JP6022167B2 - Component holding head and mounting work machine equipped with component holding head - Google Patents

Description

  The present invention relates to a component holding head capable of performing a mounting operation for mounting a mounting component on a circuit board, and a mounting work machine including the component holding head.

  The component holding head holds a mounting component and performs a mounting operation for mounting the mounting component on the circuit board by removing the held mounting component on the circuit board, and is described in the following patent document. In this way, there is a component holding head that holds the mounting component by sucking the mounting component with the suction nozzle, and a component holding head that holds the mounting component by holding the mounting component with multiple claws. To do.

JP 2006-286770 A JP-A-6-326499

  The work on the circuit board includes, in addition to the above-mentioned mounting work, work for fixing the mounting part on the circuit board, inspection work for the circuit board on which the mounting part is mounted, work for applying an adhesive etc. on the circuit board, etc. There are various operations, and the plurality of operations are performed on the circuit board, whereby the circuit board is manufactured. For this reason, there are a plurality of work heads corresponding to a plurality of work, and it is necessary to use the work heads corresponding to the work. However, for example, when performing the second work, which is a work different from the mounting work before or after the mounting work, the production efficiency may be reduced if the work head is replaced. The present invention has been made in view of such circumstances, and a component holding head capable of suppressing a decrease in production efficiency even when the second work is performed before and after the execution of the mounting work, and It is an object of the present invention to provide a mounting work machine including such a component holding head.

In order to solve the above problem, the component holding head according to claim 1 of the present application is configured to hold a mounting component to be mounted on a circuit board, and to release the held mounting component on the circuit board. A component holding head capable of performing a mounting operation, which is a task of mounting a mounting component on a circuit board, and a pair of gripping portions that perform the holding operation when approached, and an elasticity that separates the pair of gripping portions supply and the member, and a second working tool for performing a second work which is different from work and the holding operation and the mounting operation among the operations with respect to the circuit board, the negative pressure Ri by the positive negative pressure supply apparatus to, by approaching the gripper of the pair performs the holding operation by stopping the supply of the negative pressure by the negative pressure supply apparatus, separate the grip portion of the pair by the elastic member Let the mounting component be a circuit board , The mounting operation is performed, positive pressure is supplied by the positive / negative pressure supply device, and the second work tool is pushed downward, so that the second work tool is replaced with the second work tool. perform the tasks, each of said positive and negative pressure in accordance with the switching of the stop state of the supply of the supply state and the negative pressure by the supply device and the positive and negative pressures, the mounting operation and the second working and the holding working Is selectively executed.

A component holding head according to a second aspect of the invention is the component holding head according to the first aspect, wherein the holding operation is performed based on a negative pressure from an air passage connected to the positive / negative pressure supply device. The second working tool is pushed downward depending on the negative pressure from the air passage connected to the positive / negative pressure supply device, and is positively applied to the air passage by the positive / negative pressure supply device. The holding operation and the second operation are selectively executed in accordance with switching of the supply state between the pressure and the negative pressure.

  The component holding head according to claim 3 is the component holding head according to claim 1 or 2, wherein the second operation is an operation for fixing the mounted component to the circuit board. And

Moreover, the component holding head according to claim 4 is the component holding head according to any one of claims 1 to 3, before Symbol second work implement is between the gripping portions of said pair , Characterized in that it can be moved in the vertical direction.

Further, a mounting work machine according to claim 5 is provided on a base, and a board transfer device that transfers a circuit board, a component holding head according to any one of claims 1 to 4 , and A moving device that moves the component holding head to an arbitrary position on the base, and the component holding head selectively performs the holding operation, the mounting operation, and the second operation on the circuit board. It is characterized by that.

