JP5996999B2 - Wire saw apparatus and wafer manufacturing method using the same - Google Patents

Description

  The present invention relates to a wire saw apparatus that slices, for example, a semiconductor ingot or the like into a plurality of thin wafers, and a wafer manufacturing method using the same.

  For example, a wire saw apparatus that slices a workpiece made of, for example, a semiconductor ingot into a plurality of thin wafers has been known. Such a wire saw device generally includes two main rollers formed in a spiral shape on the outer periphery and arranged to face each other at a predetermined interval, and adjacent engagement grooves of each main roller so as to bridge between the main rollers. And both ends thereof are arranged between one wire wound around the wire take-up bobbin and the wire feed-out bobbin, and the main roller, the wire take-up bobbin and the wire feed-out bobbin, respectively. A plurality of auxiliary rollers. The workpiece is sliced by pressing the workpiece against the wire row formed between the main rollers (see, for example, Patent Document 1).

  The wire saw device disclosed in Patent Document 1 sends out a new wire from a wire delivery bobbin each time a predetermined amount of slicing of a workpiece by a wire row is performed, changes the wire row to a new wire row, and repeats the same operation. This invention realizes an invention relating to a configuration in which the end of a new wire is temporarily fixed and held when the wires are exchanged after all the wires are finally used for a machining operation.

Japanese Patent No. 3484718

  However, the length of the wire wound around the wire delivery bobbin of the wire saw device is very long, and actually, the wire exchange operation is not performed so frequently. On the other hand, the wire engaging groove formed on the main roller and the wire engaging groove formed on the auxiliary roller are formed by processing a groove forming member made of urethane forming a part of these rollers. . Since the diameter of the auxiliary roller is considerably smaller than the diameter of the main roller, the number of rotations of the auxiliary roller is considerably larger than the number of rotations of the main roller with respect to a certain amount of wire movement. As a result, the number of times that the wire contacts the engaging groove formed around the auxiliary roller is much greater than the number of times the wire contacts the engaging groove formed around the main roller for a certain amount of wire movement. As the size increases, the wear of the engaging groove of the auxiliary roller proceeds faster. Therefore, the replacement frequency of the wire engagement groove forming portion of the auxiliary roller is much higher than the replacement frequency of the wire engagement groove forming portion of the main roller.

  At present, when the engaging groove of the urethane portion of the auxiliary roller is worn and this is replaced with an auxiliary roller having a urethane portion having a regular engaging groove, the wire is attached to the auxiliary roller with a tape or the like. Temporarily fastened to the part. However, the tape may be peeled off from a part of the auxiliary roller, and the wire may fall off and get entangled with complicated components of the device around the auxiliary roller. When such a problem occurs, carefully remove the tangled wires from each part and return the wire to its original state, and confirm that there is no twisting of the wire and check the proper engagement groove. It is necessary to perform a very laborious operation of engaging the wire with the engagement groove of the auxiliary roller after replacement.

  On the other hand, there are a free abrasive grain method and a fixed abrasive grain method for slicing a workpiece by a wire saw device. And in the case of the wire saw apparatus by a fixed abrasive system, the abrasive grain for slicing has adhered previously over the whole wire. As the slicing abrasive grains, diamond abrasive grains, cubic BN abrasive grains, alumina abrasive grains, silicon carbide abrasive grains, and the like are known. Currently, diamond abrasive grains are generally used. In this case, when the wire to which the diamond abrasive grains are attached at the time of replacing the wire as described above is stopped with a tape, for example, and the engagement groove of the auxiliary roller is exchanged, the diamond abrasive grains adhere to the tape and the diamond abrasive at the portion is replaced. Grain may be missing from the wire. If slicing of the workpiece is performed again in such a state, not only the work efficiency of the slicing operation of the workpiece is reduced, but also the slice surface may be adversely affected.

  Moreover, the same malfunction as the above-mentioned wire drop-off may occur. That is, the tape of the wire temporarily fixed to a part of the auxiliary roller is peeled off and the wire itself is dropped, and it is entangled with components around the auxiliary roller. When an operator tries to manually return such a wire tangled to another part, for example, the diamond abrasive grains in that portion are lost and uniform diamond abrasive grains do not adhere to the wire. There is a risk that. Even in this case, not only the efficiency of the above-described slicing operation is lowered, but also the slicing surface may be adversely affected.

