JP2014063367A5 - Frequency adjustment method - Google Patents
Frequency adjustment method Download PDFInfo
- Publication number
- JP2014063367A5 JP2014063367A5 JP2012208397A JP2012208397A JP2014063367A5 JP 2014063367 A5 JP2014063367 A5 JP 2014063367A5 JP 2012208397 A JP2012208397 A JP 2012208397A JP 2012208397 A JP2012208397 A JP 2012208397A JP 2014063367 A5 JP2014063367 A5 JP 2014063367A5
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- base substrate
- predetermined surface
- resonance frequency
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
本発明は、上述したような従来の技術が有する問題点に鑑みてなされたものであって、一般的なＲＦ−ＩＤメディアの製造工程とは別ラインの工程を設けることなく、かつ製造工程を増大させることなくデータを送受信するための共振周波数を調整することができる周波数調整方法を提供することを目的とする。 The present invention has been made in view of the problems of the conventional techniques as described above, and without providing a separate line process from a general RF-ID media manufacturing process, and the manufacturing process. and to provide a frequency adjusting how capable of adjusting the resonance frequency for transmitting and receiving data without increasing.
Claims (1)
前記ベース基材上に形成されたアンテナ単体の周波数を取得する工程と、
前記ＩＣチップが、前記取得された周波数を有するアンテナに前記接続端子を接続して前記所定面と前記アンテナとの間隔を基準間隔として前記ベース基材上に実装された場合のＲＦ−ＩＤメディアの共振周波数を算出する工程と、
前記ＲＦ−ＩＤメディアがデータを送受信するための共振周波数に対する前記算出された共振周波数の差分を埋めるために必要となるキャパシタンス量を算出する工程と、
前記基準間隔と、前記算出されたキャパシタンス量を生じさせる前記所定面と前記アンテナとの間隔とに基づいて、前記所定面と前記アンテナとの間隔を算出する工程と、
前記所定面と前記アンテナとの間隔が、前記算出された間隔となるような前記ＩＣチップの前記ベース基材上への実装条件を算出する工程とを有する周波数調整方法。 An IC chip having an antenna formed on a base substrate and having a connection terminal on a predetermined surface is mounted on the base substrate with the connection terminal connected to the antenna, and transmits and receives data at a resonance frequency. A frequency adjustment method for adjusting the resonance frequency in an RF-ID medium,
Obtaining a frequency of a single antenna formed on the base substrate;
RF-ID media when the IC chip is mounted on the base substrate with the connection terminal connected to an antenna having the acquired frequency and the interval between the predetermined surface and the antenna as a reference interval Calculating a resonance frequency;
Calculating the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data;
Calculating an interval between the predetermined surface and the antenna based on the reference interval and an interval between the predetermined surface and the antenna that causes the calculated capacitance amount;
Calculating a mounting condition of the IC chip on the base substrate such that the distance between the predetermined surface and the antenna is the calculated distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012208397A JP5969339B2 (en) | 2012-09-21 | 2012-09-21 | Frequency adjustment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012208397A JP5969339B2 (en) | 2012-09-21 | 2012-09-21 | Frequency adjustment method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014063367A JP2014063367A (en) | 2014-04-10 |
| JP2014063367A5 true JP2014063367A5 (en) | 2015-10-29 |
| JP5969339B2 JP5969339B2 (en) | 2016-08-17 |
Family
ID=50618539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012208397A Active JP5969339B2 (en) | 2012-09-21 | 2012-09-21 | Frequency adjustment method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5969339B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6925701B2 (en) * | 2003-03-13 | 2005-08-09 | Checkpoint Systems, Inc. | Method of making a series of resonant frequency tags |
| JP2005321930A (en) * | 2004-05-07 | 2005-11-17 | Toppan Forms Co Ltd | Noncontact data transmitting and receiving body, and capacitance adjustment method and capacitance adjustment device therefor |
-
2012
- 2012-09-21 JP JP2012208397A patent/JP5969339B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2012102576A3 (en) | Broad-band dual polarization dipole antenna and antenna array | |
| WO2015073984A3 (en) | Card with a metal layer and an antenna | |
| WO2012141541A3 (en) | Interposer for optical module, optical module using the same, method for manufacturing the same | |
| WO2011099693A3 (en) | Antenna using a ground radiator | |
| TW201613044A (en) | Fingerprint recognition chip packaging structure and packaging method | |
| WO2012037216A3 (en) | Staged via formation from both sides of chip | |
| WO2011080299A3 (en) | A terminal and a method for communicating simultaneously on two frequencies | |
| EA201170806A1 (en) | METHOD AND DEVICE FOR ACCURATE MEASUREMENT OF CABLE CONNECTION TEMPERATURE ON THE BASIS OF HIGH-FREQUENCY TECHNOLOGY | |
| WO2009004827A1 (en) | Wireless ic device | |
| EP2405474A4 (en) | Bump, method for forming the bump, and method for mounting substrate having the bump formed thereon | |
| WO2012094436A3 (en) | Electronic components on paper-based substrates | |
| WO2012103203A3 (en) | Frid transponder and method for connecting semiconductor die to antenna | |
| JP2011175250A5 (en) | Semiconductor device | |
| EP2648238A3 (en) | Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package | |
| WO2011139496A3 (en) | Techniques for interconnecting stacked dies using connection sites | |
| EP3041046A4 (en) | Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing method | |
| WO2012165797A3 (en) | Antenna structure | |
| EP2866257A3 (en) | Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same | |
| WO2013098280A3 (en) | Downhole communication | |
| EP2490157A3 (en) | Reversible thermosensitive recording medium and method for producing the same | |
| WO2012078709A3 (en) | Compliant interconnects in wafers | |
| WO2013036480A3 (en) | Backplate with recess and electronic component | |
| WO2012134934A3 (en) | Identifier encoding scheme for use with multi-path connectors | |
| WO2015135784A3 (en) | Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly | |
| WO2011132971A3 (en) | Semiconductor chip including bump having barrier layer, and manufacturing method thereof |