JP6036054B2 - Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same - Google Patents

Description

  The present invention relates to an epoxy resin composition for semiconductor encapsulation used as a sealing material for a semiconductor device excellent in high temperature and high humidity reliability, and a semiconductor device using the same.

  Conventionally, various semiconductor elements such as transistors, ICs, and LSIs have been encapsulated by ceramic packages or the like to form semiconductor devices, but recently, from the viewpoint of cost and mass productivity, resin encapsulation using plastic packages has been performed. It has become mainstream. Conventionally, epoxy resin compositions have been used for this type of resin sealing, and good results have been achieved.

  As a means for electrically connecting the semiconductor element and the wiring circuit to be encapsulated in this way, a gold wire has been used conventionally, but recently, in order to reduce the cost, copper is used instead of the gold wire. The application of wire has become prominent. However, along with this, there is concern about a decrease in high-temperature and high-humidity reliability, specifically, a decrease in high-temperature and high-humidity reliability (HAST characteristics) at 130 ° C. × 85% RH.

  There are two types of HAST characteristic degradation, one caused by the sealing resin and the other caused by the copper wire. Further, in order to improve the degradation of HAST characteristics, for example, it has been proposed to add a large amount of ion trapping agent, trap causative impurity ions, and improve HAST reliability (Patent Document 1). 2).

JP 2011-258603 A JP 2009-152561 A

  However, since the mechanism and specific measures for lowering HAST characteristics have not been sufficiently established, further improvements in the composition of the resin composition for semiconductor encapsulation are required.

  The present invention has been made in view of such circumstances, and an epoxy resin composition for semiconductor encapsulation that can be a sealing material for a semiconductor device excellent in high-temperature and high-humidity reliability characteristics (HAST characteristics) with respect to a copper wire and the like An object of the present invention is to provide a semiconductor device using this.

（ｘ）１７５±１０℃×１２０±４０秒間の加熱硬化の後、１７５±１０℃×３±２時間のアフターキュア。
（ｙ）１３０℃×８５％ＲＨにて８０±３０時間の吸湿処理。 In order to achieve the above object, the present invention is an epoxy resin composition for semiconductor encapsulation containing the following components (A) to ( E ), and the blending ratio of the component (A) and the component (B): However, per 1 equivalent of epoxy group in component (A), the hydroxyl group equivalent in component (B) is 0.5 to 1.5 equivalents, and the content of component (C) is The content of the component (D) is 80 to 92% by weight of the entire epoxy resin composition, and the content of the component (E) is an epoxy resin. 0.5 to 5.0% by weight of the total composition, and after the epoxy resin composition for semiconductor encapsulation is cured under the following condition (x), it is subjected to moisture absorption treatment under the following condition (y). When dielectric relaxation measurement was performed on a cured product (diameter or more of the electrode of the dielectric relaxation measuring device × disk thickness of 1 ± 0.6 mm), In the peak of the dielectric loss on the polarization caused, the frequency at which the dielectric loss is 0.81 ± 0.05 for the first aspect of the semiconductor encapsulating epoxy resin composition comprising the following 25 Hz.
(A) Biphenyl type epoxy resin.
(B) Phenolic resin.
(C) Imidazole-based curing accelerator.
(D) Inorganic filler.
(E) A weight average molecular weight of 2500 or less, which is a silicone compound containing a silanol group and not containing an alkoxy group in a functional group directly bonded to silicon, and represented by the following general formula (a) And a silicone compound having a structural unit represented by the following general formula (b).

(X) After curing at 175 ± 10 ° C. × 3 ± 2 hours after heat curing at 175 ± 10 ° C. × 120 ± 40 seconds.
(Y) Moisture absorption treatment at 130 ° C. × 85% RH for 80 ± 30 hours.

  And this invention makes the 2nd summary the semiconductor device formed by resin-sealing a semiconductor element using the said epoxy resin composition for semiconductor sealing.

  That is, the present inventors have intensively studied to solve the above problems. In the course of that research, we first learned that a failure in HAST characteristics was a disconnection caused by corrosion of the connection part (bonding part) of the copper wire. As a result of further research based on the knowledge, it was found that chlorine ions existing in the sealing resin are greatly involved in the corrosion of the bonding portion. Obviously, the corrosion rate of the bonding part is related to the chlorine ion concentration in the sealing resin, but the mobility of chlorine ions in the sealing resin is more effective than that. It was. In order to quantitatively evaluate the mobility of chlorine ions, which are the effective factors, in the sealing resin, various evaluation methods were examined. As a result, the sealing with the moisture absorption treatment equivalent to the HAST test environment was performed. Dielectric relaxation measurement is performed on the cured resin, and the position of the dielectric loss peak due to ionic polarization obtained at that time, that is, the mobility of the average ion in the sealing resin, and the HAST characteristics for the copper wire are very close. It was found that there is a correlation, and the present invention has been reached.