The component holding head according to claim 1, wherein a pair of gripping parts that perform a holding work by approaching, an elastic member that separates the pair of gripping parts, and a second work execution for executing a second work It is possible to perform the second work instead of the holding work and the mounting work by providing the tool and pushing the second work tool downward. Therefore, according to the component holding head of the first aspect, it is possible to selectively perform the holding work, the mounting work, and the second work with one work head, and suppress the reduction in production efficiency. Is possible. In the component holding head according to claim 1, the holding operation is performed based on the negative pressure by the positive / negative pressure supply device , the mounting operation is performed by stopping the negative pressure, and the second work tool is moved downward. The movement is performed depending on the positive pressure by the positive / negative pressure supply device. Then, the negative pressure by negative pressure supply device, simply by switching the stop state of the supply of positive pressure supply state and the negative pressure, each of the holding working the mounting operation and the second operation is performed selectively. Many of the component holding heads are structured to hold and detach the mounted components based on the positive and negative pressures by the positive and negative pressure supply devices. The positive and negative pressures by the positive and negative pressure supply devices are The structure of the component holding head can be simplified by using it as a driving source for two working tools.

In the component holding head according to claim 2, the holding work is performed based on the negative pressure from the air passage connected to the positive / negative pressure supply device, and the downward movement of the second work tool is performed. Relying on the positive pressure from the air passage connected to the positive and negative pressure supply device. Then, the holding operation and the second operation are selectively performed only by switching the supply state of the negative pressure and the positive pressure to the air passage by the positive / negative pressure supply device. Many of the component holding heads are structured to hold and detach the mounted components based on the positive and negative pressures by the positive and negative pressure supply devices. The positive and negative pressures by the positive and negative pressure supply devices are The structure of the component holding head can be simplified by using it as a driving source for two working tools.

  In the component holding head according to the third aspect, the second operation is an operation for fixing the mounted component to the circuit board. After a mounting operation is performed in which the mounted component is held and the held mounted component is detached from the circuit board, an operation for fixing the mounted component to the circuit board may be required. Specifically, for example, there are operations for pressing the mounting component against the circuit board, heating the mounting component and thermocompression bonding to the circuit substrate, and screwing a screw or the like as the mounting component into the circuit substrate. . In such a case, according to the component holding head of the third aspect, the mounting component is mounted on the circuit board by one work head without replacing the working head, and the mounting component is connected to the circuit. It becomes possible to fix to the substrate, and the production efficiency can be improved.

Moreover, the component holding head according to claim 4, between the grip portion of a pair of gripping the instrumentation Chakubuhin, second working implement is provided. Therefore, also in the component holding head according to claim 4, it is possible to reduce the size of the component holding head.

Further, in the mounting work machine according to the fifth aspect , the component holding head having the above-described structure is mounted, and the same effect as the above effect can be obtained.

It is a perspective view which shows the electronic component mounting apparatus with which the component holding head which is the Example of this invention was mounted | worn. It is a perspective view which shows the mounting head with which the electronic component mounting apparatus shown in FIG. 1 is provided in the state which removed the upper cover. It is sectional drawing which shows the component holder which the mounting head shown in FIG. 2 has. It is sectional drawing which shows the state which can hold | grip the component holder shown in FIG. It is sectional drawing which shows the state which can press the component holder shown in FIG. It is sectional drawing which shows the component holder of the modification 1. It is sectional drawing which shows the component holder of the modification 2. It is sectional drawing which shows the component holder of the modification 3. It is sectional drawing which shows the state which can press the component holder shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments and modifications of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Example>
FIG. 1 shows an electronic component mounting apparatus (hereinafter sometimes abbreviated as “mounting apparatus”) 10. The figure is a perspective view in which a part of the exterior component of the mounting apparatus 10 has been removed. The mounting apparatus 10 includes one system base 12 and two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machines”) 16 arranged side by side adjacent to each other on the system base 12. A component including electronic components (hereinafter sometimes referred to as “mounted component”) is mounted on the circuit board. In the following description, the direction in which the mounting machines 16 are arranged is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  Each of the mounting machines 16 included in the mounting apparatus 10 mainly includes a mounting machine main body 24 configured to include a frame unit 20 and a beam unit 22 overlaid on the frame unit 20, and a circuit board in the X-axis direction. A transport device 26 that transports and fixes a set position, a mounting head 28 that mounts a mounting component on a circuit board fixed by the transport device 26, and a mounting head 28 that is disposed on the beam portion 22 and that is mounted on the X-axis. A moving device 30 that moves in the direction and the Y-axis direction, and a supply device 32 that is disposed in front of the frame portion 20 and supplies the mounting component to the mounting head 28.

