JP5949302B2

JP5949302B2 - Repair device and heat transfer cap member

Info

Publication number: JP5949302B2
Application number: JP2012176359A
Authority: JP
Inventors: 原田　徹; 徹原田; 泰之日下部; 山西　宏和; 宏和山西
Original assignee: Fujitsu Ltd
Current assignee: Fujitsu Ltd
Priority date: 2012-08-08
Filing date: 2012-08-08
Publication date: 2016-07-06
Anticipated expiration: 2032-08-08
Also published as: JP2014036106A

Description

本発明は、リペア装置及び伝熱キャップ部材に関する。 The present invention relates to a repair device and a heat transfer cap member.

従来、電子部品に設けられたＢＧＡ（Ball Grid Array）等のはんだ接合部に熱を供給し、そのはんだ接合部を溶融させる電子部品のリペア装置が知られている（特許文献１参照）。 2. Description of the Related Art Conventionally, there is known an electronic component repair device that supplies heat to a solder joint such as a BGA (Ball Grid Array) provided in an electronic component and melts the solder joint (see Patent Document 1).

特開２０１１−２１１０７３号公報JP 2011-211073 A

前記従来のリペア装置を用いて電子部品のリペア作業（リワーク）を行う場合、リペア対象となる電子部品の温度分布が、リペア対象となる電子部品の周囲に配置された他の部品の影響を受けることがある。例えば、熱を吸収し易いヒートシンクがリペア対象となる電子部品に対して対称に配置されていない場合、ヒートシンクに近い側のはんだ接合部の温度が上昇しにくい。この現象は、電子部品に付与された熱が放熱部材であるヒートシンク側に移動し易いことに起因して、電子部品における温度分布が一様になりにくいために生じると考えられる。電子部品に付与された熱を奪い易いものとして基板の電源層があり、この電源層がリペア対象となる電子部品に対して対称に配置されていない場合も同様である。このような状況に対処し、はんだ接合部の温度分布を均一にするため、加熱時間を延長するとタクトタイムが増大する。また、タイムタクトが上昇すると、リペア対象となっていない部品のはんだ接合部も溶融してしまう可能性がある。さらに、温度プロファイルを作成することが難しくなり、リペアができなかったり、温度プロファイル策定に時間がかかってしまったりすることが想定される。 When performing repair work (rework) of an electronic component using the conventional repair device, the temperature distribution of the electronic component to be repaired is affected by other components arranged around the electronic component to be repaired. Sometimes. For example, when the heat sink that easily absorbs heat is not arranged symmetrically with respect to the electronic component to be repaired, the temperature of the solder joint near the heat sink is unlikely to rise. This phenomenon is considered to occur because the temperature distribution in the electronic component is difficult to be uniform due to the heat applied to the electronic component being easily transferred to the heat sink, which is a heat radiating member. The same applies to the case where there is a power supply layer of the substrate that easily removes heat applied to the electronic component, and this power supply layer is not arranged symmetrically with respect to the electronic component to be repaired. In order to cope with such a situation and to make the temperature distribution of the solder joint uniform, if the heating time is extended, the tact time increases. Further, when the time tact increases, there is a possibility that the solder joint portion of the component that is not the repair target is also melted. Furthermore, it is assumed that it is difficult to create a temperature profile, repair cannot be performed, and it takes time to formulate the temperature profile.

そこで、本明細書開示のリペア装置及び伝熱キャップ部材は、リペア対象となる電子部品の温度分布を一様にすることを課題とする。 Thus, the repair device and the heat transfer cap member disclosed in the present specification have an object to make the temperature distribution of the electronic component to be repaired uniform.

本明細書開示のリペア装置は、電子部品に設けられたはんだ接合部に熱を供給して前記はんだ接合部を溶融させるリペア装置であって、非接触熱源と、前記非接触熱源から熱の供給を受ける受熱部と、リペア対象となる電子部品に当接する当接面を備えた複数の伝熱部と、前記受熱部と前記複数の伝熱部との間にそれぞれ配置され、前記受熱部と前記伝熱部との間の伝熱面積を変化させる伝熱ブロックと、前記伝熱部と前記伝熱ブロックの組毎に設けられ、前記伝熱部に接触させて設けられるとともに前記伝熱ブロックと接続され、前記伝熱部の温度に応じて伸縮し前記伝熱ブロックを前記受熱部と前記伝熱部との間で移動させ、伸張に伴って前記伝熱部と前記伝熱ブロックとの接触面積を縮小する駆動部材を備えた伝熱キャップ部材と、を備える。 The repair device disclosed in the present specification is a repair device that melts the solder joint by supplying heat to a solder joint provided in an electronic component, the heat supply from the non-contact heat source and the non-contact heat source A heat receiving part that receives the heat receiving part, a plurality of heat transfer parts having contact surfaces that contact the electronic component to be repaired, and the heat receiving part and the heat receiving part, respectively. A heat transfer block that changes a heat transfer area between the heat transfer unit and a set of the heat transfer unit and the heat transfer block provided in contact with the heat transfer unit and the heat transfer block And is expanded and contracted in accordance with the temperature of the heat transfer section, and the heat transfer block is moved between the heat receiving section and the heat transfer section, and the expansion of the heat transfer section and the heat transfer block with extension a heat transfer cap member with a drive member for reducing the contact area, the Obtain.

熱源より受熱部に供給された熱はそれぞれの伝熱ブロックを通じて複数の伝熱部へそれぞれ伝えられる。このとき、伝熱ブロックは伝熱部の温度に応じて受熱部と伝熱部との間で移動する。これにより、受熱部と伝熱部との間の伝熱面積が変化し、受熱部から伝熱部への伝熱量が調節される。リペア対象となる電子部品における温度分布は、周囲に配置された他の部品の影響で温度が上昇しにくい箇所がある。このような箇所に当接する伝熱部に接触させた駆動部材は伸びにくく、受熱部と伝熱部との間の伝熱面積は大きくなる。この結果、受熱部から伝熱部への伝熱量が増し、伝熱部が昇温し易くなる。一方、リペア対象となる電子部品において温度が上昇し易い箇所に当接する伝熱部に接触させた駆動部材は伸び易い。この結果、受熱部と伝熱部との間の伝熱面積が小さくなる。これにより、受熱部から伝熱部への伝熱が抑制され昇温しにくくなる。このように受熱部と各伝熱部との間で伝熱量が自動的に調節されることにより、リペア対象となる電子部品の温度分布が一様になる。 The heat supplied from the heat source to the heat receiving unit is transmitted to the plurality of heat transfer units through the respective heat transfer blocks. At this time, the heat transfer block moves between the heat receiving unit and the heat transfer unit according to the temperature of the heat transfer unit. Thereby, the heat transfer area between a heat receiving part and a heat transfer part changes, and the heat transfer amount from a heat receiving part to a heat transfer part is adjusted. In the temperature distribution in the electronic component to be repaired, there is a portion where the temperature is difficult to rise due to the influence of other components arranged around. The drive member brought into contact with the heat transfer portion that comes into contact with such a portion is not easily extended, and the heat transfer area between the heat receiving portion and the heat transfer portion is increased. As a result, the amount of heat transfer from the heat receiving portion to the heat transfer portion increases, and the temperature of the heat transfer portion is easily raised. On the other hand, the drive member brought into contact with the heat transfer portion that comes into contact with the location where the temperature is likely to rise in the electronic component to be repaired easily extends. As a result, the heat transfer area between the heat receiving portion and the heat transfer portion is reduced. Thereby, the heat transfer from the heat receiving part to the heat transfer part is suppressed, and it is difficult to raise the temperature. As described above, the amount of heat transfer is automatically adjusted between the heat receiving portion and each heat transfer portion, so that the temperature distribution of the electronic component to be repaired becomes uniform.

