JP5970995B2 - Electronic equipment board mounting structure - Google Patents

Electronic equipment board mounting structure Download PDF

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JP5970995B2
JP5970995B2 JP2012156401A JP2012156401A JP5970995B2 JP 5970995 B2 JP5970995 B2 JP 5970995B2 JP 2012156401 A JP2012156401 A JP 2012156401A JP 2012156401 A JP2012156401 A JP 2012156401A JP 5970995 B2 JP5970995 B2 JP 5970995B2
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board
case
upper cover
mounting structure
substrate
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JP2014022384A (en
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勝 中井
勝 中井
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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本発明は、汎用インバータなどの電子機器を対象に、そのケースに着脱可能に搭載する基板(オプション基板)の取付け構造に関する。   The present invention relates to a mounting structure for a board (option board) that is detachably mounted on a case for an electronic device such as a general-purpose inverter.

頭記の汎用インバータに搭載する通信カードなどのオプション基板について、従来における基板取付け構造を図,図に示す。各図において、1はモールド樹脂製のケース、2は取付フレーム、3は着脱式の操作パネル(タッチパネル)、4はケース1の開口部に被着した樹脂製の上部カバー(制御回路端子台カバー兼用)、5は主回路端子台の端子カバー、6は制御回路端子台、7は制御回路端子台6に並置してケース1の内部に着脱可能に搭載した通信カードなどのオプション基板である。 4 and 5 show conventional board mounting structures for optional boards such as communication cards mounted on the general-purpose inverter described above. In each figure, 1 is a molded resin case, 2 is a mounting frame, 3 is a detachable operation panel (touch panel), and 4 is a resin upper cover (control circuit terminal block cover) attached to the opening of the case 1. 5 is a terminal cover of the main circuit terminal block, 6 is a control circuit terminal block, 7 is an optional board such as a communication card that is mounted in parallel with the control circuit terminal block 6 and is detachably mounted inside the case 1.

ここで、前記オプション基板7は、ユーザーが必要に応じて追加装備するオプション品であり、当初から製品に組み込まれている親基板(主電源回路基板,制御回路基板)と二階建て式に組み合わせてケース1に着脱可能に搭載し、例えばボトムエントリー形のコネクタを介して他の親基板に接続して使用される。また、このオプション基板7を所定の搭載位置に固定するために、従来構造では、図で示すようにケース1に立設した左右一対のラッチ(係合爪)8を介してオプション基板7をスナップフィット式に係合保持している。 Here, the optional board 7 is an optional product that the user additionally equips as necessary, and is combined with a parent board (main power circuit board, control circuit board) built into the product from the beginning in a two-story manner. It is detachably mounted on the case 1 and is used by being connected to another parent board via, for example, a bottom entry connector. Further, in order to secure the option board 7 to a predetermined mounting position, in the conventional structure, the option board 7 via a pair of left and right latch (engaging claw) 8 erected on the case 1 as shown in FIG. 5 It is engaged and held in a snap-fit manner.

すなわち、オプション基板7を装着する際には、ケース1の上部カバー4を取り外した状態で、オプション基板7を左右のラッチ8の間に差し込み、コネクタを接続して搭載位置に固定する。また、オプション基板7を取り外す場合には、ドライバーなどを用いてラッチ8の爪を側方に押し開き、コネクタと一緒にオプション基板7を引き出す。   That is, when the option board 7 is mounted, the option board 7 is inserted between the left and right latches 8 with the upper cover 4 of the case 1 removed, and a connector is connected to fix it to the mounting position. When the option board 7 is to be removed, the claws of the latch 8 are pushed sideways using a screwdriver or the like, and the option board 7 is pulled out together with the connector.

なお、前記の基板取付け構造として、前記のようにコネクタ,およびラッチ(係合爪)を介して支持する方式は、例えば特許文献1に開示されていている。   As the above-mentioned board mounting structure, a method of supporting via a connector and a latch (engagement claw) as described above is disclosed in Patent Document 1, for example.