  Moreover, since the wire with diamond abrasive grains is much more expensive than the wire used in the normal loose abrasive system, the wire feeding bobbin is used every time the above-mentioned problems occur, especially on the upstream side of the wire row. If measures were taken to send out a new wire to create a wire array in which diamond abrasive grains were properly attached to all wires, the wire that could still be used would be taken up by the wire take-up roller. Since the attached expensive wire is wasted, it is expensive and very problematic.

  An object of the present invention is to provide a drop of a wire engaged with an engagement groove of an auxiliary roller or diamond abrasive grains when replacing an auxiliary roller with a worn engagement groove with an auxiliary roller having a normal engagement groove. To provide a wire saw apparatus and a method of manufacturing a wafer using the same which can quickly and surely replace the engaging groove portion of the auxiliary roller without causing a part of the abrasive grains of the wire to be lost. It is in.

In order to solve the above-described problem, a wire saw device according to claim 1 of the present invention includes:
A main roller which is arranged at a predetermined interval so that the axial directions of each other are parallel to each other, and in each of which a spiral wire engaging groove is continuously formed;
A wire that is engaged with each wire engaging groove so as to be bridged in parallel between the main rollers, and forms a wire row spaced apart from each other by a predetermined distance;
A wire delivery part and a wire take-up part for delivering one side of the wire and winding the other side;
It is arranged between the wire feed section and wire take-up section and the main roller, has an outer diameter smaller than that of the main roller and has a wire engagement groove formed on the outer periphery, and rotates while the wire is hooked. An auxiliary roller;
Moving means for pressing or separating the wire row and the workpiece to be sliced by the wire row,
In a wire saw device adapted to slice a workpiece by pressing the workpiece against the wire row in a state where the main roller is rotated,
The auxiliary roller includes a wire engaging groove forming portion and a wire engaging groove forming portion supporting member, and the auxiliary roller is caused by wear of the wire engaging groove of the auxiliary roller in the vicinity of the auxiliary roller. When replacing the wire engagement groove forming portion so that the engagement groove becomes a regular engagement groove, a wire temporary placement roller for temporarily placing the wire positioned corresponding to this portion is in the vicinity of the auxiliary roller. It is characterized by that.

  The auxiliary roller has a very small outer diameter compared to the main roller, and the rotation speed is considerably larger than the main roller for a certain amount of wire movement, so the wire engagement of the main roller for a certain amount of wire movement distance The number of times of contact of the wire with the wire engagement groove of the auxiliary roller is extremely larger than the number of times of contact of the wire with the groove, and the degree of wear of the wire engagement groove of the auxiliary roller within a predetermined period is the wire engagement of the main roller. It is much larger than the degree of wear of the groove. Therefore, the wire engagement groove of the auxiliary roller must be frequently replaced with one that is not worn. However, since the wire saw device according to claim 1 has such a configuration, the wire engaging groove of the auxiliary roller is worn, and when the work is performed to replace the auxiliary roller having the normal wire engaging groove, The wire temporarily placed on a part of the auxiliary roller with a tape or the like does not drop and the wire does not get entangled with a complicatedly shaped component near the auxiliary roller. Therefore, when such troubles occur, after the wires entangled with the components of the wire saw device are unwound and the wires are restored to their original state, the presence or absence of twisting of the wires is carefully checked, and then the proper wire engagement is established. There is no need for the troublesome work of engaging the wire with the auxiliary roller having the groove.

A wire saw device according to claim 2 of the present invention is the wire saw device according to claim 1,
The wire saw device is a fixed abrasive type wire saw device,
The wire is preliminarily attached with slicing abrasive grains over the entire wire.

  In the case of a fixed-abrasive type wire saw device, the wire with diamond abrasive grains generally used for slicing is attached to a part of the auxiliary roller with a tape, for example, as in the past, and the auxiliary roller is engaged. When trying to replace the groove, the diamond abrasive grains adhere to the tape, and the diamond abrasive grains in the portion are missing from the wire. If the workpiece is sliced again in such a state, not only the efficiency of the slicing operation is lowered, but also the slice surface of the workpiece may be adversely affected.

