JP5934293B2 - Rotating blade - Google Patents

Description

  The present invention relates to a rotating blade that is used for cutting or grinding a hard work such as a stone, a metal material, a concrete block, a tile, or a wood that is rotated at a high speed.

  Conventionally, for processing hard workpieces such as stone, metal materials, concrete blocks, tiles, wood, etc., for example, using a diamond cutter formed with a diamond sintered body on the outer periphery for cutting. Yes. Patent document 1 is shown as an example of the diamond cutter which processes a hard workpiece | work by rotating at high speed in this way.

JP 2002-66932 A

  However, vibrations and noises have conventionally been a problem with rotating blades such as diamond cutters. One of the causes of vibration and noise in cutting is that a discontinuous portion of the blade body interferes with the workpiece when the blade body abuts on the workpiece. For example, Patent Document 1 discloses a technique for forming a plurality of slits in a substrate in order to suppress noise. Conventionally, various means for suppressing noise and vibration when processing with a rotating blade have been proposed, and the present invention also aims to suppress noise and vibration during such processing.

As means for solving the above-mentioned problems, a main substrate in which a first through hole for attaching a support shaft is formed at a central position, processing means formed on the outer periphery of the main substrate, and a central position of the main substrate And a pair of small substrates having a rotationally symmetrical outer shape of the same shape smaller than the main substrate arranged on both the front and back surfaces, and the processing means being formed on the main substrate The outline shape of the blade main body is constructed, and the second through-hole transmitting in the front and back direction is formed at a position adjacent to the outer periphery of the small substrate of the main substrate.
When the processing means of the rotating blade comes into contact with the workpiece, the force acts not only in the radial direction of the rotating blade but also in the direction intersecting with the rotation axis, depending on the shape of the processing means. It can be assumed that this causes blurring of the rotating rotating blade, causing interference between the workpiece and the processing means, causing vibration and noise. When configured as in the present invention, when the rotating blade rotates at high speed, turbulence is generated on the front and back surfaces of the periphery due to the interaction between the second through hole and the small substrate having a step, thereby suppressing the vibration of the rotating blade. Will be. As a result, vibration and noise associated with machining are suppressed.
Here, the “main substrate” is formed with a first through hole for attaching a support shaft for imparting rotation, and a blade body is constructed by attaching a processing means to the outer periphery thereof. The blade body should preferably have a rotationally symmetric shape for suppressing vibration and noise. The rotational symmetry is best to be rotationally symmetric including the position of the through-holes formed on the main substrate. However, if the influence of the through-holes is not large, the shape of the outer periphery where the processing means is formed should be rotationally symmetric. That's fine.
“Processing means” includes cutting means and grinding means. The processing means is both when the sintered material is placed on the outer periphery of the main substrate and sintered integrally, or when a blade or a grindstone made of a diamond sintered body or cemented carbide is separately attached by welding, etc. Is included.
The “small substrates” arranged on the front and back sides must have the same shape and have an outer shape that is rotationally symmetric. This is because turbulence is generated evenly on the front and back by configuring the same shape. The rotational symmetry of the small substrate is not affected by slight differences in the surface such as engraving or painting. The same applies when the main substrate is rotationally symmetric.

The plurality of second through holes are preferably formed at positions that do not impair rotational symmetry. “Does not impair rotational symmetry” means, for example, a position that is 180 degrees opposite if there are two second through holes, and a position that is out of phase by 120 degrees if there are three second through holes. It means that it is arranged at a position that is balanced and rotationally symmetric. The plurality of second through holes may have the same shape.
Further, it is preferable to form a third through hole communicating with the second through hole in the region covered with the small substrate of the main substrate. This makes it possible to generate a large turbulence without enlarging the second through holes (that is, if the second through holes are made large, the strength of the main substrate is affected). Further, by forming the third through hole, the load on the center of the rotating blade as a whole can be made lighter than the surroundings, which contributes to stable rotation during rotation. In addition, the third through hole is preferably made larger than the second through hole.

