JP6017283B2 - Polishing tool - Google Patents

Description

  The present invention relates to a polishing tool, and more particularly to a polishing tool in which polishing abrasive grains are held on the surface of a resin foam such as a sponge. More specifically, the present invention relates to a polishing tool suitable for removing contaminants such as dirt adhering to a cleaning polishing surface while supplying water.

  Various kinds of polishing tools that can be used to remove dirt attached to equipment and equipment such as kitchen sinks, baths, and toilets in the home, vehicle window glass such as cars, trains, and buses, and other ceramics have been proposed. (For example, Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document 4).

  Of each of the above-mentioned patent documents, according to Patent Document 1, a closed cell type sponge without water absorption having a size that can be easily held by hand, a sheet-like continuous pore type sponge with water absorption, and a fine abrasive material. There has been proposed a cleaning tool in which the adhered abrasive cloth paper sheets are integrated in this order. In addition, this Patent Document 1 also mentions that the abrasive cloth paper sheet has a large number of holes or slits for water passage, and that diamond fine particles are used for the abrasive. And according to this cleaning tool, if you hold the closed cell type sponge in your hand, rub the abrasive cloth paper sheet with water and rub it against the surface to be cleaned, the abrasive surface on the abrasive cloth paper sheet (cleaning abrasive surface) The number of times water is re-applied even when cleaning and polishing work is performed continuously due to the water retention function of the continuous pore-type sponge. It is said that there will be less. Furthermore, it is also described that water flows back and forth between the continuous pore type sponge and the cleaning polishing surface through a large number of holes or slits of the continuous pore type sponge, so that the water retention of the continuous pore type sponge is fully utilized.

  Patent Document 2 proposes a cleaning tool such as glass in which an abrasive cloth paper sheet is bonded and integrated on the surface of a closed-cell sponge cut into a size that can be easily held by hand. And according to this, when the glass surface wet with water (cleaning polishing surface) is polished by the abrasive cloth paper sheet, dirt such as crystallized metal elements adhering to the glass surface is removed. . In addition, the sponge surface on the opposite side of the cleaning tool can be pressed against the glass surface to scrape off the moisture on the glass surface, or the moisture on the glass surface can be made into a thin water film to make it easy to dry.

  Patent Document 3 proposes a cleaning material composed of a sponge containing an abrasive material in which fine particles having an abrasive effect are fixed to a sponge alone or together with a binder. According to this cleaning material, only fine particles on the surface layer that are in contact with the object to be cleaned during use act on the cleaning, and no extra fine particles are generated by dropping off from the sponge that is not in contact with the object to be cleaned. Therefore, it is said that contamination by fine particles after washing can be avoided while maintaining the cleaning effect by fine particles. As the sponge, a polyvinyl acetal sponge having continuous or independent pores is used, and cerium oxide is used as the fine particles.

  Patent Document 4 describes a polishing material constituted by adhering an abrasive material made of a nonwoven fabric to which aluminosilicate abrasive particles are fixed to a sponge substrate.

Utility Model Registration No. 3166209 JP-A-6-154127 JP-A-10-130634 JP 2005-206675 A

  Among the polishing tools proposed by each of the above-mentioned patent documents, those described in Patent Document 1, Document 2, and Document 4 are used as an abrasive on the entire surface of a sheet body such as cloth or nonwoven fabric. Common in that fine particles are evenly and uniformly dispersed, and the sheet body in which fine particles are uniformly dispersed is adhered to the whole or substantially the entire surface of a sponge base material. But it is common. In addition, the cleaning and polishing surface is cleaned through the operation of rubbing the cleaning and polishing surface with one surface of the above-mentioned sheet body in which fine particles of the abrasive are scattered while supplying water contained in the sponge base material to the cleaning and polishing surface. It is common in that it is polished.

  On the other hand, in the polishing tool proposed by Patent Document 3, the fine particles having a polishing effect are fixed to the surface layer portion and the inner layer portion of the sponge as a base material. This is different from that described in the document 4. On the other hand, on one surface of the sponge as a base material, fine particles fixed to the surface layer portion of the sponge are exposed over the entire surface, and by rubbing the cleaning polishing surface with one surface of such a sponge, It can be said that the cleaning polishing surface is the same as that described in Patent Document 1, Patent Document 2, and Document 4 in terms of cleaning and polishing.

  However, the cleaning and polishing action common to Patent Document 1, Document 2, Document 3, and Document 4, that is, through the operation of rubbing the cleaning polishing surface with one surface of a sheet body or sponge in which fine particles of the abrasive are scattered. In the cleaning and polishing action that is exhibited, the scratching action of the dirt is only exerted by the individual fine particles, so that the dirt can easily remain on the cleaning and polishing surface without sufficient scraping action. There is a problem that the fine particles that remain are likely to remain on the cleaned and polished surface after work.

  In addition, when cleaning and polishing by rubbing fine particles against a cleaning polishing surface such as glass, supplying a sufficient amount of moisture to the cleaning polishing surface at all times suppresses scratches on the cleaning polishing surface and efficiently removes dirt. It is effective in doing. However, as in Patent Document 1, Document 2, Document 3, and Document 4, if the fine particles are uniformly scattered on one surface of the sheet body or sponge, the particles are present on the surface of the sheet body or sponge. The water passage hole is blocked by the fine particles. In particular, in the case where fine particles are scattered on one surface of the sheet body or sponge in order to enhance the cleaning and polishing action, most of the water passage holes present on the surface of the sheet body or sponge are blocked by the fine particles. Therefore, it is difficult to continuously supply a sufficient amount of moisture from the sheet body or sponge to the cleaning / polishing surface, and there is a concern that the cleaning / polishing surface may be easily damaged or dirt may be difficult to remove.

  Furthermore, regarding removal of moisture remaining on the cleaning and polishing surface after work, as in Patent Document 2, the sponge surface of the closed cell is pressed against the cleaning and polishing surface to scrape off the moisture, or the cleaning and polishing surface has a thin water. In the case of making the film easy to dry, when the moisture is dried, dirt and fine particles inevitably remaining in the moisture always remain on the cleaned and polished surface. In order to solve this problem, it is necessary to perform an operation of wiping and removing the water remaining on the cleaning and polishing surface by using a cloth or nonwoven fabric rich in water absorption.

  The present invention has been made with the intention of improving the above situation, and the cleaning and polishing operation can be performed while always supplying a sufficient amount of moisture to the cleaning and polishing surface of the object. It is an object of the present invention to provide a polishing tool capable of removing not only fine particles exhibiting the action but also foreign matters such as dirt attached to the cleaning polishing surface by the lump of fine particles.

  Another object of the present invention is to provide a polishing tool capable of improving the service life (life) by the action of metal particles.