  As described above, the present inventors pay attention to the characteristic of ion mobility in the sealing resin, not the ion concentration contained in the sealing resin, which has been a common knowledge in the prior art. By quantitatively evaluating the mobility, the correlation between the quantitative evaluation and the HAST characteristics for the copper wire was obtained. As a result, dielectric relaxation measurement was performed on the cured resin cured product subjected to the moisture absorption treatment equivalent to that under the HAST characteristic test environment, and the dielectric loss value was 0.81 ± on the dielectric loss peak caused by ionic polarization obtained at that time. If the frequency at the time of 0.05 is 25 Hz or less, a correlation was found that the HAST characteristic for the copper wire was good.

As described above, in the present invention, after curing the epoxy resin composition for semiconductor encapsulation containing a specific amount of the components (A) to ( E ) under a predetermined condition (x), the predetermined condition (y) When a cured product (a disk shape larger than the diameter of the electrode of the dielectric relaxation measuring device) obtained by moisture absorption treatment is measured for dielectric relaxation, the dielectric loss is 0.81 ± 0.05 on the dielectric loss peak due to ion polarization. It is the epoxy resin composition for semiconductor sealing provided with the physical property in which the frequency at the time of becoming becomes 25 Hz or less. For this reason, the sealing resin formed using this as a sealing material is provided with the excellent high temperature, high humidity reliability with respect to a copper wire.

  In particular, when the minimum melt viscosity at 175 ° C. of the epoxy resin composition in a powder state before curing is 100 Pa · s or less, the wire flow characteristics are further improved.

Moreover, the said (A) component is a biphenyl type epoxy resin, and contains the silicone compound (E component) which does not have an alkoxy group with a weight average molecular weight of 2500 or less with the said (A)-(D) component. since a semiconductor encapsulating epoxy resin composition, together with so excellent in high-temperature, high-humidity reliability, so excellent in wire flow characteristics.

It is the schematic which shows a dielectric relaxation measuring apparatus typically. It is a top view which shows typically the semiconductor device used for the measurement of gold wire wire flow evaluation. It is explanatory drawing which shows typically the measuring method of a gold wire wire flow rate.

  Next, an embodiment for carrying out the present invention will be described.

The epoxy resin composition for semiconductor encapsulation of the present invention (hereinafter sometimes abbreviated as “epoxy resin composition”) includes an epoxy resin (A component), a phenol resin (B component), and a specific curing accelerator ( C component), an inorganic filler (D component), and a specific silicone compound (E component) , which are usually in the form of powder (powder) or tablet tableted from this. ing.

<Epoxy resin (component A)>
As the epoxy resin (A component), biphenyl type epoxy resins and the like from the viewpoint of reliability and formability. The epoxy resins such as this, for example, an epoxy equivalent of 150 to 250 g / eq, a softening point or melting point is preferably used in 50 to 130 ° C..

<Phenolic resin (component B)>
The phenol resin (component B) used together with the epoxy resin (component A) has a function as a curing agent for the epoxy resin (component A) and has two or more phenolic hydroxyl groups in one molecule. Monomers, oligomers and polymers in general. For example, phenol novolak resin, cresol novolak resin, biphenyl type novolak resin, triphenylmethane type phenol resin, naphthol novolak resin, phenol biphenylene resin, phenol aralkyl resin, biphenyl aralkyl type phenol resin and the like can be mentioned. These may be used alone or in combination of two or more. Of these, phenol novolac resins, triphenylmethane type phenol resins, and phenol biphenylene resins are preferably used.

The mixing ratio of the epoxy resin (component A) and the phenol resin (component B) is such that the hydroxyl group equivalent in the phenol resin (component B) is 0.5 to 1.5 equivalents per equivalent of epoxy group in the epoxy resin. It is necessary to blend so as to be. More preferably, it is 0.7-1.1 equivalent, Most preferably, it is 0.8-1.0 equivalent.

< Specific curing accelerator (C component)>
The component A and B specific curing accelerator to be used together with the component as the component (C) is b imidazole-based curing accelerator and the like.

The pre-Symbol imidazole curing accelerator, for example, imidazole compounds are preferably used represented by the following general formula (1). Specific examples of such an imidazole compound include 2-phenyl-4-methyl-5-hydroxymethylimidazole.

Content of the said specific hardening accelerator needs to be set to 1.0-12.0 weight% with respect to the said phenol resin (B component) . More preferably, it is 3.0-10.0 weight%.