本明細書開示のリペア装置及び伝熱キャップ部材は、リペア対象となる電子部品の温度分布を一様にすることができる。 The repair device and the heat transfer cap member disclosed in the present specification can make the temperature distribution of the electronic component to be repaired uniform.

図１は実施形態のリペア装置の使用状態を示す模式図である。FIG. 1 is a schematic diagram illustrating a usage state of the repair device according to the embodiment. 図２は実施形態のリペア装置に含まれる伝熱キャップ部材の斜視図である。FIG. 2 is a perspective view of a heat transfer cap member included in the repair device of the embodiment. 図３は実施形態の伝熱キャップ部材に含まれる受熱部と第１伝熱部〜第４伝熱部を分解して示す説明図である。FIG. 3 is an explanatory view showing the heat receiving portion and the first to fourth heat transfer portions included in the heat transfer cap member of the embodiment in an exploded manner. 図４は受熱部と第１伝熱部〜第４伝熱部とを組み合わせた状態を示す図面であり、図４（Ａ）は平面図、図４（Ｂ）は正面図、図４（Ｃ）は側面図、図４（Ｄ）は底面図である。FIG. 4 is a view showing a state in which the heat receiving portion and the first to fourth heat transfer portions are combined. FIG. 4 (A) is a plan view, FIG. 4 (B) is a front view, and FIG. ) Is a side view, and FIG. 4D is a bottom view. 図５は図４（Ａ）におけるＡ−Ａ線断面図である。FIG. 5 is a cross-sectional view taken along line AA in FIG. 図６は伝熱ブロックの断面図である。FIG. 6 is a cross-sectional view of the heat transfer block. 図７はバイメタルの平面図である。FIG. 7 is a plan view of the bimetal. 図８は伝熱キャップ部材の平面図である。FIG. 8 is a plan view of the heat transfer cap member. 図９（Ａ）は伝熱部の温度が低い状態における伝熱ブロック周辺の様子を示す断面図であり、図９（Ｂ）は平面図である。FIG. 9A is a cross-sectional view showing a state around the heat transfer block when the temperature of the heat transfer section is low, and FIG. 9B is a plan view. 図１０（Ａ）は伝熱部の温度が高い状態における伝熱ブロック周辺の様子を示す断面図であり、図１０（Ｂ）は平面図である。FIG. 10A is a cross-sectional view showing a state around the heat transfer block in a state where the temperature of the heat transfer section is high, and FIG. 10B is a plan view. 図１１（Ａ）は伝熱部の温度がさらに高くなった状態における伝熱ブロック周辺の様子を示す断面図であり、図１１（Ｂ）は平面図である。FIG. 11A is a cross-sectional view showing a state around the heat transfer block in a state where the temperature of the heat transfer section is further increased, and FIG. 11B is a plan view. 図１２（Ａ）は本実施形態のリペア装置における伝熱部の温度変化の様子を示すグラフであり、図１２（Ｂ）は比較例の温度変化の様子を示すグラフである。FIG. 12A is a graph showing the temperature change state of the heat transfer section in the repair device of this embodiment, and FIG. 12B is a graph showing the temperature change state of the comparative example.

以下、本発明の実施形態について、添付図面を参照しつつ説明する。ただし、図面中、各部の寸法、比率等は、実際のものと完全に一致するようには図示されていない場合がある。また、図面によっては、説明の都合上、実際には存在する構成要素が省略されている場合がある。さらに、各部の縮尺、縦横比が図面間で異なっており、模式的に示されている場合がある。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the dimensions, ratios, and the like of each part may not be shown so as to completely match the actual ones. In addition, in some drawings, components that actually exist may be omitted for convenience of explanation. Furthermore, the scale and aspect ratio of each part differ between drawings, and may be shown schematically.

（実施形態）
まず、図１を参照して本実施形態のリペア装置１の使用状態について説明する。リペア装置１は、非接触熱源である光源（ハロゲンランプ）１０と伝熱キャップ部材１１を備える。リペア装置１は、基板１００上に配置された電子部品１１０のリペアに用いられる。電子部品１１０は、複数のはんだ接合部１１０ａを備えたＢＧＡ方式のパッケージである。このリペア対象となる電子部品１１０の周囲には、ヒートシンク１０１を搭載したＢＧＡパッケージ１０１ａが配置されている。また、リペア対象となる電子部品１１０のＢＧＡパッケージ１０１ａとは異なる側には、他の電子部品１０２、１０３が配置されている。このような部品の配置の場合、電子部品１１０の熱はヒートシンク１０１を備えたＢＧＡパッケージ１０１ａが配置された側の温度が上がりにくい。リペア装置１は、リペア対象となる電子部品１１０上に伝熱キャップ部材１１を装着し、伝熱キャップ部材１１が備える受熱部１２に光源１０を照射して熱を供給する。これにより、電子部品１１０に設けられたはんだ接合部１１０ａに熱を供給してはんだ接合部１１０ａを溶融させる。なお、非接触熱源は、例えば、キセノンランプやレーザ光源を用いてもよい。非接触熱源を用いることで、リペア対象となる電子部品１１０が周囲を他の部品で囲まれた狭い領域に配置された場合であっても適切に電子部品１１０を昇温させ、はんだ接合部１１０ａを溶融することができる。 (Embodiment)
First, the use state of the repair apparatus 1 of this embodiment is demonstrated with reference to FIG. The repair device 1 includes a light source (halogen lamp) 10 that is a non-contact heat source and a heat transfer cap member 11. The repair device 1 is used for repairing the electronic component 110 disposed on the substrate 100. The electronic component 110 is a BGA package including a plurality of solder joints 110a. Around the electronic component 110 to be repaired, a BGA package 101a on which a heat sink 101 is mounted is disposed. Further, other electronic components 102 and 103 are arranged on the side of the electronic component 110 to be repaired that is different from the BGA package 101a. In the case of such component arrangement, the heat of the electronic component 110 is unlikely to increase the temperature on the side where the BGA package 101 a including the heat sink 101 is arranged. The repair device 1 mounts the heat transfer cap member 11 on the electronic component 110 to be repaired, and supplies the heat receiving unit 12 included in the heat transfer cap member 11 with the light source 10 to supply heat. Thereby, heat is supplied to the solder joint portion 110a provided in the electronic component 110 to melt the solder joint portion 110a. For example, a xenon lamp or a laser light source may be used as the non-contact heat source. By using a non-contact heat source, even when the electronic component 110 to be repaired is arranged in a narrow area surrounded by other components, the temperature of the electronic component 110 is appropriately increased, and the solder joint 110a Can be melted.

