the range of 0.68 to 0.84 mm. The magnetic concealment card may have an IC chip and double as an IC card.

Next, the manufacturing method of the magnetic concealment card | curd provided with the metallic luster layer is demonstrated.
3A and 3B are diagrams showing a manufacturing process of the magnetic concealment card. FIG. 3A is a diagram showing a transfer process of the metal deposition layer 23, and FIG. 3B is a diagram showing a transfer process of the design printing 33. is there.
First, as shown in FIG. 3A, the core sheets 11 and 12, the transparent oversheets 13 and 14 as the central layer, and the transfer material 20 of the metal vapor deposition layer are integrally laminated and inserted into the press machine, and the mirror plate Press with heat and pressure between. The transfer material 20 is a material in which a metal vapor deposition layer 23 is formed on a film base 21 having excellent flatness such as polyethylene terephthalate (PET) via a release layer 22 and an adhesive layer 24 is further applied.
On the side surface of the metal vapor-deposited layer 23 of the substrate 21, a shallow cut uneven groove pattern such as a hairline may be formed. In that case, the decorative property of the metal thin film layer is high.

The hairline can be formed, for example, by forming a hairline on the surface of the film substrate 21 by rotating a roll wound with a sandpaper belt against the flow direction of the film substrate 21. Instead of a sandpaper belt, a hairline abrasive in which abrasive grains are attached to a metal brush or non-woven fabric, steel wool, or the like can also be used. The depth of the hairline is about 2 to 3 μm.

This transfer process and the process of thermally fusing the core sheets 11 and 12 and the oversheets 13 and 14 together are performed by a single hot press process. When the core sheet and the oversheet are heat-fusible materials such as vinyl chloride and PET-G, they are fused without using an adhesive material between the sheets, but in the case of a sheet material that is not heat-fusible. And hot pressing with a hot-melt adhesive.

The transfer material 20 is obtained by forming a metal vapor deposition layer 23 on a film substrate 21 such as polyethylene terephthalate (hereinafter referred to as “PET”) via a release layer 22. A thin layer (within a thickness of 1 to 2 μm) of the adhesive layer 24 is provided on the contact surface with the oversheet 13.
After pressing, the film substrate 21 of the transfer material 20 is peeled off. The release layer 22 may be left as a protective layer on the metal vapor deposition film side, but may not be provided because it is not the outermost surface of the card.
In the case of the first embodiment, as shown in FIG. 3, black solid printing 17 is performed on the core sheet 11. However, in the second embodiment, since the core sheet of black or the like is used, this printing is not performed. Other manufacturing conditions are the same in the first embodiment and the second embodiment.

Next, as shown in FIG. 3B, a design printing transfer material 30 is stacked, and a process of performing design printing on the surface of the metal deposition layer 23 is performed. The transfer material 30 includes a film base 31, a release layer 32, a design print 33, and an adhesive layer 34. The release layer 32 is left as a protective layer on the design printing surface. The design printing 33 may be silk screen printing or may be by offset printing. The transfer film substrate 31 is peeled and removed in the same manner after the design printing is transferred.
Generally, if the distance from the surface of the magnetic tape 15 to the magnetic head is within 15 μm, it is said that the magnetic reading is not obstructed, but it is preferable to make each layer as thin as possible.

Next, the structure of the insulating metal vapor deposition layer will be described.
FIG. 4 is a schematic plan view illustrating the structure of the insulating metal vapor deposition layer, and FIG. 5 is a schematic cross-sectional view of the insulating metal vapor deposition layer. The insulating metal vapor deposition layer is generally composed of a metal vapor deposition layer having a sea / island structure. This conventionally known sea / island structure can be formed by selecting a vapor deposition material, vapor deposition conditions, and the like. The metal vapor deposition layer 23 is a vapor deposition layer composed of minute islands 3a and intervals 3b that define the gap between the islands. 3m is formed. The deposited layer composed of the sea / island structure can be formed by directly depositing on a plastic or paper substrate. However, the magnetic concealment card of the present application employs a method of depositing on a transfer material and then transferring to a card. In either case, the island size and shape are within a certain range, but are not exactly constant.