The polishing tool according to the present invention includes a base material having water absorption properties, and a large number of abrasive grain lumps fixed to the base material and scattered on the surface of the base material at intervals. The base material is a continuous pore-type polyvinyl formal resin sponge having a pore diameter of 30 to 200 μm and a porosity of 80 to 95%, and the individual abrasive grain lumps are bonded by a binder. It consists of an aggregate of a large number of abrasive grains, and the abrasive grain lump is swelled from the surface of the substrate to form a dot shape in front view, and the binder of this abrasive grain lump enters the pores of the sponge. Thus, the bonding force between the abrasive grain lump and the surface of the base material is enhanced, and the back surface of the base material is entirely formed as a water absorbing surface based on the water absorption of the base material.

  With a polishing tool having this configuration, moisture can be contained in the base material due to water absorption of the base material, and cleaning and polishing work is performed while constantly supplying water from the base material to the cleaning polishing surface. be able to. In particular, it is possible to supply a sufficient amount of moisture from the pores of the base material located between a large number of abrasive grains. Therefore, not only the effect that the frictional heat generated during polishing is cooled by the moisture supplied to the cleaning and polishing surface, but also the moisture acts as a lubricant, making it easy to move the polishing tool smoothly on the cleaning and polishing surface. Furthermore, sludge generated during polishing is continuously washed away. In addition, after polishing, the water absorption surface formed by the entire back surface of the base material is used to absorb moisture remaining on the cleaning and polishing surface, or contaminants such as dirt remaining along with moisture and sludge generated by polishing are removed. Since it can be removed, it is possible to suppress a situation in which water containing impurities and sludge remains on the cleaning and polishing surface. The above-mentioned actions such as the constant supply of moisture to the cleaned and polished surface, the cooling action of frictional heat, the lubrication action by moisture, the continuous washing of sludge, the moisture absorption action after polishing, etc., continue as a base material depending on the skeletal structure. It has been found that the use of a material that forms pores is significant.

Further, in the polishing tool having the above-described configuration, polishing is performed by a wrinkle effect (anchoring) caused by the binder of the abrasive grain lump entering the pores of the continuous pore type sponge made of the polyvinyl formal resin constituting the base material. The bonding force between the abrasive grain lump and the surface of the substrate is enhanced. If the pore size of the continuous pore type sponge is smaller than 30 μm, it is difficult for the binder to enter the pores, and the binding force may be weakened accordingly. On the contrary, if the pore diameter of the continuous pore type sponge is larger than 200 μm, the application efficiency of the abrasive grain lump is lowered and it becomes difficult to form the dot-shaped abrasive grain lump. When the pore size of the continuous pore type sponge is within the range of 30 to 200 μm, the bonding force due to the wrinkle effect is increased without reducing the coating efficiency, and the abrasive grain lump is dropped during polishing. Is less likely to occur.

Furthermore, if the porosity is less than 80%, the elasticity and water retention of the base material are too low and the feeling of use is impaired, and if the porosity is more than 95%, the durability and applicability of abrasive grains are deteriorated. descend. When the porosity is in the range of 80 to 95%, moderate elasticity and water retention are obtained, and durability and applicability of abrasive grains are also prevented from being lowered. The porosity is a value calculated by the following formula (1) from the apparent volume and the true volume of the base material measured by a dry automatic densimeter after the rectangular parallelepiped sufficiently dried by a dryer.
Porosity (%) = [(apparent volume−true volume) / apparent volume] × 100 (1)

  In particular, in this polishing tool, a large number of polishing abrasive grain lumps are scattered on the surface of the base material at intervals, and each polishing abrasive lump is an aggregate of a large number of polishing abrasive grains bonded by a binder. The polishing abrasive lump bulges from the surface of the substrate and is formed into a dot shape in front view, so that the action of removing dirt and impurities adhering to the cleaning polishing surface is finely polished. Not only is it demonstrated by abrasive grains, but it is also demonstrated by abrasive abrasive lump that is an aggregate of fine abrasive grains, so it is highly effective in removing contaminants such as dirt and sludge generated by polishing. In addition, the excellent effect that the situation where the abrasive grains fall off from the substrate is suppressed is exhibited. In addition, the many abrasive grain lump scattered on the surface of the base material forms a polishing layer of the polishing tool.

In the present invention, it is possible to adopt a configuration in which the base material is a flexible polyvinyl formal resin having a size that can be held in the hand, and the thickness of the base material is 1 to 30 mm. It is. Here, it is particularly preferable to use a polyvinyl formal resin as a base material in which continuous pores are formed by a skeleton structure, but in the present invention, the base material forms continuous pores by a skeleton structure. It is not limited to being a polyvinyl formal resin. If it is the said structure, it is also possible not only for an operator to grasp a base material by hand but to perform cleaning grinding | polishing work easily, and also to attach a base material to an electric tool (orbital sander) and to perform grinding | polishing work. . Furthermore, since the base material is a polyvinyl formal resin, it is possible to give the base material a certain rigidity so that it does not bend easily, or to give the base material a flexibility so that it can be easily deformed. In the latter case, the polishing tool can be easily adapted to the cleaning and polishing surface having a complicated shape to perform the cleaning and polishing operation, and the operation can be easily performed even in a narrow place. In addition, there is an advantage that during the operation, it is possible to polish the abrasive grain lump fixed to the surface of the base material while uniformly contacting the cleaning abrasive surface. In particular, when the thickness of the base material is 1 to 30 mm and the base material has flexibility, the base material can sufficiently exhibit the bending flexibility, and the base material suitably follows the shape of the cleaning polished surface. .

  In the polishing tool of this invention, it is possible to employ | adopt the structure that the front view dot shape of the said abrasive grain lump is circular or a polygon. The front-view dot shape of the abrasive grain lump includes a circle such as a regular circle, an ellipse, and an oval, and a polygon such as a triangle, a rectangle, a diamond, and a star. In particular, when a diamond or star shape is selected, the edge of the pointed portion of the shape itself can effectively remove dirt and other foreign matters attached to the surface of the object. Therefore, the cleaning and polishing efficiency is improved accordingly.

  In the polishing tool of the present invention, the abrasive grains are selected from diamond, cubic boron nitride, alumina, silicon carbide, calcium carbonate, silicate mineral, cerium oxide, zirconium oxide, silica, seed powder, and melamine resin. The binder is a thermosetting resin selected from epoxy resin, melamine resin, phenol resin, and silicone resin, polystyrene resin, ethylene vinyl acetate resin, and fluorine resin. It is possible to adopt a configuration in which at least one of the thermoplastic resins selected from the above is used. Here, the silicate mineral includes kaolin.

