JP5925474B2 - Wafer processing equipment - Google Patents

Description

  The present invention relates to a mini-environment wafer transfer technique, and more particularly to a wafer processing apparatus having a load port.

  In recent years, in a manufacturing process of a semiconductor integrated circuit, a clean environment maintaining method called a mini environment system is used instead of a clean room. In the mini-environment system, only a space where cleanliness is required is locally maintained at a high level of cleanliness. Such a local clean space is called a mini-environment.

  When a wafer is transferred from one mini-environment to another mini-environment, a sealed container for storing the wafer is used. A FOUP (Front Opening Unified Pod) is known as such a sealed container. The hoop is manufactured in conformity with the SEMI (Semiconductor Equipment and Materials Institute) standard, and typically has a shell for storing a plurality of wafers and a lid provided at a wafer inlet / outlet on a side surface.

  The wafer processing apparatus is provided with a load port for receiving a hoop. The load port is provided with an opener for opening and closing the hoop lid. The opener opens the lid of the hoop, and the wafer or the transfer device provided in the wafer processing apparatus takes out the wafer and transfers it to the wafer processing apparatus. The process of taking the wafer out of the hoop and transporting it to the wafer processing apparatus is performed in an atmosphere of high cleanliness free from dust.

JP 2007-5604 A JP 2009-38073 A JP 2009-111404 A

  The interior space of the hoop is kept clean and free from dust, but humidity and oxygen are not removed. In the manufacturing process of a semiconductor integrated circuit, high cleanliness without dust is necessary, but there are processes that dislike humidity and oxygen. Therefore, when the wafer is taken out of the hoop and transferred to the wafer processing apparatus, the problem is that humidity and oxygen existing in the internal space of the hoop are taken into the wafer processing apparatus together with the wafer. Therefore, it is preferable to replace the internal space of the hoop with a purge gas or the like before removing the wafer from the hoop and transporting it to the wafer processing apparatus.

  Patent Document 1 describes a purge system in which a supply port and an exhaust port are provided on the bottom surface of a hoop, and the inside of the hoop is replaced with a predetermined gas in a state where the hoop is installed outside the wall of the load port. In this purge system, both the supply port and the exhaust port are arranged on the bottom surface of the hoop. Therefore, there is a possibility that particles accumulated on the lower surface in the hoop rise and adhere to the wafer due to the airflow from the supply port.

  Patent Document 2 describes a system in which a door for opening and closing a hoop lid and an enclosure surrounding the door are provided inside a wall of a load port. A purge gas flow is generated downward from the top side of the enclosure. The enclosure is provided with an opening that communicates with the interior of the wafer processing apparatus. Therefore, there is a possibility that humidity and oxygen existing in the internal space of the hoop may flow into the wafer processing apparatus through the opening of the enclosure.

  Patent Document 3 describes an apparatus in which two openers and a chamber surrounding them are provided inside the base of a load port. A closure provided with an adsorber for adsorbing the door of the pod is movably disposed in a closure storage chamber inside the chamber. The closure storage chamber is provided with an opening that communicates with the interior of the wafer processing apparatus. During the purge, the opening is closed by the closure, so that the closure storage chamber becomes a sealed space. Therefore, during supply and exhaust, humidity and oxygen existing in the internal space of the hoop do not flow into the wafer processing apparatus via the closure storage chamber. However, this chamber requires a space for housing the closure driving mechanism provided in the two openers, and the dimensions thereof are relatively large.

  An object of the present invention is that when purging the internal space of a wafer storage container, undesirable gas in the wafer storage container flows into the wafer processing apparatus without raising particles accumulated on the lower surface of the wafer storage container. The object is to provide a mechanism capable of minimizing the volume of the purge space.

  An opener provided in a load port of a wafer processing apparatus of the present invention includes a door for opening and closing a lid of a wafer storage container, a chamber configured to surround the door, a drive system for driving the door and the chamber, And a purge mechanism for purging the internal space of the wafer storage container.

  The drive system has three actuators, which are provided outside the chamber. The supply port of the purge mechanism is provided at a position higher than the wafer storage container, and the exhaust port is provided at a position lower than the wafer storage container. During purging, the internal space of the wafer container and the internal space of the chamber are connected to form one sealed purge space.

  According to the present invention, when purging the internal space of the wafer storage container, undesired gas in the wafer storage container flows into the wafer processing apparatus without raising particles accumulated on the lower surface of the wafer storage container. And a mechanism capable of minimizing the volume of the purge space can be provided.

It is a figure which shows schematic structure of the atmospheric conveyance in the wafer processing apparatus by this invention. It is a flowchart which shows the wafer carrying-out sequence of the atmospheric conveyance in the wafer processing apparatus by this invention. It is explanatory drawing explaining the structure of the 1st example of the load port of the wafer processing apparatus of this invention. In the 1st example of the load port of the wafer processing apparatus of the present invention, it is a side view showing the state where the opener was arranged in the advance position and the hoop moved to the lid opening / closing position. In the 1st example of the load port of the wafer processing apparatus of the present invention, it is a side view showing the state where the opener is arranged in the door retreat position and the cover of the hoop is opened. In the 1st example of the load port of the wafer processing apparatus of the present invention, it is a side view showing a state where an opener is arranged in a door and a chamber retreat position. In the 1st example of the load port of the wafer processing apparatus of the present invention, it is a side view showing the state where the opener was arranged in the retreat position. It is a flowchart which shows the process of carrying out a wafer from a hoop in the load port of the wafer processing apparatus of this invention. It is a flowchart which shows the process of closing the lid | cover of a FOUP after unloading a wafer from a FOUP in the load port of the wafer processing apparatus of this invention. It is a flowchart which shows the process of purging a hoop and a chamber with substitution gas in the load port of the wafer processing apparatus of this invention. It is explanatory drawing explaining the structure of the 2nd example of the load port of the wafer processing apparatus of this invention. In the 2nd example of the load port of the wafer processing apparatus of the present invention, it is a side view showing the state where the opener was arranged in the advance position, and the hoop moved to the lid opening / closing position. In the 2nd example of the load port of the wafer processing apparatus of this invention, an opener is arrange | positioned in a door retracted position, and it is a side view which shows the state which the lid | cover of the hoop opened. In the 2nd example of the load port of the wafer processing apparatus of this invention, it is a side view which shows the state by which the opener was arrange | positioned in the door and the chamber retracted position. It is a figure which shows the state by which the opener was arrange | positioned in the retracted position in the 2nd example of the load port of the wafer processing apparatus of this invention. It is a figure which shows the 2nd example of the structure and arrangement | positioning of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the 3rd example of the structure and arrangement | positioning of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the 4th example of the structure and arrangement | positioning of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the example of the structure of the diffusion filter of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the example of the structure of the air nozzle of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the example of arrangement | positioning of the diffusion filter and air nozzle of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the other example of arrangement | positioning of the diffusion filter of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the example of arrangement | positioning of the air nozzle of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention. It is a figure which shows the example of the shape of the exhaust passage of the exhaust system of the purge mechanism of the load port of the wafer processing apparatus of this invention.