  In addition, the same problems as described above may occur in a fixed abrasive grain type wire saw apparatus. That is, the wire tape temporarily fixed to a part of the auxiliary roller is peeled off as in the prior art, and the wire falls off, and the wire is entangled with the complicated components of the apparatus around the auxiliary roller. In this case, when an operator tries to perform manual operation when unwinding and returning the entangled wire, for example, the diamond abrasive grains in that portion may be lost and uniform diamond abrasive grains may not adhere to the wire. . However, the wire saw device according to the present invention does not cause such a problem.

  In addition, since the wire with diamond abrasive grains previously attached is much more expensive than the wire used in the normal loose abrasive system, the wire delivery bobbin is generated every time the above-mentioned problems occur, particularly on the upstream side of the wire row. Therefore, it is not necessary to take measures to change a wire array in which diamond abrasive grains are properly attached to all the wires by sending out a new wire from the point of view.

A wire saw device according to claim 3 of the present invention is the wire saw device according to claim 1 or 2,
The auxiliary roller includes a wire travel path defining roller, a guide roller, a traverser roller, and a tension adjusting roller, and the temporary wire placement roller is at least one of a wire travel path defining roller, the tension adjusting roller, a guide roller, and a traverser roller. It is characterized by being provided in one neighborhood.

  As described above, since the outer diameter of such a roller is much smaller than that of the main roller and the rotation speed is increased, the wire contacts the wire engagement groove of the main roller for a certain amount of wire movement distance. The number of times that the wire comes into contact with the wire engaging groove of the auxiliary roller is extremely larger than the number of times. Accordingly, since any auxiliary roller has a problem of wear of the auxiliary roller engaging groove, the effect of the present invention can be exhibited even if a temporary wire placement roller is provided in the vicinity of any auxiliary roller.

  In particular, the greater the number of auxiliary rollers provided with the wire temporary placement roller as described above, the easier the replacement work of the auxiliary rollers with worn wire engagement grooves can be performed. Reduce the burden on workers who are not used to maintenance work.

A wafer manufacturing method using the wire saw device according to claim 4 of the present invention includes:
A wafer is manufactured by slicing a workpiece using the wire saw device according to any one of claims 1 to 3.

  According to the wafer manufacturing method using such a wire saw device, the work for exchanging the worn wire engagement groove of the auxiliary roller with the regular wire engagement groove can be quickly performed, and the wire can be used during the exchange work. Therefore, it is possible to efficiently manufacture a large number of high-quality wafers.

  According to the present invention, when the auxiliary roller with the worn engagement groove is replaced with an auxiliary roller having a regular engagement groove, the wire engaged with the engagement groove of the auxiliary roller is dropped and diamond abrasive grains are provided. It is possible to quickly and surely replace the engagement groove portion of the auxiliary roller without missing part of the wire abrasive grains. For example, a semiconductor ingot is sliced into a plurality of thin wafers. When processing, it becomes possible to efficiently manufacture a large number of high-quality wafers.

It is a schematic block diagram of the wire saw apparatus which concerns on one Embodiment of this invention. It is a perspective view which expands partially the two wire travel path prescription | regulation rollers of the wire saw apparatus shown in FIG. 2 is an enlarged perspective view showing one of the wire travel path defining rollers shown in FIG. 2 (FIG. 3A) and an enlarged perspective view showing a wire temporary placement roller arranged in the vicinity of the wire travel path defining roller. (FIG. 3B). FIG. 4 is an exploded perspective view showing a wire travel path defining roller shown in FIG. 3.

  Hereinafter, a wire saw device according to an embodiment of the present invention and a wafer manufacturing method using the same will be described. The wire saw device according to the present embodiment is a wire saw device for slicing a workpiece in which a cross section in a direction orthogonal to the longitudinal direction forms a substantially square shape. For example, a silicon wafer is manufactured on the workpiece. A silicon ingot is used.

  Hereinafter, the structure of the wire saw device according to this embodiment will be described in more detail based on the drawings. FIG. 1 is a schematic configuration diagram of a wire saw device according to an embodiment of the present invention.

