JP6010389B2 - Method for producing conductive polymer, method for producing conductive composition, and method for producing film - Google Patents
Method for producing conductive polymer, method for producing conductive composition, and method for producing film Download PDFInfo
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- JP6010389B2 JP6010389B2 JP2012184538A JP2012184538A JP6010389B2 JP 6010389 B2 JP6010389 B2 JP 6010389B2 JP 2012184538 A JP2012184538 A JP 2012184538A JP 2012184538 A JP2012184538 A JP 2012184538A JP 6010389 B2 JP6010389 B2 JP 6010389B2
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- acid
- conductive polymer
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- producing
- conductive
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- 238000004519 manufacturing process Methods 0.000 title claims description 41
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- 239000004094 surface-active agent Substances 0.000 claims description 43
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- 238000000576 coating method Methods 0.000 claims description 32
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- 238000006116 polymerization reaction Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 11
- 125000002947 alkylene group Chemical group 0.000 claims description 10
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
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- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 4
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 description 4
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
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- 229910052757 nitrogen Inorganic materials 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
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- PTMBWNZJOQBTBK-UHFFFAOYSA-N pyridin-4-ylmethanol Chemical compound OCC1=CC=NC=C1 PTMBWNZJOQBTBK-UHFFFAOYSA-N 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
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- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
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- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
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- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
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- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical class OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- ZXYAAVBXHKCJJB-UHFFFAOYSA-N uracil-5-carboxylic acid Chemical compound OC(=O)C1=CNC(=O)NC1=O ZXYAAVBXHKCJJB-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
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- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンとの複合体である導電性高分子およびそれを含む導電性組成物、ならびに導電性高分子若しくは導電性組成物を用いてなる塗膜を有するフィルムに関する。 The present invention relates to a conductive polymer that is a complex of poly (3,4-dialkoxythiophene) and a polyanion, a conductive composition containing the same, and a coating using the conductive polymer or the conductive composition. The present invention relates to a film having a membrane.
導電性高分子は、固体電解コンデンサの固体電解質; 帯電防止剤用の導電体; 液晶ディスプレイ、エレクトロルミネセンスディスプレイ、プラズマディスプレイ、エレクトロクロミックディスプレイ、太陽電池、タッチパネルなどに形成される透明電極; ならびに電磁波シールド材などの基材のコーティングに広く用いられている。通常、透明電極として最も汎用なものは、インジウム−スズ系の複合酸化物(ITOという)の蒸着膜であるが、成膜に高温を必要とすることから、成膜コストが高いという問題がある。一方、有機材料から成る透明電極として、低温かつ低コストで成膜可能な導電性高分子を用いた膜が提案されている。この用途における導電性高分子としては、例えば、チオフェンまたはその誘導体などの重合性モノマーを化学酸化重合または電解酸化重合することによって高分子化したものが知られており、特に工業的には、化学酸化重合が行われている。 The conductive polymer is a solid electrolyte of a solid electrolytic capacitor; a conductor for an antistatic agent; a transparent electrode formed on a liquid crystal display, an electroluminescent display, a plasma display, an electrochromic display, a solar cell, a touch panel, etc .; and an electromagnetic wave Widely used for coating of base materials such as shielding materials. Usually, the most versatile transparent electrode is an indium-tin composite oxide (ITO) vapor-deposited film, but it requires a high temperature for film formation, which has a problem of high film formation cost. . On the other hand, as a transparent electrode made of an organic material, a film using a conductive polymer that can be formed at low temperature and low cost has been proposed. As a conductive polymer in this application, for example, a polymer obtained by polymerizing a polymerizable monomer such as thiophene or a derivative thereof by chemical oxidative polymerization or electrolytic oxidative polymerization is known. Oxidative polymerization is performed.
上記のような導電性高分子およびその製造方法としては、例えば、水分散性が良好なポリ(3,4−ジアルコキシチオフェン)とポリアニオンとの複合体の製造方法が知られている(例えば、特許文献1を参照)。また、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンとの複合体の水分散液に、ジヒドロキシ基、ポリヒドロキシ基、アミド基、およびラクタム基からなる群より選択される官能基を有する化合物を添加することによって、得られたコーティング組成物を基材上に付与して成る薄膜の導電性を向上させることができるとの報告もある(例えば、特許文献2を参照)。さらに、ε≧15の誘電率を有する非プロトン性化合物を含むコーティング用組成物を基材に付与することにより、100℃未満の温度で乾燥させて成る薄膜の導電性を向上させることができるとの報告もある(例えば、特許文献3を参照)。 As the conductive polymer as described above and a method for producing the same, for example, a method for producing a complex of poly (3,4-dialkoxythiophene) having good water dispersibility and a polyanion is known (for example, (See Patent Document 1). Further, a compound having a functional group selected from the group consisting of a dihydroxy group, a polyhydroxy group, an amide group, and a lactam group is added to an aqueous dispersion of a complex of poly (3,4-dialkoxythiophene) and a polyanion. There is also a report that the conductivity of a thin film formed by adding the obtained coating composition on a substrate can be improved by adding (see, for example, Patent Document 2). Furthermore, when the coating composition containing an aprotic compound having a dielectric constant of ε ≧ 15 is applied to the substrate, the conductivity of the thin film formed by drying at a temperature of less than 100 ° C. can be improved. There is also a report (for example, refer patent document 3).
また、3,4−ジアルコキシチオフェンをポリアニオンの存在下で重合させる際に、ペルオキソ二硫酸を酸化剤として用いること、あるいは重合時に酸を添加してpHを低下させることによって、透明性および導電性に優れた薄膜を形成可能な複合体含有水分散液を得ることができるとの報告もある(例えば、特許文献4を参照)。さらに、透明性と導電性に優れた薄膜を形成するため、薄膜形成用のポリマー水分散体の製造に際して、π共役系導電性ポリマーに塩基性有機化合物を添加する方法(例えば、特許文献5を参照)、耐圧容器内に導電性ポリマーと水と導電性ポリマーに対する相溶性を有する有機溶剤と二酸化炭素とを収容し、二酸化炭素が超臨界状態となるように耐圧容器内を加熱加圧する方法(例えば、特許文献6を参照)、あるいは3,4−エチレンジオキシチオフェン(EDOT)を高分子カルボン酸の存在下で酸化重合する方法(例えば、特許文献7を参照)を用いることが知られている。 In addition, when polymerizing 3,4-dialkoxythiophene in the presence of polyanion, transparency and conductivity can be achieved by using peroxodisulfuric acid as an oxidizing agent or by adding an acid during polymerization to lower the pH. There is also a report that a complex-containing aqueous dispersion capable of forming an excellent thin film can be obtained (see, for example, Patent Document 4). Further, in order to form a thin film excellent in transparency and conductivity, a method of adding a basic organic compound to a π-conjugated conductive polymer in the production of a polymer aqueous dispersion for forming a thin film (for example, Patent Document 5) (See), a method of containing a conductive polymer, water, an organic solvent compatible with the conductive polymer, and carbon dioxide in the pressure vessel, and heating and pressurizing the pressure vessel so that the carbon dioxide is in a supercritical state ( For example, see Patent Document 6), or a method of oxidative polymerization of 3,4-ethylenedioxythiophene (EDOT) in the presence of a high molecular carboxylic acid (for example, see Patent Document 7). Yes.
さらに、特定の条件を満たす保護層をノルボルネン系樹脂フィルム上に形成する工程(A)、ポリエチレンジオキシチオフェンを含有する導電性塗料を上記保護層上に塗工し、硬化させて透明導電層を形成する工程(C)を含む透明導電性積層フィルムの製造方法において、導電性塗料中にフッ素系界面活性剤および/またはアセチレン基を分子中に有するグリコール系界面活性剤をさらに含ませ、導電性塗料の表面張力を下げ、もって抵抗値の面内均一性を高めることができることが報告されている(例えば、特許文献8を参照)。また、アセチレングリコール系界面活性剤を、導電性ポリマーの製造後に添加する方法も知られている(例えば、特許文献9および特許文献10を参照)。さらに、ベンゼンスルホン酸などのドーパントを含む水溶液に、3,4−エチレンジオキシチオフェンなどの導電性高分子となり得るモノマーを投入し、そこにアセチレングリコール誘導体などの非イオン界面活性剤を用いて乳化させた乳化液中で、酸化剤を用いて化学酸化重合し、導電性高分子を合成する方法も知られている(例えば、特許文献11を参照)。また、ポリアニオンの量がエチレンジオキシチオフェンの2倍以下になると、導電性高分子の導電性が低下することが報告されている(例えば、非特許文献1を参照)。 Furthermore, a step (A) of forming a protective layer satisfying specific conditions on the norbornene-based resin film, a conductive paint containing polyethylenedioxythiophene is applied on the protective layer and cured to form a transparent conductive layer In the method for producing a transparent conductive laminated film including the step (C) of forming, the conductive paint further includes a glycol surfactant and / or a glycol surfactant having an acetylene group in the molecule. It has been reported that the surface tension of the paint can be lowered, thereby improving the in-plane uniformity of the resistance value (see, for example, Patent Document 8). Also known is a method of adding an acetylene glycol surfactant after the production of a conductive polymer (see, for example, Patent Document 9 and Patent Document 10). Furthermore, a monomer that can be a conductive polymer such as 3,4-ethylenedioxythiophene is added to an aqueous solution containing a dopant such as benzenesulfonic acid, and emulsified using a nonionic surfactant such as an acetylene glycol derivative. A method is also known in which a conductive polymer is synthesized by chemical oxidative polymerization using an oxidizing agent in an emulsified liquid (see, for example, Patent Document 11). Further, it has been reported that when the amount of the polyanion is twice or less than that of ethylenedioxythiophene, the conductivity of the conductive polymer is lowered (for example, see Non-Patent Document 1).
しかし、上記の従来から公知の技術には、次のような問題がある。特許文献1記載の技術では、帯電防止機能については十分であるが、透明性および導電性を高めるには不十分である。特許文献2〜7記載の技術では、薄膜の導電性をある程度向上させることができるものの、市場の要求するレベルの導電性を達成することはできない。 However, the above known techniques have the following problems. The technique described in Patent Document 1 is sufficient for the antistatic function, but is insufficient for enhancing transparency and conductivity. With the techniques described in Patent Documents 2 to 7, although the conductivity of the thin film can be improved to some extent, the level of conductivity required by the market cannot be achieved.
特許文献8〜10に記載される技術のように、導電性塗料中に界面活性剤を後添加すると、添加する界面活性剤の種類や量によっては、薄膜の導電性が低下し、十分な性能が得られなくなる。また、特許文献9に記載される技術のように、モノマーを乳化させるのに十分な量の界面活性剤が存在した場合、薄膜の導電性の低下が起き、これもまた十分な性能が得られなくなる。なお、非特許文献1記載のポリアニオンの添加量については、従来の製造技術に対するものであり、この添加量の制約は必ずしも正しいものではない。 As in the techniques described in Patent Documents 8 to 10, when a surfactant is added afterwards in the conductive paint, depending on the type and amount of the surfactant to be added, the conductivity of the thin film is lowered, and sufficient performance is obtained. Cannot be obtained. Further, as in the technique described in Patent Document 9, when a sufficient amount of surfactant is present to emulsify the monomer, the conductivity of the thin film is lowered, and this also provides sufficient performance. Disappear. In addition, about the addition amount of the polyanion of a nonpatent literature 1, it is with respect to the conventional manufacturing technique, and the restriction | limiting of this addition amount is not necessarily correct.
本発明は、上記問題を解決するためになされたものであって、従来の導電性高分子の性能を維持しながら、形成された薄膜の導電性を大幅に向上させることを目的とする。 The present invention has been made to solve the above-described problems, and an object thereof is to greatly improve the conductivity of a formed thin film while maintaining the performance of a conventional conductive polymer.
本発明者らは、上記目的を達成するために鋭意検討を行ってきた結果、3,4−ジアルコキシチオフェンを、ポリアニオンと特定のアセチレングリコール系界面活性剤の存在下、水系溶媒中にて化学的酸化重合させることにより、薄膜の形態としたときの導電性を大幅に向上させることができることを見出し、本発明の完成に至った。本発明では、ポリアニオンの量が3,4−ジアルコキシチオフェンの量の2倍以下となっても、実用に十分耐えられるほどの高導電性を発揮できる。本発明における具体的な解決手段は、以下の通りである。 As a result of intensive studies to achieve the above object, the inventors of the present invention chemically synthesized 3,4-dialkoxythiophene in an aqueous solvent in the presence of a polyanion and a specific acetylene glycol surfactant. It has been found that by conducting selective oxidative polymerization, the conductivity of the thin film can be greatly improved, and the present invention has been completed. In this invention, even if the quantity of polyanion becomes 2 times or less of the quantity of 3, 4- dialkoxy thiophene, the high electroconductivity which can endure practically can be exhibited. The specific solution in the present invention is as follows.
上記目的を達成するための本発明の一形態は、以下の式(1)で表される3,4−ジアルコキシチオフェン
ポリアニオン;および、
以下の式(2)および式(3)
で表されるアセチレングリコール系界面活性剤のうち少なくとも1種の存在下、水系溶媒中で化学的酸化重合させてなる導電性高分子であって、アセチレングリコール系界面活性剤を3,4−ジアルコキシチオフェン1モルに対して0.001〜0.5モルとした導電性高分子である。
One form of the present invention for achieving the above object is a 3,4-dialkoxythiophene represented by the following formula (1):
A polyanion; and
The following formulas (2) and (3)
A conductive polymer obtained by chemical oxidative polymerization in an aqueous solvent in the presence of at least one of the acetylene glycol surfactants represented by the formula: The conductive polymer is 0.001 to 0.5 mol per 1 mol of alkoxythiophene.
本発明の別の形態は、さらに、ポリアニオンを3,4−ジアルコキシチオフェン100質量部に対して10〜300質量部用いてなる導電性高分子である。 Another embodiment of the present invention is a conductive polymer obtained by further using 10 to 300 parts by mass of a polyanion with respect to 100 parts by mass of 3,4-dialkoxythiophene.
本発明の別の形態は、また、ポリアニオンをポリスチレンスルホン酸とする導電性高分子である。 Another embodiment of the present invention is a conductive polymer in which the polyanion is polystyrene sulfonic acid.
本発明の一形態は、上述のいずれかの導電性高分子を含有する導電性組成物である。 One embodiment of the present invention is a conductive composition containing any of the above-described conductive polymers.
本発明の一形態は、上述のいずれかの導電性高分子または導電性組成物を導電体として用いてなる塗膜を有するフィルムである。 One embodiment of the present invention is a film having a coating film using any of the above-described conductive polymers or conductive compositions as a conductor.
本発明によれば、薄膜の導電性を大幅に向上させることができる。 According to the present invention, the conductivity of the thin film can be greatly improved.
以下、本発明に係る導電性高分子、導電性組成物および塗膜を有するフィルムの好適な実施の形態について説明する。 Hereinafter, preferred embodiments of a film having a conductive polymer, a conductive composition, and a coating film according to the present invention will be described.
1.導電性高分子およびその製造方法
この実施の形態に係る導電性高分子は、以下の式(1)で表される3,4−ジアルコキシチオフェン
ポリアニオン;および、
以下の式(2)および式(3)
A polyanion; and
The following formulas (2) and (3)
この実施の形態に係る導電性高分子を製造する上で必須となる材料は以下の(1)〜(5)である。 Materials essential for manufacturing the conductive polymer according to this embodiment are the following (1) to (5).