  The outline of the load port of the wafer processing apparatus will be described with reference to FIG. The wafer processing apparatus 1 includes a main body 2, a fan filter unit 3 provided on the ceiling thereof, and a wafer transfer mechanism 4. The wafer processing apparatus 1 may be a wafer inspection apparatus, a semiconductor inspection apparatus, or the like. A load port 5 is provided on the front side of the wafer processing apparatus 1.

  The load port 5 is an interface between the hoop 10 and the wafer processing apparatus 1 and includes a vertical base 101 and a horizontal base 102. The base 101 is provided with a hole 101A. The outer surface of the base 101 is referred to as a BOLTS surface. A movable table 18 is mounted on the base 102. The hoop 10 is arranged on the mounting table 18. The mounting table 18 includes a pin for positioning the hoop 10 and a holding mechanism for fixing the hoop 10.

  The hoop 10 includes a shell 12 and a lid 14 attached to a wafer inlet / outlet of the shell. As shown in the figure, the wafer inlet / outlet of the hoop 10 is provided on the side surface. A plurality of wafers 20 are stacked on the shell 12 with a predetermined gap therebetween. A packing is provided around the lid 14 to shield the internal space of the hoop 10 from the outside air. When the lid 14 is closed, the inside of the hoop 10 becomes a sealed space.

  The load port 5 is provided with an opening / closing mechanism for opening / closing the lid 14 of the hoop 10, that is, an opener. The opener has a door 105 and a drive mechanism that drives the door. A vacuum chuck is provided on the front surface of the door 105 to attract and hold the hoop lid 14. The dimension of the door 105 may be substantially the same as the dimension of the lid 14 of the hoop 10. The dimension of the hole 101A of the base 101 is set so that the door 105 and the lid 14 of the hoop 10 can pass through.

  The operation of the load port shown in FIG. 1 will be described with reference to FIG. In step S <b> 1, the hoop 10 is installed on the load port 5. In step S2, the pedestal 18 is moved to place the hoop 10 at the lid open / close position. In step S 3, the hoop lid 14 is opened by the opener door 105. In step S4, the opener door 105 is retracted. In step S5, the wafer 20 is unloaded from the hoop 10 by the wafer transfer mechanism 4 of the wafer processing apparatus.

  A first example of the load port of the present invention will be described with reference to FIG. The load port of this example has a vertical base 101 and a horizontal base 102. A movable table 18 is mounted on the base 102. The hoop 10 is arranged on the mounting table 18. The base 101 is provided with a hole 101A. The mounting surface of the base 101 is referred to as a BOLTS surface. A hoop packing 11 is attached to the front surface of the base 101. The hoop packing 11 is disposed so as to surround the hole 101 </ b> A of the base 101. The load port 5 is provided with an opener for opening and closing the lid 14 of the hoop 10.

  The opener of this example surrounds a door 105 for opening and closing the lid 14 of the hoop 10, a support plate 106 that supports the door 105, a support member 107 connected to the support plate 106, and the door 105 and the support plate 106. The chamber 110 has a drive mechanism for driving the door 105 and the chamber 110.

  The drive mechanism of this example includes a door actuator 141 for moving the door 105 in the front-rear direction, a chamber actuator 142 for moving the chamber 110 in the front-rear direction, and the door 105 and the chamber 110 in the vertical direction. A vertical actuator 143. The operation of these drive mechanisms will be described later.

  In the opener of this example, the door actuator 141, the chamber actuator 142, and the vertical actuator 143 are provided outside the chamber 110. Therefore, the size of the internal space of the chamber 110 may be a size necessary for the door 105 to move in the front-rear direction. Therefore, the dimension of the chamber 110 can be reduced. If the size of the chamber 110 is small, the time required for purging can be shortened.

  A vacuum chuck is provided on the front surface of the door 105 to attract and hold the hoop lid 14. The dimension of the door 105 may be substantially the same as the dimension of the lid 14 of the hoop 10. The size of the hole 101A of the base 101 is larger than the size of the door 105 and the lid 14 of the hoop 10. Therefore, the door 105 and the lid 14 of the hoop 10 can pass through the hole 101 </ b> A of the base 101. The size of the support plate 106 is larger than the size of the door 105 and further larger than the size of the hole 101 </ b> A of the base 101. Therefore, the door 105 can pass through the hole 101A of the base 101, but the support plate 106 cannot pass through the hole 101A of the base 101. FIG. 3 shows a state in which the opener is arranged at the forward movement position. When the opener is disposed at the forward movement position, the door 105 is engaged with the hole 101 </ b> A of the base 101. The hole 101A of the base 101 is closed by the support plate 106.

  The door 105 includes a mechanism such as a latch key for unlocking the lid 14 and a pin for positioning the lid 14, but detailed description thereof will be omitted.

  The structure of the chamber 110 in this example will be described. The chamber 110 has a box-shaped structure, and has a rectangular opening on the front surface, a rectangular back surface 110A on the opposite side, and four side surfaces surrounding the opening and the back surface.

  An opening 110D through which the support member 107 passes is formed in the lower side surface 110C of the chamber 110. A bellows 113 is provided between the lower side surface 110 </ b> C and the support member 107 so as to surround the support member 107. Even if the support member 107 moves back and forth within the opening 110D of the lower side surface 110C, the gap between the support member 107 and the lower side opening 110D is always closed by the bellows 113. That is, the gas in the internal space of the chamber 110 does not leak from the periphery of the support plate 106.

  A chamber packing 111 is mounted on the back surface of the base 101. The chamber packing 111 is disposed so as to surround the hole 101 </ b> A of the base 101. The chamber 110 can be moved in the front-rear direction by a chamber actuator 142. As illustrated, when the chamber 110 is moved so as to contact the back surface of the base 101, the periphery of the opening on the front surface of the chamber 110 abuts on the chamber packing 111. As a result, the chamber packing 111 is elastically deformed, and the contact surface between the chamber packing 111 and the front surface of the chamber 110 has a band shape. The elastic deformation of the chamber packing 111 completely seals the space between the chamber 110 and the back surface of the base 101, and gas does not leak from there.

  The structure of the purge mechanism provided in the load port of this example will be described. The purge mechanism has a supply system and an exhaust system. The supply system has a supply port 120 that communicates with the internal space of the chamber 110. According to this example, the supply port 120 is provided at an arbitrary position above the hoop 10. The supply port 120 is provided at an arbitrary position above the ceiling surface of the hoop 10. In the illustrated example, the supply port 120 is provided on the back surface 110 </ b> A of the chamber 110. However, the supply port 120 may be provided on the upper side surface 110 </ b> B or the side surface of the chamber 110 or the back surface of the base 101. A supply pipe 121 is connected to the supply port 120. A supply valve 123 is provided in the supply pipe 121. The supply pipe 121 and the supply valve 123 have an appropriate piping structure so as not to disturb the movement of the chamber 110.