特開2000−59054号公報(図3)JP 2000-59054 A (FIG. 3)

ところで、前記したオプション基板7をケース1に搭載するに際しては、その着脱作業が簡単に行え、かつ着脱操作時に回路基板に実装したチップ部品などに不用な機械的ストレスが加わらないことが必要である。   By the way, when mounting the above-described option board 7 on the case 1, it is necessary that the attaching / detaching operation can be easily performed and that unnecessary mechanical stress is not applied to the chip parts mounted on the circuit board during the attaching / detaching operation. .

かかる点、先記した従来の基板取付け構造では次記のような問題点がある。すなわち、図6のようにケース1の狭いスペースに制御回路端子台6などが配置されているため、オプション基板7の着脱作業がやり難い。そのほか、ラッチ8の係脱操作に伴い回路基板7に機械的な応力が加わり、このために基板の実装部品に不用なストレスを加えるおそれもあって、その取付け構造の改善策が望まれている。   In this respect, the conventional substrate mounting structure described above has the following problems. That is, since the control circuit terminal block 6 and the like are arranged in a narrow space of the case 1 as shown in FIG. In addition, mechanical stress is applied to the circuit board 7 as the latch 8 is engaged and disengaged, which may cause unnecessary stress on the components mounted on the board, and a measure for improving the mounting structure is desired. .

本発明は上記の点に鑑みなされたものであり、その目的は基板の着脱が簡単に行え、しかもその着脱操作に伴い基板,実装部品に不用な機械的ストレスが加わらないように改良した電子機器の基板取付け構造を提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to improve an electronic apparatus in which a substrate can be easily attached and detached, and unnecessary mechanical stress is not applied to the substrate and the mounting component in accordance with the attachment and detachment operation. It is to provide a substrate mounting structure.

上記目的を達成するために、本発明によれば、ケースの内部にコネクタを介して基板を着脱可能に搭載し、該基板を覆ってケースの開口部に上部カバーを被着した電子機器において、前記上部カバーの内面に、前記基板の外形に対応して形成した保持枠と、前記基板を搭載位置に押さえ込み保持する押さえバネ部材とを設け、その押さえばね部材は具体的に次記のような態様で構成することかできる。
(1)前記押さえばね部材を樹脂成形品になる上部カバーに一体成形する。
(2)前記押さえばね部材の形状を“への字形”,あるいは“アーチ形”に形成する。
In order to achieve the above object, according to the present invention, in an electronic device in which a substrate is detachably mounted inside a case via a connector, and an upper cover is attached to the opening of the case so as to cover the substrate, Provided on the inner surface of the upper cover is a holding frame formed corresponding to the outer shape of the substrate and a pressing spring member for pressing and holding the substrate at the mounting position. The pressing spring member is specifically as follows. It can be configured in a manner.
(1) the pressing spring member integrally molded on the top cover comprising a resin molded article.
(2) the pressing "shape to" the shape of the spring member, or you formed "arcuate".

上記の基板取付け構造によれば、従来構造のように狭いスペース内で基板とラッチとの間の係脱する面倒な作業が必要なく、基板を簡単に着脱することかできる。すなわち、装着時には基板をコネクタ接続した状態でケースに上部カバーを被着するだけで、上部カバーの内面に設けた押さえばねのばね力で基板を所定の搭載位置に押さえ込み保持することができ、取り外し時にはケースから上部カバーを取り外すだけで、基板をコネクタと共に引き抜くことができる。   According to the above-described substrate mounting structure, the troublesome work of engaging and disengaging the substrate and the latch in a narrow space as in the conventional structure is not necessary, and the substrate can be easily attached and detached. In other words, when the board is attached, the board can be pressed and held in place with the spring force of the holding spring provided on the inner surface of the upper cover simply by attaching the upper cover to the case with the board connected to the case. Sometimes the board can be pulled out with the connector just by removing the top cover from the case.

また、この押さえばねをモールド樹脂製の上部カバーに一体成形することで、部品点数,組立工数が増えることもなく安価に製作できる。   Further, by integrally molding the holding spring on the upper cover made of molded resin, it can be manufactured at a low cost without increasing the number of parts and the number of assembly steps.

