JP5946287B2 - Component mounting device - Google Patents

Description

  The present invention relates to a component mounting apparatus that mounts a component on a substrate, and more particularly to a component mounting apparatus that performs non-contact power feeding to a mounting head.

  There are solder printing equipment, component mounting equipment, reflow equipment, board inspection equipment, etc. as equipment for producing a board on which a large number of components are mounted. In many cases, a board production line is constructed by connecting them with a board transport device. . Among these, the component mounting apparatus is generally provided with a mounting head for picking up components from a component supply device and mounting them on a positioned substrate, and the mounting head is generally driven by a ball screw mechanism or the like. Therefore, a part of a servo drive mechanism and a movement control circuit for moving in the horizontal two-dimensional direction are mounted on the mounting head. In addition, the mounting head is provided with a suction nozzle that picks up parts by using negative pressure generated by an air pump and mounts them on the substrate. In addition, a drive mechanism that moves the suction nozzle up and down and rotates, and a suction mechanism A circuit for controlling the nozzle drive and suction operation is also installed. Furthermore, a camera is mounted on the mounting head in order to check codes and marks on the board and to check the status of components and suction nozzles.

  In order to supply electric power to the various electric loads mounted on the moving mounting head, a deformable power feeding cable has been used in the prior art. Moreover, the voltage varies depending on the type of electric load, and in addition, communication cables are often used in parallel, and many cables are shaped or bundled so as not to be complicated. Therefore, when the mounting head is moved, the tension of the cable is added to the head's own weight, resulting in an increase in the carrying weight, resulting in a decrease in moving speed. Furthermore, there is a risk of disconnection due to metal fatigue caused by repeated deformation in power supply by a cable. For this reason, in recent years, it has been studied to apply a non-contact power feeding technique that does not use a power feeding cable to a component mounting apparatus, and an example thereof is disclosed in Patent Document 1.

  The surface mounting machine (component mounting apparatus) disclosed in Patent Document 1 includes a power feeding unit and a mounting machine side optical communication unit in a mounting machine body, and a power receiving unit and a feeder side optical communication unit in a feeder (component supply apparatus). It enables non-contact power feeding and non-contact communication. Specifically, the power feeding unit has a power feeding line extending in the feeder arrangement direction, and the power receiving unit has a pickup coil, and is configured to perform electromagnetic induction type non-contact power feeding. Accordingly, it is described that communication control can be performed without being affected by electromagnetic induction noise even when non-contact power supply by electromagnetic induction is performed.

JP 2007-109753 A

  By the way, the non-contact power feeding technique disclosed in Patent Document 1 is applied to a moving mounting head because it is intended for a feeder (part supply device) that does not move even if it is replaced. Can not do it. The mounting head does not simply move one-dimensionally on a given rail, but moves two-dimensionally in a horizontal plane, and the movement route changes depending on the type of substrate to be produced. The technology was considered difficult to apply.

  The present invention has been made in view of the problems of the background art described above, and moves by reducing the load weight corresponding to the cable tension by eliminating or reducing the cable for supplying the electric load on the moving mounting head. It is an object to be solved to provide a component mounting apparatus that can reduce the risk of cable breakage due to metal fatigue.

The invention of the component mounting apparatus according to claim 1 that solves the above-described problems includes a substrate transfer apparatus that loads, positions, and unloads a board along a transfer path at a component mounting position, and a plurality of component storage apparatuses that store a plurality of components. A component supply device that is detachably mounted, a mounting head that picks up the component from the component supply device and mounts the mounted component on a substrate, and a head drive mechanism that moves the mounting head in two orthogonal directions in a horizontal plane A component mounting device comprising: a component transfer device comprising: a non-contact power feeding element provided at a temporary stop position where the mounting head temporarily stops during operation; and the non-contact device A high-frequency power source for supplying high-frequency power to the power supply element is provided on the base side, and receives the high-frequency power in a non-contact manner facing the non-contact power supply element at the temporary stop position. Contact power receiving element, power converter for converting high frequency power received by the non-contact power receiving element into DC power, and storing the DC power to enable power supply to an electric load mounted on the mounting head And a non-contact power feeding mechanism configured to have a secondary battery on the mounting head side , wherein the component supply device includes a plurality of feeder-type component storage devices each having a predetermined slot width. The stop position includes a plurality of suction positions when the mounting head sucks and collects the component from each feeder-type component storage device, and the non-contact power feeding element has a size equal to or less than the slot width, A plurality of the non-contact power receiving elements are provided temporarily at any of the suction positions. And a plurality provided to directly facing without displacement in a part of the plurality of non-contact power supply device when sealed.