  According to the load port of this example, the inside of the hoop 10 may be purged twice when the lid 14 of the hoop 10 is opened and closed. The replacement gas used for purge when opening and the replacement gas used when closing may be the same or different. Therefore, a plurality of replacement gas sources are connected to the supply pipe 121 in a switchable manner. The supply system is further provided with a diffusion filter, an air nozzle, a rectifying plate, etc., which will be described in detail later.

  The exhaust system has an exhaust port 130 that communicates with the internal space of the chamber 110. According to this example, the exhaust port 130 is provided at an arbitrary position below the hoop 10. The exhaust port 130 is provided at an arbitrary position below the bottom surface of the hoop 10. In the illustrated example, the exhaust port 130 is provided below the hole 101 </ b> A of the base 101. An exhaust passage 131 is connected to the exhaust port 130. In this example, the exhaust passage 131 is formed in the base 102. The structure of the exhaust passage 131 will be described in detail later. An exhaust pipe 132 is connected to the exhaust passage 131. The exhaust pipe 132 is provided with an exhaust valve 133 and an exhaust fan 135. The exhaust pipe 132 may be connected to a low-pressure source (not shown) such as a vacuum source.

  A measuring device 136 is provided in the exhaust passage 131. The measurement target of the measuring device 136 is determined by the purpose of the purge. When the purpose of purging is to purge oxygen in the internal space of the hoop 10, an oxygen concentration meter may be used as the measuring device 136. If the purpose of purging is to purge the humidity in the internal space of the hoop 10, a hygrometer may be used as the measuring device 136.

  The operation of the first example of the load port opener of the present invention will be described with reference to FIGS. FIG. 4 shows a state in which the opener is disposed at the forward movement position and the hoop has moved to the lid opening / closing position. When the opener is disposed at the forward movement position, the door 105 is disposed within the hole 101 </ b> A of the base 101. The chamber 110 is pressed against the back surface of the base 101. The periphery of the front opening of the chamber 110 is in contact with the chamber packing 111. The chamber packing 111 is elastically deformed, and the contact surface between the chamber packing 111 and the front surface of the chamber 110 has a strip shape. The elastic deformation of the chamber packing 111 completely seals between the end surface of the opening of the chamber 110 and the back surface of the base 101.

  When the hoop 10 moves to the lid opening / closing position, the lid 14 of the hoop 10 contacts the front surface of the door 105, and the periphery of the wafer loading / unloading port on the front surface of the hoop 10 contacts the front surface of the base 101. The surface around the wafer loading / unloading port of the hoop 10 presses the hoop packing 11. The hoop packing 11 is elastically deformed, and the contact surface between the hoop packing 11 and the front surface of the hoop 10 has a band shape. The elastic deformation of the hoop packing 11 completely seals between the end surface around the wafer loading / unloading opening of the hoop 10 and the front surface of the base 101.

  The door 105 is provided with mechanisms such as a vacuum chuck for holding the hoop lid 14, a latch key for unlocking the lid 14, and a pin for positioning the lid 14. The lid 14 is unlocked by an unlocking mechanism provided on the door 105, and the lid 14 is adsorbed by a vacuum chuck on the outer surface of the door 105.

  FIG. 5 shows a state where the opener is disposed at the door retracted position and the hoop lid is opened. The door 105 is moved backward by the door actuator 141. The door actuator 141 includes a drive unit 141A and a rod 141B, and the drive unit 141A is movable in the horizontal direction along the rod 141B. A support member 107 is attached to the drive unit 141A. When the drive unit 141A moves in the horizontal direction along the rod 141B, the support plate 106 and the door 105 supported by the support member 107 move in the horizontal direction. Thereby, the hoop lid 14 is opened, and the internal space of the hoop 10 is connected to the internal space of the chamber 110. Here, one space formed by connecting the internal space of the hoop 10 and the internal space of the chamber 110 is referred to as a purge space.

  As described above, the purge space is completely sealed with respect to the surrounding atmosphere by the hoop packing 11, the chamber packing 111, and the bellows 113. That is, a sealed purge space is formed.

  Here, the purge space is purged by the purge mechanism. First, the exhaust valve 133 is opened and the exhaust fan 135 is rotated. A replacement gas is supplied into the chamber 110 via the supply port 120. The supply of the replacement gas by the supply system may be started simultaneously with the exhaust by the exhaust system, or may be started after a predetermined time from the exhaust by the exhaust system.

  The replacement gas is introduced into the internal space of the hoop 10 via the chamber 110. Thereby, the purge space is replaced by the replacement gas. The gas existing in the purge space is exhausted to the outside through the exhaust port 130, the exhaust passage 131 and the exhaust pipe 132.

  In order to efficiently purge the purge space by the purge mechanism, a differential pressure may be formed between the supply port 120 and the exhaust port 130. For example, the replacement gas supplied from the supply pipe 121 may be positive pressure, or the exhaust passage 131 may be connected to negative pressure. Further, the exhaust passage 131 may be connected to a vacuum source.

  As the replacement gas, a dry inert gas such as dry nitrogen or argon is used, but dry air may be used. The gas used as the replacement gas depends on the purpose of the purge. That is, it depends on the requirements of the space of the mini environment to which the internal space of the hoop 10 is connected. Here, the case where the internal space of the hoop 10 is connected to the internal space of the wafer processing apparatus 1 as shown in FIG. 1 will be described as an example. When it is necessary to avoid the introduction of oxygen into the internal space of the wafer processing apparatus 1, a gas that does not contain oxygen, such as an inert gas, may be used as the replacement gas. When it is necessary to avoid the introduction of moisture into the internal space of the wafer processing apparatus 1, dry air or a dry inert gas may be used as the replacement gas. As the replacement gas, the same gas as the internal space of the wafer processing apparatus 1 or a gas preferable for the internal space of the wafer processing apparatus 1 may be used.

According to the present invention, after the wafer is transferred from the hoop, before the lid of the hoop is closed, the inner space of the hoop is replaced again with the replacement gas. Replacement gas used at this time is determined by the hoop next request transfer destination mini the environment space. For example, as the replacement gas, a gas that is the same as the space of the mini-environment of the next transport destination of the hoop or a gas preferable for the space is used. The replacement gas used for purging when the hoop lid is opened and the replacement gas used for purging when the hoop lid is closed need not be the same.

  Whether the purge of the purge space has been completed is determined based on the output of the measuring device 136 provided in the exhaust passage 131. When the purpose of purging is to purge oxygen in the internal space of the hoop 10, an oxygen concentration meter is used as the measuring device 136. The purge is stopped when the oxygen concentration of the exhaust flow in the exhaust passage 131 becomes equal to the oxygen concentration of the replacement gas supplied from the supply system or when the oxygen concentration becomes smaller than a predetermined threshold value.

  When the purpose of purging is to purge the moisture in the internal space of the hoop 10, a hygrometer is used as the measuring device 136. The purge is stopped when the humidity of the exhaust flow in the exhaust passage 131 becomes equal to the oxygen concentration of the replacement gas supplied from the supply system or when the humidity becomes lower than a predetermined threshold.