つぎに、図面を参照しつつ、伝熱キャップ部材１１について詳細に説明する。図２はリペア装置１に含まれる伝熱キャップ部材１１の斜視図である。図３は伝熱キャップ部材１１に含まれる受熱部１２と第１伝熱部１３〜第４伝熱部１６を分解して示す説明図である。図４は受熱部１２と第１伝熱部１３〜第４伝熱部１６とを組み合わせた状態を示す図面であり、図４（Ａ）は平面図、図４（Ｂ）は正面図、図４（Ｃ）は側面図、図４（Ｄ）は底面図である。また、図５は図４（Ａ）におけるＡ−Ａ線断面図である。 Next, the heat transfer cap member 11 will be described in detail with reference to the drawings. FIG. 2 is a perspective view of the heat transfer cap member 11 included in the repair device 1. FIG. 3 is an explanatory view showing the heat receiving portion 12 and the first heat transfer portion 13 to the fourth heat transfer portion 16 included in the heat transfer cap member 11 in an exploded manner. 4 is a view showing a state in which the heat receiving portion 12 and the first heat transfer portion 13 to the fourth heat transfer portion 16 are combined, FIG. 4 (A) is a plan view, FIG. 4 (B) is a front view, FIG. 4 (C) is a side view and FIG. 4 (D) is a bottom view. FIG. 5 is a cross-sectional view taken along line AA in FIG.

図面を参照すると、伝熱キャップ部材１１の形状は、矩形である。伝熱キャップ部材１１は、リペア対象となる電子部品１１０に応じた形状、寸法とすることができる。伝熱キャップ部材１１は、四隅に第１伝熱部１３、第２伝熱部１４、第３伝熱部１５及び第４伝熱部１６を備えている。すなわち、伝熱キャップ部材１１は、複数の伝熱部を備える。伝熱部の数は、４個に限定されない。伝熱キャップ部材１１は、第１伝熱部１３〜第４伝熱部１６に囲まれた領域の中心部に受熱部１２を備えている。 Referring to the drawing, the heat transfer cap member 11 has a rectangular shape. The heat transfer cap member 11 can be shaped and dimensioned according to the electronic component 110 to be repaired. The heat transfer cap member 11 includes a first heat transfer unit 13, a second heat transfer unit 14, a third heat transfer unit 15, and a fourth heat transfer unit 16 at four corners. That is, the heat transfer cap member 11 includes a plurality of heat transfer units. The number of heat transfer parts is not limited to four. The heat transfer cap member 11 includes a heat receiving portion 12 at the center of a region surrounded by the first heat transfer portion 13 to the fourth heat transfer portion 16.

受熱部１２は、光源１０から熱の供給を受ける部分であり、形状が矩形である中心部１２１を備えている。そして、矩形の４つの角部のそれぞれから放射状に第１腕部１２ａ、第２腕部１２ｂ、第３腕部１２ｃ及び第４腕部１２ｄが延びている。それぞれの腕部の先端部には、後述する伝熱ブロックの移動を案内するガイド部がそれぞれ設けられている。すなわち、第１腕部１２ａの先端部にはガイド部１２ａ１が設けられている。第２腕部１２ｂの先端部にはガイド部１２ｂ１が設けられている。第３腕部１２ｃの先端部にはガイド部１２ｃ１が設けられている。第４腕部１２ｄの先端部にはガイド部１２ｄ１が設けられている。 The heat receiving portion 12 is a portion that receives supply of heat from the light source 10 and includes a central portion 121 having a rectangular shape. The first arm portion 12a, the second arm portion 12b, the third arm portion 12c, and the fourth arm portion 12d extend radially from each of the four corners of the rectangle. Each arm portion is provided with a guide portion for guiding movement of a heat transfer block described later. That is, the guide portion 12a1 is provided at the tip of the first arm portion 12a. A guide portion 12b1 is provided at the tip of the second arm portion 12b. A guide portion 12c1 is provided at the tip of the third arm portion 12c. A guide portion 12d1 is provided at the tip of the fourth arm portion 12d.

第１伝熱部１３は、矩形の二辺に沿って延びる部分を備えるとともに、その部分の内側に中心側に向かって延びる第１腕部１３ａを備える。第１腕部１３ａは、受熱部１２が備える第１腕部１２ａと対向させて配置される。第１腕部１３ａの先端部には、第１腕部１２ａと同様にガイド部１３ａ１が設けられている。また、図４（Ｄ）を参照すると、第１伝熱部１３は、リペア対象となる電子部品１１０に当接する当接面１３ｂを備えている。 The 1st heat-transfer part 13 is provided with the 1st arm part 13a extended toward the center side inside the part while providing the part extended along two sides of a rectangle. The 1st arm part 13a is arrange | positioned facing the 1st arm part 12a with which the heat receiving part 12 is provided. Similar to the first arm portion 12a, a guide portion 13a1 is provided at the distal end portion of the first arm portion 13a. Referring to FIG. 4D, the first heat transfer section 13 includes a contact surface 13b that contacts the electronic component 110 to be repaired.

第２伝熱部１４は、矩形の二辺に沿って延びる部分を備えるとともに、その部分の内側に中心側に向かって延びる第２腕部１４ａを備える。第２腕部１４ａは、受熱部１２が備える第２腕部１２ｂと対向させて配置される。第２腕部１４ａの先端部には、第２腕部１２ｂと同様にガイド部１４ａ１が設けられている。また、図４（Ｄ）を参照すると、第１伝熱部１３は、リペア対象となる電子部品１１０に当接する当接面１４ｂを備えている。 The second heat transfer unit 14 includes a portion extending along two sides of the rectangle, and includes a second arm portion 14a extending toward the center side inside the portion. The 2nd arm part 14a is arrange | positioned facing the 2nd arm part 12b with which the heat receiving part 12 is provided. Similar to the second arm portion 12b, a guide portion 14a1 is provided at the distal end portion of the second arm portion 14a. Further, referring to FIG. 4D, the first heat transfer unit 13 includes a contact surface 14b that contacts the electronic component 110 to be repaired.

第３伝熱部１５は、矩形の二辺に沿って延びる部分を備えるとともに、その部分の内側に中心側に向かって延びる第３腕部１５ａを備える。第３腕部１５ａは、受熱部１２が備える第３腕部１２ｃと対向させて配置される。第３腕部１５ａの先端部には、第３腕部１２ｃと同様にガイド部１５ａ１が設けられている。また、図４（Ｄ）を参照すると、第１伝熱部１３は、リペア対象となる電子部品１１０に当接する当接面１５ｂを備えている。 The third heat transfer section 15 includes a portion extending along two sides of the rectangle, and includes a third arm portion 15a extending toward the center side inside the portion. The 3rd arm part 15a is arrange | positioned facing the 3rd arm part 12c with which the heat receiving part 12 is provided. Similar to the third arm portion 12c, a guide portion 15a1 is provided at the tip of the third arm portion 15a. In addition, referring to FIG. 4D, the first heat transfer unit 13 includes a contact surface 15b that contacts the electronic component 110 to be repaired.

