JP5963476B2 - Tool for cutting tools - Google Patents

Description

  The present invention relates to a cutting tool including a cutting tool including a cutting tool for cutting a workpiece.

  Conventionally, in a cutting tool provided with a cutting tool including a cutting tool (cutting blade) for cutting a workpiece such as a semiconductor wafer, for example, as disclosed in Patent Document 1, a contact-type thickness measuring device ( By measuring the thickness of the workpiece with a length measuring device), the workpiece is thinned by cutting with high accuracy.

  As disclosed in Patent Document 1, such a contact-type thickness measuring device generally has a configuration in which a thin rod-shaped measurement terminal is projected from the lower end of a cylindrical main body, and the measurement terminal Is assumed to move in the vertical direction.

JP 2007-59523 A

  Since the thickness measuring device is exposed to the outside, there is a concern that the cutting waste of the workpiece generated during the cutting process or the cutting water supplied to the workpiece for cooling adheres to the thickness measuring device. . And when cutting waste accumulates or cutting water remains attached, there is a concern that the movement of the measurement terminal may be hindered. In other words, there is a concern that a measurement terminal malfunctions and, in turn, a measurement defect occurs.

  In particular, in the case of a thickness measuring device having an expandable bellows part, if cutting waste adheres and accumulates on the bellows part over a long period of time, the bellows part is fixed in a contracted state, and the tip of the measurement terminal May not reach the object to be measured, and the thickness of the workpiece may not be measurable.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a cutting tool capable of reducing the problem that the thickness of a workpiece becomes unmeasurable due to adhesion of the bellows portion. That is.

According to the present invention, a cutting tool including a cutting tool including a cutting tool for cutting a workpiece, a holding table having a holding surface for holding the workpiece, and a perpendicular to the holding surface. A cutting tool having a spindle having a rotating shaft and a cutting tool wheel including a cutting tool mounted on the spindle and cutting the workpiece held by the holding table, and during cutting of the workpiece A cutting water supply means for supplying cutting water to the workpiece and the bite wheel, and a contact needle that contacts the holding surface of the holding table and the upper surface of the workpiece held by the holding table. A workpiece thickness measuring means for measuring the thickness of the workpiece held by the holding table, and the contact needle includes a bar-shaped body and a bellows portion that can be expanded and contracted to the bar-shaped body. The holding surface connected via , Anda tip in contact with the upper surface of the workpiece, workpiece thickness measuring means has a through-hole in which the contact needle is inserted, made of a transparent material which surrounds at least a meandering abdomen A cutting tool including a cover member is provided.

  According to the present invention, since it has a cover member that surrounds at least the bellows part of the workpiece thickness measuring means, it is prevented that the cutting waste adheres to the bellows part, and the thickness of the workpiece cannot be measured due to the fixing of the bellows part. It is possible to reduce the problem of becoming.

  In addition, since the cover member is made of a transparent body, even if cutting waste enters the inside of the cover member through the through-hole, adhesion and accumulation of cutting waste can be visually confirmed, and cleaning is performed appropriately. And the cover member can be exchanged. Thereby, the malfunction that the thickness of a to-be-processed object becomes unmeasurable by adhesion of a bellows part can be reduced more reliably.

It is a perspective view of the cutting tool as one embodiment of the present invention. It is a side view shown about the outline | summary of the measurement by a thickness measuring apparatus. (A) is side surface partial sectional drawing which shows the state in which a front-end | tip part is accommodated in the inside of a through-hole at the time of non-measurement. (B) is a side partial sectional view showing a state in which a tip portion protrudes from a lower end portion of a through hole during measurement.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a perspective view of a cutting tool as an embodiment of the present invention. The housing 4 of the cutting tool 2 comprises a horizontal housing part 6 and a vertical housing part 8.

  A pair of guide rails 12 and 14 extending in the vertical direction are fixed to the vertical housing portion 8. A cutting unit 16 is mounted along the pair of guide rails 12 and 14 so as to be movable in the vertical direction. The cutting unit 16 is attached to a moving base 18 that moves up and down along a pair of guide rails 12 and 14 via a support portion 20.

