JP5969339B2 - Frequency adjustment method - Google Patents

Description

  The present invention relates to an RF-ID medium that transmits and receives data at a predetermined resonance frequency, and more particularly to a method for adjusting a resonance frequency.

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a non-contact type IC card, non-contact type IC label, or non-contact type that transmits / receives data in a non-contact state to the card, label, or tag Type IC tags are rapidly spreading due to their excellent convenience.

  RF-ID media such as a non-contact type IC card, a non-contact type IC label, or a non-contact type IC tag is formed such that a conductive antenna is formed on a base substrate and is connected to the antenna. An inlet on which an IC chip is mounted is configured to be sandwiched between a surface sheet and a card substrate, and transmits and receives data at a predetermined resonance frequency. Therefore, the shape of the antenna is designed so that the RF-ID media can transmit and receive data at a predetermined resonance frequency.

  However, in the etching or printing process for forming the antenna on the base substrate, the shape of the antenna does not become such a shape that the RF-ID media can transmit and receive data at a predetermined resonance frequency. There is. In particular, in the RF-ID media that transmits and receives data by the electromagnetic induction method, it is necessary to cross the coiled antenna at a part thereof, but variation occurs when forming the jumper part of the crossed part, In many cases, data cannot be transmitted / received at a predetermined resonance frequency.

  Therefore, an adjustment pattern connected to the antenna is provided, and trimming the adjustment pattern to adjust the inductance and capacitance of the antenna, so that the RF-ID medium can transmit and receive data at a predetermined resonance frequency. (See, for example, Patent Documents 1 and 2).

JP 2011-238016 A JP 2004-153716 A

  However, as described above, in the technology for adjusting the inductance and capacitance of the antenna by trimming the adjustment pattern by providing the adjustment pattern connected to the antenna, the antenna and the adjustment pattern are formed on the base substrate. Then, after the IC chip is mounted so as to be connected to the antenna, the adjustment pattern is trimmed in accordance with the resonance frequency at which the RF-ID medium transmits and receives data. There is a problem that the number of processes on a line different from the process is newly increased, the manufacturing process becomes complicated, and the manufacturing cost increases.

  Further, when trimming with a non-contact laser, it is necessary to provide a processing hole in a manufacturing table on which an RF-ID medium is mounted, which causes a problem that manufacturing cost increases.

The present invention has been made in view of the problems of the conventional techniques as described above, and without providing a separate line process from a general RF-ID media manufacturing process, and the manufacturing process. and to provide a frequency adjusting how capable of adjusting the resonance frequency for transmitting and receiving data without increasing.

In order to achieve the above object, the present invention provides:
An IC chip having an antenna formed on a base substrate and having a connection terminal on a predetermined surface is mounted on the base substrate with the connection terminal connected to the antenna, and transmits and receives data at a resonance frequency. A frequency adjustment method for adjusting the resonance frequency in the RF-ID media,
Obtaining a frequency of a single antenna formed on the base substrate;
RF-ID media when the IC chip is mounted on the base substrate with the connection terminal connected to an antenna having the acquired frequency and the interval between the predetermined surface and the antenna as a reference interval Calculating a resonance frequency;
Calculating the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data;
Calculating an interval between the predetermined surface and the antenna based on the reference interval and an interval between the predetermined surface and the antenna that causes the calculated capacitance amount;
Calculating a mounting condition of the IC chip on the base substrate such that the distance between the predetermined surface and the antenna is the calculated distance.

  In the present invention configured as described above, after the antenna is formed on the base substrate, first, the frequency of the single antenna formed on the base substrate is acquired, and the IC chip acquires the acquired frequency. The resonance of the RF-ID medium when the connection terminal of the IC chip is connected to the antenna having the antenna, and the antenna is mounted on the base substrate with the distance between the predetermined surface provided with the connection terminal of the IC chip and the antenna as a reference distance The frequency is calculated. Next, the amount of capacitance required to fill in the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data is calculated, and then the reference between the predetermined surface of the IC chip and the antenna The distance between the predetermined surface of the IC chip and the antenna is calculated based on the distance and the distance between the predetermined surface that causes the calculated capacitance amount and the antenna. Then, the mounting conditions for the IC chip on the base substrate are calculated such that the distance between the predetermined surface of the IC chip and the antenna is the calculated distance, and the IC chip is mounted on the base substrate according to the mounting conditions. Will be.