According to a second aspect of the present invention, in the first aspect, the contactless power feeding element and the contactless power receiving element are coils.

  In the invention of the component mounting apparatus according to the first aspect, the contactless power feeding from the contactless power feeding element to the contactless power receiving element can be performed at the temporary stop position of the mounting head, and the fed power is further transferred to the secondary battery. Can be stored. Therefore, it is possible to continuously supply power to the electrical load mounted on the mounting head by performing contactless power supply repeatedly and intermittently. This eliminates or reduces the cable for supplying the electric load on the moving mounting head to reduce the load weight corresponding to the cable tension, thereby increasing the speed of movement. In addition, the risk of cable breakage due to metal fatigue is reduced.

Further comprising an adsorption position and a stop point of the mounting head. Adsorption position, since relatively longer pause with the mounting head is reliably pause, can be reliably non-contact power supply.

Further, the plurality of non-contact power receiving elements and the plurality of non-contact power feeding elements face each other without deviation at the suction position of the component supply device to which the plurality of feeder-type component housing devices are attached. Therefore, non-contact power feeding can be performed efficiently.

In the invention according to claim 2 , each of the non-contact power supply element and the non-contact power reception element is a coil. Thereby, non-contact power supply can be performed by an electromagnetic induction method at a narrow pause position, and much more power can be supplied as compared with other non-contact power supply methods such as an electric field coupling method.

It is a perspective view explaining the structural example of the component mounting apparatus which can implement this invention. It is the side view which looked at the mounting head of a component transfer apparatus from the side. It is a side view of the principal part which illustrates typically the component mounting apparatus of 1st Embodiment of this invention. It is a top view of the principal part which illustrates the component mounting apparatus of 1st Embodiment typically. It is a circuit diagram which shows typically the electric composition by the side of the base of a non-contact electric power feeding mechanism. It is a circuit diagram which shows typically the electric structure by the side of the mounting head of a non-contact electric power feeding mechanism. It is a side view of the principal part which illustrates typically the component mounting apparatus of 2nd Embodiment of this invention. It is a circuit diagram which shows typically the electric structure by the side of the mounting head of the non-contact electric power feeding mechanism of 2nd Embodiment.

  A component mounting apparatus 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view illustrating a configuration example of a component mounting apparatus 9 that can implement the present invention. FIG. 1 shows two component mounting devices 9 arranged side by side on a common base 90. Each component mounting device 9 includes a substrate transfer device 91, a component supply device 92, a component transfer device 93, and a component. A camera 94, a control computer (not shown), and the like are assembled on the base 99 (reference numerals are given only to the component mounting device 9 on the right front side).

  The board transfer device 91 is disposed near the center in the longitudinal direction (Y-axis direction) of the component mounting device 9. The substrate transfer device 91 is a so-called double conveyor type device in which a first transfer device 911 and a second transfer device 912 are arranged in parallel. Each of the first and second transfer devices 911 and 912 places a pair of guide rails arranged side by side in parallel with the width direction (X-axis direction) on the base 99 and the guide rails, respectively, and places the substrate K thereon. And a pair of conveyor belts (not shown). Each of the first and second transfer devices 911 and 912 is provided with a clamp device (not shown) that pushes up and positions the board K transferred to the component mounting position from the base 99 side.