第４伝熱部１６は、矩形の二辺に沿って延びる部分を備えるとともに、その部分の内側に中心側に向かって延びる第４腕部１６ａを備える。第４腕部１６ａは、受熱部１２が備える第４腕部１２ｄと対向させて配置される。第４腕部１６ａの先端部には、第４腕部１２ｄと同様にガイド部１６ａ１が設けられている。また、図４（Ｄ）を参照すると、第１伝熱部１３は、リペア対象となる電子部品１１０に当接する当接面１６ｂを備えている。 The fourth heat transfer unit 16 includes a portion extending along two sides of the rectangle, and includes a fourth arm portion 16a extending toward the center side inside the portion. The 4th arm part 16a is arrange | positioned facing the 4th arm part 12d with which the heat receiving part 12 is provided. Similar to the fourth arm portion 12d, a guide portion 16a1 is provided at the distal end portion of the fourth arm portion 16a. Further, referring to FIG. 4D, the first heat transfer unit 13 includes a contact surface 16b that contacts the electronic component 110 to be repaired.

図４（Ａ）〜（Ｄ）及び図５を参照すると、受熱部１２と第１伝熱部１３〜第４伝熱部１６は、断熱部材１７を介して一体に纏められている。受熱部１２と第１伝熱部１３〜第４伝熱部１６の間には断熱部材１７が配置され、受熱部１２と第１伝熱部１３〜第４伝熱部１６は、断熱部材１７により、相互に接触することができない状態とされている。すなわち、断熱部材１７は、受熱部１２と第１伝熱部１３〜第４伝熱部１６を分断しており、受熱部１２と第１伝熱部１３〜第４伝熱部１６の各部間で直接的に熱の授受が行われることがないようにして各部間に温度差を生じさせる。これにより、第１伝熱部１３〜第２伝熱部１６は、独立した状態で温度制御が行われるようになる。 4A to 4D and FIG. 5, the heat receiving unit 12 and the first heat transfer unit 13 to the fourth heat transfer unit 16 are integrated together via a heat insulating member 17. A heat insulating member 17 is disposed between the heat receiving unit 12 and the first heat transfer unit 13 to the fourth heat transfer unit 16, and the heat receiving unit 12 and the first heat transfer unit 13 to the fourth heat transfer unit 16 include the heat insulating member 17. Therefore, they cannot be in contact with each other. That is, the heat insulating member 17 divides the heat receiving part 12 from the first heat transfer part 13 to the fourth heat transfer part 16, and between the heat receiving part 12 and each part of the first heat transfer part 13 to the fourth heat transfer part 16. In this way, a temperature difference is generated between the respective parts so that heat is not directly transferred. Thereby, the temperature control of the first heat transfer unit 13 to the second heat transfer unit 16 is performed in an independent state.

図６は伝熱ブロックの断面図である。伝熱キャップ部材１１は、第１伝熱ブロック２１〜第４伝熱ブロック２４を備える。 FIG. 6 is a cross-sectional view of the heat transfer block. The heat transfer cap member 11 includes a first heat transfer block 21 to a fourth heat transfer block 24.

第１伝熱ブロック２１は、受熱部１２に当接する第１当接面２１ａと、第１伝熱部１３に当接する第２当接面２１ｂを備える。第２当接面２１ｂと第１伝熱部１３との接触面積は、後述する第１バイメタル３１の伸張に伴って縮小される。すなわち、第１伝熱ブロック２１は、第１伝熱部１３の温度上昇による第１バイメタル３１の伸張に伴って第１伝熱部１３との接触面積を縮小する第２当接面２１ｂを備える。第１伝熱ブロック２１は、受熱部１２が備える第１腕部１２ａに設けられたガイド部１２ａ１と、第１伝熱部１３が備える第１腕部１３ａに設けられたガイド部１３ａ１とに沿わせて配置される。 The first heat transfer block 21 includes a first contact surface 21 a that contacts the heat receiving unit 12 and a second contact surface 21 b that contacts the first heat transfer unit 13. The contact area between the second contact surface 21b and the first heat transfer section 13 is reduced as the first bimetal 31 described later expands. That is, the first heat transfer block 21 includes a second contact surface 21 b that reduces the contact area with the first heat transfer unit 13 as the first bimetal 31 expands due to the temperature rise of the first heat transfer unit 13. . The first heat transfer block 21 is provided along a guide portion 12a1 provided in the first arm portion 12a provided in the heat receiving portion 12 and a guide portion 13a1 provided in the first arm portion 13a provided in the first heat transfer portion 13. Are arranged.

第２伝熱ブロック２２は、第１伝熱ブロック２１と同一物であり、第１伝熱ブロック２１と同様に、受熱部１２に当接する第１当接面２２ａと、第２伝熱部１４に当接する第２当接面２２ｂを備える。第２当接面２２ｂと第２伝熱部１４との接触面積は、後述する第２バイメタル３２の伸張に伴って縮小される。第２伝熱ブロック２２は、受熱部１２が備える第２腕部１２ｂに設けられたガイド部１２ｂ１と、第２伝熱部１４が備える第２腕部１４ａに設けられたガイド部１４ａ１とに沿わせて配置される。 The second heat transfer block 22 is the same as the first heat transfer block 21, and similarly to the first heat transfer block 21, the first contact surface 22 a that contacts the heat receiving unit 12 and the second heat transfer unit 14. A second abutting surface 22b that abuts on the surface. The contact area between the second contact surface 22b and the second heat transfer section 14 is reduced as the second bimetal 32 described later extends. The second heat transfer block 22 extends along a guide portion 12b1 provided on the second arm portion 12b provided in the heat receiving portion 12 and a guide portion 14a1 provided on the second arm portion 14a provided in the second heat transfer portion 14. Are arranged.

第３伝熱ブロック２３は、第１伝熱ブロック２１と同一物であり、第１伝熱ブロック２１と同様に、受熱部１２に当接する第１当接面２３ａと、第３伝熱部１５に当接する第２当接面２３ｂを備える。第２当接面２３ｂと第３伝熱部１５との接触面積は、後述する第３バイメタル３３の伸張に伴って縮小される。第３伝熱ブロック２３は、受熱部１２が備える第３腕部１２ｃに設けられたガイド部１２ｃ１と、第３伝熱部１５が備える第３腕部１５ａに設けられたガイド部１５ａ１とに沿わせて配置される。 The third heat transfer block 23 is the same as the first heat transfer block 21, and similarly to the first heat transfer block 21, the first contact surface 23 a that contacts the heat receiving unit 12 and the third heat transfer unit 15. A second abutting surface 23b that abuts on the surface. The contact area between the second contact surface 23b and the third heat transfer section 15 is reduced as the third bimetal 33 described later expands. The third heat transfer block 23 extends along a guide portion 12c1 provided on the third arm portion 12c provided in the heat receiving portion 12 and a guide portion 15a1 provided on the third arm portion 15a provided in the third heat transfer portion 15. Are arranged.

第４伝熱ブロック２４は、第１伝熱ブロック２１と同一物であり、第１伝熱ブロック２１と同様に、受熱部１２に当接する第１当接面２４ａと、第４伝熱部１６に当接する第２当接面２４ｂを備える。第２当接面２４ｂと第４伝熱部１６との接触面積は、後述する第４バイメタル３４の伸張に伴って縮小される。第４伝熱ブロック２４は、受熱部１２が備える第４腕部１２ｄに設けられたガイド部１２ｄ１と、第４伝熱部１６が備える第４腕部１６ａに設けられたガイド部１６ａ１とに沿わせて配置される。 The fourth heat transfer block 24 is the same as the first heat transfer block 21, and similarly to the first heat transfer block 21, the first contact surface 24 a that contacts the heat receiving unit 12 and the fourth heat transfer unit 16. A second abutting surface 24b that abuts on the surface. The contact area between the second contact surface 24b and the fourth heat transfer section 16 is reduced as the fourth bimetal 34 described later expands. The fourth heat transfer block 24 follows the guide portion 12d1 provided on the fourth arm portion 12d provided in the heat receiving portion 12 and the guide portion 16a1 provided on the fourth arm portion 16a provided in the fourth heat transfer portion 16. Are arranged.