The size (average passing diameter) of such islands 3a is preferably in the range of 20 nm to 1 μm, and the distance between islands (average interval) 3b is preferably in the range of 10 nm to 500 nm. If the island size is smaller than 20 nm, the metal becomes too coarse to obtain a sufficient metallic luster. Further, if it is 1 μm or more, it becomes conductive and causes an electrostatic failure.
However, the island size and the distance between the islands are not correctly formed with a groove between the islands and may not be clearly identified with the naked eye or a microscope. In that case, as shown in the cross-sectional view of FIG. 5, the island 3a portion is thickly laminated with a dense metal, and the inter-island 3b is in a laminated state although the metal is a rough structure. . The rough structure portion between the islands is a portion that becomes a grain boundary, and the resistance value is electrically large.
In some cases, the islands 3a themselves are dense and have variable resistance values and are not conductive. Therefore, when the interval between islands is not clear, it is appropriate to interpret the interval 3b between islands as a rough structure portion (a crystal grain boundary or a grain boundary) between islands.

The sea / island structure is formed by intricate conditions such as the generation and growth of the nuclei of the deposited atoms and the coalescence of the islands. Although the island size and the island interval can be set by selecting the vapor deposition conditions such as the vapor deposition metal material and the vapor deposition rate, the material is limited because quite complicated control is required.
In general, a metal or a noble metal having a low melting point is relatively easy to control, and two or more selected from a single metal of tin (Sn), zinc (Zn), lead (Pb), bismuth (Bi), or a group thereof. An alloy made of metal, or tin-aluminum (Sn-Al) or tin-silicon (Sn-Si) is used, but tin (Sn) is particularly easy. Tin-aluminum deposition can be accomplished by vaporizing tin and aluminum single metals in separate crucibles and depositing them as an alloy on the substrate. The same applies to tin-silicon.
Aluminum is excellent in metallic luster, but the single metal of aluminum itself has a high surface energy and is likely to migrate on the substrate, and becomes a metal material that is unlikely to form island-like deposition.

The surface resistivity of the insulating metal vapor deposition layer is preferably in the range of 10 ¹⁰ to 10 ²⁵ Ω / □. If it is less than 10 ¹⁰ Ω / □, it will be close to a conductor and will be easily charged, resulting in electrostatic damage. If it is greater than 10 ²⁵ Ω / □, the metallic luster is lost and the design is impaired. The surface resistivity is adjusted by the film thickness depending on the deposition rate and the deposition time.

The island size (average passing diameter) and island spacing (average island spacing) of the sea / island structure can be measured using an atomic force microscope (hereinafter referred to as “AFM”).
The AFM used for the measurement can be manufactured by Digital Instruments, manufactured by Seiko Electronics Co., Ltd., manufactured by Topometrics, or the like. For example, when Nano Scope III manufactured by Digital Instruments is used, flat processing is performed on the AFM image obtained by measuring the area of 500 nm × 500 nm on the uneven surface in the tapping mode, and then analysis is performed to analyze the island size (average passing diameter). Find the island spacing (average island spacing). In the measurement, a cantilever with no wear or dirt was used, and a uniform uneven region without significant dents or protrusions was used as a measurement location.

The thickness of the metal vapor deposition layer 23 shall be about 10 nm-50 nm. When it is 50 nm or more, it often becomes conductive. Vapor deposition methods include physical vapor deposition methods (PVD methods) such as vacuum deposition methods, sputtering methods, and ion plating methods that are generally adopted, thermal chemical vapor deposition methods, and photochemical vapor deposition methods. A chemical vapor deposition method (Chemical Vapor Deposition method; CVD method), an atmospheric pressure plasma method, or the like can be used.

Formation of the vapor deposition layer on the base film by the vacuum vapor deposition method can be performed by using a metal material as a raw material and heating and evaporating it in a vacuum chamber to form a thin film on the base film. In the formation of the vapor deposition layer on the base film by the sputtering method, a conventionally known sputtering method such as a high frequency sputtering method or a magnetron sputtering method can be used.