  The cutting unit 16 includes a spindle housing 22 attached to the support portion 20, a spindle 24 rotatably accommodated in the spindle housing 22, and a servo motor 26 that rotationally drives the spindle 24. A bite wheel 30 is fixed to the tip of the spindle 24, and a cutting bit 52 is attached to the bite wheel 30.

  The cutting tool 2 includes a cutting unit feed mechanism 44 that moves the cutting unit 16 in the vertical direction along the pair of guide rails 12 and 14. The cutting unit feeding mechanism 44 includes a ball screw 46 and a pulse motor 48 fixed to one end of the ball screw 46. When the pulse motor 48 is pulse-driven, the ball screw 46 rotates and the moving base 18 is moved in the vertical direction via the nut of the ball screw 46 fixed inside the moving base 18.

  A chuck table 50, which is a holding table, is disposed in the recess 10 of the horizontal housing portion 6. The chuck table 50 is moved in the Y-axis direction by a chuck table moving mechanism (not shown). 70 and 72 are bellows.

  In the horizontal housing portion 6 of the housing 4, a first wafer cassette 74, a second wafer cassette 76, a wafer transfer means 78, a temporary wafer placement means 80, a wafer carry-in means 82, and a wafer carry-out means 84 are provided. A cleaning means 86 is provided. Further, an operation means 88 is provided in front of the housing 4 for an operator to input cutting conditions and the like.

  In the concave portion 10 of the horizontal housing portion 6, below the cutting unit 16, in the vicinity of the moving area of the chuck table 50, cutting water is supplied to the wafer and the bite wheel 30 during the cutting of the wafer as the workpiece. A cutting water jet nozzle 90 for supplying is provided.

  The horizontal housing portion 6 is provided with a gate-shaped frame 60 so as to straddle the recess 10, and the chuck table 50 can pass through a space below the frame 60.

  The frame 60 has a contact surface that contacts the holding surface of the chuck table 50 and the upper surface of the wafer held by the chuck table 50, and a pair of thickness measurements for measuring the thickness of the wafer held by the chuck table 50. Devices 62 and 64 are provided.

  FIG. 2 is a side view showing an outline of the measurement by the thickness measuring devices 62 and 64. The height position H 2 of the holding surface 50 a of the chuck table 50 is measured by one thickness measuring device 62 and the other measuring device 64 is measured. A state in which the height position H4 of the upper surface 11a of the wafer 11 is measured is shown.

  The thickness H1 of the wafer 11 can be detected by calculating the difference between the height positions H2 and H4 measured by the thickness measuring devices 62 and 64 by a control device (not shown).

  The cutting work of the cutting tool 2 configured as described above will be described below. The wafer 11 accommodated in the first wafer cassette 74 is transferred by the vertical movement and forward / backward movement of the wafer transfer means 78 and is placed on the temporary wafer placement means 80.

  The wafer placed on the temporary wafer placement means 80 is centered by a plurality of positioning pins, and is then positioned in the wafer carry-in / out area by the turning operation of the wafer carry-in means 82. 50, and is sucked and held by the chuck table 50.

  When the chuck table 50 sucks and holds the wafer 11 as described above, the chuck table moving mechanism is operated to position the chuck table 50 below the thickness measuring device 64.

  Next, the thickness measuring device 62 measures the height of the holding surface 50a of the chuck table 50, and the thickness measuring device 64 is brought into contact with the upper surface 11a of the wafer 11 to measure the height position of the upper surface 11a. A thickness H1 (see FIG. 2) of the wafer 11 is calculated.

  Next, a target cutting height of the wafer 11 held on the chuck table 50 is set based on the calculated thickness H1 of the wafer 11.

  When the target cutting height is set in this way, the upper surface 11a of the wafer 11 is cut with the cutting bit 52 by feeding the chuck table 50 in the arrow Y direction at, for example, 2 mm / sec while rotating the cutting bit 52 at, for example, 6000 rpm. To do.