図７はバイメタルの平面図である。伝熱キャップ部材１１は、駆動部材に相当する第１バイメタル３１〜第４バイメタル３４を備える。バイメタルは伝熱部と伝熱ブロックの組毎に設けられる。すなわち、第１伝熱部１３と第１伝熱ブロック２１との組に対して第１バイメタル３１が設けられる。第２伝熱部１４と第２伝熱ブロック２２との組に対して第２バイメタル３２が設けられる。第３伝熱部１５と第３伝熱ブロック２３との組に対して第３バイメタル３３が設けられる。第４伝熱部１６と第４伝熱ブロック２４との組に対して第４バイメタル３４が設けられる。 FIG. 7 is a plan view of the bimetal. The heat transfer cap member 11 includes a first bimetal 31 to a fourth bimetal 34 corresponding to drive members. A bimetal is provided for each set of heat transfer section and heat transfer block. That is, the first bimetal 31 is provided for the set of the first heat transfer unit 13 and the first heat transfer block 21. A second bimetal 32 is provided for the set of the second heat transfer unit 14 and the second heat transfer block 22. A third bimetal 33 is provided for the set of the third heat transfer unit 15 and the third heat transfer block 23. A fourth bimetal 34 is provided for the set of the fourth heat transfer unit 16 and the fourth heat transfer block 24.

第１バイメタル３１は、第１伝熱部１３に接触させて設けられるとともに第１伝熱ブロック２１と接続され、第１伝熱部１３の温度に応じて伸縮し第１伝熱ブロック２１を受熱部１２と第１伝熱部１３との間で移動させる。これにより、第１伝熱ブロック２１が備える第２当接面２１ｂと第１伝熱部１３との間の接触面積が変化し、受熱部１２と第１伝熱部１３との伝熱面積が変化する。ここで、第１バイメタル３１は、螺旋形状を有している。螺旋形状とすることにより、バイメタルの有効長を長くすることができ、伝熱部の温度上昇に伴う駆動力や変位量を増大させることができる。なお、駆動部材は、温度の変化に伴って伸縮する感温変形部材であれば採用することができるが、バイメタルは、有効長を確保することができる螺旋形状を維持したまま温度変化に伴う伸縮を実現できる点で、駆動部材として好適である。図８を参照すると、第１バイメタル３１の中心側端部３１ａは、取付ネジ３６により第１伝熱部１３に固定されている。これにより、第１バイメタル３１と第１伝熱部１３との接触状態が確保されている。第１バイメタル３１の外縁側端部３１ｂは、取付ピン３５により第１伝熱ブロック２１に取り付けられる。取付ピン３５は、第１伝熱ブロック２１の脱落を防止し、第１伝熱ブロック２１を受熱部１２及び第１伝熱部１３側に押し付ける状態とする。取付ピン３５は、回転が規制されるものではなく、螺旋形状の第１バイメタル３１の伸縮動作を第１伝熱ブロック２１の直線運動に変換することができる。 The first bimetal 31 is provided in contact with the first heat transfer unit 13 and connected to the first heat transfer block 21, and expands and contracts according to the temperature of the first heat transfer unit 13 to receive the first heat transfer block 21. It moves between the section 12 and the first heat transfer section 13. Thereby, the contact area between the 2nd contact surface 21b with which the 1st heat-transfer block 21 is provided and the 1st heat-transfer part 13 changes, and the heat-transfer area of the heat-receiving part 12 and the 1st heat-transfer part 13 is changed. Change. Here, the first bimetal 31 has a spiral shape. By adopting the spiral shape, the effective length of the bimetal can be increased, and the driving force and the displacement amount accompanying the temperature rise of the heat transfer section can be increased. The drive member can be adopted as long as it is a temperature-sensitive deformation member that expands and contracts with changes in temperature, but bimetals can expand and contract with changes in temperature while maintaining a helical shape that can ensure an effective length. It is suitable as a drive member in that it can be realized. Referring to FIG. 8, the center-side end portion 31 a of the first bimetal 31 is fixed to the first heat transfer unit 13 with a mounting screw 36. Thereby, the contact state of the 1st bimetal 31 and the 1st heat-transfer part 13 is ensured. The outer edge side end portion 31 b of the first bimetal 31 is attached to the first heat transfer block 21 by the attachment pin 35. The attachment pin 35 prevents the first heat transfer block 21 from falling off and presses the first heat transfer block 21 against the heat receiving unit 12 and the first heat transfer unit 13 side. The attachment pin 35 is not restricted in rotation, and can convert the expansion / contraction operation of the spiral first bimetal 31 into the linear motion of the first heat transfer block 21.

第２バイメタル３２は、第１バイメタル３１と同一物である。第２バイメタル３２は、第２伝熱部１４に接触させて設けられるとともに第２伝熱ブロック２２と接続され、第２伝熱部１４の温度に応じて伸縮し第２伝熱ブロック２２を受熱部１２と第２伝熱部１４との間で移動させる。これにより、第２伝熱ブロック２２が備える第２当接面２２ｂと第２伝熱部１４との接触面積が変化し、受熱部１２と第２伝熱部１４との間の伝熱面積が変化する。図８を参照すると、第２バイメタル３２の中心側端部３２ａは、取付ネジ３６により第２伝熱部１４に固定されている。これにより、第２バイメタル３２と第２伝熱部１４との接触状態が確保されている。第２バイメタル３２の外縁側端部３２ｂは、取付ピン３５により第２伝熱ブロック２２に取り付けられる。取付ピン３５は、第２伝熱ブロック２２の脱落を防止し、第２伝熱ブロック２２を受熱部１２及び第２伝熱部１４側に押し付ける状態とする。取付ピン３５は、回転が規制されるものではなく、螺旋形状の第２バイメタル３２の伸縮動作を第２伝熱ブロック２２の直線運動に変換することができる。 The second bimetal 32 is the same as the first bimetal 31. The second bimetal 32 is provided in contact with the second heat transfer unit 14 and connected to the second heat transfer block 22, and expands and contracts according to the temperature of the second heat transfer unit 14 to receive the second heat transfer block 22. It moves between the section 12 and the second heat transfer section 14. Thereby, the contact area of the 2nd contact surface 22b with which the 2nd heat-transfer block 22 is provided, and the 2nd heat-transfer part 14 changes, and the heat-transfer area between the heat-receiving part 12 and the 2nd heat-transfer part 14 is changed. Change. Referring to FIG. 8, the center side end portion 32 a of the second bimetal 32 is fixed to the second heat transfer portion 14 with a mounting screw 36. Thereby, the contact state of the 2nd bimetal 32 and the 2nd heat-transfer part 14 is ensured. The outer edge side end portion 32 b of the second bimetal 32 is attached to the second heat transfer block 22 by the attachment pin 35. The attachment pin 35 prevents the second heat transfer block 22 from falling off and presses the second heat transfer block 22 against the heat receiving unit 12 and the second heat transfer unit 14 side. The mounting pin 35 is not restricted in rotation, and can convert the expansion / contraction operation of the spiral second bimetal 32 into the linear motion of the second heat transfer block 22.

