JP5963175B2 - Method and apparatus for forming insulation component for power cable - Google Patents

Description

  The present invention relates to a method and an apparatus for forming an insulating component for a power cable.

In the conventional premolded insulator for power cables, first, the insulating layer or semiconductive layer is wound with unvulcanized insulating rubber or semiconductive rubber tape in which a vulcanizing agent is blended in the core metal. It is formed by adjusting the shape into a spindle shape, filling it into a mold and molding and vulcanizing it.
The pre-molded insulator formed by molding vulcanization removes burrs, polishes the bonding interface between the insulating layer and the semiconductive layer, sets the insulating layer and semiconductive layer on the core, and newly adds insulating rubber. Alternatively, it is formed by winding a tape of semiconductive rubber, filling the mold again, and pressure vulcanizing (for example, Patent Document 1).

JP-A-8-98362

However, in the conventional method for forming a pre-mold insulator, the winding work of the insulating rubber or the semiconductive rubber tape which is the raw material of the insulating layer or the semiconductive layer is manually performed. The work to form the target shape requires skill and depends on the skill of the worker.
For this reason, there has been a variation in the adjustment of the winding tension and the work of forming the target shape, and there has been a problem that voids (bubbles) and peeling may occur if these results are not good.

  An object of the present invention is to form an excellent insulating component for a power cable that is less likely to cause voids or peeling.

  The present invention provides a method for forming an insulating component for power cables, and a shape pre-formation step in which unvulcanized resin is wound or placed on a core metal, and the shape of the resin wound or mounted on the core metal is corrected. It comprises a shape correcting step of pressing a pressing die and a vulcanizing step of vulcanizing the resin molded by the pressing die in a vulcanizing mold.

In the above invention, since the shape is corrected by pressing the pressing die against the resin wound or placed on the core metal, the resin can be brought close to the target shape.
Furthermore, since the pressing operation of the above-mentioned pressing mold is performed before entering the mold for vulcanization in the vulcanization process, even if there is a variation in winding tension or unevenness of the resin, it is corrected so that it is uniform throughout. In this state, it can be put into a vulcanization mold used in the vulcanization process, and it is possible to effectively reduce the occurrence of voids and peeling after vulcanization.

  In the method for forming an insulating part for a power cable, in the shape correction step, the shape may be corrected by pressing the pressing die from the entire periphery against the resin wound or placed on the core metal.

In the above invention, in the shape correction step, the pressing mold is pressed against the resin from the entire periphery to correct the shape, so that the work can be performed easily and quickly.
Especially for small power cable insulation parts, it is difficult to disperse the applied pressure on the resin and it is easy to correct the shape, so the variation in the work of adjusting the winding tension and shaping to the target shape can be sufficiently reduced. Is possible.

  Further, in the method for forming an insulating component for power cables, in the shape correction step, the resin wound around or placed on the core metal with a predetermined angular range around the resin centered on the core metal You may correct | amend the whole shape by performing the operation | work which presses a pressing die in multiple times, changing the angle of the said pressing die centering on the said core metal.

  In the above invention, in the shape correction step, the operation of pressing the pressing die only within a predetermined angle range centered on the core metal against the resin is performed a plurality of times while changing the angle, so the pressing die is applied to the entire surface at once. Compared with the case of pressing, since the dispersion of the applied pressure does not occur, it is possible to adjust the winding tension and correct the target shape more effectively.

  In the method for forming an insulating part for power cables, the shape may be corrected by pressing a plurality of the pressing dies in the shape correction step.

  In the above invention, in the shape correction step, the shape is corrected by pressing the entire surface of the resin against the resin, so that the work can be easily and quickly performed.

  In the method for forming a power cable insulation component, the resin wound or placed on the core metal may be an insulation layer or a semiconductive layer of the power cable insulation component.

  In the above invention, it is possible to form an excellent insulating layer or semiconductive layer that has no voids after vulcanization and hardly causes peeling.

  Further, the present invention provides a power cable insulation component forming apparatus, wherein a support base that rotatably supports a core metal on which unvulcanized resin is wound or placed is rotatably supported on the core metal on the support base. And a pressing die for correcting the shape of the resin wound or placed around the core bar.

In the above invention, since the shape is corrected by pressing the pressing die against the resin wound or placed on the core metal, the resin can be brought close to the target shape.
In addition, since the mandrel is rotatable, the pressing mold can be easily pressed from any direction against the unvulcanized resin, and the resin is molded by pressurizing as a whole. It is possible to effectively reduce the occurrence of subsequent voids and peeling.