(1)3,4−ジアルコキシチオフェン
上記式(1)で示される3,4−ジアルコキシチオフェンにおいて、R1およびR2のC1−4のアルキル基としては、好ましくは、メチル基、エチル基、n−プロピル基などを挙げることができる。R1およびR2が一緒になったC1−4のアルキレン基としては、好ましくは、1,2−アルキレン基、1,3−アルキレン基などを挙げることができ、具体的には、メチレン基、1,2−エチレン基、1,3−プロピレン基などを挙げることができ、その中でも特に、1,2−エチレン基が好ましい。また、C1−4のアルキレン基は、置換されていても良く、その場合の好ましい置換基としては、C1−12のアルキル基あるいはフェニル基を挙げることができる。置換されたC1−4のアルキレン基としては、好ましくは、1,2−シクロヘキシレン基、2,3−ブチレン基を挙げることができる。このようなアルキレン基の代表例としてR1およびR2のいずれもC1−12のアルキル基で置換された1,2−アルキレン基は、エテン、プロペン、ヘキセン、オクテン、デセン、ドデセン、スチレンなどのα−オレフィン類を臭素化して得られる1,2−ジブロモアルカン類から誘導される。
(1) 3,4-dialkoxythiophene In the 3,4-dialkoxythiophene represented by the above formula (1), the C 1-4 alkyl group of R 1 and R 2 is preferably a methyl group, ethyl Group, n-propyl group and the like. Preferred examples of the C 1-4 alkylene group in which R 1 and R 2 are combined include a 1,2-alkylene group and a 1,3-alkylene group. Specifically, a methylene group 1,2-ethylene group, 1,3-propylene group, etc., among which 1,2-ethylene group is particularly preferable. The C 1-4 alkylene group may be substituted, and preferred substituents in that case include a C 1-12 alkyl group or a phenyl group. Preferred examples of the substituted C 1-4 alkylene group include a 1,2-cyclohexylene group and a 2,3-butylene group. As representative examples of such alkylene groups, 1,2-alkylene groups in which both R 1 and R 2 are substituted with a C 1-12 alkyl group include ethene, propene, hexene, octene, decene, dodecene, styrene, and the like. Derived from 1,2-dibromoalkanes obtained by bromination of α-olefins.
(2)ポリアニオン
本発明の実施の形態で使用されるポリアニオンを形成し得る化合物(以下、ポリアニオンという場合がある)としては、ポリアクリル酸、ポリメタクリル酸、ポリマレイン酸等のポリカルボン酸類; ポリスチレンスルホン酸、ポリビニルスルホン酸等のポリスルホン酸類; 等を挙げることができる。これらの中で、ポリスチレンスルホン酸が特に好ましい。ポリアニオン化合物の分子量は、特に限定されないが、通常、重量平均分子量(Mw)が1,000〜2,000,000の範囲であり、さらに好ましくは2,000〜1,000,000の範囲であり、より好ましくは10,000〜500,000の範囲である。特に、上記分子量の範囲のポリスチレンスルホン酸を用いるのが好ましい。ポリスチレンスルホン酸のスルホン化率は、特に限定されるものではないが、好ましくは、80〜100%、さらに好ましくは85〜95%の範囲である。ここで、「スルホン化率」とは、ポリスチレンスルホン酸において、分子中のスルホン酸基を有するスチレン単位(A)およびスルホン酸基を有していないスチレン単位(B)の合計(A+B)に対する(A)の割合(%)を指していう。
(2) Polyanion Examples of compounds capable of forming a polyanion used in the embodiment of the present invention (hereinafter sometimes referred to as polyanions) include polycarboxylic acids such as polyacrylic acid, polymethacrylic acid, and polymaleic acid; And polysulfonic acids such as acid and polyvinyl sulfonic acid; Of these, polystyrene sulfonic acid is particularly preferred. The molecular weight of the polyanion compound is not particularly limited, but usually the weight average molecular weight (Mw) is in the range of 1,000 to 2,000,000, more preferably in the range of 2,000 to 1,000,000. More preferably, it is in the range of 10,000 to 500,000. In particular, it is preferable to use polystyrene sulfonic acid having the above molecular weight range. The sulfonation rate of polystyrene sulfonic acid is not particularly limited, but is preferably in the range of 80 to 100%, more preferably 85 to 95%. Here, the “sulfonation rate” refers to the total (A + B) of styrene units (A) having a sulfonic acid group and styrene units (B) having no sulfonic acid group in the polystyrene sulfonic acid. It refers to the ratio (%) of A).
ポリスチレンスルホン酸を得る方法としては、ポリスチレンをスルホン化する方法と、スチレンスルホン酸ナトリウムを高分子化する方法が挙げられる。後者のスチレンスルホン酸ナトリウムを高分子化する方法は、前者のポリスチレンをスルホン化する方法に比べて、純度の高いポリスチレンスルホン酸が得られやすい。この方法では、適量のイオン交換水にスチレンスルホン酸ナトリウムを溶解し、水溶性開始剤を用いて重合し、高分子化する。水溶性開始剤としては、過硫酸塩、過酸化水素、遷移金属のような酸化剤を好適に例示できる。また、重合の温度としては、特に限定されないが、好ましくは10〜90℃である。得られた反応液を陽イオン交換樹脂と陰イオン交換樹脂で処理して、ポリスチレンスルホン酸を得ることができる。かかる高分子化の際に、上記のような酸化剤を共存させることにより、得られるポリスチレンスルホン酸ナトリウムの分子量を調整することができる。 Examples of the method for obtaining polystyrene sulfonic acid include a method for sulfonating polystyrene and a method for polymerizing sodium styrene sulfonate. The latter method of polymerizing sodium styrenesulfonate makes it easier to obtain polystyrene sulfonic acid having a higher purity than the former method of sulfonating polystyrene. In this method, sodium styrenesulfonate is dissolved in an appropriate amount of ion-exchanged water, polymerized using a water-soluble initiator, and polymerized. Preferable examples of the water-soluble initiator include oxidants such as persulfate, hydrogen peroxide, and transition metals. The polymerization temperature is not particularly limited, but is preferably 10 to 90 ° C. The resulting reaction solution can be treated with a cation exchange resin and an anion exchange resin to obtain polystyrene sulfonic acid. The molecular weight of the sodium polystyrene sulfonate obtained can be adjusted by the coexistence of the oxidizing agent as described above during the polymerization.
ポリアニオンの使用量は、3,4−ジアルコキシチオフェン100質量部に対して、好ましくは10〜300質量部であり、さらに好ましくは50〜250質量部であり、より好ましくは100〜200質量部である。ポリアニオンを3.4−ジアルコキシチオフェン100質量部に対して10質量部以上使用することにより、ポリアニオンの添加による導電性向上効果を十分に発現でき、ポリアニオンを3.4−ジアルコキシチオフェン100質量部に対して300質量部以下使用することにより、ポリアニオンを過剰に添加しないことによる表面抵抗値の抑制が働き、導電性能の維持を期待できる。特に、一般的に導電率が低下すると言われているポリアニオンの使用量、すなわちポリアニオンが3,4−ジアルコキシチオフェン100質量部に対して2倍に相当する200質量部以下の条件でも、十分な性能を発揮できる。また、ポリアニオンの比率を低くすることにより、ポリアニオン由来の吸湿性を低減でき、ポリアニオンによる金属への腐食性を緩和できる。 The amount of polyanion used is preferably 10 to 300 parts by weight, more preferably 50 to 250 parts by weight, and more preferably 100 to 200 parts by weight with respect to 100 parts by weight of 3,4-dialkoxythiophene. is there. By using 10 parts by mass or more of polyanion with respect to 100 parts by mass of 3.4-dialkoxythiophene, the effect of improving the conductivity due to the addition of the polyanion can be sufficiently expressed. When 300 parts by mass or less is used, the surface resistance value is suppressed by not adding an excessive amount of polyanion, and the maintenance of the conductive performance can be expected. In particular, the amount of polyanion that is generally said to decrease in electrical conductivity, that is, the condition that the polyanion is 200 parts by mass or less, which corresponds to twice the amount of 100 parts by mass of 3,4-dialkoxythiophene, is sufficient. Performance can be demonstrated. Moreover, by reducing the ratio of the polyanion, the hygroscopicity derived from the polyanion can be reduced, and the corrosiveness to the metal by the polyanion can be reduced.
(3)重合開始剤
本発明の実施の形態で使用される重合開始剤(以下、単に、「開始剤」という)としては、過硫酸塩、過酸化水素、遷移金属といった酸化剤を挙げることができる。開始剤としては、より好適には、第一鉄塩または第二鉄塩をそれぞれ単体、あるいは両方を組み合わせることができる。その場合、第一鉄塩としては、塩化第一鉄、硫酸第一鉄、硝酸第一鉄、トルエンスルホン酸第一鉄、ドデシルベンゼンスルホン酸第一鉄、ナフタレンスルホン酸第一鉄を好適に例示できる。また、第二鉄塩としては、塩化第二鉄、硫酸第二鉄、硝酸第二鉄、トルエンスルホン酸第二鉄、ドデシルベンゼンスルホン酸第二鉄、ナフタレンスルホン酸第二鉄を好適に例示できる。さらに、重合開始剤として、上記第一鉄塩、上記第二鉄塩と共に、過硫酸塩を混合して用いるのが、さらに好ましい。過硫酸塩としては、例えば、過硫酸アンモニウム、過硫酸ナトリウム、過硫酸カリウム、過硫酸カルシウム、過硫酸バリウムなどを好適に用いることができる。それらの中でも、過硫酸アンモニウムと硫酸第二鉄の組み合わせが好ましい。また、過硫酸塩と第二鉄塩との比率としては、モル比にて、1〜5000:1が好ましく、5〜100:1がさらに好ましい。第二鉄塩の使用量は、3,4−ジアルコキシチオフェン100質量部に対して好ましくは1〜400質量部であり、さらに好ましくは5〜200質量部であり、より好ましくは10〜100質量部である。第二鉄塩を3,4−ジアルコキシチオフェン100質量部に対して1質量部以上用いると導電性を向上でき、第二鉄塩を3,4−ジアルコキシチオフェン100質量部に対して400質量部以下用いると反応性を高めることができる。複数の開始剤を用いる場合、当該複数の開始剤を予め混合して用いても良いが、予めの混合は必須ではなく、導電性高分子の合成時に混合状態なっていれば良い。
(3) Polymerization initiator Examples of the polymerization initiator (hereinafter simply referred to as “initiator”) used in the embodiment of the present invention include oxidizing agents such as persulfates, hydrogen peroxide, and transition metals. it can. As the initiator, more preferably, the ferrous salt or the ferric salt can be used alone or in combination. In that case, ferrous chloride, ferrous sulfate, ferrous nitrate, ferrous toluenesulfonate, ferrous dodecylbenzenesulfonate, ferrous naphthalenesulfonate are preferred examples of ferrous salts. it can. Moreover, as a ferric salt, ferric chloride, ferric sulfate, ferric nitrate, ferric toluenesulfonate, ferric dodecylbenzenesulfonate, ferric naphthalenesulfonate can be illustrated suitably. . Further, it is more preferable to use a persulfate as a polymerization initiator in combination with the ferrous salt and the ferric salt. As the persulfate, for example, ammonium persulfate, sodium persulfate, potassium persulfate, calcium persulfate, barium persulfate and the like can be preferably used. Among them, a combination of ammonium persulfate and ferric sulfate is preferable. Moreover, as a ratio of a persulfate and a ferric salt, 1-5000: 1 are preferable at molar ratio, and 5-100: 1 are further more preferable. The amount of ferric salt used is preferably 1 to 400 parts by weight, more preferably 5 to 200 parts by weight, and more preferably 10 to 100 parts by weight with respect to 100 parts by weight of 3,4-dialkoxythiophene. Part. When the ferric salt is used in an amount of 1 part by mass or more with respect to 100 parts by mass of 3,4-dialkoxythiophene, the conductivity can be improved, and the ferric salt is 400 parts by mass with respect to 100 parts by mass of 3,4-dialkoxythiophene. When the amount is less than or equal to the amount, the reactivity can be increased. In the case of using a plurality of initiators, the plurality of initiators may be mixed and used in advance, but the mixing in advance is not essential, as long as it is in a mixed state when the conductive polymer is synthesized.
3,4−ジアルコキシチオフェンをポリアニオンおよび特定のアセチレングリコール系界面活性剤の存在下にて重合する際、重合温度は、5〜90℃、特に10〜50℃が好ましい。重合時間としては1〜48時間、特に1〜24時間が好ましい。 When polymerizing 3,4-dialkoxythiophene in the presence of a polyanion and a specific acetylene glycol surfactant, the polymerization temperature is preferably from 5 to 90 ° C, particularly preferably from 10 to 50 ° C. The polymerization time is preferably 1 to 48 hours, particularly 1 to 24 hours.
(4)アセチレングリコール系界面活性剤
本発明の実施の形態では、アセチレングリコール系界面活性剤として、下記の式(2)および式(3)で表されるものの内の少なくともいずれか一種を用いる。
(式中、R3、R4、R5、R6、R7、R8はそれぞれ炭素数1〜5のアルキル基を示す。) (Wherein, shows the R 3, R 4, R 5 , R 6, R 7, R 8 are each an alkyl group having 1 to 5 carbon atoms.)
上記のアセチレングリコール系界面活性剤としては、2,4,7,9−テトラメチル−5−デシン−4,7−ジオール、3,6−ジメチル−4−オクチン−3,6−ジオール、2,5,8,11−テトラメチル−6−ドデシン−5,8−ジオール、3,5−ジメチル−1−ヘキシン−3−オールなどを好適に例示できる。上記アセチレングリコール系界面活性剤の使用量は、好ましくは3,4−ジアルコキシチオフェン1モルに対して0.001〜0.5モルであり、より好ましくは0.005〜0.1モル、さらに好ましくは0.01〜0.06モルである。3,4−ジアルコキシチオフェン1モルに対してアセチレングリコール系界面活性剤を0.001〜0.5モルの範囲で使用することにより、塗膜にしたときの導電性を高く維持できる。 Examples of the acetylene glycol surfactant include 2,4,7,9-tetramethyl-5-decyne-4,7-diol, 3,6-dimethyl-4-octyne-3,6-diol, 2, Preferred examples include 5,8,11-tetramethyl-6-dodecin-5,8-diol and 3,5-dimethyl-1-hexyn-3-ol. The amount of the acetylene glycol surfactant used is preferably 0.001 to 0.5 mol, more preferably 0.005 to 0.1 mol, and more preferably 1 mol of 3,4-dialkoxythiophene. Preferably it is 0.01-0.06 mol. By using the acetylene glycol surfactant in the range of 0.001 to 0.5 mol with respect to 1 mol of 3,4-dialkoxythiophene, the conductivity when formed into a coating film can be maintained high.