第３バイメタル３３は、第１バイメタル３１と同一物である。第３バイメタル３３は、第３伝熱部１５に接触させて設けられるとともに第３伝熱ブロック２３と接続され、第３伝熱部１５の温度に応じて伸縮し第３伝熱ブロック２３を受熱部１２と第３伝熱部１５との間で移動させる。これにより、第３伝熱ブロック２３が備える第２当接面２３ｂと第３伝熱部１５との接触面積が変化し、受熱部１２と第３伝熱部１５との間の伝熱面積が変化する。図８を参照すると、第３バイメタル３３の中心側端部３３ａは、取付ネジ３６により第３伝熱部１５に固定されている。これにより、第３バイメタル３３と第３伝熱部１５との接触状態が確保されている。第３バイメタル３３の外縁側端部３３ｂは、取付ピン３５により第３伝熱ブロック２３に取り付けられる。取付ピン３５は、第３伝熱ブロック２３の脱落を防止し、第３伝熱ブロック２３を受熱部１２及び第３伝熱部１５側に押し付ける状態とする。取付ピン３５は、回転が規制されるものではなく、螺旋形状の第３バイメタル３３の伸縮動作を第３伝熱ブロック２３の直線運動に変換することができる。 The third bimetal 33 is the same as the first bimetal 31. The third bimetal 33 is provided in contact with the third heat transfer unit 15 and connected to the third heat transfer block 23, and expands and contracts according to the temperature of the third heat transfer unit 15 to receive the third heat transfer block 23. It moves between the section 12 and the third heat transfer section 15. Thereby, the contact area of the 2nd contact surface 23b with which the 3rd heat transfer block 23 is provided, and the 3rd heat transfer part 15 changes, and the heat transfer area between the heat receiving part 12 and the 3rd heat transfer part 15 is changed. Change. Referring to FIG. 8, the center-side end portion 33 a of the third bimetal 33 is fixed to the third heat transfer portion 15 with a mounting screw 36. Thereby, the contact state of the 3rd bimetal 33 and the 3rd heat-transfer part 15 is ensured. The outer edge side end portion 33 b of the third bimetal 33 is attached to the third heat transfer block 23 by the attachment pin 35. The attachment pin 35 prevents the third heat transfer block 23 from falling off and presses the third heat transfer block 23 against the heat receiving unit 12 and the third heat transfer unit 15 side. The attachment pin 35 is not restricted in rotation, and can convert the expansion / contraction operation of the spiral third bimetal 33 into the linear motion of the third heat transfer block 23.

第４バイメタル３４は、第１バイメタル３１と同一物である。第４バイメタル３４は、第４伝熱部１６に接触させて設けられるとともに第４伝熱ブロック２４と接続され、第４伝熱部１６の温度に応じて伸縮し第４伝熱ブロック２４を受熱部１２と第４伝熱部１６との間で移動させる。これにより、第４伝熱ブロック２４が備える第２当接面２４ｂと第４伝熱部１６との接触面積が変化し、受熱部１２と第４伝熱部１６との間の伝熱面積が変化する。図８を参照すると、第４バイメタル３４の中心側端部３４ａは、取付ネジ３６により第４伝熱部１６に固定されている。これにより、第４バイメタル３４と第４伝熱部１６との接触状態が確保されている。第４バイメタル３４の外縁側端部３４ｂは、取付ピン３５により第４伝熱ブロック２４に取り付けられる。取付ピン３５は、第４伝熱ブロック２４の脱落を防止し、第４伝熱ブロック２４を受熱部１２及び第４伝熱部１６側に押し付ける状態とする。取付ピン３５は、回転が規制されるものではなく、螺旋形状の第４バイメタル３４の伸縮動作を第４伝熱ブロック２４の直線運動に変換することができる。 The fourth bimetal 34 is the same as the first bimetal 31. The fourth bimetal 34 is provided in contact with the fourth heat transfer unit 16 and connected to the fourth heat transfer block 24, and expands and contracts according to the temperature of the fourth heat transfer unit 16 to receive the fourth heat transfer block 24. It moves between the section 12 and the fourth heat transfer section 16. Thereby, the contact area of the 2nd contact surface 24b with which the 4th heat transfer block 24 is provided, and the 4th heat transfer part 16 changes, and the heat transfer area between the heat receiving part 12 and the 4th heat transfer part 16 is changed. Change. Referring to FIG. 8, the center side end portion 34 a of the fourth bimetal 34 is fixed to the fourth heat transfer portion 16 with an attachment screw 36. Thereby, the contact state of the 4th bimetal 34 and the 4th heat-transfer part 16 is ensured. An outer edge side end portion 34 b of the fourth bimetal 34 is attached to the fourth heat transfer block 24 by an attachment pin 35. The attachment pin 35 prevents the fourth heat transfer block 24 from falling off and presses the fourth heat transfer block 24 against the heat receiving unit 12 and the fourth heat transfer unit 16 side. The rotation of the mounting pin 35 is not restricted, and the expansion / contraction operation of the spiral fourth bimetal 34 can be converted into the linear motion of the fourth heat transfer block 24.

つぎに、図１に示すようにリペア対象となる電子部品１１０の上面に搭載し、光源１０によって受熱部１２に熱を供給したときの伝熱キャップ部材１１の動作について説明する。なお、伝熱キャップ部材１１は、第１伝熱部１３〜第４伝熱部１６を備えているが、以下の説明では、受熱部１２を第１伝熱部１３との間の伝熱について説明する。受熱部１２と第２伝熱部１４〜第４伝熱部１６との間の伝熱は、受熱部１２と第１伝熱部１３との間の伝熱と同様に行われるため、その詳細な説明は省略する。 Next, the operation of the heat transfer cap member 11 when mounted on the upper surface of the electronic component 110 to be repaired as shown in FIG. 1 and supplying heat to the heat receiving unit 12 by the light source 10 will be described. The heat transfer cap member 11 includes the first heat transfer unit 13 to the fourth heat transfer unit 16. However, in the following description, the heat receiving unit 12 is connected to the first heat transfer unit 13. explain. Since the heat transfer between the heat receiving unit 12 and the second heat transfer unit 14 to the fourth heat transfer unit 16 is performed in the same manner as the heat transfer between the heat receiving unit 12 and the first heat transfer unit 13, the details thereof are described. Detailed explanation is omitted.