  The component supply device 92 is provided at the front portion in the longitudinal direction of the component mounting device 9 (the left front side in FIG. 2). The component supply device 92 has 10 feeder-type component storage devices 921 having a predetermined slot width attached in a detachable manner. The number of feeders is not limited to 10, but may be configured to be 20, 45, 60, for example. Each feeder-type component storage device 921 includes a feeder main body 922, a supply reel 923 that is rotatably and detachably attached to a rear portion of the feeder main body 922 (a front side of the component mounting device 9), and a tip of the feeder main body 922 (component mounting). And a component supply unit 924 provided near the center of the apparatus 9. The supply reel 923 is a medium for supplying parts, and is wound with a carrier tape (not shown) holding a predetermined number of parts at regular intervals. The leading end of the carrier tape is pulled out to the component supply unit 924, and different components are supplied for each carrier tape.

  The component transfer device 93 is a so-called XY robot type device that can move in the width direction (X-axis direction) and the longitudinal direction (Y-axis direction). Side) to the upper part of the front part supply device 92. The component transfer device 93 includes a Y-axis movement mechanism 931, an X-axis drive mechanism 932, the mounting head 2, and the like. The Y-axis moving mechanism 931 and the X-axis drive mechanism 932 drive the mounting head 2 independently in the X-axis direction and the Y-axis direction. The detailed structure of the mounting head 2 will be described later.

  The component camera 94 is a device that captures an image of the state in which the suction nozzles 251 and 252 of the mounting head 2 of the component transfer device 93 suck and collect the component, and transmits the image data to the control computer. The component camera 94 is disposed on the base 99 between the component supply unit 924 of the component supply device 92 and the first transfer device 911 so as to face upward.

  The control computer (not shown) is connected to the substrate transfer device 91, the component supply device 92, the component transfer device 93, and the component camera 94 by a communication cable, obtains necessary information, performs calculation and determination, and appropriately A command is issued to control the operation of each part. A display operation device 96 is arranged on the upper front side of the upper cover 95 so that the operator can confirm information from the control computer and perform necessary operations and settings.

  Next, the detailed structure of the mounting head 2 will be described. FIG. 2 is a side view of the mounting head 2 of the component transfer device 93 as viewed from the side. The mounting head 2 includes an X-axis slider 21, an R-axis motor 22, an index shaft body 23, a nozzle holder 24, suction nozzles 251 and 252, a θ-axis motor 26, an unillustrated Z-axis motor, a negative pressure generating mechanism, and a control unit. have.

  The X-axis slider 21 has a pair of upper and lower guide blocks 28 and is movably supported by a pair of upper and lower guide rails 27 of the Y-axis slider 2 extending in the X-axis direction (the front and back direction of the paper). An unillustrated X-axis servo motor is fixed to the Y-axis slider 29, and a ball screw 2A extending in the X-axis direction is attached to the output shaft of the X-axis servo motor. The ball screw 2A is screwed into a ball nut 2B fixed to the X-axis slider 21 via a ball (not shown). As a result, when the X-axis servo motor rotates, the ball screw 2A rotates and the ball nut 2B advances, and the entire mounting head 2 along with the X-axis slider 21 moves in the X-axis direction. An X-axis drive mechanism 932 is configured by the X-axis slider 21, the guide rail 27, the guide block 28, the X-axis servo motor, the ball screw 2A, and the ball nut 2B. The Y-axis slider 29 is a part of the Y-axis moving mechanism 931, and moves the X-axis slider 21 and the mounting head 2 in the Y-axis direction (left and right direction on the paper surface).

  The X-axis slider 21 is equipped with suction nozzles 251 and 252 for picking up parts, a negative pressure generating mechanism (not shown) for suction, and drive motors for movement and rotation. More specifically, an index shaft body 23 is rotatably supported on the X-axis slider 21. The upper end of the index shaft body 23 is coupled to the output shaft of the R-axis motor 22, and a nozzle holder 24 is rotatably held below the index shaft body 23. The R-axis motor 22 rotationally drives the index shaft body 23 and the nozzle holder 24 around the vertical R-axis. A plurality of suction nozzles 251, 252 are arranged concentrically at predetermined intervals downward from the nozzle holder 24, and can move up and down. Although two suction nozzles 251 and 252 are illustrated in the figure, there are many cases where there are actually many such as eight.