  Moreover, in the said formation apparatus of the insulation components for electric power cables, the said press die may be a shape which presses only to the one part angle range centering on the said metal core with respect to the resin wound or mounted on the said metal core. good.

In the above invention, since the pressing die presses only a part of the angular range centering on the core metal against the resin, and the core metal is rotatable on the mounting table, the core metal resin While rotating the, the pressing die is pressed a plurality of times.
Thereby, compared with the case where the pressing die is pressed against the entire surface at once, the applied pressure is not dispersed, so that the winding tension can be adjusted and the target shape can be corrected more effectively.

  Moreover, in the said formation apparatus of the insulation components for power cables, you may provide two or more said stamping dies.

  In the above invention, since a plurality of pressing dies can be pressed against the core metal resin, the shape can be corrected efficiently.

  As described above, according to the present invention, it is possible to form an excellent power cable insulation component that is less prone to voids and peeling.

It is the front schematic diagram which notched a part of premold insulator used as the object of formation. It is a figure which shows the state before forming and correcting an insulating layer in a metal core, The illustration of the half is abbreviate | omitted. It is a front view of the insulating layer during shape correction. It is a front view of a forming apparatus. It is a top view of a forming apparatus. It is a perspective view of the push type | mold of an insulating layer. It is a figure which shows the state before forming and correcting a semiconductive layer in a metal core, The illustration of the half is abbreviate | omitted. It is a front view of the semiconductive layer during shape correction. It is a perspective view of the pressing die of a semiconductive layer. It is a perspective view which shows the other example of a push die.

  Hereinafter, as an embodiment of the invention, a method for forming an insulating component for a power cable and a forming apparatus used therefor will be described with reference to the drawings.

[Premold insulator]
FIG. 1 shows a pre-molded insulator 10 as an insulating part for a power cable, and a half thereof is shown in cross section with a center line as a boundary.
This pre-molded insulator (hereinafter simply referred to as “insulator”) 10 is used by being attached to the end of the power cable at the intermediate connection portion and the end connection portion of the power cable.
That is, the pre-molded insulator is accommodated inside the intermediate connection portion and the termination connection portion while being attached to the outer periphery of the termination portion of the power cable, and relaxes the electric field at the end of the power cable.
As in the case of pre-molding, when the power cable terminal connection portion is installed, a finished product of the insulator 10 is manufactured in advance at a factory or the like instead of being formed on the outer periphery of the power cable end portion at the site. At the end of the power cable.

The power cable has a conductor, an internal semiconductive layer, an insulating layer, an external semiconductive layer, a shielding layer, a sheath (protective layer), etc., in order from the center, and each end of the power cable is stepped to a predetermined length. Sequentially exposed.
The insulator 10 has a cylindrical shape, and is attached to the boundary between the insulating layer of the power cable and the external semiconductive layer in a state where the power cable is passed inside.

The insulator 10 has a spindle shape, and includes an insulating layer 11 formed on one end side of the insulator 10 and a semiconductive layer 12 formed on the other end side. The insulating layer 11 is formed of a resin such as ethylene propylene rubber having insulation and elasticity such as EPM (Ethylene Propylene Methylene Linkage) and EPDM (Ethylene Propylene Diene Methylene Linkage). Further, the semiconductive layer 12 is formed from a resin having semiconductive properties by including conductive carbon or the like in ethylene propylene rubber or the like.
And the insulator 10 whose inner diameter is smaller than the outer diameter of the insulating layer of the power cable is used. When attaching to the power cable, it is press-inserted by chamfering the corners of the end face of the insulator 10. And the insulator 10 is attached in the state closely_contact | adhered to the insulating layer and semiconductive layer of the electric power cable by the contraction pressure without a gap. The semiconductive layer 12 of the insulator 10 is in close contact with the semiconductive layer of the power cable and becomes conductive.

[Premold insulator forming method]
When the insulator 10 is formed, the pre-molding step of the insulating layer 11, the shape correcting step of the insulating layer 11, the vulcanizing step of the insulating layer 11, the post-processing step of the insulating layer 11, the pre-molding step of the semiconductive layer 12, The shape correction process of the conductive layer 12, the vulcanization process of the semiconductive layer 12, and the post-processing process of the semiconductive layer 12 are performed in order.
These will be described in turn.