図９（Ａ）は第１伝熱部１３の温度が低い状態における第１伝熱ブロック２１周辺の様子を示す断面図であり、図９（Ｂ）は平面図である。第１伝熱ブロック２１の第１当接面２１ａの全面が第１腕部１２ａと当接している。また、第１伝熱ブロック２１の第２当接面２１ｂの一部が第１腕部１３ａと当接している。これにより、受熱部１２に供給された熱量が、第１腕部１２ａ及び第１伝熱ブロック２１を通じて第１伝熱部１３へ伝わる。これにより、第１伝熱部１３の温度が上昇する。このとき、受熱部１２と第１伝熱部１３との間の伝熱面積は、第２当接面２１ｂが第１腕部１３ａと接触している面積に規制される。第１伝熱部１３の温度が上昇すると、その温度に応じて第１バイメタル３１が伸張する。この結果、第１伝熱ブロック２１が受熱部１２に近づく側に移動する。 FIG. 9A is a cross-sectional view showing a state around the first heat transfer block 21 in a state where the temperature of the first heat transfer unit 13 is low, and FIG. 9B is a plan view. The entire first contact surface 21a of the first heat transfer block 21 is in contact with the first arm portion 12a. A part of the second contact surface 21b of the first heat transfer block 21 is in contact with the first arm portion 13a. Thereby, the amount of heat supplied to the heat receiving part 12 is transmitted to the first heat transfer part 13 through the first arm part 12 a and the first heat transfer block 21. Thereby, the temperature of the 1st heat-transfer part 13 rises. At this time, the heat transfer area between the heat receiving part 12 and the first heat transfer part 13 is restricted to the area where the second contact surface 21b is in contact with the first arm part 13a. When the temperature of the first heat transfer unit 13 rises, the first bimetal 31 expands according to the temperature. As a result, the first heat transfer block 21 moves to the side closer to the heat receiving unit 12.

図１０（Ａ）は第１伝熱部１３の温度が高い状態における第１伝熱ブロック２１周辺の様子を示す断面図であり、図１０（Ｂ）は平面図である。第１伝熱部１３の温度が上昇すると、上述のように第１バイメタル３１が伸張し、第１伝熱ブロック２１が受熱部１２に近づく側に移動する。すると、図９（Ａ）と図１０（Ａ）との比較から明らかであるように、第１伝熱ブロック２１の第２当接面２１ｂと第１腕部１３ａとの接触面積が縮小される。この結果、受熱部１２と第１伝熱部１３との間の伝熱面積が縮小する。これにより、図９（Ａ）、（Ｂ）に示した状態と比較して、受熱部１２から第１伝熱部１３へ伝熱し難い状態となる。ただし、受熱部１２と第１伝熱部１３との間の伝熱量は、受熱部１２と他の伝熱部、すなわち、第２伝熱部１３〜第４伝熱部１４との伝熱量の配分によって決まる。受熱部１２は、非接触温度計を用いた自動温度調整装置により一定温度に保たれているため、配分が決まると第１伝熱部１３の温度は一定に保たれる。 FIG. 10A is a cross-sectional view showing a state around the first heat transfer block 21 in a state where the temperature of the first heat transfer section 13 is high, and FIG. 10B is a plan view. When the temperature of the first heat transfer unit 13 rises, the first bimetal 31 expands as described above, and the first heat transfer block 21 moves to the side closer to the heat receiving unit 12. Then, as is clear from a comparison between FIG. 9A and FIG. 10A, the contact area between the second contact surface 21b of the first heat transfer block 21 and the first arm portion 13a is reduced. . As a result, the heat transfer area between the heat receiving unit 12 and the first heat transfer unit 13 is reduced. Thereby, compared with the state shown to FIG. 9 (A) and (B), it will be in the state which is hard to transfer heat from the heat receiving part 12 to the 1st heat transfer part 13. FIG. However, the amount of heat transfer between the heat receiving unit 12 and the first heat transfer unit 13 is the amount of heat transfer between the heat receiving unit 12 and another heat transfer unit, that is, the second heat transfer unit 13 to the fourth heat transfer unit 14. It depends on the distribution. Since the heat receiving unit 12 is kept at a constant temperature by an automatic temperature control device using a non-contact thermometer, the temperature of the first heat transfer unit 13 is kept constant when the distribution is determined.

図１１（Ａ）は第１伝熱部１３の温度がさらに高くなった状態における第１伝熱ブロック２１周辺の様子を示す断面図であり、図１１（Ｂ）は平面図である。第１伝熱部１３の温度がさらに上昇すると、第１バイメタル３１がさらに伸張し、第１伝熱ブロック２１が受熱部１２にさらに近づく側に移動する。すると、最終的に、第２当接面２１ｂと第１腕部１３ａとの接触が解除される。このような状態となると、受熱部１２から第１腕部１３ａへの伝熱が遮断される。この結果、第１伝熱部１３の温度が低下し、これに伴って第１バイメタル３１が縮小する。第１バイメタル３１が縮小すると再び第２当接面２１ｂと第１腕部１３ａとの接触状態が回復する。さらに温度が低下し第１バイメタル３１が縮小すれば第２当接面２１ｂと第１腕部１３ａとの接触面積は増大し、受熱部１２と第１伝熱部１３との間の伝熱面積が増大する。この例は、電子部品側の吸熱のバランスが大きく崩れている場合に有効に作用する。 FIG. 11A is a cross-sectional view showing a state around the first heat transfer block 21 in a state where the temperature of the first heat transfer section 13 is further increased, and FIG. 11B is a plan view. When the temperature of the first heat transfer unit 13 is further increased, the first bimetal 31 is further expanded, and the first heat transfer block 21 is moved closer to the heat receiving unit 12. Then, the contact between the second contact surface 21b and the first arm portion 13a is finally released. If it will be in such a state, the heat transfer from the heat receiving part 12 to the 1st arm part 13a will be interrupted | blocked. As a result, the temperature of the first heat transfer section 13 is lowered, and the first bimetal 31 is reduced accordingly. When the first bimetal 31 is reduced, the contact state between the second contact surface 21b and the first arm portion 13a is restored again. If the temperature further decreases and the first bimetal 31 shrinks, the contact area between the second contact surface 21b and the first arm portion 13a increases, and the heat transfer area between the heat receiving portion 12 and the first heat transfer portion 13 is increased. Will increase. This example works effectively when the balance of heat absorption on the electronic component side is greatly broken.

このように、第２当接面２１ｂと第１腕部１３ａとの接触面積は、供給する熱量と、放熱量が一致する位置で停止する。ただし、４つの調整部のバランスの差がかなり大きい場合は、図１１（Ａ）、（Ｂ）で示した動作をする。第１伝熱部１３の温度変化は、受熱部１２からの受熱量と、リペア対象となる電子部品１１０からの放出される周囲へ放熱量の影響を受ける。第２伝熱部１４〜第４伝熱部１６においても受熱部１２との間での熱の授受、周囲への放熱が同様に行われ、温度変化が生じている。そして、それぞれ断熱部材１７で分断され、その時々で、相対的に温度が低い伝熱部に熱量が多く分配される。受熱部１２と第１伝熱部１３〜第４伝熱部１６との間でそれぞれ同様の動作をすることにより、最終的に、第１伝熱部１３〜第４伝熱部１６において均一の温度状態となる。この結果、リペア対象となる電子部品１１０の温度分布を一様にすることができ、はんだ接合部１１０ａを溶融し、リペア作業を行うことができる。 Thus, the contact area between the second contact surface 21b and the first arm portion 13a stops at a position where the amount of heat to be supplied and the amount of heat released coincide. However, when the difference between the balances of the four adjustment units is quite large, the operations shown in FIGS. 11A and 11B are performed. The temperature change of the first heat transfer unit 13 is affected by the amount of heat received from the heat receiving unit 12 and the amount of heat released to the surroundings released from the electronic component 110 to be repaired. Also in the 2nd heat transfer part 14-the 4th heat transfer part 16, transfer of heat between heat receiving parts 12 and heat dissipation to the circumference are performed similarly, and temperature change has arisen. And each is divided | segmented by the heat insulation member 17, and much heat quantity is distributed to the heat-transfer part with relatively low temperature at that time. By performing the same operation between the heat receiving unit 12 and the first heat transfer unit 13 to the fourth heat transfer unit 16, finally, the first heat transfer unit 13 to the fourth heat transfer unit 16 are uniform. It becomes a temperature state. As a result, the temperature distribution of the electronic component 110 to be repaired can be made uniform, the solder joint 110a can be melted, and repair work can be performed.