<Inorganic filler (component D)>
Various fillers are used as the inorganic filler (D component) used together with the components A to C. For example, silica powder such as fused silica powder or crystalline silica powder, alumina powder, talc, aluminum nitride powder, nitriding Examples thereof include silicon powder. These inorganic fillers can be used in any form such as crushed, spherical, or ground. And these inorganic fillers are used individually or in combination of 2 or more types. Among these, it is preferable to use silica powder, and among the above silica powders, it is particularly preferable to use fused silica powder from the viewpoints of high filling property and high fluidity. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, spherical fused silica powder is preferably used.

  Moreover, as an inorganic filler (D component), it is preferable to use a thing with the average particle diameter of the range of 5-40 micrometers from the point of making fluidity | liquidity favorable. The average particle size of the inorganic filler (D component) can be measured, for example, by taking an arbitrary measurement sample from the population and using a commercially available laser diffraction / scattering particle size distribution analyzer.

Then, the content of the inorganic filler (D component) is 8 0 to 92% by weight of the total epoxy resin composition. That is, if the content of the inorganic filler (component D) is too small, the effect of reducing the water absorption rate due to the inorganic filler blending is reduced, and the absolute value of the water absorption rate of the epoxy resin composition is increased in the first place. There is a tendency for high temperature and high humidity reliability to deteriorate and for significant warping to occur. Conversely, if the content of the inorganic filler (component D) is too large, the fluidity of the epoxy resin composition is lowered, and there is a tendency for wire flow and unfilling to occur.

<Additives>
In addition to the above-described components A to D and the silicone compound (E component) , various additives can be appropriately blended in the epoxy resin composition for semiconductor encapsulation of the present invention as necessary. For example, silane-coupling agents, flame retardants, flame retardant agents, release agents, ion trapping agent, pigment or colorant such as carbon black, stress-reducing agent, as necessary other additives such as tackifiers It can mix | blend suitably according to it.

<Silicone compound (component E) >
Examples of the silicone compound (E component), as structural features of its not contain alkoxy groups on the functional groups bonded directly to silicon, silicone compound having a characteristic structure of a silanol group. Silicone compounds having such a characteristic structure are used alone or in combination of two or more.

As said silicone compound (E component) , some commercial items are mention | raise | lifted, for example. Alternatively, it can also be produced by synthesis. As commercially available products of the specific silicone compound, a silicone compound containing a silanol group in containing non an alkoxy group, manufactured by Dow Corning Toray Co., 217FLAKE, 255FLAKE, SH6018FLAKE, 220FLAKE and the like.

  And the silicone compound which does not contain an alkoxy group in the functional group directly couple | bonded with the said silicon, but contains a silanol group can be manufactured as follows, for example. That is, organosilanes having one phenyl group selected from the group consisting of phenylchlorosilanes and phenylalkoxysilanes according to the molecular structure and molecular weight of the target organopolysiloxane and optionally other organochlorosilanes After appropriately reacting with water, if necessary, the polymer is further increased in molecular weight using a condensation reaction accelerating catalyst, and the added organic solvent, by-product hydrochloric acid and low-boiling compounds are removed to remove silanol groups (- An organopolysiloxane containing SiOH) can be obtained. And as a silicone compound obtained in this way, it has a structural unit represented by the following general formula (a), and a structural unit represented by the following general formula (b).

As R ₁ in the general formulas (a) and (b), as described above, at least one is a phenyl group. In addition, for example, alkyl such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, isobutyl group, t-butyl group, pentyl group, hexyl group, heptyl group, octyl group, 2-ethylhexyl group, etc. Group, vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group and other alkenyl groups, tolyl group, xylyl group, naphthyl group, biphenyl group and other aryl groups, benzyl group, phenethyl group and other aralkyl groups, etc. . Especially, it is preferable that they are all a phenyl group or a methyl group with a phenyl group.

  Specific examples of the phenylchlorosilanes used as a raw material for producing the silicone compound include phenyltrichlorosilane, diphenyldichlorosilane, triphenylchlorosilane, and phenylmethyldichlorosilane. These may be used alone or in combination of two or more.

  Specific examples of the phenylalkoxysilanes include phenyltrimethoxysilane, phenyltriethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, triphenylmethoxysilane, triphenylethoxysilane, phenylmethyldimethoxysilane, and phenylmethyldiphenyl. Examples thereof include ethoxysilane. These may be used alone or in combination of two or more.

  Specific examples of the other organochlorosilanes include alkylchlorosilanes such as tetrachlorosilane, methyltrichlorosilane, dimethyldichlorosilane, and trimethylchlorosilane; fluorinated alkylchlorosilanes such as trifluoropropyltrichlorosilane and trifluoropropylmethyldichlorosilane. Alkyl silanes such as tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, trimethylmethoxysilane, trimethylethoxysilane; trifluoropropyltrimethoxysilane, trifluoro Propyltriethoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxy Fluorinated alkyl alkoxysilanes such as orchids and the like. These may be used alone or in combination of two or more.