  The θ-axis motor 26 rotationally drives the suction nozzles 251 and 252 via the rotation transmission mechanism 2C. An unillustrated Z-axis motor drives the suction nozzles 251 and 252 in the vertical direction (Z-axis direction). An unillustrated negative pressure generating mechanism is configured by an air pump, a solenoid valve, a pressure switch, and the like, and individually controls the pressures of the suction nozzles 251 and 252. The R-axis motor 22, the θ-axis motor 26, the Z-axis motor, and the negative pressure generating mechanism in the mounting head 2 are controlled by a control unit (not shown). Note that the non-contact power receiving elements 51 to 55, the power receiving power supply substrate 2 </ b> D, and the secondary battery 8 in FIG. 2 are members mounted in the first embodiment and are not mounted in the prior art.

  The component transfer device 93 operates in accordance with a command from the control computer to the control unit. The mounting head 2 of the component transfer device 93 first moves to the feeder-type component storage device 921 instructed by the component supply device 92, temporarily stops, and picks up and collects the components. The mounting head 2 then moves to the component camera 94 and pauses, and the component adsorption state is imaged by the component camera 94. The mounting head 2 moves on the board K third, mounts the component, and finally returns to the component supply device 92. This series of operations is a component mounting cycle. The temporary stop position of the mounting head 2 in the feeder-type component storage device 921 is the suction position, and the temporary stop position of the mounting head 2 in the vicinity of the component camera 94 is the imaging position. In addition, the mounting head 2 pauses and stands by at a predetermined standby position on the base 99 during a non-operating time period.

  In the prior art, in order to supply electric power to the electric loads such as the drive motors 22 and 26, the negative pressure generating mechanism, and the control unit described above, a power supply cable having deformable flexibility has been used. Moreover, the voltage is often different in the three sections of the drive motors, the negative pressure generating mechanism, and the control unit, and in addition, in many cases, a communication cable that transmits a control signal between the control unit and the control computer is used. A large number of cables were shaped or bundled so as not to be complicated.

  Next, the component mounting apparatus 1 according to the first embodiment in which this cable is eliminated or reduced will be described. FIG. 3 is a side view of a main part schematically illustrating the component mounting apparatus 1 according to the first embodiment of the present invention, and FIG. 4 is a main part schematically illustrating the component mounting apparatus 1 according to the first embodiment. It is a top view. The component mounting apparatus 1 includes a substrate transfer device 91, a component supply device 92, a component transfer device 93, and a component camera 94, which are substantially the same as those described in FIG. A description thereof will be omitted. Furthermore, the component mounting apparatus 1 according to the embodiment includes a non-contact power feeding mechanism. The non-contact power supply mechanism includes a non-contact power supply element 31 and a high-frequency power supply unit 4 on the base 99 side, non-contact power reception elements 51 to 55 on the mounting head 2 side, a power conversion unit 6, a charge control unit 7, and two A secondary battery 8 is used.

  The non-contact power feeding element 31 is a coil formed by winding a conductor around an unillustrated core, and is disposed on the base 99 side close to the suction position of the mounting head 2. More specifically, as shown in FIG. 3 and FIG. 4, hollow power supply props 36 are erected from the base 99 at positions outside the feeder-type component storage devices 921 at both ends of the component supply device 92. Yes. The upper ends of the two power supply columns 36 are connected by a hollow power supply beam 37. The power supply beam 37 crosses the part supply device 92 in the width direction (X-axis direction).

  Inside the power feeding beam 37, ten non-contact power feeding elements 31 equal to the number of feeders are provided rearward. The outer shape of the contactless power supply element 31 is slightly smaller than the slot width d of the feeder-type component housing device 921. Each contactless power feeding element 31 is disposed at a position directly above each feeder-type component housing device 921 at a pitch of the slot width d (see FIG. 4). The ten contactless power feeding elements 31 are connected in parallel to the high-frequency power supply unit 4 provided in the base 99 by a wiring cable 311 that passes through the hollow interior of the power feeding beam 37 and the power feeding column 36.