<Embodiment related to material>
(1) A wide variety of core sheet white or colored plastic sheets can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like. The film thickness of the core sheet is appropriately selected in consideration of the entire thickness of the card.
(2) Oversheet Usually, the same material as the core sheet is used, but a transparent material having a thickness of about 0.05 to 0.1 mm is often used.

(3) A wide variety of plastic film and paper base materials for transfer having a metal vapor deposition layer can be used. As the plastic film, the various materials described above can be used as in the core sheet. The following can be used as the paper substrate.
Fine paper, coated paper, kraft paper, glassine paper, synthetic paper, latex and melamine impregnated paper.
(4) The release agent for the release agent release layer includes acrylic resin, polyester resin, polyvinyl chloride resin, cellulose resin, rubber resin, polyurethane resin, polyvinyl acetate resin, etc. Copolymers such as vinyl chloride-vinyl acetate copolymer resin and ethylene-vinyl acetate copolymer resin can be used. When the release layer requires hardness, a photo-curing resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, or the like can be used.

Hereinafter, embodiments of the magnetic concealment card will be specifically described based on examples. In the example, the transfer material 20 having the metal vapor deposition layer was made on a trial basis under various conditions, and the manufacture of the magnetic card using the transfer material and the transfer of the design printing were performed under the same conditions.

(Metal vapor deposition layer transfer material production 1)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is mounted on a feed roll of a PVD vacuum deposition apparatus, and then this is fed out, and tin (Sn) is deposited on the surface of the release layer 22 of the biaxially stretched PET film under the following deposition conditions. A metal vapor deposition film 23m having a thickness of 20 nm was formed so as to have a sea / island structure. Argon (Ar) gas was introduced into the deposition chamber in order to set the degree of vacuum in the deposition chamber to the target degree of vacuum.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 7.2 × 10 ⁻⁴ torr (9.6 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 7 nm / sec.
(The cooling drum is a coating drum. The same applies hereinafter.)

(Metal vapor deposition layer transfer material production 2)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21 and the surface thereof was used by forming a hairline with a sandpaper belt. A release layer 22 made of cellulose acetate butyrate resin was formed on the hairline surface. This biaxially stretched PET film is mounted on a feed roll of a PVD vacuum deposition apparatus, and then this is fed out, and tin (Sn) is deposited on the surface of the release layer 22 of the biaxially stretched PET film under the following deposition conditions. A metal vapor deposition film 23m having a thickness of 10 nm was formed so as to have a sea / island structure. Argon (Ar) gas was introduced into the vapor deposition chamber in order to obtain the target vacuum level in the vapor deposition chamber.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 7.4 × 10 ⁻⁴ torr (9.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 7 nm / sec.

(Metal vapor deposition layer transfer material production 3)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is mounted on a feed roll of a PVD vacuum deposition apparatus, and then this is fed out, and tin (Sn) is deposited on the surface of the release layer 22 of the biaxially stretched PET film under the following deposition conditions. A metal vapor deposition film 23m having a thickness of 10 nm was formed so as to have a sea / island structure.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 2.6 × 10 ⁻⁴ torr (3.5 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Deposition rate: 1 nm / sec.

(Metal vapor deposition layer transfer material production 4)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is attached to a sputtering method vapor deposition apparatus, and then, on the release layer 22 surface of the biaxially stretched PET film, tin (Sn) is formed into a sea / island structure under the following vapor deposition conditions. A metal vapor deposition film 23m having a thickness of 15 nm was formed.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 9.2 × 10 ⁻⁴ torr (12.0 × 10 ⁻² Pa)
Cooling drum temperature: 4 ° C
Deposition rate: 0.2 nm / sec.