(5)水系溶媒
水系溶媒は、好適には、水、あるいは水と水混和性有機溶媒との混合物であり、より好適には水である。水混和性有機溶媒を水に混合する場合、水混和性有機溶媒を、水と水混和性有機溶媒との総量に対して、10質量%以下とするのが好ましい。水混和性有機溶媒として、例えば、メタノール、エタノール、プロパノール、イソプロパノール等のアルコール類; アセトン、メチルエチルケトン等のケトン類; N−メチル−2−ピロリドン、N−メチルアセトアミド、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、ヘキサメチレンホスホルトリアミド、N−ビニルピロリドン、N−ビニルホルムアミド、N−ビニルアセトアミド等のアミド化合物; クレゾール、フェノール、キシレノール等のフェノール類; エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール、ジプロピレングリコール、1,3−ブチレングリコール、1,4−ブチレングリコール、グリセリン、ジグリセリン、D−グルコース、D−グルシトール、イソプレングリコール、ブタンジオール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,9−ノナンジオール、ネオペンチルグリコール等の多価脂肪族アルコール類; エチレンカーボネート、プロピレンカーボネート等のカーボネート化合物; ジオキサン、ジエチルエーテル等のエーテル化合物; ジアルキルエーテル、プロピレングリコールジアルキルエーテル、ポリエチレングリコールジアルキルエーテル、ポリプロピレングリコールジアルキルエーテル等の鎖状エーテル類; 3−メチル−2−オキサゾリジノン等の複素環化合物; アセトニトリル、グルタロジニトリル、メトキシアセトニトリル、プロピオニトリル、ベンゾニトリル等のニトリル化合物; ジメチルスルホキシドに代表されるスルホキシド類; 等を好適に用いることができる。これらの水混和性有機溶媒は、単独で用いてもよいし、2種類以上の混合物で用いてもよい。上記水混和性有機溶媒の中でも、作業環境をより損ないにくく、しかも沸点が水より低く、容易に塗膜を形成できることから、エタノール、イソプロパノールが好ましい。
(5) Aqueous solvent The aqueous solvent is preferably water or a mixture of water and a water-miscible organic solvent, and more preferably water. When mixing a water-miscible organic solvent with water, it is preferable that a water-miscible organic solvent shall be 10 mass% or less with respect to the total amount of water and a water-miscible organic solvent. Examples of water-miscible organic solvents include alcohols such as methanol, ethanol, propanol and isopropanol; ketones such as acetone and methyl ethyl ketone; N-methyl-2-pyrrolidone, N-methylacetamide, N, N-dimethylformamide, N , N-dimethylacetamide, hexamethylene phosphortriamide, N-vinylpyrrolidone, N-vinylformamide, amide compounds such as N-vinylacetamide; phenols such as cresol, phenol, xylenol; ethylene glycol, diethylene glycol, triethylene glycol, Propylene glycol, dipropylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, glycerin, diglycerin, D-glucose, D-glucitol, iso Polyhydric aliphatic alcohols such as prene glycol, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol and neopentyl glycol; carbonate compounds such as ethylene carbonate and propylene carbonate; Ether compounds such as diethyl ether; chain ethers such as dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol dialkyl ether, and polypropylene glycol dialkyl ether; heterocyclic compounds such as 3-methyl-2-oxazolidinone; acetonitrile, glutarodinitrile Nitrile compounds such as methoxyacetonitrile, propionitrile, benzonitrile; sulfoxides represented by dimethyl sulfoxide; Can be. These water-miscible organic solvents may be used alone or in a mixture of two or more. Among the above-mentioned water-miscible organic solvents, ethanol and isopropanol are preferred because they are less likely to damage the working environment and have a boiling point lower than that of water and can easily form a coating film.
(6)導電性高分子の製造方法
この実施の形態に係る導電性高分子は、例えば、以下の方法により製造できる。まず、ポリアニオンを水系溶媒に分散または溶解させ、これにより得られた溶液に、前駆体モノマーとしての3,4−ジアルコキシチオフェンとアセチレングリコール系界面活性剤を添加してモノマー分散液を得る。次に、当該モノマー分散液に開始剤を添加して、3,4−ジアルコキシチオフェンを化学的酸化重合させる。その後、余剰の酸化剤や未反応モノマーを除去して精製し、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンとが複合化した構造の導電性高分子の水分散液を得る。こうして得られた導電性高分子の水分散液の固形分濃度は、好ましくは0.1〜4.0質量%であり、より好ましくは0.5〜2.0質量%であり、さらに好ましくは1.0〜1.5質量%である。
(6) Manufacturing method of conductive polymer The conductive polymer which concerns on this Embodiment can be manufactured with the following method, for example. First, a polyanion is dispersed or dissolved in an aqueous solvent, and 3,4-dialkoxythiophene and acetylene glycol surfactant as precursor monomers are added to the resulting solution to obtain a monomer dispersion. Next, an initiator is added to the monomer dispersion to chemically oxidatively polymerize 3,4-dialkoxythiophene. Thereafter, excess oxidant and unreacted monomer are removed and purified to obtain an aqueous dispersion of a conductive polymer having a structure in which poly (3,4-dialkoxythiophene) and polyanion are complexed. The solid content concentration of the aqueous dispersion of the conductive polymer thus obtained is preferably 0.1 to 4.0% by mass, more preferably 0.5 to 2.0% by mass, and still more preferably. 1.0 to 1.5% by mass.
2.導電性組成物およびその製造方法
この実施の形態に係る導電性組成物は、上述の導電性高分子を含有する液体若しくは固形物をいう。導電性組成物は、上述の導電性高分子に、水混和性有機溶媒、導電性向上剤、バインダ樹脂などを混合することもできる。導電性高分子の水分散液に、導電性向上剤および/またはバインダ樹脂を均一に混合するために、高い剪断力を付与できる混合分散機を用いるのが好ましい。混合分散機としては、例えば、ホモジナイザ、高圧ホモジナイザ、ビーズミル等が挙げられ、中でも、高圧ホモジナイザが好ましい。高圧ホモジナイザを用いた分散処理としては、例えば、分散処理を施す前の複合体溶液を高圧で対向衝突させる処理、オリフィスやスリットに高圧で通す処理等が挙げられる。混合分散機により分散処理を施すと、原理上、処理により得られる導電性高分子溶液の温度が高くなる。そのため、分散処理前の複合体溶液の温度を−20〜60℃にすることが好ましく、−10〜40℃にすることがより好ましく、−5〜30℃にすることが特に好ましい。複合体溶液の温度を−20℃以上にすれば、凍結を防止でき、60℃以下にすれば、導電性高分子またはポリアニオンの変質を防止できる。また、分散処理後の導電性高分子の水分散液を、例えば、冷媒温度−30〜20℃の熱交換器に通して冷却しても良い。
2. Conductive composition and method for producing the same The conductive composition according to this embodiment refers to a liquid or solid containing the above-described conductive polymer. In the conductive composition, a water-miscible organic solvent, a conductivity improver, a binder resin, and the like can be mixed with the above-described conductive polymer. In order to uniformly mix the conductivity improver and / or the binder resin with the aqueous dispersion of the conductive polymer, it is preferable to use a mixing and dispersing machine capable of imparting a high shearing force. Examples of the mixing and dispersing machine include a homogenizer, a high-pressure homogenizer, and a bead mill. Among them, a high-pressure homogenizer is preferable. Examples of the dispersion process using the high-pressure homogenizer include a process in which the complex solution before the dispersion process is subjected to a high-pressure opposing collision, a process in which the complex solution is passed through an orifice or a slit at a high pressure, and the like. When the dispersion treatment is performed by the mixing and dispersing machine, in principle, the temperature of the conductive polymer solution obtained by the treatment becomes high. Therefore, the temperature of the complex solution before the dispersion treatment is preferably -20 to 60 ° C, more preferably -10 to 40 ° C, and particularly preferably -5 to 30 ° C. Freezing can be prevented if the temperature of the complex solution is −20 ° C. or higher, and alteration of the conductive polymer or polyanion can be prevented if the temperature is 60 ° C. or lower. In addition, the aqueous dispersion of the conductive polymer after the dispersion treatment may be cooled by passing through a heat exchanger having a refrigerant temperature of −30 to 20 ° C., for example.
上述のような分散工程では、複合体のキュムラント平均粒子径が好ましくは2000nm以下、より好ましくは500nm以下、特に好ましくは200nm以下になるように分散処理する。複合体のキュムラント平均粒子径が2000nm以下になるように分散処理すれば、得られる導電性高分子溶液の安定性が高くなり、複合体の沈殿を防止できる。キュムラント平均粒子径は、動的光散乱法による粒径分布の測定から求められる。キュムラント平均粒子径は、分散工程での混合条件(例えば、圧力等)により調整される。具体的には、圧力が高い程、平均粒子径は小さくなる。 In the dispersion step as described above, the dispersion treatment is performed such that the cumulant average particle size of the composite is preferably 2000 nm or less, more preferably 500 nm or less, and particularly preferably 200 nm or less. If the dispersion treatment is performed so that the average particle size of the cumulant of the composite is 2000 nm or less, the stability of the obtained conductive polymer solution is increased, and precipitation of the composite can be prevented. The cumulant average particle size can be determined from the measurement of particle size distribution by the dynamic light scattering method. The cumulant average particle size is adjusted by mixing conditions (for example, pressure) in the dispersion step. Specifically, the higher the pressure, the smaller the average particle size.
(1)水混和性有機溶媒
導電性組成物の一構成としての水混和性有機溶媒は、上述の導電性高分子の製造の際に使用する水系溶媒に混合し得る水混和性有機溶媒と同種類の中から選択できる。水混和性有機溶媒は、水分量が好適には4質量%以下、さらに好適には3質量%以下、より好適には2質量%以下のものである。水混和性有機溶媒の量は、特に限定されるものではないが、この実施の形態に係る固形分100質量部に対して、好適には10〜5000質量部、さらに好適には50〜3000質量部である。水混和性有機溶媒の量が上記固形分100質量部に対して3000質量部以下の場合には、導電性組成物から得られる導電性塗膜の導電性をより高くできる。一方、水混和性有機溶媒の量が上記固形分100質量部に対して50質量部以上の場合に、導電性組成物の溶液がゲル化しにくくなり、適度な粘度で調整が可能となる。
(1) Water-miscible organic solvent The water-miscible organic solvent as one component of the conductive composition is the same as the water-miscible organic solvent that can be mixed with the aqueous solvent used in the production of the conductive polymer described above. You can choose from types. The water-miscible organic solvent has a water content of preferably 4% by mass or less, more preferably 3% by mass or less, and more preferably 2% by mass or less. The amount of the water-miscible organic solvent is not particularly limited, but is preferably 10 to 5000 parts by mass, more preferably 50 to 3000 parts by mass with respect to 100 parts by mass of the solid content according to this embodiment. Part. When the amount of the water-miscible organic solvent is 3000 parts by mass or less with respect to 100 parts by mass of the solid content, the conductivity of the conductive coating film obtained from the conductive composition can be further increased. On the other hand, when the amount of the water-miscible organic solvent is 50 parts by mass or more with respect to 100 parts by mass of the solid content, the solution of the conductive composition becomes difficult to gel, and adjustment with an appropriate viscosity becomes possible.
(2)導電性向上剤
導電性高分子の製造の際、導電性塗膜の導電性をさらに向上させるべく、下記(2a)〜(2h)の化合物から選ばれる1種以上の導電性向上剤を添加するのが好ましい。
(2a)窒素含有芳香族性環式化合物
(2b)2個以上のヒドロキシ基を有する化合物
(2c)2個以上のカルボキシ基を有する化合物
(2d)1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物
(2e)アミド基を有する化合物
(2f)イミド基を有する化合物
(2g)ラクタム化合物
(2h)グリシジル基を有する化合物
(2) Conductivity improver One or more conductivity improvers selected from the following compounds (2a) to (2h) in order to further improve the conductivity of the conductive coating film during the production of the conductive polymer. Is preferably added.
(2a) a nitrogen-containing aromatic cyclic compound (2b) a compound having two or more hydroxy groups (2c) a compound having two or more carboxy groups (2d) one or more hydroxy groups and one or more carboxys A compound having a group (2e) a compound having an amide group (2f) a compound having an imide group (2g) a lactam compound (2h) a compound having a glycidyl group
(2a)窒素含有芳香族性環式化合物
窒素含有芳香族性環式化合物としては、好適には、一つの窒素原子を含有するピリジン類およびその誘導体、二つの窒素原子を含有するイミダゾール類およびその誘導体、ピリミジン類およびその誘導体、ピラジン類およびその誘導体、三つの窒素原子を含有するトリアジン類およびその誘導体等が挙げられる。溶媒溶解性等の観点からは、ピリジン類およびその誘導体、イミダゾール類およびその誘導体、ピリミジン類およびその誘導体が好ましい。
(2a) Nitrogen-containing aromatic cyclic compound As the nitrogen-containing aromatic cyclic compound, pyridines containing one nitrogen atom and derivatives thereof, imidazoles containing two nitrogen atoms and their Derivatives, pyrimidines and derivatives thereof, pyrazines and derivatives thereof, triazines containing three nitrogen atoms and derivatives thereof, and the like. From the viewpoint of solvent solubility and the like, pyridines and derivatives thereof, imidazoles and derivatives thereof, and pyrimidines and derivatives thereof are preferable.
ピリジン類およびその誘導体の具体的な例としては、ピリジン、2−メチルピリジン、3−メチルピリジン、4−メチルピリジン、4−エチルピリジン、N−ビニルピリジン、2,4−ジメチルピリジン、2,4,6−トリメチルピリジン、3−シアノ−5−メチルピリジン、2−ピリジンカルボン酸、6−メチル−2−ピリジンカルボン酸、4−ピリジンカルボキシアルデヒド、4−アミノピリジン、2,3−ジアミノピリジン、2,6−ジアミノピリジン、2,6−ジアミノ−4−メチルピリジン、4−ヒドロキシピリジン、4−ピリジンメタノール、2,6−ジヒドロキシピリジン、2,6−ピリジンジメタノール、6−ヒドロキシニコチン酸メチル、2−ヒドロキシ−5−ピリジンメタノール、6−ヒドロキシニコチン酸エチル、4−ピリジンメタノール、4−ピリジンエタノール、2−フェニルピリジン、3−メチルキノリン、3−エチルキノリン、キノリノール、2,3−シクロペンテノピリジン、2,3−シクロヘキサノピリジン、1,2−ジ(4−ピリジル)エタン、1,2−ジ(4−ピリジル)プロパン、2−ピリジンカルボキシアルデヒド、2−ピリジンカルボン酸、2−ピリジンカルボニトリル、2,3−ピリジンジカルボン酸、2,4−ピリジンジカルボン酸、2,5−ピリジンジカルボン酸、2,6−ピリジンジカルボン酸、3−ピリジンスルホン酸等が挙げられる。 Specific examples of pyridines and derivatives thereof include pyridine, 2-methylpyridine, 3-methylpyridine, 4-methylpyridine, 4-ethylpyridine, N-vinylpyridine, 2,4-dimethylpyridine, 2,4 , 6-trimethylpyridine, 3-cyano-5-methylpyridine, 2-pyridinecarboxylic acid, 6-methyl-2-pyridinecarboxylic acid, 4-pyridinecarboxaldehyde, 4-aminopyridine, 2,3-diaminopyridine, 2 , 6-diaminopyridine, 2,6-diamino-4-methylpyridine, 4-hydroxypyridine, 4-pyridinemethanol, 2,6-dihydroxypyridine, 2,6-pyridinedimethanol, methyl 6-hydroxynicotinate, 2 -Hydroxy-5-pyridinemethanol, ethyl 6-hydroxynicotinate, 4- Pyridinemethanol, 4-pyridineethanol, 2-phenylpyridine, 3-methylquinoline, 3-ethylquinoline, quinolinol, 2,3-cyclopentenopyridine, 2,3-cyclohexanopyridine, 1,2-di (4- Pyridyl) ethane, 1,2-di (4-pyridyl) propane, 2-pyridinecarboxaldehyde, 2-pyridinecarboxylic acid, 2-pyridinecarbonitrile, 2,3-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, Examples include 2,5-pyridinedicarboxylic acid, 2,6-pyridinedicarboxylic acid, and 3-pyridinesulfonic acid.