  In particular, when kaolin particles which are one type of silicate mineral having a Mohs hardness of 2 to 2.5 are used as the abrasive grains, the self-disintegrating properties of the kaolin particles themselves are conveniently exhibited. For this reason, it is possible to prevent the abrasive grains from scratching and scratching the cleaning polished surface during polishing. Further, kaolin has a smaller specific gravity than other abrasive grains, so that kaolin is easily dispersed in the binder, and the settling of the abrasive grains hardly occurs in the process of forming dots of the abrasive grain lump by screen printing. As a result, it is easy to form an abrasive grain lump having a stable composition, which helps to improve the stability of the polishing performance.

In the present invention, it is desirable that the abrasive grain lump contains 30 to 70 wt% of abrasive grains. Here, 30 to 70 wt% indicates a numerical range when kaolin is selected as the polishing abrasive grain, and means a weight percentage of the polishing abrasive grain with respect to the abrasive grain lump. In this case, if the abrasive grain is less than 30 wt%, the polishing power tends to be insufficient, and if it is more than 70 wt%, the abrasive grain lump becomes brittle and the abrasive abrasive lump fragments are likely to occur during polishing. Therefore, it becomes difficult to obtain sufficient polishing power and polishing durability. When the abrasive grains are within the range of 30 to 70 wt%, the abrasive abrasive lump is less likely to collapse and generate fragments during polishing, and sufficient polishing power and polishing durability can be obtained. .

In the polishing tool of the present invention, it is desirable that the number of the abrasive abrasive lump is 4 to 12 / cm ² . If the number of abrasive grain lumps is less than 4 / cm ² , there is a high possibility that the abrasive grain lumps themselves will crack when the substrate is bent. Further, when the number of polishing abrasive grains is larger than 12 / cm ² , the arrangement density of the abrasive abrasive grains becomes too fine, and it becomes difficult to form the abrasive abrasive grains in a dot shape. When the number of abrasive grains is within the range of 4 to 12 pieces / cm ² , the abrasive grains are not easily cracked even if the substrate is bent, and the abrasive grains are easily formed into a dot shape. Is possible . In addition, the ratio (L / D) of the width dimension (L) and the height (D) of the dots of the abrasive grain lump is preferably in the range of 0.1-1. When L / D is smaller than 0.1, the abrasive grain lump is liable to lose its shape, and when L / D is larger than 1, the polishing stability tends to be impaired. A more preferable range of L / D is 0.2 to 0.5.

In the polishing tool of the present invention, the entire surface area of a large number of abrasive grains lump scattered on the surface of the substrate is preferably 30 to 80% of the substrate surface area. If the entire surface area of a large number of abrasive grains is less than 30% of the surface area of the substrate, sufficient polishing efficiency cannot be obtained, and if it is more than 80%, the abrasive grains are likely to be destroyed. The flexibility of the material is likely to be hindered. When the entire surface area of a large number of abrasive grains is within the range of 30 to 80% of the surface area of the substrate, the abrasive grains are hardly broken and the bending durability of the substrate is improved.

  In the polishing tool of the present invention, the abrasive grain lump may contain metal particles together with the abrasive grains. The metal particles contained in the abrasive grain lump not only serve to increase the strength of the abrasive abrasive grain lump by acting as a filler or aggregate, but also by adopting soft metal particles, It is presumed that the metal particles are crushed and stretched on the surface of the abrasive grain lump to form a metal surface covering the abrasive abrasive lump, and the abrasive grains are supported on the metal surface and exhibit a polishing action. Therefore, the disappearance of the abrasive grains accompanying the polishing operation is suppressed, and the useful life (life) of the polishing tool is improved. This effect is remarkably exhibited by adopting a configuration in which the metal particles are composed of one or more selected from copper particles and tin particles.

  In the polishing tool of the present invention in which the abrasive grain lump includes metal particles together with the abrasive grain, the entire surface area of a large number of abrasive grain lump scattered on the surface of the substrate is more than 80% of the substrate surface area. If the amount is less than 90%, a sufficient life improvement effect cannot be obtained. If the amount is more than 90%, the abrasive grain lump itself tends to be broken, and the flexibility of the base material 1 tends to be hindered. When the entire surface area of a large number of abrasive grains is within the range of 80 to 90% of the surface area of the base material, a life improvement effect can be easily obtained, and the bending durability of the base material is also improved.

  In the polishing tool of the present invention in which the abrasive abrasive lump includes metal particles together with the abrasive abrasive, it is desirable that the maximum size of each of the abrasive abrasive agglomerates is 1 to 1.5 mm. This is useful for technically facilitating the formation of dot-shaped abrasive grains. In addition, it is desirable that the maximum size of each abrasive grain lump is as fine as possible within the range of 1 to 1.5 mm.

In the polishing tool of the present invention in which the abrasive grain lump includes metal particles together with the abrasive grain, the number of the abrasive grain agglomerates is preferably 50 / cm ² or more. The number of this abrasive grain lump is naturally set according to the maximum size of the above-mentioned abrasive grain lump.

In the polishing tool of the present invention in which the abrasive grain lump includes metal particles together with the abrasive grain, the abrasive grain lump preferably contains 5 to 50 wt% of abrasive grains. Here, if the abrasive grain is less than 5 wt%, the polishing power tends to be insufficient, and if it is more than 50 wt%, the abrasive grain lump becomes brittle and the abrasive abrasive lump fragments are likely to be generated during polishing. It becomes difficult to obtain sufficient polishing power and polishing durability. When the abrasive grains are within the range of 5 to 50 wt%, even if metal particles are contained, the abrasive grains lump is less likely to break down and generate debris during polishing. High polishing power and polishing durability .

  As described above, the polishing tool according to the present invention is a base material that is located between a large number of abrasive grain lumps after water is contained in a base material made of a continuous pore type sponge having water absorption. Cleaning and polishing work can be performed while constantly supplying a sufficient amount of moisture to the cleaning and polishing surface from the opening of the continuous pores, so that the polishing tool can be moved smoothly on the cleaning and polishing surface while suppressing the temperature rise of the cleaning and polishing surface be able to. In addition, it becomes possible to continuously wash away sludge containing polishing abrasive lump fragments and polishing abrasive grains generated during polishing, and after polishing, it remains on the cleaning polished surface using the water absorption surface of the substrate. It is possible to easily remove moisture by absorbing it together with sludge including contaminants such as dirt contained in the moisture, and fragments of abrasive abrasive lump. Therefore, it is possible to easily and quickly perform the cleaning and polishing operation without performing the operation of repeatedly immersing the polishing tool in water frequently or wiping off the remaining water with a separately prepared cloth or nonwoven fabric.