  Next, as shown in FIGS. 2 and 3, the configuration of a thickness measuring apparatus 62 that is characteristic in the present invention will be described below. Since the thickness measuring device 64 configured in a pair with the thickness measuring device 62 has the same configuration as that of the thickness measuring device 62, the thickness measuring device 62 will be representatively described using the configuration of the thickness measuring device 62.

  The thickness measuring device 62 includes a contact needle 63 that contacts the holding surface 50 a of the chuck table 50. The contact needle 63 includes a bar-shaped main body 63a and a tip 63c that contacts a holding surface 50a connected to the bar-shaped main body 63a via a bellows 63b that can be expanded and contracted.

  The bar-shaped main body 63a is formed of a cylindrical member, and is disposed so as to hang through the frame 60 from a casing 63d installed on the upper surface 60a of the frame 60. A manifold space filled with working air is formed inside the cylindrical shape, and high pressure working air is supplied to the manifold space from an air supply source (not shown).

  The bellows portion 63b is formed of a cylindrical member, and an upper portion thereof is fixed to the lower end portion of the bar-shaped main body 63a, and a lower portion thereof is fixed to the upper end portion of the tip end portion 63c. The inside of the bellows portion 63b in the cylindrical shape communicates with the inside of the bar-shaped main body 63a, and operating air is supplied to the inside of the bellows portion 63b through the bar-shaped main body 63a.

  The bellows part 63b comprises a cylindrical member made of a flexible resin, and an elastic member such as a coil spring is built in the cylindrical member. This elastic member is configured to generate a biasing force in a direction in which the bellows portion 63b is contracted.

  The tip portion 63c is a part that abuts on the holding surface 50a to be measured, and a sensor mechanism for detecting the height position of the holding surface 50a is provided inside. The information detected here is transmitted to the control unit through a signal cable (not shown).

  In the above configuration, when the height position is measured, the working air is supplied, the bellows portion 63b extends, and the tip portion 63c moves downward to contact the holding surface 50a that is the measurement target. It is like that.

  And in order to cover the contact needle 63 comprised as mentioned above, the thickness measuring apparatus 62 is equipped with the cover member 65 which has the through-hole 65a in which the contact needle 63 is inserted, and surrounds at least the bellows part 63b. It is said.

  In the present embodiment, the cover member 65 is configured by a block-shaped member, and is suspended from the lower surface 60 b of the frame 60. The cover member 65 is made of a transparent resin so that the state of the contact needle 63 passed through the through hole 65a can be visually recognized from the outside.

  A bar-shaped main body 63a, a bellows portion 63b, and a tip portion 63c constituting the contact needle 63 are accommodated in the vertical through-hole 65a formed in the cover member 65.

  The inner diameter of the through hole 65a is set to a size that allows the bellows part 63b and the tip part 63c to slide, and between the through hole 65a and the bellows part 63b, between the through hole 65a and the tip part 63c, A slight gap is formed in each case.

  As shown in FIG. 3A, the tip 63c is housed inside the through hole 65a when not measuring, while the tip from the lower end of the through hole 65a is measured as shown in FIG. 3B. The part 63c protrudes.

  Further, as shown in FIGS. 3 (A) and 3 (B), the bellows portion 63b is kept accommodated in the through hole 65a both at the time of non-measurement and at the time of measurement. The surrounding area is enclosed.

  Even if the cutting water 68 and the cutting waste 69 of the wafer 11 described above adhere to the outer surface of the cover member 65, the cutting water 68 and the cutting waste 69 reach the bellows portion 63 b inside the cover member 65. Therefore, it is possible to prevent the cutting water 68 and the cutting waste 69 from adhering to the bellows part 63b.

  In addition, when the bellows part 63b consists of Teflon (trademark) type resin, for example, it will be in the condition where cutting waste tends to adhere to the surface of the bellows part 63b by static electricity. For this reason, the cover member 65 is made of, for example, a resin that easily generates static electricity such as vinyl chloride, thereby creating a situation in which cutting waste easily adheres to the cover member 65 due to static electricity generated on the cover member 65 side. It is good as well.