イミダゾール類およびその誘導体の具体的な例としては、イミダゾール、2−メチルイミダゾール、2−プロピルイミダゾール、2−ウンデジルイミダゾール、2−フェニルイミダゾール、N−メチルイミダゾール、N−ビニルイミダゾール、N−アリルイミダゾール、1−(2−ヒドロキシエチル)イミダゾール(N−ヒドロキシエチルイミダゾール)、2−エチル−4−メチルイミダゾール、1,2−ジメチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、1−アセチルイミダゾール、4,5−イミダゾールジカルボン酸、4,5−イミダゾールジカルボン酸ジメチル、ベンズイミダゾール、2−アミノべンズイミダゾール、2−アミノべンズイミダゾール−2−スルホン酸、2−アミノ−1−メチルべンズイミダゾール、2−ヒドロキシべンズイミダゾール、2−(2−ピリジル)べンズイミダゾール等が挙げられる。 Specific examples of imidazoles and derivatives thereof include imidazole, 2-methylimidazole, 2-propylimidazole, 2-undecylimidazole, 2-phenylimidazole, N-methylimidazole, N-vinylimidazole, and N-allylimidazole. 1- (2-hydroxyethyl) imidazole (N-hydroxyethylimidazole), 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenyl Imidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-acetylimidazole, 4,5-imidazole dical Acid, dimethyl 4,5-imidazole dicarboxylate, benzimidazole, 2-aminobenzimidazole, 2-aminobenzimidazole-2-sulfonic acid, 2-amino-1-methylbenzimidazole, 2-hydroxybens Examples include imidazole and 2- (2-pyridyl) benzimidazole.
ピリミジン類およびその誘導体の具体的な例としては、2−アミノ−4−クロロ−6−メチルピリミジン、2−アミノ−6−クロロ−4−メトキシピリミジン、2−アミノ−4,6−ジクロロピリミジン、2−アミノ−4,6−ジヒドロキシピリミジン、2−アミノ−4,6−ジメチルピリミジン、2−アミノ−4,6−ジメトキシピリミジン、2−アミノピリミジン、2−アミノ−4−メチルピリミジン、4,6−ジヒドロキシピリミジン、2,4−ジヒドロキシピリミジン−5−カルボン酸、2,4,6−トリアミノピリミジン、2,4−ジメトキシピリミジン、2,4,5−トリヒドロキシピリミジン、2,4−ピリミジンジオール等が挙げられる。 Specific examples of pyrimidines and derivatives thereof include 2-amino-4-chloro-6-methylpyrimidine, 2-amino-6-chloro-4-methoxypyrimidine, 2-amino-4,6-dichloropyrimidine, 2-amino-4,6-dihydroxypyrimidine, 2-amino-4,6-dimethylpyrimidine, 2-amino-4,6-dimethoxypyrimidine, 2-aminopyrimidine, 2-amino-4-methylpyrimidine, 4,6 -Dihydroxypyrimidine, 2,4-dihydroxypyrimidine-5-carboxylic acid, 2,4,6-triaminopyrimidine, 2,4-dimethoxypyrimidine, 2,4,5-trihydroxypyrimidine, 2,4-pyrimidinediol, etc. Is mentioned.
ピラジン類およびその誘導体の具体的な例としては、ピラジン、2−メチルピラジン、2,5−ジメチルピラジン、ピラジンカルボン酸、2,3−ピラジンジカルボン酸、5−メチルピラジンカルボン酸、ピラジンアミド、5−メチルピラジンアミド、2−シアノピラジン、アミノピラジン、3−アミノピラジン−2−カルボン酸、2−エチル−3−メチルピラジン、2,3−ジメチルピラジン、2,3−ジエチルピラジン等が挙げられる。 Specific examples of pyrazines and derivatives thereof include pyrazine, 2-methylpyrazine, 2,5-dimethylpyrazine, pyrazinecarboxylic acid, 2,3-pyrazinedicarboxylic acid, 5-methylpyrazinecarboxylic acid, pyrazineamide, 5 -Methylpyrazine amide, 2-cyanopyrazine, aminopyrazine, 3-aminopyrazine-2-carboxylic acid, 2-ethyl-3-methylpyrazine, 2,3-dimethylpyrazine, 2,3-diethylpyrazine and the like.
トリアジン類およびその誘導体の具体的な例としては、1,3,5−トリアジン、2−アミノ−1,3,5−トリアジン、3−アミノ−1,2,4−トリアジン、2,4−ジアミノ−6−フェニル−1,3,5−トリアジン、2,4,6−トリアミノ−1,3,5−トリアジン、2,4,6−トリス(トリフルオロメチル)−1,3,5−トリアジン、2,4,6−トリ−2−ピリジン−1,3,5−トリアジン、3−(2−ピリジン)−5,6−ビス(4−フェニルスルホン酸)−1,2,4―トリアジン二ナトリウム、3−(2−ピリジン)−5,6−ジフェニル−1,2,4−トリアジン、3−(2−ピリジン)−5,6−ジフェニル−1,2,4―トリアジン−ρ,ρ’−ジスルホン酸二ナトリウム、2−ヒドロキシ−4,6−ジクロロ−1,3,5−トリアジン等が挙げられる。 Specific examples of triazines and derivatives thereof include 1,3,5-triazine, 2-amino-1,3,5-triazine, 3-amino-1,2,4-triazine, and 2,4-diamino. -6-phenyl-1,3,5-triazine, 2,4,6-triamino-1,3,5-triazine, 2,4,6-tris (trifluoromethyl) -1,3,5-triazine, 2,4,6-tri-2-pyridine-1,3,5-triazine, 3- (2-pyridine) -5,6-bis (4-phenylsulfonic acid) -1,2,4-triazine disodium 3- (2-pyridine) -5,6-diphenyl-1,2,4-triazine, 3- (2-pyridine) -5,6-diphenyl-1,2,4-triazine-ρ, ρ′- Disodium disulphonate, 2-hydroxy-4,6-dichloro And ro-1,3,5-triazine.
窒素含有芳香族性環式化合物の含有量は、ポリアニオンのアニオン基単位1モルに対して0.1〜100モルの範囲であることが好ましく、0.5〜30モルの範囲であることがより好ましく、導電性の観点からは、1〜10モルの範囲が特に好ましい。窒素含有芳香族性環式化合物の含有率が0.1モル以上の場合には、窒素含有芳香族性環式化合物とポリアニオンおよびポリ(3,4−ジアルコキシチオフェン)との相互作用が強くなる傾向にあり、十分な導電性を発揮できる。また、窒素含有芳香族性環式化合物が100モル以下の場合には、導電性高分子の含有量が相対的に多くなり、導電性をより高めることができる。 The content of the nitrogen-containing aromatic cyclic compound is preferably in the range of 0.1 to 100 mol, more preferably in the range of 0.5 to 30 mol, with respect to 1 mol of the anion group unit of the polyanion. The range of 1 to 10 mol is particularly preferable from the viewpoint of conductivity. When the content of the nitrogen-containing aromatic cyclic compound is 0.1 mol or more, the interaction between the nitrogen-containing aromatic cyclic compound and the polyanion and poly (3,4-dialkoxythiophene) becomes strong. Tend to exhibit sufficient electrical conductivity. Moreover, when the nitrogen-containing aromatic cyclic compound is 100 mol or less, the content of the conductive polymer is relatively increased, and the conductivity can be further increased.
(2b)2個以上のヒドロキシ基を有する化合物
2個以上のヒドロキシ基を有する化合物としては、例えば、プロピレングリコール、1,3−ブチレングリコール、1,4−ブチレングリコール、グリセリン、ジグリセリン、D−グルコース、D−グルシトール、イソプレングリコール、ジメチロールプロピオン酸、ブタンジオール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,9−ノナンジオール、ネオペンチルグリコール、トリメチロールエタン、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、チオジエタノール、グルコース、酒石酸、D−グルカル酸、グルタコン酸等の多価脂肪族アルコール類; セルロース、多糖、糖アルコール等の高分子アルコール; 1,4−ジヒドロキシベンゼン、1,3−ジヒドロキシベンゼン、2,3−ジヒドロキシ−1−ペンタデシルベンゼン、2,4−ジヒドロキシアセトフェノン、2,5−ジヒドロキシアセトフェノン、2,4−ジヒドロキシベンゾフェノン、2,6−ジヒドロキシベンゾフェノン、3,4−ジヒドロキシベンゾフェノン、3,5−ジヒドロキシベンゾフェノン、2,4’−ジヒドロキシジフェニルスルフォン、2,2’,5,5’−テトラヒドロキシジフェニルスルフォン、3,3’,5,5’−テトラメチル−4,4’−ジヒドロキシジフェニルスルフォン、ヒドロキシキノンカルボン酸およびその塩類、2,3−ジヒドロキシ安息香酸、2,4−ジヒドロキシ安息香酸、2,5−ジヒドロキシ安息香酸、2,6−ジヒドロキシ安息香酸、3,5−ジヒドロキシ安息香酸、1,4−ヒドロキノンスルホン酸およびその塩類、4,5−ヒドロキシベンゼン−1,3−ジスルホン酸およびその塩類、1,5−ジヒドロキシナフタレン、1,6−ジヒドロキシナフタレン、2,6−ジヒドロキシナフタレン、2,7−ジヒドロキシナフタレン、2,3−ジヒドロキシナフタレン、1,5−ジヒドロキシナフタレン−2,6−ジカルボン酸、1,6−ジヒドロキシナフタレン−2,5−ジカルボン酸、1,5−ジヒドロキシナフトエ酸、1,4−ジヒドロキシ−2−ナフトエ酸フェニルエステル、4,5−ジヒドロキシナフタレン−2,7−ジスルホン酸およびその塩類、1,8−ジヒドロキシ−3,6−ナフタレンジスルホン酸およびその塩類、6,7−ジヒドロキシ−2−ナフタレンスルホン酸およびその塩類、1,2,3−トリヒドロキシベンゼン(ピロガロール)、1,2,4−トリヒドロキシベンゼン、5−メチル−1,2,3−トリヒドロキシベンゼン、5−エチル−1,2,3−トリヒドロキシベンゼン、5−プロピル−1,2,3−トリヒドロキシベンゼン、トリヒドロキシ安息香酸、トリヒドロキシアセトフェノン、トリヒドロキシベンゾフェノン、トリヒドロキシベンゾアルデヒド、トリヒドロキシアントラキノン、2,4,6−トリヒドロキシベンゼン、テトラヒドロキシ−p−ベンゾキノン、テトラヒドロキシアントラキノン、ガーリック酸メチル(没食子酸メチル)、ガーリック酸エチル(没食子酸エチル)等の芳香族化合物、ヒドロキノンスルホン酸カリウム等が挙げられる。
(2b) Compound having two or more hydroxy groups Examples of the compound having two or more hydroxy groups include propylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, glycerin, diglycerin, D- Glucose, D-glucitol, isoprene glycol, dimethylolpropionic acid, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, neopentyl glycol, trimethylolethane, trimethylolpropane, Polyhydric aliphatic alcohols such as pentaerythritol, dipentaerythritol, thiodiethanol, glucose, tartaric acid, D-glucaric acid and glutaconic acid; high molecular alcohols such as cellulose, polysaccharide and sugar alcohol; 1,4-dihydroxybenze 1,3-dihydroxybenzene, 2,3-dihydroxy-1-pentadecylbenzene, 2,4-dihydroxyacetophenone, 2,5-dihydroxyacetophenone, 2,4-dihydroxybenzophenone, 2,6-dihydroxybenzophenone, 3, 4-dihydroxybenzophenone, 3,5-dihydroxybenzophenone, 2,4′-dihydroxydiphenylsulfone, 2,2 ′, 5,5′-tetrahydroxydiphenylsulfone, 3,3 ′, 5,5′-tetramethyl-4 , 4′-dihydroxydiphenylsulfone, hydroxyquinonecarboxylic acid and its salts, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3, 5-dihydroxybenzoic acid, 1, -Hydroquinonesulfonic acid and its salts, 4,5-hydroxybenzene-1,3-disulfonic acid and its salts, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7- Dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene-2,6-dicarboxylic acid, 1,6-dihydroxynaphthalene-2,5-dicarboxylic acid, 1,5-dihydroxynaphthoic acid, 1,4- Dihydroxy-2-naphthoic acid phenyl ester, 4,5-dihydroxynaphthalene-2,7-disulfonic acid and its salts, 1,8-dihydroxy-3,6-naphthalenedisulfonic acid and its salts, 6,7-dihydroxy-2 -Naphthalenesulfonic acid and its salts, 1,2,3 -Trihydroxybenzene (pyrogallol), 1,2,4-trihydroxybenzene, 5-methyl-1,2,3-trihydroxybenzene, 5-ethyl-1,2,3-trihydroxybenzene, 5-propyl- 1,2,3-trihydroxybenzene, trihydroxybenzoic acid, trihydroxyacetophenone, trihydroxybenzophenone, trihydroxybenzaldehyde, trihydroxyanthraquinone, 2,4,6-trihydroxybenzene, tetrahydroxy-p-benzoquinone, tetra Examples include hydroxyanthraquinone, aromatic compounds such as methyl garlic acid (methyl gallate) and ethyl garlic acid (ethyl gallate), and potassium hydroquinone sulfonate.
2個以上のヒドロキシ基を有する化合物の含有量は、ポリアニオンのアニオン基単位1モルに対して0.05〜50モルの範囲であることが好ましく、0.3〜10モルの範囲であることがより好ましい。2個以上のヒドロキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して0.05モル以上になると、導電性および耐熱性をより高めることができる。また、2個以上のヒドロキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して50モル以下になると、得られる導電性塗膜中の導電性高分子の含有量が相対的に多くなり、導電性をより高めることができる。 The content of the compound having two or more hydroxy groups is preferably in the range of 0.05 to 50 mol and more preferably in the range of 0.3 to 10 mol with respect to 1 mol of the anion group unit of the polyanion. More preferred. When the content of the compound having two or more hydroxy groups is 0.05 mol or more with respect to 1 mol of the anion group unit of the polyanion, conductivity and heat resistance can be further improved. Further, when the content of the compound having two or more hydroxy groups is 50 mol or less with respect to 1 mol of the anion group unit of the polyanion, the content of the conductive polymer in the obtained conductive coating film is relatively The conductivity can be further increased.
(2c)2個以上のカルボキシ基を有する化合物
2個以上のカルボキシ基を有する化合物としては、マレイン酸、フマル酸、イタコン酸、シトラコン酸、マロン酸、1,4−ブタンジカルボン酸、コハク酸、酒石酸、アジピン酸、D−グルカル酸、グルタコン酸、クエン酸等の脂肪族カルボン酸類化合物; フタル酸、テレフタル酸、イソフタル酸、テトラヒドロ無水フタル酸、5−スルホイソフタル酸、5−ヒドロキシイソフタル酸、メチルテトラヒドロ無水フタル酸、4,4’−オキシジフタル酸、ビフェニルテトラカルボン酸二無水物、ベンゾフェノンテトラカルボン酸二無水物、ナフタレンジカルボン酸、トリメリット酸、ピロメリット酸等の、芳香族性環に少なくとも一つ以上のカルボキシ基が結合している芳香族カルボン酸類化合物; ジグリコール酸、オキシ二酪酸、チオ二酢酸(チオジ酢酸)、チオ二酪酸、イミノ二酢酸、イミノ酪酸等が挙げられる。
(2c) Compound having two or more carboxy groups Examples of the compound having two or more carboxy groups include maleic acid, fumaric acid, itaconic acid, citraconic acid, malonic acid, 1,4-butanedicarboxylic acid, succinic acid, Aliphatic carboxylic acid compounds such as tartaric acid, adipic acid, D-glucaric acid, glutaconic acid, citric acid; phthalic acid, terephthalic acid, isophthalic acid, tetrahydrophthalic anhydride, 5-sulfoisophthalic acid, 5-hydroxyisophthalic acid, methyl At least one aromatic ring such as tetrahydrophthalic anhydride, 4,4′-oxydiphthalic acid, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, naphthalenedicarboxylic acid, trimellitic acid, pyromellitic acid, etc. Aromatic carboxylic acid compounds with two or more carboxy groups attached ; Diglycolic acid, oxy two acid, thiodiacetic acid (thiodiacetic acid), thiodiacetic acid, iminodiacetic acid, etc. imino acid are exemplified.