  The purge may be stopped based on the elapsed time from the start of the purge without using the measurement data of the measuring instrument 136. For example, the time required for purging is measured in advance. When a predetermined time has elapsed from the start of the purge, the purge is considered to be completed and the purge is stopped. To stop the purge, the supply valve 123 and the exhaust valve 133 are closed and the exhaust fan 135 is stopped.

  FIG. 6 shows the opener placed in the door and chamber retracted position. The chamber 110 is retracted along the horizontal direction by the chamber actuator 142. The chamber actuator 142 includes a drive unit 142A and a rod 142B, and the drive unit 142A is movable in the horizontal direction along the rod 142B. A chamber 110 is attached to the drive unit 142A. When the driving unit 142A moves in the horizontal direction along the rod 142B, the chamber 110 moves in the horizontal direction.

  As a result, the periphery of the front opening of the chamber 110 is separated from the chamber packing 111. The chamber packing 111 returns to its original shape by elastic deformation. The internal space of the hoop 10 and the internal space of the chamber 110 are connected to the internal space of the wafer processing apparatus 1. Incidentally, the internal space of the wafer processing apparatus 1 is usually a mini-environment. Therefore, the internal space of the hoop 10 and the chamber 110 is connected to the mini environment of the wafer processing apparatus 1.

  When the opener is in the door and chamber retracted position, the inner surface of the lid 14 is disposed at least inside the end surface of the opening of the chamber 110 as shown.

  As described above, when the purge is completed, the supply of the replacement gas from the supply system is stopped, and the exhaust valve 133 is closed. Therefore, the mini environment in the internal space of the wafer processing apparatus 1 is shielded from the external atmosphere.

  FIG. 7 shows a state where the opener is arranged at the retracted position. In this example, the opener is placed in the retracted position by lowering the door 105 and the chamber 110. The vertical actuator 143 lowers the door 105 and the chamber 110 holding the hoop lid 14. The vertical actuator 143 includes a drive unit 143A and a rod 143B, and the drive unit 143A is movable in the vertical direction along the rod 143B. A rod 141B of the door actuator 141 and a rod 142B of the chamber actuator 142 are mounted on the drive unit 143A. When the driving unit 143A moves in the vertical direction along the rod 143B, the door 105 and the chamber 110 move in the vertical direction together with the driving unit 143A.

  The vertical actuator 143 is attached to the front surface of the base 101. The base 101 is provided with a hole 101B, and the door actuator 141 and the chamber actuator 142 mounted on the vertical actuator 143 can move in the hole 101B along the vertical direction. A cover member 103 that covers the vertical actuator 143 and the hole 101B of the base 101 is provided.

  When the door 105 and the chamber 110 are lowered, a space is created behind the hole 101A of the base 101. This space becomes the wafer transfer path 21. The wafer 20 is taken out via the wafer loading / unloading port 16 of the hoop by the wafer carrying mechanism 4 (see FIG. 1) of the wafer processing apparatus 1 and carried out along the horizontal direction via the wafer carrying path 21. The

  With reference to FIG. 8, the process of unloading the wafer from the hoop at the load port of the present invention will be described. In step S101, the hoop 10 is installed in the load port 5 as shown in FIG. The hoop 10 is installed on a table 18 provided on the load port base 102. The opener is disposed at the door forward position. At the door advance position, the door 105 is engaged with the hole 101 </ b> A of the base 101. The opening on the front side of the chamber 110 is pressed against the chamber packing 111 provided on the back surface of the base 101.

  In step S102, as shown in FIG. 4, the pedestal 18 is moved to place the hoop 10 at the lid open / close position. When the hoop 10 is moved to the lid opening / closing position, the lid 14 of the hoop 10 contacts the front surface of the door 105 disposed in the hole 101A of the base 101. In step S 103, the hoop lid 14 is adsorbed by the door 105. In step S104, as shown in FIG. 5, the opener is disposed at the door retracted position. When the opener is disposed at the door retracted position, the hoop lid 14 adsorbed by the door 105 moves together with the door 105. Thus, the hoop lid 14 is opened, and the internal space of the hoop 10 and the internal space of the chamber 110 are connected. Thus, a sealed purge space is formed. In step S105, the purge space is replaced with a replacement gas. Details of the purge with the replacement gas will be described with reference to FIG. In step S106, as shown in FIG. 6, the opener is disposed at the door and the chamber retracted position. When the opener is disposed at the door and the chamber retracted position, the opening on the front side of the chamber 110 is separated from the back surface of the base 101. The internal space of the hoop 10 is connected to the internal space of the wafer processing apparatus. In step S107, as shown in FIG. 7, the opener is placed at the retracted position. When the opener is disposed at the retracted position, a wafer transfer path 21 is formed in front of the wafer loading / unloading port of the FOUP 10. In step S <b> 108, the wafer 20 is transferred from the hoop 10. The wafer is transferred by the wafer transfer mechanism 4 (FIG. 1) of the wafer processing apparatus.

  With reference to FIG. 9, the process of closing the cover of the FOUP after unloading the wafer from the FOUP at the load port of the wafer processing apparatus of the present invention will be described. In step S201, the opener is returned from the retracted position shown in FIG. 7 to the door and chamber retracted position shown in FIG. In step S202, the opener is returned from the door and chamber retracted position to the door retracted position shown in FIG. Thus, the internal space of the hoop and the internal space of the chamber are connected to form a sealed purge space. In step S203, the inside of the hoop 10 and the chamber 110 is replaced with a replacement gas. Details of the purge with the replacement gas will be described with reference to FIG. In step S204, the opener is returned from the door retracted position to the door advanced position shown in FIG. The lid 14 of the hoop 10 adsorbed to the door 105 engages with the wafer inlet / outlet of the hoop. In step S205, the suction of the hoop lid 14 by the door 105 is released. In step S206, the hoop is returned from the lid opening / closing position to the original position shown in FIG.

  With reference to FIG. 10, the process of purging the hoop and the chamber with a replacement gas in the load port of the wafer processing apparatus of the present invention will be described. In the purge process, the opener is disposed at the door retracted position as shown in FIG. The interior space of the hoop and the interior space of the chamber are connected to form a sealed purge space. In step S301, exhaust is started from the exhaust system, and at the same time or after a predetermined time has elapsed, replacement gas is supplied from the supply system. As the replacement gas, dry air, inert gas, or the like is used. The type of the replacement gas depends on the space requirement of the mini-environment at the transfer destination. In the replacement process of step S105 in FIG. 8, the wafer transfer destination is the wafer processing apparatus 1. Therefore, the replacement gas is the same gas as the internal space of the wafer processing apparatus 1 or a preferable gas for the internal space of the wafer processing apparatus 1. In the replacement process in step S203 of FIG. 9, the wafer transfer destination is the next transfer destination of the hoop. Accordingly, the replacement gas is the same gas as the mini-environment space of the next transport destination of the hoop, or the preferred gas for the mini-environment space of the next transport destination of the hoop. The gas filling the purge space is replaced by the replacement gas supplied from the supply system.

  The pressure of the supply system may be set to a high pressure and the pressure of the exhaust system may be set to a low pressure so that a pressure difference is generated between the exhaust system and the supply system. The pressure of the gas in the exhaust system and the supply system is adjusted so that the pressure difference between the supply system and the exhaust system does not exceed a predetermined value.