  As described above, after the antenna is formed on the base substrate, the distance between the predetermined surface of the IC chip connected to the antenna and mounted on the base substrate and the antenna is the resonance frequency of the RF-ID media. Since the IC chip is mounted on the base substrate under mounting conditions corresponding to the interval, the IC chip is mounted on the base substrate after the antenna is formed. In the process up to the mounting process, the distance between the predetermined surface of the IC chip and the antenna is calculated in-line, and the resonance frequency of the RF-ID medium is adjusted.

  In the present invention, after the antenna is formed on the base substrate, the distance between the predetermined surface of the IC chip connected to the antenna and mounted on the base substrate and the antenna is the data of the resonance frequency of the RF-ID media. Since the IC chip is mounted on the base substrate under mounting conditions corresponding to the interval, the IC chip is mounted on the base substrate after the antenna is formed. In the process up to mounting on the board, the distance between the predetermined surface of the IC chip and the antenna is calculated in-line, and the resonance frequency of the RF-ID medium is adjusted. The resonance frequency for transmitting and receiving data can be adjusted without providing a process on a separate line from the process and without increasing the manufacturing process.

It is a figure which shows one Embodiment of RF-ID media by which the resonant frequency is adjusted with the frequency adjustment method of this invention, (a) is a figure which shows the structure of the surface, (b) is A shown to (a) -A 'sectional drawing, (c) is the A section enlarged view shown in (b). It is a flowchart for demonstrating the manufacturing method of the inlet shown in FIG. It is a figure which shows one Embodiment of the frequency adjustment apparatus which adjusts the resonant frequency of the inlet shown in FIG. It is a flowchart for demonstrating the frequency adjustment method which adjusts the resonant frequency of an inlet using the frequency adjustment apparatus shown in FIG. It is a figure for demonstrating the space | interval of the back surface of an IC chip, and an antenna. It is a figure which shows the relationship between the crimping | compression-bonding load with respect to an IC chip at the time of crimping | bonding an IC chip to a base substrate, and the resonant frequency of an inlet.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an embodiment of an RF-ID medium in which the resonance frequency is adjusted by the frequency adjusting method of the present invention, where (a) is a diagram showing the configuration of the surface, and (b) is (a). A-A ′ cross-sectional view shown in FIG. 4C is an enlarged view of a portion A shown in FIG.

  As shown in FIG. 1, the RF-ID media of this embodiment is an inlet 1 in which a conductive antenna 4 is formed on a base substrate 2 made of an insulating material such as a resin and an IC chip 3 is mounted. is there.

  The antenna 4 is formed in a coil shape on the base substrate 2 by etching, printing, or the like, and part of the antenna 4 is guided from the outside to the inside of the coil via an insulating layer in order to place both ends in the coil. The jumper portion 5 is provided.

  The IC chip 3 has a size of, for example, 1 mm □ or more, and is connected to the antenna 4 when the bumps 6 serving as connection terminals provided on the back surface serving as a predetermined surface come into contact with both ends of the coiled antenna 4. It is mounted on the base substrate 2 by being mounted on the base substrate 2 and crimped to the base substrate 2 by thermocompression bonding.

  In the inlet 1 configured as described above, the antenna 4 is brought into close proximity to an information writing / reading device (not shown) provided outside, by electromagnetic induction by electromagnetic waves output from the information writing / reading device. Current is supplied to the IC chip 3, whereby data is transmitted and received between the information writing / reading device and the IC chip 3 in a non-contact state. Such an inlet is sandwiched between card substrates and used as a non-contact IC card, or is attached to a label substrate and used as a non-contact IC label. Therefore, when the resonance frequency of the inlet 1 is configured as a non-contact IC card or a non-contact IC label, the frequency of the electromagnetic wave output from the information writing / reading device, for example, 13.56 MHz is set. ing.

  Below, the manufacturing method of the inlet 1 mentioned above is demonstrated.

  FIG. 2 is a flowchart for explaining a method of manufacturing the inlet 1 shown in FIG.

  When the inlet 1 shown in FIG. 1 is manufactured, first, the antenna 4 is formed on the base substrate 2 by etching, printing, or the like, and further, the jumper portion 5 is formed by printing (step 1).