  The wire saw device 1 according to the present embodiment is arranged at a predetermined interval so that the axial directions thereof are parallel to each other, and spiral wire engaging grooves (not shown) are continuously formed on the respective outer peripheral surfaces. The main rollers 110 and 120 (100) and the respective main rollers 110 and 120 (100) are sequentially engaged with adjacent wire engaging grooves (not shown here), and a large number of them are parallel between the main rollers. One wire W that forms a wire row at this portion, a wire feed bobbin 210 (200) and a wire take-up bobbin 220 (200) that feed and wind the wire W, and a wire feed bobbin 210 (200) ) And the wire take-up bobbin 220 (200) and the main roller 100, and the wire W is hooked and rotated with the wire W being hooked. The workpiece 10 to be sliced is pressed against the wire row by a wire row formed by a plurality of wires W spaced apart by a predetermined distance between the auxiliary rollers 300 (310 to 340) of the main roller and a portion bridged between the main rollers. A workpiece moving unit 20 that is separated from the wire row and a control unit 30 that controls each of these components are included.

  Note that the wire engagement grooves formed on the outer peripheral surface of the main roller 100 are formed, for example, so as to be arranged at a predetermined interval in the longitudinal direction of the main roller by several tens to several thousand rows. Several tens to thousands of wires W with a slight gap are arranged in parallel.

  The silicon ingot 10 is pressed against the wire row between the main rollers to slice the silicon ingot 10. The configuration up to this point is the same as the configuration shown in FIG. 1 of JP 2010-105061 A, for example, but in the case of the wire saw device 1 according to the present embodiment, in the vicinity of each auxiliary roller 300 (310 to 340). Each of the two wire temporary placement rollers 500 is provided.

  Although not shown in detail here, a main roller main body 100 made of metal and a wire member made of urethane formed around the main roller main body are arranged on the main roller 100 in which axes of each other are arranged in parallel to each other with a predetermined distance therebetween. It consists of a groove forming part. In addition, as described above, the spiral wire engagement groove is continuously formed on the outer peripheral portion of the wire groove formation engagement portion of each main roller 100.

  The wire W used in the fixed-abrasive wire saw device 1 according to the present embodiment includes a metal wire main body and diamond abrasive grains as slicing abrasive grains that are uniformly attached to the periphery thereof. Then, as described above, the wires W are engaged with the wire engaging grooves adjacent to each other between the main rollers, so that many wires W are bridged in parallel to the wire engaging grooves of the main rollers 100. As a result, a wire array formed between the main rollers and having diamond abrasive grains attached to each wire slices the silicon ingot 10. Note that the wire W has a very long overall length and is wound around a wire delivery bobbin 210 through various auxiliary rollers 300 described later, and the other end is wound around a wire take-up bobbin 220.

  The auxiliary roller 300 is disposed between the one main roller 110 and the wire feed bobbin 210 and between the other main roller 120 and the wire W extending between the wire take-up bobbin 220 and the auxiliary roller 300. A wire W is engaged with the wire engagement groove 302a (see FIGS. 2 and 3). In this embodiment, the auxiliary roller 300 includes a wire travel path defining roller 310, a guide roller 320, a traverser roller 330, and a tension adjusting roller 340. The guide roller 320 is a roller for accurately guiding and engaging the wire W with a predetermined wire engagement groove formed in the main roller. The tension adjustment roller 340 is a roller that is rotatably provided at the other end of the arm 341 supported at one end, and adjusts the tension acting on the wire W according to the inclination of the arm 341. The traverser roller 330 feeds the wire W before slicing use from an appropriate wire winding position of the wire delivery bobbin 210 and winds the wire W after slicing use to an appropriate position of the wire take-up bobbin 220. It is a roller for. Further, the wire travel path defining roller 310 disposed from the wire delivery bobbin 210 to the one main roller 110 reaches the one main roller 110 to which the wire W is introduced from the wire delivery bobbin 210. It plays the role of defining the travel route of the wire W. Similarly, the wire travel path defining roller 310 disposed from the other main roller 120 to the wire take-up bobbin 220 is led out from the other main roller 120 to the wire take-up bobbin 220. It plays the role of defining the driving route.

  The wire delivery bobbin 210 is wound with an extremely long wire W so that a new wire train can be sequentially fed and formed after slicing a predetermined number of silicon ingots using the wire train described above. Then, the wire W wound around the wire delivery bobbin 210 is led out via the traverser roller 330 and the wire travel path defining roller 310, and the guide roller 320 is adjusted while adjusting the tension of the wire W via the tension adjusting roller 340. The main roller 110 is engaged with a predetermined roller engaging groove while the traveling direction of the main roller 110 is controlled.