  Further, in the polishing tool according to the present invention, the individual abrasive grains lump scattered on the surface of the base material are formed in a dot shape in front view by bulging from the surface of the base material, and by the binder Because it is an aggregate of a large number of bonded abrasive grains, the action of removing contaminants such as dirt adhering to the cleaning abrasive surface is improved, and the substrate falls off from the abrasive grains and becomes a cleaning abrasive surface. The situation of remaining is also suppressed.

In particular, a configuration is adopted in which the base material is selected from flexible polyvinyl formal resin or artificial leather having a size that can be held in the hand, and the thickness of the base material is 1 to 30 mm. In addition, the polishing tool can be easily adapted to the cleaning and polishing surface having a complicated shape so that the cleaning and polishing operation can be easily performed, and the operation can be easily performed even in a narrow place. .

  Furthermore, the polishing tool of the present invention can be manufactured through a simple process of screen-printing abrasive grains in a predetermined pattern on the surface of a continuous pore-type sponge as a base material. Since there is no need to form a water passage hole in the material, there is an effect that it can be provided at a low cost.

  Further, in the present invention, when adopting a configuration in which the abrasive grain lump includes metal particles together with the abrasive grains, when soft metal particles such as copper particles and tin particles are employed, the soft abrasive particles during the polishing operation are used. The metal particles form a metal surface covering the abrasive grain lump, and the abrasive grains are supported on the metal surface. Therefore, disappearance of the abrasive grains accompanying the polishing operation is suppressed, and an excellent effect that the service life (life) of the polishing tool is improved is exhibited.

1 is a perspective view illustratively showing a polishing tool according to the present invention. It is explanatory drawing which illustrated the arrangement | sequence pattern and planar view shape of the abrasive grain lump. It is an enlarged view of the principal part of FIG. It is explanatory drawing which showed the side view shape of the abrasive grain lump. It is explanatory drawing which showed the other side view shape of the abrasive grain lump. It is the side view which showed the polishing tool explanatoryly. It is explanatory drawing which illustrated the other arrangement | sequence pattern and other planar view shape of the abrasive grain lump. It is explanatory drawing which illustrated further another arrangement pattern and other planar view shape of an abrasive grain lump.

  FIG. 1 is a perspective view illustratively showing a polishing tool according to the present invention, FIG. 2 is an explanatory view illustrating an array pattern of polishing abrasive agglomerates and a plan view shape, and FIG. 3 is an enlarged view of the main part of FIG. 4 is an explanatory view showing a side view shape of the abrasive grain lump, FIG. 5 is an explanatory view showing another side view shape of the abrasive abrasive lump, and FIG. 6 is a side view illustratively showing the polishing tool. FIG. 7 is an explanatory view illustrating another arrangement pattern of the abrasive grain lump and another plan view shape, and FIG. 8 illustrates still another array pattern of the abrasive grain lump and another plan view shape. It is explanatory drawing.

  As shown in FIG. 1, the polishing tool according to the present invention is fixed in an array in which a large number of abrasive grain lumps 2 are scattered on the surface of a substrate 1, and the abrasive grain lumps 2 are spaced apart from each other. The surface of the base material 1 is exposed between the abrasive grain lumps 2.

A hard or flexible continuous pore type sponge made of polyvinyl formal (PVFM) is adopted as the base material 1, and its front view shape is formed in a front view rectangle as shown in FIG . The base material 1 has a size that can be held by an operator who performs cleaning and polishing. Since this type of base material 1 has its own continuous pores exhibit absorbency due to capillary action, when the base material 1 is immersed in water, the base material 1 absorbs moisture. Moisture absorption is performed on continuous pores that are open on the outer surface such as the front surface, back surface, and side surface of the substrate 1. Moreover, when the base material 1 is squeezed or pressed using the flexibility and compressed, moisture is squeezed to the outside from the continuous pores opened on the front surface or the back surface of the base material 1 absorbed by the base material 1. Is issued. Therefore, the back surface and the side surface of the substrate 1 according to this embodiment act as the water absorption surfaces 12 and 13 (see FIG. 1 or FIG. 6).

  As illustrated in FIG. 6, each abrasive grain lump 2 is an aggregate of a large number of abrasive grains 21 joined by a binder 22.

  Next, an example of the manufacturing procedure of the polishing tool will be described. A masking sheet in which a large number of through holes are scattered is superposed on the surface of the substrate 1 made of a continuous pore type sponge, and a binder 22 containing abrasive grains 21 is screen-printed thereon. When this step is performed, the front-view dot-shaped abrasive grain lump 2 is fixed at a number of locations on the surface of the substrate 1. Thus, the abrasive grain lump 2 fixed to the base material 1 swells from the surface of the base material 1 as shown in FIG. The abrasive grain lump 2 shown in FIG. 4 is formed to have a dome shape when viewed from the side, and the abrasive grain lump 2 shown in FIG. 5 is formed to have a rectangular shape when viewed from the side. The side view shape of the lump 2 is not limited to these. Moreover, the front-view dot shape of the abrasive grain lump 2 may be a regular circle as shown in FIG. 2 or FIG. 3 or a diamond shape as shown in FIG. 7 or FIG. Further, it may be other ellipse, oval, or polygon such as star or rectangle. Further, various dot-shaped abrasive abrasive lumps may be mixed, or different sizes of dot-shaped abrasive abrasive lumps may be mixed. Further, even if the front-view dot shape of the abrasive grain lump 2 includes the abrasive grains throughout as shown in FIGS. 2 and 7, it has a void 23 in the center as shown in FIG. It may be a thing.

  The binder 22 of the abrasive grain lump 2 fixed to the surface of the base material 1 penetrates into the continuous pores opened on the surface of the base material 1 and is joined to the base material 1. Therefore, the abrasive grain lump 2 is firmly integrated with the substrate 1 by the wrinkle effect (anchoring effect).

  The abrasive grain lump 2 can contain relatively soft metal particles such as copper particles and tin particles together with the abrasive grains 21.

  The abrasive grain lump 2 is formed only on the surface of the substrate 1 and not on the back surface. Therefore, on the surface of the base material 1, the openings of the continuous pores are located between the adjacent abrasive grain lumps 2, and on the back surface of the base material 1, the openings of the continuous pores are uniformly distributed over the entire back surface. Existing. The abrasive grain lump 2 may be scattered randomly on the surface of the substrate 1 or may be scattered according to a certain arrangement pattern. For example, in the example of FIG. 2, the abrasive abrasive lump 2 is arranged in a staggered manner vertically and horizontally. 7 and 8, the abrasive grain lump 2 is regularly arranged according to a certain rule.