  Next, the frequency of the antenna 4 alone formed on the base substrate 2 is measured (step 2). Note that the step 1 and the step 2 do not need to be performed continuously. For example, in step 1, an antenna sheet formed by imposing a plurality of antennas 4 and jumper portions 5 on the base substrate 2 is wound up in a roll shape, and then the antenna sheet is pulled out to measure the frequency of the antenna 4 alone. May be.

  Next, an adhesive is applied to the region of the base substrate 2 where the IC chip 3 is mounted (step 3). As this adhesive, a conductive adhesive in which conductive particles are contained in a resin binder is generally used, but an adhesive not containing conductive particles may be used.

  Next, the IC chip 3 is mounted on the area of the base substrate 2 to which the adhesive has been applied (step 4), and pressure is applied while applying heat to bring the bumps 6 into contact with the antenna 4 and the IC chip 3 Is pressure-bonded to the base substrate 2 with an adhesive (step 5). Thereby, the IC chip 3 is mounted on the base substrate 2 in a state where the bump 6 and the antenna 4 are reliably electrically connected.

  Thereafter, the frequency of the inlet 1 is measured to complete the inlet 1 (step 6).

  It can be considered that the completed inlet 1 is wound into a roll shape as an inlet sheet and stored.

  Below, the method to adjust the resonant frequency in the inlet 1 mentioned above is demonstrated.

  FIG. 3 is a diagram illustrating an embodiment of a frequency adjustment device that adjusts the resonance frequency of the inlet 1 illustrated in FIG. 1.

  As shown in FIG. 3, the frequency adjustment device of the present embodiment includes an antenna frequency acquisition unit 10, an inlet frequency calculation unit 20, a capacitance amount calculation unit 30, an interval calculation unit 40, and a crimping condition determination unit 60. ing.

  The antenna frequency acquisition unit 10 acquires the frequency of the antenna 4 alone formed on the base substrate 2.

  The inlet frequency calculation unit 20 refers to the frequency data table 51, and the IC chip 3 connects the bump 6 to the antenna having the frequency acquired by the antenna frequency acquisition unit 10 to connect the back surface of the IC chip 3 and the antenna 4. The resonance frequency of the inlet 1 when mounted on the base substrate 2 is calculated using a predetermined interval as a reference interval.

  The capacitance calculation unit 30 calculates the amount of capacitance necessary to fill the difference between the resonance frequencies calculated by the inlet frequency calculation unit 20 with respect to the resonance frequencies for the inlet 1 to transmit and receive data.

  The interval calculation unit 40 refers to the interval data table 52 and generates the reference interval between the back surface of the IC chip 3 and the antenna 4 and the amount of capacitance calculated by the capacitance calculation unit 30 and the antenna 4. And the distance between the back surface of the IC chip 3 and the antenna 4 is calculated.

  The crimping condition determining unit 60 refers to the crimping condition data table 53 and calculates and determines a crimping condition in which the interval between the back surface of the IC chip 3 and the antenna 4 is the interval calculated by the interval calculating unit 40. In this embodiment, this crimping condition is the mounting condition in the present invention. The crimping conditions include parameter conditions for changing intervals such as a crimping load, an indentation amount, a stroke length, a crimping speed, and a crimping time. In addition, when the change of the space | interval of the back surface of the IC chip 3 and the antenna 4 is the same about at least 2 parameters about crimping conditions, you may prioritize crimping conditions in view of a subsequent process.

  FIG. 4 is a flowchart for explaining a frequency adjustment method for adjusting the resonance frequency of the inlet 1 using the frequency adjustment apparatus shown in FIG.

  First, the antenna frequency acquisition unit 10 acquires the frequency of the single antenna 4 measured in step 2 described above (step 11).

  Next, the inlet frequency calculation unit 20 refers to the frequency data table 51, and the IC chip 3 connects the bump 6 to the antenna having the frequency acquired by the antenna frequency acquisition unit 10 to connect the back surface of the IC chip 3. The resonance frequency of the inlet 1 when mounted on the base substrate 2 with the distance from the antenna 4 as a predetermined reference distance is calculated (step 12). In the frequency data table 51, the frequency of the antenna alone and the IC chip 3 connected to the antenna are mounted on the base substrate 2 with the distance between the back surface of the IC chip 3 and the antenna 4 as a predetermined reference interval. In this case, the resonance frequency of the inlet 1 is associated. Therefore, when the frequency of the antenna 4 alone is acquired by the antenna frequency acquisition unit 10, the IC chip 3 is mounted on the base substrate 2 so that the interval between the back surface of the IC chip 3 and the antenna 4 becomes the reference interval. Thus, the resonance frequency of the inlet 1 in a state connected to the antenna 4 can be calculated. The reference interval between the back surface of the IC chip 3 and the antenna 4 is determined in advance, and the interval between the back surface of the IC chip 3 and the antenna 4 is calculated based on this reference interval.