  The wire winding bobbin 220 is for winding the used wire W through the auxiliary roller 300. The used wire W is led out from the wire engagement groove of the other main roller 120 through the wire travel path defining roller 310, the tension is adjusted through the tension adjusting roller 340, and the wire winding is performed through the traverser roller 330. The take-up bobbin 220 is wound around a predetermined position.

  FIG. 2 is a partially enlarged perspective view showing two wire travel path defining rollers of the wire saw device shown in FIG. 3 is an enlarged view of the wire travel path defining roller (FIG. 3A) shown in FIG. 2 and one of the two wire temporary placement rollers arranged in the vicinity thereof (FIG. 3B). It is a perspective view.

  The temporary wire placement roller 500 is rotatable in two locations on the base plate 40 in the circumferential direction of each auxiliary roller 300 and in the vicinity of the portion where the wire W is engaged with the wire engagement groove of each auxiliary roller 300. Has been placed. For example, as shown in FIG. 3B, the temporary wire placement roller 500 is a metal shaft 501 fixed to a base plate 40 that rotatably supports the auxiliary roller 300, and is rotatably attached to the shaft 501. In addition, a wire temporary placement engagement groove forming portion 502 made of urethane is formed around the engagement groove for temporarily engaging the wire.

  Thanks to the temporary wire placement roller 500 being placed in such a position, the operator can, for example, use a hand or an appropriate tool near the engagement portion of the wire W engaged with the wire engagement groove 302a of the auxiliary roller 300. The wire engagement groove 502a of the temporary wire placement roller 500 is picked up and temporarily placed, and the worn wire engagement groove of the auxiliary roller 300 described later is changed to a new wire engagement groove. It can be done.

  The lifting device 20 plays a role of pressing the silicon ingot 10 against the wire row between the two main rollers to slice the ingot 10 and pulling the silicon after slicing away from the wire row.

  The control device 30 is for appropriately controlling the main roller 100, the traverser roller 330, the lifting device 20, the tension adjusting roller 340, the wire delivery bobbin 210, the wire take-up bobbin 220, and the like. That is, the control device 30 rotates the two main rollers 110 and 120 in the forward and reverse directions by a predetermined number of rotations to move the lifting device 20 toward the wire row while the wire row is traveling in the predetermined direction. The silicon ingot 10 is pressed against the wire W traveling in a predetermined direction for slicing, and the silicon is pulled away from the wire row by the lifting device 20 after the slicing.

  Further, the control device 30 sends a predetermined amount of a new wire W from the wire delivery bobbin 210 and performs a predetermined amount of the used wire W by the wire take-up bobbin 220 after the wire row performs a certain amount of slicing. A new wire row is formed by controlling the winding so that a new silicon ingot is sliced through the new wire row. In this way, a new wire row is formed between the main rollers for every fixed processing work amount.

  Next, the configuration of the auxiliary roller 300 including the wire travel path defining roller 310, the guide roller 320, the traverser roller 330, and the tension adjustment roller 340 having basically the same configuration will be described in detail. 4 is an exploded perspective view showing the wire travel path defining roller shown in FIG.

  The auxiliary roller 300 is supported by the base plate 40 through a rotating shaft 305 so as to be able to rotate forward and backward. The auxiliary roller 300 is made of metal, and has an outer peripheral surface that is in contact with an inner peripheral surface of a urethane ring 302 described later. 301, a urethane ring 302 made of urethane having a wire engaging groove 302a on the outer peripheral portion, a pressing ring 303 made of metal for sandwiching and fixing the urethane ring 302 in cooperation with the support ring 301, and a rotating shaft A cover 304 or the like that covers the end of 305 is provided. The urethane ring 302 is formed on the female thread portion 301b provided on the three spokes 301a formed between the outer peripheral portion of the support ring 301 and the shaft connecting portion, and the holding ring 303 corresponding to the female thread portion 301b. The urethane ring 302 is firmly sandwiched between the pressing ring 303 and the support ring 301 via a hexagon bolt 309 using the mounting hole 303b. Similarly, the cover 304 is also fixed to the internal thread portion 301c provided on the shaft side of the three spokes of the through ring 304b provided on the cover peripheral surface and the support ring 301 via a hexagonal bolt 309.