  On the other hand, the five non-contact power receiving elements 51 to 55 are also coils, and are arranged in a row at the pitch of the slot width d in the width direction (X-axis direction) so as to face the front side of the mounting head 2. (See FIG. 4). The five non-contact power receiving elements 51 to 55 are connected in parallel to each other and input to the power conversion unit 6 in a lump. The output side of the power conversion unit 6 is input-connected to the charge control unit 7, and the output side of the charge control unit 7 is connected to the secondary battery 8.

  Further, the configuration on the mounting head 2 side will be described in detail. In FIG. 2, the five non-contact power receiving elements 51 to 55 are arranged facing forward on the lower side of the front side (left side in the drawing) of the X-axis slider 21. The non-contact power receiving elements 51 to 55 are coils formed by winding the conductor 58 around the core 57, and it is preferable to increase the power feeding efficiency by aligning the characteristics with the facing non-contact power feeding element 31. A power receiving power supply substrate 2D is disposed at an intermediate height near the front of the X-axis slider 21. Circuits of the power conversion unit 6 and the charging control unit 7 are configured on the power receiving power supply substrate 2D. A secondary battery 8 is disposed on the upper front side of the X-axis slider 21.

  In FIG. 4, the mounting head 2 is away from the suction position, and moves to the left in the figure when picking up a component. Then, as shown in FIG. 3, the mounting head 2 moves to a suction position directly above the component supply unit 924 of the feeder-type component storage device 921 and stops temporarily, and the suction nozzle 251 descends to pick up and pick up the component. To do. Here, when the mounting head 2 is temporarily stopped at the suction position, the non-contact power receiving elements 51 to 55 face a part of the non-contact power feeding element 31 without being displaced.

  For example, when the mounting head 2 moves to the left in the figure from the state of FIG. 4 and the suction nozzle 251 picks up and picks up a component from the fourth feeder-type component storage device 921 in the drawing, The non-contact power receiving elements 51 to 55 face the second to sixth non-contact power feeding elements 31 from the top and face each other without deviation. That is, the five sets of non-contact power receiving elements 51 to 55 and the non-contact power feeding element 31 face each other to enable electromagnetic induction type non-contact power feeding.

  Further, when picking up and picking up parts from the same fourth feeder-type component housing device 921 with another suction nozzle 252, the mounting head 2 does not move, the suction nozzle 251 rises, the nozzle holder 24 rotates, and the suction nozzle 252 goes down. Therefore, non-contact power feeding during this time becomes possible. On the other hand, when picking up and picking up a component from another feeder-type component storage device 921 with another suction nozzle 252, the mounting head 2 moves and non-contact power feeding is possible at another suction position of the movement destination.

  When the mounting head 2 picks up and picks up components from the feeder-type component storage devices 921 at both ends, the two non-contact power receiving elements (51 and 52 or 54 and 55) are arranged in the width direction (X-axis) of the component supply device 2. Direction). Therefore, the number of pairs of the non-contact power receiving elements 51 to 55 and the non-contact power feeding elements 31 facing each other is reduced to three. When the mounting head 2 picks up and picks up components from the second feeder-type component storage device 921 from both ends, the number of non-contact power receiving elements 51 to 55 and non-contact power feeding elements 31 that face each other is four. . As described above, the amount of non-contact power feeding decreases depending on the position of the feeder-type component housing device 921 that picks up and picks up components, but at least three sets of non-contact power receiving elements 51 to 55 and non-contact power feeding Non-contact power feeding by the element 31 can be ensured.

  FIG. 5 is a circuit diagram schematically showing an electrical configuration on the base 99 side of the non-contact power feeding mechanism. As shown in the figure, each of the ten contactless power feeding elements 31 is connected in parallel to the high frequency power supply unit 4 via a switch 32. Each switch 32 is controlled to open and close independently by a command from the control computer. The high-frequency power supply unit 4 outputs a high-frequency voltage having a high frequency equal to or higher than the MHz band suitable for non-contact power feeding. On / off of the output of the high frequency power supply unit 4 is also controlled by a command from the control computer.