本発明の実施例による基板取付け構造を表す模式断面図である。It is a schematic cross section showing the board | substrate attachment structure by the Example of this invention. 図1における押さえばね部材付き上部カバーをその内面側から見た斜視図である。It is the perspective view which looked at the upper cover with a pressing spring member in FIG. 1 from the inner surface side. 図2と押さえばね部材の形状が異なる上部カバーの構成図であって、(a),(b)はそれぞれ内面側,外面側から見た斜視図である。It is a block diagram of the upper cover from which the shape of a presser spring member differs from FIG. 2, Comprising: (a), (b) is the perspective view seen from the inner surface side and the outer surface side, respectively. 電子機器の従来例として示す汎用インバータのケース一部の俯瞰図である。It is a bird's-eye view of a part of case of a general-purpose inverter shown as a conventional example of electronic equipment. 図4の汎用インバータに搭載したオプション基板の取付け構造を表す俯瞰図である。FIG. 5 is an overhead view showing an attachment structure of an option board mounted on the general-purpose inverter of FIG. 4.

以下、汎用インバータのケース内部に搭載したオプション基板を例に、本発明の実施の形態を図1〜図3に示す実施例に基づいて説明する。なお、実施例の図中で図4,図5に対応する部材には同じ符号を付してその説明は省略する。   Hereinafter, an embodiment of the present invention will be described based on an example shown in FIGS. 1 to 3 by taking an option board mounted inside a case of a general-purpose inverter as an example. In the drawing of the embodiment, members corresponding to those in FIG. 4 and FIG.

まず、図1,図2の実施例において、1は汎用インバータのケース(図4,図5参照)、4はケース1の開口部に被着した上部カバー(樹脂成形品)であり、ケース1の内部には標準装備の親基板(主回路基板,制御回路基板)9と別に、その上方には通信カードなどのオプション基板7が二階建て式に搭載されており、該オプション基板7はボトムエントリー形のコネクタ7aを介して親基板9に接続するようにしている。なお、図示のオプション基板7は片面式基板で、その基板に実装したコネクタ7a,および回路部品7bは基板7の下面側に配置されている。   1 and 2, reference numeral 1 denotes a case of a general-purpose inverter (see FIGS. 4 and 5), and 4 denotes an upper cover (resin molded product) attached to the opening of the case 1. In addition to the standard parent board (main circuit board, control circuit board) 9, an optional board 7 such as a communication card is mounted in a two-story structure above it. The main board 9 is connected via a connector 7a. The illustrated option board 7 is a single-sided board, and the connector 7a and the circuit component 7b mounted on the board are disposed on the lower surface side of the board 7.

一方、前記のオプション基板7を覆ってケース1の開口部に被着する上部カバー2(図2参照)には、オプション基板7の上面に対峙する“への字形”形状になる押さえばね部材4aがカバーの内面側に張り出すように一体成形して作り込まれている。なお、4bは上部カバー2の後端縁に設けてケース1の係合溝10(図5参照)に差込む係合爪、4cは上部カバー4をケース1にねじ止めする締結ねじの通し孔、4dはオプション基板7の外形四隅に対応してカバー内面側に形成した保持枠である。   On the other hand, the upper cover 2 (see FIG. 2) that covers the option board 7 and adheres to the opening of the case 1 has a presser spring member 4a having a “U” shape facing the upper surface of the option board 7. Is formed by integral molding so as to project on the inner surface side of the cover. 4b is an engagement claw provided on the rear edge of the upper cover 2 and inserted into the engagement groove 10 (see FIG. 5) of the case 1, and 4c is a fastening screw through hole for screwing the upper cover 4 to the case 1. Reference numerals 4 d denote holding frames formed on the inner surface side of the cover corresponding to the four outer corners of the option substrate 7.