  As the condensation reaction promoting catalyst, a known condensation catalyst can be used, but a phosphorus compound is preferably used as the condensation catalyst, and in particular, a phosphorus compound that is phosphine oxide is preferably used as the condensation catalyst.

The weight average molecular weight of the silicone compound (E component) must be 2500 or less. Then, preferably in the range of 1,000 to 2,500, particularly preferably from the viewpoint of melt viscosity of the epoxy resin composition or the like, the weight-average molecular weight is 1,200 to 2,500. That is, if the weight average molecular weight of the silicone compound is too small, an appropriate silicone domain is not formed from the viewpoint of phase separation, and there is a tendency to adversely affect various properties. Conversely, the weight average molecular weight of the silicone compound is large. It is because the melt viscosity of an epoxy resin composition will raise significantly and the tendency for a wire flow to generate | occur | produce will be seen when too much.

In the epoxy resin composition of the present invention, the epoxy resin (component A) is a biphenyl type epoxy resin, and the silicone compound has a weight average molecular weight of 2500 or less and has no alkoxy group (E since a component), the epoxy resin composition, together with so excellent in high-temperature, high-humidity reliability, because so excellent in wire flow characteristics, preferred.

The weight average molecular weight of the silicone compound (component E) is measured and calculated as follows. That is, the above specific silicone compound is used to prepare a toluene solution and left at 25 ° C. for 1 day. Then, it filters with a 0.45 micrometer membrane filter, and molecular weight measurement is performed about the obtained filtrate. For this molecular weight measurement, for example, GPC (manufactured by Tosoh Corporation, HLC-8120GPC, column: Tosoh Corporation GMH _XL , GMH _XL , G3000H _XL ) is used. The measurement conditions in this case are a column temperature of 40 ° C., an eluent tetrahydrofuran, a flow rate of 0.8 mL / min, and an injection volume of 100 μL. And a detector calculates a weight average molecular weight (Mw) with a number average molecular weight (Mn) by polystyrene conversion using a differential refractometer.

Content of the said silicone compound (E component) needs to set to the range of 0.5 to 5.0 weight% of the whole epoxy resin composition . Particularly preferred is 1.0 to 4.7% by weight. That is, if the amount of the silicone compound is too small, there is a tendency that the effect of improving the reliability of high temperature and high humidity is difficult to obtain. Conversely, if the content of the silicone compound is too large, the strength of the cured product of the epoxy resin composition is greatly increased. This is because there is a tendency to decrease.

  As the silane coupling agent, those having two or more alkoxy groups are preferably used. Specifically, 3-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ- ( 2-aminoethyl) aminopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-anilinopropyltrimethoxysilane, hexamethyldisilazane and the like. These may be used alone or in combination of two or more.

  Examples of the flame retardant include novolac-type brominated epoxy resins and metal hydroxides. Furthermore, as the flame retardant aid, antimony trioxide, diantimony pentoxide, or the like is used. These may be used alone or in combination of two or more.

  Examples of the mold release agent include compounds such as higher fatty acid, higher fatty acid ester, higher fatty acid calcium and the like. For example, carnauba wax and polyethylene wax are used, and these are used alone or in combination of two or more. Among these, a system using a linear saturated carboxylic acid alone or a system using this linear saturated carboxylic acid and oxidized polyethylene wax in combination is preferably used.

  As the ion trapping agent, all known compounds having ion trapping ability can be used. For example, hydrotalcites, bismuth hydroxide, yttrium oxide and the like are used. These may be used alone or in combination of two or more.

  Examples of the stress reducing agent include butadiene rubbers such as methyl acrylate-butadiene-styrene copolymer and methyl methacrylate-butadiene-styrene copolymer, and silicone compounds. These may be used alone or in combination of two or more.

<Epoxy resin composition for semiconductor encapsulation>
The epoxy resin composition for semiconductor encapsulation of the present invention can be produced, for example, as follows. That is, the above components A to E and other additives as necessary are mixed and mixed, and then melt kneaded in a heated state in a kneader such as a mixing roll machine. Subsequently, after cooling and solidifying this to room temperature, it can grind | pulverize by a well-known means and can manufacture the target epoxy resin composition by a series of processes of tableting as needed.