  The transport device 26 includes two conveyor devices 40 and 42, and the two conveyor devices 40 and 42 are parallel to each other and extend in the X-axis direction so that the central portion in the Y-axis direction of the frame portion 20. It is arranged. Each of the two conveyor devices 40 and 42 conveys the circuit board supported by each conveyor device 40 and 42 in the X-axis direction by an electromagnetic motor (not shown) and holds the circuit board fixedly at a predetermined position. It is supposed to be a structure.

  The moving device 30 is an XY robot type moving device, and an electromagnetic motor (not shown) that slides a slider 46 that holds the mounting head 28 in the X-axis direction, and an electromagnetic motor (not shown) that slides in the Y-axis direction. The mounting head 28 can be moved to an arbitrary position on the frame portion 20 by the operation of these two electromagnetic motors.

  The supply device 32 is disposed at the front end of the frame portion 20 and is a feeder-type supply device. The feeder-type supply device 32 has a structure in which the mounted components are sequentially supplied from the taped component in which the mounted components are taped to the supply position to the mounting head 28, and a plurality of tapes around which the taped components are wound. A feeder 48 and a plurality of feeding devices (not shown) for feeding out each of the plurality of tape feeders 48 are provided.

  The mounting head 28 is for mounting a mounting component on a circuit board held by the transport device 26, and as shown in FIG. 2, a mounting unit that holds a component holder 50 that holds the mounting component at the tip. 52. The component holder 50 has a structure in which the mounting component is gripped by a pair of arms and the mounting component gripped on the circuit board is detached. Further, the mounting head 28 includes a unit lifting device (not shown) for moving the mounting unit 52 up and down, and a unit rotation device (not shown) for rotating the mounting unit 52 about its axis, and a mounting component to be gripped. It is possible to change the vertical position and the posture of the mounted component.

  Here, specific structures of the component holder 50 and the mounting unit 52 will be described. As shown in FIG. 3, a unit-side air passage 58 connected to a positive / negative pressure supply device (not shown) is formed in the mounting unit 52 so as to extend in the axial direction. On the other hand, the component holder 50 is formed with a holder-side air passage 60 coaxially with the unit-side air passage 58, and the unit-side air passage 58 and the holder-side air passage 60 are separated from each other. 50 is in communication with the mounting unit 52 being held at the tip.

  The component holder 50 includes a generally cylindrical housing 62, and the housing 62 has a stepped shape partitioned into a large diameter portion 66 having a lid portion 64 and a small diameter portion 68. A cylindrical member 70 is disposed inside the large diameter portion 66, and the cylindrical member 70 partitions the inside of the large diameter portion 66 and the inside of the small diameter portion 68. A through hole 72 is formed in the cylindrical member 70 so as to extend in the axial direction, and communicates with the through hole 74 formed in the lid portion 64 of the large diameter portion 66. The holder-side air passage 60 is configured by the two through holes 72 and 74.

  The cylindrical member 70 is further formed with a pair of side wall holes 76 so as to extend in the radial direction at two equally spaced positions. The pair of side wall holes 76 communicate with the through hole 72 and open to the outer peripheral surface of the cylindrical member 70. ing. The large-diameter portion 66 of the housing 62 is also formed with a pair of side wall holes 78 coaxially with the pair of side wall holes 76. The two side wall holes 76, 78 are generally L-shaped. An arm 80 is slidably fitted. The arm 80 is positioned between the fitting portion 82 fitted into the side wall holes 76 and 78, the flange portion 84 formed on the outer periphery of the fitting portion 82, and the outside of the housing 62. And a gripping portion 86 that is bent downward. A coil spring 88 is disposed between the flange portion 84 and the cylindrical member 70 in a compressed state, and the arm 80 is urged radially outward by the elastic force of the coil spring 88. Yes.