2個以上のカルボキシ基を有する化合物は、ポリアニオンのアニオン基単位1モルに対して0.1〜30モルの範囲であることが好ましく、0.3〜10モルの範囲であることがより好ましい。2個以上のカルボキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して0.1モル以上になると、導電性および耐熱性をより高めることができる。また、2個以上のカルボキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して30モル以下になると、導電性塗膜中の導電性高分子の含有量が相対的に多くなり、導電性をより高めることができる。 The compound having two or more carboxy groups is preferably in the range of 0.1 to 30 mol, more preferably in the range of 0.3 to 10 mol, relative to 1 mol of the anion group unit of the polyanion. When the content of the compound having two or more carboxy groups is 0.1 mol or more with respect to 1 mol of the anion group unit of the polyanion, conductivity and heat resistance can be further improved. In addition, when the content of the compound having two or more carboxy groups is 30 mol or less with respect to 1 mol of the anion group unit of the polyanion, the content of the conductive polymer in the conductive coating film is relatively large. Thus, the conductivity can be further increased.
(2d)1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物
1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物としては、酒石酸、グリセリン酸、ジメチロールブタン酸、ジメチロールプロパン酸、D−グルカル酸、グルタコン酸等が挙げられる。
(2d) Compound having one or more hydroxy groups and one or more carboxy groups Examples of the compound having one or more hydroxy groups and one or more carboxy groups include tartaric acid, glyceric acid, dimethylolbutanoic acid, dimethylol Examples include propanoic acid, D-glucaric acid, and glutaconic acid.
1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物の含有量は、ポリアニオンとポリ(3,4−ジアルコキシチオフェン)の合計100質量部に対して1〜5,000質量部であることが好ましく、50〜500質量部であることがより好ましい。1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物の含有量が1質量部以上になると、導電性および耐熱性をより高めることができる。また、1個以上のヒドロキシ基および1個以上のカルボキシ基を有する化合物の含有量が5,000質量部以下になると、導電性塗膜中の導電性高分子の含有量が相対的に多くなり、導電性をより高めることができる。 The content of the compound having one or more hydroxy groups and one or more carboxy groups is 1 to 5,000 parts by mass with respect to 100 parts by mass in total of the polyanion and poly (3,4-dialkoxythiophene). It is preferably 50 to 500 parts by mass. When the content of the compound having one or more hydroxy groups and one or more carboxy groups is 1 part by mass or more, conductivity and heat resistance can be further improved. Further, when the content of the compound having one or more hydroxy groups and one or more carboxy groups is 5,000 parts by mass or less, the content of the conductive polymer in the conductive coating film is relatively increased. , Conductivity can be further increased.
(2e)アミド化合物
アミド基を有する化合物は、−CO−NH−(COの部分は二重結合)で表されるアミド結合を分子中に有する単分子化合物である。すなわち、アミド化合物としては、例えば、上記結合の両末端に官能基を有する化合物、上記結合の一方の末端に環状化合物が結合された化合物、上記両末端の官能基が水素である尿素および尿素誘導体などが挙げられる。アミド化合物の具体例としては、アセトアミド、マロンアミド、スクシンアミド、マレアミド、フマルアミド、ベンズアミド、ナフトアミド、フタルアミド、イソフタルアミド、テレフタルアミド、ニコチンアミド、イソニコチンアミド、2−フルアミド、ホルムアミド、N−メチルホルムアミド、プロピオンアミド、プロピオルアミド、ブチルアミド、イソブチルアミド、メタクリルアミド、パルミトアミド、ステアリルアミド、オレアミド、オキサミド、グルタルアミド、アジプアミド、シンナムアミド、グリコールアミド、ラクトアミド、グリセルアミド、タルタルアミド、シトルアミド、グリオキシルアミド、ピルボアミド、アセトアセトアミド、ジメチルアセトアミド、ベンジルアミド、アントラニルアミド、エチレンジアミンテトラアセトアミド、ジアセトアミド、トリアセトアミド、ジベンズアミド、トリベンズアミド、ローダニン、尿素、1−アセチル−2−チオ尿素、ビウレット、ブチル尿素、ジブチル尿素、1,3−ジメチル尿素、1,3−ジエチル尿素およびこれらの誘導体等が挙げられる。
(2e) Amide Compound The compound having an amide group is a monomolecular compound having an amide bond represented by —CO—NH— (wherein the CO portion is a double bond) in the molecule. That is, as the amide compound, for example, a compound having functional groups at both ends of the bond, a compound in which a cyclic compound is bonded to one end of the bond, urea and a urea derivative in which the functional groups at both ends are hydrogen Etc. Specific examples of amide compounds include acetamide, malonamide, succinamide, maleamide, fumaramide, benzamide, naphthamide, phthalamide, isophthalamide, terephthalamide, nicotinamide, isonicotinamide, 2-fluamide, formamide, N-methylformamide, propionamide , Propioluamide, butyramide, isobutylamide, methacrylamide, palmitoamide, stearylamide, oleamide, oxamide, glutaramide, adipamide, cinnamamide, glycolamide, lactamide, glyceramide, tartaramide, citrulamide, glyoxylamide, pyruvamide, acetoacetamide, dimethyl Acetamide, benzylamide, anthranilamide, ethylenediamine Laacetamide, diacetamide, triacetamide, dibenzamide, tribenzamide, rhodanine, urea, 1-acetyl-2-thiourea, biuret, butylurea, dibutylurea, 1,3-dimethylurea, 1,3-diethylurea and These derivatives are mentioned.
また、アミド化合物として、アクリルアミドを使用することもできる。アクリルアミドとしては、N−メチルアクリルアミド、N−メチルメタクリルアミド、N−エチルアクリルアミド、N−エチルメタクリルアミド、N,N−ジメチルアクリルアミド、N,N−ジメチルメタクリルアミド、N,N−ジエチルアクリルアミド、N,N−ジエチルメタクリルアミド、2−ヒドロキシエチルアクリルアミド、2−ヒドロキシエチルメタクリルアミド、N−メチロールアクリルアミド、N−メチロールメタクリルアミドなどが挙げられる。アミド化合物の分子量は46〜10,000であることが好ましく、46〜5,000であることがより好ましく、46〜1,000であることが特に好ましい。 Moreover, acrylamide can also be used as an amide compound. As acrylamide, N-methylacrylamide, N-methylmethacrylamide, N-ethylacrylamide, N-ethylmethacrylamide, N, N-dimethylacrylamide, N, N-dimethylmethacrylamide, N, N-diethylacrylamide, N, Examples thereof include N-diethyl methacrylamide, 2-hydroxyethyl acrylamide, 2-hydroxyethyl methacrylamide, N-methylol acrylamide, N-methylol methacrylamide and the like. The molecular weight of the amide compound is preferably 46 to 10,000, more preferably 46 to 5,000, and particularly preferably 46 to 1,000.
アミド化合物の含有量は、ポリアニオンとポリ(3,4−ジアルコキシチオフェン)の合計100質量部に対して1〜5,000質量部であることが好ましく、50〜500質量部であることがより好ましい。アミド化合物の含有量が1質量部以上になると、導電性および耐熱性をより高めることができる。また、アミド化合物の含有量が5,000質量部以下になると、導電性塗膜中の導電性高分子の含有量が相対的に多くなり、導電性をより高めることができる。 The content of the amide compound is preferably 1 to 5,000 parts by mass and more preferably 50 to 500 parts by mass with respect to 100 parts by mass in total of the polyanion and poly (3,4-dialkoxythiophene). preferable. When the content of the amide compound is 1 part by mass or more, conductivity and heat resistance can be further improved. Moreover, when content of an amide compound will be 5,000 mass parts or less, content of the conductive polymer in a conductive coating film will increase relatively, and electroconductivity can be improved more.
(2f)イミド化合物
イミド化合物としては、その骨格より、フタルイミドおよびフタルイミド誘導体、スクシンイミドおよびスクシンイミド誘導体、ベンズイミドおよびベンズイミド誘導体、マレイミドおよびマレイミド誘導体、ナフタルイミドおよびナフタルイミド誘導体などが挙げられる。
(2f) Imide compound Examples of the imide compound include phthalimide and phthalimide derivatives, succinimide and succinimide derivatives, benzimide and benzimide derivatives, maleimide and maleimide derivatives, naphthalimide and naphthalimide derivatives based on the skeleton.
また、イミド化合物は、両末端の官能基の種類によって、脂肪族イミド、芳香族イミド等に分類されるが、溶解性の観点からは、脂肪族イミドが好ましい。さらに、脂肪族イミド化合物は、分子内の炭素間に不飽和結合を有する飽和脂肪族イミド化合物と、分子内の炭素間に不飽和結合を有する不飽和脂肪族イミド化合物とに分類される。飽和脂肪族イミド化合物は、R1−CO−NH−CO−R2で表される化合物であり、R1,R2の両方が飽和炭化水素である化合物である。具体的には、シクロヘキサン−1,2−ジカルボキシイミド、アラントイン、ヒダントイン、バルビツル酸、アロキサン、グルタルイミド、スクシンイミド、5−ブチルヒダントイン酸、5,5−ジメチルヒダントイン、1−メチルヒダントイン、1,5,5−トリメチルヒダントイン、5−ヒダントイン酢酸、N−ヒドロキシ−5−ノルボルネン−2,3−ジカルボキシイミド、セミカルバジド、α,α−ジメチル−6−メチルスクシンイミド、ビス[2−(スクシンイミドオキシカルボニルオキシ)エチル]スルホン、α−メチル−α−プロピルスクシンイミド、シクロヘキシルイミドなどが挙げられる。不飽和脂肪族イミド化合物は、R1−CO−NH−CO−R2で表される化合物であり、R1,R2の一方または両方が1つ以上の不飽和結合である化合物である。その具体例としては、1,3−ジプロピレン尿素、マレイミド、N−メチルマレイミド、N−エチルマレイミド、N−ヒドロキシマレイミド、1,4−ビスマレイミドブタン、1,6−ビスマレイミドヘキサン、1,8−ビスマレイミドオクタン、N−カルボキシヘプチルマレイミドなどが挙げられる。 Moreover, although an imide compound is classified into an aliphatic imide, an aromatic imide, etc. according to the kind of functional group of both terminal, an aliphatic imide is preferable from a soluble viewpoint. Furthermore, the aliphatic imide compound is classified into a saturated aliphatic imide compound having an unsaturated bond between carbons in the molecule and an unsaturated aliphatic imide compound having an unsaturated bond between carbons in the molecule. The saturated aliphatic imide compound is a compound represented by R 1 —CO—NH—CO—R 2 , and is a compound in which both R 1 and R 2 are saturated hydrocarbons. Specifically, cyclohexane-1,2-dicarboximide, allantoin, hydantoin, barbituric acid, alloxan, glutarimide, succinimide, 5-butylhydantoic acid, 5,5-dimethylhydantoin, 1-methylhydantoin, 1,5 , 5-trimethylhydantoin, 5-hydantoin acetic acid, N-hydroxy-5-norbornene-2,3-dicarboximide, semicarbazide, α, α-dimethyl-6-methylsuccinimide, bis [2- (succinimidooxycarbonyloxy) Ethyl] sulfone, α-methyl-α-propylsuccinimide, cyclohexylimide and the like. An unsaturated aliphatic imide compound is a compound represented by R 1 —CO—NH—CO—R 2 , and one or both of R 1 and R 2 are one or more unsaturated bonds. Specific examples thereof include 1,3-dipropylene urea, maleimide, N-methylmaleimide, N-ethylmaleimide, N-hydroxymaleimide, 1,4-bismaleimide butane, 1,6-bismaleimide hexane, 1,8 -Bismaleimide octane, N-carboxyheptylmaleimide and the like.
イミド化合物の分子量は60〜5,000であることが好ましく、70〜1,000であることがより好ましく、80〜500であることが特に好ましい。 The molecular weight of the imide compound is preferably 60 to 5,000, more preferably 70 to 1,000, and particularly preferably 80 to 500.
イミド化合物の含有量は、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンの合計100質量部に対して10〜10,000質量部であることが好ましく、50〜5,000質量部であることがより好ましい。イミド化合物の添加量が前記下限値以上であると、イミド化合物添加による効果が高くなるので、より好ましい。また、前記上限値以下であると、導電性高分子の濃度の上昇に起因する導電性の向上が起きるので、より好ましい。 The content of the imide compound is preferably 10 to 10,000 parts by mass, and 50 to 5,000 parts by mass with respect to 100 parts by mass in total of poly (3,4-dialkoxythiophene) and polyanion. Is more preferable. It is more preferable that the amount of the imide compound added is equal to or greater than the lower limit because the effect of adding the imide compound is increased. Further, if it is not more than the above upper limit value, it is more preferable because conductivity is increased due to an increase in the concentration of the conductive polymer.
(2g)ラクタム化合物
ラクタム化合物とは、アミノカルボン酸の分子内環状アミドであり、環の一部が−CO−NR−(Rは水素または任意の置換基)である化合物である。ただし、環の一個以上の炭素原子が不飽和やヘテロ原子に置き換わっていてもよい。ラクタム化合物としては、例えば、ペンタノ−4−ラクタム、4−ペンタンラクタム−5−メチル−2−ピロリドン、5−メチル−2−ピロリジノン、ヘキサノ−6−ラクタム、6−ヘキサンラクタム等が挙げられる。
(2g) Lactam Compound A lactam compound is an intramolecular cyclic amide of an aminocarboxylic acid, and a part of the ring is —CO—NR— (where R is hydrogen or an arbitrary substituent). However, one or more carbon atoms in the ring may be replaced with an unsaturated or heteroatom. Examples of the lactam compound include pentano-4-lactam, 4-pentanelactam-5-methyl-2-pyrrolidone, 5-methyl-2-pyrrolidinone, hexano-6-lactam, 6-hexane lactam and the like.
ラクタム化合物の含有量は、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンの合計100質量部に対して10〜10000質量部であることが好ましく、50〜5000質量部であることがより好ましい。ラクタム化合物の添加量が前記下限値以上であると、ラクタム化合物添加による効果が高くなるため、好ましい。また、前記上限値以下になると、導電性高分子の濃度の上昇に起因する導電性の向上が起きるので、より好ましい。 The content of the lactam compound is preferably 10 to 10000 parts by mass, and more preferably 50 to 5000 parts by mass with respect to 100 parts by mass in total of poly (3,4-dialkoxythiophene) and polyanion. Since the effect by addition of a lactam compound becomes high as the addition amount of a lactam compound is more than the said lower limit, it is preferable. Moreover, since it will become the electroconductivity improvement resulting from the raise of the density | concentration of a conductive polymer when it becomes below the said upper limit, it is more preferable.