The thus obtained epoxy resin composition for semiconductor encapsulation has the following physical properties as cured physical properties. That is, a cured product obtained by curing the epoxy resin composition for semiconductor encapsulation under the following condition (x) and then moisture-absorbing under the following condition (y) (more than the diameter of the electrode of the dielectric relaxation measuring device × thickness) When measuring dielectric relaxation of a 1 ± 0.6 mm disk), the physical property is such that the frequency at which the dielectric loss becomes 0.81 ± 0.05 on the dielectric loss peak due to ion polarization is 25 Hz or less. I have.
(X) After curing at 175 ± 10 ° C. × 3 ± 2 hours after heat curing at 175 ± 10 ° C. × 120 ± 40 seconds.
(Y) Moisture absorption treatment at 130 ° C. × 85% RH for 80 ± 30 hours.

  The cured product of the epoxy resin composition formed by curing under the above condition (x) is formed into a disk shape having a diameter equal to or larger than the diameter of the electrode of the dielectric relaxation measuring device, preferably 1 ± 0.6 mm. The above dimensional condition depends on the distance between electrodes of the dielectric relaxation measuring apparatus and the diameter of the electrode, and means that a sample having a diameter larger than the diameter of the electrode is required.

  That is, the cured product of the epoxy resin composition for semiconductor encapsulation has the above physical properties (frequency at which the dielectric loss on the dielectric loss peak due to ionic polarization when the dielectric relaxation measurement is 0.81 ± 0.05. Of 25 Hz or less) is equivalent to an evaluation result of more than 200 hours when an evaluation test is performed by performing an equivalent moisture absorption treatment in the conventional high temperature and high humidity reliability characteristic (HAST characteristic). Thus, if the frequency at the time when the peak of dielectric loss due to ion polarization is 0.81 ± 0.05 is 25 Hz or less, it is equivalent to the evaluation exceeding 200 hours in the HAST characteristic. The lower limit of the frequency is usually 0.01 Hz.

  Next, the dielectric relaxation measurement will be described in detail. First, an epoxy resin composition cured body having a predetermined size obtained by curing under the curing condition (x) is prepared, and then the cured body is subjected to moisture absorption treatment under the moisture absorption condition (y). Using this moisture-absorbed cured body, dielectric relaxation measurement is performed by a dielectric relaxation measuring device. Examples of the dielectric relaxation measuring device include a configuration comprising a combination of an impedance measuring device having a dielectric constant measuring interface and a dynamic viscoelasticity measuring device, and appropriate measurement can be performed with such a configuration. . FIG. 1 is a schematic diagram showing an example of a dielectric relaxation measuring device used in the evaluation method of the present invention. 11a is a dielectric constant measuring interface, 11b is an impedance measuring device, 12 is a dynamic viscoelasticity measuring device, and 12a is The measurement electrode is shown. That is, in this dielectric relaxation measuring device, a dielectric constant measuring interface 11a connected to and arranged on the impedance measuring device 11b is connected to the dynamic viscoelasticity measuring device 12, and the dynamic viscoelasticity measuring device 12 performs measurement. A working electrode 12a is attached. And the sample used as a measuring object is pinched | interposed between the said electrodes 12a for a measurement, and it uses for a measurement. As the dielectric constant measuring interface 11a, for example, a 1296 type dielectric constant measuring interface manufactured by Solartron, UK is used, and as the impedance measuring apparatus 11b, for example, a 1255B type impedance analyzer manufactured by Solartron, UK is used. Moreover, as the dynamic viscoelasticity measuring apparatus 12, ARES made from TA Instruments is used, for example.

  Moreover, when a more accurate measurement result is considered, it is preferable to perform the measurement by the said dielectric relaxation measuring apparatus in 125-135 degreeC atmosphere. More preferably, the measurement is performed in an atmosphere of 129 to 131 ° C.

  And it is preferable to perform the measurement by the said dielectric relaxation measuring apparatus for 2 to 6 minutes from the point that an accurate measurement result is obtained in a short time, maintaining the reliability similar to a HAST test.

  In particular, in the measurement by the dielectric relaxation measuring device, the contact between the sample and the electrode is improved by pressing the electrode against the sample placed between the electrodes of the dielectric relaxation measuring device, and the more accurate measurement result Can be obtained. In addition, the said press is performed by the load of 100-500g, for example.

  Furthermore, in the epoxy resin composition for semiconductor encapsulation of this invention, it is preferable that the minimum melt viscosity in 175 degreeC is 100 Pa.s or less as a physical property of the epoxy resin composition in the powder state before the hardening. By having such physical properties, even better wire flow characteristics are exhibited.

<Semiconductor device>
The method for sealing a semiconductor element using the epoxy resin composition having the above characteristics is not particularly limited, and can be performed by a known molding method such as normal transfer molding, and can be made into a semiconductor device. it can. Examples of the semiconductor device thus obtained include semiconductor devices such as IC and LSI.