  Further, the lower end of the through-hole 72 formed in the columnar member 70 is opened inside the small diameter portion 68 of the housing 62, and a pressing member 90 is disposed in the small diameter portion 68, The member 90 seals the lower end of the through hole 72. Specifically, the pressing member 90 is divided into a generally cylindrical pressing portion 92 and a large-diameter head portion 96 continuous from the upper end portion of the pressing portion 92. The outer diameter of the head portion 96 is slightly smaller than the inner diameter of the small diameter portion 68, and the pressing member 90 can slide in the small diameter portion 68 in the vertical direction. A bent portion 98 that is bent radially inward is formed at the lower end portion of the small diameter portion 68, and the coil spring 100 is compressed between the bent portion 98 and the lower surface of the head portion 96. It is arranged. Accordingly, the pressing member 90 is biased upward by the elastic force of the coil spring 100, whereby the lower end of the through hole 72 is sealed by the head portion 96 of the pressing member 90. When the pressing member 90 is moved downward against the elastic force of the coil spring 100, the lower end of the pressing portion 92 protrudes downward from the small diameter portion 68, that is, the lower end of the housing 62. ing.

  With such a structure, the component holder 50 can perform a mounting operation of gripping / detaching the mounted component and mounting the mounted component on the circuit board. Further, by deforming a part of the component holder 50, it is possible to perform an operation of pressing the mounting component mounted on the circuit board. Specifically, first, in a state where neither positive pressure nor negative pressure is supplied into the unit-side air passage 58 by the positive / negative pressure supply device, as shown in FIG. The pressing member 90 is housed in the small diameter portion 68 of the housing 62 by the elastic force of the coil spring 100. In such a state, the mounting operation and the pressing operation are not executed, and the standby state is set.

  In the standby state, when negative pressure is supplied into the unit-side air passage 58 by the positive / negative pressure supply device, the fitting portions 82 of the pair of arms 80 are affected by the elastic force of the coil spring 88 as shown in FIG. On the other hand, it is sucked into the side wall holes 76 and 78. As a result, the gripping portions 86 of the pair of arms 80 approach each other, and the mounting component located between the pair of gripping portions 86 is gripped. Then, by stopping the supply of negative pressure to the unit-side air passage 58 by the positive / negative pressure supply device, the fitting portion 82 of the pair of arms 80 is retracted from the side wall holes 76 and 78 by the elastic force of the coil spring 88. Then, the gripping portions 86 of the pair of arms 80 are separated from each other. As a result, the mounted component gripped by the pair of gripping portions 86 is detached. As described above, by stopping the supply of the negative pressure to the unit-side air passage 58 and the supply of the negative pressure, it is possible to perform the mounting operation on the circuit board.

  Further, in the standby state, when positive pressure is supplied into the unit-side air passage 58 by the positive / negative pressure supply device, the pressing member 90 moves downward against the elastic force of the coil spring 100 as shown in FIG. The pressing portion 92 protrudes outside the small diameter portion 68 of the housing 62. As a result, the pressing portion 92 is positioned at the lowest end of the component holder 50. Then, the mounting unit 52 is moved downward by the unit lifting device provided in the mounting head 28, so that the pressing part 92 can press the mounting component mounted on the circuit board. That is, the component holder 50 is deformed so as to push the pressing member 90 downward, so that the second work, which is a work different from the mounting work, instead of the mounting work, specifically, on the circuit board. An operation of pressing the mounted component is executed, and the mounted component can be fixed to the circuit board.

  As described above, the component holder 50 can selectively perform the mounting operation and the pressing operation only by switching the supply state of the negative pressure and the positive pressure by the positive / negative pressure supply device. For this reason, for example, after the mounting component is detached on the circuit board by the component holder 50, positive pressure is supplied into the unit-side air passage 58 by the positive / negative pressure supply device at that position, and the mounting unit 52 is moved downward. It is possible to press the mounted component toward the circuit board by moving to. Thereby, work such as head replacement can be omitted, and production efficiency can be improved. Further, in the component holder 50, the pressing member 90 is disposed inside the pair of arms so as to be movable in the vertical direction, so that the work head can be made compact.