  When cleaning and polishing the cleaning and polishing surface with the polishing tool configured as described above, for example, an operator holds the base material 1 by hand and brings the abrasive grain lump 2 on the surface of the base material 1 into contact with the cleaning and polishing surface. Rub together. In this case, the entire polishing tool is immersed in water in advance to allow the substrate 1 to absorb moisture.

  When such a cleaning and polishing operation is performed, moisture is constantly supplied from the opening of the continuous pores of the substrate 1 to the cleaning and polishing surface during the cleaning and polishing. Therefore, not only the frictional heat generated on the cleaning / polishing surface is cooled, but also moisture acts as a lubricant so that the polishing tool moves smoothly on the cleaning / polishing surface. In addition, sludge generated during the cleaning and polishing, specifically, contaminants such as dirt adhering to the cleaning and polishing surface, polishing abrasive particles coming out from the polishing abrasive lump 2 and the like are continuously washed away. In addition, when the cleaning and polishing operation is completed, residual moisture is absorbed by the substrate 1 when the water absorbing surfaces 12 and 13 of the substrate 1 are pressed against the cleaning and polishing surface or moved on the cleaning and polishing surface. Therefore, it does not take time and effort to wipe off residual moisture using a separate cloth or non-woven fabric. When the residual moisture is absorbed by the substrate 1 and wiped off, contaminants such as dirt contained in the residual moisture, debris from the abrasive grain lump 2 and abrasive grains are simultaneously removed.

  In the polishing cleaning operation, not only the fine particles of the polishing abrasive grains contained in the polishing abrasive lump 2, but also the polishing abrasive lump 2 itself is useful for scraping off and removing foreign substances such as dirt adhering to the cleaning and polishing surface. In particular, in the polishing tool of this embodiment, each polishing abrasive grain lump 2 is an aggregate of a large number of polishing abrasive grains 21 bonded by a binder 22, and therefore, when scraping impurities with fine polishing abrasive grains. An excellent removal effect can be obtained. In particular, when the abrasive grain lump 2 is formed in a front rhombus-like dot shape as shown in FIGS. 7 and 8, the sharpness of the rhombus in the front view scrapes away impurities, so that the removal action is remarkably improved. To do. Further, the supply of moisture to the cleaning and polishing surface is performed through continuous pores that are open between adjacent abrasive grain lumps 2 on the surface of the substrate 1. Therefore, a sufficient amount of moisture is always supplied without being disturbed by the abrasive grain lump 2.

  In the polishing tool of this embodiment, the fixing of the base material 1 and the abrasive grain lump 2 is firmly coupled by the above-described wrinkle effect, so that the abrasive grain lump 2 is detached from the base material 1 during the cleaning and polishing operation. Or the shape of the abrasive grain lump 2 collapses and a large amount of abrasive grains are unlikely to occur. Therefore, not only the above-described contaminant removal operation is efficiently performed, but also the abrasive grains contained in the residual moisture can be minimized.

  In the above-described polishing tool, when the front view shape is rectangular, the base material 1 has a size that can be held in the hand, and the thickness of the base material 1 is 1 to 30 mm. desired. If the thickness of the base material 1 is within this range, the operator can easily perform the cleaning and polishing work by grasping the base material 1 by hand. It becomes possible to clean and polish the cleaning / polishing surface having it without difficulty. It is also useful for easily carrying out the cleaning and polishing operation in a narrow place. In addition, it is also possible to attach the base material 1 to a rotating machine called an orbital sander and perform the polishing operation. Here, if the thickness of the base material 1 is set to 5 to 20 mm in particular, the cleaning and polishing surface having a complicated shape can be easily cleaned and polished, or the cleaning and polishing operation in a narrow place can be easily and easily performed. The effect of being able to perform is remarkably exhibited.

  The abrasive grains 21 contained in the abrasive grain lump 2 include diamond, cubic boron nitride, alumina, silicon carbide, calcium carbonate, silicate mineral, cerium oxide, zirconium oxide, silica, seed powder, melamine resin, At least one or more of inorganic particles or organic particles selected from can be used. That is, these inorganic particles or organic particles may be used alone, or different types of inorganic particles or organic particles may be used in combination. As the polishing abrasive grain 21, appropriate inorganic particles or organic particles should be appropriately selected according to the hardness of the cleaning polishing surface. By doing so, it becomes possible to prevent the cleaning polishing surface from being damaged.

  When the abrasive grains 21 contain metal particles in the abrasive grains 21, copper particles and tin particles can be contained alone or in combination as metal particles.

  When the particles of kaolin, which is one kind of silicate mineral having a Mohs hardness of 2 to 2.5, are selected as the abrasive grains 21, the following advantages can be obtained. That is, kaolin particles themselves have self-disintegrating properties. Therefore, even if the abrasive grain lump 2 collapses during the cleaning and polishing operation and the abrasive grains (kaolin particles) 21 flow out onto the cleaning and polishing surface, the abrasive grains are fine due to the self-disintegrating property of the abrasive grains 21. Since the powder is changed to powder, it is possible to prevent scratching by scratching the cleaning polished surface. In addition, kaolin has a smaller specific gravity than other abrasive grains, so it is easy to disperse in the binder, so it is easy to form abrasive grains with a stable composition, which improves the stability of the polishing performance. It helps.

  Further, when metal particles are included in the abrasive grain lump 2 together with the abrasive grains 21, soft metal particles form a metal surface that covers the abrasive lump 2 during the polishing operation, and the abrasive grains 21 are formed on the metal surface. Will be carried. Therefore, it is considered that the disappearance of the abrasive grains 21 accompanying the polishing operation is suppressed, and the service life (life) of the polishing tool is improved.

  The binder 22 contained in the abrasive grain lump 2 is made of a thermoplastic resin selected from an epoxy resin, a melamine resin, a phenol resin, and a silicone resin, a polystyrene resin, an ethylene vinyl acetate resin, and a fluororesin. At least one of them can be used. When these thermosetting resins or thermoplastic resins are employed in the binder 22 and the abrasive grains 21 are mixed, the bubbles may be trapped inside the abrasive grain lump 2 in some cases. However, even if the bubbles are confined as such, the bubbles do not adversely affect the cleaning and polishing operation. In FIG. 6, the bubbles confined in the abrasive grain lump 2 are illustratively indicated by reference numeral 24.

  Each polishing abrasive grain lump 2 preferably includes 30 to 70 wt% of polishing abrasive grains 21 in a weight percentage with respect to the polishing abrasive lump 2. If the content of the abrasive grains 21 is less than 30 wt%, the polishing power tends to be insufficient, and if it exceeds 70 wt%, the abrasive grains 2 become brittle and fragments of the abrasive grains are generated during cleaning and polishing. It becomes easy to obtain sufficient polishing power and polishing durability. When the abrasive grains are within the range of 30 to 70 wt%, the abrasive grains lump is less likely to collapse and generate fragments during cleaning and polishing, and sufficient polishing power and polishing durability can be obtained. It is done. This effect is particularly prominent when the abrasive grains are 40 to 60 wt%.