上記の構成で、オプション基板7を搭載する際には、その手順として、まずケース1から上部カバー4を取り外し、続いてオプション基板7のコネクタ7aを差し込んで親基板9に接続する。この仮支持状態で上部カバー4をケース1に被着してねじ締結すると、上部カバー4の内面側に形成した保持枠4dがオプション基板7の四隅に填まり合うとともに、押さえばね部材4aがオプション基板7を上面側からばね力Fで押圧する。これにより、オプション基板7は所定の搭載位置に確実に押さえ込み保持される。また、オプション基板7を外す場合には、前記手順と逆に上部カバー4を取り外した状態で、オプション基板7のコネクタ7aを引き抜くことで簡単にケース1から取り出すことができる
したがって、図5で述べた従来の基板取付け構造のように、狭いスペースで行うラッチ8の面倒な係脱作業が必要なく、かつラッチ8の係脱操作に伴うオプション基板7,およびその実装回路部品7bへの不用な機械的ストレスが加わるおそれもない。
In mounting the option board 7 with the above configuration, as a procedure, first, the upper cover 4 is removed from the case 1, and then the connector 7 a of the option board 7 is inserted and connected to the parent board 9. When the upper cover 4 is attached to the case 1 in this temporarily supported state and screwed, the holding frames 4d formed on the inner surface side of the upper cover 4 fit into the four corners of the option substrate 7, and the holding spring member 4a is optional. The substrate 7 is pressed with a spring force F from the upper surface side. As a result, the option board 7 is securely pressed and held at a predetermined mounting position. Further, when removing the option board 7, it can be easily taken out from the case 1 by pulling out the connector 7a of the option board 7 with the upper cover 4 removed in the reverse order of the above procedure. Unlike the conventional board mounting structure, the troublesome engagement / disengagement work of the latch 8 in a narrow space is not required, and the optional board 7 and the mounting circuit component 7b associated with the engagement / disengagement operation of the latch 8 are unnecessary. There is no risk of additional stress.

また、前記上部カバー4の内面側に一体成形した押さえばね部材4aの形状について、図2ではばね形状が“くの字形”であるが、図3(a),(b)で示すようにばね部材4aの両端がカバーに連なる“アーチ形”に形成しても同様な効果を奏することができる。   Further, regarding the shape of the presser spring member 4a integrally formed on the inner surface side of the upper cover 4, the spring shape is a "<" shape in FIG. 2, but as shown in FIGS. The same effect can be obtained even if the both ends of the member 4a are formed in an “arch shape” continuous with the cover.

1 ケース
4 上部カバー
4a 押さえばね部材
7 オプション基板
7a コネクタ
1 Case 4 Upper cover 4a Pressing spring member 7 Option board 7a Connector

Claims (3)

ケースの内部にコネクタを介して基板を着脱可能に搭載し、該基板を覆ってケースの開口部に上部カバーを被着した電子機器において、
前記上部カバーの内面に、前記基板の外形に対応して形成した保持枠と、前記基板を搭載位置に押さえ込み保持する押さえバネ部材とを設けたことを特徴とする電子機器の基板取付け構造。
In an electronic device in which a substrate is detachably mounted inside a case via a connector, and the upper cover is attached to the opening of the case so as to cover the substrate,
A board mounting structure for an electronic device , comprising: a holding frame formed on an inner surface of the upper cover so as to correspond to an outer shape of the board; and a holding spring member that holds the board in a mounting position.
請求項1に記載の基板取付け構造において、押さえばね部材が樹脂成形品になる上部カバーに一体成形されていることを特徴とする電子機器の基板取付け構造。   2. The board mounting structure according to claim 1, wherein the holding spring member is integrally formed with an upper cover that is a resin molded product. 請求項1に記載の基板取付け構造において、押さえばね部材の形状が“への字形”,あるいは“アーチ形”であることを特徴とする電子機器の基板取付け構造。   2. The board mounting structure for an electronic device according to claim 1, wherein the shape of the presser spring member is "U" or "arch".
JP2012156401A 2012-07-12 2012-07-12 Electronic equipment board mounting structure Active JP5970995B2 (en)

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JPS4521764Y1 (en) * 1966-09-16 1970-08-29
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