  In the rotating blade of the present invention, vibration and noise accompanying processing are suppressed.

The front view of the diamond cutter of embodiment of this invention. Sectional drawing in the AA sectional line of FIG. Explanatory drawing explaining the main board | substrate and small board | substrate of the diamond cutter of the same embodiment. The perspective view of the diamond cutter of the same embodiment, and the elements on larger scale of a diamond tip.

Hereinafter, an embodiment of a diamond cutter will be described with reference to the drawings as an example of the rotating blade of the present invention.
As shown in FIGS. 1-3, the diamond cutter 1 of this Embodiment is provided with the disk-shaped main board | substrate 2 which consists of carbon tool steel. A diamond chip 3 as a processing means is formed on the outer periphery of the main substrate 2. The diamond chip 3 is a diamond sintered body in which a sintered material mainly composed of Cu, F, Ni, Ti, and diamond is placed in a mold together with the main substrate 2 and formed by simultaneous sintering. The blade body 4 is configured with the diamond chip 3 formed on the main substrate 2. The main substrate 2 is formed on the front and back planes and has a thickness of 8 mm, and the diamond chip 3 has a thickness of 11 mm. The diamond chip 3 has a uniform width (about 7.5 mm) and surrounds the main substrate 2 from the outer periphery. In the diamond chip 3, the grooves 3 and the ridges are alternately arranged on one surface, and the cutting portion 3a is formed on the back surface so that the relationship between the grooves and the ridges is reversed. The extending direction of the concave grooves and the ridges is arranged at a predetermined angle (29 degrees in the present embodiment) with respect to the diameter. Since the diamond chip 3 has such a configuration, as shown in FIG. 4, the tip (circumferential end face) appears as a zigzag shape in which a trapezoid is alternately repeated on the front and back sides. When the diamond chip 3 having such a shape is brought into contact with a hard work at high speed, vibration due to the uneven shape and noise based on the vibration are generated.

As shown in FIG. 2, a circular shaft attachment hole 5 is formed in the center of the main substrate 2 as a first through hole into which, for example, a support shaft (rotary shaft) of a disk cutter device is inserted. Four deformed through holes 6 are formed around the shaft mounting hole 5. The deformed through hole 6 is disposed at a position closer to the shaft attachment hole 5 than the cutting portion 3a. The deformed through holes 6 are equidistant from the center of the main substrate 2 and are arranged in a balanced manner at positions shifted by 90 degrees in phase. The odd-shaped through holes 6 are equally left and right in the circumferential direction of the shaft mounting hole 5 integrally formed with the oval-shaped slit portion 6a extending outward from the center along the radial direction of the main substrate 2 and the base side of the slit portion 6a. It is a hole comprised from the bulging part 6b projected over. The deformed through hole 6 needs to be formed at a position closer to the shaft mounting hole 5 than the diamond chip 3 in the main substrate 2. Near the diamond chip 3 of the main substrate 2, eight circular small through holes 8 are formed. Each small through hole 8 is arranged in a well-balanced position at a phase shift of 45 degrees. Further, the small through holes 8 are arranged at positions separated from the slit portions 6a and are not arranged on the diameter passing through the main substrate 2 and the slit portions 6a.
As shown in FIGS. 1 to 3, a pair of small substrates 9 are arranged on the front and back of the main substrate 2. The small substrate 9 is a ring-shaped member made of carbon tool steel. A circular through hole 10 having the same shape as the shaft mounting hole 5 of the main substrate 2 is formed, and the periphery of the through hole 10 is formed to have the same width. Has been. The small substrate 9 is formed on the front and back planes and has a thickness of 8 mm. The small substrate 9 is fixed to the front and back surfaces of the main substrate 2 by spot welding. The main substrate 2 is sandwiched between the small substrates 9, and most of the deformed through holes 6 are surrounded by the small substrate 9 from the front and back sides, and the tip of the slit portion 6a is not covered as shown in FIG. Slightly exposed. The slightly exposed end of the slit portion 6a of the modified through hole 6 corresponds to the second through hole, and the portion covered with the small substrate 9 corresponds to the third through hole.