[Insulating layer pre-molding process]
In the pre-molding process of the insulating layer 11, as shown in FIG. 2, an insulating tape-shaped resin is manually wound around the outer peripheral surface of the columnar core 21 so that no gap is generated in the tape. It is brought close to the target shape of the insulating layer 11 while being laminated. In addition, the target shape of the insulating layer 11 in this pre-molding process is not the shape of FIG. 1 but a simpler rugby ball type. As the tape-like resin, an unvulcanized resin containing a vulcanizing agent is used.
At this time, it is desirable that the formed insulating layer 11 be finished in a target shape. However, as shown in FIG. 2, the winding of the insulating resin is finished when the insulating layer 11 has a shape close to the target shape to some extent.

[Insulating layer shape correction process]
Next, the shape correction is performed on the insulating layer 11 formed on the cored bar 21 by winding an insulating resin using a power cable insulator forming device 30 (hereinafter, simply referred to as “forming device 30”). The process is executed. 3 is a front view of the insulating layer 11 during shape correction, FIG. 4 is a front view of the forming apparatus 30, and FIG. 5 is a plan view. 4 and 5 show a state in which a pressing die 50 for a semiconductive layer 12 to be described later is provided. In the shape correction process of the insulating layer 11, the pressing die for the insulating layer shown in FIG. 40.

  The forming device 30 is provided on a support base 31 that rotatably supports the core metal 21, and is movable on the support base 31 toward the core metal 21, and with respect to the insulating resin wound around the core metal 21. A plurality of (for example, four) pressing dies 40 (or 50) for correcting the shape, and a motor 32 as a drive source for moving the respective pressing dies 40 toward and away from the resin wound around the core metal 21 are provided. ing.

  The support base 31 has a smooth and horizontal upper surface, and has an insertion hole 31a into which one end of the cored bar 21 can be inserted. The cored bar 21 is supported by the insertion hole 31a so that the center line direction is in the vertical vertical direction. Further, the insertion hole 31a has a slight clearance with respect to the core metal 21, and the core metal 21 can be smoothly rotated.

FIG. 6 is a perspective view of the pressing die 40. As shown in FIGS. 3 and 6, the pressing die 40 is a rectangular parallelepiped block made of a hard material such as metal, and a notch corresponding to a target shape of the outer peripheral surface of the insulating layer 11 is formed at one end portion thereof. 41 is formed. The cutout 41 is formed by cutting out from a target shape of the insulating layer 11 along a shape obtained by orthogonal projection along the radial direction with the cored bar 21 as the center.
Each pressing die 40 has a radial direction centering on the insertion hole 31a on the upper surface of the support base 31 so that the notch 41 side can move toward the core metal 21 and the insulating layer 11 on the support base 31. It is supported by a slide guide 33 that can slide along.
That is, the pressing die 40 presses the inner surface of the notch 41 against the outer peripheral surface of the insulating layer 11 to correct the resin bias and the like. The range in which one pressing die 40 contacts the insulating layer 11 is a range of about 15 ° with the cored bar 21 as the center. The contact range is preferably less than [360 ° ÷ (number of individuals of the pressing die 40)].
The four pressing dies 40 are radially arranged on the upper surface of the support base 31 in four directions centering on the insertion hole 31a. In FIG. 3, only the two pressing dies 40, 40 facing each other are illustrated. The other two pressing dies 40 are not shown.

The motor 32 converts the rotational force of the motor 32 into a linear movement in the horizontal direction by a well-known mechanical element disposed inside the support base 31 and applies it to each pressing die 40. The four pressing dies 40 move forward and backward while maintaining an equal distance from the cored bar 21 by driving the motor 32.
Further, the forming apparatus 30 has a control circuit (not shown) of the motor 32, and each push die 40 receives an input setting of a forward position that is closest to the backward position that is farthest from the metal core 21, and the control circuit sets the setting. The motor 32 is controlled to move forward and backward according to the above.

In the shape correction process, the cored bar 21 in which the resin is wound around the insertion hole 31a of the support base 31 of the forming apparatus 30 is set. Then, when driving of the motor 32 is started, each pressing die 40 moves toward the insulating layer 11. As a result, the portion of the insulating layer 11 that is offset outward in the radial direction is corrected by pressing the notch 41 of the pressing die 40 and pressing it back.
Then, while rotating the core metal 21 and the insulating layer 11 by about 15 ° around the center line by hand, the contacting and separating movement of each pressing die 40 is repeated, and the entire outer periphery of the insulating layer 11 is corrected in order.
In addition, although the angle which performs the rotation operation of the metal core 21 and the insulating layer 11 is not limited to 15 °, the angle can be increased or decreased. However, as the angle range is narrowed, the shape of the insulating layer 11 can be corrected more accurately.