  In step S302, the exhaust gas component in the exhaust system is observed. By observing the components of the exhaust gas, it is possible to grasp the progress of the replacement process. The component of the exhaust gas can be known from the output of the measuring device 136 provided in the exhaust system.

  In step S303, it is determined whether or not the replacement is completed. When the exhaust gas in the exhaust system becomes substantially equal to the component of the replacement gas supplied from the supply system, it may be determined that the replacement is complete. Alternatively, when the oxygen or humidity contained in the exhaust gas of the exhaust system becomes smaller than a predetermined threshold value, it may be determined that the replacement is completed. Furthermore, when a predetermined time has elapsed from the start of replacement, it may be determined that the replacement has been completed. In the replacement process in step S105 in FIG. 8 and the replacement process in step S203 in FIG. 9, the type of replacement gas may be the same or different. However, the operating procedure is the same.

  A second example of the load port opener of the present invention will be described with reference to FIG. The opener of this example drives a door 105 for opening and closing the lid 14 of the hoop 10, a support plate 106 that supports the door 105, a chamber 110 that surrounds the door 105 and the support plate 106, and the door 105 and the chamber 110. It has a drive mechanism. The chamber 110 has a box-shaped structure, and has a rectangular opening on the front surface, a rectangular back surface on the opposite side, and four side surfaces surrounding the opening and the back surface. FIG. 11 shows a state where the opener is disposed at the forward movement position. When the opener is disposed at the forward movement position, the door 105 is engaged with the hole 101 </ b> A of the base 101.

  The drive mechanism of the load port door and chamber of this example will be described. The drive mechanism of this example includes a door actuator 153 for moving the door 105 in the front-rear direction and a chamber actuator 163 for moving the chamber 110 in the front-rear direction. The door actuator 153 is supported by the first support base 151, and the chamber actuator 163 is supported by the second support base 161. The first support base 151 includes a plurality of door guide devices 155 for ensuring the horizontal movement of the door 105 and the support plate 106, and a plurality of chambers for ensuring the horizontal movement of the chamber 110. A guide device 165 is provided.

  The center axis of the drive shaft of the door actuator 153 and the center axis of the drive shaft of the chamber actuator 163 are on the same line. This is called the central axis of the drive shaft. The door guide device 155 and the chamber guide device 165 are arranged at rotationally symmetric positions with respect to the central axis of the drive shaft. The central axis of the drive shaft passes through the central axes of the door 105 and the support plate 106. In this example, since the structure of the drive mechanism is rotationally symmetric, there is an advantage that assembly errors and the like can be reduced.

  The second support base 161 is disposed behind the first support base 151. Legs 162A and 162B are connected to the upper and lower ends of the second support base 161, respectively. Legs 162A and 162B of the second support base 161 are mounted on the first support base 151.

  The first support base 151 is disposed behind the chamber 110. Leg portions 152A and 152B are connected to the upper and lower ends of the first support base 151, respectively.

  In order to reduce the size of the opener, the first support base 151 and the second support base 161 may be integrated. In this case, the door actuator 153, the chamber actuator 163, the door guide device 155, and the chamber guide device 165 are provided on one support base.

  Guide rails 145A and 145B are mounted on the back surface of the base 101. The guide rails 145A and 145B extend along the horizontal direction (the direction perpendicular to the paper surface). Guide members 144A and 144B are attached to the ends of the leg portions 152A and 152B of the first support base 151, respectively. The guide members 144A and 144B are engaged with the guide rails 145A and 145B, respectively.

  A lateral actuator 146 for driving the first support base 151 along the horizontal direction (perpendicular to the paper surface) is further provided on the back surface of the base 101. The lateral actuator 146 includes a drive unit 146A and a rod 146B, and the drive unit 146A is movable in the horizontal direction (perpendicular to the paper surface) along the rod 146B. The drive unit 146A is connected to one of the legs of the first support base 151 to the leg 152B. When the drive unit 146A moves relative to the rod 146B, the first support base 151 connected to the drive unit 146A moves in the horizontal direction (perpendicular to the paper surface) along the base 101.

  In the opener of this example, the door actuator 153, the chamber actuator 163, the lateral actuator 146, the door guide device 155, and the chamber guide device 165 are provided outside the chamber 110. Therefore, the size of the internal space of the chamber 110 may be a size necessary for the door 105 to move in the front-rear direction. Therefore, the dimension of the chamber 110 can be reduced. If the size of the chamber 110 is small, the time required for purging can be shortened.

  The structure of the purge mechanism provided in the load port of this example will be described. The purge mechanism of this example may have the same structure as the purge mechanism provided in the first example of the load port. In the illustrated example, the supply port 120 is provided on the upper side surface of the chamber 110. However, the supply port 120 may be provided on the upper side surface 110 </ b> B or the lateral side surface of the chamber 110 or on the back surface of the base 101.

  The operation of the second example of the opener of the load port according to the present invention will be described with reference to FIGS. FIG. 12 shows a state where the opener is disposed at the forward movement position and the hoop has moved to the lid opening / closing position. When the opener is disposed at the advanced position, the space between the end surface of the opening of the chamber 110 and the back surface of the base 101 is completely sealed by the elastic deformation of the chamber packing 111. When the hoop moves to the lid opening / closing position, the gap between the end surface around the wafer loading / unloading opening of the hoop 10 and the front surface of the base 101 is completely sealed by elastic deformation of the hoop packing 11. The lid 14 is unlocked by an unlocking mechanism provided on the door 105, and the lid 14 is adsorbed by a vacuum chuck on the outer surface of the door 105.

  FIG. 13 shows a state in which the opener is disposed at the door retracted position and the hoop lid is opened. The door 105 is moved backward by the door actuator 153. The door actuator 153 includes a drive unit 153A and a movable rod 153B, and the movable rod 153B is movable in the horizontal direction with respect to the drive unit 153A. The drive unit 153A is mounted on the first support base 151. The movable rod 153 </ b> B passes through a hole provided in the chamber 110, and its tip is connected to the support plate 106. When the movable rod 153B moves in the horizontal direction with respect to the drive unit 153A, the support plate 106 and the door 105 connected to the movable rod 153B move in the horizontal direction. Thereby, the hoop lid 14 is opened, and the internal space of the hoop 10 is connected to the internal space of the chamber 110. Here, as in the first example, one space formed by connecting the internal space of the hoop 10 and the internal space of the chamber 110 is referred to as a purge space.

  As described above, the purge space is completely sealed from the surrounding atmosphere by the hoop packing 11, the chamber packing 111, the door actuator packing 154, and the door guide packing 156.

  The door guide device 155 includes a guide member 155A and a movable rod 155B, and the movable rod 155B is movable in the horizontal direction with respect to the guide member 155A. The guide member 155A is mounted on the first support base 151. The movable rod 155 </ b> B passes through a hole provided in the chamber 110, and its tip is connected to the support plate 106. When the support plate 106 and the door 105 move in the horizontal direction by the door actuator 153, the movable rod 155B moves in the horizontal direction while being restrained by the guide member 155A. The door guide device 155 is disposed at a position close to the outer periphery of the support plate 106.

