JPH0281091U - - Google Patents
Info
- Publication number
- JPH0281091U JPH0281091U JP16100388U JP16100388U JPH0281091U JP H0281091 U JPH0281091 U JP H0281091U JP 16100388 U JP16100388 U JP 16100388U JP 16100388 U JP16100388 U JP 16100388U JP H0281091 U JPH0281091 U JP H0281091U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic device
- molded spring
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Vibration Prevention Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例による電子機器の構
造を示す断面図、第２図は同構造の重量部品と成
形バネが接している状態を示す斜視図、第３図は
従来の電子機器の構造を示す断面図、第４図は電
子機器が落下や衝撃により重量部品が上下振動す
る状態を示す説明図、第５図は従来構造の重量部
品取付部が電子機器の落下や衝撃により破損する
状態を示す斜視図、第６図は同構造の重量部品上
に衝撃吸収用ゴムを取付けた状態を示す断面図で
ある。
１１……プリント基板、１２……電子部品、１
３……絶縁ケース、１４……シールドケース、１
５……成形バネ、１６……外装ケース、１７，１
７′……ボス、１８……重量部品。
Fig. 1 is a sectional view showing the structure of an electronic device according to an embodiment of the present invention, Fig. 2 is a perspective view showing a state in which a heavy component of the same structure and a molded spring are in contact, and Fig. 3 is a conventional electronic device. Figure 4 is an explanatory diagram showing how heavy parts vibrate up and down due to a drop or impact from an electronic device. Figure 5 is a diagram showing how a heavy component mounting part of a conventional structure is damaged due to a drop or impact from an electronic device. FIG. 6 is a sectional view showing a state in which shock-absorbing rubber is attached to a heavy component of the same structure. 11...Printed circuit board, 12...Electronic component, 1
3... Insulation case, 14... Shield case, 1
5... Molded spring, 16... Exterior case, 17,1
7'...Boss, 18...Heavy parts.
Claims (1)
シールドする金属ケース間を絶縁する絶縁ケース
に、プリント基板上の重量部品を押圧する成形バ
ネを、一体に成形した電子機器。 An electronic device that has a molded spring that presses heavy components on the printed circuit board integrated into an insulating case that insulates the printed circuit board that incorporates various electronic components and the metal case that shields it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16100388U JPH0281091U (en) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16100388U JPH0281091U (en) | 1988-12-12 | 1988-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281091U true JPH0281091U (en) | 1990-06-22 |
Family
ID=31443567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16100388U Pending JPH0281091U (en) | 1988-12-12 | 1988-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281091U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014022384A (en) * | 2012-07-12 | 2014-02-03 | Fuji Electric Co Ltd | Substrate mounting structure of electronic apparatus |
-
1988
- 1988-12-12 JP JP16100388U patent/JPH0281091U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014022384A (en) * | 2012-07-12 | 2014-02-03 | Fuji Electric Co Ltd | Substrate mounting structure of electronic apparatus |