Further, although the angles of the cored bar 21 and the insulating layer 11 are changed by hand, a motor serving as a driving source for rotating the cored bar 21 and the insulating layer 11 may be newly added to the forming apparatus 30. In that case, for example, after the motor 32 that moves the contacting and separating of each pressing die 40 presses the pressing die 40 to a predetermined position, the core metal 21 and the insulating layer 11 are rotated by a predetermined specified angle. It is desirable to perform control so that the pressing and rotation are alternately performed a predetermined number of times.
In addition, burrs may occur in the insulating layer 11 when pressed by the pressing die 40. In that case, the generated burrs are cut and removed. The same amount of unvulcanized resin as that removed is pasted to the insufficient portion, and is pressed again with the pressing die 40.

[Insulating layer vulcanization process]
The vulcanization process of the insulating layer 11 is performed using a well-known vulcanization mold (not shown). This vulcanization mold can be divided into a plurality of parts and is formed in a shape that substantially matches the finished product of the insulating layer 11. Then, the metal core 21 and the insulating layer 11 formed in the shape of FIG. 2 on the outer periphery thereof are accommodated inside the metal mold without any gap while the rubber shape is deformed when the metal mold is closed by pressing force. . When the shape of the rubber is deformed by this pressing force, if the shape of the rubber is not good, a large gap is generated between the mold and the rubber, resulting in defects such as voids and rough skin. That is, the shape of the insulating layer in the state shown in FIG. 2 corresponds to the necessity of adjusting the shape to a predetermined shape so that no gap is generated when the mold is closed. In addition, inside the vulcanization mold, heaters serving as heating sources are provided in various places. Further, the cored bar 21 is also provided with a heater storage space, and the insulating layer 11 can be heated from the inside during vulcanization.
Then, the metal core 21 and the insulating layer 11 are accommodated inside, and heated by a heater for a predetermined time at a predetermined temperature (depending on the resin type, but in the case of ethylene propylene rubber, for example, in the range of about 100 to 130 ° C.) (even once). The insulating layer 11 can be vulcanized by heating several times. In addition, since the semiconductive layer 12 is newly added to the vulcanized insulating layer 11 and vulcanized again, the insulating layer 11 is not completely vulcanized, so-called semi-vulcanized at a low temperature. Sulfur may be performed. Thereby, the semiconductive layer 12 formed on the insulating layer 11 can be more closely adhered.

[Insulation layer post-treatment process]
In the post-processing step of the insulating layer 11, polishing processing of the interface with the semiconductive layer 12 in the insulating layer 11 is performed.

[Process before forming semiconductive layer]
In the pre-molding process of the semiconductive layer 12, as shown in FIG. 7, a semiconductive tape-like resin is manually wound on the interface of the insulating layer 11 of the cored bar 21 in a laminated state, It will be closer to 12 target shapes. In addition, this tape-shaped resin is also used as an unvulcanized one containing a vulcanizing agent.
Then, the winding of the insulating resin is finished when the shape is close to the target shape.

[Shape correction process of semiconductive layer]
Next, a shape correction process is performed on the semiconductive layer 12 formed on the cored bar 21 using the forming apparatus 30 described above. FIG. 8 shows a front view of the semiconductive layer 12 during shape correction.
As shown in FIGS. 4 and 5 described above, in the process of correcting the shape of the semiconductive layer, all of the pressing mold 40 for the insulating layer 11 is replaced with the pressing mold 50 for the semiconductive layer 12.
A cylindrical middle piece 59 is attached to the insulating layer 11, and the outer peripheral surface of the insulating layer 11 excluding the interface with the semiconductive layer 12 is covered with the middle piece 59.

FIG. 9 is a perspective view of the pressing die 50. The stamping die 50 is a rectangular parallelepiped block made of a hard material such as metal, like the stamping die 40 described above, and at one end thereof, a cut corresponding to the target shape of the outer peripheral surface of the semiconductive layer 12 is provided. A notch 51 is formed. The cutout 51 is formed by cutting out from the target shape of the semiconductive layer 12 along a shape obtained by orthogonal projection along the radial direction with the cored bar 21 as the center.
Each of the four pressing dies 50 is mounted on the slide guide 33 with the notch 51 facing the core 21 on the support base 31.
Also, in the case of the pressing die 50, the range where one pressing die 50 contacts the semiconductive layer 12 is a range of about 15 ° centering on the core metal 21 ([360 ° ÷ (individual of the pressing die 50). Number)].
In addition, a holding member 55 that holds the middle piece 59 side when the push die 50 moves forward is added to the upper end portion of each push die 50 by screwing.
The four pressing dies 50 are radially arranged on the upper surface of the support base 31 in four directions centered on the insertion hole 31a. However, FIG. 8 shows only two pressing dies 50, 50 facing each other. The other two pressing dies 50 are not shown.