  The chamber 110 is provided with a hole through which the movable rod 153B of the door actuator 153 passes. A packing 154 is attached to this hole. Similarly, the chamber 110 is provided with a hole through which the movable rod 155B of the door guide device 155 passes. A packing 156 is attached to this hole. These packings 154 and 156 may be O-rings, for example. These packings 154 and 156 provide a seal between the movable rod and the hole of the chamber 110. That is, the packings 154 and 156 prevent the gas in the chamber 110 from leaking outside from the periphery of the movable rod. A bellows arranged so as to surround the movable rod may be used instead of the packing.

  When the opener is disposed at the door retracted position, the purge space is purged by the purge mechanism. Purge by the purge mechanism is the same as in the first example.

  FIG. 14 shows the opener in the door and chamber retracted position. The chamber 110 is retracted along the horizontal direction by the chamber actuator 163. The chamber actuator 163 has a drive part 163A and a movable rod 163B, and two extension rods 163C are attached to the tip of the movable rod 163B. The distal end of the extension rod 163C is connected to the chamber 110. The movable rod 163B is movable in the horizontal direction with respect to the drive unit 163A. The drive unit 163A is mounted on the second support base 161. When the rod 163B moves in the horizontal direction with respect to the drive unit 163A, the chamber 110 connected to the extension rod 163C moves in the horizontal direction. As a result, the periphery of the opening on the front surface of the chamber 110 is separated from the chamber packing 111. The chamber packing 111 returns to its original shape by elastic deformation. The internal space of the hoop 10 and the internal space of the chamber 110 are connected to the internal space of the wafer processing apparatus 1. Incidentally, the internal space of the wafer processing apparatus 1 is usually a mini-environment. Therefore, the internal space of the hoop 10 and the chamber 110 is connected to the mini environment of the wafer processing apparatus 1.

  When the opener is in the door and chamber retracted position, the inner surface of the lid 14 is disposed at least inside the end surface of the opening of the chamber 110 as shown.

  As described above, when the purge is completed, the supply of the replacement gas from the supply system is stopped, and the exhaust valve 133 is closed. Therefore, the mini environment in the internal space of the wafer processing apparatus 1 is shielded from the external atmosphere.

  The first support base 151 is provided with a chamber guide device 165 for securing the movement of the chamber 110 in the horizontal direction. The chamber guide device 165 includes a guide member 165A mounted on the first support base 151 and a movable rod 165B movable with respect to the guide member. The distal end of the movable rod 165B is connected to the chamber 110.

  When the chamber 110 moves in the horizontal direction, the hole in the chamber 110 moves relative to the movable rod 153B of the door actuator 153 and the movable rod 155B of the door guide device 155 passing therethrough. However, packings 154 and 156 are mounted in the holes of the chamber 110. Therefore, when the chamber 110 moves in the horizontal direction, no gas leaks from the periphery of these movable rods.

  FIG. 15 is a diagram illustrating a state where the opener is disposed at the retracted position. In this example, the opener is disposed at the retracted position by moving the door 105 and the chamber 110 in the horizontal direction along the base 101. FIG. 15 shows a state when the back surface configuration of the load port is observed from the inside of the wafer processing apparatus 1.

  Guide rails 145A and 145B are mounted on the back surface of the base 101. The guide rails 145A and 145B extend along the horizontal direction. Guide members 144A and 144B mounted on the ends of the upper and lower legs 152A and 152B of the first support base 151 are engaged with the guide rails 145A and 145B.

  A lateral actuator 146 for driving the first support base 151 along the horizontal direction is further provided on the back surface of the base 101. The lateral actuator 146 includes a drive unit 146A and a rod 146B, and the drive unit 146A is movable in the horizontal direction along the rod 146B. The drive unit 146A is connected to one leg 152B of the legs of the first support base 151. When the drive unit 146A moves relative to the rod 146B, the first support base 151 connected to the drive unit 146A moves in the horizontal direction along the base 101.

  When the first support base 151 moves in the horizontal direction along the base 101, the chamber 110 mounted on the first support base 151, the door 105 holding the hoop lid 14, the door actuator 153, the second support The table 161, the chamber actuator 163, and the like move in the lateral direction.

  Through the hole 101A of the base 101, the wafer 20 inside the hoop 10 can be observed. A hoop packing 11 is provided on the front surface of the base 101 so as to surround the hole 101 </ b> A of the base 101.

  An exhaust port 130 is provided on the back surface of the base 101. The exhaust port 130 is formed by a horizontally elongated opening. The cross section of the exhaust passage 131 extending from the exhaust port 130 becomes smaller as it goes deeper.

  According to the load port of this example, as in the first example, the inside of the hoop 10 may be purged twice when the lid 14 of the hoop 10 is opened and closed. The replacement gas used for purge when opening and the replacement gas used when closing may be the same or different. Therefore, a plurality of replacement gas sources are connected to the supply pipe 121 in a switchable manner. The supply system is further provided with a diffusion filter, an air nozzle, a rectifying plate, etc., which will be described in detail later.

  Another example of the structure and arrangement of the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described with reference to FIGS. As described above, the supply port 120 of the supply system is connected to the internal space of the chamber 110 and is provided at an arbitrary position as long as it is above the ceiling surface of the hoop 10, and an arbitrary structure is possible. Hereinafter, various examples of the supply port 120 of the supply system will be described.

  A third example of the supply system of the load port purge mechanism of the wafer processing apparatus of the present invention will be described with reference to FIG. In the supply system of the purge mechanism of this example, the supply port 120 is provided on the back surface of the base 101. The direction of the flow of the replacement gas discharged from the supply port 120 is the direction from the base 101 toward the inside of the chamber 110, not the direction of the internal space of the hoop 10. Therefore, a rectifying plate 125 is provided at a position facing the supply port 120. The rectifying plate 125 is mounted inside the chamber 110 by an appropriate method. The replacement gas discharged from the supply port 120 collides with or reflects on the rectifying plate 125, changes the course, and is guided to the internal space of the hoop 10.

  A fourth example of the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described with reference to FIG. In the supply system of the purge mechanism of this example, a supply pipe 121 is connected to the front surface of the base 101 as shown in the figure. A supply passage 124 is formed in the base 101 so as to be connected to the supply pipe 121. The supply passage 124 extends inside the base 101 along the back surface of the base 101, and its tip extends to the inner surface of the hole 101 </ b> A of the base 101. Therefore, the supply port 120 is provided on the inner surface of the hole 101 </ b> A of the base 101. The direction of the flow of the replacement gas discharged from the supply port 120 is the direction along the base 101 in the hole 101 </ b> A of the base 101, and not the direction of the internal space of the hoop 10. Therefore, a rectifying plate 125 is provided along the supply passage 124. The rectifying plate 125 is mounted along the back surface of the base 101 by an appropriate method. The replacement gas released from the supply system collides with or reflects on the rectifying plate 125 to change the course, and is guided to the internal space of the hoop 10 via the supply port 120.