In the diamond cutter 1 having such a configuration, when rotating at high speed during use, turbulence is generated around the tip (second through hole) of the slightly exposed slit portion 6a on the outer edge of the small substrate 9 on both the front and back surfaces. . In this embodiment, it occurs in a well-balanced manner at four locations as the centers of the tips (second through holes) of the slit portions 6a on the front and back surfaces. It is considered that the pressure generated by the turbulent airflow becomes a force for holding the diamond cutter 1 and the effect of suppressing the force that intersects the axial direction of the support shaft (rotating shaft) during processing is exhibited.
Therefore, the vibration and noise which generate | occur | produce between workpieces in cutting are suppressed.
Further, in the present embodiment, since the space beyond the actual exposure is communicated inside the small substrate 9, there is an effect of increasing (intensifying) the turbulence even though the exposure amount of the slit portion 6a is small. The larger the exposure, the greater the turbulence. On the other hand, the rigidity of the main substrate 2 is lowered, which causes vibration. Therefore, such a configuration is preferable. In addition, since the small substrate 9 is arranged near the center of the main substrate 2 that covers most of the deformed through hole 6, it is possible to reduce the weight by forming the deformed through hole 6. The rigidity of the region near the center can be improved.

It should be noted that the present invention can be modified and embodied as follows.
The shapes of the main substrate 2, the diamond chip 3, and the small substrate 9 are examples, and can be implemented in other shapes. For example, the outer shape (circumferential shape in front view) of the blade body 4 in which the diamond chip 3 is formed on the main substrate 2 is circular, but the outer peripheral shape (that is, outside the diamond chip 3) is rotationally symmetric even if not circular. Is rotationally symmetric). The presence or absence of small through-holes 8 formed on the side surface of the main substrate 2 and other changes in shape and number are also free. The shape of the small substrate 9 is not limited as long as the second through holes exposed to the outer edge are arranged in a well-balanced manner with a rotational symmetry. Moreover, the presence or absence of the painting is not questioned.
-The shape and the number of the irregular shaped through holes 6 are not limited to the above. The exposure amount of the second through hole can be changed freely. Further, a configuration in which no through hole is formed in the main substrate 2 may be employed.
Further, as a processing means, a blade body or a grindstone made of another diamond sintered body or cemented carbide material may be retrofitted by welding or the like. In the above description, the diamond cutter 1 is used for cutting. However, the present invention may be applied to a rotating blade for grinding used in a disk grinder device, for example.
In addition, the present invention can be freely modified and implemented without departing from the spirit of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Diamond cutter as a rotating blade, 2 ... Main substrate, 3 ... Diamond chip as processing means, 5 ... Shaft mounting hole as 1st through-hole, 9 ... Small board | substrate, 6a ... As 2nd through-hole Slit part.

Claims (4)

A main substrate having a first through hole for attaching a support shaft at a central position;
Processing means formed on the outer periphery of the main substrate;
A small substrate having a rotationally symmetrical shape of a pair of the same shape that is smaller than the main substrate disposed on the front and back surfaces at the center position of the main substrate,
The outer shape of the blade body is constructed in a state where the processing means is formed on the main substrate, and a second through hole is formed in the main substrate adjacent to the outer periphery of the small substrate in the front-back direction. In addition, a rotating blade is characterized in that a third through hole communicating with the second through hole is formed in a region covered with the small substrate of the main substrate .   The rotating blade according to claim 1, wherein the plurality of second through holes are formed at positions that do not impair rotational symmetry. The rotary blade according to claim 1, wherein the third through hole is larger than the second through hole . The rotary blade according to any one of claims 1 to 3, wherein the processing means is means for performing cutting or grinding made of a diamond sintered body .

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