The present invention can be implemented as described above.
That is, in this embodiment, as shown in FIG. 1, a cutting tool 2 having a cutting unit (cutting cutting means) 16 including a cutting bit 52 for cutting a wafer 11 as a workpiece, 11, a chuck table (holding table) 50 having a holding surface 60 a for holding 11, a spindle 24 having a rotation axis orthogonal to the holding surface 50 a, and a bite wheel 30 including a cutting bit 52 attached to the spindle 24. Then, a cutting unit 16 that cuts the wafer 11 held by the chuck table 50, and a cutting water jet nozzle (cutting water supply means) 90 that supplies cutting water to the wafer 11 and the bite wheel 30 while the wafer 11 is being cut. And it has composition which has.

  Further, as shown in FIGS. 2 and 3, the chuck table 50 has a pair of contact needles 63 and 66 that respectively contact the holding surface 50 a of the chuck table 50 and the upper surface 11 a of the wafer 11 held by the chuck table 50. 50, thickness measuring devices (workpiece thickness measuring means) 62, 64 for measuring the thickness of the wafer 11 held by the contact needles 63c, 66c extend and contract to the bar-shaped main body 63a and the bar-shaped main body 63a. Including the holding surface 50a connected via the possible bellows parts 63b and 66b or the tip parts 63a and 66a contacting the upper surface 11a of the wafer 11, and the thickness measuring devices 62 and 64 are contact needles 63 and 66, respectively. Are provided with through holes 65a and 67a, and cover members 65 and 67 surrounding at least the bellows portions 63b and 66b.

  And according to the above embodiment, since it has the cover members 65 and 67 surrounding at least the bellows parts 63b and 66b of the thickness measuring devices 62 and 64, it is prevented that the cutting waste adheres to the bellows parts 65 and 67. The problem that the thickness of the wafer 11 (workpiece) becomes impossible to measure can be reduced by fixing the bellows portions 63b and 66b in a contracted state.

  In the above embodiment, the two thickness measuring devices 62 and 64 are provided. The holding surface 50 a of the chuck table 50 is used by one thickness measuring device 62 and the wafer 11 is used by the other thickness measuring device 64. The height position of the upper surface 11a is measured, but in addition to this, for example, one thickness measurement device 62 is used, and both the holding surface 50a and the upper surface 11a are high by the contact needle 63 of the thickness measurement device 62. The position may be measured. In this case, it can be considered that the thickness measuring device 62 is appropriately moved or the chuck table 50 is appropriately moved at the time of measurement.

  In addition, the cover member 65 is preferably made of a transparent body.

  According to this, even if the cutting waste enters the inside of the cover member 65 through the through holes 65a and 67a, it is possible to visually confirm the attachment and accumulation of the cutting waste, and appropriately clean and replace the cover member 65. Is possible. Thereby, the malfunction that the thickness of the wafer 11 becomes unmeasurable by adhesion of the bellows parts 63b and 66b can be reduced more reliably.

DESCRIPTION OF SYMBOLS 50 Chuck table 50a Holding surface 62 Measuring device 63 Contact needle 63a Bar-shaped main body 63b Bellows part 63c Tip part 63d Casing 64 Measuring device 65 Cover member 65a Through-hole 90 Cutting water injection nozzle

Claims (1)

A cutting tool including a cutting tool including a cutting tool for cutting a workpiece,
A holding table having a holding surface for holding the workpiece;
A cutting tool having a spindle having a rotation axis orthogonal to the holding surface and a cutting tool wheel including a cutting tool mounted on the spindle, and cutting the workpiece held by the holding table;
Cutting water supply means for supplying cutting water to the workpiece and the bite wheel during cutting of the workpiece;
A workpiece thickness having a contact needle that contacts the holding surface of the holding table and the upper surface of the workpiece held by the holding table, and measures the thickness of the workpiece held by the holding table Measuring means,
The contact needle is
A bar-shaped body;
The holding surface connected to the bar-shaped main body via an extendable bellows portion, or a tip portion contacting the upper surface of the workpiece,
The workpiece thickness measuring means includes:
A cutting tool having a through-hole into which the contact needle is inserted, and a cover member made of a transparent body surrounding at least the bellows part.

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