  With reference to FIG. 18, a fifth example of the structure and arrangement of the supply system of the load mechanism of the load port of the wafer processing apparatus of the present invention will be described. In the supply system of the purge mechanism of this example, the supply port 120 is provided on the upper side surface 110 </ b> B of the chamber 110. The direction of the flow of the replacement gas discharged from the supply port 120 is a direction from the upper side surface 110 </ b> B of the chamber 110 to the lower side, not the direction of the internal space of the hoop 10. Therefore, a rectifying plate 125 is provided at a position along the air flow path from the supply port 120. The rectifying plate 125 is attached to the inner surface of the chamber 110 by an appropriate method. The replacement gas discharged from the supply port 120 collides with or reflects on the rectifying plate 125, changes the course, and is guided to the internal space of the hoop 10.

  Although the supply system of the purge mechanism shown in FIGS. 16 to 18 can be applied to the first example of the load port of the present invention, it can also be applied to the second example. That is, the drive mechanism of the load port door and chamber shown in FIGS. 16 to 18 is merely an example, and the supply system of the purge mechanism shown in FIGS. 16 to 18 is, for example, the load port shown in FIG. This can also be applied to the second example.

  With reference to FIG. 19A, an example of the structure of the diffusion filter of the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described. The diffusion filter 126 is attached to the tip of the supply pipe 121. The diffusion filter 126 includes a cylindrical filter medium 126A. The replacement gas supplied through the supply pipe 121 is discharged radially from the filter medium 126A in the circumferential direction.

  With reference to FIG. 19B, an example of the structure of the air nozzle of the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described. The air nozzle 127 is attached to the tip of the supply pipe 121. The air nozzle 127 has a triangular prism-shaped housing 127A, and a thin band-shaped nozzle 127B is provided at the tip thereof. The replacement gas supplied through the supply pipe 121 is discharged from the nozzle 127B as a belt-like airflow. In the air nozzle 127 of this example, the housing 127A has a triangular prism shape, but may have a cylindrical shape.

  With reference to FIG. 20, the example of arrangement | positioning of the diffusion filter of the supply system of the purge mechanism of the load port of the wafer processing apparatus of this invention is demonstrated. In this example, a diffusion filter 126 is connected to the tip of the supply pipe 121, and an air nozzle 127 is provided so as to surround the diffusion filter 126. The nozzle 127B of the air nozzle 127 faces downward. The diffusion filter 126 and the air nozzle 127 are disposed along the lateral direction along the back surface and the upper side surface of the chamber 110 in the internal space of the chamber 110.

  The supply pipe 121 connected to the diffusion filter 126 extends along the upper surface and the lateral surface along the back surface of the chamber 110 in the inner space of the chamber 110, and penetrates the lower surface of the chamber 110 to pass through the chamber 110. Extends from the inside to the outside. In addition, the piping structure of the supply pipe shown here is an example, and other piping structures are also possible.

  In the illustrated example, the air nozzle 127 has a cylindrical shape, but a triangular prism-shaped air nozzle shown in FIG. 19B may be used. Furthermore, the diffusion filter 126 may be omitted and only the air nozzle 127 may be attached.

  With reference to FIG. 21, another example of the arrangement of the diffusion filter of the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described. In this example, a supply passage 128 is formed in the base 101, and a diffusion filter 126 is disposed there. The diffusion filter 126 is connected to the tip of the supply pipe 121. A rectifying plate 125 is provided on the back surface of the supply passage 128. The airflow emitted from the cylindrical surface of the diffusion filter 126 collides with or reflects on the inner surface of the supply passage 128 and the rectifying plate 125 to change the course, and is guided to the inner space of the hoop 10.

  With reference to FIG. 22, an example of the arrangement of air nozzles in the supply system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described. In this example, an air nozzle is mounted on the front surface of the base 101. The air nozzle is connected to the tip of the supply pipe 121. The air nozzle has an elongated belt-like nozzle. This nozzle is provided on the back surface of the base 101. In this example, this nozzle is the supply port 120. Also in this example, the rectifying plate 125 may be provided at a position facing the supply port 120 as in the example of FIG.

  The shape of the exhaust passage of the exhaust system of the purge mechanism of the load port of the wafer processing apparatus of the present invention will be described with reference to FIG. The exhaust passage 131 includes an inlet portion 131A and a passage portion 131B, and an exhaust port 130 is formed by the opening of the inlet portion 131A. The flow path cross section of the passage portion 131B is constant, but the flow path cross section of the inlet portion 131A increases as it approaches the exhaust port 130 from the passage portion 131B. The exhaust port 130 has a laterally elongated shape.

  An exhaust pipe 132 and a measuring device 136 are connected to the passage portion 131B. As shown in FIG. 3, the exhaust pipe 132 is provided with an exhaust valve 133 and an exhaust fan 135.

  Although the examples of the present invention have been described above, the present invention is not limited to the above-described examples, and it is easy for those skilled in the art to make various modifications within the scope of the invention described in the claims. Will be understood.

DESCRIPTION OF SYMBOLS 1 ... Wafer processing apparatus, 2 ... Main body, 3 ... Fan filter unit, 4 ... Wafer conveyance mechanism, 5 ... Load port, 10 ... Hoop, 11 ... Packing for hoops, 12 ... Shell, 14 ... Cover, 16 ... Wafer loading / unloading port , 18 ... mounting table, 20 ... wafer, 21 ... wafer transfer path, 101 ... base, 101A ... hole, 101B ... hole, 102 ... base, 103 ... cover member, 105 ... door, 106 ... support plate, 107 ... support member 110 ... Chamber, 111 ... Chamber packing, 113 ... Bellows, 120 ... Supply port, 121 ... Supply pipe, 123 ... Supply valve, 124 ... Supply passage, 125 ... Current plate, 126 ... Diffusion filter, 127 ... Air nozzle, 128 ... Supply passage, 130 ... Exhaust port, 131 ... Exhaust passage, 132 ... Exhaust pipe, 133 ... Exhaust valve, 135 ... Exhaust fan, 1 6 ... Measuring device, 141 ... Door actuator, 142 ... Chamber actuator, 143 ... Vertical actuator, 144A, 144B ... Guide member, 145A, 145B ... Guide rail, 146 ... Lateral actuator, 151 ... First support base, 152A, 152B ... Leg part, 153 ... Door actuator, 154 ... Door actuator packing, 155 ... Door guide device, 156 ... Door guide packing, 161 ... Second support, 162A, 162B ... Leg part 163 ... Actuator for chamber, 163C ... Extension rod, 165 ... Guide device for chamber

Claims (14)