  FIG. 6 is a circuit diagram schematically showing an electrical configuration of the non-contact power feeding mechanism on the mounting head 2 side. As shown in the drawing, the five non-contact power receiving elements 51 to 55 are connected in parallel to each other and input to the power conversion unit 6 at once. The power converter 6 is a known full-wave rectifier circuit composed of four rectifier diodes 61 to 64, and an output-side smoothing element is not shown. The output side of the power conversion unit 6 is input-connected to the charge control unit 7. The charging control unit 7 controls the output voltage and output current (charging voltage and charging current) with reference to the charging state of the secondary battery 8 connected to the output side, and maintains the charging operation appropriately. All or part of the electric load L mounted on the mounting head 2 is connected to the secondary battery 8.

  Next, the operation of the component mounting apparatus 1 according to the first embodiment will be described. The control computer issues a command to the control unit of the mounting head 2 to sequentially control the component mounting cycle. Here, the control computer schedules and controls that the mounting head 2 picks up and picks up a component at a suction position of a specific feeder-type component storage device 921 of the component supply device 92. Therefore, the control computer controls the output of the high-frequency power supply unit 4 to be turned on immediately before the mounting head 2 reaches the suction position. At the same time, the control computer closes the specific feeder-type component housing device 921 and the five switches 32 corresponding to both sides thereof, selects the five contactless power feeding elements 31 and applies the high-frequency voltage. Further, the control computer controls the output of the high frequency power supply unit 4 to be turned off immediately after the mounting head 2 is separated from the suction position.

  Thereby, non-contact electric power feeding by an electromagnetic induction system can be performed from the five non-contact power feeding elements 31 on the base 99 side to the five non-contact power receiving elements 51 to 55 on the mounting head 2 side. The non-contact power supply continues for a time period in which the mounting head 2 is temporarily stopped at the suction position. The five non-contact power receiving elements 51 to 55 receive high-frequency power by electromagnetic induction and output a high-frequency current having the same phase. The high-frequency current is converted into DC power by the power conversion unit 6 and stored in the secondary battery 8 via the charge control unit 7. Therefore, each time the mounting head 2 is temporarily stopped at the suction position, the contactless power supply is intermittently repeated, and the electric load L mounted on the mounting head 2 can be continuously supplied with power.

  According to the component mounting apparatus 1 of the first embodiment, the non-contact power feeding mechanism performs non-contact power feeding at the suction position during the temporary stop period, and continuously feeds the electric load L mounted on the mounting head 2. be able to. Here, in the configuration in which all the electric loads L mounted on the mounting head 2 are contactlessly fed, the feeding cable can be eliminated. Further, in the configuration in which non-contact power is supplied to some of the electric loads L due to restrictions on the amount of electric power that can be supplied, differences in voltage of the electric loads L, and the like, the number of power supply cables can be reduced. Further, the communication cable can be replaced with wireless communication means. As a result, the load on the cable can be reduced by eliminating or reducing the tension of the cable applied to the mounting head 2, and the speed of movement of the mounting head 2 can be increased. In addition, the risk of cable breakage due to metal fatigue is reduced.

  Further, at the suction position, the plurality of non-contact power receiving elements 51 to 55 and the plurality of non-contact power feeding elements 3 face each other without deviation. The non-contact power feeding elements 51 to 55 and the non-contact power receiving element 31 are respectively coils. By these comprehensive actions, electromagnetic induction type non-contact power supply can be performed at a narrow temporary stop position, and much more electric power can be supplied compared to the electric field coupling method and the magnetic field resonance method.

  Next, regarding the component mounting apparatus 1A of the second embodiment that performs non-contact power feeding at the imaging position in addition to the suction position, differences from the first embodiment will be mainly described. FIG. 7 is a side view of an essential part for schematically explaining a component mounting apparatus 1A according to a second embodiment of the present invention. In the second embodiment, in order to perform non-contact power feeding at the imaging position, a non-contact power feeding element 33, a non-contact power receiving element 56, and the like are added to the first embodiment.