  In addition, the entire surface area of a large number of abrasive grain lumps 2 fixed to the surface of the substrate 1 is 30 to 80% of the surface area of the substrate 1 when the abrasive abrasive lump 2 does not contain metal particles. It is desirable that When the entire surface area of the abrasive grain lump 2 is less than 30% of the surface area of the substrate 1, sufficient polishing efficiency cannot be obtained, and when it is more than 80%, the water supply rate from the substrate 1 is lowered. Or the flexibility and durability of the substrate 1 may be deteriorated. When the entire surface area of a large number of abrasive grains 2 is within the range of 30 to 80% of the surface area of the substrate 1, a high polishing efficiency is maintained while always supplying a sufficient amount of moisture to the cleaned polishing surface. It becomes possible. This effect is remarkably exhibited when the entire surface area of the large number of abrasive grains 2 is 50 to 60% of the surface area of the substrate 1.

  When the abrasive grain lump 2 contains metal particles, the entire surface area of the many abrasive abrasive lump 2 scattered on the surface of the substrate 1 is 80 to 90% of the substrate surface area. desirable. If the entire surface area of the large number of abrasive grain masses 2 is less than 80% of the surface area of the substrate, a sufficient life improvement effect cannot be obtained, and if more than 90%, the abrasive grain masses themselves are easily destroyed. The flexibility of the base material 1 is likely to be hindered. If the entire surface area of a large number of abrasive grains is not sufficient to improve the surface area of the substrate, and if it is more than 90%, the abrasive grains are likely to be destroyed and the flexibility of the substrate 1 is increased. It becomes easy to be disturbed. When the entire surface area of a large number of abrasive grains is within the range of 80 to 90% of the surface area of the base material, a life improvement effect can be easily obtained, and the bending durability of the base material is also improved.

  The pore diameter of the continuous pore type sponge made of PVFM resin as the substrate 1 is desirably 30 to 200 μm. If the pore diameter is smaller than 30 μm, it is difficult for the binder 22 to enter the pores, and the binding force may be weakened accordingly. When the pore diameter is larger than 200 μm, the amount of the binder 22 that enters the continuous pores becomes too large, the coating efficiency is lowered, and it becomes difficult to form the dot-shaped abrasive grain lump 2. When the pore diameter is in the range of 30 to 200 μm, the bonding force due to the above-described wrinkle effect is increased without causing a decrease in coating efficiency, and it is difficult for the abrasive abrasive lump 2 to drop off during the cleaning and polishing operation. Become. This effect is remarkably exhibited when the pore diameter is 60 to 130 μm.

  The porosity of the continuous pore type sponge made of PVFM resin as the substrate 1 is desirably 80 to 95%. The porosity is a value calculated by the above equation (1). If the porosity is less than 80%, the elasticity and water retention of the substrate 1 are too low, and the feeling of use is impaired. If the porosity is more than 95%, durability and applicability of abrasive grains are increased. descend. When the porosity is in the range of 89 to 91%, moderate elasticity and water retention are obtained, and durability and applicability of the abrasive grains are also prevented from being lowered.

When the abrasive grain lump 2 does not contain metal particles, the number of abrasive abrasive lump 2 fixed to the surface of the substrate 1 is desirably 4 to 12 / cm ² . When the number of the abrasive grain lump 2 is less than 4 pieces / cm ² , there is a high possibility that the polishing abrasive lump 2 itself is cracked when the substrate 1 is bent. Further, when the number of polishing abrasive lump 2 is more than 12 pieces / cm ² , the arrangement density of polishing abrasive lump 2 becomes too fine, and it becomes difficult to form polishing abrasive lump 2 in a dot shape. When the number of the abrasive abrasive lump 2 is within the range of 4 to 12 pieces / cm ² , the abrasive abrasive lump 2 is hardly cracked even if the substrate 1 is bent, and the abrasive abrasive lump 2 is easily formed. It can be formed in a dot shape. This effect is remarkably exhibited when the number of abrasive grains 2 is 6 to 8 / cm ² .

When the abrasive grain lump 2 contains metal particles, the number of the abrasive abrasive lump 2 is preferably 50 / cm ² or more. The number of the abrasive grains lump 2 is naturally set according to the maximum size of the abrasive grains lump.

In the case where the abrasive grain lump 2 contains metal particles together with the abrasive grains, it is desirable that the abrasive grain lump 2 contains 5 to 50 wt% abrasive grains. If the abrasive grain is less than 5 wt%, the polishing power tends to be insufficient, and if it exceeds 50 wt%, the abrasive grain lump becomes brittle and it is easy to generate fragments of the abrasive grain lump during polishing. It becomes difficult to obtain strength and polishing durability. When the abrasive grains are within the range of 5 to 50 wt%, even if metal particles are contained, the abrasive grain lump 2 is less likely to collapse and generate fragments during polishing, Sufficient polishing power and polishing durability can be obtained. It has been found that this effect is particularly prominent when the abrasive grains are 5 to 30 wt%.

Example 1
10 g of epoxy resin, 2 g of curing agent, and 10 g of kaolin as abrasive grains are mixed, and the surface area of the binder made of PVFM resin sponge (PVFM sponge) is abbreviated as the surface area of the binder relative to the surface area of the substrate (hereinafter referred to as “grinding stone area”). ) Was applied at 50%, and then dried and solidified at 60 ° C. When the kitchen sink was cleaned and polished with the resulting abrasive material, the stain was removed well even with a small amount of water supply.

Example 2
10 g of an epoxy resin, 2 g of a curing agent, and 10 g of kaolin as abrasive grains were mixed and applied to the surface of a substrate made of PVFM sponge so that the grindstone area was 30%, and then dried and solidified at 60 ° C. When the kitchen sink was cleaned and polished with the resulting abrasive material, the stain was removed well even with a small amount of water supply.

Example 3
10 g of epoxy resin, 2 g of curing agent, 4 g of artificial diamond particles as abrasive grains, and 61 g of copper particles as metal particles are mixed, and a dot of about 1 mmφ is formed on the surface of the substrate made of PVFM sponge so that the grindstone area becomes 80%. After forming into a shape, it was dried at 60 ° C. and further reacted at 80 ° C. When the obtained abrasive was cleaned and polished on a glass with scaly dirt adhered in a state where water was contained in the sponge portion, the dirt was satisfactorily removed even if the supply of water was small.
To verify the life improving effect by the metal particles, upon sticking to the electric tool, it was traversing the glass surface at 1.25 m 2 ^/ 15min, abrasive agglomerates at the time of processing a 4m ² is sufficiently remained Was.