In the shape correction process, the cored bar 21 is set in the insertion hole 31 a of the support base 31 of the forming apparatus 30, and each pressing die 50 moves toward the semiconductive layer 12 by driving the motor 32. As a result, the portion of the semiconductive layer 12 that is offset outward in the radial direction is corrected by the notch 51 of the pressing die 50 being pressed and pushed back.
Also in this case, while the core metal 21, the insulating layer 11, and the semiconductive layer 12 are rotated by about 15 ° around the center line by hand, the pressing die 50 is repeatedly moved and separated to repeat the entire outer periphery of the semiconductive layer 12. Correct in order.
In addition, the point which can change the angle which performs rotation operation of the metal core 21 is the same as that of the case of the insulating layer 11. FIG.
In addition, burrs may occur in the semiconductive layer 12 when pressed by the pressing die 50. In that case, the generated burrs are cut and removed. The same amount of unvulcanized resin as that of the removed part is pasted on the lacking portion, and is pressed again with the pressing die 50.

[Semiconductive layer vulcanization process]
The vulcanization step of the semiconductive layer 12 is performed using a well-known vulcanization mold (not shown). The vulcanizing mold can be divided into a plurality of parts, and the cored bar 21, the insulating layer 11, the middle piece 59, and the semiconductive layer 12 can be accommodated therein with almost no gap. Further, the inside of the vulcanizing mold is provided with a heater as a heating source at various places, which is the same as in the case of the vulcanizing mold for the insulating layer 11 described above.
Then, the cored bar 21, the insulating layer 11, the middle piece 59 and the semiconductive layer 12 are accommodated inside, and a predetermined temperature by the heater (depending on the resin type, but in the case of ethylene propylene rubber, for example, a range of about 100 to 130 ° C.) The semiconductive layer 12 is vulcanized by heating for a certain time (may be heated once or several times).

[Post-processing step of semiconductive layer]
In the post-processing step of the semiconductive layer 12, the middle piece 59 is removed, and the cored bar 21 is extracted from the insulating layer 11 and the semiconductive layer 12.
Thereby, the insulator 10 is completed.

[Technical effects of the embodiment]
As described above, in the method for forming a power cable insulator, in the pre-molding process of the insulating layer 11 and the semiconductive layer 12, the insulating layer 11 or the semiconductive layer 12 made of resin wound around the core metal 21 is used. Since the shape is corrected by pressing the pressing die 40 or 50 before vulcanization, the vulcanization process is performed in a state where it is corrected so as to be uniform even when there is a variation in the tension of the resin wrapping or unevenness of the resin. Can be placed in a mold for vulcanization, and voids and peeling after vulcanization can be effectively reduced.
In particular, the core die 21 set on the support base 31 of the forming apparatus 30 is rotated approximately 15 ° at a time to change the place, and the pressing die 40 or 50 is pressed against the insulating layer 11 or the semiconductive layer 12 to make multiple times. Since the correction is performed separately, a higher contact pressure can be maintained as compared with the case where the entire outer peripheral surface of the insulating layer 11 or the semiconductive layer 12 is corrected simultaneously, and each part of the outer peripheral surface of the insulating layer 11 or the semiconductive layer 12 can be maintained. Therefore, it is possible to effectively correct the shape.

  In addition, the angle range in which the respective pressing dies 40 and 50 are in contact with the insulating layer 11 or the semiconductive layer 12 is desirably narrowed in order to enhance the correction effect, but the range that can be corrected is also narrowed. Therefore, it is desirable to use a plurality of the pressing dies 40, 50. Thereby, even when the range which can correct | amend with the die 40,50 single-piece | unit is narrow, it is possible to correct efficiently.