Next, the capacitance amount calculation unit 30 calculates the capacitance amount necessary to fill the difference of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data ( Step 13). The resonance frequency f of the inlet 1 is such that the inductance component of the inlet 1 is L and the capacitance component is C.
f = 1 / [2π (LC) ^1/2 ]
Therefore, using this equation, the capacitance amount C required to fill the difference f of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data. Can be calculated.

  Next, the interval calculation unit 40 refers to the interval data table 52 and generates the reference interval between the back surface of the IC chip 3 and the antenna 4 and the amount of capacitance calculated by the capacitance calculation unit 30. The distance between the back surface of the IC chip 3 and the antenna 4 is calculated based on the distance between the antenna 4 and the antenna 4 (step 14).

  FIG. 5 is a diagram for explaining the distance between the back surface of the IC chip 3 and the antenna 4.

The distance between the back surface of the IC chip 3 and the antenna 4 is not limited to the distance D ₁ at which the bump 6 is in contact with the antenna 4 as shown in FIG. There is also a case where the distance D ₂ is bitten. Here, since the IC chip 3 has a built-in circuit made of a conductive material, the capacitance changes depending on the distance from the antenna 4. That is, when the distance between the back surface of the IC chip 3 and the antenna 4 is the distance D ₁ as shown in FIG. 5A and the distance D ₂ as shown in FIG. Are different from each other, and the distance D ₁ is smaller than the distance D ₂ . Therefore, in the interval data table 52, the amount of capacitance necessary for filling the difference of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data, and the capacitance amount. The amount of displacement from the reference interval of the distance between the back surface of the IC chip 3 and the antenna 4 necessary for obtaining the relationship is associated. For example, in the interval data table 52, the resonance frequency calculated by the inlet frequency calculation unit 20 is filled with the resonance frequency for the inlet 1 to transmit and receive data by the above-described equation to fill the difference. When it is necessary to reduce the amount of capacitance, the amount of displacement including the increase / decrease condition is the amount of displacement from the reference interval in which the distance between the back surface of the IC chip 3 and the antenna 4 increases by the amount corresponding to the amount of capacitance to be reduced. Is associated with. Further, the resonance frequency calculated by the inlet frequency calculation unit 20 needs to increase the capacitance amount in order to fill the difference with respect to the resonance frequency for the inlet 1 to transmit and receive data by the above-described equation. In this case, the amount of displacement from the reference interval in which the distance between the back surface of the IC chip 3 and the antenna 4 is reduced by an amount corresponding to the amount of capacitance to be increased is associated with the amount of capacitance including the increase / decrease condition. However, when the distance between the back surface of the IC chip 3 and the antenna 4 becomes “0”, the back surface of the IC chip 3 comes into contact with the antenna 4 and an electrical short circuit occurs. A displacement amount such that the interval of “0” is “0” is not set in the interval data table 52.

  In view of this, the interval calculation unit 40 refers to the interval data table 52, whereby the interval between the back surface of the IC chip 3 and the antenna 4 so that the resonance frequency of the inlet 1 becomes the resonance frequency for transmitting and receiving data. The amount of displacement from the reference interval is calculated, and the interval between the back surface of the IC chip 3 and the antenna 4 is calculated based on the amount of displacement and the reference interval.

  Thereafter, the crimping condition determining unit 60 refers to the crimping condition data table 53 to calculate and determine a crimping condition in which the interval between the back surface of the IC chip 3 and the antenna 4 is the interval calculated by the interval calculating unit 40. (Step 15). In the crimping condition data table 53, the IC chip 3 is crimped to the base substrate 2 in order to set the gap between the back surface of the IC chip 3 and the antenna 4 and the gap between the back surface of the IC chip 3 and the antenna 4. The crimping conditions that are necessary for this are associated with each other.

  In view of this, the crimping condition determination unit 60 refers to the crimping condition data table 53 to determine the crimping condition in which the interval between the back surface of the IC chip 3 and the antenna 4 is the interval calculated by the interval calculation unit 40. Can be calculated and determined.