  The non-contact power feeding element 33 is a coil formed by winding a conductor around an unillustrated core, and is disposed on the base 99 side close to the imaging position of the mounting head 2. Specifically, as shown in FIG. 7, a hollow power supply column 38 is erected from the base 99 at a position near the component camera 94. A non-contact power supply element 33 is provided inside the upper end of the power supply column 38 so as to face upward. The height of the contactless power feeding element 33 is set to be approximately the same as the height of the component camera 94. The structure and electrical characteristics of the non-contact power feeding element 33 may be the same as or different from the non-contact power feeding element 31 provided at the suction position. The non-contact power feeding element 33 is connected in parallel to the high frequency power supply unit 4 via a switch (not shown) by a wiring cable 331 passing through the hollow interior of the power feeding support 38.

  On the other hand, the non-contact power receiving element 56 is also a coil formed by winding a conductor around a core (not shown), and is provided to face downward toward the Y-axis slider 29 on the lower side of the mounting head 2. The structure and electrical characteristics of the non-contact power receiving element 56 may be the same as or different from those of the non-contact power receiving elements 51 to 55 provided for the suction position. It is preferable to increase the power feeding efficiency by arranging the above. The non-contact power receiving element 56 is connected to the power conversion unit 6A. The output side of the power conversion unit 6 </ b> A is input-connected to the charge control unit 7, and the output side of the charge control unit 7 is connected to the secondary battery 8.

  In FIG. 7, the mounting head 2 has reached the imaging position above the component camera 94, and the component camera 94 images the component suction state of the suction nozzles 251 and 252. Here, when the mounting head 2 is temporarily stopped at the imaging position, the non-contact power receiving element 56 approaches so as to face directly from above the non-contact power feeding element 33, and electromagnetic induction type non-contact power feeding is performed. It becomes possible.

  FIG. 8 is a circuit diagram schematically showing an electrical configuration on the mounting head 2 side of the non-contact power feeding mechanism. As shown in the figure, an input changeover switch 65 is added to the input side of the full-wave rectifier circuit of the power converter 6A as compared with the first embodiment. The input changeover switch 65 is controlled by a command from the control unit, and selectively switches between the five non-contact power receiving elements 51 to 55 for the suction position and the non-contact power receiving element 56 for the imaging position. FIG. 8 illustrates the state switched to the non-contact power receiving element 56 for the imaging position.

  In addition, a part of the electric load L1 and a voltage regulator 81 are connected to the secondary battery 8 in parallel. The output voltage V1 of the secondary battery 8 is supplied as it is to some of the electric loads L1. The voltage regulator 81 converts the output voltage V1 of the secondary battery 8 to generate a regulator voltage V2, and supplies power to another electric load L2 having a different voltage. A plurality of voltage regulators may be provided to supply power to three or more electrical loads having different voltages. Alternatively, a multi-output type charge control unit that outputs a plurality of voltages and a plurality of secondary batteries corresponding to each voltage may be provided to supply power to two or more electrical loads having different voltages.

  Next, the operation of the component mounting apparatus 1A of the second embodiment will be described. The control computer issues a command to the control unit of the mounting head 2 to sequentially control the component mounting cycle. Here, the control computer schedules and controls the movement of the mounting head 2 to the suction position and the imaging position. Therefore, when the mounting head 2 reaches the suction position, the control computer selects five non-contact power feeding elements 31 at the suction position and applies a high-frequency voltage. At the same time, the control computer issues a command to the control unit on the mounting head 2 and switches the input changeover switch 65 of the power conversion unit 6A to the five non-contact power receiving elements 51 to 55 for the suction position.

  Similarly, when the mounting head 2 reaches the imaging position, the control computer selects the non-contact power feeding element 33 at the imaging position and applies a high-frequency voltage. At the same time, the control computer issues a command to the control unit on the mounting head 2 to switch the input changeover switch 65 of the power conversion unit 6A to the non-contact power receiving element 56 side for the imaging position.

  Thereby, the electromagnetic induction type non-contact power feeding can be performed at both the suction position and the imaging position. In the component mounting apparatus 1A of the second embodiment, the power supply amount is larger than that of the first embodiment by the amount of non-contact power supply at the imaging position. Furthermore, by using the voltage regulator 81, it is possible to continuously supply power to the two electric loads L1 and L2 having different voltages V1 and V2, thereby expanding the application range.