(2h)グリシジル基を有する化合物
グリシジル基を有する化合物としては、例えば、エチルグリシジルエーテル、ブチルグリシジルエーテル、t−ブチルグリシジルエーテル、アリルグリシジルエーテル、ベンジルグリシジルエーテル、グリシジルフェニルエーテル、ビスフェノールA、ジグリシジルエーテル、アクリル酸グリシジルエーテル、メタクリル酸グリシジルエーテル等のグリシジル化合物などが挙げられる。
(2h) Compound having glycidyl group Examples of the compound having glycidyl group include ethyl glycidyl ether, butyl glycidyl ether, t-butyl glycidyl ether, allyl glycidyl ether, benzyl glycidyl ether, glycidyl phenyl ether, bisphenol A, and diglycidyl ether. And glycidyl compounds such as glycidyl acrylate and glycidyl methacrylate.
グリシジル基を有する化合物の含有量は、ポリ(3,4−ジアルコキシチオフェン)とポリアニオンの合計100質量部に対して10〜10000質量部であることが好ましく、50〜5000質量部であることがより好ましい。グリシジル基を有する化合物の添加量が前記下限値以上であると、グリシジル基を有する化合物添加による効果が高くなるため、好ましい。また、前記上限値以下になると、導電性高分子の濃度の上昇に起因する導電性の向上が起きるので、より好ましい。 The content of the compound having a glycidyl group is preferably 10 to 10000 parts by mass, and preferably 50 to 5000 parts by mass with respect to 100 parts by mass in total of poly (3,4-dialkoxythiophene) and polyanion. More preferred. It is preferable that the addition amount of the compound having a glycidyl group is equal to or more than the lower limit because the effect of the addition of the compound having a glycidyl group is increased. Moreover, since it will become the electroconductivity improvement resulting from the raise of the density | concentration of a conductive polymer when it becomes below the said upper limit, it is more preferable.
(3)バインダ樹脂
バインダ樹脂としては、特に限定されることなく、目的に応じて適宜選択可能であり、熱硬化性樹脂であってもよいし、熱可塑性樹脂であってもよい。例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル; ポリイミド、ポリアミドイミド等のポリイミド; ポリアミド6、ポリアミド6,6、ポリアミド12、ポリアミド11等のポリアミド; ポリフッ化ビニリデン、ポリフッ化ビニル、ポリテトラフルオロエチレン、エチレンテトラフルオロエチレンコポリマー、ポリクロロトリフルオロエチレン等のフッ素樹脂; ポリビニルアルコール、ポリビニルエーテル、ポリビニルブチラール、ポリ酢酸ビニル、ポリ塩化ビニル等のビニル樹脂; エポキシ樹脂; オキセタン樹脂; キシレン樹脂; アラミド樹脂; ポリイミドシリコーン; ポリウレタン; ポリウレア; メラミン樹脂; フェノール樹脂; ポリエーテル; アクリル樹脂およびこれらの共重合体等を好適に挙げることができる。また、バインダ樹脂には、必要に応じて、架橋剤、重合開始剤等の硬化剤、重合促進剤、溶媒、粘度調整剤等を加えて使用することができる。
(3) Binder resin The binder resin is not particularly limited and may be appropriately selected depending on the purpose, and may be a thermosetting resin or a thermoplastic resin. For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyimides such as polyimide and polyamideimide; polyamides such as polyamide 6, polyamide 6,6, polyamide 12, and polyamide 11; polyvinylidene fluoride, polyvinyl fluoride, poly Fluororesin such as tetrafluoroethylene, ethylenetetrafluoroethylene copolymer, polychlorotrifluoroethylene; Vinyl resin such as polyvinyl alcohol, polyvinyl ether, polyvinyl butyral, polyvinyl acetate, polyvinyl chloride; Epoxy resin; Oxetane resin; Xylene resin; Aramid resin; Polyimide silicone; Polyurethane; Polyurea; Melamine resin; Phenol resin; And it can be exemplified copolymers thereof suitably. Further, the binder resin can be used by adding a curing agent such as a cross-linking agent and a polymerization initiator, a polymerization accelerator, a solvent, a viscosity adjusting agent, and the like as necessary.
上記バインダ樹脂の中でも、容易に混合可能なポリウレタン、ポリエステル、アクリル樹脂、ポリアミド、ポリイミド、エポキシ樹脂、ポリイミドシリコーンのいずれか1種以上が好ましい。また、アクリル樹脂は、硬度が高く透明性に優れるため、光学フィルタのような用途には適している。また、バインダ樹脂は、熱エネルギーおよび/または光エネルギーによって硬化する液状重合体を含むことが好ましい。ここで、熱エネルギーにより硬化する液状重合体としては、反応型重合体および自己架橋型重合体が挙げられる。反応型重合体は、置換基を有する単量体が重合した重合体であり、置換基としては、ヒドロキシ基、カルボキシ基、酸無水物、オキセタン系、グリシジル基、アミノ基などが挙げられる。具体的な単量体としては、エチレングリコール、ジエチレングリコール、ジプロピレングリコール、グリセリン等の多官能アルコール; マロン酸、コハク酸、グルタミン酸、ピメリン酸、アスコルビン酸、フタル酸、アセチルサルチル酸、アジピン酸、イソフタル酸、安息香酸、m−トルイル酸等のカルボン酸化合物; 無水マレイン酸、無水フタル酸、ドデシル無水コハク酸、ジクロル無水マレイン酸、テトラクロル無水フタル酸、テトラヒドロ無水フタル酸、無水ピメリット酸等の酸無水物; 3,3−ジメチルオキセタン、3,3−ジクロロメチルオキセタン、3−メチル−3−ヒドロキシメチルオキセタン、アジドメチルメチルオキセタン等のオキセタン化合物; ビスフェノールAジグリシジルエーテル、ビスフェノールFジグリシジルエーテル、フェノールノボラックポリグリシジルエーテル、N,N−ジグリシジル−p−アミノフェノールグリシジルエーテル、テトラブロモビスフェノールAジグリシジルエーテル、水添ビスフェノールAジグリシジルエーテル(すなわち、2,2−ビス(4−グリシジルオキシシクロヘキシル)プロパン)等のグリシジルエーテル化合物; N,N−ジグリシジルアニリン、テトラグリシジルジアミノジフェニルメタン、N,N,N,N−テトラグリシジル−m−キシリレンジアミン、トリグリシジルイソシアヌレート、N,N−ジグリシジル−5,5−ジアルキルヒダントイン等のグリシジルアミン化合物; ジエチレントリアミン、トリエチレンテトラミン、ジメチルアミノプロピルアミン、N−アミノエチルピペラジン、ベンジルジメチルアミン、トリス(ジメチルアミノメチル)フェノール、DHP30−トリ(2−エチルヘクソエート)、メタフェニレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ジシアンジアミド、三フッ化ホウ素、モノエチルアミン、メタンジアミン、キシレンジアミン、エチルメチルイミダゾール等のアミン化合物; 1分子中に2個以上のオキシラン環を含む化合物のうち、ビスフェノールAのエピクロロヒドリンによるグリシジル化合物、あるいはその類似物; などが挙げられる。 Among the binder resins, one or more of polyurethane, polyester, acrylic resin, polyamide, polyimide, epoxy resin, and polyimide silicone that can be easily mixed are preferable. Acrylic resins are suitable for applications such as optical filters because of their high hardness and excellent transparency. The binder resin preferably contains a liquid polymer that is cured by thermal energy and / or light energy. Here, examples of the liquid polymer that is cured by thermal energy include a reactive polymer and a self-crosslinking polymer. A reactive polymer is a polymer in which a monomer having a substituent is polymerized, and examples of the substituent include a hydroxy group, a carboxy group, an acid anhydride, an oxetane group, a glycidyl group, and an amino group. Specific monomers include polyfunctional alcohols such as ethylene glycol, diethylene glycol, dipropylene glycol and glycerin; malonic acid, succinic acid, glutamic acid, pimelic acid, ascorbic acid, phthalic acid, acetylsalicylic acid, adipic acid, isophthalic acid Carboxylic acid compounds such as acid, benzoic acid and m-toluic acid; acid anhydrides such as maleic anhydride, phthalic anhydride, dodecyl succinic anhydride, dichloromaleic anhydride, tetrachlorophthalic anhydride, tetrahydrophthalic anhydride, pimelic anhydride Products; Oxetane compounds such as 3,3-dimethyloxetane, 3,3-dichloromethyloxetane, 3-methyl-3-hydroxymethyloxetane, azidomethylmethyloxetane; bisphenol A diglycidyl ether, bisphenol F diglycol Zyl ether, phenol novolac polyglycidyl ether, N, N-diglycidyl-p-aminophenol glycidyl ether, tetrabromobisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether (ie 2,2-bis (4-glycidyloxy) Glycidyl ether compounds such as cyclohexyl) propane); N, N-diglycidylaniline, tetraglycidyldiaminodiphenylmethane, N, N, N, N-tetraglycidyl-m-xylylenediamine, triglycidyl isocyanurate, N, N-diglycidyl Glycidylamine compounds such as -5,5-dialkylhydantoin; diethylenetriamine, triethylenetetramine, dimethylaminopropylamine, N-aminoethylpiperazine, benzene Dimethylamine, tris (dimethylaminomethyl) phenol, DHP30-tri (2-ethylhexoate), metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, dicyandiamide, boron trifluoride, monoethylamine, methanediamine, xylenediamine And amine compounds such as ethyl methyl imidazole; among compounds containing two or more oxirane rings in one molecule, glycidyl compounds by epichlorohydrin of bisphenol A, or the like;
反応型重合体においては、少なくとも2官能以上の架橋剤を使用する。その架橋剤としては、例えば、メラミン樹脂、エポキシ樹脂、金属酸化物などが挙げられる。金属酸化物としては、塩基性金属化合物のAl(OH)3、Al(OOC・CH3)2(OOCH)、Al(OOC・CH3)3、ZrO(OCH3)、Mg(OOC・CH3)2、Ca(OH)2、Ba(OH)3等を適宜使用できる。 In the reactive polymer, at least a bifunctional or higher functional crosslinking agent is used. Examples of the crosslinking agent include melamine resin, epoxy resin, metal oxide and the like. Examples of the metal oxide include basic metal compounds Al (OH) 3 , Al (OOC · CH 3 ) 2 (OOCH), Al (OOC · CH 3 ) 3 , ZrO (OCH 3 ), Mg (OOC · CH 3). ) 2 , Ca (OH) 2 , Ba (OH) 3 and the like can be used as appropriate.
自己架橋型重合体は、加熱により官能基同士で自己架橋するものであり、例えば、グリシジル基とカルボキシ基を含むもの、あるいは、N−メチロールとカルボキシ基の両方を含むものなどが挙げられる。 Self-crosslinking polymers are those that self-crosslink between functional groups by heating, and examples include those containing a glycidyl group and a carboxy group, and those containing both an N-methylol and a carboxy group.
光エネルギーによって硬化する液状重合体としては、例えば、ポリエステル、エポキシ樹脂、オキセタン樹脂、ポリアクリル、ポリウレタン、ポリイミド、ポリアミド、ポリアミドイミド、ポリイミドシリコーン等のオリゴマーまたはプレポリマーが挙げられる。光エネルギーによって硬化する液状重合体を構成する単量体単位としては、例えば、ビスフェノールA・エチレンオキサイド変性ジアクリレート、ジペンタエリスリトールヘキサ(ペンタ)アクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジプロピレングリコールジアクリレート、トリメチロールプロパントリアクリレート、グリセリンプロポキシトリアクリレート、4−ヒドロキシブチルアクリレート、1,6−ヘキサンジオールジアクリレート、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、イソボルニルアクリレート、ポリエチレングリコールジアクリレート、ペンタエリスリトールトリアクリレート、テトラヒドロフルフリルアクリレート、トリメチロールプロパントリアクリレート、トリプロピレングリコールジアクリレート等のアクリレート類; テトラエチレングリコールジメタクリレート、アルキルメタクリレート、アリルメタクリレート、1,3−ブチレングリコールジメタクリレート、n−ブチルメタクリレート、ベンジルメタクリレート、シクロヘキシルメタクリレート、ジエチレングリコールジメタクリレート、2−エチルヘキシルメタクリレート、グリシジルメタクリレート、1,6−ヘキサンジオールジメタクリレート、2−ヒドロキシエチルメタクリレート、イソボルニルメタクリレート、ラウリルメタクリレート、フェノキシエチルメタクリレート、t−ブチルメタクリレート、テトラヒドロフルフリルメタクリレート、トリメチロールプロパントリメタクリレート等のメタクリレート類; アリルグリシジルエーテル、ブチルグリシジルエーテル、高級アルコールグリシジルエーデル、1,6−ヘキサンジオールグリシジルエーテル、フェニルグリシジルエーテル、ステアリルグリシジルエーテル等のグリシジルエーテル類; ダイアセトンアクリルアミド、N,N−ジメチルアクリルアミド、ジメチルアミノプロピルアクリルアミド、ジメチルアミノプロピルメタクリルアミド、メタクリルアミド、N−メチロールアクリルアミド、N,N−ジメチルアクリルアミド、アクリロイルモルホリン、N−ビニルホルムアミド、N−メチルアクリルアミド、N−イソプロピルアクリルアミド、N−t−ブチルアクリルアミド、N−フェニルアクリルアミド、アクリロイルピペリジン、2−ヒドロキシエチルアクリルアミド等のアクリル(メタクリル)アミド類; 2−クロロエチルビニルエーテル、シクロヘキシルビニルエーテル、エチルビニルエーテル、ヒドロキシブチルビニルエーテル、イソブチルビニルエーテル、トリエチレングリコールビニルエーテル等のビニルエーテル類; 酪酸ビニル、モノクロロ酢酸ビニル、ピバリン酸ビニル等のカルボン酸ビニルエステル類の単官能モノマー並びに多官能モノマーが挙げられる。 Examples of the liquid polymer that is cured by light energy include oligomers or prepolymers such as polyester, epoxy resin, oxetane resin, polyacryl, polyurethane, polyimide, polyamide, polyamideimide, and polyimide silicone. Examples of monomer units constituting a liquid polymer that is cured by light energy include bisphenol A / ethylene oxide-modified diacrylate, dipentaerythritol hexa (penta) acrylate, dipentaerythritol monohydroxypentaacrylate, and dipropylene glycol diacrylate. Acrylate, trimethylolpropane triacrylate, glycerin propoxytriacrylate, 4-hydroxybutyl acrylate, 1,6-hexanediol diacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isobornyl acrylate, polyethylene glycol diacrylate, Pentaerythritol triacrylate, tetrahydrofurfuryl acrylate, trimethylolpropane tria Acrylates such as relate and tripropylene glycol diacrylate; tetraethylene glycol dimethacrylate, alkyl methacrylate, allyl methacrylate, 1,3-butylene glycol dimethacrylate, n-butyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, diethylene glycol dimethacrylate, 2- Such as ethylhexyl methacrylate, glycidyl methacrylate, 1,6-hexanediol dimethacrylate, 2-hydroxyethyl methacrylate, isobornyl methacrylate, lauryl methacrylate, phenoxyethyl methacrylate, t-butyl methacrylate, tetrahydrofurfuryl methacrylate, trimethylolpropane trimethacrylate, etc. Methacrylates Glycidyl ethers such as allyl glycidyl ether, butyl glycidyl ether, higher alcohol glycidyl edel, 1,6-hexanediol glycidyl ether, phenyl glycidyl ether, stearyl glycidyl ether; diacetone acrylamide, N, N-dimethylacrylamide, dimethylaminopropyl Acrylamide, dimethylaminopropyl methacrylamide, methacrylamide, N-methylolacrylamide, N, N-dimethylacrylamide, acryloylmorpholine, N-vinylformamide, N-methylacrylamide, N-isopropylacrylamide, Nt-butylacrylamide, N- Acrylics such as phenylacrylamide, acryloylpiperidine, 2-hydroxyethylacrylamide, etc. (Meth) amides; vinyl ethers such as 2-chloroethyl vinyl ether, cyclohexyl vinyl ether, ethyl vinyl ether, hydroxybutyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether; vinyl carboxylates such as vinyl butyrate, vinyl monochloroacetate and vinyl pivalate Examples thereof include monofunctional monomers and polyfunctional monomers of esters.