<Modification 1>
The component holder 50 of the above embodiment has a structure capable of selectively performing the mounting operation and the pressing operation. However, the component holder 50 is capable of selectively executing the operation different from the pressing operation and the mounting operation. It is possible to adopt. Specifically, for example, it is possible to employ a component holder capable of selectively performing a work for heating a component mounted on a circuit board and thermocompression bonding the mounted component to the circuit board, and a mounting operation. Is possible. A component holder capable of selectively executing the thermocompression bonding operation and the mounting operation is shown in FIG. 6 as a component holder 110 of a modified example. Since the component holder 110 of the modified example has the same configuration as the component holder 50 except for the thermocompression bonding member 112, the same reference numerals are used for components having the same functions as those of the component holder 50. The description will be omitted or simplified.

  The thermocompression bonding member 112 of the component holder 110 is divided into a cylindrical portion 114, a large-diameter head portion 116 continuous from the upper end portion of the cylindrical portion 114, and a heating portion 118 provided at the lower end of the cylindrical portion 114. Yes. The outer diameter of the head portion 116 is slightly smaller than the inner diameter of the small-diameter portion 68 of the housing 62, similar to the head portion 96 of the pressing member 90, and the thermocompression bonding member 112 extends vertically in the small-diameter portion 68. It is possible to slide. The coil spring 120 is disposed in a compressed state between the lower surface of the head portion 116 and the bent portion 98 of the small diameter portion 68.

  With such a structure, in the component holder 110, when positive pressure is supplied to the unit-side air passage 58 by the positive / negative pressure supply device, the heating part 118 of the thermocompression bonding member 112 moves downward from the small diameter part 68 of the housing 62. It protrudes and is located at the lowermost end of the component holder 110. Then, by moving the mounting unit 52 downward by the unit lifting device, it is possible to heat the mounting component by the heating unit 118 and fix the mounting component to the circuit board by thermocompression bonding. That is, the component holder 110 can selectively execute the thermocompression bonding operation and the mounting operation.

<Modification 2>
Moreover, it is possible to employ a component holder that can selectively execute a screw tightening operation and a mounting operation of a screw as a mounting component. A component holder capable of selectively executing the screw tightening operation and the mounting operation is shown in FIG. 7 as a component holder 130 of a modified example. Since the component holder 130 of the modified example has the same configuration as the component holder 50 except for the screw fastening member 132, the same reference numerals are used for components having the same functions as the component holder 50. The description will be omitted or simplified.

  The screw fastening member 132 of the component holder 130 is divided into a driver part 134 whose tip shape is a + character and a large-diameter head part 136 that is continuous from the upper end part of the driver part 134. The outer diameter of the head portion 136 is slightly smaller than the inner diameter of the small-diameter portion 68 of the housing 62, similar to the head portion 96 of the pressing member 90, and the screw fastening member 132 extends in the vertical direction inside the small-diameter portion 68. It is possible to slide. However, a pair of keys 138 are formed at two equal positions on the outer peripheral surface of the head portion 136, and a pair of key grooves formed at two equal positions on the inner peripheral surface of the small diameter portion 68. 140 is fitted. Accordingly, the screw fastening member 132 is prohibited from rotating around the axis within the small diameter portion 68. A coil spring 141 is disposed in a compressed state between the lower surface of the head portion 136 and the bent portion 98 of the small diameter portion 68.

  With such a structure, in the component holder 130, when positive pressure is supplied to the unit-side air passage 58 by the positive / negative pressure supply device, the tip of the driver portion 134 of the screw fastening member 132, that is, a + character is formed. The distal end portion protrudes downward from the small diameter portion 68 of the housing 62 and is in a state positioned at the lowest end of the component holder 130. In this state, the mounting unit 52 is moved downward by the unit lifting device so that the + -shaped tip of the driver portion 134 is fitted into the + groove of the screw arranged on the circuit board. Then, the mounting unit 52 is rotated around the axis line by a unit rotation device provided in the mounting head 28, whereby a screw tightening operation is performed and the mounting component is fixed to the circuit board. That is, the component holder 130 can selectively execute a screw tightening operation and a mounting operation.