  As a semiconductor device of the present invention obtained in this way, for example, a single-sided resin-encapsulated package can be mentioned. The single-sided resin-encapsulated package includes a semiconductor element coated with a passivation film made of polyimide such as PSPI on a semiconductor element mounting substrate such as bismaleimide-triazine (BT) resin. Are sealed with a sealing resin. In general, the semiconductor element and the circuit portion on the semiconductor element mounting substrate are connected by a bonding wire such as a copper wire.

  Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.

  First, prior to Examples and Comparative Examples, the following materials were prepared.

[Epoxy resin a1]
Biphenyl type epoxy resin (Mitsubishi Chemical Corporation YX4000H)
[Epoxy resin a2]
Triphenylmethane type epoxy resin (Nippon Kayaku Co., Ltd., EPPN-501HY)

[Phenolic resin b1]
Phenol biphenylene resin (MEH-7851SS, manufactured by Meiwa Kasei Co., Ltd.)
[Phenolic resin b2]
Phenol novolac resin (Mitsui Chemicals, VR8210
[Phenolic resin b3]
Triphenylmethane type phenolic resin (Maywa Kasei Co., Ltd., MEH-7500)
[Phenolic resin b4]
Phenol novolac resin (manufactured by Gunei Chemical Industry Co., Ltd., GS-180)

[Curing accelerator c1]
2-Phenyl-4-methyl-5-hydroxymethylimidazole (manufactured by Shikoku Chemicals Co., 2P4MHZ)
[Curing accelerator c2]
Phosphorus curing accelerator (manufactured by Hokuko Chemical Co., Ltd., TPP-MK)
[Curing accelerator c3]
Phosphorus curing accelerator (manufactured by Hokuko Chemical Co., Ltd., TPP)
[Curing accelerator c4]
Phosphorus curing accelerator (made by Hokuko Chemical Co., Ltd., TPP-S)

[Additive e1]
Alkoxy group-free silanol group-containing silicone compound (Toray Dow Corning, 217FLAKE, weight average molecular weight 2000)
[Additive e2]
Alkoxy group-free silanol group-containing silicone compound (manufactured by Dow Corning Toray, SH6018FLAKE, weight average molecular weight 2000)
[Additive e3]
Alkoxy group-free silanol group-containing silicone compound (Toray Dow Corning, 220FLAKE, weight average molecular weight 3000)
[Additive e4]
Silanol group-free silicone group-containing silicone compound (Toray Dow Corning, 3074 INTERMEDIATE, weight average molecular weight 1400)
[Additive e5]
Silanol group-free silicone group-containing silicone compound (Toray Dow Corning, SR2402, weight average molecular weight 1500)
[Additive e6]
Silanol group-free silicone group-containing silicone compound (Toray Dow Corning, AY42-163, weight average molecular weight 4500)
[Additive e7]
Silanol group-free silicone group-containing silicone compound (Toray Dow Corning, 3037 INTERMEDIATE, weight average molecular weight 1000)
[Additive e8]
Silanol group-free alkoxy group-containing silicone compound (Momentive Performance Materials, TSR165)
[Additive e9]
Silanol group-free alkoxy group-containing silicone compound (Momentive Performance Materials, XR31-B2733)
[Additive e10]
Silanol group-free silicone group-containing silicone compound (manufactured by Shin-Etsu Chemical Co., Ltd., KR-500)
[Additive e11]
Silanol group-free alkoxy group-containing silicone compound (manufactured by Shin-Etsu Chemical Co., Ltd., KR-9218)
[Additive e12]
Silanol group-free alkoxy group-containing silicone compound (manufactured by Konishi Chemical Industries, SR-23)

[Inorganic filler]
Spherical fused silica powder (average particle size 13μm)

[Pigment]
Carbon black

〔Flame retardants〕
Magnesium hydroxide

〔Silane coupling agent〕
3-Methacryloxypropyltrimethoxysilane

〔Release agent〕
Straight chain saturated carboxylic acid (manufactured by Baker Petrolite, UNICID-700)

[Examples 1 and 2, Reference Examples 1 to 18 , Comparative Examples 1 to 9]
The above materials were blended in the proportions shown in Tables 1 to 3 below, mixed thoroughly with a mixer, and then melt kneaded at 100 ° C. for 2 minutes using a biaxial kneader. Next, after this melt was cooled, the solid powder was pulverized into a powdery epoxy resin composition of interest.

Using each of the epoxy resin compositions of Examples , Reference Examples and Comparative Examples thus obtained, measurement and evaluation were performed according to the methods shown below. These results are also shown in Tables 1 to 3 below.