光エネルギーによって硬化する液状重合体は、光重合開始剤によって硬化する。その光重合開始剤としては、アセトフェノン類、ベンゾフェノン類、ミヒラーベンゾイルベンゾエート、α−アミロキシムエステル、テトラメチルチウラムモノサルファイド、チオキサントン類などが挙げられる。さらに、光増感剤として、n−ブチルアミン、トリエチルアミン、トリ−n−ブチルホスフィン等を混合できる。また、カチオン重合開始剤としては、アリールジアゾニウム塩類、ジアリールハロニウム塩類、トリフェニルスルホニウム塩類、シラノール/アルミニウムキレート、α−スルホニルオキシケトン類等が挙げられる。 A liquid polymer that is cured by light energy is cured by a photopolymerization initiator. Examples of the photopolymerization initiator include acetophenones, benzophenones, Michler benzoylbenzoate, α-amyloxime ester, tetramethylthiuram monosulfide, thioxanthones and the like. Furthermore, n-butylamine, triethylamine, tri-n-butylphosphine, or the like can be mixed as a photosensitizer. Examples of the cationic polymerization initiator include aryldiazonium salts, diarylhalonium salts, triphenylsulfonium salts, silanol / aluminum chelates, α-sulfonyloxyketones, and the like.
上記バインダ樹脂の量は、特に限定されるものではないが、導電性高分子の固形分(ポリ(3,4−ジアルコキシチオフェン)とポリアニオンとからなる複合体)100質量部に対して、固形分換算で10〜10,000質量部、特に50〜4,000質量部とするのが好ましい。 The amount of the binder resin is not particularly limited, but is solid with respect to 100 parts by mass of a conductive polymer solid (poly (3,4-dialkoxythiophene) and polyanion complex). It is preferably 10 to 10,000 parts by mass, particularly 50 to 4,000 parts by mass in terms of minutes.
(4)その他
その他に導電性組成物に含め得る成分としては、例えば、充填剤、架橋剤、紫外線吸収剤、酸化防止剤、重合禁止剤、表面改質剤、脱泡剤、可塑剤、抗菌剤、界面活性剤、金属微粒子などを好適に挙げることができる。これらの成分は、1種単独または2種以上を併用しても良い。さらには、上記成分に属する材料も1種のみを用いても良く、あるいは2種以上を併用しても良い。
(4) Others Other components that can be included in the conductive composition include, for example, a filler, a crosslinking agent, an ultraviolet absorber, an antioxidant, a polymerization inhibitor, a surface modifier, a defoaming agent, a plasticizer, and an antibacterial agent. Preferable examples include agents, surfactants, and metal fine particles. These components may be used alone or in combination of two or more. Furthermore, only one type of material belonging to the above components may be used, or two or more types may be used in combination.
3.塗膜を有するフィルムおよびその製造方法
この実施の形態に係る導電性高分子または導電性組成物は、それを用いて塗膜を形成したフィルムに利用できる。上記導電性高分子または上記導電性組成物は、優れた導電性を発揮するのみならず、透明性、高温下での放置による導電性の低下の少ない高耐熱性などの性能も保持する。このことから、上記導電性高分子または上記導電性組成物は、帯電防止フィルムの他、導電性塗料、固体電解コンデンサ、タッチスクリーン、有機LED、有機EL、リチウム二次電池、有機薄膜太陽電池、導電性高分子繊維などにも利用できる。
3. Film having Coating Film and Manufacturing Method Thereof The conductive polymer or conductive composition according to this embodiment can be used for a film having a coating film formed thereon. The conductive polymer or the conductive composition not only exhibits excellent conductivity, but also retains performance such as transparency and high heat resistance with little decrease in conductivity due to standing at high temperatures. From this, the conductive polymer or the conductive composition includes an antistatic film, a conductive paint, a solid electrolytic capacitor, a touch screen, an organic LED, an organic EL, a lithium secondary battery, an organic thin film solar battery, It can also be used for conductive polymer fibers.
この実施の形態に係る塗膜を有するフィルムは、基材となるフィルム(基材フィルムという)と、該基材フィルムの少なくとも片面に形成された導電性塗膜とを有する。上記導電性高分子または上記導電性組成物を導電体として用いてなる塗膜を有するフィルムを製造する場合、基材フィルムに導電性高分子または導電性組成物の分散液を塗布した後、あるいは基材フィルムを当該分散液中に浸漬した後、乾燥によって揮発成分を除去することにより、塗膜を有するフィルムを得ることができる。乾燥温度は、特に限定されないが、好適には40℃以上で、かつ塗膜や基材フィルムにダメージを与えない温度以下である。 The film having a coating film according to this embodiment includes a film serving as a base material (referred to as a base film) and a conductive coating film formed on at least one surface of the base film. When manufacturing a film having a coating film using the conductive polymer or the conductive composition as a conductor, after applying a dispersion of the conductive polymer or conductive composition to the base film, or A film having a coating film can be obtained by immersing the base film in the dispersion and then removing volatile components by drying. The drying temperature is not particularly limited, but is preferably 40 ° C. or higher and not higher than the temperature at which the coating film or the substrate film is not damaged.
基材フィルムへ上記分散液の供給法の具体例としては、スピンコート法、ローラコート法、バーコート法、ディップコート法、グラビアコート法、カーテンコート法、ダイコート法、スプレーコート法、ドクターブレードコート法、ニーダーコート法などを挙げることができる。基材フィルムは、特に限定されるものではなく、透明な材料で成る基体であればより好ましく、その材料の種類、基体の形状、構造、大きさ、厚みなどについては、目的に応じて適宜選択できる。本明細書において、「透明」は、無色透明の他、有色透明、無色半透明および有色半透明のいずれをも含むように広義に解釈される。透明な基体の材料としては、例えば、樹脂を好適に挙げることができる。当該樹脂の種類は、特に限定されるものではなく目的に応じて適宜選択でき、例えば、ポリエチレンテレフタレート樹脂(結晶性または非晶性)、ポリブチレンテレフタレート樹脂(結晶性または非晶性)、ポリエチレンナフタレート樹脂(結晶性または非晶性)、ポリ塩化ビニル樹脂、ポリエーテルサルホン樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリイミド樹脂、ポリエーテルイミド樹脂、ポリ酢酸ビニル樹脂、ポリ塩化ビニリデン樹脂、ポリフッ化ビニリデン樹脂、ポリビニルアルコール樹脂、ポリビニルアセタール樹脂、ポリビニルブチラール樹脂、ポリアクリロニトリル樹脂、ポリオレフィン樹脂、ポリスチレン樹脂、ポリアミド樹脂、ポリブタジエン樹脂、酢酸セルロース、硝酸セルロース、アクリロニトリル−ブタジエン−スチレン共重合樹脂(ABS樹脂)などを挙げることができ、これらの内の1種を用い、あるいは2種以上を併用しても良い。シートを延伸処理する場合には、非晶性ポリエチレンテレフタレートフィルムまたはポリスチレンフィルムなどのようにガラス転移温度の低い樹脂フィルムを好適に用いる。基材フィルムとして、ガラス転移温度の低い樹脂フィルムを用いる場合には、表面外観の劣化を防止するために、乾燥温度を80℃以下にすることが好ましい。 Specific examples of the method for supplying the dispersion to the base film include spin coating, roller coating, bar coating, dip coating, gravure coating, curtain coating, die coating, spray coating, and doctor blade coating. Method, kneader coating method and the like. The base film is not particularly limited, and is preferably a base made of a transparent material. The type of the material, the shape, structure, size, thickness, etc. of the base are appropriately selected according to the purpose. it can. In this specification, “transparent” is broadly interpreted to include any of transparent and colorless, colorless and translucent, and colored and translucent. As a material for the transparent substrate, for example, a resin can be preferably cited. The type of the resin is not particularly limited and can be appropriately selected depending on the purpose. For example, polyethylene terephthalate resin (crystalline or amorphous), polybutylene terephthalate resin (crystalline or amorphous), polyethylene naphthalate. Phthalate resin (crystalline or amorphous), polyvinyl chloride resin, polyether sulfone resin, polycarbonate resin, polystyrene resin, polyimide resin, polyetherimide resin, polyvinyl acetate resin, polyvinylidene chloride resin, polyvinylidene fluoride resin , Polyvinyl alcohol resin, polyvinyl acetal resin, polyvinyl butyral resin, polyacrylonitrile resin, polyolefin resin, polystyrene resin, polyamide resin, polybutadiene resin, cellulose acetate, cellulose nitrate, acrylonitrile-butane Ene - styrene copolymer resin (ABS resin) can be mentioned, with one of these, or may be used in combination of two or more. When the sheet is stretched, a resin film having a low glass transition temperature, such as an amorphous polyethylene terephthalate film or a polystyrene film, is preferably used. When using a resin film having a low glass transition temperature as the substrate film, it is preferable to set the drying temperature to 80 ° C. or lower in order to prevent deterioration of the surface appearance.
この実施の形態に係る塗膜を有するフィルムにおいて、上記導電性高分子または上記導電性組成物の分散液により形成される塗膜の厚みは、特に限定されるものではなく目的に応じて適宜選択でき、例えば、好適には、0.01〜10μmの範囲に設定できる。塗膜の厚みを0.01μm以上とすると、塗膜を有するフィルムの表面抵抗率をより安定化させることができ、塗膜の厚みを10μm以下とすると、透明な基体と塗膜との密着性をより高めることができる。 In the film having the coating film according to this embodiment, the thickness of the coating film formed by the dispersion of the conductive polymer or the conductive composition is not particularly limited and is appropriately selected depending on the purpose. For example, it can be suitably set in the range of 0.01 to 10 μm. When the thickness of the coating film is 0.01 μm or more, the surface resistivity of the film having the coating film can be further stabilized, and when the thickness of the coating film is 10 μm or less, the adhesion between the transparent substrate and the coating film Can be further enhanced.
次に、製造例と、実施例及び比較例とを示して、本発明を具体的に説明するが、本発明は、以下の実施例に限定されるものではない。なお、下記の例において、部および%は、それぞれ質量部および質量%を意味する。 Next, although a manufacture example, an Example, and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example. In the following examples, parts and% mean mass parts and mass%, respectively.
1.ポリアニオンの合成
<製造例1>
1000mlのイオン交換水に206gのスチレンスルホン酸ナトリウムを溶解し、80℃にて攪拌しながら、予め10mlの水に溶解した3gの過硫酸アンモニウム溶液を2時間滴下し、その溶液を6時間攪拌した。得られたポリスチレンスルホン酸ナトリウム溶液に対して、陽イオン交換樹脂200gを用いて2回処理した。その後、固形分が5%になるように、イオン交換水を加えて調整した。GPC(ゲル濾過クロマトグラフィ)カラムを用いたHPLC(高速液体クロマトグラフィ)システムを用いて、得られたポリスチレンスルホン酸の分析を行った。昭和電工株式会社製のプルランを標準物質として重量平均分子量(Mw)を測定した結果、ポリスチレンスルホン酸のMwは約20万であった。
<製造例2>
製造例1の3gの過硫酸アンモニウムを1gに変えた事以外は製造例1と同じにして、固形分が5%のポリスチレンスルホン酸溶液を得た。GPC(ゲル濾過クロマトグラフィ)カラムを用いたHPLC(高速液体クロマトグラフィ)システムを用いて、得られたポリスチレンスルホン酸の分析を行った。昭和電工株式会社製のプルランを標準物質として重量平均分子量(Mw)を測定した結果、ポリスチレンスルホン酸のMwは約40万であった。
1. Synthesis of polyanion <Production Example 1>
In 1000 ml of ion-exchanged water, 206 g of sodium styrenesulfonate was dissolved. While stirring at 80 ° C., 3 g of ammonium persulfate solution previously dissolved in 10 ml of water was added dropwise for 2 hours, and the solution was stirred for 6 hours. The obtained sodium polystyrene sulfonate solution was treated twice with 200 g of cation exchange resin. Then, ion-exchange water was added and adjusted so that solid content might be 5%. The obtained polystyrene sulfonic acid was analyzed using a HPLC (high performance liquid chromatography) system using a GPC (gel filtration chromatography) column. As a result of measuring the weight average molecular weight (Mw) using pullulan manufactured by Showa Denko KK as a standard substance, the Mw of polystyrene sulfonic acid was about 200,000.
<Production Example 2>
A polystyrene sulfonic acid solution having a solid content of 5% was obtained in the same manner as in Production Example 1 except that 3 g of ammonium persulfate in Production Example 1 was changed to 1 g. The obtained polystyrene sulfonic acid was analyzed using a HPLC (high performance liquid chromatography) system using a GPC (gel filtration chromatography) column. As a result of measuring the weight average molecular weight (Mw) using pullulan manufactured by Showa Denko KK as a standard substance, the Mw of polystyrene sulfonic acid was about 400,000.
2.導電性高分子の製造
(1)実施例
表1〜4に各実施例の製造条件と成膜後の評価結果をまとめて示す。
<実施例1>
5gの3,4−エチレンジオキシチオフェン(EDOT)と、上記製造例1にて得られたポリスチレンスルホン酸水溶液100g(固形分:5g)を1000mlのイオン交換水に溶かした溶液と、0.25g(EDOT1モルに対して0.06モル相当)の2,4,7,9−テトラメチル−5−デシン−4,7−ジオール(アセチレングリコール系界面活性剤の一種)を混合した。次に、当該混合後の溶液を30℃に保ち攪拌を行いながら、3gの硫酸第二鉄と10gの過硫酸アンモニウムをそれぞれ50mlのイオン交換水に溶かした酸化触媒溶液をゆっくり加え、4時間攪拌して反応させた。これにより得られた反応液に陽イオン交換樹脂と陰イオン交換樹脂をそれぞれ100g用いて2回処理し、続いて、溶液中の固形分が1%になるように、イオン交換水を加えて、導電性高分子の固形分濃度を調整した。
<実施例2>
表1に示すように、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例3>
表1に示すように、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例4>
表1に示すように、ポリスチレンスルホン酸水溶液を150gに増やし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例5>
表1に示すように、ポリスチレンスルホン酸水溶液を150gに増やし、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例6>
表1に示すように、ポリスチレンスルホン酸水溶液を150gに増やし、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例7>
表2に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例8>
表2に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例9>
表2に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例10>
表2に示すように、アセチレングリコール系界面活性剤をEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例11>
表2に示すように、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例12>
表2に示すように、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例13>
表3に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、アセチレングリコール系界面活性剤をEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例14>
表3に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例15>
表3に示すように、ポリスチレンスルホン酸水溶液を200gに増やし、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例16>
表3に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、かつ150gに増やし、アセチレングリコール系界面活性剤をEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例17>
表3に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、かつ150gに増やし、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例18>
表3に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、かつ150gに増やし、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例19>
表4に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、アセチレングリコール系界面活性剤をEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例20>
表4に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、アセチレングリコール系界面活性剤を3,6−ジメチル−4−オクチン−3,6−ジオールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<実施例21>
表4に示すように、ポリスチレンスルホン酸水溶液を製造例2で得たMw=40万のものに代え、アセチレングリコール系界面活性剤を3,5−ジメチル−1−ヘキシン−3−オールに代え、かつEDOT1モルに対して0.01モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
2. Production of Conductive Polymer (1) Examples Tables 1 to 4 collectively show the production conditions of each example and the evaluation results after film formation.
