JP6023777B2 - 極端紫外線リソグラフィプロセスおよび低減されたシャドウ効果および向上した強度を有するマスク - Google Patents
極端紫外線リソグラフィプロセスおよび低減されたシャドウ効果および向上した強度を有するマスク Download PDFInfo
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- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
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- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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Description
本発明は、極端紫外線リソグラフィプロセスおよび低減されたシャドウ効果および向上した強度を有するマスクに関するものである。
20 放射源
30 照明装置
40 マスク
42 マスクステージ
50 投影光学ボックス(POB)
60 ターゲット
70 入射光線
71 0次回折光
72 −1次回折光
73 +1次回折光
105 導電層
110 LTEM基板
120 反射層(ML)
130 第1の反射層
150 第2の反射層
151 モリブデン(Mo)膜
162、164、166、168、170 Mo膜
152、154、156、158、160 Si膜
172 バッファ層
210 第1の状態
220 第2の状態
310、320 メインポリゴン
330 フィールド
340 サブレゾリューションアシストポリゴン
Claims (10)
- 極端紫外線リソグラフィ(EUVL)のマスクであって、
第1の反射係数を有する第1の状態と、前記第1の反射係数と位相差がほぼ180度異なる第2の反射係数を有する第2の状態、
第1のメインポリゴンと前記第1のメインポリゴンと隣接する第2のメインポリゴン、および
前記第1のメインポリゴンと前記第2のメインポリゴンの傍に形成され、複数のサブレゾリューションアシストポリゴンおよび前記サブレゾリューションアシストポリゴンの傍のフィールドを含むバックグラウンド領域、を含み、
前記第1と第2の状態の1つは、前記第1のメインポリゴンに割り当てられ、前記第1と第2の状態の他方は、前記第2のメインポリゴンに割り当てられ、前記複数のサブレゾリューションアシストポリゴンは、前記第2のメインポリゴンに割り当てられた状態と同じ状態に割り当てられ、前記フィールドに割り当てられた状態は、前記第1のメインポリゴンに割り当てられた状態と同じ状態であるマスク。 - 前記第2の状態の反射率は、前記第1の状態の反射率の50%よりも大きい請求項1に記載のマスク。
- 前記マスクは、
低熱膨張材料(LTEM)基板、
前記LTEM基板上の第1の反射層、
前記第1の反射層上のバッファ層、および
前記バッファ層上の第2の反射層を含み、前記第2の反射層は、パターン化されて開口を有し、前記第1の状態と第2の状態の中の1つは、前記第2の反射層の前記開口内で、前記第1の反射層を含み、前記第2の反射層がない第1の領域に定義され、前記第1の状態と第2の状態のもう1つは、前記第1と第2の反射層の両方を含む第2の領域に定義される請求項1に記載のマスク。 - 前記サブレゾリューションアシストポリゴンの隣接する2つの間のピッチは、λ/NAより短く、λは、放射源の波長であり、NAは、投影光学ボックスの開口数である請求項1に記載のマスク。
- ターゲットをパターン化する極端紫外線リソグラフィ(EUVL)プロセスであって、
第1の反射係数を有する第1の状態と、前記第1の反射係数と位相差がほぼ180度異なる第2の反射係数を有する第2の状態、
第1のメインポリゴンと前記第1のメインポリゴンと隣接する第2のメインポリゴン、および
前記第1のメインポリゴンと第2のメインポリゴンの傍に形成され、複数のサブレゾリューションアシストポリゴンおよび前記サブレゾリューションアシストポリゴンの傍のフィールドを含むバックグラウンド領域、を含み、
前記第1と第2の状態の1つは、前記第1のメインポリゴンに割り当てられ、前記第1と第2の状態の他方は、前記第2のメインポリゴンに割り当てられ、前記複数のサブレゾリューションアシストポリゴンは、前記第2のメインポリゴンに割り当てられた状態と同じ状態に割り当てられ、前記フィールドに割り当てられた状態は、前記第1のメインポリゴンに割り当てられた状態と同じ状態であり、
照明によって前記マスクを露光し、回折光と非回折光を生成するステップ、
フィルタによって殆どの前記非回折光を除去するステップ、および
投影光学ボックス(POB)によって、前記回折光と前記除去されていない非回折光を収集して導いて、前記ターゲットを露光するステップを含むEUVLプロセス。 - 前記照明は、0.3未満の部分干渉性σの略軸上照明(ONI)であるか、または軸外照明であり、σcΔσ/2とσc+Δσ/2との間の部分干渉性σを有する光源からなり、σcは、ほぼ0.5であり、Δσは、0.3未満である請求項5に記載のEUVLプロセス。
- 前記第2の状態の反射率は、前記第1の状態の反射率の50%よりも大きい請求項5に記載のEUVLプロセス。
- 前記マスクは、
低熱膨張材料(LTEM)基板、
前記LTEM基板上の第1の反射層、
前記第1の反射層上のバッファ層、および
パターン化されて開口を有し、前記バッファ層上の第2の反射層を含み、
前記第1と第2の状態の1つは、前記第2の反射層の前記開口内で、前記第1の反射層を含み、前記第2の反射層がない第1の領域に定義され、前記第1と第2の状態のもう1つは、前記第1と第2の反射層の両方を含む第2の領域に定義される請求項5に記載のEUVLプロセス。 - 前記サブレゾリューションアシストポリゴンの隣接する2つの間のピッチは、λ/NAより短く、λは、放射源の波長であり、NAは、投影光学ボックスの開口数である請求項5に記載のEUVLプロセス。
- 極端紫外線(EUV)マスクであって、
低熱膨張材料(LTEM)基板
前記低熱膨張材料基板の1つの表面上の第1反射層、
前記第1の反射層上のバッファ層、および
前記バッファ層上の第2の反射層を含み、前記第2の反射層は、パターン化されて種々の開口を有して、第1の状態と第2の状態を定義し、前記第1の状態は、前記第1の反射層を含み、前記第2の反射層を含まない開口で規定され、前記第2の状態は、前記第1と第2の反射層の両方を含み、
隣接のメインポリゴンは、前記第1と第2の状態をそれぞれ定義し、
前記メインポリゴンの傍で、複数のサブレゾリューションアシストポリゴンおよび前記サブレゾリューションアシストポリゴンの傍のフィールドを有するバックグラウンド領域を有し、
前記複数のサブレゾリューションアシストポリゴンは、前記第1の状態と前記第2の状態の中の1つに定義され、且つ
前記フィールドは前記第1の状態と前記第2の状態のもう1つに定義されるEUVマスク。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361907882P | 2013-11-22 | 2013-11-22 | |
US61/907,882 | 2013-11-22 | ||
US14/221,555 US9261774B2 (en) | 2013-11-22 | 2014-03-21 | Extreme ultraviolet lithography process and mask with reduced shadow effect and enhanced intensity |
US14/221,555 | 2014-03-21 |
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JP2015103810A JP2015103810A (ja) | 2015-06-04 |
JP6023777B2 true JP6023777B2 (ja) | 2016-11-09 |
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