Example 4
10 g of epoxy resin, 2 g of curing agent, 12 g of alumina particles (# 2000) as abrasive grains, and 40 g of tin particles as metal particles are mixed so that the surface of the substrate made of PVFM sponge has a grinding wheel area of 80%. After forming into a dot shape of about 1 mmφ, it was dried at 60 ° C. and further reacted at 80 ° C. When the kitchen sink was cleaned and polished with the resulting abrasive in which water was contained in the sponge part, the dirt was satisfactorily removed even when the supply of water was small.

Comparative Example 1
10 g of epoxy resin, 2 g of curing agent, and 10 g of kaolin as abrasive grains were mixed and applied to the surface of the substrate made of PVFM sponge so that the grindstone area was 100%, and then dried and solidified at 60 ° C. The obtained abrasive material was not flexible and durable, and had problems such as cracking on the surface of the abrasive grain lump when bent. It was not suitable for polishing fine parts.

Comparative Example 2
10 g of epoxy resin, 2 g of curing agent, and 10 g of kaolin as abrasive grains were mixed and applied to the surface of a substrate made of PVFM sponge so that the grindstone area was 20%, and then dried and solidified at 60 ° C. Although the obtained abrasive was flexible and durable, its polishing power (polishing performance) was inferior to that of Example 1.

Comparative Example 3
10 g of epoxy resin, 2 g of curing agent, and 10 g of kaolin as abrasive grains are mixed and applied to the surface of a substrate made of PVFM sponge having a pore size of 250 μm so that the grindstone area becomes 50%, and then at 60 ° C. Dry and solidify. The obtained abrasive had a low dot height, and the polishing power (polishing performance) was inferior to that of Example 1.

Comparative Example 4
10 g of epoxy resin, 2 g of curing agent, and 10 g of kaolin as abrasive grains were mixed and applied to the surface of a base material made of urethane closed-cell sponge so that the grindstone area was 50%, and then dried and solidified at 60 ° C. . There was no problem in the polishing power (polishing performance) of the obtained abrasive, but the sludge wiping performance on the cleaned polishing surface was inferior.

Comparative Example 5
10 g of epoxy resin, 2 g of curing agent, 4 g of artificial diamond particles as abrasive grains, and zeolite instead of the metal particles of Example 3 are mixed so that the surface of the substrate made of PVFM sponge has a grinding wheel area of 80%. After forming into a dot shape of about 1 mmφ, it was dried at 60 ° C. and further reacted at 80 ° C. When the obtained abrasive was cleaned and polished on a glass with scaly dirt adhered in a state where water was contained in the sponge portion, the dirt was satisfactorily removed even if the supply of water was small.
However, in order to verify the life-improving effect, after it attached to the electric tool (orbital sander), was traversing the glass surface at 1.25m 2 ^/ 15min, abrasive grain mass at the time of processing the 4m ² is abrasion loss did.

Comparative Example 6
10 g of epoxy resin, 2 g of curing agent, 12 g of alumina particles (# 2000) as abrasive grains, and 40 g of tin particles as metal particles are mixed so that the surface of the substrate made of PVFM sponge has a grinding wheel area of 100%. After coating and forming, it was dried at 60 ° C. and further reacted at 80 ° C. The obtained abrasive was not flexible, and problems such as cracking of the abrasive surface occurred when bent.

Comparative Example 7
10 g of epoxy resin, 2 g of curing agent, 12 g of alumina particles (# 2000) as abrasive grains, and 40 g of tin particles as metal particles are mixed so that the surface of the substrate made of PVFM sponge has a grinding wheel area of 20%. After coating and forming, it was dried at 60 ° C. and further reacted at 80 ° C. Although the obtained abrasive was flexible and durable, the polishing power (polishing performance) was inferior to that of Example 4.

Comparative Example 8
10 g of epoxy resin, 2 g of curing agent, 4 g of artificial diamond particles as abrasive grains, and 61 g of copper particles as metal particles are mixed, and the surface of the base material made of PVFM sponge with a pore size of 250 μm has a grinding wheel area of 80%. After coating and forming in such a manner, it was dried at 60 ° C. and further reacted at 80 ° C. The obtained abrasive had a low dot height, and the polishing power (polishing performance) was inferior to that of Example 3.

Comparative Example 9
10 g of epoxy resin, 2 g of curing agent, 4 g of artificial diamond particles as abrasive grains, and 61 g of copper particles as metal particles are mixed and applied to the surface of a base material made of urethane closed cell sponge so that the grindstone area is 80%. After forming, it was dried at 60 ° C. and further reacted at 80 ° C. Although the obtained abrasive has polishing power (polishing performance), it has poor adhesion to the sponge base material, and the dot-shaped abrasive grains lump easily and the sponge does not have water absorption. Therefore, the wiping performance of the sludge on the cleaning polished surface was inferior.

  In Table 1, the epoxy resin, the curing agent, the content of abrasive grains, the content of metal particles, the grindstone area, and the base material contained in the abrasive grain lump for Examples 1 to 5 and Comparative Examples 1 to 9 Table 2 lists the evaluation results for Examples 1 to 5 and Comparative Examples 1 to 9.