図１２（Ａ）は本実施形態のリペア装置１における伝熱部の温度変化の様子を示すグラフであり、図１２（Ｂ）は比較例の温度変化の様子を示すグラフである。比較例は、伝熱部の温度調整手段として、ＯＮ／ＯＦＦを繰り返すサーモスタット（例えば、板状のバイメタル）を装備した例である。本実施形態の場合、伝熱ブロックを用い、第２当接面と伝熱部との接触面積を変化させる。この接触面積の変化はアナログ的である。この結果、温度を安定して制御することできる。一方、比較例の場合、温度の変化に伴ってサーモスタットがＯＮ／ＯＦＦを繰り返すため、温度変化が安定しない。伝熱キャップ部材は全体の熱容量が少ないため、サーモスタットがＯＮ／ＯＦＦを繰り返すと温度が安定せず、結果としてリペア対象となる電子部品の温度分布を一様にすることが困難となる。 FIG. 12A is a graph showing the temperature change state of the heat transfer section in the repair device 1 of this embodiment, and FIG. 12B is a graph showing the temperature change state of the comparative example. The comparative example is an example equipped with a thermostat (for example, a plate-like bimetal) that repeats ON / OFF as temperature adjusting means of the heat transfer section. In the case of this embodiment, the heat transfer block is used, and the contact area between the second contact surface and the heat transfer portion is changed. This change in contact area is analog. As a result, the temperature can be controlled stably. On the other hand, in the case of the comparative example, the temperature change is not stable because the thermostat repeats ON / OFF as the temperature changes. Since the heat transfer cap member has a small heat capacity as a whole, when the thermostat is repeatedly turned on and off, the temperature is not stabilized, and as a result, it is difficult to make the temperature distribution of the electronic components to be repaired uniform.

以上本発明の好ましい実施形態について詳述したが、本発明は係る特定の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、変更が可能である。本明細書開示の伝熱キャップ部材を用いる場合、その熱源は、非接触熱源に限定されず、他の熱源も用いることができる。 Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications, within the scope of the gist of the present invention described in the claims, It can be changed. When the heat transfer cap member disclosed in the present specification is used, the heat source is not limited to the non-contact heat source, and other heat sources can also be used.

１リペア装置１０光源（ハロゲンランプ）
１１伝熱キャップ部材１２受熱部
１３第１伝熱部１３ａ第１腕部
１３ｂ当接面１４第２伝熱部
１４ａ第２腕部１４ｂ当接面
１５第３伝熱部１５ａ第３腕部
１５ｂ当接面１６第４伝熱部
１６ａ第４腕部１６ｂ当接面
１７断熱部材２１第１伝熱ブロック
２１ａ第１当接面２１ｂ第２当接面
２２第２伝熱ブロック２２ａ第１当接面
２２ｂ第２当接面２３第３伝熱ブロック
２３ａ第１当接面２３ｂ第２当接面
２４第４伝熱ブロック２４ａ第１当接面
２４ｂ第２当接面３１第１バイメタル
３２第２バイメタル３３第３バイメタル
３４第４バイメタル３５取付ピン
３６取付ネジ１１０電子部品 1 Repair device 10 Light source (halogen lamp)
DESCRIPTION OF SYMBOLS 11 Heat-transfer cap member 12 Heat receiving part 13 1st heat-transfer part 13a 1st arm part 13b Contact surface 14 2nd heat-transfer part 14a 2nd arm part 14b Contact surface 15 3rd heat-transfer part 15a 3rd arm part 15b Contact surface 16 4th heat transfer part 16a 4th arm part 16b Contact surface 17 Heat insulation member 21 1st heat transfer block 21a 1st contact surface 21b 2nd contact surface 22 2nd heat transfer block 22a 1st contact Surface 22b Second contact surface 23 Third heat transfer block 23a First contact surface 23b Second contact surface 24 Fourth heat transfer block 24a First contact surface 24b Second contact surface 31 First bimetal 32 Second Bimetal 33 Third bimetal 34 Fourth bimetal 35 Mounting pin 36 Mounting screw 110 Electronic component

Claims

A repair device for supplying heat to a solder joint provided in an electronic component to melt the solder joint,
A non-contact heat source;
Between the heat receiving part which receives supply of heat from the non-contact heat source, a plurality of heat transfer parts provided with contact surfaces which contact the electronic components to be repaired, and between the heat receiving part and the plurality of heat transfer parts A heat transfer block that is disposed respectively and changes a heat transfer area between the heat receiving unit and the heat transfer unit, and is provided for each set of the heat transfer unit and the heat transfer block, and is in contact with the heat transfer unit. And is connected to the heat transfer block, expands and contracts according to the temperature of the heat transfer section, moves the heat transfer block between the heat receiving section and the heat transfer section, and moves the heat transfer as it expands. A heat transfer cap member having a drive member that reduces the contact area between the heat transfer block and the heat transfer block ;
Repair device with

The heat transfer block is in contact with the heat transfer unit as the drive member expands due to a temperature increase of the heat transfer unit and a first contact surface that contacts the heat receiving unit. The repair apparatus of Claim 1 provided with the 2nd contact surface which reduces an area.

The repair device according to claim 1, wherein the driving member is a bimetal having a spiral shape.

The repair apparatus as described in any one of Claims 1 thru | or 3 by which the heat insulation member was arrange | positioned between these heat-transfer parts.

A heat receiving unit that receives heat supply from a heat source;
A plurality of heat transfer parts having contact surfaces that contact the electronic components to be repaired;
A heat transfer block that is disposed between the heat receiving unit and the plurality of heat transfer units, and changes a heat transfer area between the heat receiving unit and the plurality of heat transfer units;
Provided for each set of the heat transfer section and the heat transfer block, provided in contact with the heat transfer section and connected to the heat transfer block, and expands and contracts according to the temperature of the heat transfer section. A drive member that moves between the heat receiving portion and the heat transfer portion, and reduces the contact area between the heat transfer portion and the heat transfer block as it extends ,
A heat transfer cap member.

The heat transfer block is in contact with the heat transfer unit as the drive member expands due to a temperature increase of the heat transfer unit and a first contact surface that contacts the heat receiving unit. The heat transfer cap member according to claim 5, further comprising a second contact surface that reduces an area.

The heat transfer cap member according to claim 5 or 6, wherein the driving member is a bimetal having a spiral shape.

The heat transfer cap member according to any one of claims 5 to 7, wherein a heat insulating member is disposed between the plurality of heat transfer portions.