A load port having a vertical base provided with a hole through which a lid of the wafer storage container passes, and a horizontal base provided on the front side of the base, and a lid of the wafer storage container disposed on the base A wafer processing apparatus comprising: an opener provided on the back side of the base for opening and closing
The opener includes a door for opening and closing the lid of the wafer storage container via the hole of the base, a box-shaped chamber having an opening on the front surface so as to surround the door, and the door and the chamber. A drive system for driving, and a purge mechanism for purging the internal space of the wafer storage container,
The drive system includes: a door actuator that drives the door along a hole axis direction of the hole of the base; a chamber actuator that drives the chamber along a proximity / separation direction with respect to a back surface of the base; and the door And a third actuator for simultaneously driving the chamber along the back surface of the base, the three actuators being provided outside the chamber;
When the lid of the wafer storage container is opened by the door with the end of the opening on the front surface of the chamber engaged with the back surface of the base, the internal space of the wafer storage container and the internal space of the chamber are Connected to form a sealed purge space,
The purge mechanism includes a supply system having a supply port for supplying a replacement gas to the purge space, and an exhaust system having an exhaust port for exhausting the purge space, the supply port being the wafer storage container Provided at a higher position, the exhaust port is provided at a position lower than the wafer storage container, and the exhaust port is provided below the hole of the base on the back surface of the base ,
Purge by the purge mechanism is performed when the lid of the wafer storage container is opened in order to take out the wafer from the wafer storage container, and when the lid of the wafer storage container is closed after taking out the wafer from the wafer storage container. The replacement gas used for purging when the lid of the wafer storage container is opened and the replacement gas used for purging when the lid of the wafer storage container is closed are the same or different. A wafer processing apparatus. The wafer processing apparatus according to claim 1,
The exhaust system has an exhaust passage connected to the exhaust port and an exhaust pipe connected to the exhaust passage, and the exhaust passage is formed in the base and the base. Wafer processing apparatus. The wafer processing apparatus according to claim 1,
The exhaust system includes an exhaust passage connected to the exhaust port and an exhaust pipe connected to the exhaust passage, and the exhaust passage is connected to an inlet portion where the exhaust port is formed and to the inlet portion. And a passage section of the passage section is constant. A passage section of the inlet section increases from the passage section toward the exhaust port, and the exhaust port is elongated horizontally. A wafer processing apparatus having a shape. The wafer processing apparatus according to claim 1,
The supply port is provided on the back surface of the base or the inner surface of the chamber, and the chamber is configured to direct the flow direction of the replacement gas supplied from the supply port toward the internal space of the wafer storage container. A wafer processing apparatus provided with a current plate. The wafer processing apparatus according to claim 1,
The supply port is provided in an inner surface of the hole of the base, and a supply passage connected to the supply port is formed in the base, and a flow of replacement gas supplied from the supply port is formed in the supply passage. 2. A wafer processing apparatus, comprising a current plate for directing a direction toward an internal space of the wafer storage container. The wafer processing apparatus according to claim 1,
The supply system has a supply pipe connected to a replacement gas source, and at least one of a diffusion filter and an air nozzle is attached to the tip of the supply pipe, and at least one of the diffusion filter and the air nozzle extends along the inner surface of the chamber. A wafer processing apparatus, wherein the wafer processing apparatus is arranged. The wafer processing apparatus according to claim 1,
The supply system has a supply pipe connected to a replacement gas source, a diffusion filter is attached to the tip of the supply pipe, and the diffusion filter is disposed in a supply passage formed inside the base. A wafer processing apparatus.   8. The wafer processing apparatus according to claim 7, wherein the supply passage is provided with a rectifying plate for directing the flow direction of the replacement gas supplied from the diffusion filter toward the internal space of the wafer storage container. A wafer processing apparatus. The wafer processing apparatus according to claim 1,
The exhaust system has a measuring device for measuring a component of gas exhausted through the exhaust port, and the concentration of the gas exhausted through the exhaust port is determined by measurement data from the measuring device. The wafer processing apparatus, wherein the purge of the purge space by the purge mechanism is terminated when it becomes smaller than a predetermined threshold value. The wafer processing apparatus according to claim 1,
Wafer processing system center axis of the drive shaft and the center axis of the drive shaft of the actuator for the door the chamber for the actuator, characterized in that it is arranged on the same line. The wafer processing apparatus according to claim 10 .
The drive system includes a guide rail mounted on the back surface of the base, and a support base that moves along the guide rail, and the door actuator and the chamber actuator are mounted on the support base. A wafer processing apparatus. The wafer processing apparatus according to claim 10 .
The drive system includes a plurality of door guide devices for securing movement of the door in the hole axial direction of the base, and movement of the chamber in the proximity / separation direction with respect to the back surface of the base. A plurality of chamber guide devices for securing the wafer, wherein the door guide device and the chamber guide device are disposed rotationally symmetrically about a central axis of the drive shaft. Processing equipment. A load port having a vertical base provided with a hole through which a lid of the wafer storage container passes, and a horizontal base provided on the front side of the base, and a lid of the wafer storage container disposed on the base An opener provided on the back side of the base for opening and closing the door, and the opener surrounds the door and a door for opening and closing the lid of the wafer storage container via the hole of the base A wafer processing apparatus having a box-shaped chamber having an opening on the front surface, a drive system for driving the door and the chamber, and a purge mechanism for purging the internal space of the wafer storage container. In a method of unloading a wafer from a storage container,
Installing a wafer storage container on the load port table;
Placing the opener at a door forward position and moving the wafer storage container to a lid opening / closing position to bring the lid of the wafer storage container into contact with the front surface of the door disposed in the hole of the base;
Adsorbing the lid of the wafer storage container by the door;
By disposing the opener from the door advance position to the door retract position, the lid of the wafer storage container is opened and the internal space of the wafer storage container and the internal space of the chamber are connected to form a sealed purge space. Forming a step;
A first replacement step of replacing the purge space with a replacement gas;
Connecting the internal space of the wafer storage container to the internal space of the wafer processing apparatus by disposing the opener from the door retracted position to the door and chamber retracted position;
Forming a wafer transfer path behind the wafer loading / unloading port of the wafer storage container by disposing the opener from the door and chamber retracted position to the retracted position;
Transporting a wafer from the wafer storage container via the wafer transport path;
Returning the opener from the retracted position to the door and chamber retracted position;
Returning the opener from the door and chamber retracted position to the door retracted position to connect the internal space of the wafer storage container and the internal space of the chamber to form one sealed purge space;
A second replacement step of replacing the purge space with a replacement gas that is the same as or different from the replacement gas used in the first replacement step;
Engaging the lid of the wafer storage container adsorbed by the door with the wafer loading / unloading port of the wafer storage container by returning the opener from the door retracted position to the door advance position;
Releasing the adsorption of the lid of the wafer storage container by the door;
Returning the wafer storage container from the lid opening / closing position to the original position;
A method for unloading a wafer from a wafer storage container. In the method of carrying out a wafer from the wafer storage container according to claim 13 ,
The first and second replacement steps include:
Exhaust of the purge space is started by the exhaust system provided in the purge mechanism, and replacement gas is supplied to the purge space by a supply system provided in the purge mechanism at the same time or after a predetermined time has elapsed. And steps to
Observing components of exhaust gas in the exhaust system;
Ending the purge of the purge space by the purge mechanism when the concentration of the gas exhausted through the exhaust port becomes smaller than a predetermined threshold value.

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