[Other examples of pressing molds]
FIG. 10 shows another example of a pressing die used in the shape correction process of the semiconductive layer 12.
The aforementioned pressing die 50 is in contact with the outer peripheral surface of the semiconductive layer 12 within a range of 15 ° to correct the shape. In FIG. 10, each of the pressing die 50A is 180 ° by two pressing dies 50A. The shape can be corrected by contacting the outer peripheral surface of the semiconductive layer 12 within the range.
Each pressing die 50 </ b> A is formed with a recess 52 </ b> A that accommodates a 180 ° range centering on the cored bar 21 with respect to the cored bar 21, the insulating layer 11, the middle piece 59, and the semiconductive layer 12. Further, a handle 53A for performing an operation of pressing the pressing die 50A is provided outside.
Then, the other metal mold 50A is covered with the other metal mold 21A from above in a state where the metal core 21, the insulating layer 11, the middle piece 59, and the semiconductive layer 12 are half accommodated in one metal mold 50A, and pressed from above. It is possible to correct the outer shape of the layer 12.
When these pressing dies 50A and 50A are used, it is not necessary to rotate the core metal 21, the insulating layer 11, the middle piece 59, and the semiconductive layer 12, and the pressing is divided into a plurality of times at different locations. Since it is not necessary to perform the work, the shape correction process can be performed quickly and easily.
Since each pressing die 50A has a wide pressing range of 180 ° of the semiconductive layer 12, it is advantageous in forming a small pre-molded insulator that hardly reduces the pressing force per unit area.
In addition, for forming the insulating layer 11, two pressing molds that press the insulating layer 11 within a range of 180 ° may be used.
Further, burrs may occur in the semiconductive layer 12 or the insulating layer 11 when pressed by the pressing die 50A. In that case, the generated burrs are cut and removed. The same amount of unvulcanized resin as that of the removed part is pasted on the lacking portion, and again pressed with the pressing die 50A.
Here, the pressing die 50A of the semiconductive layer 50 is illustrated, but the insulating layer 40 may be similarly formed by two pressing dies corresponding to the 180 ° range.

[Others]
The insulating layer 11 and the semiconductive layer 12 are formed by winding a tape-shaped resin around the cored bar 21 in each forming process. By forming the same material in a compound form, the insulating layer 11 and the semiconductive layer 12 are formed. Also good.
Further, the material is not limited to ethylene propylene rubber, and other resins having insulation and elasticity may be used.

  In the method for forming the premold insulator described above, the shape correction process is performed on both the insulating layer 11 and the semiconductive layer 12 of the premold insulator 10. You may implement a shape correction process only about either. In that case, for the insulating layer 11 or the semiconductive layer 12 that does not perform the shape correction process, when the resin is wound or placed on the core metal 21, it is placed in a mold for vulcanization and vulcanization is performed. Is called.

10 Pre-molded insulation (insulation parts for power cables)
DESCRIPTION OF SYMBOLS 11 Insulating layer 12 Semiconductive layer 21 Core metal 30 Forming device 31 Support base 31a Insertion hole 32 Motor 33 Slide guide 40, 50, 50A Stamping die 55 Holding member 59 Medium piece

Claims (8)

A pre-molding step of winding or placing unvulcanized resin around the core;
A shape correction step of pressing a pressing mold for correcting the shape of the resin wound or placed on the core metal; and
And a vulcanization step of vulcanizing the resin molded by the pressing mold in a vulcanization mold.   2. The formation of an insulating part for a power cable according to claim 1, wherein in the shape correction step, the shape is corrected by pressing the pressing die from the entire periphery against the resin wound or placed on the core metal. Method.   In the shape correction step, an operation of pressing the pressing die in a predetermined angle range around the resin centered on the core metal with respect to the resin wound or placed on the core metal is centered on the core metal. The method for forming an insulating part for a power cable according to claim 1, wherein the entire shape is corrected by performing a plurality of times while changing the angle of the pressing die.   The method for forming an insulating part for a power cable according to claim 2 or 3, wherein, in the shape correction step, the shape is corrected by pressing a plurality of the pressing dies.   5. The insulation for a power cable according to claim 1, wherein the resin wound or placed on the core metal forms an insulation layer or a semiconductive layer of the insulation component for a power cable. 6. Part forming method. A support base for rotatably supporting a cored bar on which unvulcanized resin has been wound or placed;
An insulating part for a power cable, comprising: a pressing die which is provided so as to be movable toward the core metal on the support base and corrects the shape of the resin wound or placed on the core metal. Forming equipment.   The said pressing die is a shape which presses in the predetermined | prescribed angle range of the circumference | surroundings of the said resin centering on the said core metal with respect to the resin wound or mounted on the said core metal. Equipment for forming insulation parts for power cables.   The apparatus for forming an insulating part for a power cable according to claim 6 or 7, comprising a plurality of the pressing dies.

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