  Since the auxiliary roller 300 has such a configuration, the auxiliary roller 300 is performed relatively frequently with respect to the auxiliary roller generally composed of the wire travel path defining roller 310, the guide roller 320, the traverser roller 330, the tension adjusting roller 340, and a large number of rollers. The urethane ring 302 can be easily replaced.

  Next, how to use the temporary wire placement roller 500, which is a feature of this embodiment, will be described. As shown in FIG. 4, the temporary wire placement roller 500 disassembles the auxiliary roller 300 and replaces the urethane ring 302 with a new urethane ring 302. Temporarily engage with the wire engaging groove (see the position of the wire W in FIG. 3A). Then, the cover 304 of the auxiliary roller 300 is removed and the pressing ring 303 is removed, and the urethane ring 302 that is fitted in the support ring 301 and worn on the wire engagement groove 302 a is replaced with a new urethane ring 302. Then, by tightening the holding ring 303 and the support ring 301 with a hexagonal bolt 309, the new urethane ring 302 is firmly sandwiched between the support ring 301 and the holding ring 303 and is firmly fixed to the support ring 301. A cover 304 is attached to the support ring 301. Then, the wire W is hooked back to the new wire engaging groove 302a of the auxiliary roller 300 on which the wire W is hooked in the wire temporary setting engaging groove 502a of the temporary setting roller 500.

  Such an operation is performed on, for example, all of the auxiliary rollers 300, that is, all of the wire travel path defining roller 310, the guide roller 320, the traverser roller 330, and the tension adjusting roller 340, every fixed maintenance period. In the case of this embodiment, since each auxiliary roller 300 is equipped with the temporary wire placement roller 500, the urethane ring 302 of each auxiliary roller 300 can be replaced while temporarily placing the wire W on the temporary wire placement roller 500. It can be done reliably. That is, without worrying that the wire W tape temporarily fixed to the support ring 301 with a tape or the like as in the past peels off from a part of the auxiliary roller 300 and the wire W gets entangled with its peripheral parts. The replacement operation of the auxiliary roller 300 can be performed quickly. In particular, it is possible for a worker who is not used to such replacement work to reduce the burden of maintenance work.

  Below, the advantage compared with the prior art example of the wire saw apparatus 1 which concerns on the above-mentioned embodiment is confirmed again. The auxiliary roller 300 has a very small outer diameter as compared with the main roller 100 of the wire saw device 1 and the rotational speed is considerably larger than that of the main roller 100 for a certain wire movement amount. Thus, the number of times of contact of the wire with the engagement groove of the auxiliary roller 300 is extremely larger than the number of times of contact of the wire W with the wire engagement groove of the main roller 100, and the wire engagement groove of the auxiliary roller 300 within a predetermined period. Is much larger than the degree of wear of the wire engaging groove of the main roller 100. Therefore, the wire engagement groove of the auxiliary roller 300 must be frequently replaced with one that is not worn. However, since the wire saw device 1 according to the present embodiment has the above-described configuration, the wire engagement groove of the auxiliary roller 300 is worn, and an operation of replacing the wire engagement groove with the auxiliary roller 300 having a regular wire engagement groove is performed. At this time, the wire W temporarily placed with a tape or the like on a part of the auxiliary roller 300 does not drop and the wire W does not get entangled with a complicatedly shaped component near the auxiliary roller of the wire saw device 1. Therefore, after such a malfunction occurs, after the wire W entangled with the constituent parts of the wire saw device 1 is unwound and the wire W is returned to the original state, the presence or absence of the twist of the wire W is carefully checked. There is no need for the troublesome work of hooking on the auxiliary roller 300 having a regular wire engaging groove.

  In addition, the wire saw device 1 is a fixed abrasive system. In such a system, an attempt is made to replace the engagement groove of the auxiliary roller 300 by, for example, fixing a wire to which diamond abrasive grains have been attached as in the past with a tape. Then, diamond abrasive grains adhere to the tape, and the diamond abrasive grains in the portion are missing from the wire W. If the slicing of the workpiece 10 is performed again in such a state, not only the efficiency of the slicing operation is reduced, but also the slicing surface of the workpiece may be adversely affected.