<Example 1>
5 g of 3,4-ethylenedioxythiophene (EDOT) and a solution of 100 g (solid content: 5 g) of the polystyrenesulfonic acid aqueous solution obtained in Production Example 1 in 1000 ml of ion-exchanged water, 0.25 g 2,4,7,9-Tetramethyl-5-decyne-4,7-diol (a kind of acetylene glycol surfactant) was mixed (equivalent to 0.06 mol with respect to 1 mol of EDOT). Next, while keeping the mixed solution at 30 ° C. while stirring, an oxidation catalyst solution prepared by dissolving 3 g of ferric sulfate and 10 g of ammonium persulfate in 50 ml of ion-exchanged water is slowly added and stirred for 4 hours. And reacted. The reaction solution thus obtained was treated twice with 100 g each of cation exchange resin and anion exchange resin, and then ion exchange water was added so that the solid content in the solution was 1%. The solid content concentration of the conductive polymer was adjusted.
<Example 2>
As shown in Table 1, the acetylene glycol surfactant was replaced with 3,6-dimethyl-4-octyne-3,6-diol, and a solution having a solid content of 1% was prepared in the same manner as in Example 1 except for the other conditions. Obtained.
<Example 3>
As shown in Table 1, the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol, and other conditions were obtained in the same manner as in Example 1 to obtain a solution having a solid content of 1%. .
<Example 4>
As shown in Table 1, the polystyrene sulfonic acid aqueous solution was increased to 150 g, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
<Example 5>
As shown in Table 1, the polystyrene sulfonic acid aqueous solution was increased to 150 g, the acetylene glycol surfactant was replaced with 3,6-dimethyl-4-octyne-3,6-diol, and other conditions were the same as in Example 1. To obtain a 1% solids solution.
<Example 6>
As shown in Table 1, the polystyrene sulfonic acid aqueous solution was increased to 150 g, the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol, and other conditions were the same as in Example 1. A 1% solids solution was obtained.
<Example 7>
As shown in Table 2, the polystyrene sulfonic acid aqueous solution was increased to 200 g, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
<Example 8>
As shown in Table 2, the polystyrene sulfonic acid aqueous solution was increased to 200 g, the acetylene glycol surfactant was replaced with 3,6-dimethyl-4-octyne-3,6-diol, and other conditions were the same as in Example 1. To obtain a 1% solids solution.
<Example 9>
As shown in Table 2, the polystyrene sulfonic acid aqueous solution was increased to 200 g, the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol, and other conditions were the same as in Example 1. A 1% solids solution was obtained.
<Example 10>
As shown in Table 2, the acetylene glycol surfactant was reduced to 0.01 mol with respect to 1 mol of EDOT, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
<Example 11>
As shown in Table 2, the acetylene glycol surfactant was replaced with 3,6-dimethyl-4-octyne-3,6-diol and reduced to 0.01 mol with respect to 1 mol of EDOT, and other conditions were carried out. In the same manner as in Example 1, a solution having a solid content of 1% was obtained.
<Example 12>
As shown in Table 2, the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol and reduced to 0.01 mol with respect to 1 mol of EDOT. In the same manner, a solution having a solid content of 1% was obtained.
<Example 13>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was increased to 200 g, the acetylene glycol surfactant was reduced to 0.01 mol with respect to 1 mol of EDOT, and the other conditions were the same as in Example 1 with a solid content of 1%. Solution was obtained.
<Example 14>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was increased to 200 g, the acetylene glycol surfactant was replaced with 3,6-dimethyl-4-octyne-3,6-diol, and 0.01 mol per 1 mol of EDOT. A solution having a solid content of 1% was obtained in the same manner as in Example 1 except that the number of moles was reduced.
<Example 15>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was increased to 200 g, the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol, and 0.01 mol relative to 1 mol of EDOT. A solution having a solid content of 1% was obtained in the same manner as in Example 1 except for the above.
<Example 16>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was replaced with the one having Mw = 400,000 obtained in Production Example 2 and increased to 150 g, and the acetylene glycol surfactant was reduced to 0.01 mol with respect to 1 mol of EDOT. A solution having a solid content of 1% was obtained in the same manner as in Example 1 under the other conditions.
<Example 17>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was replaced with the Mw = 400,000 obtained in Production Example 2 and increased to 150 g, and the acetylene glycol surfactant was changed to 3,6-dimethyl-4-octyne-3. , 6-diol, and reduced to 0.01 mol with respect to 1 mol of EDOT, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
<Example 18>
As shown in Table 3, the polystyrene sulfonic acid aqueous solution was replaced with the Mw = 400,000 obtained in Production Example 2 and increased to 150 g, and the acetylene glycol surfactant was changed to 3,5-dimethyl-1-hexyne-3. -It replaced with oar and reduced to 0.01 mol with respect to 1 mol of EDOT, and the other conditions were carried out similarly to Example 1, and obtained the solution of 1% of solid content.
<Example 19>
As shown in Table 4, the polystyrene sulfonic acid aqueous solution was replaced with the one having Mw = 400,000 obtained in Production Example 2, and the acetylene glycol surfactant was reduced to 0.01 mol with respect to 1 mol of EDOT, and other conditions were changed. A solution having a solid content of 1% was obtained in the same manner as in Example 1.
<Example 20>
As shown in Table 4, the polystyrene sulfonic acid aqueous solution was replaced with the one having Mw = 400,000 obtained in Production Example 2, and the acetylene glycol surfactant was changed to 3,6-dimethyl-4-octyne-3,6-diol. The solution was reduced to 0.01 mol with respect to 1 mol of EDOT.
<Example 21>
As shown in Table 4, the polystyrene sulfonic acid aqueous solution was replaced with the one having Mw = 400,000 obtained in Production Example 2, and the acetylene glycol surfactant was replaced with 3,5-dimethyl-1-hexyn-3-ol. And it reduced to 0.01 mol with respect to 1 mol of EDOT, and other conditions were carried out similarly to Example 1, and obtained the solution of 1% of solid content.
上記の表1〜4および後述の表5中、界面活性剤A〜Cは、以下の通りである。
A〜C: アセチレングリコール系界面活性剤
A: 2,4,7,9−テトラメチル−5−デシン−4,7−ジオール
B: 3,6−ジメチル−4−オクチン−3,6−ジオール
C: 3,5−ジメチル−1−ヘキシン−3−オール
In Tables 1 to 4 and Table 5 described later, surfactants A to C are as follows.
A to C: Acetylene glycol surfactant A: 2,4,7,9-tetramethyl-5-decyne-4,7-diol B: 3,6-dimethyl-4-octyne-3,6-diol C : 3,5-dimethyl-1-hexyn-3-ol
(2)比較例
表5に各比較例の製造条件と成膜後の評価結果をまとめて示す。
<比較例1>
5gの3,4−エチレンジオキシチオフェン(EDOT)と、上記製造例1にて得られたポリスチレンスルホン酸水溶液200g(固形分:10g)を1000mlのイオン交換水に溶かした溶液とを混合した。その後の工程については実施例1と同様に行った。
<比較例2>
表5に示すように、ポリスチレンスルホン酸水溶液を100gに減らし、その他の条件を比較例1と同様にして固形分1%の溶液を得た。
<比較例3>
表5に示すように、比較例1で調整した試料300gに、2,4,7,9−テトラメチル−5−デシン−4,7−ジオールを0.05g(EDOT1モルに対して0.06モル相当)加えて、攪拌を30分行い、評価用の試料とした。
<比較例4>
表5に示すように、アセチレングリコール系界面活性剤を、EDOT1モルに対して0.0005モルに減らし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
<比較例5>
表5に示すように、アセチレングリコール系界面活性剤を、EDOT1モルに対して0.6モルに増やし、その他の条件を実施例1と同様にして固形分1%の溶液を得た。
(2) Comparative Example Table 5 summarizes the manufacturing conditions of each comparative example and the evaluation results after film formation.
<Comparative Example 1>
5 g of 3,4-ethylenedioxythiophene (EDOT) was mixed with a solution obtained by dissolving 200 g (solid content: 10 g) of the polystyrenesulfonic acid aqueous solution obtained in Production Example 1 in 1000 ml of ion-exchanged water. Subsequent steps were performed in the same manner as in Example 1.
<Comparative example 2>
As shown in Table 5, the polystyrenesulfonic acid aqueous solution was reduced to 100 g, and the other conditions were the same as in Comparative Example 1 to obtain a solution having a solid content of 1%.
<Comparative Example 3>
As shown in Table 5, 0.05 g of 2,4,7,9-tetramethyl-5-decyne-4,7-diol was added to 300 g of the sample prepared in Comparative Example 1 (0.06 with respect to 1 mol of EDOT). In addition, stirring was performed for 30 minutes to obtain a sample for evaluation.
<Comparative example 4>
As shown in Table 5, the acetylene glycol surfactant was reduced to 0.0005 mol with respect to 1 mol of EDOT, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
<Comparative Example 5>
As shown in Table 5, the acetylene glycol surfactant was increased to 0.6 mol with respect to 1 mol of EDOT, and the other conditions were the same as in Example 1 to obtain a solution having a solid content of 1%.
3.評価方法
(1)固形分濃度の測定方法
試料約1gをアルミニウム箔製の皿に計り取り、105〜110℃に保った乾燥機に入れて1時間加熱した後、乾燥機より試料を取り出して、デシケーターの中で放冷した。試料の乾燥後の重量を測定し、次式により、固形分濃度を算出した。
3. Evaluation Method (1) Method for Measuring Solid Concentration About 1 g of a sample was weighed on an aluminum foil dish, placed in a dryer maintained at 105 to 110 ° C. and heated for 1 hour, then the sample was taken out of the dryer. It was allowed to cool in a desiccator. The weight of the sample after drying was measured, and the solid content concentration was calculated by the following formula.
(2)導電性の測定方法
各1%溶液にジメチルスルホキシド(DMSO)を5質量%添加後、ガラス上にドクターブレードにより塗布し、塗布膜を150℃のオーブン中で乾燥させて、厚さ約1μmの塗膜を得た。得られた塗膜の電気伝導度をローレスタ(三菱化学アナリテック社製: ロレスタGP MCP−T610)を用いて測定した。
(2) Conductivity measurement method After adding 5% by mass of dimethyl sulfoxide (DMSO) to each 1% solution, it was coated on glass with a doctor blade, and the coated film was dried in an oven at 150 ° C. to a thickness of about A 1 μm coating film was obtained. The electrical conductivity of the obtained coating film was measured using a Loresta (Mitsubishi Chemical Analytech Co., Ltd. product: Loresta GP MCP-T610).
(3)耐熱性の測定方法
式・・・耐熱性(%)=(初期導電性−加熱処理後の導電性)×100/初期導電性
導電性測定試料を150℃の雰囲気下で40時間加熱処理し、加熱処理後の電気伝導度をローレスタ(三菱化学アナリテック社製: ロレスタGP MCP−T610)を用いて測定した。耐熱性は、上記式にて計算した。
(3) Heat resistance measurement method Formula: Heat resistance (%) = (initial conductivity-conductivity after heat treatment) x 100 / initial conductivity Conductivity measurement sample is heated at 150 ° C for 40 hours The electrical conductivity after the heat treatment was measured using a Loresta (Mitsubishi Chemical Analytech Co., Ltd .: Loresta GP MCP-T610). The heat resistance was calculated by the above formula.
(4)表面抵抗値の測定方法
各1%溶液にジメチルスルホキシド(DMSO)を5質量%添加後、メタノールにて倍量に希釈し、PETフィルム(三菱化学株式会社製、DIAFOIL T680E100)上に#8バーコーターで上記希釈した液を塗布した後、熱風乾燥機を用いて100℃×1分間の条件で乾燥した。得られたフィルムの表面抵抗値は、ローレスタ(三菱化学アナリテック社製: ロレスタGP MCP−T610)を用いて測定した。
(4) Method for measuring surface resistance value After adding 5% by mass of dimethyl sulfoxide (DMSO) to each 1% solution, the solution was diluted with methanol and diluted to a double amount on a PET film (manufactured by Mitsubishi Chemical Corporation, DIAFOIL T680E100). After the diluted liquid was applied with an 8 bar coater, it was dried at 100 ° C. for 1 minute using a hot air dryer. The surface resistance value of the obtained film was measured using Loresta (Mitsubishi Chemical Analytech Co., Ltd .: Loresta GP MCP-T610).
(5)透過率の測定方法
表面抵抗値の測定に用いたフィルムの透過率を、ヘイズメーターNDH5000(日本電色社製)を用いて測定した。
(5) Measuring method of transmittance The transmittance of the film used for measuring the surface resistance value was measured using a haze meter NDH5000 (manufactured by Nippon Denshoku).
4.評価結果
表1〜5に、実施例1〜21および比較例1〜5の各条件にて作製した試料の各種評価結果を示す。
4). Evaluation results Tables 1 to 5 show various evaluation results of samples prepared under the conditions of Examples 1 to 21 and Comparative Examples 1 to 5.
表1〜5の評価結果から明らかなように、実施例1〜21により得られた導電性組成物から形成した塗膜は、比較例1〜5により得られたそれらと比べ、透過率に対する表面抵抗値が低かった。すなわち、各実施例により作製した導電性高分子を用いることにより、透過率の向上と表面抵抗値の低下という従来相反する性能が両立した塗膜を得ることができた。 As is clear from the evaluation results in Tables 1 to 5, the coating films formed from the conductive compositions obtained in Examples 1 to 21 were compared with those obtained in Comparative Examples 1 to 5, and the surface relative to the transmittance. The resistance value was low. That is, by using the conductive polymer produced in each example, it was possible to obtain a coating film in which the contradictory performances of improvement in transmittance and reduction in surface resistance value were compatible.
本発明は、例えば、帯電防止フィルム、導電性塗料、固体電解コンデンサ、タッチスクリーン、有機LED、有機EL、リチウム二次電池、有機薄膜太陽電池、導電性高分子繊維などに有効に利用できる。 The present invention can be effectively used for, for example, an antistatic film, a conductive paint, a solid electrolytic capacitor, a touch screen, an organic LED, an organic EL, a lithium secondary battery, an organic thin film solar battery, and a conductive polymer fiber.
Claims (5)
ポリアニオン;および、
以下の式(2)および式(3)
で表されるアセチレングリコール系界面活性剤のうち少なくとも1種の存在下、水系溶媒中で化学的酸化重合させ、上記アセチレングリコール系界面活性剤を上記3,4−ジアルコキシチオフェン1モルに対して0.001〜0.5モルとする導電性高分子の製造方法。 3,4-dialkoxythiophene represented by the following formula (1)
A polyanion; and
The following formulas (2) and (3)
In at least one presence of acetylene glycol surfactant represented, in an aqueous solvent to chemical oxidation polymerization, the upper Symbol acetylene glycol surfactant in the 3,4-dialkoxythiophene 1 mole The manufacturing method of the conductive polymer made into 0.001-0.5 mol with respect to.
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