  In the first and second embodiments, the output on / off control of the high frequency power supply unit 4 and the selection control of the non-contact power feeding elements 31 and 33 by the switch 32 are not essential. That is, the high-frequency power supply unit 4 may be turned on throughout the time period in which the mounting head 2 is operating, and a high-frequency voltage may be applied to all the non-contact power feeding elements 31 and 33. In this aspect, non-contact power feeding is automatically performed by the non-contact power feeding elements 31 and 33 that the mounting head 2 approaches. As a result, the normal excitation loss of the non-contact power supply elements 31 and 33 slightly increases, but the control of the non-contact power supply can be greatly simplified.

  Further, non-contact power feeding can be performed at a standby position where the mounting head 2 waits during a time period when the mounting head 2 does not operate. In this aspect, it is necessary to newly provide a non-contact power feeding element at the standby position on the base 99 side, but on the mounting head 2 side, the non-contact power receiving elements 51 to 55 for the suction position or the imaging position, 56 can also be used. Further, in the first and second embodiments, the electromagnetic induction type coils are used for the non-contact power feeding elements 31 and 33 and the non-contact power receiving elements 51 to 56, but an electric field coupling method or a magnetic field resonance method is applied. Also good. Various other applications and modifications are possible for the present invention.

1, 1A: Component mounting device 2: Linear motor device
21: X-axis slider 22: R-axis motor 23: Index shaft body
24: Nozzle holder 251, 252: Suction nozzle
26: θ-axis motor 27: Guide rail 28: Guide block
29: Y-axis slider 2A: Ball screw 2B: Ball nut
2C: Rotation transmission mechanism 2D: Power receiving power supply board 31: Element for non-contact power feeding (for suction position) 32: Switch 33: Element for non-contact power feeding (for imaging position)
36: Power supply support 37: Power supply beam 38: Power supply support 4: High frequency power supply unit 51-55: Non-contact power receiving element (for suction position)
56: Non-contact power receiving element (for imaging position)
6, 6A: Power conversion unit 61-64: Rectifier diode 65: Input changeover switch 7: Charge control unit 8: Secondary battery 81: Voltage regulator 9: Component mounting device
90: Common base 91: Substrate transfer device
92: Component supply device 921: Feeder-type component storage device
93: Parts transfer device 94: Parts camera 95: Cover
96: Display operation device 99: Base K: Substrate d: Slot width L, L1, L2: Electric load

Claims (2)

From the component supply device, a substrate conveyance device that carries a substrate into a component mounting position along a conveyance path, positions and unloads the substrate, a component supply device in which a plurality of component accommodation devices that accommodate a plurality of components are detachably attached, and A component mounting apparatus comprising: a mounting head that mounts a component on a substrate that has been picked up and mounted; and a component transfer device that includes a head drive mechanism that moves the mounting head in two orthogonal directions within a horizontal plane. There,
A non-contact power supply element provided at a temporary stop position where the mounting head is temporarily stopped during operation, and a high frequency power supply unit that supplies high frequency power to the non-contact power supply element are provided on the base side. ,
A non-contact power receiving element that receives high-frequency power in a non-contact manner facing the non-contact power feeding element at the temporary stop position, a power conversion unit that converts high-frequency power received by the non-contact power receiving element into DC power, and A non-contact power feeding mechanism configured to have a secondary battery on the mounting head side that stores the DC power and enables power feeding to an electrical load mounted on the mounting head ;
The component supply device is attached with a plurality of feeder-type component storage devices having a predetermined slot width,
The temporary stop position includes a plurality of suction positions when the mounting head picks up and picks up the parts from each feeder-type part storage device,
The non-contact power feeding element has a size equal to or smaller than the slot width, and a plurality of the non-contact power feeding elements are provided at a pitch of the slot width corresponding to the plurality of suction positions.
A plurality of non-contact power receiving elements are provided so as to face each other without misalignment when a plurality of the non-contact power feeding elements are temporarily stopped at any suction position. Mounting device. The component mounting apparatus according to claim 1 , wherein each of the contactless power feeding element and the contactless power receiving element is a coil.

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