  Further, even in the case of a fixed abrasive type wire saw device, as described above, the tape of the wire temporarily fixed to a part of the auxiliary roller is peeled off as described above, and the wire falls off, and the wire is surrounded by the auxiliary roller. It becomes entangled in the complicated component part of the apparatus. In this case, when the operator tries to perform the manual operation when the tangled wire is unwound and returned to the original state, for example, the diamond abrasive grains in that portion may be lost, and the uniform diamond abrasive grains may not adhere to the wire W. There is. However, according to the wire saw device 1 according to the present invention, such a problem does not occur. Since the wire W to which diamond abrasive grains are attached is much more expensive than the wire W used in the normal loose abrasive system, the wire delivery bobbin 210 is provided each time the above-described problems occur, particularly on the upstream side of the wire row. It is not necessary to take measures to change the wire array in which diamond abrasive grains are uniformly attached to all the wires W by sending new wires W from the wire, and it is possible to use expensive wires with diamond abrasive grains without waste. Very good.

  In this embodiment, the auxiliary roller 300 includes a wire travel path defining roller 310, a guide roller 320, a traverser roller 330, a tension adjusting roller 340, and a large number of rollers. The larger the number of the more, the easier the replacement work of the auxiliary roller 300 with the worn wire engagement groove is, and the burden on the worker who is not used to such maintenance work is reduced.

  Finally, a method for manufacturing a silicon wafer using the wire saw device 1 according to this embodiment described above will be described. After operating the wire saw device 1 for a predetermined period, the urethane ring 302 of each auxiliary roller 300 is replaced with a new urethane ring 302 as described above. At this time, since the wire W is temporarily placed in the wire temporary placement engagement groove 502a of the wire temporary placement roller 500 described above in the replacement operation of each auxiliary roller 300, the wire W which is taped as in the conventional case is dropped and the auxiliary roller is removed. It is prevented from being caught in the peripheral part of 300. Then, after the replacement operation of the urethane ring 302 of the auxiliary roller is completed, the main roller 100 is caused to run each wire W in the wire row alternately in the forward and reverse directions of the constant rotation. At the same time, the lifting device 20 to which the silicon ingot 10 is attached is gradually approached toward the wire row to perform slicing processing. After slicing, the lifting device 20 is driven again in the direction away from the wire row, and the silicon sliced into a number of silicon wafers is pulled away from the wire row. And it isolate | separates at a post process so that it may become each separate silicon wafer. In this way, high-quality silicon wafers are efficiently mass-produced using the wire saw device 1 according to the present embodiment.

  As described above, the dimensional relationship, material, and number of each component of the apparatus introduced in the above-described embodiment are merely illustrative, and other dimensional relationships, material, and number can be used as long as the operation of the present invention can be achieved. Needless to say, this is also included in the scope of the present invention.

  For example, in the present embodiment, the temporary wire placement roller 500 is provided in the vicinity of each of the wire travel path defining roller 310, the guide roller 320, the traverser roller 330, and the tension adjustment roller 340 constituting the auxiliary roller 300. However, it is not always necessary to provide the wire travel path defining roller 310, the tension adjusting roller 340, the guide roller 320, and the traverser roller 330 near the wire temporary placement roller 500. The effect of the invention can be exhibited.

  This is because the diameter of the auxiliary roller 300 is much smaller than that of the main roller 100 and the number of rotations is faster. Therefore, the wire W is inserted into the wire engagement groove of the main roller 100 for a certain amount of wire movement distance. This is because the number of times the wire W contacts the wire engaging groove of the auxiliary roller 300 is extremely larger than the number of times of contact. Therefore, since any auxiliary roller 300 has a problem of wear of the auxiliary roller engaging groove, the effect of the present invention can be exhibited even if the temporary wire placing roller 500 is provided in the vicinity of any auxiliary roller 300. Because.