<Modification 3>
In the above-described embodiments and modifications, a component holder that holds the mounting component by gripping the mounting component, that is, a so-called chuck-type component holder is employed. It is possible to adopt tools. Specifically, as shown in FIG. 8, a component holder 152 having a suction nozzle 150 can be employed.

  The component holder 152 is provided on the lower end surface of the connection member 154 so as to surround the suction nozzle 150 and the suction nozzle 150 provided at the center of the lower end surface of the connection member 154. The annular member 156 is provided. A through hole 160 is formed in the center of the connecting member 154 coaxially with the nozzle hole 158 of the suction nozzle 150, and the lower end surface of the connecting member 154 so that the through hole 160 and the nozzle hole 158 communicate with each other. The suction nozzle 150 is fixed to the surface.

  Further, the inner diameter of the annular member 156 is larger than the outer diameter of the suction nozzle 150, and the annular member 156 is arranged on the lower end surface of the connecting member 154 so that the suction nozzle 150 is located inside the annular member 156. It is fixed. The inner peripheral surface of the annular member 156 and the outer peripheral surface of the suction nozzle 150 are separated from each other, and a short cylindrical passage 162 is defined by the inner peripheral surface of the annular member 156 and the outer peripheral surface of the suction nozzle 150. Yes. Eight connecting holes (two shown in the figure) 164 formed at eight equal positions of the connecting member 154 communicate with the passage 162.

  A short cylindrical pressing member 166 is disposed in the passage 162 so as to be slidable in the vertical direction, and the lower end of each connection hole 164 opening in the passage 162 is sealed by the pressing member 166. . Specifically, a flange portion 168 is formed at the upper end portion of the outer peripheral surface of the pressing member 166, and an extension portion 170 extending radially inward is formed at the lower end portion of the annular member 156. . A coil spring 172 is disposed between the extended portion 170 and the flange portion 168 in a compressed state. Accordingly, the pressing member 166 is biased upward by the elastic force of the coil spring 172, so that the lower end of the connection hole 164 is sealed by the pressing member 166. When the pressing member 166 is moved downward against the elastic force of the coil spring 172, the lower end of the pressing member 166 protrudes downward from the lower end of the annular member 156.

  The mounting unit 174 that holds the component holder 152 at the lower end portion is formed with a first unit-side air passage 176 that communicates with the through hole 160 of the connecting member 154 so as to extend in the axial direction. A positive / negative pressure supply device is connected to the first unit side air passage 176 so as to supply positive pressure or negative pressure. The mounting unit 174 is further formed with eight second unit side air passages (two shown in the figure) 178 communicating with the eight connection holes 164 of the connecting member 154 so as to extend in the axial direction. Has been. A positive / negative pressure supply device is connected to each second unit side air passage 178 so that only positive pressure is supplied.

  With such a structure, the component holder 152 can selectively perform a mounting operation by suction holding / removal of a mounted component and a pressing operation. More specifically, when the negative pressure is supplied to the first unit side air passage 176 by the positive / negative pressure supply device at the component supply position of the tape feeder 48, the mounted component is sucked and held at the tip of the suction nozzle 150. The Then, the mounting head 28 is moved onto the circuit board, and the positive and negative pressure supply device supplies a slight positive pressure to the first unit side air passage 176, so that the mounting component held at the tip of the suction nozzle 150 is removed. Detached on the circuit board. Thereby, the mounting operation by suction holding / removing the mounted component is executed by the component holder 152.