[Frequency properties in dielectric relaxation measurement]
1) Preparation of sample Using each epoxy resin composition prepared above, press molding is performed at 175 ° C for 120 seconds using a mold, and further post-curing is performed at 175 ° C for 3 hours, so that the thickness is 50 mm. A 1 mm disk-shaped resin cured body sample was prepared.

2) Moisture absorption treatment The sample was subjected to moisture absorption treatment under conditions of moisture absorption treatment at 130 ° C x 85% RH for 80 hours.

3) Dielectric relaxation measurement A 1296 type dielectric constant measurement interface manufactured by Solartron was connected to a 1255B type impedance analyzer manufactured by Solartron. Next, after attaching a measurement electrode to ARES manufactured by TA Instruments, which is a dynamic viscoelasticity measuring apparatus, the dynamic viscoelasticity measuring apparatus was connected to the dielectric constant measurement interface. In this way, a dielectric relaxation measuring apparatus was completed (see FIG. 1). And after setting the set temperature of the thermostat of the dynamic viscoelasticity measuring apparatus to 130 ° C. and performing the gap zero setting, the thermostat chamber door is opened, the sample prepared above is set between the measurement electrodes, and the thermostat bath Closed the door. A load of about 400 g was applied between the measurement electrodes to bring the sample and the electrode into sufficient contact. Five minutes after setting the sample in this way, dielectric relaxation measurement was started. In addition, the dielectric constant of air was separately measured with the same gap (1 mm) as the above sample. The dielectric relaxation measurement conditions were as follows.
・ AC voltage: 1V
・ Frequency range: 1000000Hz to 0.01Hz
・ Integrated time: 1 second

4) Data analysis The average dielectric constant of air was calculated from the measurement result of the dielectric constant of air. Next, from the dielectric relaxation measurement results (capacitance real and capacitance imagery) of the sample, these were divided and normalized by the average dielectric constant of air, and the dielectric constant and dielectric loss of the sample were calculated. Then, the dielectric loss of the sample is plotted against the measurement frequency, and a signal derived from the polarization of ions is confirmed. Among the signals, the frequency at which the dielectric loss value is 0.812 (dielectric relaxation measurement). The default frequency K) (Hz) was read.

[Indicator of high temperature and high humidity reliability for copper wire]
Using each of the epoxy resin compositions prepared above, transfer molding of the semiconductor element is performed under conditions of a molding temperature of 175 ° C. and a molding time of 120 seconds, and post-curing is performed at 175 ° C. for 3 hours (the sample and A single-sided resin-encapsulated package was manufactured under the same thermosetting conditions. Specifically, on a BT resin (manufactured by JCI) (size: 49 mm × 49 mm × thickness 0.21 mm) as a semiconductor element mounting substrate, a Si chip (size: 30 mm × 30 mm × thickness 0.2 mm) as a semiconductor element. ) Was mounted and fixed, and only the mounting surface side was resin-sealed by the transfer molding (sealing resin size: 49 mm × 49 mm × thickness 0.7 mm) to produce a single-side sealed type semiconductor device. A copper bonding wire was used for connection between the Si chip and the circuit portion on the BT resin.

  The HAST test (unsaturated pressurized steam test: no bias) in a high-temperature, high-humidity environment (130 ° C. × 85% RH) is performed on the single-sided resin-encapsulated package (semiconductor device) thus obtained. It was. Then, the resistance value of the single-sided resin-encapsulated package after the high temperature and high humidity treatment is measured, and when the increase rate of the resistance value is 10% or more, it is determined that the disconnection is defective (relative to the copper wire). The high-temperature and high-humidity treatment time during which the above occurs is measured as the defect occurrence time (Cu-HAST reliability) (time) of the high-temperature and high-humidity reliability.

[175 ° C minimum melt viscosity]
The minimum melt viscosity (Pa · s) at 175 ° C. of each epoxy resin composition (powder) prepared as described above was measured using a rheometer manufactured by HAAKE, RS6000.
Measurement gap: 0.5mm
Rotation speed: 5.0 (1 / sec)

[Wire flow characteristics]
As shown in FIG. 2, a gold wire 3 having a wire diameter of 0.6 mil and a wire length of 3.2 mm was bonded onto a PBGA substrate 2 on which the semiconductor chip 1 was mounted, thereby producing an evaluation package. A semiconductor device was obtained by molding with an automatic molding machine (Y-1) manufactured by TOWA (conditions: 175 ° C. × 120 seconds) and post-curing at 175 ° C. × 3 hours. And the amount of gold | metal wire flow in the produced package was measured using the X-ray analyzer. The measurement was performed on eight gold wire wires of each package, and the flow amount of the gold wire 3 from the front direction was measured as shown in FIG. And the value which becomes the maximum part of the flow rate of the gold wire 3 is set to the value (dmm) of the gold wire flow rate of the package, and the gold wire flow rate [(d / L) × 100] is calculated. The average value of the wire flow rate was calculated. L represents the wire length (mm) of the gold wire 3. And the thing with the said gold wire flow rate of 4% or more was displayed as (circle) the x below 4%.