Table 1
┌────┬─────┬───┬───┬────┬────┬┬─────────┐
│ │Epoxy │Hardening agent │Abrasive grain│Metal particle │Whetstone area│ Base material │
│ │Resin (g) │ (g) │ (g) │ (g) │ (%) │ (g) │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Example 1│ 10 │ 2 │ 10 │ 0 │ 50 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Example 2│ 10 │ 2 │ 10 │ 0 │ 30 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Example 3│ 10 │ 2 │ 4 │ 61 │ 80 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Example 4│ 10 │ 2 │ 12 │ 40 │ 80 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 1│ 10 │ 2 │ 10 │ 0 │ 100 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 2│ 10 │ 2 │ 10 │ 0 │ 20 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 3│ 10 │ 2 │ 10 │ 0 │ 50 │PVFM sponge │
│ │ │ │ │ │ │ Pore diameter 250μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 4│ 10 │ 2 │ 10 │ 0 │ 50 │Urethane closed cell │
│ │ │ │ │ │ │ type sponge │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 5│ 10 │ 2 │ 4 │ 0 │ 80 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 6│ 10 │ 2 │ 12 │ 40 │ 100 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 7│ 10 │ 2 │ 12 │ 40 │ 20 │PVFM sponge │
│ │ │ │ │ │ │Pore diameter 100μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 8│ 10 │ 2 │ 4 │ 61 │ 80 │PVFM sponge │
│ │ │ │ │ │ │ Pore diameter 250μm │
├────┼─────┼───┼───┼────┼────┼┼─────────┤
│Comparative Example 9│ 10 │ 2 │ 4 │ 61 │ 80 │Urethane closed cell │
│ │ │ │ │ │ │ type sponge │
└────┴─────┴───┴───┴────┴────┴┴─────────┘
Table 2
┌────┬────────────────────────────────┐
│ │ Evaluation results │
├────┼────────────────────────────────┤
│Example 1│Good │
├────┼────────────────────────────────┤
│Example 2│Good │
├────┼────────────────────────────────┤
│Example 3│Good │
├────┼────────────────────────────────┤
│Example 4│Good │
├────┼────────────────────────────────┤
│Comparative Example 1│Partial cracks occurred in the abrasive grain lump. │
├────┼────────────────────────────────┤
│Comparative Example 2│Poor polishing power is small. │
├────┼────────────────────────────────┤
| Comparative Example 3 | It is difficult to form the abrasive grain lump in a dot shape and the polishing power is low. │
├────┼────────────────────────────────┤
│Comparative Example 4│It is difficult to clean sludge after polishing. │
├────┼────────────────────────────────┤
│Comparative Example 5│Poor polishing performance is poor. │
├────┼────────────────────────────────┤
| Comparative Example 6 | Cracks were generated in the polishing layer. │
├────┼────────────────────────────────┤
│Comparative Example 7│Poor polishing power. │
├────┼────────────────────────────────┤
| Comparative Example 8 | It is difficult to make the dot-shaped abrasive grains lump highly, and the polishing power is inferior. │
├────┼────────────────────────────────┤
│Comparative Example 9│Dot-like abrasive grains lump easily. Sludge cleanability is poor. │
└────┴────────────────────────────────┘

  In the polishing tool according to the present invention, the composition of the abrasive grain lump 2 can be changed according to the application. For example, in a polishing tool in which the abrasive grain lump 2 contains metal particles together with the abrasive grains 21, for use as a scaly descaler of mirrors or glass, the base material 1 has a thickness of about 10 mm. A formal abrasive (PVFM) sponge is adopted, and the abrasive lump 2 containing diamond particles (abrasive particles), copper particles (metal particles) and epoxy resin in a content ratio of 6:83:11 on the surface of the PVFM sponge. What is formed can be used. In this case, for example, 75 × 45 mm is appropriate for the vertical and horizontal sizes of the polishing tool. In addition, for the purpose of removing rust and water around the stainless steel sink, a PVFM sponge having a thickness of about 10 mm is adopted as the base material 1, and alumina particles (abrasive particles) and tin particles (on the surface of the PVFM sponge) It is possible to use those in which the abrasive grain lump 2 containing the metal particles) and the epoxy resin in a content ratio of 20:66:14 is formed. In this case, for example, 75 × 45 mm is appropriate for the vertical and horizontal sizes of the polishing tool. Furthermore, for the purpose of removing water and dirt around the water faucet, artificial leather having a thickness of about 1.4 mm is adopted as the base material 1, and alumina particles (abrasive particles) and tin particles are formed on the surface of the artificial leather. What formed the abrasive grain lump 2 which contains (metal particle) and an epoxy resin by the content ratio of 20:66:14 can be used. The vertical and horizontal sizes of the polishing tool in this case are appropriately adopted as an elongated strip shape of about 120 × 40 mm, for example. An elongated belt-like polishing tool using artificial leather as the base material 1 is a work of reciprocating by holding both ends of the polishing tool by hand while the intermediate portion of the polishing tool is wrapped around the portion to be polished. Can be easily performed.

DESCRIPTION OF SYMBOLS 1 Base material 2 Abrasive grain lump 12 Water absorption surface 21 Abrasive grain 22 Binder

Claims (14)

A substrate having water absorption, and a large number of abrasive grains lump fixed to the substrate and scattered on the surface of the substrate at intervals,
The base material is a continuous pore type polyvinyl formal resin sponge having a pore diameter of 30 to 200 μm and a porosity of 80 to 95%,
Becomes a collection of a large number of abrasive grains each of said abrasive agglomerates are bonded by a binder, the abrasive agglomerates is bulged from the surface of the substrate is formed in the front view dot shape, the polishing As the binder of the abrasive grain mass enters the pores of the sponge, the bonding force between the abrasive grain mass and the surface of the base material is enhanced, and the back surface of the base material is entirely composed of the base material. A polishing tool characterized by being formed as a water absorbing surface based on water absorption. The polishing tool according to claim 1, wherein the base material is a polyvinyl formal resin having a size that can be held by a hand, and the thickness of the base material is 1 to 30 mm . The polishing tool according to claim 1 or 2 , wherein the polishing abrasive grain lump has a polygonal shape when viewed from the front. The abrasive grains are inorganic particles or organic particles selected from diamond, cubic boron nitride, alumina, silicon carbide, calcium carbonate, silicate mineral, cerium oxide, zirconium oxide, silica, seed powder, melamine resin. At least one of them,
Claims wherein the binder comprises at least one of a thermoplastic resin selected from an epoxy resin, a melamine resin, a phenol resin, and a silicone resin, a polystyrene resin, an ethylene vinyl acetate resin, and a fluororesin. The polishing tool according to any one of claims 1 to 3 . The polishing tool according to claim 4 , wherein the abrasive grains are particles of kaolin, which is a kind of silicate mineral having a Mohs hardness of 2 to 2.5. The polishing tool according to claim 5 , wherein the abrasive grain lump includes 30 to 70 wt% of abrasive grains. The number of the polishing abrasive agglomerates polishing tool as set forth in any one of claims 1 to 6 which is 4 to 12 / cm ^2. The polishing tool according to any one of claims 1 to 7 , wherein the entire surface area of a large number of abrasive grains lump scattered on the surface of the substrate is 30 to 80% of the surface area of the substrate. The polishing tool according to any one of claims 1 to 5 , wherein the abrasive grain lump includes metal particles together with the abrasive grains. The polishing tool according to claim 9 , wherein the metal particles comprise one or more selected from copper particles and tin particles. The polishing tool according to claim 9 or 10 , wherein the entire surface area of a large number of abrasive grains lump scattered on the surface of the substrate is 80 to 90% of the surface area of the substrate. The polishing tool according to any one of claims 9 to 11 , wherein a maximum size of each of the abrasive abrasive lump is 1 to 1.5 mm. The number of the said abrasive grain lump is 50 piece / cm < ² > or more, The polishing tool of any one of Claim 9 thru | or 12 . The polishing tool according to any one of claims 9 to 13 , wherein the abrasive grain lump includes 5 to 50 wt% of abrasive grains.

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