  When positive pressure is supplied to the second unit side air passage 178 by the positive / negative pressure supply device, the pressing member 166 is biased downward against the elastic force of the coil spring 172 as shown in FIG. Then, the lower end portion of the pressing member 166 protrudes outside the annular member 156 and is positioned below the lower end of the suction nozzle 150. In this state, the mounting unit 174 is moved downward by the unit lifting device, whereby the mounting component mounted on the circuit board can be pressed by the pressing member 166. As described above, in the component holder 152, the component holder 152 is deformed so as to push the pressing member 166 downward, so that the pressing operation is executed instead of the mounting operation, and the mounting component is placed on the circuit board. It can be fixed.

  Incidentally, in the said Example, the component holders 50,110,130,152 are examples of a component holding head. The arm 80 constituting the component holders 50, 110, 130 is an example of a claw, and the suction nozzle 150 constituting the component holder 152 is an example of a suction nozzle. The pressing member 90, the thermocompression bonding member 112, the screw fastening member 132, and the pressing member 166 are examples of the second working tool. The electronic component mounting machine 16 is an example of a mounting work machine, and the frame unit 20, the transport device 26, and the moving device 30 that constitute the electronic component mounting machine 16 are examples of a base, a substrate transport device, and a moving device. is there.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiments and modifications, the second work tool such as the pressing members 90 and 166 for performing a work different from the mounting work is relied on the positive pressure by the positive and negative pressure supply device. However, the second work tool may be moved downward depending on a drive source such as an electromagnetic motor. Further, the pair of arms 80 that grip and detach the mounted component may be operated depending on a drive source such as an electromagnetic motor.

  Further, in the above-described embodiments and modifications, the work for fixing the mounting component to the circuit board is employed as the second work different from the mounting work, but other work can be employed. Specifically, various operations such as an inspection operation and an application operation of an adhesive or the like can be employed.

  16: Electronic component mounting machine (mounting machine) 20: Frame part (base) 26: Transfer device (substrate transfer device) 30: Moving device 50: Component holder (component holding head) 80: Arm (claw) 90: Press Member (second working tool) 110: Component holder (component holding head) 112: Thermocompression bonding member (second working tool) 130: Component holder (component holding head) 132: Screw tightening member (second working tool) 150 : Adsorption nozzle 152: Component holder (component holding head)

Claims (5)

A component holding head that can perform a holding operation for holding a mounting component to be mounted on a circuit board and a mounting operation for mounting the mounting component on the circuit board by removing the held mounting component on the circuit board. There,
Of the work on the circuit board, a pair of gripping parts that perform the holding work by approaching, an elastic member that separates the pair of gripping parts, and a work different from the holding work and the mounting work. and a second working tool for performing a second work,
The negative pressure Ri by the positive negative pressure supply device is supplied, by approaching the gripper of the pair performs the holding operation,
By stopping the supply of negative pressure by the positive / negative pressure supply device, the pair of gripping portions are separated by the elastic member, the mounting component is detached on the circuit board, and the mounting operation is performed.
By supplying positive pressure by the positive / negative pressure supply device and pushing the second work tool downward, the second work is executed instead of the holding work and the mounting work.
Each of the holding operation, the mounting operation, and the second operation is selectively executed in accordance with switching between a positive pressure and negative pressure supply state and a negative pressure supply stop state by the positive and negative pressure supply device. A component holding head. Relying on the negative pressure from the air passage connected to the positive / negative pressure supply device, the holding operation is performed,
The second working tool is pushed downward, depending on the positive pressure from the air passage connected to the positive / negative pressure supply device,
2. The holding operation and the second operation are selectively executed in accordance with switching of a supply state of positive pressure and negative pressure to the air passage by the positive / negative pressure supply device. The component holding head described.   The component holding head according to claim 1, wherein the second operation is an operation for fixing a mounted component to a circuit board. Before Stories second working implement is the one between the grip of the pair, the component holding head according to any one of claims 1 to 3, characterized in that provided movably in the vertical direction . A substrate transfer device that is provided on the base and transfers the circuit board;
The component holding head according to any one of claims 1 to 4 ,
A moving device for moving the component holding head to an arbitrary position on the base;
With
A mounting work machine that selectively performs the holding work, the mounting work, and the second work on the circuit board by the component holding head.

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