(Metal vapor deposition layer transfer material manufacturing 5)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is attached to a feed roll of a PVD vacuum deposition apparatus, and then this is fed out. On the surface of the release layer 22 of the biaxially stretched PET film, tin (Sn) and Aluminum (Al) was vapor-deposited from each vapor deposition source, and a metal vapor-deposited film 23m having a film thickness of 20 nm was formed so that the vapor-deposited layer had a sea / island structure made of Sn—Al alloy.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 6.7 × 10 ⁻⁴ torr (8.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 15 nm / sec.

(Metal vapor deposition layer transfer material production 6)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is attached to a feed roll of a PVD vacuum deposition apparatus, and then this is fed out. On the surface of the release layer 22 of the biaxially stretched PET film, tin (Sn) and Aluminum (Al) was vapor-deposited from each vapor deposition source, and a metal vapor-deposited film 23m having a film thickness of 10 nm was formed so that the vapor-deposited layer had a sea / island structure made of Sn—Al alloy.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 4.2 × 10 ⁻⁴ torr (5.6 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 15 nm / sec.

(Manufacture of transfer material having metal vapor deposition layer 7)
A biaxially stretched PET film having a thickness of 40 μm was used as the substrate 21, and a release layer made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is mounted on a feed roll of a PVD vacuum deposition apparatus, and then this is fed out, and tin (Sn) is deposited on the surface of the release layer 22 of the biaxially stretched PET film under the following deposition conditions. Vapor deposition was performed to form a sea / island structure to form a metal vapor deposition film 23m having a thickness of 10 nm.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 7.4 × 10 ⁻⁴ torr (9.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 7 nm / sec.

(Metal vapor deposition layer transfer material production 8)
A biaxially stretched PET film having a thickness of 40 μm was used as the substrate 21, and a release layer made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is mounted on the feed roll of the PVD vacuum deposition apparatus 20 and then fed out. Then, tin (Sn) is formed on the surface of the release layer 22 by the following deposition conditions. The metal vapor deposition film 23m having a film thickness of 10 nm was formed.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 7.4 × 10 ⁻⁴ torr (9.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 7 nm / sec.

(Production Comparative Example 1 of Transfer Material Having Metal Deposition Layer)
A biaxially stretched PET film having a thickness of 40 μm was used as the substrate 21, and a release layer made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is mounted on a feed roll of a PVD vacuum deposition apparatus, and then fed out, and aluminum (Al) is deposited on the release layer surface of the biaxially stretched PET film under the following deposition conditions. A normal continuous metal deposition film 23 m of 40 nm was formed.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 3.7 × 10 ⁻⁴ torr (4.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Vapor deposition rate: 25 nm / sec.

(Production Comparative Example 2 of Transfer Material Having Metal Deposition Layer)
A biaxially stretched PET film having a thickness of 40 μm was used as the base material 21, and a release layer 22 made of cellulose acetate butyrate resin was formed on the surface. This biaxially stretched PET film is attached to the feed roll of the PVD vacuum deposition apparatus 20, and then this is fed out. On the surface of the release layer 22 of the biaxially stretched PET film, tin (Sn) is formed according to the following deposition conditions. A normal continuous metal deposition film 23m having a thickness of 20 nm was formed.
(Deposition conditions)
Degree of vacuum in the deposition chamber: 6.7 × 10 ⁻⁴ torr (8.9 × 10 ⁻² Pa)
Cooling drum temperature: 0 ° C
Deposition rate: 30 nm / sec.

Regarding the metal vapor deposition films of the transfer materials of Examples 1 to 8 above, it was confirmed that a structural layer that can be almost determined as a sea / island structure was formed. Table 1 shows the results of analyzing the island size (average span diameter) and the island interval (average island interval) of the sea-island structure from an image of an atomic force microscope (“Nano Scope 3” manufactured by Digital Instruments).
In Comparative Examples 1 and 2, it was not a sea / island structure but a continuous film.
Table 1 shows the results obtained by measuring the surface resistivity (Ω / □) of the metal deposition surface 23 m including Comparative Examples 1 and 2 with a resistivity meter (by “MCP-HT260” manufactured by Mitsubishi Chemical Corporation).