[Normal temperature warping characteristics]
Using each epoxy resin composition prepared above, the semiconductor element was resin-sealed by transfer molding (molding temperature 175 ° C., molding time 90 seconds), and post-cured at 175 ° C. × 3 hours to form a molded product (semiconductor Package). This semiconductor package has a silicon chip (10 mm) on a substrate (50 mm × 50 mm × thickness 0.22 mm: Mitsubishi Gas Chemical Co., Ltd., CCL-HL832) coated with solder resist (manufactured by Taiyo Ink Manufacturing Co., Ltd., PSR-4000 AUS308). × 10 mm × thickness 0.37 mm) is mounted with a die bonding material (EM-700J, manufactured by Nitto Denko Corporation) in a state of 3 vertical × 3 horizontal (total 9) at 10 mm intervals. The amount of warpage of the obtained semiconductor package was measured at room temperature (about 25 ° C.).

From the above results, the epoxy resin compositions of Examples and Reference Examples all contain an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler, and the predetermined frequency K in dielectric relaxation measurement is 25 Hz or less. Therefore, a result excellent in Cu-HAST reliability (high temperature and high humidity reliability) evaluation in the HAST test was obtained. Among them, the epoxy resin compositions of Examples 1 and 2 contain a silicone compound having no alkoxy group, the epoxy resin being a biphenyl type epoxy resin and a weight average molecular weight of 2500 or less, and further imidazole-based curing. Since the accelerator was used and the inorganic filler was in a high blending amount, the high temperature and high humidity reliability was improved, and the wire flow characteristics and the room temperature warping characteristics were more excellent.

  On the other hand, since the predetermined frequency K in dielectric relaxation measurement is larger than 25 Hz, the epoxy resin composition of the comparative example is inferior in Cu-HAST reliability (high temperature and high humidity reliability) evaluation in the HAST test. (Less than 200 hours).

  The epoxy resin composition for semiconductor encapsulation of the present invention makes it possible to obtain a semiconductor device in which a sealing resin formed using this has excellent high-temperature and high-humidity reliability characteristics (HAST characteristics) for copper wires. Therefore, it is useful as a sealing material for various semiconductor elements.

Claims (4)

The epoxy resin composition for semiconductor encapsulation containing the following (A)-( E ) component , Comprising: The compounding ratio of the said (A) component and (B) component is epoxy group 1 in (A) component. The hydroxyl group equivalent in the component (B) is 0.5 to 1.5 equivalents per equivalent, and the content of the component (C) is 1.0 to 12.0% by weight with respect to the component (B). The content of the component (D) is 80 to 92% by weight of the entire epoxy resin composition, and the content of the component (E) is 0.5 to 5.0 based on the entire epoxy resin composition. The cured product obtained by curing the epoxy resin composition for semiconductor encapsulation under the following condition (x) and then performing moisture absorption under the following condition (y) (diameter of electrode of dielectric relaxation measuring device) Above × disk thickness of 1 ± 0.6mm), when measuring dielectric relaxation, peak of dielectric loss due to ion polarization Oite, epoxy resin composition for semiconductor encapsulation which has a frequency at which the dielectric loss is 0.81 ± 0.05, characterized in that the following 25 Hz.
(A) Biphenyl type epoxy resin.
(B) Phenolic resin.
(C) Imidazole-based curing accelerator.
(D) Inorganic filler.
(E) A weight average molecular weight of 2500 or less, which is a silicone compound containing a silanol group and not containing an alkoxy group in a functional group directly bonded to silicon, and represented by the following general formula (a) And a silicone compound having a structural unit represented by the following general formula (b).

(X) After curing at 175 ± 10 ° C. × 3 ± 2 hours after heat curing at 175 ± 10 ° C. × 120 ± 40 seconds.
(Y) Moisture absorption treatment at 130 ° C. × 85% RH for 80 ± 30 hours.   The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin composition in a powder state before curing has a minimum melt viscosity at 175 ° C of 100 Pa · s or less. The epoxy resin composition for semiconductor encapsulation according to claim 1 or 2, wherein the component (B) is at least one selected from the group consisting of a phenol novolac resin, a triphenylmethane type phenol resin, and a phenol biphenylene resin. The semiconductor device formed by resin-sealing a semiconductor element using the epoxy resin composition for semiconductor sealing as described in any one of Claims 1-3 .

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