  FIG. 6 is a diagram showing the relationship between the pressure applied to the IC chip 3 and the resonance frequency of the inlet 1 when the IC chip 3 is pressure-bonded to the base substrate 2.

  As described above, the distance between the back surface of the IC chip 3 and the antenna 4 is controlled according to the pressure bonding conditions for the IC chip 3 when the IC chip 3 is pressure bonded to the base substrate 2. 4, the resonance frequency of the inlet 1 varies depending on the crimping condition for the IC chip 3 when the IC chip 3 is crimped to the base substrate 2, as shown in FIG. 6. become. That is, the resonance frequency of the inlet 1 can be controlled by the pressure bonding conditions of the IC chip 3 when the IC chip 3 is pressure bonded to the base substrate 2.

  When the crimping conditions for the IC chip 3 are determined as described above, in step 5, the IC chip 3 is crimped to the base substrate 2 in accordance with the crimping conditions.

  As described above, after the antenna 4 is formed on the base substrate 2, the distance between the antenna 4 and the back surface of the IC chip 3 that is connected to the antenna 4 and mounted on the base substrate 2 and press-bonded is set to the inlet 1. Since the resonance frequency is calculated to be for transmitting and receiving data, and the IC chip 3 is crimped under the crimping condition according to the interval, the IC chip 3 is formed on the base substrate after the antenna 4 is formed. In the process until it is crimped to the material 2, the distance between the back surface of the IC chip 3 and the antenna 4 is calculated in-line, and the resonance frequency of the inlet 1 is adjusted. The resonance frequency for transmitting and receiving data can be adjusted without providing a separate line process and increasing the manufacturing process.

  In this embodiment, an example in which the IC chip 3 is thermocompression bonded to the base substrate 2 is taken as an example, and the IC chip 3 is heated to the base substrate 2 as a mounting condition of the IC chip 3 on the base substrate 2. Although the description has been made on the one using the pressure bonding conditions for the pressure bonding, the mounting of the IC chip 3 on the base substrate 2 is not limited to the thermocompression bonding, and for example, ultrasonic waves may be used. When ultrasonic waves are used, the distance between the back surface of the IC chip 3 and the antenna 4 is controlled not by the load on the IC chip 3 but by the output, amplitude, frequency, and time of the ultrasonic waves. The parameter to be changed is the mounting condition. These mounting conditions are associated with the distance between the back surface of the IC chip 3 and the antenna 4 in a data table similar to the crimping condition data table 53. By referring to this data table, the IC chip 3 is referred to. The mounting condition in which the distance between the back surface of the antenna 4 and the antenna 4 is the distance calculated by the distance calculation unit 40 is calculated and determined.

  Further, in the present embodiment, the explanation has been given by taking the inlet 1 having the coiled antenna 4 and transmitting / receiving data by electromagnetic induction by the electromagnetic wave output from the information writing / reading device as an example. The RF-ID medium whose resonance frequency is adjusted may be a medium having a dipole antenna and transmitting and receiving data by resonating with a radio wave having a frequency in the UHF band.

DESCRIPTION OF SYMBOLS 1 Inlet 2 Base base material 3 IC chip 4 Antenna 5 Jumper part 6 Bump 10 Antenna frequency acquisition part 20 Inlet frequency calculation part 30 Capacitance amount calculation part 40 Spacing calculation part 51 Frequency data table 52 Spacing data table 53 Crimping condition data table 60 Crimping Condition determining section

Claims (1)

An IC chip having an antenna formed on a base substrate and having a connection terminal on a predetermined surface is mounted on the base substrate with the connection terminal connected to the antenna, and transmits and receives data at a resonance frequency. A frequency adjustment method for adjusting the resonance frequency in the RF-ID media,
Obtaining a frequency of a single antenna formed on the base substrate;
RF-ID media when the IC chip is mounted on the base substrate with the connection terminal connected to an antenna having the acquired frequency and the interval between the predetermined surface and the antenna as a reference interval Calculating a resonance frequency;
Calculating the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data;
Calculating an interval between the predetermined surface and the antenna based on the reference interval and an interval between the predetermined surface and the antenna that causes the calculated capacitance amount;
Calculating a mounting condition of the IC chip on the base substrate such that the distance between the predetermined surface and the antenna is the calculated distance.

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