  In the present embodiment, two wire temporary placement rollers 500 are disposed in the vicinity of the corresponding auxiliary roller 300, but the number of the wire temporary placement rollers 500 is limited as in the present embodiment. Never happen. Specifically, when a sufficient space for arranging the temporary wire placement roller 500 is secured, only one wire temporary placement roller having a relatively large diameter capable of temporarily placing the wire W with sufficient margin is provided in the vicinity of the auxiliary roller. If there is not enough space for placing the wire temporary placement roller, the wire temporary placement roller itself is moved along the wire engagement grooves of, for example, three auxiliary rollers. You may arrange | position so that it may not protrude so much from the auxiliary roller outer peripheral surface seeing from the rotating shaft direction of the auxiliary roller 300. FIG.

  Further, in the present embodiment, as described above as a preferred example, the fixed abrasive type wire saw device in which diamond abrasive grains are preliminarily adhered to the wire has been described as a premise of application, but slicing processing adhered to the wire Needless to say, the abrasive grains are not limited to diamond abrasive grains as long as they fulfill the purpose.

  Further, in place of the fixed abrasive grain type wire saw apparatus as in the present embodiment, the present invention can also be applied to a free abrasive grain type wire saw apparatus that uses a machining liquid obtained by mixing abrasive grains with a coolant liquid. it can. This is because even if the present invention is applied to such a loose abrasive type wire saw, it is sufficiently useful for solving the problem described at the beginning of the problem of the present invention.

  In the above-described embodiment, the wire saw apparatus of the so-called multi-wire slicing method in which the wire row is formed between the main rollers in order to slice the workpiece into three or more has been described. Instead, the workpiece is processed. The present invention is also applicable to a so-called single wire slicing type wire saw apparatus in which one wire is bridged between main rollers in order to slice an object into two.

1 Wire saw device 10 Silicon ingot (workpiece)
20 Lifting device (workpiece moving part)
30 Control device 40 Base plate 110, 120 (100) Main roller 210 (200) Wire feed bobbin 220 (200) Wire take-up bobbin 300 Auxiliary roller 301 Support ring 301a Spoke 301b Female thread part 301c Shaft side female thread part 302 Urethane ring 302a Wire Engaging groove 303 Holding ring 303b Mounting hole 304 Cover 304b Through hole 305 Rotating shaft 309 Hexagonal bolt 310 Wire travel path defining roller 320 Guide roller 330 Traverser roller 340 Tension adjusting roller 341 Arm 500 Wire temporary placement roller 501 Shaft 502 Wire temporary placement Roller 502a Wire temporary placement engagement groove W wire

Claims (4)

A main roller which is arranged at a predetermined interval so that the axial directions of each other are parallel to each other, and in each of which a spiral wire engaging groove is continuously formed;
A wire that is engaged with each wire engaging groove so as to be bridged in parallel between the main rollers, and forms a wire row spaced apart from each other by a predetermined distance;
A wire delivery part and a wire take-up part for delivering one side of the wire and winding the other side;
It is arranged between the wire feed section and wire take-up section and the main roller, has an outer diameter smaller than that of the main roller and has a wire engagement groove formed on the outer periphery, and rotates while the wire is hooked. An auxiliary roller;
Moving means for pressing or separating the wire row and the workpiece to be sliced by the wire row,
In a wire saw device adapted to slice a workpiece by pressing the workpiece against the wire row in a state where the main roller is rotated,
The auxiliary roller includes a wire engaging groove forming portion and a wire engaging groove forming portion supporting member, and the auxiliary roller is caused by wear of the wire engaging groove of the auxiliary roller in the vicinity of the auxiliary roller. When the wire engagement groove forming portion is replaced so that the engagement groove becomes a regular engagement groove, a wire temporary placement roller for temporarily placing the wire positioned corresponding to this portion is in the vicinity of the auxiliary roller. A wire saw device characterized by that. The wire saw device is a fixed abrasive type wire saw device,
The wire saw device according to claim 1, wherein the wire is preliminarily attached with slicing abrasive grains.   The auxiliary roller includes a wire travel path defining roller, a guide roller, a traverser roller, and a tension adjusting roller. The wire temporary placement roller includes the wire travel path defining roller, the tension adjusting roller, the guide roller, and the traverser roller. The wire saw device according to claim 1, wherein the wire saw device is provided in at least one of the vicinity. A wafer manufacturing method using a wire saw device, wherein a wafer is manufactured by slicing a workpiece using the wire saw device according to any one of claims 1 to 3.

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