White core sheets (thickness 360 μm) 11, 12 made of amorphous polyester resin (trade name “PET-G”) are used as the central layers, and transparent oversheets (thickness 50 μm) 13, 14 made of the same material are formed on both sides thereof. Further, the transfer materials 20 obtained in Examples 1 to 8 and Comparative Examples 1 and 2 were laminated and introduced into a mirror plate of a press machine, and 150 ° C, 25 kg / cm ² , 15 minutes. Was hot-pressed under the following conditions. The magnetic tape 15 is transferred in advance to the outer surface of the oversheet 13, and a black solid print (full-surface print) 17 is printed on the surface of the core sheet 11 to a thickness of 3 to 5 μm by silk screen printing. .

After the transfer of the metal vapor deposition layer 23, the transfer film substrate 21 was removed, the transfer material 30 of the design printing 33 was laminated, and the hot press was again performed under the same conditions as described above.
The transfer material 30 is a biaxially stretched PET film having a thickness of 100 μm, a polyester resin-based thin layer (1 to 2 μm) peeled off by gravure printing, and provided with design printing 33 by silk screen printing on each surface. It was commonly used for the examples and comparative examples. The design print 33 also serves as an adhesive layer. The total thickness of each layer from the surface of the magnetic tape 15 to the outermost surface of the card was about 8 to 10 μm.

With respect to the magnetic concealment cards of the completed examples and comparative examples, embossed characters were stamped, but could be performed without any trouble. Thereafter, an appearance inspection (concealment) and a reading test using a magnetic card reader / writer were performed. In the reading test, a test was performed in which the magnetic card was read and written 2000 times by a reader / writer. The above results are also shown in “Table 1”.

The reason why the surface resistivity of Example 4 is lower than that of Example 3 is considered to be that the film thickness is large and the deposition rate is low and a dense film is formed. Moreover, it is thought that the surface resistivity of Example 5 is lower than that of Example 1 because the surface resistivity is lowered by the entry of aluminum.
In Example 5 and Example 6, multi-source deposition using tin (Sn) and aluminum (Al) was performed, but the produced Sn—Al alloy was produced by ESCA (“LAB 220i-XL, manufactured by VG Scientific, UK). ]), The ratio of Sn and Al was in the range of 100: 1 to 10 in terms of the number of atoms.

DESCRIPTION OF SYMBOLS 10 Magnetic concealment card 11,12 Core sheet 13,14 Oversheet 15,16 Magnetic tape 17 Black solid printing 20 Transfer material 21 Film base material 22 Peeling layer, peeling protective layer 23 Metal vapor deposition layer 23m Metal vapor deposition film 24 Adhesive layer 30 Transfer Material 31 Film Base 32 Release Layer, Release Protection Layer 33 Design Printing 34 Adhesive Layer

Claims (4)

In a magnetic card in which a white core sheet is used as a central layer, oversheets are laminated on both sides thereof, a metal vapor deposition layer is laminated on the magnetic tape transfer surface of one oversheet, and the metal vapor deposition layer surface is subjected to design printing. Magnetic concealment with a metallic luster layer, characterized in that the deposited layer is an insulating layer composed of a sea / island structure, and the core sheet surface in contact with the one oversheet is black-printed with a silk screen. card. In a magnetic card having a black core sheet as a central layer, oversheets are laminated on both sides thereof, a metal vapor deposition layer is laminated on the magnetic tape transfer surface of one oversheet, and the metal vapor deposition layer surface is subjected to design printing. A magnetic concealment card provided with a metallic luster layer, characterized in that the deposited layer is an insulating layer having a sea / island structure.   3. The magnetic concealment card with a metallic luster layer according to claim 1, wherein the metal vapor deposition layer is made of tin (Sn) or a tin-aluminum (Sn-Al) alloy. The magnetic concealment provided with a metallic luster layer according to any one of claims 1 to 3, wherein the surface resistivity of the metal deposition layer is in the range of 10 ¹⁰ to 10 ²⁵ Ω / □. card.

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